JP2003031993A - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

(57) Abstract: A method and an apparatus for mounting an electronic component capable of mounting a high-end electronic component having a narrow pitch bump are provided. SOLUTION: After detecting contact between each solder bump 1b of the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 and each solder portion 2 of the circuit board 4, each solder bump 1 is detected.
b, and the solder portions 2 are melted by heating, and the timing of releasing the suction holding of the head tool 3 to the electronic component 1 by the suction nozzle 11 is not released during the melting of the solder, but the solder is cooled after being melted. Release after solidification.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting electronic components on a circuit board, and particularly to an electronic component such as an IC chip having narrow pitch bumps on a circuit board by a flip chip bonding method. The present invention relates to a mounting method and mounting device for electronic components that can be mounted.

[0002]

2. Description of the Related Art Conventionally, various methods for mounting electronic components of this type have been known. As an example of a conventional flip chip bonding method for mounting electronic components, a method of temporarily soldering a plurality of electronic components onto a circuit board and then reflowing solder collectively to mount the electronic components (hereinafter, collectively reflow mounting 22) is shown in FIG.

As shown in FIG. 22A, the pads 8 which are a plurality of electrodes on the upper surface of a plate-shaped circuit board 84.
The cream solder is supplied onto the surface 4a by printing or the like to form the solder portion 82 on each pad 84a of the circuit board 84.

Next, in FIG. 22B, the electronic component 81 in which the solder bumps 81b are bonded to the plurality of electrodes 81a on the bonding surface is sucked by the tool 83 on the back surface which is the surface without the electrodes 81a. After being held and aligned so that the solder bumps 81b of the electronic component 81 can be joined to the solder portions 82 on the circuit board 84, the solder bumps 81b of the electronic component 81 are attached to the solder portions 82 of the circuit board 84. Pressurize to perform temporary joining. When mounting a plurality of electronic components 81 on the circuit board 84, these operations are repeated to mount each electronic component 81 on the circuit board 84. The term “temporary joining” as used herein means that the joining of the electronic component 81 and the circuit board 84 can be released by destroying the electronic component 81 and the circuit board 84 by applying an external force to the electronic component 81 or the circuit board 84. Shows possible joints.

After that, the circuit board 84 to which the electronic components 81 are temporarily joined is conveyed to the solder reflow working unit. Figure 2
As shown in 2 (c), in the solder reflow working unit,
The electronic components 81 and the circuit board 84 are heated by the heat source, and the solder portions 82 and the solder bumps 81b are melted. When the plurality of electronic components 81 are temporarily joined on the circuit board 84, the solder is reflowed all at once in the solder reflow working unit.

After that, as shown in FIG. 22D, in the circuit board 84 taken out from the solder reflow working section, the molten solder is cooled and solidified, so that each electrode 81a of each electronic component 81 is connected to the circuit. The pads 84a of the board 84 are permanently joined via solder, and the electronic components 81 are collectively mounted on the circuit board 84. Here, the main bonding is a bonding performed by applying heat to the electronic component 81 and the circuit board 84 in the temporary bonding state to melt and solidify the solder, and the electronic component 81 or the circuit board 84. It is difficult to easily release the joined state by applying external force to the joint.

In such a collective reflow mounting method, after a large number of electronic components 81 have been temporarily joined, the solder can be melted in a lump and each electronic component 81 can be permanently joined to the circuit board 84 for mounting. Since the mounting work of the electronic components can be efficiently performed, the mounting cost of each electronic component 81 on the circuit board 84 can be suppressed.

However, in such a method, after each electronic component 81 is temporarily joined to the circuit board 84, the solder is melted to perform the main joining, so that the circuit board 84 to which each electronic component 81 is temporarily joined is formed. It is necessary to convey to the solder reflow work part, and due to the vibration etc. generated during the conveyance during this conveyance,
When the joint position of each electronic component 81 with respect to the circuit board 84 is displaced and the solder is reflowed as it is, each electronic component 8
In some cases, the connection of No. 1 to the circuit board 84 may be defective. For electronic components that do not require high bonding position accuracy, such as general-purpose electronic components, the bonding position deviation that occurs in the batch reflow mounting method did not pose a problem, but particularly high bonding position accuracy is required. In electronic parts such as IC chips, there may be a problem.

As an example of a conventional flip chip bonding method for mounting electronic components that solves the problems in such a batch reflow mounting method, the electronic components are individually soldered by heating and pressing them on a circuit board. FIG. 23 shows a method of reflowing the electronic component to mount an electronic component (hereinafter referred to as a conventional local reflow mounting method).

As shown in FIG. 23A, the pads 9 which are a plurality of electrodes on the upper surface of the plate-shaped circuit board 94.
Cream solder is supplied onto the surface 4a by printing or the like to form the solder portion 92 on each pad 94a of the circuit board 94.

Next, as shown in FIG. 23B, the electronic component 91 in which the solder bumps 91b are bonded to the plurality of electrodes 91a on the bonding surface has a back surface which is a surface not having the electrodes 91a as a tool. The solder bumps 91b of the electronic component 91 are positioned so that the solder bumps 91b of the electronic component 91 can be joined to the solder portions 92 of the circuit board 94, and then the solder bumps 91b of the electronic component 91 are soldered to the solder of the circuit board 94. The portions 92 and the solder bumps 91b are melted by applying pressure to the portions 92 while heating.

Next, as shown in FIG. 23 (c), the suction holding of the electronic component 91 by the tool 93 is released while the solder is in a molten state. As a result, the self-alignment effect due to the surface tension of the molten solder can be obtained.

Then, as shown in FIG. 23D, the melted solder is solidified so that each electrode 91a of the electronic component 91 is bonded to each pad 94a of the circuit board 94 via the solder, and the electronic component 91 are individually mounted on the circuit board 94. When a plurality of electronic components 91 are mounted on the circuit board 94, these operations are repeated to individually mount each electronic component 91 on the circuit board 94.

In such a local reflow mounting method, the electronic component 91 is sucked and held by the tool 93,
The solder bumps 91b of the electronic component 91 are heated and pressed by the tool 93 to the solder portions 92 of the circuit board 94, and then the electronic component 9 is applied by the tool 93 during the molten state of the solder.
Since the adsorption and holding to 1 is released, the self-alignment effect due to the surface tension of the molten solder is obtained, and even if the accuracy of the joining position of the electronic component 91 by the tool 93 is somewhat poor, the self-alignment effect results in a poor joining. It was possible to obtain a welding position accuracy that does not become bad.

[0015]

However, in a high-end electronic component having a narrow bump pitch among electronic components such as IC chips, the bump pitch becomes a narrow pitch of, for example, 150 μm or less. In the case of electronic components having bumps, the bonding position of the electronic components due to vacuum break blow that occurs when releasing the suction holding to the electronic components during melting of the solder, rather than the self-alignment effect in the local reflow mounting method described above. It is required to have a high bonding position accuracy such that the amount of deviation of the distance becomes a problem, for example, a bonding position accuracy of ± 5 μm or less. Therefore, in the mounting method of the electronic component by the above-mentioned local reflow mounting method that releases the suction and holding to the electronic component by the tool while the solder is in the molten state, such a narrow pitch bump is provided and a high bonding position is provided. There is a problem that it cannot be applied to the mounting of high-end electronic components that require high accuracy.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to solve the above problems by providing a mounting method and mounting device for an electronic component capable of mounting a high-end electronic component having a narrow pitch bump, and a general-purpose electronic component. In a mounting method and mounting device for electronic components on a circuit board where high-end electronic components and high-end electronic components are mounted together, the mounting method for each electronic component is selected according to the bonding position accuracy required for each electronic component to improve productivity and quality. An object of the present invention is to provide a mounting method and mounting apparatus for electronic components that are compatible with each other.

[0017]

In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, an electronic component having a plurality of electrodes is sucked and held by a component holding member, and the electrodes of the electronic component and the plurality of electrodes of the circuit board are interposed by a bonding material. Position so that they can be joined together, and the component holding member is lowered while the electronic component is adsorbed and held, and the electrodes of the electronic component and the electrodes of the circuit board with the joining material interposed Provided is a method for mounting an electronic component, which detects contact, and after the contact is detected, the bonding material is heated and melted, and then cooled and solidified.

According to the second aspect of the present invention, the contact is actually detected when the electrodes of the electronic component and the electrodes of the circuit board are contacted with each other with the bonding material interposed. A mounting method for an electronic component according to the first aspect, which is detected when a load generated exceeds a contact load predicted to be generated at the time of contact.

According to the third aspect of the present invention, the contact is actually detected when the electrodes of the electronic component and the electrodes of the circuit board are contacted with each other with the bonding material interposed therebetween. The component holding member is controlled to be slightly lowered according to the generated load so that the load actually generated at the time of contact exceeds the contact load predicted to be generated at the time of contact. A mounting method for an electronic component according to the first aspect or the second aspect, which is detected by being controlled by the above.

[0021] According to a fourth aspect of the present invention, there is provided the method according to any one of the first to third aspects, wherein after the joining material is solidified, the suction holding of the electronic component by the component holding member is released. A method for mounting electronic components is provided.

According to a fifth aspect of the present invention, the bonding material is previously supplied to at least one of the electrodes of the electronic component or the electrodes of the circuit board. To A method of mounting an electronic component according to any one of the fourth aspect.

According to a sixth aspect of the present invention, there is provided the electronic component mounting method according to any one of the first to fifth aspects, in which the bonding material is solder.

According to a seventh aspect of the present invention, flux is previously supplied to the electrodes of the electronic component, the electrodes of the circuit board, or the bonding material. A method for mounting an electronic component according to any one of aspects is provided.

According to an eighth aspect of the present invention, the bonding material is a solder bump formed on each electrode of the electronic component, or a solder bump formed on each electrode of the electronic component and the circuit board. The method for mounting an electronic component according to any one of the first to fourth aspects or the seventh aspect, which is the solder portion formed on each of the electrodes.

According to the ninth aspect of the present invention, the contact between the electrodes of the electronic component and the electrodes of the circuit board via the bonding material is detected, and the component is held by the heating. When it is determined whether or not the elongation amount of the member is corrected and the elongation amount of the component holding member is corrected, the component holding member is held based on the elongation change data of the component holding member due to the heating. While raising the member,
While each bonding material between each electrode of the electronic component and each electrode of the circuit board is melted by the heating, when the expansion amount of the component holding member is not corrected, each of the electronic components Whether to correct the shrinkage amount of the component holding member due to the cooling after melting the bonding material between the electrode and each of the electrodes of the circuit board by heating and starting cooling of the melted bonding material When performing the correction of the shrinkage amount of the component holding member based on the change data of the shrinkage amount of the component holding member due to the cooling, each component of the electronic component is lowered while lowering the component holding member. While each bonding material between the electrode and each electrode of the circuit board is solidified by the cooling, when the shrinkage amount of the component holding member is not corrected, each electrode of the electronic component and the circuit board are It provides a method of mounting an electronic component according to the bonding material from the first aspect to solidify by cooling to any one of the eighth aspect between the electrodes of the.

According to the tenth aspect of the present invention, the contact between the electrodes of the electronic component and the electrodes of the circuit board via the bonding material is detected, and the component is held by the heating. Based on the expansion amount change data of the member, while raising the component holding member, each bonding material between each electrode of the electronic component and each electrode of the circuit board is melted by the heating. An electronic component mounting method according to any one of eight aspects is provided.

According to the eleventh aspect of the present invention, after the cooling of the molten bonding material is started, the component holding member is lowered while the component holding member is lowered based on the shrinkage amount change data of the component holding member due to the cooling. A mounting method for an electronic component according to any one of the first to eighth aspects, in which each bonding material between each electrode of the electronic component and each electrode of the circuit board is solidified by the cooling.

According to the twelfth aspect of the present invention, after detecting the contact between the electrodes of the electronic component and the electrodes of the circuit board with the bonding material intervening, the electrodes are contacted by the contact. The load actually generated between the electrodes is maintained substantially constant, and after the melting of the bonding material by heating is started, the maintenance of the load actually generated is released, and the contact height of the electronic component with the circuit board is increased. A method for mounting an electronic component according to any one of the first aspect to the eleventh aspect, which maintains the position substantially constant.

According to a thirteenth aspect of the present invention, the electronic component according to the twelfth aspect, wherein when the decrease in the load generated between the electrodes due to the contact is detected, the melting of the bonding material is started. Provide a mounting method of parts.

According to the fourteenth aspect of the present invention, after the electronic component is sucked and held by the component holding member, the supply height of the bonding material previously supplied onto the electrodes of the electronic component is made uniform. Then, the electronic component and the circuit board are aligned so that the electrodes of the electronic component and the electrodes of the circuit board can be joined to each other. A method of mounting the described electronic component is provided.

According to a fifteenth aspect of the present invention, in the electronic component mounting method for mounting two kinds of electronic components, a first electronic component and a second electronic component, on a circuit board, the second electronic component is the first electronic component. In the case where it is required to be mounted on the circuit board with a bonding position accuracy higher than that of the first electronic component, the first electronic component is sucked and held by the component holding member, and a plurality of electrodes of the first electronic component are held. And a plurality of electrodes of the circuit board are aligned so that they can be joined with a joining material interposed, and the component holding member is lowered while adsorbing and holding the first electronic component. After temporarily bonding the electrodes and the electrodes of the circuit board with the bonding material interposed therebetween to temporarily bond the electrodes, the electrodes of the first electronic components that are temporarily bonded and the electrodes of the circuit board Heating the above bonding material between each electrode Then, the main bonding is performed by melting, cooling, and solidifying, and the electrodes of the first electronic component and the electrodes of the circuit board are mounted with the bonding material interposed, and then the second electronic component is mounted. The component is the electronic component according to the first aspect, wherein the component has a plurality of electrodes that can be bonded to the electrodes of the second electronic component, and is mounted on the circuit board on which the first electronic component is mounted. 1 aspect to 14th
A method for mounting an electronic component according to any one of aspects is provided.

According to the sixteenth aspect of the present invention, the electronic component is sucked and held by the component holding member, and the plurality of electrodes of the electronic component and the plurality of electrodes of the circuit board are brought into contact with each other with the bonding material interposed therebetween, In a mounting device for an electronic component, which heats and melts a bonding material, and bonds the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed, the electronic component is mounted on the component holding member. A suction holding mechanism for sucking and holding, a lifting mechanism for lowering or raising the component holding member, a component holding member for sucking and holding the electronic component by the suction holding mechanism, lowering by the lifting mechanism,
Occurs between the electrodes of the electronic component and the electrodes of the circuit board at the time of contact between the electrodes of the electronic component and the electrodes on the circuit board with the bonding material interposed. A load detection unit that detects a contact load, a heating mechanism that heats the bonding material, a cooling mechanism that cools the bonding material heated by the heating mechanism, and an adsorption holding mechanism,
The lifting mechanism, the load detection unit, the heating mechanism, and
A control unit for controlling the cooling mechanism is provided, and the control unit is
After the contact load is detected by the load detection unit, the bonding material is melted by heating by the heating mechanism, and then the bonding material is cooled and solidified by the cooling mechanism, and the electronic component described above. According to the contact load detected by the load detecting unit, the elevating mechanism operates between the contact between the electrodes and the electrodes of the circuit board with the bonding material interposed until the bonding material melts. Provided is an electronic component mounting apparatus, which is configured to control an elevating operation of the component holding member.

According to the seventeenth aspect of the present invention, the contact load is detected by using the bonding material between the electrodes of the electronic component and the electrodes of the circuit board, which are detected by the load detection unit. The electronic component mounting apparatus according to the sixteenth aspect, which is detected by the control unit when the load actually generated at the time of abutting contact exceeds the abutting load predicted to occur at the time of the abutting. provide.

According to the eighteenth aspect of the present invention, the contact load is detected by using the bonding material between the electrodes of the electronic component and the electrodes of the circuit board, which are detected by the load detection unit. It is predicted that the component holding member is slightly moved down by the elevating mechanism according to the load actually generated at the time of contact with the interposition, and the load actually generated at the time of contact is generated at the time of contact. There is provided the electronic component mounting apparatus according to the sixteenth aspect or the seventeenth aspect, which is detected by the control unit when the contact load is exceeded.

