JP2003037122A - Bonding apparatus and bonding method - Google Patents

Abstract

[PROBLEMS] To provide a simple bonding apparatus capable of improving the quality and productivity of a device such as an optical element and reducing the manufacturing cost. , The carrier is placed on the stage 13 by the loader 3. The carrier is conveyed by the stage 13. And after the solder pieces are temporarily attached on the carrier,
At the die bond point, the optical element chip is soldered by the die bond head 6 while the carrier is heated by the ceramic heater. Further, the carrier is transported to a wire bond point, where a gold wire is bonded to the carrier and the optical element chip by the wire bond head 11 to complete the optical element. This optical element is unloaded by the unloader 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus and a bonding method, and more particularly to a bonding apparatus and a bonding method used in an assembling process of an optical element used for information communication means.

[0002]

2. Description of the Related Art Generally, an optical element used for information communication means has an optical element chip such as a laser diode or a photodiode bonded to a carrier, and the optical element chip and the carrier are electrically connected by a gold wire or the like. It has a structured structure. When manufacturing or assembling such an optical element, a die bonder, a wire bonder, or the like is used to join the optical element chip and the carrier, or to connect them with a gold wire or the like.

FIG. 4 shows the structure of a die bonder and a wire bonder according to such a conventional technique. The structures and functions of the conventional die bonder and wire bonder will be described below. In FIG. 4, 101 is a die bonder,
102 is a wire bonder. Die bonder 101
The DB loader 103 (die bonder-side loader) that supplies the carrier to this, the DB transport unit 104 (die bonder-side transport unit) that transports, positions, or heats the carrier, the solder supply unit 105, and the carrier. Die bond head 106 for joining optical element chips and wafer loader 1 capable of supplying optical element chips in a wafer state
07 and the DB unloader 1 that stores the die-bond completed body
08 (die bonder-side unloader).

On the other hand, to the wire bonder 102, a WB loader 109 (wire bonder loader) for supplying a carrier to the wire bonder 102, and a WB transfer section 11 for transferring, positioning or heating the carrier as in the case of the die bonder 101.
0 (wire bonder side transfer part) and wire bond head 1
11 and a WB unloader 112 (wire bonder-side unloader) for housing the wire bond completed body.

Next, referring to FIG. 5, a conventional carrier heating mechanism or heating method will be described. In FIG. 5, 121 indicates an optical element chip, 122 indicates a carrier, and 123 indicates a gold wire. Also, 12
Reference numeral 4 denotes a solder piece for joining the optical element chip 121 and the carrier 122, 125 denotes a soldering heat block, 126 denotes a die bonding heat block, and 12
Reference numeral 7 indicates a heat block for wire bonding. Although not shown in FIG. 5, each heat block 1
25 to 127 have a heat source (cartridge heater or the like) and a temperature measuring device (thermocouple or the like) built therein, and are temperature-controlled so as to maintain their respective set temperatures.

A die bonder 101 according to the prior art will be described below.
The operation, that is, the die bonding step will be described. The carrier 122 stored in a tray with pockets, etc.
It is set in the loader 103. The carriers 122 on the tray are supplied to the DB transfer unit 104 by vacuum suction one by one. This carrier 122 is used for the DB transport unit 104.
It is positioned and held by and is carried to the solder supply section 105. Then, by the solder supply unit 105, the carrier 12
A solder piece is temporarily attached to 2.

Further, a good optical element chip 121 is bonded by the die bond head 106 to the carrier 122 carried to the die bond point. The non-defective optical element chip 121 is one that is manually recognized and selected from the wafer set on the wafer loader 107 by using an image processing technique or the like. Next, the carrier 122 is cooled to near room temperature, and the carrier 12 held in the DB transport unit 104 is
2 is vacuum-sucked by the DB unloader 108 and stored in a tray with a storage pocket. This completes the die bonding process.

