JP2003034543A - Scribe groove forming apparatus, scribe groove forming method, glass substrate cutting method, electro-optical device manufacturing method, electro-optical device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scribe groove in a glass substrate used for an electro-optical device without lowering the strength of the glass substrate and without causing damage to the edge of the glass substrate. It enables good formation. A scribe groove forming apparatus includes a stage for holding a scribe object on an XY plane formed by an X direction and a Y direction orthogonal to each other, and a cutter for forming a scribe groove in the scribe object. 520 and a head 530 for integrally holding the cutter
And a Z-direction position adjusting means 570 for adjusting a relative position between the cutter and the scribe object by moving a position of the head in a Z direction perpendicular to the XY plane; and the cutter for the scribe object. A pressure sensor 583 for detecting a pressing pressure of the pressure sensor and outputting a pressure detection signal, and a control means 590 for controlling the Z-direction position adjusting means based on the pressure detection signal.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the technical field of a glass substrate cutting method, and more particularly to a scribe groove forming apparatus and method for a glass substrate which constitutes an electro-optical device, and a glass substrate cutting apparatus and a cutting method.

[0002]

2. Description of the Related Art In recent years, mobile phones, portable computers,
Electro-optical devices such as liquid crystal devices are widely used as display units of electronic devices such as video cameras. In a liquid crystal device, two glass substrates are stacked with a sealing material and bonded to each other to form an empty panel called an empty cell, and then a liquid crystal as an electro-optical material is enclosed in a region partitioned by the sealing material. .

In manufacturing such a liquid crystal device, there are cases in which two substrates cut into a size corresponding to each panel are laminated and bonded together, but particularly in the case of manufacturing a small liquid crystal device. Until the middle of the manufacturing process, such as forming wiring patterns for multiple liquid crystal devices on a mother substrate (large glass substrate) that can form multiple panels, processing is performed on the large mother substrate, and then The mother substrate is often cut and divided into individual glass substrates.

In any of these manufacturing methods, conventionally, in a scribing groove forming apparatus in which a cutter such as a diamond tip is supported by a head so as to be vertically movable, the position of the head with respect to the glass substrate and the pressing pressure with respect to the cutter by the head are set. In the fixed state, while keeping the cutter in contact with the surface of the glass substrate, by relatively moving the cutter along the planned cutting line of the glass substrate, a scribe groove is formed in the glass substrate, and then the glass substrate is removed. A bending jig (for example, a rubber roller) or the like is pressed from the back surface side to apply bending stress, and the glass substrate is cut by this stress. This method is called the scribe-break method.

[0005]

However, in this cutting method, when the surface of the glass substrate has undulations or variations in the thickness of the glass, the scribe groove is too deep or too shallow due to it. Likely to happen. As a result, if the scribe groove is too deep, it will break carelessly while handling the glass substrate,
If the scribe groove is too shallow, there is a problem that the glass substrate cannot be cut well along the scribe groove.

Further, in the scribing groove forming device equipped with the cutter as described above, a structure is adopted in which the cutter is pressed downward with a predetermined pressing amount and pressing pressure, and the cutter is fixed on the base. The scribe groove is formed by linearly moving the glass substrate while pressing it against the surface of the glass substrate.

However, in such a scribing method, when the cutter rides on the end surface of the glass substrate and when the cutter moving on the surface of the glass substrate separates from the end of the glass substrate, There is a case where the end portion of the glass substrate is damaged due to the pushing amount and the pushing pressure, and a chip or a crack is generated at the end portion of the glass substrate. Since such damage to the edge of the glass substrate remains at the corners of the glass substrate after division, there is a problem that the impact resistance of the glass substrate after division decreases due to microcracks and the like caused by this damage. . This problem is particularly remarkable in an electro-optical device that uses a thin glass substrate in response to the recent demand for thinner and lighter electronic devices.

The present invention has been made in view of the above points, and an object thereof is an electro-optical device without lowering the strength of the glass substrate and without damaging the edge of the glass substrate. The purpose is to enable good formation of scribed grooves in the glass substrate used for.

[0009]

In order to solve the above problems, a scribe groove forming apparatus of the present invention has an XY plane defined by an X direction and a Y direction which are orthogonal to each other, and the scribe plane is formed on the XY plane. A stage for holding an object, a cutter for forming a scribe groove in the scribe object, a head for holding the cutter, and a Z direction for moving the head in a Z direction perpendicular to the XY plane. A position adjusting means, a pressure sensor that detects the pressing pressure of the cutter against the scribing target and outputs a pressure detection signal, and the Z based on the pressure detection signal.
Control means for controlling the directional position adjusting means.

According to the scribing groove forming apparatus configured as described above, a scribing target such as a glass substrate or a panel is held on the stage. The Z-direction position adjusting means adjusts the relative position between the cutter and the scribing target by moving the position of the head holding the cutter in the Z direction so that the cutter contacts the scribing target. The pressing pressure of the cutter against the scribing target is detected by the pressure sensor, and the Z-direction position adjusting means controls the Z-direction position of the cutter based on the pressure sensor to form an appropriate scribing groove.

In one aspect of the scribe groove forming device,
The control means controls the Z-direction position adjusting means so that the pressing pressure of the cutter against the scribing target is always a constant pressure value while the scribing groove is formed in the scribing target by the cutter. Control.

According to this aspect, since the pressing pressure of the cutter against the scribing target is kept constant, it is possible to form the scribing groove having a constant depth even when the surface of the scribing target has irregularities. it can.

In another aspect of the scribe groove forming device, the head includes a cylinder and a plunger arranged in the cylinder, and the pressure sensor is disposed on a top portion of the cylinder and above the plunger. It is arranged between the end face.

According to this aspect, the pressing pressure of the cutter against the object to be scribed is transmitted to the pressure sensor via the plunger, so that the pressing pressure can be easily detected.