According to the nineteenth aspect of the present invention, the control section maintains the suction holding of the electronic component to the component holding member by the suction holding mechanism even during the melting of the bonding material by the heating mechanism, Any one of the sixteenth aspect to the eighteenth aspect, in which the suction holding mechanism releases the suction holding of the electronic component by the suction holding mechanism after solidification by cooling the joining material by the cooling mechanism. A mounting device for the electronic component described in 1.

According to the twentieth aspect of the present invention, after positioning the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed, the electronic component is held by suction. Any of the sixteenth aspect to the nineteenth aspect in which the control unit sets the load detected by the load detection unit to the load zero point in the load detection unit until the component holding member is lowered. An electronic component mounting apparatus according to one aspect is provided.

According to the twenty-first aspect of the present invention, the electronic component is sucked and held by the component holding member, and the plurality of electrodes of the electronic component and the plurality of electrodes of the circuit board are brought into contact with each other with the joining material interposed therebetween, In a mounting device for an electronic component, which heats and melts a bonding material, and bonds the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed, the electronic component is mounted on the component holding member. A suction holding mechanism for sucking and holding, a lifting mechanism for lowering or raising the component holding member, a component holding member for sucking and holding the electronic component by the suction holding mechanism, lowering by the lifting mechanism,
Occurs between the electrodes of the electronic component and the electrodes of the circuit board at the time of contact between the electrodes of the electronic component and the electrodes on the circuit board with the bonding material interposed. A load detection unit that detects a contact load, a heating mechanism that heats the bonding material, and a cooling mechanism that cools the bonding material heated by the heating mechanism are provided, and in the component holding member, the component holding member is A component holding member tip portion and a component holding member body portion, wherein the component holding member tip portion includes the suction holding mechanism, the heating mechanism, the cooling mechanism and the shaft portion, and the component holding member body. The portion includes a support portion that supports the tip end portion of the component holding member, and the load detection portion attached to the support portion, and each of the suction holding mechanism, the heating mechanism, the shaft portion, and the load detection portion. The center is on the same axis And the coaxial is arranged in parallel with the ascending / descending operation axis of the component holding member by the elevating mechanism, and the load detecting unit is such that the end of the shaft portion at the tip of the component holding member is the supporting unit. By being pressed against the load detection surface of the load detection unit by the elastic body that is attached and supports the shaft, it is possible to detect the load acting in the coaxial direction of the tip of the component holding member by the load detection unit. Provided is a mounting device for electronic parts.

According to a twenty-second aspect of the present invention, the component holding member further comprises a pressurizing mechanism for pressurizing the electronic component onto the circuit board, and the pressurizing mechanism comprises two pneumatic cylinders having different inner diameters. One of the pneumatic cylinders is provided in the component holding member main body,
Another pneumatic cylinder is provided at the tip of the component holding member, and by selecting an pneumatic cylinder having an inner diameter suitable for the contact load from the pneumatic cylinders and operating the pneumatic cylinder,
Pressurization in which the tip of the component holding member is lowered coaxially, and the electrodes of the electronic component suction-held by the suction-holding mechanism are pressed to the electrodes of the circuit board with the bonding material interposed. The component holding member is configured to have a function, and further, at least one pneumatic cylinder among the pneumatic cylinders includes a limiting mechanism that mechanically limits the operation of the one pneumatic cylinder, The limiting mechanism is provided with the limiting mechanism when the pneumatic cylinder having the limiting mechanism presses the pneumatic cylinder not having the limiting mechanism to limit the operation of the pneumatic cylinder not having the limiting mechanism. By limiting the operation of the pressure cylinder, the operation of each of the above pneumatic cylinders is limited,
There is provided an electronic component mounting apparatus according to a twenty first aspect, in which the pressing function of the component holding member is restricted.

According to a twenty-third aspect of the present invention, the limiting mechanism provided in the pneumatic cylinder having a cylindrical guide and a cylindrical rod arranged inside the guide is A groove-shaped recess formed on the outer periphery of the cylindrical side surface, a hole formed on the cylindrical side surface of the guide at a position where it can match the recess of the rod, and the hole of the guide, A rod body that can be fitted inside the concave portion of the rod; and in the limiting mechanism, the rod body is made to penetrate the hole of the guide from the outside of the guide, and the rod body of the concave portion of the rod. A mounting device for an electronic component according to a twenty-second aspect, which restricts the operation of the pneumatic cylinder by being fitted inside, is provided.

According to the twenty-fourth aspect of the present invention, of the two pneumatic cylinders having different inner diameters in the pressurizing mechanism, a large cylinder having a larger inner diameter is provided in the component holding member main body and the inner diameter is A small small cylinder is provided at the tip of the component holding member, the centers of the large cylinder and the small cylinder are arranged on the same axis, and the large cylinder is provided with the limiting mechanism, and the component holding member main body is provided. In the section, the guide of the large cylinder is attached to the end portion of the support portion, the rod of the large cylinder is attached to the load detection portion, and at the tip of the component holding member,
The guide of the small cylinder is attached to the end portion of the shaft portion, and the rod of the small cylinder can contact the load detection surface of the load detection unit. An electronic component mounting device is provided.

[0042]

BEST MODE FOR CARRYING OUT THE INVENTION An electronic component mounting method and mounting apparatus according to the present invention are configured such that a plurality of electrodes of an electronic component are abutted on a plurality of electrodes of a circuit board with a bonding material interposed therebetween, and each bonding material is attached. The present invention relates to a mounting method and mounting device for an electronic component, which is melted and solidified to bond an electronic component to a circuit board with each bonding material interposed, and a mounting method and mounting device for an electronic component according to a first embodiment of the present invention. Will be described in detail with reference to the drawings.

As shown in FIG. 1, the electronic component mounting apparatus 20
1, a head tool 3, which is an example of a component holding member for mounting electronic components, is fixed to a nut portion of an X-direction moving mechanism 22, and the X-direction moving mechanism 22 rotates a ball screw shaft by a motor. By this, the head tool 3 fixed to the nut portion screwed on the ball screw shaft is moved in the X1 direction to the right in the X direction in the drawing or the X2 direction to the left. Further, as shown in FIG. 3, which is a schematic cross-sectional view of the head tool 3, the electronic component mounting apparatus 201 includes an elevating unit 2 that is an example of an elevating mechanism that lowers or raises the head tool 3.
1 is provided. Furthermore, head tool 3
Is a suction nozzle 11 that is an example of a suction holding mechanism that holds an electronic component by suction at its tip, and this suction nozzle 11
Ceramic heater 1 which is an example of a heating mechanism for heating an electronic component sucked and held by the suction nozzle 11 by heating
2 and a cooling blow nozzle 19 which is an example of a cooling mechanism for cooling the electronic component heated by the ceramic heater 12. Here, the heating mechanism is, for example, a ceramic heater 12 provided in the head tool 3.
However, instead of the ceramic heater 12,
The electronic component mounting apparatus may include a heating unit included in the gantry unit on which the circuit board is arranged, or a heating unit that heats the electronic component and the circuit board by blowing hot air. A detailed description of the structure of the head tool 3 will be given later.

In FIG. 1, the slide base 6 is fixed to a nut portion of a Y-direction moving mechanism 23, and the Y-direction moving mechanism 23 rotates a ball screw shaft by a motor so that the nut screwed to the ball screw shaft is engaged. The slide base 6 fixed to the section is moved in the Y direction shown in the Y direction to the right or the Y2 direction to the left. A plurality of electronic components 1 are supplied to a parts tray 5 fixed on a slide base 6, and a circuit board 4 is positioned and fixed on a stage 7 which is an example of a pedestal part fixed on the slide base 6. ing. The X direction and the Y direction in FIG. 1 are orthogonal to each other.

Further, the electronic component mounting apparatus 201 is provided with a control unit 9 which is a control unit for controlling each component in the electronic component mounting apparatus 201, and the moving operation of the elevating unit 21 and the X-direction moving mechanism 22 are performed. Movement operation, Y-direction movement mechanism 2
3, the suction operation of the suction nozzle 11 of the head tool 3, and the ceramic heater 12 of the head tool 3.
The heating operation of is controlled by the controller 9.

FIG. 2 is a sectional view of the electronic component 1 and the circuit board 4 schematically showing the mounting method of the electronic component according to the first embodiment. As shown in FIG. 2B, the rectangular plate-shaped electronic component 1 has a large number of electrodes 1a on the bonding surface.
Solder bumps 1b as a bonding material are formed in advance on each of the electrodes 1a. Further, as shown in FIG. 2A, the rectangular plate-shaped circuit board 4 has pads 4a which are a large number of electrodes on the upper surface, and each pad 4
Solder, which is a bonding material, is pre-supplied on the surface a by printing or the like to form the solder portion 2. In addition, each electrode 1 of the electronic component 1
Each pad 4a of the circuit board 4 is arranged at a position corresponding to each electrode 1a of the electronic component 1 so that a and each pad 4a of the circuit board 4 can be joined. Here, the electronic component 1 is
For example, each solder bump 1b formed on each electrode 1a
It is a high-end electronic component such as a high-end IC chip having a bump pitch of 150 μm or less, which requires a high bonding position accuracy.

Next, a method of mounting the electronic component 1 on the circuit board 4 using the electronic component mounting apparatus 201 will be described.

First, in FIG. 1, a slide base 6 to which a parts tray 5 on which a plurality of electronic components 1 are supplied and arranged is fixed is moved to Y1 by a Y-direction moving mechanism 23.
Or it is moved in the Y2 direction and the X direction moving mechanism 2
2, the head tool 3 is moved in the X1 or X2 direction so that one electronic component 1 arranged in the parts tray 5 can be sucked by the suction nozzle 11 at the tip of the head tool 3. Tool 3 its electronic components 1
Align to. After that, the elevation tool 21 lowers the head tool 3, the adsorption nozzle 11 of the head tool 3 adsorbs and holds the rear surface of the electronic component 1 which is a surface without the electrodes 1a, and the elevation tool 21 raises the head tool 3. Then, the electronic component 1 is taken out from the parts tray 5.
Here, the case where the electronic component 1 is arranged on the parts tray 5 with the back surface facing up has been described. However, even when the electronic component 1 is arranged with the back surface facing down, the head of the electronic component 1 is arranged. By providing a reversing mechanism for reversing the electronic component 1 before the tool 3 is suction-held by the suction nozzle 11, the suction nozzle 11 can suction-hold the back surface of the electronic component 1. Instead of supplying each electronic component 1 from the parts tray 5, a wafer supply unit may be provided to supply each electronic component 1 from the wafer.

Next, in FIG. 1, the slide base 6 fixing the stage 7 to which the circuit board 4 is fixed.
Is moved in the Y1 or Y2 direction by the Y-direction moving mechanism 23, and the head tool 3 that holds the electronic component 1 by suction is moved in the X1 or X2 direction by the X-direction moving mechanism 22. As shown, each solder bump 1b formed on each electrode 1a of the electronic component 1 can be joined to each solder portion 2 on each pad 4a of the circuit board 4,
The electronic component 1 and the circuit board 4 are aligned.

After that, as shown in FIG. 2 (c), the head tool 3 is lowered by the elevating part 21, and the suction nozzle 11
Each solder bump 1b of the electronic component 1 sucked and held by the solder bump 1b
Are brought into contact with each solder portion 2 of the circuit board 4 fixed to the stage 7.

After this contact, as shown in FIG.
The ceramic heater 12 of the head tool 3 heats the suction nozzle 11, and the solder bumps 1b of the electronic component 1 suction-held by the suction nozzle 11 and the circuit board 4 abutting on each solder bump. Each solder part 2 is heated. Further, the heating temperature of the suction nozzle 11 by the ceramic heater 12 is raised to a temperature above the melting point of the solder forming each solder bump 1b and above the melting point of the solder forming each solder portion 2, The solder bump 1b and each solder portion 2 are melted.

After that, as shown in FIG. 2E, after the heating by the ceramic heater 12 is stopped, the molten solder is cooled by blowing from the cooling blow nozzle 19, so that the solder is solidified and the Each electrode 1 of component 1
a and each pad 4a of the circuit board 4 are joined with solder interposed. The cooling blow nozzle 1 for the molten solder
Instead of forced cooling by 9, the solder may be solidified by naturally cooling the melted solder.

After that, as shown in FIG. 2F, the suction holding of the tip of the head tool 3 by the suction nozzle 11 to the electronic component 1 is released, and the head tool 3 is raised by the elevating part 21. When a plurality of electronic components 1 are mounted on the circuit board 4, these operations are repeated for each electronic component 1 and each electronic component 1 is individually mounted on the circuit board 4.

In the above, when the bonding material is the solder bumps 1b formed in advance on the electrodes 1a of the electronic component 1 and the solder portions 2 formed on the pads 4a of the circuit board 4 in advance. However, the bonding material may be only the solder bumps 1b previously formed on the electrodes 1a of the electronic component 1.

Further, the oxide film on the surface of each bonding portion is removed on each electrode 1a of the electronic component 1, each pad 4a of the circuit board 4, or each solder bump 1b or each solder portion 2 which is a bonding material. However, a flux capable of improving the wettability of the molten solder may be applied in advance and supplied. Depending on the type of flux applied and supplied, the electronic component 1 may be mounted on the circuit board 4 and then the applied flux may be removed by cleaning.

Next, the structure of the head tool 3 in the electronic component mounting apparatus 201 will be described in detail with reference to FIG. 3 which is a sectional view schematically showing the structure of the head tool 3.

In FIG. 3, the head tool 3 supports the head tool tip portion 3a for adsorbing and holding the electronic component 1, performing heating, and the like, and the head tool tip portion 3a so that the head tool 3 is moved up and down. The head tool main body portion 3b is formed.

The head tool tip portion 3a has a suction nozzle 11 capable of sucking and holding the electronic component 1 from its tip side, a ceramic heater 12 for heating the electronic component 1 sucked and held by the suction nozzle 11, and this ceramic. Heater 12
Water jacket 13, which is a cooling unit that shuts off heat so that the generated heat is not transferred to the head tool body 3b,
And a shaft 17 which is an example of a shaft portion attached to the upper portion of the water jacket 13, and further,
A cooling blow nozzle 19 for cooling the electronic component 1 heated by the ceramic heater 12 by blowing is attached around the lower portion of the shaft 17.

The head tool main body 3b is composed of a frame 16 which is an example of a supporting portion which supports the head tool tip portion 3a, and a load cell 14 which is an example of a load detecting portion attached to the frame 16.

The frame 16 has a substantially U-shape formed of a rigid body, and has an upper frame 16a for supporting the load cell 14 and a shaft 17 of the head tool tip 3a.
Is supported by a self-weight offset spring 15 which is an example of an elastic body attached to the lower part of a spring receiving portion 18 having an annular projection shape provided on the side of the shaft 17 so as to wind the outer periphery of the shaft 17, Also, the lower frame 16b for guiding the vertical movement of the shaft 17, and the upper frame 16a and the lower frame 16
It is configured by a cylindrical intermediate frame 16c that supports b.

The shaft 17 has a step portion 17c near the middle in the axial direction, and the step portion 17c serves as a boundary.
The shaft lower part 17b of the shaft 17 has a smaller diameter than the shaft upper part 17a. Further, the lower shaft portion 17b penetrates a hole 16d formed in a lower frame 16b that supports the shaft 17 through a self-weight counterbalance spring 15, and the hole 16d of the lower frame 16b moves up and down the shaft 17. Is formed so that it can be guided and has a diameter smaller than the diameter of the shaft upper portion 17a of the shaft 17. As a result, the shaft 17 is supported by the lower frame 16b via the self-weight offset spring 15 and can be vertically moved by being guided by the hole 16d of the lower frame 16b, and the self-weight offset spring 15 is damaged due to damage or the like. Even when it becomes impossible to support the shaft 17, the periphery of the hole 16d of the lower frame 16b can support the shaft 17 by the step portion 17c of the shaft 17 so that the shaft 17 does not fall. .

Further, the shaft lower part 17b is provided with an outer ring and a shaft of a ball spline, the lower frame 16b is provided with a bearing inside the hole 16d, and the outer ring of the ball spline is attached to the inside of the bearing, whereby the shaft 17 is formed. While being supported by the lower frame 16b, it can rotate about an axis and can move up and down in the axial direction.