Next, the wire bonder 10 according to the prior art.
The second operation, that is, the wire bonding step will be described. The carrier 122 that has completed the die-bonding process is stored in a pocketed tray, and the trays (plural sheets) are set in a carrying box called a cassette. This cassette is W
It is set in the B loader 109 and the wire bonding process is started. As with the die bonder 101, the WB loader 109 includes the carriers 122 one by one in the WB transport unit 110.
Set to.

In the WB transfer section 110, the die bonder 101
In the same manner as in the above case, the carrier 122 positioned and held is carried to the wire bond point, and the wire bond head 11
1, the electrode portion of the optical element chip 121 and the carrier 1
The gold wire 123 is joined to the electrical wiring portion of 22. After the wire bonding is completed, the carrier 122 is cooled to near room temperature, vacuum-adsorbed by the WB unloader 112, and stored in a tray with a storage pocket, and all steps are completed.

In the series of die-bonding process and wire-bonding process, the carrier temperature required by the carrier 122 varies. An example of such a joining temperature is 250 ° C. in soldering and 37 in die bonding.
The temperature is 0 ° C., and the temperature for wire bonding is 300 ° C. Therefore, in the prior art, in order to maintain the carrier temperature at these set temperatures, the soldering heat block 125,
The temperature of the die-bonding heat block 126 and the wire-bonding heat block 127 is controlled, and the carrier 122 is brought into contact with this surface to obtain a necessary temperature. According to the above temperature example and each process order, the temperature profile of the carrier 122 is approximately as follows.

(1) Set the carrier 122 at room temperature → (2) Heat the carrier 122 to the soldering temperature →
(3) Heating the carrier 122 to the die bond temperature →
(4) Lower the temperature of the carrier 122 to room temperature and store it once → (5) Set the carrier 122 again with the wire bonder →
(6) Heating the carrier 122 to the wire bond temperature →
(7) Lower the temperature of the carrier 122 to room temperature and complete storage

[0012]

However, in the conventional die bonder and wire bonder or optical element manufacturing method shown in FIGS. 4 and 5, for example, as described above, trays and magazines for individually accommodating carriers in both bonders are used. Since it is necessary to prepare a large amount of the above, there is a problem that the manufacturing cost becomes high. Further, there is a problem that manpower is required to convey the material between both bonders, and the production input plan needs to be managed by both bonders, which complicates the work.

Further, in order to sufficiently secure the function of supplying / discharging the carrier in both the die-bonding process and the wire-bonding process, it is necessary to equip both bonders with substantially the same supplying / discharging unit, which increases the apparatus cost. There is such a problem. At the same time, it is necessary to have a jig for setting the material so that the material can be delivered between the two bonders, handling by hand, and production plan management between the two bonders. In addition, if the specifications of the carrier itself or the tray are changed,
It is necessary to modify each bonder. Therefore, there is a problem that the versatility is poor and a large amount of cost is required for construction, maintenance and management of the device.

In addition, in each bonder, in order to heat the carrier, it is necessary to individually provide a heater block for heating the material, which causes a problem that the structure of the apparatus is further complicated. Furthermore, since the conventional heat block method is a control method that maintains a constant temperature, the heating / cooling performance is affected by the heat transfer characteristics of the material, and as a result, heating / cooling takes time and productivity is reduced. There is such a problem. In addition, it is impossible to finely set the heating profile that affects the wettability of the solder, which is the bonding material of the optical element chip, and the quality of the optical element is not stable.

The present invention has been made to solve at least a part of the above conventional problems, and can improve the quality and productivity of devices such as optical elements manufactured by bonding, and manufacture the same. It is an object to be solved to provide a simple and compact bonding apparatus or bonding method capable of reducing the cost.