In still another mode of the scribe groove forming device, the upper end surface of the plunger is always in contact with the pressure sensor, and the plunger is movable in the Z direction.

According to this aspect, since the upper end surface of the plunger is kept in contact with the pressure sensor at all times, the pressing pressure of the cutter can be accurately detected.

Yet another aspect of the scribe groove forming apparatus further comprises head driving means for moving the head in at least one of the X direction and the Y direction.

According to this aspect, the scribing groove is formed in the scribing target by moving the head in the X direction or the Y direction while the cutter is in contact with the scribing target.

In still another mode of the scribing groove forming apparatus, the control means places the stage on the stage based on the position of the stage in the Z direction and the thickness of the scribing target in the Z direction. Z for forming a scribe groove having a predetermined depth on the placed scribe object
A direction reference position is calculated, the Z direction adjusting mechanism is controlled so that the cutter is located at the Z direction reference position before the cutter contacts the scribing target, and then the head driving means moves the cutter. The scribing groove is formed in the scribing target by moving in the X direction or the Y direction.

According to this aspect, the Z-direction reference position of the cutter for forming the groove having the predetermined depth is calculated based on the position of the stage in the Z direction and the thickness of the scribing target in the Z direction. . Before the cutter contacts the scribe target, the cutter is located at the Z-direction reference position. Then, the head driving means moves the head in the X direction or the Y direction, so that the cutter comes into contact with the scribing target object, and the scribing groove is formed.

In still another mode of the scribing groove forming apparatus, the control means causes the cutter to move to the Z-direction when the cutter is separated from the scribing target by the movement of the cutter by the head driving means. The X-direction adjusting means is controlled so as to be located at the direction reference position.

According to this aspect, since the cutter is located at the Z-direction reference position when the cutter is separated from the scribing target, the end of the scribing target is not chipped.

A scribing groove forming method for forming a scribing groove in a scribing target using a cutter according to the present invention is such that the pressing pressure of the cutter against the scribing target becomes a constant value. And a step of moving the cutter along the scribing surface of the scribing object while adjusting the relative position of the cutter with respect to.

According to the above-mentioned scribing groove forming method, since the position of the cutter is adjusted so that the pressing pressure of the cutter against the scribing object becomes a constant value, it is possible to always form a constant scribing groove.

According to the present invention, the X-direction and the Y-direction are orthogonal to each other.
A scribing groove forming method for forming a scribing groove on a scribing target object held on an XY plane defined by a direction by using a cutter is a method of forming a scribing groove perpendicular to the XY plane of a stage on which the scribing target object is placed. Determining a Z-direction reference position of the cutter for forming a scribe groove having a predetermined depth in the scribing target based on the position in the Z direction and the thickness of the scribing target in the Z direction. A first step, a second step of arranging the cutter at the Z-direction reference position before the cutter comes into contact with the scribing target, and a third step of moving the cutter in the X-direction or the Y-direction. In the third step, the cutter is held in the Z-direction reference position until the cutter comes into contact with the scribing target while the cutter is in the X-direction or the front direction. The step of moving in the Y direction and the relative movement of the cutter with respect to the scribing target object such that the pressing pressure of the cutter against the scribing target object has a constant value while the cutter is in contact with the scribing target object. Moving the cutter along the scribing surface of the scribing object while adjusting the position; and after the cutter is separated from the scribing object, while holding the cutter at the Z direction reference position, And a step of moving in the X direction or the Y direction.

According to the above-mentioned scribing groove forming method, first, the scribing target is predetermined based on the position of the stage on which the scribing target is placed in the Z direction and the thickness of the scribing target in the Z direction. The Z-direction reference position of the cutter is determined in order to form a scribe groove having a depth of. Next, the cutter is placed at the Z direction reference position, and the cutter is moved in the X direction or the Y direction. The cutter is at the Z-direction reference position until it comes into contact with the scribing target, and the Z-direction position of the cutter is adjusted so that the pressing pressure of the cutter against the scribing target becomes constant while it is in contact with the scribing target. After that, when the cutter separates from the scribing target, the cutter returns to the Z-direction reference position again. As a result, a scribe groove having a constant depth is formed in the scribing object, and chipping or cracking at the end of the scribing object is prevented.

In the glass substrate cutting method of the present invention, the scribing target is a glass substrate, the step of forming the scribe groove by the above-mentioned scribe groove forming method, and cutting the glass substrate along the formed scribe groove. And a step of performing.

According to this aspect, the glass substrate on which the scribe groove having a constant depth is formed can be easily cut along the scribe groove.

In the method of manufacturing the electro-optical device of the present invention, the glass substrate for holding the electro-optical substance is cut by utilizing the above-mentioned method of cutting the glass substrate.

The electro-optical device of the present invention can be manufactured by the above method. In addition, an electronic device including the electro-optical device as a display unit is provided.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below with reference to the drawings. In the following description, an example in which the present invention is applied to a method of manufacturing a passive matrix type electro-optical device will be described.

[1] Configuration of Electro-Optical Device FIGS. 1 and 2 are a perspective view and an exploded perspective view of an electro-optical device to which the present invention is applied, respectively. In addition, FIG.
FIG. 2 is a cross-sectional view of an end portion on the I side when the electro-optical device to which the invention is applied is cut along the line II ′ of FIG. 1. It should be noted that FIGS. 1 and 2 only schematically show electrode patterns, terminals, and the like, and in an actual electro-optical device, a larger number of electrode patterns and terminals are formed.

1 and 2, the electro-optical device 1 of the present embodiment is a passive matrix type liquid crystal display device mounted in an electronic device such as a mobile phone,
A liquid crystal encapsulation region 35 is partitioned by the seal material 30 between a pair of transparent substrates 10 and 20 made of glass substrates which are adhered to each other by a seal member 30 at a predetermined interval. Liquid crystal is enclosed as a substance.