The intermediate frame 16c has both ends of its cylindrical shape fixed to the nut portion 21b of the elevating portion 21, and the ball screw shaft 21a screwed into the nut portion 21b of the elevating portion 21 is rotated by the motor 21m. As a result, the intermediate frame 16c is moved up and down, whereby the frame 16 is moved up and down, and the entire head tool 3 is moved up and down.

The centers of the suction nozzle 11, the ceramic heater 12, the water jacket 13, the shaft 17, and the load cell 14 are coaxially arranged, and these shafts are arranged in parallel with the vertical movement axis of the vertical movement unit 21. Therefore, the suction nozzle 11, the ceramic heater 12, the water jacket 13, the shaft 17, and the load cell 14 can be moved up and down on the same axis by the vertical movement of the vertical movement unit 21.

Further, on the lower surface which is the load detecting surface of the load cell 14, the upper end of the shaft 17 in the head tool tip portion 3a is attached to the lower frame 16b and the shaft 17 is supported via the spring receiving portion 18 by a self-weight canceling spring. The load 15 presses and contacts the head tool 15, and the load cell 14 can detect the load acting in the upward direction of the shaft 17 of the head tool tip 3a.

Further, the lower shaft portion 17 which is the periphery of the lower portion of the shaft 17
cooling blow nozzle 19 mounted around b
Is formed so as to wrap around both sides of the water jacket 13 and the ceramic heater 12 located below the shaft 17, and the tip of the cooling blow nozzle 19 is directed to the electronic component suction holding surface which is the lower surface of the suction nozzle 11. And the blow from the cooling blow nozzle 19 is the suction nozzle 1.
It is possible to cool the electronic component 1 sucked and held by the device 1.

Further, the control unit 9 controls the suction operation of the suction nozzle 11, the heating operation of the ceramic heater 12, and the lifting unit 2.
1 is controlled so that the load detected by the load cell 14 is output to the control unit 9.

Here, a control system diagram in the electronic component mounting apparatus 201 is shown in FIG. In the electronic component mounting apparatus 201, the control unit 9 controls the operation of each component of the electronic component mounting apparatus 201 to move up and down by the motor 21m of the lifting unit 21, the heating operation of the ceramic heater 12, the cooling operation of the cooling blow nozzle 19, The suction operation of the suction nozzle 11, the movement operation of the motor of the X-direction moving mechanism 22, and the movement operation of the motor of the Y-direction moving mechanism 23 are controlled, and the load detected by the load cell 14 is output to the control unit 9. It As a result, each of the above-described constituent parts, which are the controlled parts of the control part 9, are controlled by the control part 9 while being related to each other, so that the electronic part mounting apparatus 201 mounts the electronic part 1 on the circuit board 4. Is applied.

Next, a method of detecting the contact load generated when the electronic component 1 and the circuit board 4 are contacted by the load cell 14 in the head tool 3 will be described.

After the electronic component 1 and the circuit board 4 are aligned with each other, the head tool 3 is lowered by the elevating part 21 while the electronic component 1 is suction-held by the suction nozzle 11, and each solder bump 1b of the electronic component 1 is placed on the circuit board. 4 to contact each solder portion 2. At this time, a contact load is generated between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, and the contact load makes contact with the load detection surface of the load cell 14 of the head tool 3. The upper end of the shaft 17 of the head tool tip portion 3a at the position pushes up the load detection surface of the load cell 14, and the contact load is detected by the load cell 14.

By detecting the contact load in the load cell 14 in this manner, it is detected that the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are in contact with each other, and the load cell 14 detects the contact. The contact load thus generated is output to the control unit 9, and the elevating unit 21 is controlled by the control unit 9 so that the contact load preset by the control unit 9 is achieved. And the lift unit 21 is controlled so that the contact load detected by the load cell 14 becomes a preset contact load.

The electronic component mounting method according to the first embodiment constructed and implemented by the above mounting procedure (hereinafter, since each electronic component is individually melted or reflowed, this is The local reflow mounting method of the first embodiment) will be summarized in the flowchart shown in FIG. The operation instruction in each step is given by the controller 9.

At step SP1 in FIG. 4, the electronic component 1 is sucked and held by the head tool 3, and at step SP2, each solder bump 1b formed on each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 is held. The electronic component 1 and the circuit board 4 are aligned so that the solder portions 2 formed on the substrate 1 can be joined. After that, step SP3
In step SP4, the head tool 3 is lowered with the electronic component 1 held by suction, and in step SP4, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are brought into contact with each other.
It is detected by the load cell 14 of the head tool 3. Further, in step SP5, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted by heating the electronic component 1 by the ceramic heater 12 of the head tool 3. Then, in step SP6, cooling of the melted solder by blowing the cooling blow nozzle 19 is started, and in step SP7, the melted solder is solidified, and each electrode 1a of the electronic component 1 is connected to each pad 4b of the circuit board 4. Join with solder intervening. After that, step S
At P8, the suction holding of the electronic component 1 by the head tool 3 is released. When a plurality of electronic components 1 are mounted on the circuit board 4, the steps SP1 to SP8 are repeated for each electronic component 1 to mount each electronic component 1. The cooling of the melted solder in step SP6 may be performed by natural cooling instead of cooling by blowing the cooling blow nozzle 19.

Next, the correction operation when the expansion / contraction amount of the head tool 3 due to heat is corrected will be described.

After the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are brought into contact with each other, the suction nozzles 11 are heated by the ceramic heater 12 of the head tool 3, and the solder bumps 1b and the solder portions are soldered. 2 is melted, in the head tool 3, at least the head tool tip portion 3a
Is affected by heat from the ceramic heater 12 and extends in the vertical direction, and when the heating of the ceramic heater 12 is stopped, the effect of the heat disappears and the head tool tip portion 3a contracts in the vertical direction. By such expansion and contraction of the head tool tip portion 3a in the vertical direction, each electrode of the circuit board 4 is provided between the contact of each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 to the joining. It becomes difficult to keep the height of the back surface of the electronic component 1 with which the electrodes 1a are in contact with each other by interposing the solder portions 2 and the solder bumps 1b in the 4a, and bump collapse or the like may occur in some cases. Depending on the required joining accuracy, it may be difficult to stabilize the joining quality of electronic components.

For the purpose of surely controlling the height of the back surface of the electronic component 1 as described above, the head tool tip portion 3 is previously prepared.
The data of the change in the amount of expansion and the amount of contraction due to heat of a are set in the memory in the control unit 9, and the control unit 9 controls the ceramic heater 12, the elevating unit 21, and the cooling blow nozzle 19, and the ceramic heater 12 controls During heating, the head tool 3 is gradually raised by the elevating part 21 based on the data on the change in the amount of extension of the head tool tip 3a due to heating, and after the heating by the ceramic heater 12 is stopped, during cooling by the cooling blow nozzle 19. , The amount of expansion and contraction of the head tool tip 3a due to heat is corrected by gradually lowering the head tool 3 by the elevating part 21 based on the data of the change in the amount of contraction of the head tool tip 3a due to cooling. . Thereby, the height of the back surface of the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 between the contact and the joining of the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4. Can be kept constant. It should be noted that the correction of the amount of expansion or the amount of contraction of the head tool 3 due to heat is required for the bonding accuracy of the electronic component 1 to the circuit board 4 and each solder bump 1b formed on each electrode 1a of the electronic component 1. It may be a case where it is determined whether or not to carry out by the number of, and only the correction of the elongation amount or the correction of the contraction amount is performed.

The procedure of the operation of correcting the amount of expansion and the amount of contraction of the head tool 3 due to the heat configured as described above is summarized as shown in FIG. FIG. 5 is a flowchart showing a mounting procedure of the mounting method of the electronic component according to the above-mentioned embodiment in FIG. 4, and between steps SP4 to SP7, steps related to the correction operation of the extension amount and the contraction amount of the head tool 3 due to heat. 6 is a flowchart showing a procedure of a correction operation in which is added. The operation instruction and judgment in each step are performed by the control unit 9.

At step SP4 in FIG. 5, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are soldered.
After the contact with is detected, in step SP10,
The heating of the ceramic heater 12 starts the temperature rise of the adsorption nozzle 11. Next, in step SP11, it is determined whether or not the elongation amount correction of the head tool 3 due to heat is to be performed. When the elongation amount correction is performed, it is determined in step SP12 whether or not to wait for the elongation amount correction start of the head tool 3, and when the elongation amount correction start wait is performed, in step SP13, the head tool 3 of the head tool 3 is set for the set time. If the elongation amount correction start is put in the standby state and the elongation amount correction start waiting is not performed, step S
P13 is not performed, and then, in step SP14, while gradually increasing the head tool 3 based on the change data of the elongation amount of the head tool 3 due to heat, step SP5
At, the solder bumps 1 b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted by heating the ceramic heater 12. The standby operation for starting the expansion amount correction of the head tool 3 in step SP13 is replaced by the ceramic heater 12 instead of waiting for the set time as described above.
It may be a case where the temperature of the suction nozzle 11 heated by the temperature exceeds the set temperature.

On the other hand, in step SP11, when the elongation amount correction is not performed, steps SP12 to SP14
Without performing each step up to step SP5
Is carried out.

Then, in step SP6, cooling of the melted solder is started. Next, step SP15
At, it is determined whether to perform the shrinkage amount correction of the head tool 3 by cooling. When performing the shrinkage amount correction, it is determined in step SP16 whether or not to wait for the shrinkage amount correction start of the head tool 3. When performing the shrinkage amount correction start wait, in step SP17, the head tool 3 is set for the set time. If you want to start the shrinkage correction start in the standby state and do not wait for the shrinkage correction start,
Without performing step SP17, in step SP18, the solder melted by cooling is solidified in step SP7 while gradually lowering the head tool 3 based on the shrinkage amount change data of the head tool 3 due to cooling. The standby operation for starting the correction of the shrinkage amount of the head tool 3 in step SP17 is replaced by the ceramic heater 12 instead of waiting for the set time as described above.
There may be a case where the temperature of the suction nozzle 11 heated by is lowered to the set temperature.

On the other hand, in step SP15, when the shrinkage amount correction is not performed, steps SP16 to SP18.
Without performing each step up to step SP7
Is carried out.

Next, after detecting the contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, the head tool 3 is detected.
Constant control of contact load by each solder bump 1b
The case where the tip position control of the suction nozzle 11 is performed after the melting of each solder portion 2 will be described.

After detecting the contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, the contact load detected by the load cell 14 is moved up and down so as to be a preset contact load. The section 21 is controlled by the control section 9, and a constant load is applied to the electronic component 1 and the circuit board 4 by the head tool 3, so that the head tool 3 is in a constant load control state. However, with the ceramic heater 12, the suction nozzle 1
If the head tool 3 remains in the constant load control state when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted as described above, the suction nozzle 11 is heated. There is a problem in that the tip positions of the solder bumps are lowered, and the solder bumps 1b and the solder portions 2 in a molten state are excessively crushed.

In order to solve such a problem, it is necessary to surely manage the back surface height of the electronic component 1 after melting of each solder, that is, the management of the contact height position of the electronic component 1 to the circuit board 4. For that purpose, after the temperature of the adsorption nozzle 11 is started to rise by being heated by the ceramic heater 12, the above-described constant load control by the head tool 3 is performed, and the load cell 1
4, the load is detected, and when the decrease in the detected load is detected, it is determined that the melting of each solder has started, and the tip height position of the suction nozzle 11 is made constant from the above load constant control of the head tool 3. By switching to the position control, the front end height position of the suction nozzle 11 can be made constant even when each solder is melted, and the back surface height management of the electronic component 1 can be reliably performed.

The procedure of the constant load control of the head tool 3 and the tip height position control of the suction nozzle 11 configured as described above will be summarized as shown in FIG. FIG. 6 is a flowchart showing the mounting procedure of the mounting method of the electronic component according to the embodiment in FIG. 4, and during steps SP4 to SP6, constant load control of the head tool 3 and the tip height position of the suction nozzle 11 are performed. It is a flow chart which shows the procedure of control operation. The operation instruction and judgment in each step are performed by the control unit 9.

First, in step SP4 in FIG. 6, after the contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 is detected, the ceramic heater 12 is heated to adsorb it in step SP10. Nozzle 1
The temperature rise of 1 is started. Next, in step SP5a, the descent operation of the elevator unit 21 is finely controlled to perform constant load control of the head tool 3, and the head tool 3 controls the electronic component 1 and the circuit board 4.
A constant load is applied. During this constant load control, the load actually generated in the load cell 14 is detected. However, in step SP5b, when the decrease in the detected load is detected due to the decrease in the load detected in the load cell 14, Is determined to have started melting of each solder, and in step SP5c, the control system is switched from the constant load control of the head tool 3 to the constant control of the tip height position of the suction nozzle 11, and step SP5d. In the above, by restricting the raising / lowering operation of the raising / lowering portion 21, the back surface height of the electronic component 1 sucked and held by the suction nozzle 11 whose tip height position is kept constant becomes constant, and in step SP5e, the ceramic heater 12 Until the temperature rise of the adsorption nozzle 11 due to the stop of the heating of the adsorption nozzle 11 is completed. Constant control of the position is performed. When the temperature rise of the suction nozzle 11 is completed in step SP5e, cooling of each melted solder is started in step SP6.

Further, when the decrease in the load detected in the load cell 14 is not detected in step SP5b, it is determined that the melting of each solder is not yet started, and in step SP5f, the heating of the ceramic heater 12 is stopped. It is determined whether or not the temperature rise of the suction nozzle 11 is completed. If not, the process returns to step SP5a and the constant load control of the head tool 3 is continued. In step SP5f,
The suction nozzle 11 by stopping the heating of the ceramic heater 12
When the temperature rise of No. 2 is completed, the control system is switched from the above-mentioned constant load control of the head tool 3 to the constant control of the tip height position of the suction nozzle 11 in step SP5g, and the tip height position is controlled in step SP5h. The height of the back surface of the electronic component 1 sucked and held by the suction nozzle 11 is constant, and cooling of each melted solder is started in step SP6.

In step SP4, when the contact between each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 is detected, the formation height of each solder bump 1b and each solder portion 2 varies. Each solder bump 1b and each solder 2
In some cases, some of them may not come into contact with each other. For example, this is a case where the electronic component 1 has a large number of bumps of 1000 or more. In such a case, if the electronic component 1 is heated as it is, the solder portions 2 that are not in contact with each other do not conduct heat from the solder bumps 1b, and thus there is a problem that they are not melted.

For such a problem, step SP5
At the time of constant load control of the head tool 3 in a, the constant load is set to a load equal to or more than the contact load at the time of contact detection, and the load is constantly controlled to be applied to the electronic component 1 and the circuit board 4. As described above, when the contact between each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 is detected, each solder bump 1b and each solder portion 2 may have different heights due to variations in the formation height. Even if some of the solder bumps 1b and the solders 2 are not in contact with each other, by applying the constant load, the solder bumps 1b and the solder portions 2 are brought into contact with each other. Therefore, it is possible to enhance the property and surely melt all the solder.

Next, a case where the load zero point of the load cell 14 of the head tool 3 is set will be described.

The heat generated by the heating of the ceramic heater 12 of the head tool 3 is transferred from each component of the head tool 3 and the heat of the surrounding air of the head tool 3, so that the spring of the shaft 17 at the head tool tip 3a. The self-weight offset spring 15 attached to the receiving portion 18 is affected by heat and its spring characteristics change. This allows
The self-weight canceling spring 15 whose spring characteristic has changed is the shaft 1
The pressing load in the load cell 14 generated by pressing 7 on the load detection surface of the load cell 14 changes.
In addition, the spring characteristics of the self-weight canceling spring 15 may change over time depending on the usage period of the head tool 3,
The pressing load of the self-weight canceling spring 15 in the load cell 14 changes. This weight offset spring 15
Due to the change in the pressing load on the load cell 14 due to the change in the spring characteristic, the actual contact load at the time of contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 and the load cell 14 detected. There is a problem that a difference occurs between the contact load detection values, and the actual contact load cannot be controlled according to a preset contact load.