[0016]

The bonding apparatus according to the present invention made to solve the above-mentioned problems is (i)
A linear rail, (ii) a stage movably mounted on the rail, and (iii) a servo motor that drives the stage to reciprocate along the rail (other drive means may be used), (Iv) A loader for mounting an object to be bonded (for example, a carrier) on the stage, and (v) positioning fixing means integrally disposed on the stage for positioning and fixing the object to be bonded mounted on the stage. And (vi) a pulse heater (for example, a ceramic heater) that is integrally mounted on the stage and that positions and fixes the object to be bonded on the stage, and (vii) the object to be bonded that is placed on the stage. Solder piece supply means for supplying a solder piece and (viii) a bonding body (for example, an optical element chip) using the solder piece on the body to be bonded placed on the stage. A bonding unit for bonding (bonding) and (ix) an unloader for unloading (removing) the bonding-completed body from the stage after the bonding body is bonded to the object to be bonded are provided. While the body is pressed against the body to be bonded with a predetermined load, the pulse heater is turned on to melt the solder piece, while the pulse heater is turned off to solidify the solder piece. is there.

In the above bonding apparatus, (xi)
A plurality of sets (for example, 2
Set), each stage is mounted on each rail, and each stage is provided with a servo motor, a positioning fixing means, and a pulse heater, and (xii) a loader is selectively provided for each stage. The object to be bonded is placed on the substrate, the solder piece supply means selectively supplies the solder piece to the object to be bonded placed on each stage, and the bonding unit is selected to the object to be bonded placed on each stage. Bonding the bonding body,
In addition, it is preferable that the unloader selectively unloads the completed bonding body from each stage.

It is preferable that the above-mentioned bonding apparatus is provided with a cooling means (for example, forced draft cooling means) for forcibly cooling the pulse heater at the same time when the pulse heater is turned off.

In the above bonding apparatus,
It is preferable to include a wire bonding head for bonding a wire (for example, a metal wire such as a gold wire) to at least the bonding body on the stage after the bonding body is bonded to the bonded body.

The bonding method according to the present invention is
(I) a step of placing an object to be bonded on a linear rail on a stage that freely reciprocates along the rail, and (ii) a step of positioning and fixing the object to be bonded placed on the stage And (iii) a step of supplying a solder piece to an object to be bonded which is positioned and fixed on the stage, and (iv) a bonding element is bonded to the object to be bonded placed on the stage by using the solder piece. And (v) bonding the bonded body to the bonded body and then unloading the bonding completed body from the stage. (Vi) bonding the bonded body to the bonded body. While pressing with a predetermined load, the pulse heater integrated with the stage is turned on. While melting the solder pieces, it is characterized in that the solidifying solder pieces by turning off the pulse heater.

In the above bonding method, it is preferable that the pulse heater is turned off and the pulse heater is forcibly cooled (for example, forced ventilation is performed on the pulse heater to cool the pulse heater).

The above-mentioned bonding method preferably includes a step of bonding a wire to at least the bonding body on the stage after bonding the bonding body to the body to be bonded.

[0023] Incidentally, JP-A-55-088341,
JP-A-57-054337, JP-A-63-314
Japanese Patent Laid-Open No. 838, Japanese Patent Laid-Open No. 55-021178, or Japanese Patent Laid-Open No. 06-283555 discloses a bonding apparatus or bonding method similar to the present invention. However, the bonding apparatus or the bonding method disclosed in each of these publications is not limited to the carrier transfer mode or the heating / cooling mode,
Alternatively, the joining form and the like are obviously different from the present invention.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below. FIG. 1 shows the configuration of a die bonder / wire bonder integrated device (bonding device) according to the present invention.
FIG. 2 shows a heating mechanism of a carrier (bonded body) in the die bonder / wire bonder integrated device, and FIG.
(A) and (b) respectively show an optical element (bonding completed body) obtained by bonding a carrier and an optical element chip (bonding body). This integrated die bonder / wire bonder device for an optical element is an integrated device that executes two processes, a die bonding process and a wire bonding process, and uses a ceramic heater (pulse heater) as a heating source of a carrier.

First, an outline of a bonding method and a device to be bonded by the die bonder / wire bonder integrated device according to this embodiment will be described. Devices to be bonded in this die bonder / wire bonder integrated device are, for example, as shown in FIG.
An optical element including a laser diode or a photodiode as shown in (b).