The electro-optical device 1 shown here is an example of a transmission type, and a polarizing plate 61 is attached to the outer surface of the second transparent substrate 20, and a polarizing plate 62 is also attached to the outer surface of the first transparent substrate 10. It is pasted. Further, on the outer side of the second transparent substrate 20,
A backlight device 9 is arranged.

As shown in FIG. 3, the first transparent substrate 10 has a first electrode pattern 40 and a second electrode pattern 50.
Red (R), green (G), and blue (B) color filters 7R, 7G, and 7B are formed in a region corresponding to the intersection point with, and insulating surfaces are provided on the surface side of these color filters 7R, 7G, and 7B. Planarizing film 13, first electrode pattern 40
And the alignment film 22 is formed in this order. On the other hand, the second electrode pattern 5 is formed on the second transparent substrate 20.
0, an overcoat film 29, and an alignment film 22 are formed in this order.

In the electro-optical device 1 of the present embodiment, both the first electrode pattern 40 and the second electrode pattern 50 are formed by a transparent conductive film represented by an ITO film (Indium Tin Oxide). It should be noted that the semi-transmissive / semi-reflective electro-optical device 1 can be configured by thinly forming a film of aluminum or the like patterned below the second electrode pattern 50 via an insulating film. Further, the transflective / semireflective electro-optical device 1 can also be constructed by laminating a transflective plate on the polarizing plate 61. Further, by disposing a reflective film under the second electrode pattern 50, the reflective electro-optical device 1 can be configured. In this case, the backlight device 9 is provided from the back surface side of the second transparent substrate 20. You can omit it.

[2] Configuration of Electrode Pattern and Terminal Referring again to FIGS. 1 and 2, in the electro-optical device 1 according to the present embodiment, no matter whether the signal input from the outside or the conduction between the substrates is performed, the first pattern is used. Substrate sides 101 and 201 located in the same direction of the transparent substrate 10 and the second transparent substrate 20.
First terminal formation region 1 formed on each of first transparent substrate 10 and second transparent substrate 20 in the vicinity thereof.
The first and second terminal formation regions 21 are used. Therefore, as the second transparent substrate 20, the first transparent substrate 10
A larger substrate is used, and when the first transparent substrate 10 and the second transparent substrate 20 are bonded together, the portion 25 where the second transparent substrate 20 projects from the substrate side 101 of the first transparent substrate 10. Is used to connect the flexible substrate 90 on which the driving IC 7 is COF-mounted.

Therefore, in the second transparent substrate 20,
The second terminal formation region 21 is formed in a portion 25 near the substrate side 201 and overhangs the first transparent substrate 10, and the surface of the terminal formation region portion near the substrate side 201 is in an open state. On the other hand, in the second transparent substrate 20, the portion of the second terminal formation region 21 located on the liquid crystal encapsulation region 35 side is used for inter-substrate conduction with the first transparent substrate 10 side. , This second terminal formation region 21
Of these, the portion located on the liquid crystal enclosing region 35 side is the first
Is formed in an overlapping portion with the transparent substrate 10.

In the first transparent substrate 10, the first
The terminal formation region 11 is used for conduction between the second transparent substrate 20 and the second transparent substrate 20, and thus is formed in an overlapping portion with the second transparent substrate 20.

In constructing such a connection structure, in the present embodiment, in the first transparent substrate 10, the first terminal formation region 11 is the substrate side 1 of the first transparent substrate 10.
In the first terminal formation region 11, a plurality of first inter-substrate conduction terminals 60 are arranged at a predetermined interval along the substrate side 101. Further, in the first transparent substrate 10, after the first electrode patterns 40 for driving liquid crystal in a plurality of columns obliquely extend to both sides from the first inter-substrate conduction terminal 60 toward the opposing substrate side 102, It extends in a direction orthogonal to the substrate sides 101 and 102 in the liquid crystal enclosing region 35.

In the second transparent substrate 20, the second terminal forming region 21 is also formed along the substrate side 201, but the second terminal forming region 21 is relatively excluding both ends of the substrate side 201. It is formed over a wide range. In the second terminal formation region 21, the substrate side 20 is formed in the central region.
1, a plurality of first external input terminals 81 arranged at a predetermined interval, and these first external input terminals 8
A plurality of second external input terminals 82 are formed along the substrate edge 201 at two positions on both sides of the region where the 1 is formed.

From the first external input terminal 81,
A plurality of second inter-substrate conduction terminals 70 overlapping the first inter-substrate conduction terminals 60 when the first transparent substrate 10 and the second transparent substrate 20 are bonded are straight lines toward the substrate side 202. Have been extended.

Furthermore, in the second transparent substrate 20, the first electrode pattern 40 is attached to the second external input terminal 82 when the first transparent substrate 10 and the second transparent substrate 20 are bonded together. Second electrode patterns 50 for driving a plurality of columns of liquid crystal so as to wrap around regions corresponding to both sides of the formation region of
And the second electrode patterns 50 extend in the liquid crystal encapsulation region 35 so as to intersect the first electrode patterns 40.

In constructing the electro-optical device 1 using the first transparent substrate 10 and the second transparent substrate 20 thus configured, in the present embodiment, the first transparent substrate 10 is used.
At the time of bonding the second transparent substrate 20 and the second transparent substrate 20 via the seal material 30, a gap material and a conductive material are mixed in the seal material 30, and the seal material 30 is used as the first inter-substrate conductive terminal 60 and It is formed in a region where the second inter-substrate conduction terminal 70 overlaps. Here, the conductive material included in the sealing material 30 is, for example, particles obtained by plating the surface of elastically deformable plastic beads, and the particle diameter thereof is slightly smaller than the particle diameter of the gap material included in the sealing material 30. large.
Therefore, when the sealing material 30 is melted and cured while applying a force for narrowing the gap between the first transparent substrate 10 and the second transparent substrate 20, the conductive material becomes the first transparent substrate. The first inter-substrate conduction terminal 60 and the second inter-substrate conduction terminal 70 are electrically connected to each other in a crushed state between 10 and the second transparent substrate 20.