In such a case, after aligning the electronic component 1 sucked and held by the head tool 3 to the circuit board 4 so that the electronic component 1 can be joined to the circuit board 4, the head tool 3 is placed in the non-contact state. Shaft 17 at tip 3a
Is pressed against the load detection surface of the load cell 14 by the self-weight offset spring 15, and the load cell 14 detects the pressing load. The detected pressing load is output to the control unit 9, and the control unit 9 outputs this pressing load. Set the load zero point at 14. After that, head tool 3
Is lowered to mount the electronic component 1 on the circuit board 4, and all the operations are controlled by the controller 9.

As a result, the self-weight offset spring 15 changes its spring characteristics due to the influence of heat or aging, so that the head tool tip portion 3 of the load cell 14 is changed.
Even when the pressing load by the shaft 17 at a changes, the pressing load detected by the control unit 9 is set as the load zero point in the load cell 14 every time the electronic component 1 and the circuit board 4 are aligned. By doing so, each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4
There is no difference between the actual contact load at the time of contact and the contact load detection value detected by the load cell 14,
The actual contact load can be controlled according to the preset contact load.

Next, the contact load when each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 is contacted by the head tool 3 is detected by the load cell 14 of the head tool 3, and the head tool 3 is detected. A method of controlling the ascending / descending operation of No. 3 to control the contact load set in advance will be described based on an embodiment with reference to the contact load control operation flowcharts shown in FIGS. 7 and 8. The operation instruction and judgment in each step are performed by the control unit 9.

After the alignment of the electronic component 1 and the circuit board 4 is performed, the head tool 3 holding the electronic component 1 by suction starts the lowering operation by the elevating unit 21 in step SP3. While the head tool 3 is descending, step SP
In 21, it is determined whether or not the preset contact load exceeds 450 g. If it exceeds 450 g, in step SP22 the initial detected load due to contact is 2
If it is set to 00 g and is 450 g or less, the initial detected load due to contact is 100 in step SP23.
set to g. Next, in step SP24, each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4
And the set initial detection load is detected by the load cell 14, the head tool 3 that was descending is stopped in step SP25, and the head tool 3 is placed in an operation standby state for 200 ms. 3 after the stop operation of 3, the control unit 9 instructs the head tool 3 to stop the descending operation,
The head tool 3 is brought into a static state in order to eliminate the influence on the detected load of the load cell 14 due to a minute amount of descending until the head tool 3 is decelerated at the descending speed and stopped.

Next, in step SP26, it is judged whether or not the present load detected by the load cell 14 exceeds a preset contact load of -100 g, and the present load is judged to be the preset contact load. It is judged whether or not it is approaching.

At step SP26, the current load is
If the preset contact load is greater than −100 g, the head tool 3 is allowed to stand still for 200 ms in step SP27, and then step SP2.
8, the present load is a preset contact load −5.
It is determined whether the load is 0 g or more, and if the present load is less than the preset contact load −50 g, step 2
9, the head tool 3 is moved up and down by the elevating part 21 to 1 μm.
After lowering, in step SP27, 200 ms
After passing through the static state of the head tool 3 for a while, it is again determined in step SP28 whether or not the present load is equal to or more than the preset contact load −50 g, and the present load is set to the preset contact load. This operation loop is repeatedly performed until it becomes -50 g or more.

At step SP28, the current load is
If the preset contact load is −50 g or more, in step SP30, the static state of the head tool 3 is held for a preset time, and each solder bump 1b of the electronic component 1 and the circuit board 4 are held. The control of the contact load between the solder portions 2 of the above is completed to the preset contact load, and in step SP4, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are contacted with each other. The contact has been detected. Here, it is predicted that the preset contact load of −50 g, which is the determination criterion in step SP28, will occur when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are in contact with each other. When the current load, which is the contact load that is generated and that is actually generated during the contact, is equal to or greater than the contact load that is predicted to occur during the contact, almost all of the electronic component 1 is Solder bump 1b
Then, almost all the solder portions 2 of the circuit board 4 are brought into contact with each other, and the contact is detected.

If the present load is equal to or less than the preset abutting load-100 g in step SP26, the present load is further reduced to the preset abutting load-500 g in step SP31. If it is exceeded, if it is not exceeded, then
In step SP32, it is determined stepwise whether or not the current load exceeds the preset contact load −1000 g. If the current load is equal to or less than the preset contact load-1000 g in step SP32, the load difference between the current load and the preset contact load is moved to the head tool 3 in step SP33. Converted to distance. The current load is step SP.
If the condition in 31 is satisfied, step SP
In 34, when the moving distance of the head tool 3 is 1 μm and the current load satisfies the condition in step SP32, the moving distance of the head tool 3 is set to 2 μm in step SP35. After that, in step SP36, the head tool 3 is lowered by the elevating unit 21 by the moving distance of the head tool 3 in each of the above cases, and in step SP37,
The head tool 3 is stopped and the static state is maintained for 50 ms. After that, in step SP26 again, it is determined whether or not the current load exceeds the preset contact load −100 g, and these operation loops are repeatedly performed until the condition of step SP26 is satisfied.

In the contact load control method carried out by each of the above-mentioned operations, the head tool 3 is slightly controlled to descend, but the moving distance of the head tool 3 under each operation condition is as follows. It is set by the relationship between the minimum movable distance of the head tool 3 in the vertical direction by the elevating part 21 and the load per unit movement of the head tool that can be generated by this minimum movable distance. In the case of the above embodiment, the minimum movable distance is 1 μm, and the load per unit movement of the head tool is 100 g / μm. Therefore, for example, 100 g, which is the difference between the preset contact load and the current load, which is the condition in step SP26, is
It is set by the load per head tool unit movement. Further, also in step SP29, step SP34, and step SP35, the moving distances of the head tool 3 of 1 μm and 2 μm are respectively set from the minimum movable distance.

The numerical values such as the load, the time, and the distance described above are numerical values as an example in the present embodiment, and the present embodiment is not limited to these numerical values.

Next, a case where the head tool 3 shapes each solder bump 1b of the electronic component 1 will be described.

After the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are brought into contact with each other, the suction nozzle 11 is heated by the ceramic heater 12 of the head tool 3, and the solder bumps 1b and the solder portions are soldered. When 2 is melted, the head tool 3 that holds the electronic component 1 by suction is vibrated slightly in the vertical direction or the lateral direction, so that the melted solder bumps 1b and solder portions 2 It is possible to improve the wettability of the mutual solder and to improve the joint quality between the electronic component 1 and the circuit board 4. This head tool 3
As shown in FIG. 9, the vibrating operation pattern of the shaping operation according to (3) includes patterns such as a cross shape, an O shape, and an 8-shaped shape that are used in the conventional mounting method of electronic components. Further, as parameters of each vibration operation in the shaping operation by the head tool 3, the head tool 3 in the shaping operation is used.
The number of shaping operations for moving up and down is 0 to 20 as an example.
The operation speed when the head tool 3 is moved up and down by the turning operation and the shaping operation is 0.1 to 9.9 sec as an example, and the operation amount that is the movement amount that moves the head tool 3 up and down by the shaping operation is −99 to 99 μm as an example. X head tool 3 in motion
The number of shaping vibration operations for vibrating in the Y direction is 0 as an example.
200 times are used.

Next, in the case where the operations of the head tool 3 described above are combined to mount electronic components on a circuit board, the control height of the head tool 3 shown in FIG. The suction nozzle 11 of the head tool 3 is shown in (b).
10C, and FIG. 10C is a time chart showing changes in the temperature of the suction nozzle 11 of the head tool 3 over time. Here, the control height of the head tool 3 is a relative elevation control height position of the head tool 3 by the elevation unit 21, and the tip height of the suction nozzle 11 of the head tool 3 is the relative height of the suction nozzle 11. It shows the height position of the tip. In addition, the time axis which is each horizontal axis in FIGS. 10A to 10C is the same time axis so that the above change states can be compared.

First, from the time starting point t0 to t1 in FIGS. 10A to 10C, the control height of the head tool 3 and the tip height of the suction nozzle 11 are lowered by the lowering of the head tool 3 by the elevating part 21. , It falls in the same change state. At this time, since the heating by the ceramic heater 12 has not been started yet, the temperature of the adsorption nozzle 11 is kept constant.

Next, from time t1 to t2, time t
At 1, the electronic component 1 and the circuit board 4 come into contact with each other, and the ceramic heater 12 starts heating the suction nozzle 11 to raise the temperature of the suction nozzle 11. Since the expansion amount correction operation of the head tool 3 is performed by this temperature rise, the control height of the head tool 3 is increased as set in advance, and the head tool 3 subjected to the expansion amount correction operation has the suction nozzle 11 The height of the tip becomes constant. This time t1
The melting of the solder is started in the section from t to t2.

Next, from time t2 to t4, the temperature of the suction nozzle 11 is controlled by the heating of the ceramic heater 12 and maintained at a constant temperature. Further, both the control height of the head tool 3 and the tip height of the suction nozzle 11 are kept constant. However, since the solder bumps 1b of the electronic component 1 are shaped by the head tool 3 from the time t2 to the time t3, the head tool 3 performs a minute vibration operation, and the control height of the head tool 3 and the head tool 3 The tip heights of the suction nozzles 3 of 3 both slightly rise and fall.

Next, from time t4 to t5, the cooling of the molten solder is started and the temperature of the suction nozzle 11 is lowered. Since the operation of correcting the shrinkage amount of the head tool 3 is performed by this cooling, the control height of the head tool 3 is lowered as set in advance, and the head tool 3 that has been subjected to the operation of correcting the shrinkage amount of the suction nozzle 11 is moved. The height of the tip is constant.
The molten solder is solidified in the section from time t4 to time t5.

Finally, at time t5, the suction holding of the suction nozzle 11 of the head tool 3 to the electronic component 1 is released, and then the head tool 3 is lifted by the elevating part 21, so that the control height of the head tool 3 is increased. And the height of the tip of the suction nozzle 11 rises in the same changed state.

Next, a description will be given of a case where the leveling operation for aligning the heights of the solder bumps 1b of the electronic component 1 is performed before the electronic component 1 is brought into contact with the circuit board 4.

When the height of each solder bump 1b joined to each electrode 1a of the electronic component 1 varies, when each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 are brought into contact with each other, The contact load control is affected by the variation in the height of each solder bump 1b, and the head tool 3 cannot adsorb and hold it at the predetermined back surface height of the electronic component 1. However, if the electronic components 1 are melted and the electronic components 1 are joined to the circuit board 4, there is a problem in that the height of the back surface of each electronic component 1 on each circuit substrate 4 cannot be constant.

In order to cope with such a problem, before mounting work of the electronic component 1 on the circuit board 4 by the head tool 3, a leveling operation for adjusting the heights of the solder bumps 1b of the electronic component 1 is performed. After that, the mounting work of the electronic component 1 on the circuit board 4 is performed.

In the electronic component mounting apparatus 201 shown in FIG. 1, the leveling stage 8 is fixed to the slide base 6 which can be moved in the Y1 or Y2 direction shown by the Y-direction moving mechanism 23. Electronic component 1 to head tool 3
Of the slide base 6 to which the leveling stage 8 is fixed before the solder bumps 1b of the electronic component 1 are aligned with the solder portions 2 of the circuit board 4 so that they can be bonded to each other after being sucked and held by the suction nozzle 11. The Y-direction moving mechanism 23
By moving the head tool 3 in the X1 or X2 direction by the X-direction moving mechanism 22 while moving the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 on the upper surface of the leveling stage 8. Align to. After that, the head tool 3 is lowered by the elevating unit 21, and the suction nozzle 11 of the head tool 3 is moved.
The solder bumps 1b of the electronic component 1 that are adsorbed and held on the upper surface of the leveling stage 8 are brought into contact with each other. The upper surface of the leveling stage 8 is composed of a glass plate having a smooth flat surface. At this time, the contact load generated by this contact is applied to the load cell 14 of the head tool 3.
And the contact load detected,
The elevating part 21 is controlled, the elevating part 21 slightly lowers the head tool 3, and the contact load is controlled so that the contact load becomes a preset contact load. The solder bumps 1b of the electronic component 1 are pressed against the upper surface of the leveling stage 8 by the controlled contact load, whereby the solder bumps 1
The height of b is constant. After that, the head tool 3 is raised by the elevating unit 21, and each solder bump 1 of the electronic component 1 suction-held by the suction nozzle 11 of the head tool 3 is held.
The electronic component 1 and the circuit board 4 are aligned so that the solder joint b can be joined to each solder portion 2 of the circuit board 4, and the mounting operation of the electronic component 1 on the circuit board 4 is performed.

According to the first embodiment, the following various effects can be obtained.

First, according to the first embodiment, after the solder bumps 1b of the electronic component 1 are brought into contact with the solder portions 2 of the circuit board 4, the solder bumps 1b are kept in contact with each other. The bumps 1b and the solder parts 2 are melted by heating and then solidified by cooling to bond the electrodes 1a of the electronic component 1 and the pads 4a of the circuit board 4 with solder interposed. In other words, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are contacted and joined at the same place, and the circuit board is mounted on the circuit board as in the conventional batch reflow mounting method. Temporary bonding of electronic components, which is the process that is performed between the temporary bonding of electronic components, the melting of each solder bump and each solder part, and the main bonding of electronic components to the circuit board It is possible to dispense with the step of carrying the circuit board to the solder reflow working unit in this state. Therefore, it is possible to eliminate the occurrence of the displacement of the joining position of the electronic component to the circuit board, which has occurred during the transportation, and it is possible to improve the joining quality of the electronic component to the circuit board.

After the solder bumps 1b of the electronic component 1 suction-held by the suction nozzles 11 of the head tool 3 and the solder portions 2 of the circuit board 4 are brought into contact with each other, the solder bumps 1
b and each solder part 2 are melted by heating, and the timing of releasing the suction holding to the electronic component 1 by the suction nozzle 11 of the head tool 3 is released during the melting of the solder as in the conventional local reflow mounting method. Instead, the solder is melted and then cooled and solidified to release the solder. That is, unlike the conventional local reflow mounting method, the electronic component is not mounted by obtaining the self-alignment effect due to the surface tension of the molten solder, but the circuit board of the electronic component 1 is placed at the contact position positioned by the head tool 3. Implement to 4.
Thus, when the suction holding of the electronic component 1 by the suction nozzle 11 of the head tool 3 is released, the suction nozzle 1
The electronic device 1
It is possible to eliminate the displacement of the joining position. Therefore, rather than obtaining a self-alignment effect, an electronic component such as a high-end IC chip whose bump pitch is narrowed to 150 μm or less, for example, in which the displacement of the bonding position of the electronic component due to vacuum break blow in the suction nozzle becomes a problem. Can be mounted on the circuit board.

Further, in the head tool 3, the upper end of the shaft 17 at the head tool tip portion 3a is attached to the lower frame 16b and the spring receiving portion 18 of the shaft 17 on the lower surface which is the load detection surface of the load cell 14, and the shaft 17 is attached. By being pressed and in contact with the self-weight canceling spring 15 supporting the head, it is possible to detect the load acting in the upward direction of the head tool tip portion 3a in the load cell 14.

As a result, when the solder bumps 1b of the electronic component 1 sucked and held by the head tool 3 and the solder portions 2 of the circuit board 4 come into contact with each other, the contact load generated between the two causes the head tool to move. Since the upper end of the shaft 17 of the tip portion 3a pushes up the load detection surface of the load cell 14, the contact load can be reliably detected by the load cell 14.

Therefore, by detecting the contact load, the controller 9 can detect that the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are in contact with each other, and are detected. The abutting load controls the elevating unit 21, and the elevating unit 21 slightly lowers the head tool 3 to more accurately control the actual abutting load so that the preset abutting load is achieved. it can. Therefore, when repeatedly mounting a plurality of electronic components on the circuit board, each electronic component can be always brought into contact with the circuit board under a preset contact load, and the electronic components are bonded to the circuit board. It is possible to stabilize the quality.

In addition, when the expansion amount and the contraction amount of the head tool 3 are both corrected, only the expansion amount or the contraction amount is corrected, the expansion amount and the contraction amount are further corrected. An effect based on the embodiment in the case where both are not implemented will be described.

After the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are brought into contact with each other, the head tool tip portion 3 is formed.
a is affected by heat from the ceramic heater 12 and is extended in the vertical direction, so that the electronic component 1 and the circuit board 4
The abutment load generated between the two is affected. The influence load on the contact load due to the extension of the head tool tip portion 3a is about 3 kg. Based on this influential load, the effects of the above-described various combinations of the correction of the expansion and contraction amounts of the head tool tip portion 3a will be described below.