In FIGS. 3A and 3B, reference numeral 21 denotes an optical element chip (for example, laser diode, photodiode, etc.), and 22 denotes a carrier which is a base component to which the optical element chip 21 is joined. , 23 are gold wires for electrically connecting the optical element chip 21 and the carrier 22. Here, the carrier 22 is formed using a material such as ceramic and has an electric circuit formed by conductive metal plating. Although not shown in detail, the optical element chip 21 and the carrier 22 are mechanically joined by solder. Although solder is used here, it goes without saying that a bonding material other than solder can be used.

The manufacturing procedure of this optical element is approximately as follows. That is, first, the carrier 22 is put into a die bonder / wire bonder integrated device and heated, and a certain amount of solder (solder piece) as a bonding material is temporarily attached to the chip bonding portion of the carrier 22. Further, the carrier 22 is heated and the optical element chip 21 is supplied on the solder. Then, the joining is completed when a certain time has passed under a certain load. At that time, in order to prevent oxidation of the solder and ensure good wettability, an oxidation atmosphere is generated to perform the bonding. Next, the temperature of the carrier 22 is slightly lowered to the wire bond joining temperature. At this point, the optical element chip 21 and the carrier 22 are joined by the gold wire 23. Next, the temperature of the carrier 22 is lowered to about room temperature in order to house the bonding completed body, and all manufacturing steps (assembly steps) are completed.

The specific structure and function of the die bonder / wire bonder integrated device according to this embodiment or the bonding method using the same will be described below with reference to FIGS. 1 and 2. In FIG. 1, 1 is a die bonder
The wire bonder integrated device is shown, 3 is a loader for supplying the carrier 22, and 4 is a carrying section for carrying, positioning, or heating the carrier 22. The transport unit 4 has a twin configuration including the first transport unit 4A and the second transport unit 4B.

Each of the transport units 4A and 4B has a linear rail 12, a stage 13 movably mounted on the rail 12, and a servo for driving the stage 13 to reciprocate along the rail 12. And a motor (not shown). The rails 12 of both the transport units 4A and 4B are arranged so as to be parallel to each other. The loader 3
When the stage 13 is located at the loading point (the left end in FIG. 1), the carrier 22 is placed (loaded) on the stage 13.

In FIG. 1, reference numeral 5 denotes a solder supply section (solder piece supply means) for supplying a solder piece (not shown) to the carrier 22 placed on the stage 13, and 6 denotes the stage 13.
The die bond head (bonding unit) which joins (bonds) the optical element chip 21 on the carrier 22 mounted on top using a solder piece is shown. Also, FIG.
7 shows a wafer loader capable of supplying the optical element chip 21 to the carrier 22 in a wafer state.
1 is an optical element chip 21 and a carrier 2 on the stage 13.
2 is a wire bond head (wire bonding head) for bonding the gold wire 23, and 8 is the stage 1
3 shows an unloader for unloading (removing) an optical element which is a wire bond completed product and storing it from above.

As shown in FIG. 2, each stage 13 has
A ceramic heater 25 (pulse heater) mounted integrally on the stage to heat the carrier 22, and positioning and fixing (holding) the carrier 22 on the stage 13 respectively.
The positioning pin 26 and the positioning block 24 (positioning fixing means), and the base 28 on which the ceramic heater 25 and the positioning elements are collectively mounted are provided.
Here, the die bond head 6 presses the optical element chip 21 against the carrier 22 with a predetermined load, and turns on the ceramic heater 25 to melt the solder, while turning off the ceramic heater solidifies the solder. Has become.