When the first transparent substrate 10 and the second transparent substrate 20 are attached to each other with the sealing material 30 in between,
Pixels are formed in a matrix by the intersections of the electrode patterns 40 and the second electrode patterns 50. Therefore, after the flexible substrate 90 is mounted on the end of the second terminal formation region 21 of the second transparent substrate 20 on the substrate side 201 side using an anisotropic conductive material or the like, the flexible substrate 90 is mounted on the flexible substrate 90. When a signal is input to the first external input terminal 81 and the second external input terminal 82 of the second transparent substrate 20 through the second transparent substrate 20, the second electrode pattern 50 formed on the second transparent substrate 20 will be exposed. The scanning signal can be directly applied through the second external input terminal 82, and the first external input terminal is formed on the first electrode pattern 40 formed on the second transparent substrate 10. Image data can be input as a signal through 81, the second inter-substrate conduction terminal 70, the conducting material, and the first inter-substrate conduction terminal 60. Therefore,
The first electrode pattern 40 and the second electrode pattern 5 are formed in each pixel by the image data and the scanning signal.
Since the alignment state of the liquid crystal located between 0 and 0 can be controlled, a predetermined image can be displayed. [3] Method of Manufacturing Electro-Optical Device FIGS. 4 and 5 are a process diagram and an explanatory view showing a method of manufacturing the electro-optical device 1, respectively.

In manufacturing the electro-optical device 1 of this embodiment, the first transparent substrate 10 and the second transparent substrate 2 are used.
4A and 4B, in the step (A) shown in FIGS. 4 and 5, the electrode patterns 40, 50 are formed in the state of large substrates 100, 200 including a large number of these substrates 10, 20, respectively.
And the like are performed.

Then, for each of the large-sized substrates 100 and 200, in the step (B) shown in FIGS.
After performing the formation of the alignment films 12 and 22 and the rubbing step, for example, in the step (C) shown in FIGS. 4 and 5,
While applying the sealing material 30 to the first large substrate 100,
The gap material 28 is scattered on the second large substrate 200.

Next, in a step (D) shown in FIGS. 4 and 5, the large-sized substrates 100 and 200 are bonded together in a predetermined positional relationship to form a large-sized panel 300 shown in FIGS. 6 (A) and 6 (B). To do.

In order to obtain the single electro-optical device 1 described with reference to FIGS. 1 and 2 from the large-sized panel 300 having the above-described structure, the planned cutting line shown by broken lines in FIGS. 6A and 6B is obtained. The large substrates 100 and 200 are cut along 301 ′ and 301 ″, planned cutting lines 401 ′ and 401 ″ indicated by the one-dot chain line, and planned cutting lines 403 indicated by the two-dot chain line.

First, in the step (E) shown in FIGS. 4 and 5, as the cutting step (primary breaking step) for the large-sized panel 300, the large-sized substrates 100, 200 are used.
On the other hand, after forming scribe grooves 302 ′ and 302 ″ for cutting the large-sized panel 300 into strip-shaped panels on the entire planned cutting lines 301 ′ and 301 ″, or both ends thereof, the large-sized substrate The large panel 300 is configured by applying a predetermined pressing jig from the back surface side to apply mechanical stress to the 100 and 200 along the planned cutting lines 301 ′ and 301 ″, or by irradiating laser light. The large-sized substrates 100 and 200 to be cut are cut into strip-shaped panels 40.
Get 0.

In this state, since the liquid crystal injection port 31 (see FIG. 2) is opened at the cut portion of the strip-shaped panel 400, in the step (F) shown in FIGS. 4 and 5,
After injecting the liquid crystal from the liquid crystal inlet 31, the liquid crystal inlet 31
Are sealed with a sealing material 32 (see FIG. 2).

Next, in the step (G) shown in FIGS. 4 and 5, as a cutting step (secondary breaking step) for the strip-shaped panel 400, the large substrates 100 and 200 forming the strip-shaped panel 400 are A planned cutting line 40 for cutting the strip-shaped panel 400 into a single panel 1 '
After forming scribe grooves 402 ′ and 402 ″ on the entire 1 ′ and 401 ″ or on both ends thereof, the planned cutting lines 401 and 401 ″ are formed on the large substrates 100 and 200.
A predetermined pressing jig is pressed from the back side along the above to apply mechanical stress, or laser light is irradiated to cut the large-sized substrates 100 and 200 constituting the strip-shaped panel 400, respectively, and the single panel 1 Get '

Note that the single panel 1'is shown in FIG.
As shown in FIG. 2 and FIG. 2, since it is necessary to finish the first transparent substrate 10 to be smaller than the second transparent substrate to expose each terminal region, in this case, a single panel 1 ′ is configured. First transparent substrate 10 and second transparent substrate 20
Of these, after forming the scribe grooves 404 on the entire planned cutting line 403 of the first transparent substrate 10 or both end portions thereof, a predetermined pressing jig is pressed from the back surface side along the planned cutting line 403. Mechanical stress is applied or laser light is irradiated to remove an unnecessary portion from the first transparent substrate 10 and expose the terminal region from the second transparent substrate 20 (removal step from strips).

After that, in the step (H) shown in FIGS. 4 and 5, the flexible substrate 90 and the like are mounted.

[4] Structure of scribing groove forming apparatus In the method of manufacturing the electro-optical device 1 as described above, the present invention uses the scribing groove forming apparatus shown in FIGS. 7 and 8 in each scribing step.

FIG. 7 and FIG. 8 are an explanatory view of a scribe groove forming device to which the present invention is applied and an explanatory view showing the main part thereof.