First, the electronic component 1 is an IC chip having each electrode 1a of 1000 bumps or more, and the head tool 3
When the elongation and shrinkage of the
For example, if the electronic component 1 is an IC chip having 2000 bump electrodes 1a, the influence load of about 3 kg due to the extension of the head tool tip portion 3a is about 1.5 g per bump. After the contact between the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4, the extension amount of the head tool tip 3a is used to determine the influence load due to the extension of the head tool tip 3a as the contact load. As a result, about 1.
An appropriate contact load of 5 g can be generated, and it becomes possible to reduce variations in melting height of each solder bump 1b and each solder portion 2.

Next, the electronic component 1 is an IC chip in which the gap width between adjacent solder bumps 1b formed on each electrode 1a is as narrow as 50 μm or less, and the head tool tip 3
When only the expansion amount correction of a is performed and the contraction amount correction is not performed, the expansion amount of the head tool tip portion 3a is corrected, and the head tool tip portions 3a come into contact with each other in a state of being pressed with an appropriate contact load set in advance. After the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted, the melted solder is solidified while the head tool 3 is contracted by cooling. That is, the melted solder is expanded and solidified by the amount of contraction of the head tool tip portion 3a due to cooling. For this reason, the solder bumps 1b and the solder portions 2 after being melted and solidified can have a drum shape, and thus it is possible to prevent contact between adjacent solder bumps.

Next, in a case where the electronic component 1 is an IC chip having each electrode 1a of 1000 bumps or more and the expansion amount of the head tool tip portion 3a is not corrected and only the contraction amount is corrected, for example, the electronic component is If 1 is an IC chip having 2000 bump electrodes 1a, the influence load of about 3 kg due to the extension of the head tool tip portion 3a is about 1.5 g per bump, and each solder bump 1b of the electronic component 1 and the circuit board 4 are After the contact of each solder portion 2, by utilizing the extension amount of the head tool tip portion 3a, the influence load due to the extension of the head tool tip portion 3a is set as the contact load, so that about 1.5 g per bump is appropriate. It is possible to generate an abutting load. The IC chip is pushed by a predetermined amount by the contact load, and the contraction amount of the head tool 3 is corrected to solidify the solder of the IC chip with the tip position of the suction nozzle 11 of the head tool 3 kept constant. Therefore, it is possible to improve the management accuracy of the height of the back surface of the final IC chip after solder cooling.

Furthermore, when the electronic component 1 is an IC chip having each electrode 1a of less than 1000 bumps and both the expansion amount and the contraction amount of the head tool tip portion 3a are corrected, for example, the electronic component 1 has 100 bumps. Electrode 1a
If the IC chip has
The impact load of about 3 kg is about 30 per bump
g, and if the elongation amount is not corrected, an excessive load is applied to each solder bump 1b to cause bump crushing. Therefore, the elongation amount and contraction amount of the head tool tip portion 3a are corrected,
Enables bonding without bump collapse.

Therefore, according to the number of the solder bumps 1b formed on the electrodes 1a of the electronic component 1 to be mounted and the joining accuracy required for the electronic component 1, the head tool tip portion is removed from each of the above cases. 3a is required depending on whether the expansion amount and the contraction amount are corrected together, only the expansion amount or the contraction amount is corrected, or the expansion amount and the contraction amount are not corrected. It is possible to obtain the joining quality of the electronic component.

Also, by performing a standby operation for starting the operation of expansion amount correction from the start of the temperature rise of the suction nozzle 11 in step SP10 to the operation start of the expansion amount correction of the head tool 3 in step SP14, for example, Even when the elongation amount of the head tool 3 is affected by non-uniform heat transfer or thermal disturbance at the beginning of heating to the suction nozzle 11, the standby operation causes the heating at the beginning of heating to start. It is possible to eliminate the above influence and then perform the operation of correcting the elongation amount of the head tool 3. It should be noted that the same effect as described above can be obtained for the correction of the shrinkage amount of the head tool 3.

The numerical values of the respective loads described above are numerical values as an example in the present embodiment, and the present embodiment is not limited to these numerical values.

Further, after the temperature of the suction nozzle 11 is started to rise by being heated by the ceramic heater 12, the load cell 1 is brought into a state of constant load control by the head tool 3.
4, the load is detected, and when the decrease in the detected load is detected, it is determined that the melting of each solder has started, and the tip height position of the suction nozzle 11 is made constant from the above load constant control of the head tool 3. By switching to the position control, the tip height position of the suction nozzle 11 can be made constant even when each solder is melted. As a result, when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted, the tip position of the suction nozzle 11 is lowered, so that the solder bumps 1b and the solder portions 2 in a melted state. Can be prevented from being crushed, and the back surface height of the electronic component can be surely managed even during the melting of each solder.

Furthermore, in the above-described constant load control of the head tool 3, this constant load is set as a load equal to or more than the contact load at the time of contact detection, and this load is constantly controlled to control the electronic component 1 and the circuit board. When the contact between each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 is detected by applying the same to each of the electronic components 1, each of the solder bumps 1b and each solder portion 2 has a variation in the formation height. Even if some of the solder bumps 1b and the solders 2 are not in contact with each other, by applying the constant load, the solder bumps 1b and the solder portions 2 are brought into contact with each other. It is possible to improve the property, it is possible to reliably melt all solder,
It is possible to increase the reliability of the bonding between the electronic component and the circuit board.

After the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 is positioned so that it can be joined to the circuit board 4, the shaft 17 of the head tool tip 3a is loaded by the self-weight offset spring 15 into the load cell. 14
The load applied to the load detection surface of the load cell 1
4, and the detected pressing load is detected by the controller 9
By setting this pressing load as the load zero point in the load cell 14 in the control unit 9, the self-weight canceling spring 15 is affected by heat or the like and its spring characteristics change, and the head tool tip 3 of the load cell 14 is changed.
Even when the pressing load due to a changes, the actual contact load at the time of contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 and the contact detected by the load cell 14 There is no difference between the load detection values, and the actual contact load can be controlled according to the preset contact load. Therefore, when repeatedly mounting a plurality of electronic components on the circuit board, each electronic component can be always brought into contact with the circuit board under a preset contact load, and the electronic components are bonded to the circuit board. It is possible to stabilize the quality.

Further, after the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are brought into contact with each other, the head tool 3 causes the electronic component 1 to move to each of the electronic components 1 while the solder bumps 1b and the solder portions 2 are melted. By performing the shaping operation of the solder bumps 1b, the wettability between the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 in the molten state can be improved.
Therefore, the adhesiveness of the solder to each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 can be improved, and the reliability of the bonding between the electronic component and the circuit board can be improved. Becomes

Further, before the electronic component 1 is brought into contact with the circuit board 4, a leveling operation for aligning the heights of the solder bumps 1b of the electronic component 1 is performed, whereby the formation height of the solder bumps 1b of the electronic component 1 is increased. Even if there is variation in the height, this variation can be eliminated and the height of each solder bump 1b can be made uniform. As a result, when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 come into contact with each other,
The influence on the contact load control due to the variation in the formation height of each solder bump 1b can be eliminated, the controllability of the contact load can be improved, and the contact load on each solder bump 1b can be made more uniform. You can call. Therefore, each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 can be reliably joined with a more uniform contact load by interposing solder, and the joining quality of the electronic component and the circuit board is stabilized. It becomes possible.

In the case where the back surface height accuracy of the electronic component 1 after the electronic component 1 is bonded to the circuit board 4 is required, the leveling operation is performed and the formation height of each solder bump 1b of the electronic component 1 is increased. By making the thickness uniform, it becomes possible to stabilize the back surface height of the electronic component 1 after being mounted on the circuit board 4. The leveling operation is performed, for example, in the electronic component 1 having each solder bump 1b of 1000 bumps or more.
It is effective to further stabilize the joining quality by applying the above.

The present invention is not limited to the above embodiment, but can be implemented in various other modes. For example, the electronic component mounting method according to the second embodiment of the present invention is an electronic component mounting method in which a plurality of types of electronic components are mixedly mounted on a circuit board by different methods.

In the conventional collective reflow mounting method, the first electronic component, which is one type of electronic components among the plurality of types of electronic components, uses the circuit board to which the electronic components are temporarily joined as the solder reflow working section. Even if the displacement of the bonding position of the electronic component with respect to the circuit board occurs during transportation, since the solder bumps formed on the electrodes of the electronic component have large bump pitches, this displacement of the bonding position The general-purpose electronic component is a general-purpose electronic component that is unlikely to cause poor bonding of the electronic component to the circuit board. For example, the general-purpose electronic component 31 has a bump pitch formed on each electrode of the general-purpose electronic component that is greater than 150 μm. Further, the second electronic component, which is another type of electronic component, is required to have high bonding position accuracy in the conventional collective reflow mounting method so that the displacement of the bonding position causes defective bonding of the electronic component to the circuit board. Is a high-end electronic component, for example, ± 5μ
A high-end electronic component 41 such as a high-end IC chip having a bump pitch of 150 μm or less that requires a bonding position accuracy of m or less. For each of these electronic components, a plurality of general-purpose electronic components 31 are mounted on the circuit board by the conventional collective reflow mounting method, and then the high-end electronic component 41 is mounted by the local reflow mounting method of the first embodiment. Mount on the circuit board.

The electronic component mounting method according to the second embodiment of the present invention will be described in detail below with reference to FIGS. 12 and 13.

As shown in FIG. 12A, the rectangular plate-shaped circuit board 34 has a pad 3 which is a plurality of electrodes on the upper surface.
4a and 34b, each pad 34a can be bonded to each general-purpose electronic component 31, and each pad 34b can be bonded to the high-end electronic component 41. Each pad 34a of the circuit board 34 that can be bonded to each general-purpose electronic component 31
Flux is supplied to the upper side from the supply nozzle 35 to form the flux portion 32 on each pad 34a.

Next, in FIG. 12B, solder bumps 31b, which are bonding materials, are formed on a plurality of electrodes 31a of the rectangular plate-shaped general-purpose electronic component 31, and each electrode of the general-purpose electronic component 31 is provided. The back surface, which is not the surface, is sucked and held by a tool 33, which is an example of a component holding member, and the solder bumps 31b of the general-purpose electronic component 31 are bonded to the flux portions 32 formed on the pads 34a of the circuit board 34. The general-purpose electronic component 31 is aligned with the circuit board 34 as possible. After that, the tool 33 that holds the general-purpose electronic component 31 by suction is lowered, and each solder bump 31b of the general-purpose electronic component 31 is pressed against each pad 34a of the circuit board 34 via each flux portion 32 to temporarily bond them. The above-described work is repeated for each general-purpose electronic component 31, and each general-purpose electronic component 31 is temporarily bonded to the circuit board 34.

Next, the circuit board 34 to which the general-purpose electronic components 31 are temporarily joined is conveyed to the solder reflow working unit, and the circuit board 34 shown in FIG.
As shown in (c), each general-purpose electronic component 31 and the circuit board 34 are heated by the heat source in the solder reflow working unit,
Each solder bump 31b of each general-purpose electronic component 31 is melted.

Thereafter, as shown in FIG. 12D, the heated general-purpose electronic components 31 and the circuit board 34 are cooled and melted, and the solder bumps 31 of the general-purpose electronic components 31 are cooled.
b is solidified, each electrode 31a of each general-purpose electronic component 31 is permanently bonded to each pad 34a of the circuit board 34 with each solder bump 31b interposed, and each general-purpose electronic component 31 is collectively mounted on the circuit board 34. It

Next, as shown in FIG. 13E, the flux is supplied from the supply nozzle 45 onto the pads 34b that can be bonded to the high-end electronic components 41 on the circuit board 34 on which the general-purpose electronic components 31 are mounted. And flux part 4
2 is formed on each pad 34b.

Next, in FIG. 13 (f), solder bumps 41b are formed on a plurality of electrodes 41a of the square-plate-shaped high-end electronic component 41, and the surface without the electrodes 41a of the high-end electronic component 41. Is held by suction by the suction nozzle 11 of the head tool 3, and each solder bump 41b of the high-end electronic component 41 is attached to the circuit board 3
4 so that the high-end electronic components 41 can be bonded to the pads 34b of FIG. 4 via the flux portions 42.
Align to 4.

After that, as shown in FIG. 13G, the head tool 3 holding the high-end electronic component 41 by suction.
While lowering the suction nozzle 11, the solder bumps 41b of the high-end electronic component 41 are brought into contact with the pads 34b of the circuit board 34 via the flux portions 42. After this contact, the ceramic heater 12 of the head tool 3 heats and melts each solder bump 41b of the high-end electronic component 41 contacting each flux portion 42 of the circuit board 34. Then, after the heating by the ceramic heater 12 is stopped, the cooling blow nozzle 19 is applied to the molten solder.
The molten solder bumps 41b are solidified by cooling by blowing from the high-end electronic component 4
Each electrode 41a of 1 and each pad 34b of the circuit board 34,
It is bonded to each solder bump 41b. Instead of forcibly cooling the molten solder by the cooling blow nozzle 19, the molten solder may be naturally cooled to solidify the solder.

After that, as shown in FIG. 13H, the suction holding of the high-end electronic component 41 by the suction nozzle 11 of the head tool 3 is released, and the head tool 3 is raised.

By the mounting method of electronic parts as described above,
The general-purpose electronic components 31 and the high-end electronic components 41 are mounted on the circuit board 34 in a mixed manner.

In the above description, the bonding material is each solder bump 31b previously formed on each electrode 31a of the general-purpose electronic component 31 and each solder bump 41b previously formed on each electrode 41a of the high-end electronic component 41. Although the case has been described, the bonding material is each electrode 31a of the general-purpose electronic component 31.
The solder bumps formed in advance and the solder bumps formed in advance on the electrodes 41a of the high-end electronic component 41 and the solder portions formed in advance on the pads 34a and 34b of the circuit board 34 may be used.

Further, the flux supply place is on the electrodes 31a of the general-purpose electronic component 31, on the electrodes 41a of the high-end electronic component 41, and on the pads 34a and 3 of the circuit board 34.
4b, or each solder bump or each solder portion as a bonding material may be used, or no flux may be supplied. Depending on the type of the applied and supplied flux, the general-purpose electronic component 31 and the high-end electronic component 41 may be mounted on the circuit board 34 and then the applied and supplied flux may be removed by cleaning.

According to the second embodiment described above, the bump pitch of the bumps formed on each electrode of the electronic component is 150 μm.
In a case where a larger general-purpose electronic component 31 and a high-end electronic component 41 such as a high-end IC chip having a bump pitch of 150 μm or less are mixed and mounted on the circuit board 34, high joint position accuracy is not required. After mounting each general-purpose electronic component 31 on the circuit board 34 by the conventional collective reflow mounting method, the high-end electronic component 41 that requires high bonding position accuracy is mounted by the local reflow mounting method of the first embodiment. 31
Are mounted on the circuit board 34 on which is mounted.

In the method of mounting each general-purpose electronic component 31 on the circuit board 34, each general-purpose electronic component 31 with respect to the circuit board 34 is conveyed when the circuit board 34 to which each general-purpose electronic component 31 is temporarily joined is transported to the solder reflow working unit. Even if the displacement of the joint position occurs, the electrodes 31 of the general-purpose electronic component 31
Each solder bump 31b formed on a has a bump pitch of 1
Since it is formed to have a size larger than 50 μm, this misalignment of the bonding position is unlikely to cause a defective bonding of the general-purpose electronic component 31 to the circuit board 34, and the circuit board 34 of the general-purpose electronic component 31 is not formed.
The mounting method is required to suppress the mounting cost, not to improve the accuracy of the bonding position.

Therefore, after each general-purpose electronic component 31 is temporarily joined on the circuit board 34 individually, the solder is melted in a lump so that each general-purpose electronic component 31 is main-joined and mounted on the circuit board 34. Since the mounting work can be performed efficiently, the mounting cost of each general-purpose electronic component 31 on the circuit board 34 can be suppressed.

On the other hand, the high-end electronic component 41 includes the solder bumps 41b of the high-end electronic component 41 and the circuit board 34.
From the contact of the respective flux portions 42 to the solidification after the solder is melted, the high-end electronic component 41 is sucked and held by the suction nozzle 11 of the head tool 3, so that the joining position shift does not occur and the high-end electronic component 41 is connected to the circuit. It can be mounted on the substrate 34 with high bonding position accuracy.