Next, the operation of the die bonder / wire bonder integrated device will be described. In this die bonder / wire bonder integrated device, first, a plurality (a large number) of carriers 22 housed in a tray with pockets or the like are manually set on the loader 3. The carriers 22 on the tray are vacuum-adsorbed one by one by the loader 3, and are alternately (selectively) supplied or placed on the stage 13 of the first transport unit 4A and the stage 13 of the second transport unit 4B. It

In each of the transport sections 4A and 4B, the stage 1
Carrier 22 positioned and fixed (held) on 3
Is carried to a position corresponding to the solder supply section 5 by the stage 13, and the solder is temporarily attached to the carrier 22 there. Further, the carrier 22 is carried to the die bond point by the stage 13, and the good optical element chip 21 is bonded (bonded) on the carrier 22 by the die bond head 6 (die bonding step). The non-defective optical element chip 21 is one that is recognized and selected from the wafer manually set on the wafer loader 7 by using an image processing technique or the like.

The carrier 22 to which the optical element chip 21 is bonded in the die-bonding process is carried to the wire bond point by the stage 13, and the electrode portion of the optical element chip 21 and the electric wiring part of the carrier 22 are carried by the wire bond head 11 here. Are joined by the gold wire 23 (wire bonding step). The carrier 22 for which wire bonding has been completed is vacuum-sucked by the unloader 8, unloaded from the stage 13, and stored in a tray with a storage pocket.
All steps are completed.

The specific positioning and fixing operation and heating / cooling operation of the carrier 22 on the stage 13 in the die bonding process or the wire bonding process will be described below.
As can be seen from FIG. 2, in each stage 13, the positioning pin 26 and the positioning block 27 are provided with a base 28.
It is installed in. Then, before the carrier 22 is positioned and fixed (held) on the stage 13, the positioning pin 26 and the positioning block 27 are moved to the positions opposite to the directions indicated by the arrows X and Y, respectively. positioned. That is, the positioning pin 26 and the positioning block 27 are on standby in the open state.

When positioning and fixing the carrier 22, the positioning pin 26 and the positioning block 27 are used.
Respectively move (advance) in the directions indicated by arrows X and Y, contact the carrier 22 and press it against the ceramic heater 25. As a result, the carrier 22 is positioned at a predetermined position and fixed (held).

In this way, the carrier 22 positioned and fixed on the stage 13 or the base 28 receives heat from the ceramic heater 25 and is heated or cooled to a predetermined set temperature. Ceramic heater 2
When the controlled pulse current is supplied, 5 rapidly heats up due to its internal resistance. In the ceramic heater 25, the ultimate temperature and the heating time are controlled by controlling the pulse current supplied to the ceramic heater 25 (for example, on / off control).

When the ceramic heater 25 is cooled, the pulse current supplied to the ceramic heater 25 is cut off (almost at the same time as the cutoff), and the ceramic heater 25 itself is forcedly ventilated to forcibly cool it. Then, the temperature is quickly lowered. In this embodiment, the ceramic heater 2
The high-pressure nitrogen at room temperature is applied (sprayed) to 5. By controlling the supply pressure, flow rate, supply time, and the like of the high-pressure nitrogen that is the cooling source, the temperature reached by cooling and the required time thereof are controlled. Air at room temperature may be used as the cooling source.

In the die bond process and the wire bond process in this die bonder / wire bonder integrated device, the bonding temperature required by the carrier 22 varies, but an example of such a bonding temperature is 250 ° C. in soldering.
And 370 ° C. for die bond and 300 ° C. for wire bond. In this case, the temperature profile of the carrier 22 is approximately as follows.

(1) Set the carrier 22 at room temperature →
(2) Heat the carrier 22 to the soldering temperature with the ceramic heater 25 → (3) Further heat the carrier 22 to the die bond temperature with the ceramic heater 25 → (4) Force cool the carrier 22 to the wire bond temperature and keep it at 300 ° C → (5) Lower the temperature of the carrier 22 to room temperature and complete storage

Further, in the die bonder / wire bonder integrated device according to this embodiment, the optical element chip 21 is utilized by utilizing the rapid heating characteristic which is the characteristic of the ceramic heater 25.
After being placed on the carrier 22, heating to the die bond temperature is started. That is, the heating method after landing the chip is adopted. In the conventional die bonder, the optical element chip is arranged on the carrier and bonded while the carrier is already heated to the die bond temperature on the heat block.