In FIG. 7, the scribing groove forming apparatus 500 of the present embodiment sucks the large-sized panel 300 or the strip-shaped panel 400 on the XY plane when the mutually orthogonal directions are the X direction, the Y direction and the Z direction. The stage 510 held by a means for
00 or the large-sized substrate 100 that constitutes the strip-shaped panel 400,
Cutter 52 for forming a scribe groove in 200 or the like
0, and a head 530 that movably supports the cutter 520 in the Z direction.

Further, the scribe groove forming device 500 includes
X-direction drive mechanism 54 for moving the head 530 in the X-direction
0, a Y-direction drive mechanism 550 that moves the head 530 in the Y-direction, and a rotary drive device (not shown) that rotates the stage 510 in the XY plane.

In this embodiment, as the X-direction drive mechanism 540, a ball screw 541 extending in the X-direction and a motor (not shown) for rotationally driving the ball screw 541 are arranged, while the head 530 is mounted. Base 560
A screw (not shown) that meshes with the ball screw is formed on the. Therefore, when the ball screw 541 is rotated in the direction shown by the arrow + X0, the cutter 520 moves in the + X direction together with the head 530 mounted on the base 560. Further, in the present embodiment, as the Y-direction drive mechanism 550, a ball screw 551 extending in the Y-direction and a motor (not shown) for rotationally driving the ball screw 551 are arranged, while being supported on the ball screw 551. The slider 552 thus formed is provided with a screw (not shown) that meshes with the ball screw 551. Therefore, if the ball screw 551 is rotated in the direction indicated by the arrow + Y0, the slider 552
Moves in the + Y direction, the cutter 520 moves in the + Y direction together with the head 530 mounted on the base 560.

Further, in the scribe groove forming apparatus 500, as shown in FIG. 8, the Z of the head 530 with respect to the large-sized panel 300 and the strip-shaped panel 400 on the stage 510.
Z-direction position adjusting mechanism 5 for adjusting the relative position in the direction
70 and a sensor unit 530 for detecting the pressing pressure of the cutter 520 against the large-sized panel 300 or the strip-shaped panel 400.
During the formation of the scribe groove, the large-sized panel 300 is detected based on the pressure detection signal 584 from the sensor unit 530.
The controller 590 controls the Z-direction position adjusting mechanism 570 so that the pressing force of the cutter 520 against the strip-shaped panel 400 in the Z-direction becomes constant.

As the Z-direction drive mechanism 570, the base 5 is used.
A ball screw 571 extending in the Z direction and a pulse motor 572 that rotationally drives the ball screw 571 are arranged on the base 60, while the base 560 has a ball screw 5
A screw 573 that meshes with 71 is formed. Therefore, when the ball screw 571 is rotated in the direction shown by the arrow -Z0, the cutter 520 moves in the -Z direction together with the base 560 and the head 530 to approach the large-sized panel 300 or the strip-shaped panel 400, while the ball screw 571 moves. When 571 is rotated in the direction indicated by the arrow + Z, the cutter 520 moves in the + Z direction together with the base 560 and the head 530, and is separated from the large-sized panel 300 or the strip-shaped panel 400.

In the sensor portion 530, a cylinder 581 is formed integrally with the head 560, a plunger 582 is arranged inside the cylinder 581 so as to be slightly movable in the + Z direction, and a cutter 520 is provided at the lower end portion of the plunger 582.
Is supported. A pressure sensor 583 is attached to the top of the cylinder 581. The upper end surface of the plunger 582 has a pressure sensor 58 inside the cylinder 581.
3 is provided so as to be always in contact with 3, and is arranged in the cylinder 581 so as to be slightly movable in the vertical direction by the elasticity of the pressure sensor 583. The pressing pressure of the cutter 520 against the large-sized panel 300 or the strip-shaped panel 400 is transmitted to the pressure sensor 583 through the plunger 582. The pressure sensor 583 detects the pressing pressure of the cutter 520 against the large-sized panel 300 or the strip-shaped panel 400, and supplies a pressure detection signal 584 to the control unit 590.

The control unit 590 includes a microcomputer and a memory, and the pressing pressure of the cutter 520 against the large-sized panel 300 or the strip-shaped panel 400 is always a constant pressure value based on the pressure detection signal 584 from the pressure sensor 583. The Z-direction drive function 570 is feedback-controlled so as to maintain.

In the scribe groove forming apparatus 500 having such a structure, the Y-direction driving mechanism 550 moves the head 530 in the Y-direction with respect to the large-sized panel 300 or the strip-shaped panel 400 arranged on the XY plane on the stage 510. Adjust the position and attach the cutter 520 to the large panel 30.
0 or the strip-shaped panel 400 is aligned with the planned cutting line, the head 530 is processed by the Z-direction drive mechanism 570 under the control of the control unit 590, and the cutter 520 is brought into contact with the large-sized panel 300 or the strip-shaped panel 400. If the cutter 520 is moved in the X direction in this state, the scribe groove can be formed. While contacting the cutter 520 supported by the head 530, the X-direction drive mechanism 540
When the head 530 is relatively moved in the X direction by the cutter 520, the large panel 300 or the strip-shaped panel 4 is moved.
00, a scribe groove extending in the X direction can be formed.

During the formation of the scribe groove,
The control unit 590 includes the large-sized panel 300 and the strip-shaped panel 40.
The Z-direction drive mechanism 570 is controlled so that the pressing pressure of the cutter 520 with respect to 0 maintains a constant value. Therefore, it is possible to always form the scribe groove having a constant depth on the large-sized panel 300 or the strip-shaped panel 400, regardless of the uneven thickness or the unevenness of the surface.

FIG. 9 is an explanatory view showing a state where the substrate is cut by the above-mentioned scribe groove forming device. As shown in the drawing, according to the scribe groove forming apparatus 500 of the present invention, even if the substrate surface has irregularities, the cutter 520 is always operated by the feedback control of the control unit 590 based on the pressure detection signal 584 from the pressure sensor 583. The base 560 moves up and down so that a constant pressing pressure is applied to the surface.