Therefore, in the electronic component mounting method in the case where the general-purpose electronic component 31 and the high-end electronic component 41 are mixedly mounted on the circuit board 34, each electronic component is required according to the required accuracy of the joining position of each electronic component. It is possible to achieve both productivity and bonding quality by using different mounting methods.

Further, in the mounting apparatus used in the mounting method for electronic parts according to the third embodiment of the present invention, the head tool further includes a pressing mechanism for pressing the electronic parts onto the circuit board. A head tool that can also be used in a local reflow mounting apparatus in which the head tool has two large and small pneumatic cylinders, which is an example, is used. In the mounting apparatus for electronic components having the head tool, the local tool of the first embodiment is used. The electronic component mounting apparatus is capable of mounting electronic components by the reflow mounting method and is compatible with the local reflow mounting method.

The structure of this head tool will be described in detail. In FIG. 14, the head tool 50 is the electronic component 1
A head tool tip portion 50a that performs operations such as suction holding and heating to the head tool, and a head tool body portion 50b that supports the head tool tip portion 50a and that moves up and down with respect to the head tool 50. 50a
Has a small cylinder 58, and the head tool main body 50b has a large cylinder 61 coaxially.

In FIG. 14, the head tool tip portion 50.
a is a suction nozzle 51 capable of sucking and holding the electronic component 1 from the tip side, a ceramic heater 52 for heating the electronic component 1 sucked and held by the suction nozzle 51, and heat from the ceramic heater 52 is a head tool. Water jacket 53 that cuts off heat so that it does not reach the main body 50b.
And a small cylinder 58 provided above the shaft 57 and a shaft 57 attached to the upper end of the water jacket 53.
A cooling blow nozzle 70 for cooling the electronic component 1 heated by the blow is attached around the lower portion of the shaft 57.

In FIG. 14, the head tool main body portion 50b includes a frame 56 supporting the head tool tip portion 50a, a large cylinder 61 provided above the frame 56, and a load cell attached to the lower portion of the large cylinder 61. And 54.

The frame 56 has a substantially U-shape formed of a rigid body, and includes an upper frame 56a provided with a large cylinder 61, a shaft 57 of the head tool tip 50a, and a side portion of the shaft 57. The lower part that supports the vertical movement of the shaft 57 while supporting the lower part of the spring receiving part 68 having an annular projection provided on the lower part through the self-weight offset spring 55 that is an elastic body that is attached so as to wind the outer periphery of the shaft 57. Frame 56b, upper frame 56a and lower frame 56
It is configured by a cylindrical intermediate frame 56c that supports b.

The shaft 57 has a step portion 57c near the middle in the axial direction, and with the step portion 57c as a boundary,
The shaft lower portion 57b of the shaft 57 has a smaller diameter than the shaft upper portion 57a. Further, the lower shaft portion 57b penetrates a hole 56d formed in a lower frame 56b that supports the shaft 57 via a self-weight counterbalance spring 55, and the hole 56d of the lower frame 56b moves up and down the shaft 57. Is formed so that it can be guided and has a diameter smaller than the diameter of the shaft upper portion 57a of the shaft 57. As a result, the shaft 57 causes the hole 56 of the lower frame 56b to pass through the self-weight canceling spring 55.
Even when the self-weight canceling spring 55 cannot support the shaft 57 due to damage or the like, the lower frame 56 can be moved vertically by being guided by d.
The periphery of the hole 56d of b can support the shaft 57 by the step portion 57c of the shaft 57 so that the shaft 57 does not drop.

Further, since the lower shaft portion 57b is provided with the outer ring and the shaft of the ball spline, the lower frame 56b is provided with the bearing inside the hole 56d, and the outer ring of the ball spline is attached to the inside of the bearing. The 57 can be rotated around an axis while being supported by the lower frame 56b, and can be vertically moved in the axial direction.

Further, both ends of the cylindrical shape of the intermediate frame 56c are fixed to the nut part 21b of the elevating part 21, and the ball screw shaft 21a screwed to the nut part 21b in the elevating part 21 is rotated by the motor 21m. As a result, the intermediate frame 56c is moved up and down, the frame 56 is moved up and down, and the entire head tool 50 is moved up and down.

Further, the small cylinder 58 is disposed inside the guide 60 of the small cylinder 58 formed on the shaft upper portion 57a of the shaft 57, and is guided inside the guide 60. A cylindrical rod 59 that moves up and down in 60 is provided, and compressed air can be supplied to and discharged from a pressurized air supply chamber 65 surrounded by the inner surface of the guide 60 and the lower surface of the rod 59.

Further, the large cylinder 61 has the upper frame 5
The cylindrical guide 63 of the large cylinder 61 formed at the end of 6a and the cylindrical rod 62 that is arranged inside the guide 63 and is guided inside the guide 63 and moves up and down in the guide 63. Equipped with a rod 62
The load cell 54 at the lower end of the narrow neck 62b
Is attached to the upper surface of. Furthermore, the large cylinder 61
Has a pressurized air supply chamber 66 surrounded by the inner surface of the guide 63 and the upper surface of the rod 62.
On the other hand, compressed air can be supplied and exhausted.

The suction nozzle 51, the ceramic heater 52, the water jacket 53, the shaft 57, the guide 60 of the small cylinder 58, the rod 59, the load cell 54, the guide 63 of the large cylinder 61, and the rod 62 are arranged coaxially. On the same axis, the rod 62 of the large cylinder 61 and the rod 59 of the small cylinder 58 move up and down,
Further, since this axis is arranged so as to be parallel to the elevating and lowering operation axis of the elevating and lowering section 21, the head tool 5 which is arranged coaxially by the elevating and lowering operation by the elevating and lowering section 21.
Each part constituting 0 can move up and down on the same axis.

Further, at the head tool tip portion 3a supported by the lower frame 56b via the self-weight offset spring 55, the rod 59 of the small cylinder 58 can abut its upper end on the lower surface which is the load detecting surface of the load cell 54. By contacting the upper end of the rod 59 of the small cylinder 58 with the load cell 54, the load acting on the lower surface, which is the load detection surface of the load cell 54, in the upward direction can be detected.

Further, in the large cylinder 61, the rod 62 has a groove-shaped recess 62a on the outer periphery of a cylindrical side surface which is the central portion in the axial direction, and the guide 63 has a rod on the cylindrical side surface. A hole 63a is provided at a position that can be matched with the recess 62a of 62. Further, the hole 6 of this guide 63
A rod-shaped stopper 6 that is an example of a rod that can penetrate 3a
4 is a guide 6 by a stopper drive cylinder 67, which is an example of a rod drive mechanism provided outside the guide 63.
3 through the hole 63a of the guide 63 from the outside,
It is formed so that it can be fitted into the second concave portion 62a, and the stopper driving cylinder 67 allows the stopper 64 to penetrate the hole 63a of the guide 63 and fit into the concave portion 62a of the rod 62, whereby the rod 6 of the large cylinder 61 can be fitted.
The vertical movement of the second cylinder 2 can be restricted, and an example of a restriction mechanism that restricts the operation of the rod 62 of the large cylinder 61 is configured as described above. The axial width of the rod 62 inside the recess 62a is slightly larger than the axial width of the stopper 64, and the stopper 64 is fitted inside the recess 62a, that is, the rod 62.
In the state where the vertical movement of the concave portion 62a is restricted, the rod 62 having the concave portion 62a can be slightly moved up and down because the inner width of the concave portion 62a is large.

The large cylinder 61, the small cylinder 58,
The stopper drive cylinder 67 is a compressed air supply / exhaust unit 69A, 69, which is an example of a compressed air supply / exhaust mechanism.
The compressed air supply / exhaust units 69A, 69B, and 69C are connected to B and 69C, and each of the compressed air supply / exhaust units 69A, 69B, and 69C includes an air supply unit that supplies compressed air, an exhaust unit that discharges compressed air, and the air supply unit. And a compressed air supply / exhaust line connected to each cylinder by the switching valve.

Also, a shaft lower part 57 which is the periphery of the lower part of the shaft 57.
Cooling blow nozzle 70 mounted around b
Is formed so as to wrap around both sides of the water jacket 53 and the ceramic heater 52 located below the shaft 57, and the tip of the cooling blow nozzle 70 is directed toward the electronic component suction holding surface which is the lower surface of the suction nozzle 51. And the blow from the cooling blow nozzle 70 is the suction nozzle 5.
It is possible to cool the electronic component 1 sucked and held by the device 1.

The control unit 9 also controls the suction operation of the suction nozzle 51, the heating operation of the ceramic heater 52, and the large cylinder 6.
1 and small cylinder 58 and stopper drive cylinder 67
Each compressed air supply / exhaust section 69A to 69C connected to
Is configured to control the air supply / exhaust operation and the moving operation of the elevating / lowering unit 21, and the load detected by the load cell 54 is output to the control unit 9.

Next, the operation of the head tool 3 according to the third embodiment will be described with reference to FIGS. 14 and 15.

First, when the head tool 3 is used in the local reflow mounting method in the first embodiment, compressed air is supplied to the pressurized air supply chamber 65 in the small cylinder 58 by the compressed air supply / exhaust section 69A in FIG. Air is supplied, and the pressure of the supplied compressed air causes the rod 59 to move upward in the guide 60 along the inner surface of the guide 60 so that the upper end of the rod 59 abuts the lower surface of the load cell 54. The rod 62 in the large cylinder 61 is pushed up via the load cell 54, and the rod 62 is moved in the guide 63 upward along the inner surface of the guide 63. At this time, the stopper 64 for restricting the vertical movement of the rod 62 of the large cylinder 61 has the recess 62 a of the rod 62.
Is not fitted inside, the stopper 64 is in an off state, and the rod 62 can freely move up and down in the guide 63 along the inner surface of the guide 63.

Next, the upper surface of the rod 62 of the large cylinder 61 pushed up and moved upward contacts the inner upper surface of the guide 63, and the upper end of the vertical movement of the rod 62 along the inner surface of the guide 63. 15, the compressed air supply / exhaust section 69C supplies compressed air to the stopper drive cylinder 67 by the stopper 64 for limiting the vertical movement of the rod 62 of the large cylinder 61 in the off state. By doing so, it is fitted into the inside of the recess 62a of the rod 62 while penetrating the hole 63a of the guide 63, and the stopper 64 is turned on.

Thereafter, the compressed air supply / exhaust portion 69A to the compressed air supply chamber 65 in the small cylinder 58 is stopped, and the compressed air supply / exhaust portion 69B in the compressed air supply chamber 66 in the large cylinder 61 is stopped. The compressed air is supplied by the compressed air supply chamber 65 in the small cylinder 58.
From the compressed air supply / exhaust section 69A,
The rod 62 of the large cylinder 61 is pushed down by the pressure of the compressed air supplied to the pressurized air supply chamber 66, and the load cell 54 attached to the lower end of the narrow neck portion 62b which is the lower portion of the rod 62 is moved downward, As a result, the rod 59 of the small cylinder 58, whose upper end is in contact with the lower surface of the load cell 54, is pushed down via the load cell 54 and moved downward.

Thereafter, the lower end of the rod 59 of the small cylinder 58 abuts on the inner lower end of the guide 60, and this abutment makes the rod 59 integral with the shaft 57 forming the guide 60. Further, when the rod 59 is pressed downward, the lower frame 56 is pushed through the self-weight canceling spring 55.
The entire head tool tip portion 50a supported by b is pushed down, and the self-weight canceling spring 55 is contracted by the pushing load. Then, in the large cylinder 61, the recessed portion 62a of the rod 62 that has been pushed down.
The inner upper surface of the rod abuts on the upper portion of the stopper 64, and at this abutting position, the rod 62 is pressed downward and fixed by the pressure of the compressed air supplied to the pressurized air supply chamber 66. Become. In order to reduce the impact when the rod 62 and the stopper 64 come into contact with each other, the amount of compressed air supplied to the compressed air supply chamber 66 in the compressed air supply / exhaust portion 69B is increased by the load detected by the load cell 54. It is controlled in stages.

The relationship between the axial width of the recess 62a of the rod 62 in the axial direction and the axial width of the stopper 64 will be described in more detail below.
The rod 59 of the small cylinder 58 is pushed up, and the rod 5
9 is moved upward in the guide 60 along the inner surface of the guide 60, whereby the rod 62 of the large cylinder 61 is pushed up via the load cell 54, and is moved upward in the guide 63 along the inner surface of the guide 63. After the movement, when the rod 62 is moved until the upper surface of the rod 62 contacts the inner upper surface of the guide 63, it is possible to fit the stopper 64 inside the concave portion 62a of the rod 62, and thereafter, The rod 62 of the large cylinder 61 is pushed down and moved downward in the guide 63 along the inner surface of the guide 63, whereby the rod 59 of the small cylinder 58 is pushed down via the load cell 54 and along the inner surface of the guide 60. The rod 59 is moved downward in the guide 60, the lower end of the rod 59 abuts the inner lower end of the guide 60, and
Is pressed, the self-weight canceling spring 55 can be compressed by this pressing force. In this state, the inner upper surface of the recess 62a of the rod 62 abuts the upper portion of the stopper 64. It is configured.

Head tool 5 in the above state
At 0, the electronic component 1 is suction-held by the suction nozzle 51, and after the electronic component 1 and the circuit board 4 are aligned, the head tool 50 is lowered by the elevating part 21 while the electronic component 1 is suction-held by the suction nozzle 51. The solder bumps 1b of the electronic component 1 come into contact with the solder portions 2 of the circuit board 4.
At this time, due to the abutting load generated, the upper end of the rod 59 of the small cylinder 58, which has an integral structure with the shaft 57 at the upper part of the head tool tip portion 50a, is not moved.
By pressing the load detection surface of, the contact load can be detected in the load cell 54.

By thus detecting the contact load in the load cell 54, it is detected that the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are in contact with each other, and the load cell 54 detects the contact. The contacting load thus generated is output to the control unit 9, and the elevating unit 21 is controlled by the control unit 9 so that the contacting load set in advance by the control unit 9 is controlled. The elevating part 21 is controlled so that the contact load is set in advance.

Next, when the head tool 50 is used in the conventional local reflow mounting method, the head tool 5 in the state used in the local reflow mounting method in the first embodiment shown in FIG. 15 is used.
In 0, the stopper 64 is turned on and the large cylinder 6
The compressed air supply / exhaust section 69 is provided in the pressurized air supply chamber 66
Compressed air is supplied by B.

First, after the compressed air supply amount to the compressed air supply chamber 66 is gradually reduced by the compressed air supply / exhaust unit 69B to stop the compressed air supply, the compressed air in the small cylinder 58 is stopped. The compressed air supply / exhaust unit 69A starts supplying compressed air to the supply chamber 65. As a result, as shown in FIG. 14, the rod 59 of the small cylinder 58 is pushed up, the rod 59 is moved upward along the inner surface of the guide 60 in the guide 60, and the upper end of the rod 59 is brought to the lower surface of the load cell 54. The rod 62 of the large cylinder 61 is pushed up via the load cell 54, and the rod 62 moves upward in the guide 63 along the inner surface of the guide 63.

Thereafter, the stopper 64 fitted inside the recess 62a of the rod 62 is exhausted from the compressed air supplied to the stopper driving cylinder 67 by the compressed air supply / exhaust unit 69C, whereby the recess 62a of the rod 62 is discharged. Then, the stopper 64 which is turned on is turned off.

Head tool 5 in the above state
At 0, the electronic component 1 is suction-held by the suction nozzle 51, and after the electronic component 1 and the circuit board 4 are aligned, the head tool 50 is lowered by the elevating part 21 while the electronic component 1 is suction-held by the suction nozzle 51. , Large cylinder 61
The compressed air supply / exhaust unit 69A or 69B supplies compressed air to the compressed air supply chamber 66 of FIG. 1 of each solder bump 1b
Are pressed against each solder portion 2 of the circuit board 4. At this time, the load with which the suction nozzle 51 that holds the electronic component 1 by suction presses the circuit board 4 is compressed air in the pressurizing air supply chamber 66 in the large cylinder 61 or in the pressurizing air supply chamber 65 in the small cylinder 58. A pressure load detected by the load cell 54 via the rod 62 or rod 59 is transmitted to the adsorption nozzle 51 via the shaft 57 by the pressure of the compressed air supplied by the air supply / exhaust unit 69A or 69B. . In this case, the product of the pressure of the compressed air and the area of the upper surface of the rod 62 or the rod 59 becomes the pressing load. The large cylinder 61 is used when a large pressing load is required, and the small cylinder 58 is used when a small pressing load is required.