Specifically, in this die bonder / wire bonder integrated device, a good product is first passed toward the carrier 22 conveyed from the point corresponding to the solder supply section 5 to the die bond point while being kept at the soldering temperature. Die bond head 6 holding the optical element chip 21 by vacuum suction
Starts descending. The die bond head 6 detects the moment when the solder on the carrier 22 contacts the optical element chip 21, that is, the moment when the optical element chip 21 lands on the solder, and at this time, the die bond head 6 or the optical element chip 21 is detected. Stop the descending motion.

Next, after a lapse of a fixed time, the ceramic heater 25 is activated, and this is heated all at once from the soldering temperature (250 ° C.) to the die bond temperature (370 ° C.) to raise the temperature of the carrier 22. During this time, the optical element chip 21 remains in the state of landing on the solder. Here, when the solder reaches its die-bonding temperature above its melting temperature,
The optical element chip 21 and the carrier 22 are in a molten state. After that, a chip stirring operation (scrub operation) is performed in order to increase the wetted area of the solder. This tip stirring operation is
It is realized by moving the optical element chip 21 held by the die bond head 6 on the molten solder so as to follow a predetermined operation (for example, box operation) of the die bond head 6.

When the chip stirring operation (scrub operation) is completed, the ceramic heater 25 is moved to the die bond temperature (3
70 ° C.), the die bond head 6 opens the held optical element chip 21 by vacuum suction (releases the holding). After that, the die bond head 6 moves upward above the optical element chip 21. Thereby, the optical element chip 2 using the solder as the bonding material
The joining operation of 1 and the carrier 22 is completed.

Although not shown, this joining operation is performed in a solder oxidation preventing atmosphere in order to prevent deterioration of solder wettability. Specifically, a solder oxidation prevention atmosphere is generated by supplying an inert gas such as nitrogen heated and controlled to a constant temperature toward the chip bonding surface.

As described above, in this die bonder / wire bonder integrated device, the heating method after landing the chip is adopted, but this makes it possible to more reliably block the oxygen from the outside when the optical element chip 21 and the carrier 22 are joined. And to improve the wettability of the solder. In the conventional joining method, since the solder is melted on the carrier before the optical element chip is placed on the solder, the solder is easily oxidized. On the other hand, in this die bonder / wire bonder integrated device, the solder is pressed down by the chip and the carrier and the inert gas is supplied to the chip bonding surface before the solder reaches a molten state where the solder is easily oxidized. Is not oxidized. Further, the rapid heating characteristic of the ceramic heater 25 can be used to complete the joining in a relatively short time.

Thus, according to the die bonder / wire bonder integrated device or the bonding method, the following actions and effects can be obtained. First, since the die-bonding process and the wire-bonding process are performed by a single integrated device, the total cost of each facility can be reduced. Furthermore, there is no need for pallets or cassettes to transport materials between devices,
Does not require human labor. Therefore, it is possible to reduce the cost required to maintain and manage the equipment. In addition, since it is a device in which the die bonding process and the wire bonding process are connected,
The production plan management that was necessary in the conventional individual bonding equipment is also unnecessary. Further, although the device is an integrated device, by changing the device setting conditions, the usage as a die bonder-dedicated device or a wire bonder-dedicated device can be selected, so that a flexible production form is obtained.

In this die-bonder / wire-bonder integrated device, since two transfer sections 4A and 4B for transferring the carrier 22 are provided (twin configuration), the productivity is greatly improved. Further, even when one of the transport units 4A and 4B is in the process of changeover work due to a type change, the other transport units 4A and 4B can be operated. Therefore, the operating rate of the device as a whole is improved.