FIG. 10A is another explanatory view showing a state in which the substrate is cut by the above-mentioned scribe groove forming apparatus, and shows a state in which the cutter 520 starts forming the scribe groove from the end 512 of the substrate. . In addition, FIG.
FIG. 5 is a diagram schematically showing a state at the start of scribe groove formation in the case of a scribe groove formation device employing an air cylinder type head as a comparative example.

In the case of FIG. 10A, since the height of the stage 510 of the scribe groove forming apparatus 500 in the Z direction and the thickness of the substrate on which the scribe is formed are known, the controller 590 is predetermined. Cutter 520 at the Z position
Control the head 530 (which is integral with the base 560) so that the
Move 0. The cutter 520 hits the end portion 512 of the substrate at an appropriate position in the Z direction, and the scribe groove 592 is formed on the surface of the substrate by moving the base in the X or Y direction. Therefore, the cutter 520 hits the edge 512 of the substrate with an impact more than necessary, and the head 530 causes the edge 5 of the substrate to hit.
You won't hit twelve.

On the other hand, in the case of the scribe groove forming device employing the air cylinder type head shown in FIG. 10B, the cutter 520 'moves in the Z direction when nothing is in contact with the cutter 520'. Since the head 530 'is lowered to the lowest point of the possible range, the head 53' is moved when the head 530 'is moved in the X or Y direction to form the scribe groove on the substrate.
0'may hit the side surface of the substrate. Also,
When the cutter 520 ′ hits the edge 512 of the substrate, the position of the cutter 520 ′ in the Z direction is improper,
The cutter 520 ′ may hit the end portion 512 of the substrate with an impact more than necessary, causing chipping or cracking at the end portion of the substrate.

Further, also in the opposite end portion (not shown) of the substrate, in the case of the scribe groove forming device employing the air cylinder type head, when the cutter 520 ′ reaches the end portion of the substrate, the load is suddenly increased. The cutter 520 'rapidly descends to the lowest point of its movable range. As a result, an excessive impact or force is applied to the edge portion of the substrate, and a chip or a crack may occur at the edge portion of the substrate.

In this respect, the scribe groove forming apparatus 5 of the present invention
According to 00, when the cutter 520 hits the edge 512 of the substrate, the controller 590 positions the cutter 520 at an appropriate position in the Z direction, so that the inappropriate impact or force as described above is exerted on the edge of the substrate. This does not occur, and no chipping or cracking occurs at the edge of the substrate.

[4] Formation of Scribing Grooves In the present embodiment, the above-described primary break step (E) is performed by using the scribing groove forming apparatus 500 having the above-described structure.
And / or large panel 3 in the secondary break step (G)
00 and / or scribe grooves are formed in the large-sized substrates 100 and 200 that form the strip-shaped panel 400. In addition,
Since these steps are basically the same steps, here, an example in which the scribe groove 302 ′ is formed in the large-sized substrate 100 forming the large-sized panel 300 will be described.

First, the control unit 590 determines the relative positional relationship between the stage 510 of the scribing groove forming apparatus 500 and the X and Y direction drive mechanisms 550 and 570, and the thickness of the substrate placed on the stage 510. , Fig. 10
As shown in (A), the position of the head 530 in the Z direction is adjusted so that the lower end of the cutter 520 is located slightly below the substrate surface. Note that, specifically, the position of the head 520 in the Z direction is determined by a predetermined scribe depth D (see FIG. 1).
Only 0 (see 0 (A)) is located below the substrate surface.

When the initial position of the head 530 is determined in this manner, the X or Y direction drive mechanism 540 or 550 is next determined.
Thus, the base 560 is moved in the X or Y direction to form a scribe groove on the substrate surface. At this time, if the substrate surface has irregularities, the head 530 to the plunger 58
Since the pressure transmitted to the pressure sensor 583 via 2 changes, the control unit 590 controls the Z direction drive mechanism 570 based on the pressure detection signal 584 so that the cutter 520 is always pressed against the substrate with a constant pressing pressure. To As a result, as shown in FIG. 9, a scribe groove having a predetermined depth is formed on the substrate surface regardless of the unevenness of the substrate surface.

As described above, in the scribing groove forming apparatus 500 of this embodiment, even when the cutter 520 enters the substrate and separates from the substrate, the cutter 5 does not move.
Since the control unit 590 controls the Z-direction position of the base 560 integrated with the substrate 20, no chipping or cracking occurs at the substrate end.

[5] Substrate Cutting Method Next, a substrate cutting method utilizing the above-mentioned scribe groove forming method will be described. FIG. 11 is a process diagram showing a method for cutting a glass substrate (panel), and shows in detail the processes (E) and (F) described with reference to FIGS. 4 and 5.

As shown in FIG. 11, in this embodiment, first, the step (E11) is performed as the primary break step (E).
Then, the scribe groove 30 is formed on the large substrate 100 of the large panel 300 by the cutter 520 of the scribe groove forming device 500.
After forming 2 ′, the large-sized panel 300 is turned upside down, and in the step (E12), the scribed groove 302 ′ is pressed by the pressing jig 600 from the large-sized substrate 200, so that the large-sized substrate 1 is processed.
Cut 00. Next, in step (E13), after the scribe grooves 302 ″ are formed in the large-sized substrate 200 of the large-sized panel 300 by the cutter 520 of the scribe-groove forming device 500, the large-sized panel 300 is turned upside down, and the step (E13) is performed.
14), the scribe groove 30 from the large substrate 100
The large substrate 200 is cut by pressing the 2 ″ with the pressing jig 600. As a result, the large-sized panel 300 becomes the strip-shaped panel 4.
It is cut to 00.