In the above, the case where the head tool 50 has two large and small cylinders has been described.
If the required pressing load is limited to a certain range, a head tool with only one cylinder
Electronic components can be mounted in the same manner as above.

According to the third embodiment described above, the head tool 3 having a pneumatic cylinder of the type used in the local reflow mounting apparatus has means for fixing the pneumatic cylinder, for example, as described above. The conventional local reflow mounting method and the above-described first method are provided by the recess 62a of the rod 62 of the large cylinder 61 and the stopper 64, and the electronic device mounting apparatus including the head tool 3 as described above.
The electronic component 1 can be mounted on the circuit board 4 by both of the mounting methods of the local reflow mounting method of the embodiment.

Accordingly, for example, when the electronic component 1 is a general-purpose electronic component that does not require high joining accuracy, and when this general-purpose electronic component is mounted on the circuit board 4, the stopper 64 is attached to the rod 62 of the large cylinder 61. The rod 62 is turned off so that the rod 62 can freely move up and down in the guide 63. Thereafter, by supplying compressed air to the pressurized air supply chamber 66 of the large cylinder 61 or the pressurized air supply chamber 65 of the small cylinder 58, the pressure of the supplied compressed air is utilized to make the rod 62, Or load cell 5 via rod 59
The pressing load detected by 4 is transmitted to the suction nozzle 51 via the shaft 57, and the suction nozzle 51 is pushed down, so that an electronic component can be mounted by a conventional local reflow mounting method at a high mounting speed. Becomes

At the same time, for example, when the electronic component 1 is a high-end electronic component which requires high joining accuracy, and when this high-end electronic component is mounted on the circuit board 4, the recess 62a of the rod 62 in the large cylinder 61 is used.
By turning on the stopper 64 inside the chamber and supplying compressed air to the pressurized air supply chamber 66 of the large cylinder 61,
The rod 6 is pushed down to push down the rod 6.
By bringing the inner upper surface of the second concave portion 62a into contact with the upper portion of the stopper 64, the load cell 54, the rod 62,
The guide 63 and the upper frame 56a are brought into an integrated structure, and the rod 62 of the large cylinder 61 pushes down the rod 59 of the small cylinder 58 via the load cell 54 so that the lower end of the rod 59 is the inner lower end of the guide 60. The head tool tip portion 50a.
The entire head tool 50 is pressed down through the self-weight canceling spring 55 when the head tool 50 is entirely pressed into the integrated structure, and the head tool 50 is moved to the first embodiment. The head tool can have a structure similar to that of the head tool 3 in FIG. Head tool 5 in this state
At 0, the lowering operation of the head tool 50 by the elevating unit 21 causes the electronic components and the circuit board to come into contact with each other.
4, the elevating part 21 is controlled by the control part 9 so that the detected contact load becomes a preset contact load. According to the local reflow mounting method of the embodiment, it becomes possible to mount the electronic component. Therefore, the mounting method can be selectively used depending on the bonding accuracy of the electronic component to the circuit board, and the productivity and the bonding quality can be compatible.

Further, in the head tool 50 in which the stopper 64 is turned on in a state in which the head tool 50 is compatible with the local reflow mounting method of the first embodiment, the contraction height of the self-weight canceling spring 55 is set to a constant height. The height of the tip of the suction nozzle 51 can be kept constant by controlling the height of the suction nozzle 51 so that the contact load can be stably controlled when the electronic component 1 is brought into contact with the circuit board 4. Therefore, it becomes possible to stabilize the joining quality of electronic components.

Therefore, in the third embodiment described above, in the head tool 50, the large cylinder 6 is separated from the dimensional accuracy of each component forming the large cylinder 61.
The dimensional accuracy of the concave portion 62a and the stopper 64 provided in the rod 62 of No. 1 is increased, and the rod 62 of the stopper 64 is further increased.
The concave portion 62a of the large cylinder 61
By making it adjustable on the outer side of the guide 63, it is possible to manage the contraction height of the self-weight spring 55 to a constant height.

Further, as shown in FIG. 16, the mounting apparatus used in the mounting method for electronic components according to the fourth embodiment of the present invention, as shown in FIG. 16, holds the electronic components by suction and mounts them on the circuit board. An electronic component mounting apparatus 202 of a dual stage specification including the head tool 50 of the embodiment and two stages 7 for fixing the circuit board on which the electronic component of the electronic component mounting apparatus 201 of the first embodiment is mounted. .

As shown in FIG. 16, the electronic component mounting apparatus 2
02, a plurality of ICs formed in a lattice on the wafer
The chip 73 is supplied to the IC chip supply unit 73, the high-end electronic components 71 are supplied to the parts tray 5A, and the general-purpose electronic components 72 are supplied to the parts tray 5B. The parts tray 5A and the parts tray 5B are fixed on slide bases 6A and 6B to which the stages 7A and 7B are fixed. The high-end electronic component 71 and the general-purpose electronic component 72 are
The same as the high-end electronic component 41 and the general-purpose electronic component 31 in the second embodiment, the IC chip 73 is
This is an example of an electronic component that requires high bonding position accuracy as with the high-end electronic component 71.

Further, the plurality of circuit boards 4A on which the IC chip 73, the high-end electronic components 71, and the general-purpose electronic components 72 are mounted are supplied to the circuit board supply section 76, and the circuit board 4A is moved by suction and holding. Loader 7
7, the circuit board 4A from this circuit board supply unit 76
Circuit board 4A to each stage 7A and 7B
It is also possible to take out the circuit board 4A on which the electronic components are mounted from the stages 7A and 7B and to eject the circuit board 4A to the circuit board ejecting section 78.

As with the electronic component mounting apparatus 201 in the first embodiment, the head tool 50 is moved by the X-direction moving mechanism 22 and the elevating part 21, and the slide bases 6A and 6B are moved by the Y-direction moving mechanism 23. , Each can be moved.

Further, the IC chip 73 supplied to the IC chip supply unit 74 is arranged such that the surface having each electrode is on the upper surface, and the surface having each electrode is changed by the adsorption reversing unit 75 which is an example of the reversing mechanism. The IC chip 73 is suction-held, and the suction-reversing unit 75 is rotated while the IC chip 73 is suction-held.
By making the back surface of the IC chip 73, which is the surface not having the electrodes, the top surface, the back surface of the IC chip 73 can be suction-held by the head tool 50.

Next, the case where the IC chip 73, the high-end electronic component 71, and the general-purpose electronic component 72 are mounted on the circuit board 4A in the electronic component mounting apparatus 202 having such a configuration will be described.

First, the circuit board 4A is sucked and held by the loader 77 from the circuit board supply unit 76, and is taken out, and each circuit board 4A is supplied to each of the stages 7A and 7B and fixed. Next, the suction reversal unit 75 is moved to move one IC chip 73 arranged in the IC chip supply unit 74,
The suction reversal unit 75 is aligned with the IC chip 73 so that the suction reversal unit 75 can be suction-held.
The IC chip 73 is taken out from the IC chip supply unit 74 by lowering the suction reversal unit 75, holding the IC chip 73 by suction, and raising it. At the same time, the head tool 50 sucks and holds the high-end electronic component 71 on the parts tray 5A, and the high-end electronic component 71 is mounted on the circuit board 4A fixed to the stage 7A. At this time, the stopper 64 is turned on inside the concave portion 62a of the rod 62 in the large cylinder 61 of the head tool 50, and the head tool main facing portion 50b and the head tool tip portion 50a are in an integrated structure, respectively. The head tool 50 is the above-mentioned first tool in the third embodiment.
It is in a state in which the local reflow mounting method of the above embodiment can be supported.

After that, the IC chip 73 suction-held by the suction-inversion unit 75 is rotated to make the back surface of the IC chip 73 the upper surface.
At the same time, the head tray 50 is used for the parts tray 5
At A, the high-end electronic component 71 is suction-held and taken out, and the high-end electronic component 71 is mounted on the circuit board 4A fixed to the stage 7B. After that, the head tool 50 is moved above the suction reversal unit 75, the back surface of the IC chip 73 suction-held by the suction reversal unit 75 is suction-held by the head tool 50, and the IC chip 73 is moved to the IC chip 73 by the suction reversal unit 75. Release the adsorption hold of
From the suction reversal unit 75 of the IC chip 73 to the head tool 50
Hand over to. After that, by the head tool 50, the IC is mounted on the circuit board 4A fixed to the stage 7A.
Mount the chip.

Further, thereafter, the general-purpose electronic component 72 is sucked and held by the parts tray 5B by the head tool 50 and taken out, and the circuit board 4A fixed to the stage 7A.
The general-purpose electronic component 72 is mounted on top. Along with that, IC
The IC chip 73 is sucked and held by the suction reversing unit 75 from the chip supply unit 73 and taken out. At this time, the recess 62a of the rod 62 in the large cylinder 61 of the head tool 50
The stopper 64 is off inside the
The head tool 50 is ready for the conventional local reflow mounting method according to the third embodiment.

After that, the general-purpose electronic component 72 is sucked and held by the parts tray 5B by the head tool 50 and taken out, and the general-purpose electronic component 72 is mounted on the circuit board 4A fixed to the stage 7B. At the same time, the IC chip 73 suction-held by the suction-inversion unit 75 is rotated to make the back surface of the IC chip 73 the upper surface. After that, similarly to the above, the head tool 50 is moved above the suction reversal unit 75, the back surface of the IC chip 73 suction-held by the suction reversal unit 75 is suction-held by the head tool 50, and the suction reversal unit 75 is also held. The suction holding by the IC chip 73 is released, and the IC chip 73 is transferred from the suction reversing unit 75 to the head tool 50. Thereafter, the head tool 50 is used to attach the circuit board 4A fixed to the stage 7B to the circuit board 4A.
Mount the C chip. IC by this head tool 50
When mounting the chip 73 on the circuit board 4A, the recess 62a of the rod 62 in the large cylinder 61 of the head tool 50 is mounted.
The stopper 64 is turned on again inside the
The head tool 50 is in a state of being compatible with the local reflow mounting method of the first embodiment in the third embodiment.

Further, thereafter, each circuit board 4A on which each IC chip 73, each high-end electronic component 71, and each general-purpose electronic component 72 are mounted is taken out from each stage 7A and 7B by the loader 77, and the circuit board ejecting section. Discharge to 78.

The above-described work is repeated for each of the circuit boards 4A for the plurality of circuit boards 4A, and the IC chip 73 and the high-end electronic parts 7 are formed on each circuit board 4A.
1 and the general-purpose electronic component 72 are mounted.

According to the fourth embodiment, the circuit board 4
The electronic component mounted on A is, for example, an IC chip 73,
Even in the case of various types of electronic components such as the high-end electronic component 71 and the general-purpose electronic component 72, the electronic component mounting apparatus 202 is the head tool 50 of the third embodiment.
Since the electronic component mounting apparatus 202 is equipped with
Only the conventional local reflow mounting method and the local reflow mounting method of the first embodiment described above can be applied to the high-end electronic component 71 and the IC chip 73 that require high bonding accuracy. Has a high bonding accuracy by the local reflow mounting method of the first embodiment, and a high mounting speed by the conventional local reflow mounting method for general-purpose electronic components 72 that do not require high bonding accuracy. Electronic components can be mounted on the circuit board 4A. Therefore, it is possible to provide an electronic component mounting apparatus that can achieve both productivity and joint quality by properly using the mounting method of each electronic component according to the required joint accuracy of each electronic component.

Further, since the electronic component mounting apparatus 202 includes a plurality of stages for fixing each circuit board 4A, for example, two stages 7A and 7B, each electronic component is required for the same mounting method. After mounting the electronic components on the circuit board 4A, the electronic components can be mounted on the circuit board 4A with respect to the electronic components requiring a different mounting method. It is possible to reduce the number of times the stopper 64 is turned on and off to the recess 62a of the rod 62 of the head tool 50, which is an operation required to switch the mounting method required for each electronic component. It is possible to reduce the time loss for the electronic component mounting work due to the ON and OFF operations, and it is possible to shorten the time required for the electronic component mounting work. .

Next, in the fifth embodiment of the present invention, the local reflow mounting method of the first embodiment and the ultrasonic mounting method which is a conventional electronic component mounting method are mixed in various orders. , Mounting various types of electronic components. Here, the ultrasonic mounting method means that ultrasonic vibration is applied to the surface of the bonding base material, that is, each surface of each electrode of the electronic component or each electrode of the circuit board, so that each electrode of the electronic component and the circuit board This is a mounting method of an electronic component in which friction is generated on a contact surface with each electrode and the friction heat is used for bonding.
The above fifth embodiment of the present invention will be described based on the following examples.

First, in the first example of the fifth embodiment of the present invention, the high-end electronic component is mounted on the circuit board by the local reflow mounting method of the first embodiment, and then the high-end electronic component is mounted. Electronic components are mounted on the circuit board on which the components are mounted by an ultrasonic mounting method.

First, the electronic component mounting apparatus 203 for carrying out the electronic component mounting method in the first embodiment will be described.

As shown in FIG. 17, the electronic component mounting apparatus 2
Reference numeral 03 denotes the head tool 3 according to the first embodiment, which sucks and holds high-end electronic components and mounts them on a circuit board,
An ultrasonic tool 113 for mounting electronic components by an ultrasonic mounting method is provided, and the circuit board 104 is fixed to the stage 7 fixed on the slide base 6. In addition, a plurality of IC chips 101 formed in a lattice on a wafer, which is an example of a high-end electronic component, are supplied to the IC chip supply unit 73, and a plurality of electronic components mounted on the circuit board 104 by the ultrasonic mounting method. 111 is supplied to the parts tray 5 and arranged.

Also, the IC chip 101 and the electronic component 1
The plurality of circuit boards 104 on which 11 are mounted are supplied to the circuit board supply unit 76, and the circuit board 104 is removed from the circuit board supply unit 76 by the loader 77 that performs a moving operation by suction holding the circuit board 104. The circuit board 104 can be supplied to the stage 7 and the circuit board 104 on which each electronic component is mounted is taken out from the stage 7 and the circuit board 1 to the circuit board discharge portion 78.
It is also possible to discharge 04.

Further, similarly to the electronic component mounting apparatus 201 in the first embodiment, the head tool 3 is moved by the X-direction moving mechanism 22 and the elevating / lowering section 21 to the ultrasonic tool 113.
The X-direction moving mechanism 22 and the elevating / lowering unit 21A allow the slide bases 6 to move by the Y-direction moving mechanism 23.

Further, the IC chip 101 supplied to the IC chip supply section 74 is arranged such that the surface having each electrode is on the upper surface, and the surface having each electrode is sucked and held by the suction reversing section 75, and the IC chip 101 is held. The suction reversing unit 75 is rotated while the suction holding unit 101 is held, and the IC chip 101
By setting the back surface, which is the surface not having each electrode, as the top surface, the back surface of the IC chip 101 can be held by suction by the head tool 3.

Next, in the electronic component mounting apparatus 203 having such a configuration, the IC chip 101 and the electronic component 11 are
A mounting method of the electronic component according to the first embodiment when mounting 1 on the circuit board 104 will be described in detail.

As shown in FIG. 18A, the rectangular plate-shaped circuit board 104 has pads 104a and 104b which are a plurality of electrodes on the upper surface, and each pad 104a.
Can be bonded to a plurality of electrodes 101a of the IC chip 101, and each pad 104b can be bonded to a plurality of electrodes 111a of the electronic component 111.

In FIG. 17, such a circuit board 10 is formed.
From the circuit board supply unit 76 to which a plurality of 4 are supplied, the loader 77 picks up the circuit board 104 by suction holding, supplies it to the stage 7, and fixes it.