Further, in this die bonder / wire bonder integrated device, since it is only necessary to provide a heater unit composed of one set of ceramic heaters 25 and the like in each of the transport sections 4A and 4B, the conventional one having a plurality of heat blocks ( 5), the heating / cooling structure is simplified and the device cost is reduced. Further, since the heating of the carrier 22 can be completed in a short time by utilizing the rapid heating characteristic of the ceramic heater 25, each carrier 2
The processing time of 2 can be shortened, and the productivity is increased.

Moreover, since the carrier 22 is heated by the ceramic heater 22 after the optical element chip 21 has landed on the solder, it is possible to cut off the oxygen from the outside, which is a factor inhibiting solder wettability. This realizes stable and high-quality chip bonding with good solder wettability.

As described above, in this embodiment, the case where the carrier 22 formed of a ceramic material or the like and the optical element chip 21 are solder-bonded to each other has been described. However, the application range of the bonding apparatus or the bonding method according to the present invention is not limited to such a case. The bonding apparatus or the bonding method according to the present invention, even when using other materials or bonding materials, when the die bonding step or the wire bonding step is necessary, and it is necessary to individually set the operating temperature in each step. It can be widely applied, and also in this case, the same operation and effect as in the case of the above-described embodiment are exhibited.

[0052]

According to the bonding apparatus of the present invention, since the pulse heater is used for melting the solder pieces, the melting can be performed in a short time and the productivity can be improved. Further, since it is possible to supply the solder pieces to the object to be bonded and to bond the bonding body in the same stage, the structure of the apparatus becomes extremely simple. Furthermore, since the stage can be reciprocally moved along the rail, it can be applied to a bonding method in which the supply of the solder piece to the object to be bonded and the bonding of the bonding body are alternately performed, and a flexible bonding device is provided. can do. In addition, the quality of the bonded body can be improved.

In the above bonding apparatus, when a plurality of sets of rails are provided, a stage is placed on each rail, and a servo motor, a positioning fixing means, and a pulse heater are provided for each stage, the above-mentioned operation is performed.・ In addition to being effective, productivity can be further increased.

When the above-mentioned bonding apparatus is provided with the cooling means for forcibly cooling the pulse heater at the same time when the pulse heater is turned off, the above-described action and effect can be obtained, and the conveyance of the object to be bonded is started after the completion of bonding. By shortening the time until, the productivity can be further improved.

When the above-described bonding apparatus is provided with a wire bonding head for bonding a wire to the bonding body on the stage after bonding the bonding body, the above-described actions and effects can be obtained, and the wire bonding is also performed on the same stage. Therefore, the structure of the device can be made extremely rational and simple.

According to the bonding method of the present invention, since the pulse heater is used for melting the solder pieces, the melting can be performed in a short time and the productivity can be improved. Moreover, the supply of the solder pieces to the object to be bonded and the bonding of the bonding body can be performed in the same stage, and the bonding process becomes extremely simple. Further, since the stage can reciprocate along the rail, it can be applied to a bonding method in which the supply of the solder piece to the body to be bonded and the bonding of the bonding body are alternately performed. In addition, the quality of the bonded body can be improved.

In the above bonding method, when the pulse heater is turned off and at the same time the pulse heater is forcibly cooled, the above-described actions and effects are obtained, and the time from the completion of bonding to the start of conveyance of the object to be bonded is shortened. Thereby, the productivity can be further improved.

In the above-mentioned bonding method, when the wire is bonded to the bonding body on the stage after the bonding of the bonding body, the above-described actions and effects can be obtained, and the wire bonding can be performed on the same stage. The process can be extremely rational and simple.

[Brief description of drawings]

FIG. 1 is a plan view of a die bonder / wire bonder integrated device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a carrier heating mechanism provided in each stage of the die bonder / wire bonder integrated device shown in FIG.

3A is a side view of an optical element bonded by the die bonder / wire bonder integrated device shown in FIG. 1, and FIG. 3B is a front view of the optical element shown in FIG.

FIG. 4 is a plan view of a die bonder and a wire bonder according to a conventional technique.

FIG. 5 is a perspective view of a heating mechanism for a carrier according to the related art.