On the other hand, in the second break step (G), in the step (G11), the large substrate 100 of the strip-shaped panel 400 is processed.
After forming the scribe groove 402 ′ by the cutter 520 of the scribe groove forming apparatus 500, the strip panel 400 is turned upside down, and in the step (G12), the strip panel 40 is formed.
The scribe groove 402 ′ is pressed by the pressing jig 600 from the large substrate 200 of 0 to cut the large substrate 100. Next, in step (G13), the cutter 5 of the scribe groove forming apparatus 500 is applied to the large substrate 200 of the strip-shaped panel 400.
After forming the scribed groove 402 ″ with 20, the strip-shaped panel 400 is turned upside down, and in the step (G14), the scribed groove 402 ″ is pressed by the pressing jig 600 from the large-sized substrate 100. Cut 100. As a result, the strip-shaped panel 400 is cut into a single panel 1 '.

Then, in the step (G15), the scribe grooves 404 are scribed by the cutter 520 of the scribe groove forming apparatus 500 with the first transparent substrate 10 of the single panel 1 ′ facing upward.
After forming, the single panel 1'is turned upside down, and in the step (G16), the second transparent substrate 20 of the single panel 1'is formed.
Of the second transparent substrate 20 from the substrate side of the first transparent substrate 10 by removing the unnecessary portion from the first transparent substrate 10 by pressing the scribe groove 404 with the pressing jig 600 from above. Expose.

In this way, the scribe groove 302 ',
In manufacturing the single panel 1 ′ from the large-sized panel 300 to the strip-shaped panel 400 by using 302 ″, 402 ′, 402 ″, and 404, in the present embodiment, the above-mentioned scribe groove forming apparatus 500 is used. Then, during the formation of the scribe groove, the control unit 590 controls the Z-direction drive mechanism so that the pressing pressure of the head 520 against each panel 300, 400, 1 ′ is always constant. Therefore, it is possible to always form a scribe groove having a constant depth regardless of the unevenness on the surface of the panel and break the panel at the correct position.

In the example shown in FIG. 11, the pressing jig 60
At 0, the backsides of the large-sized substrates 100, 200 are pressed to cut the large-sized substrates 100, 200. Instead,
After the scribe grooves are formed by the scribe groove forming apparatus 500 of the present invention, the large substrates 100 and 200 may be cut by irradiating laser light along the planned cutting line. According to this method, the large-sized substrate 1 is caused by thermal stress caused by laser irradiation.
Vertical cracks occur at 00 and 200, and the large substrate 10
0,200 can be cut.

Further, in the above example, the present invention is applied to the case of cutting a panel in which two glass substrates are bonded together, but the present invention may be applied to the case of cutting one glass substrate. . In this case, when cutting the glass substrate at a plurality of locations, forming a scribe groove for each of a plurality of planned cutting lines,
The cutting along the planned cutting line may be repeated, but after the scribe groove is formed for each of the plural planned cutting lines on one glass substrate, the cutting is performed along each of the planned cutting destinations. By adopting a method of sequentially cutting the glass substrate by using the glass substrate, the process can be simplified.

Further, in the above embodiment, an example in which the present invention is applied to the manufacture of the passive matrix type electro-optical device 1 is shown. However, an active matrix type liquid crystal device using a TFD element as an active element, or an active element. The present invention can be applied to the manufacture of various electro-optical devices such as an active matrix type liquid crystal device using a thin film transistor.

[6] Embodiment of Electronic Device FIG. 12 shows an embodiment in which the electro-optical device (liquid crystal device) according to the present invention is used as a display device of various electronic devices. The electronic device shown here has a display information output source 70, a display information processing circuit 71, a power supply circuit 72, a timing generator 73, and a liquid crystal device 74. The liquid crystal device 74 also includes a liquid crystal display panel 75 and a drive circuit 76. As the liquid crystal device 74 and the liquid crystal panel 75, the electro-optical device 1 and the single panel 1 ′ described above can be used.

The display information output source 70 is a ROM (Read Onl
y Memory), a memory such as a RAM (Random Access Memory), a storage unit such as various disks, a tuning circuit that tunes and outputs a digital image signal, and the like, based on various clock signals generated by the timing generator 73. Display information such as a format image signal is supplied to the display information processing circuit 71.

The display information processing circuit 71 includes a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit,
Various well-known circuits such as a gamma correction circuit and a clamp circuit are provided, the input display information is processed, and the image signal is supplied to the drive circuit 76 together with the clock signal CLK. The power supply circuit 72 supplies a predetermined voltage to each component.

FIG. 13 shows a mobile personal computer which is an embodiment of the electronic apparatus according to the present invention. The personal computer 80 shown here has a main body 87 having a keyboard 86 and a liquid crystal display unit 88. The liquid crystal display unit 88 is configured to include the electro-optical device 1 described above.

FIG. 14 shows a mobile phone which is another embodiment of the electronic apparatus according to the present invention. The mobile phone 90 shown here has a plurality of operation buttons 91 and the electro-optical device 1 including a liquid crystal device.

[0089]

As described above, according to the present invention, when the scribed groove is formed on the substrate (panel), the pressing pressure of the head against the substrate is detected by the pressure sensor and the vertical position of the head is feedback-controlled. As a result, the scribe groove can be formed while pressing the head against the substrate with a constant pressing pressure. Therefore, it is possible to always form a scribe groove having a constant depth regardless of the shape of the unevenness on the substrate surface.

Further, by driving the head integrated with the cutter in the vertical direction, the control unit can precisely adjust the vertical position of the cutter, so that there is no chipping at the end of the substrate on which the scribe groove is to be formed. It is possible to prevent the occurrence of cracks.

[Brief description of drawings]

FIG. 1 is a perspective view of an electro-optical device to which the invention is applied.

FIG. 2 is an exploded perspective view of the electro-optical device shown in FIG.