[Explanation of symbols]

1 die bonder / wire bonder integrated device, 3 loader, 4 transfer section, 4A first transfer section, 4B second transfer section, 5 solder supply section, 6 die bond head, 7
Wafer loader, 8 unloader, 11 wire bond head, 21 optical device chip, 22 carrier,
23 gold wire, 25 ceramic heater, 26 positioning pin, 27 positioning block, 28 base, 101 die bonder, 102 wire bonder,
103 DB loader, 104 DB transport unit, 105
Solder supply unit, 106 Die bond head, 107
Wafer loader, 108 DB unloader, 109
WB loader, 110 WB transfer section, 111 wire bond head, 112 WB unloader, 121
Optical element chip, 122 carrier, 123 gold wire,
124 Solder Pieces, 125 Soldering Heat Block, 126 Die Bonding Heat Block, 127
Heat block for wire bond.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tatsuya Sakamoto             2-6-2 Otemachi 2-chome, Chiyoda-ku, Tokyo             Ryoden Engineering Co., Ltd. F term (reference) 5F044 BB01 BB22 BB25 FF04                 5F047 BA05 BB05 CA08 FA21 FA32                       FA36 FA54 FA69 FA73 FA75                       FA79 FA84

Claims (7)

[Claims] 1. A linear rail, a stage movably mounted on the rail, a servomotor that drives the stage to reciprocate along the rail, and an object to be bonded to the stage. A loader that mounts the unit, a positioning fixing unit that is integrally disposed on the stage and that positions and fixes the object to be bonded that is mounted on the stage, and a mounting unit that is integrally mounted on the stage. A pulse heater for heating the object to be bonded, which is positioned and fixed on the stage, a solder piece supply means for supplying a solder piece to the object to be bonded placed on the stage, and the object to be placed on the stage. A bonding unit for bonding the bonding body using the solder piece on the bonding body; An unloader for unloading the bonding-completed body from the stage after the bonding body is bonded, wherein the bonding unit presses the bonding body against the body to be bonded with a predetermined load to operate the pulse heater. A bonding apparatus, wherein the solder piece is melted when turned on, while the pulse piece is turned off to solidify the solder piece. 2. A plurality of sets of the rails are provided so as to be parallel to each other, the stages are mounted on the rails, and the servo motor and the positioning and fixing means are provided for the respective stages. And the pulse heater are provided, the loader selectively mounts the object to be bonded on each stage, and the solder piece supply means selectively connects the solder to the object to be bonded mounted on each stage. So that the bonding unit selectively bonds the bonding body to the bonded body mounted on each stage, and the unloader selectively unloads the bonding completed body from each stage. The bonding apparatus according to claim 1, wherein: 3. The bonding apparatus according to claim 1, further comprising cooling means for forcibly cooling the pulse heater at the same time when the pulse heater is turned off. 4. A wire bonding head for bonding a wire to at least the bonding body on a stage after the bonding body is bonded to the bonding target body, according to claim 1. The bonding apparatus according to any one of the above. 5. A step of placing an object to be bonded on a linear rail on a stage that freely reciprocates along the rail, and positioning and fixing the object to be bonded placed on the stage. A step of supplying a solder piece to the object to be bonded which is positioned and fixed on the stage; and a bonding element to be bonded on the object to be bonded placed on the stage using the solder piece. And a step of unloading a bonding-completed body from the stage after bonding the bonding body to the bonding body, wherein the bonding body is bonded to the bonding body in the bonding step. While pressing with a predetermined load, it is integrated with the stage. The bonding method is characterized in that the solder piece is melted by turning on the pulse heater, and the solder piece is solidified by turning off the pulse heater. 6. The bonding method according to claim 5, wherein the pulse heater is turned off and the pulse heater is forcibly cooled at the same time. 7. The bonding method according to claim 5, further comprising a step of bonding a wire to at least the bonding body on a stage after the bonding body is bonded to the bonding target body.