3 is a cross-sectional view of an end portion on the I side when the electro-optical device shown in FIG. 1 is cut along a line II ′ in FIG.

4A to 4D are process diagrams showing a method of manufacturing the electro-optical device shown in FIG.

5A and 5B are explanatory views showing a method of manufacturing the electro-optical device shown in FIG.

6 is a method for manufacturing the electro-optical device shown in FIG.
It is explanatory drawing which shows the planned cutting line for cutting from a large board | substrate through a strip-shaped panel to a panel of a single item.

FIG. 7 is a perspective view of a scribe groove forming device of the present invention.

8 is an explanatory view showing a main part of the scribe groove forming device shown in FIG. 7. FIG.

FIG. 9 is an explanatory view showing how scribe grooves are formed by the scribe groove forming device of the present invention.

FIG. 10 is a diagram for explaining how a scribe groove is formed by the scribe groove forming apparatus of the present invention in comparison with the case of another scribe groove forming apparatus employing an air cylinder type head.

FIG. 11 is a process drawing showing a method for cutting a glass substrate (panel) according to the present invention.

FIG. 12 is a block diagram showing a configuration of various electronic devices using the electro-optical device according to the invention.

FIG. 13 is an explanatory diagram showing a mobile personal computer as an embodiment of an electronic apparatus using the electro-optical device according to the invention.

FIG. 14 is an explanatory diagram of a mobile phone as an embodiment of an electronic device using the electro-optical device according to the invention.

[Explanation of symbols]

1 Electro-optical device 10 First transparent substrate (glass substrate) 20 Second transparent substrate (glass substrate) 30 sealing material 100, 200 Large substrate (glass substrate) 300 large panel 500 scribe groove forming device 510 stage 520 cutter 530 head 540 X-direction drive mechanism 550 Y direction drive mechanism 560 base 570 Z-direction drive mechanism 572 pulse motor 583 Pressure sensor 590 control unit 600 pressing jig

Claims (13)

[Claims] 1. A stage having an XY plane defined by X and Y directions orthogonal to each other, for holding a scribing target on the XY plane, and a stage for forming a scribing groove in the scribing target. A cutter, a head for holding the cutter, a Z direction position adjusting means for moving the head in a Z direction perpendicular to the XY plane, a pressing pressure of the cutter with respect to the scribing target, and a pressure detection. A scribe groove forming apparatus comprising: a pressure sensor that outputs a signal; and a control unit that controls the Z-direction position adjusting unit based on the pressure detection signal. 2. The control means, while forming a scribe groove in the scribe object by the cutter,
2. The scribing groove forming apparatus according to claim 1, wherein the Z direction position adjusting means is controlled so that the pressing pressure of the cutter against the scribing target is always a constant pressure value. 3. The head includes a cylinder and a plunger disposed in the cylinder, the cutter is attached to a lower end portion of the plunger, and the pressure sensor is disposed at an uppermost portion in the cylinder and the plunger. The scribe groove forming device according to claim 1 or 2, wherein the scribe groove forming device is arranged between the scribe groove forming device and the upper end face of the scribe groove. 4. The scribe according to claim 1, wherein an upper end surface of the plunger is always in contact with the pressure sensor, and the plunger is movable in the Z direction. Groove forming device. 5. The scribing groove forming apparatus according to claim 1, further comprising a head driving unit that moves the head in at least one of the X direction and the Y direction. 6. The control means includes the Z of the stage.
A Z direction reference position for forming a scribe groove of a predetermined depth on the scribe target placed on the stage based on the position in the directional direction and the thickness of the scribe target in the Z direction. Then, after controlling the Z direction adjusting mechanism so that the cutter is located at the Z direction reference position before the cutter contacts the scribing target,
The scribing groove forming apparatus according to claim 5, wherein the head driving unit moves the cutter in the X direction or the Y direction to form a scribing groove in the scribing target. 7. The X-direction so that the cutter is located at the Z-direction reference position when the cutter is separated from the scribing target by the movement of the cutter by the head driving means. The scribe groove forming device according to claim 6, wherein the adjusting means is controlled. 8. A scribing groove forming method for forming a scribing groove in a scribing target using a cutter, wherein the pressing pressure of the cutter against the scribing target becomes a constant value. A method for forming a scribing groove, which comprises a step of moving the cutter along a scribing surface of the scribing object while adjusting a relative position of the cutter. 9. A scribe object held on an XY plane defined by X and Y directions orthogonal to each other,
In a scribing groove forming method of forming a scribing groove using a cutter, a position in a Z direction perpendicular to the XY plane of a stage on which the scribing target is placed, and A first step of determining a Z-direction reference position of the cutter for forming a scribe groove having a predetermined depth in the scribe object based on a thickness, before the cutter contacts the scribe object And a third step of arranging the cutter at the Z-direction reference position, and a third step of moving the cutter in the X-direction or the Y-direction, the third step comprising: Holding the cutter in the Z direction reference position and moving the cutter in the X direction or the Y direction until the cutter contacts the scribing target; While contacting the object to be scrubbed, while adjusting the relative position of the cutter with respect to the scribing object, the cutter with the scribing object so that the pressing pressure of the cutter against the scribing object has a constant value. Moving the object along the scribe surface, and after the cutter is separated from the scribe object,
And a step of moving the cutter in the X-direction or the Y-direction while holding the cutter at the Z-direction reference position. 10. The scribing target is a glass substrate, and a step of forming a scribe groove by the scribe groove forming method according to claim 8 or 9, and cutting the glass substrate along the formed scribe groove. And a step of cutting the glass substrate. 11. A method of manufacturing an electro-optical device, which comprises cutting the glass substrate for holding an electro-optical substance by using the method of cutting a glass substrate according to claim 10. 12. An electro-optical device manufactured by the method according to claim 11. 13. An electronic apparatus comprising the electro-optical device according to claim 12 as a display unit.