Next, in FIG. 17, the suction reversal unit 75 is moved so that one rectangular plate-shaped IC chip 101 arranged in the IC chip supply unit 74 can be suction-held by the suction reversal unit 75. As shown in FIG.
Is aligned with the IC chip 73, the suction reversal unit 75 is lowered, the IC chip 101 is suction-held, and then raised, and the IC chip 10 is fed from the IC chip supply unit.
Take 1 out. After that, the IC chip 101 suction-held by the suction-inversion unit 75 is rotated to make the back surface of the IC chip 101 the upper surface, and the head tool 3 is moved above the suction-inversion unit 75. , The IC chip 1 sucked and held by the suction reversing unit 75
The back surface of 01 is suction-held by the suction nozzle 11 of the head tool 3, and the suction-reversing unit 75 releases the suction-holding to the IC chip 101, and the IC chip 101 is transferred from the suction-reversing unit 75 to the head tool 3. .

Next, in FIG. 18B, solder bumps 101b are formed on each electrode 101a of the IC chip 101 which is suction-held by the suction nozzle 11 of the head tool 3, and each solder of the IC chip 101 is formed. Bump 10
The IC chip 101 is aligned with the circuit board 104 so that 1b can be bonded to each pad 104a of the circuit board 104.

After that, as shown in FIG. 18C, the IC
While lowering the suction nozzle 11 of the head tool 3 that holds the chip 101 by suction, each solder bump 101b of the IC chip 101 is connected to each pad 104a of the circuit board 104.
Abut. After this contact, each pad 104 of the circuit board 104 is driven by the ceramic heater 12 of the head tool 3.
Each solder bump 10 of the IC chip 101 in contact with a
1b is heated and melted. After that, the heating by the ceramic heater 12 is stopped, and the molten solder is cooled by blowing from the cooling blow nozzle 19,
The melted solder bumps 101b are solidified, and the electrodes 101a of the IC chip 101 and the pads 104a of the circuit board 104 are joined with the solder bumps 101b interposed therebetween. The cooling blow nozzle 19 for the molten solder
Instead of the forced cooling by, the molten solder may be naturally cooled to solidify the solder.

After that, as shown in FIG. 18D, the suction holding of the IC chip 101 by the suction nozzle 11 of the head tool 3 is released, the head tool 3 is raised, and the IC
The chip 101 is mounted on the circuit board 104.

Here, for example, when flux is supplied to the surface of each solder bump 101b of the IC chip 101 or each pad 104a of the circuit board 104,
Perform flux cleaning to remove the flux. This flux cleaning may not be necessary depending on the type of supplied flux.

Next, referring to FIG. 17, the ultrasonic tool 11
The ultrasonic tool 1 is moved so that one rectangular plate-shaped electronic component 111 arranged in the parts tray 5 can be sucked and held by the ultrasonic tool 113.
13 is aligned with the electronic component 111,
The ultrasonic tool 113 is lowered to suck and hold the electronic component 111, and then raised to take out the electronic component 111 from the parts tray 5.

Next, as shown in FIG. 19E, the electronic component 111 sucked and held by the ultrasonic tool 113.
Solder bumps 111b are formed on the respective electrodes 111a of the
Each pad 1 of the circuit board 104 on which the chip 101 is mounted
The electronic component 111 is aligned with the circuit board 104 so that it can be bonded to 04b.

Thereafter, as shown in FIG. 19 (f), while lowering the ultrasonic tool 113 holding the electronic component 111 by suction, each solder bump 111b of the electronic component 111 is lowered.
While pressing on the pads 104b of the circuit board 104,
The surface of each solder bump 111b of the electronic component 111 which is in contact with each other and each pad 104 of the circuit board 104
Ultrasonic vibration is applied to the surface of b by the ultrasonic tool 113 to cause friction on each of these abutting surfaces. The frictional heat generated by this friction causes the solder bumps 111b of the electronic component 111 and the pads 104 of the circuit board 104.
b is joined.

After that, as shown in FIG. 19G, the suction holding of the ultrasonic tool 113 to the electronic component 111 is released, the ultrasonic tool 113 is raised, and the electronic component 111 is lifted.
Are mounted on the circuit board 104.

By the electronic component mounting method as described above,
The IC chip 101 and the electronic component 111 are provided on the circuit board 104.
Will be implemented in.

Further, thereafter, the circuit board 104 on which the IC chip 101 and the electronic component 111 are mounted is sucked and held by the loader 77, whereby the circuit board 104 is held.
Is taken out from the stage 7 and discharged to the circuit board discharging section 78.

The above operations are repeated for each of the circuit boards 104 on the plurality of circuit boards 104, and the IC chip 101 and the electronic component 1 are mounted on each circuit board 104.
11 is implemented.

According to the first example of the fifth embodiment, the electronic component mounting apparatus 203 is provided with the head tool 3 capable of implementing the local reflow mounting method of the first embodiment and the ultrasonic mounting method. Possible ultrasonic tool 1
13 is provided, the IC is mounted on the circuit board 104 by the local reflow mounting method according to the first embodiment.
After mounting the chip 101, the electronic component 111 can be mounted by an ultrasonic mounting method, and therefore, for example, when the electronic component 111 is an electronic component that is required to be prevented from being affected by heat. And IC chip 10
Since the electronic component 111 is not affected by the melting and heating of the solder at the time of mounting No. 1, the electronic component 111 can be mounted on the circuit board 104 without being affected by the heat. Further, for example, in the case where flux is supplied to each solder bump 101b of the IC chip 101 or each pad 104a of the circuit board 104 and the flux needs to be removed after the IC chip 101 is mounted, The IC chip 10 is mounted on the circuit board 104 by the local reflow mounting method according to the first embodiment.
After the mounting of No. 1, the supplied flux is removed by the flux cleaning, and then the electronic component 111 can be mounted by the ultrasonic mounting method. Therefore, the electronic component 111 can be mounted by the ultrasonic mounting method during the flux cleaning. It is possible to eliminate the need to consider the effect of the flux cleaning liquid on the electronic component 111, or the effect of redeposition of fine fragments or the like washed off during the flux cleaning on the electronic component 111. Therefore, a high bonding position accuracy is required for the electronic component 111 that needs to consider the above influence, for example, an electronic component that requires a heatproof environment or a waterproof environment at the time of mounting, by the ultrasonic mounting method. It becomes possible to mount together with a high-end electronic component such as an IC chip on a circuit board.

Next, in the second example of the fifth embodiment of the present invention, first, the circuit board 10 is manufactured by the ultrasonic mounting method.
After mounting the electronic component 111 on the board 4, the electronic component 1
The IC chip 101, which is an example of a high-end electronic component, is mounted on the circuit board 104 on which 11 is mounted by the local reflow mounting method according to the first embodiment. That is, the order of the ultrasonic mounting method and the local reflow mounting method of the first embodiment is reversed from that of the first example of the fifth embodiment.

According to the second example of the fifth embodiment, after the electronic component 111 is mounted on the circuit board 104 by the ultrasonic mounting method, the electronic component 111 is mounted on the circuit board 104. Since the IC chip 101 is mounted by the local reflow mounting method of the first embodiment, it is possible to eliminate the need to consider the influence on the IC chip 101 due to the ultrasonic vibration generated during ultrasonic mounting. Therefore, when a high-end electronic component such as an IC chip that requires high bonding position accuracy is an electronic component that needs to further consider the influence on vibration, the high-end electronic component is mounted together with the electronic component mounted by the ultrasonic mounting method. , Can be mixedly mounted and mounted on a circuit board.

Further, in the third example of the fifth embodiment of the present invention, first, by an ultrasonic mounting method, a sealing material for sealing the joint portion between the electronic component and the circuit board is used,
After mounting the electronic component on the circuit board, by a batch reflow mounting method, a general-purpose electronic component is temporarily joined on the circuit substrate on which the electronic component is mounted via solder, and then the electronic component is mounted. By collectively applying heat to the general-purpose electronic component and the circuit board, the joint portion of the electronic component and the circuit board is sealed with the sealing material and is temporarily joined via the solder. Main bonding is performed by melting the solder of the general-purpose electronic component, and is mounted. After that, the high-end electronic component is mounted on the circuit board on which the electronic component and the general-purpose electronic component are mounted by the local reflow mounting method of the first embodiment. The mounting method of the electronic component of the third embodiment will be described in detail below.

As shown in FIG. 20A, the rectangular plate-shaped circuit board 124 has pads 124a, 124b, and 124c, which are a plurality of electrodes, on the upper surface, and each pad 124a is formed by the ultrasonic mounting method. It is possible to bond to the plurality of electrodes 121a of the electronic component 121 mounted on the substrate 124, each pad 124b can be bonded to the plurality of electrodes 131a of the general-purpose electronic component 131, and each pad 124c.
Can be joined to the plurality of electrodes 141a of the high-end electronic component 141. Each pad 124 of the circuit board 124
A sealing material 122, which is a non-conductive resin material, is supplied to a portion on the circuit board 124 where the rectangular plate-shaped electronic component 121 is mounted, including on and near a, and the electronic component 121. Au bumps 121b are formed on the respective electrodes 121a. First, the back surface of the electronic component 121, which is a surface not having the electrodes 121a, is adsorbed and held by the ultrasonic tool 123 so that each Au bump 121b of the electronic component 121 can be bonded to each pad 124a of the circuit board 124. , The electronic component 121 is aligned with the circuit board 124.

After that, as shown in FIG. 20B, while lowering the ultrasonic tool 123 that holds the electronic component 121 by suction, each Au bump 121b of the electronic component 121 is lowered.
Is pressed against each pad 124 a of the circuit board 124 via the sealing material 122. As a result, each Au of the electronic component 121 is
The sealing material 122 between the bump 121b and each pad 124a of the circuit board 124 is pushed away, and each Au bump 121b of the electronic component 121 is connected to each pad 124 of the circuit board 124.
The surface of each Au bump 121b of the electronic component 121 and the surface of each pad 124a of the circuit board 124 that are in contact with each other and pressed against the surface of the pad 124a of the circuit board 124 are ultrasonically bonded to each other.
3, ultrasonic vibration is applied to cause friction on each of these contact surfaces. Due to the frictional heat generated by this friction, the Au bumps 121b of the electronic component 121 are bonded to the pads 124a of the circuit board 124, and these bonding portions are sealed between the electronic component 121 and the circuit board 124. The material 122 is covered.

After that, the suction holding of the electronic component 121 by the ultrasonic tool 123 is released, the ultrasonic tool 123 is raised, and the electronic component 121 is mounted on the circuit board 124.

Next, as shown in FIG. 20C, solder bumps 131b are formed on each electrode 131a of the rectangular plate-shaped general-purpose electronic component 131.
The back surface, which is the surface not having the electrodes 131a of 31, is adsorbed and held by the tool 133, and the solder bumps 131b of the general-purpose electronic component 131 are connected to the pads 124b of the circuit board 124.
General-purpose electronic component 131 so that it can be bonded to
Align with 24.

Then, as shown in FIG. 20D, the tool 133 holding the general-purpose electronic component 131 by suction is lowered, and the solder bumps 131b of the general-purpose electronic component 131 are pressed against the pads 124b of the circuit board 124. Then, temporary joining is performed. When mounting a plurality of general-purpose electronic components 131 on the circuit board 124, the above-described work is repeated for each general-purpose electronic component 131, and each general-purpose electronic component 131 is mounted on the circuit board 124. Temporarily join.

Next, as shown in FIG. 21 (e), the circuit board 124 on which the electronic component 121 is mounted and the general-purpose electronic component 131 is provisionally joined in a state where the joining portion is covered with the sealing material 122. , The solder reflow working unit, and in the solder reflow working unit, the electronic component 121, the general-purpose electronic component 13
1 and the circuit board 124 are heated by the heat source, the solder bumps 131b of the general-purpose electronic component 131 are melted, and the sealing material 122 of the electronic component 121 is also heated. After that, the heated electronic component 121 and the general-purpose electronic component 131
The circuit board 124 is cooled, and the melted solder bumps 131b of the general-purpose electronic component 131 are solidified, and the electrodes 131a of the general-purpose electronic component 131 are permanently bonded to the pads 124b of the circuit board 124 via the solder bumps 131b. Is
The sealing material 122 of the electronic component 121 that is mounted and heated is solidified, and each Au bump 121b of the electronic component 121, which is a joint portion between the electronic component 121 and the circuit board 124.
Each pad 124a of the circuit board 124 is sealed by the sealing material 122.

Next, in FIG. 21 (f), solder bumps 141b are formed on the electrodes 141a of the square-plate-shaped high-end electronic component 141, and the solder bumps 141b are formed on the surface of the high-end electronic component 141 not having the electrodes 141a. A certain back surface is sucked and held by the suction nozzle 11 of the head tool 3, and each solder bump 141b of the high-end electronic component 141 is held.
The high-end electronic component 141 is aligned with the circuit board 124 so that the high-end electronic component 141 can be bonded to the pads 124c of the circuit board 124 on which the electronic component 121 and the general-purpose electronic component 131 are mounted.

After that, as shown in FIG. 21G, while lowering the suction nozzle 11 of the head tool 3 which holds the high-end electronic component 141 by suction, each solder bump 141b of the high-end electronic component 141 is attached to the circuit board 124. To contact each pad 124c. After this contact, the circuit board 124 is moved by the ceramic heater 12 of the head tool 3.
The solder bumps 141b of the high-end electronic component 141, which are in contact with the pads 124c, are heated and melted.
Thereafter, after the heating by the ceramic heater 12 is stopped, the molten solder bumps 141b are solidified by cooling the molten solder bumps 141b by the blow from the cooling blow nozzle 19, thereby solidifying the molten solder bumps 141b. Each electrode 141a and each pad 124c of the circuit board 124 are joined with each solder bump 141b interposed. Instead of forcibly cooling the melted solder bumps 141b with the cooling blow nozzle 19, the melted solder bumps 141b may be naturally cooled and solidified.

After that, as shown in FIG. 21H, the suction holding of the high-end electronic component 141 by the suction nozzle 11 of the head tool 3 is released, the head tool 3 is raised, and the high-end electronic component 141 is moved to the circuit board 124. Will be implemented in.

By the mounting method of electronic parts as described above,
The electronic component 121, the general-purpose electronic component 131, and the high-end electronic component 141 are mounted on the circuit board 124.

According to the third example of the fifth embodiment, in addition to the effect of the second example, the joint portion of the electronic component 121 joined to the circuit board 124 by the ultrasonic mounting method is further added. The general-purpose electronic component 131 temporarily sealed to the circuit board 124 by sealing with the sealing material 122.
Since the main joining by batch reflow can be performed simultaneously by collectively heating each electronic component and the circuit board with a heat source, each electronic component mounted on the circuit board is To reduce the mounting time of each electronic component on the circuit board in the case of electronic components that are mounted by the sonic mounting method and that require sealing of the joints and high-end electronic components that require high joint position accuracy. Is possible.

By properly combining the arbitrary embodiments of the aforementioned various embodiments, the effects possessed by them can be produced.

[0240]

According to the first to third aspects of the present invention, the respective electrodes of the electronic component sucked and held by the component holding member and the respective electrodes of the circuit board are brought into contact with each other with a bonding material interposed therebetween, When the bonding material is melted by heating, like the conventional local reflow mounting method, the electrodes of the electronic component and the electrodes of the circuit board are simply pressed by interposing the bonding material. Instead of pressing the bonding material with the bonding material interposed between the electrodes of the electronic component and the electrodes of the circuit board after melting the bonding material by heating the bonding material, After the contact between the electrodes and the electrodes of the circuit board with the bonding material interposed, the bonding material is melted by heating. Because it is not in a molten state, It is possible to detect a load actually generated between the electrodes of the electronic component and the electrodes of the circuit board, and further, in the contact, the detected load actually generated is It is possible to control so as to exceed the contact load that is expected to occur at the time of contact. Therefore, when repeatedly mounting a plurality of electronic components on a circuit board, it is necessary to accurately control the load actually generated so as to always exceed the contact load expected to occur at the time of contact. The contact position of each electronic component when contacting the circuit board can be made more uniform, and the pitch between the electrodes of the electronic component can be narrowed, resulting in a high bonding position accuracy to the circuit board. For electronic components such as high-end electronic components that require
It becomes possible to stabilize the bonding position on the circuit board and mount it on the circuit board.

According to the fourth aspect of the present invention, after the contact between the electrodes of the electronic component sucked and held by the component holding member and the electrodes of the circuit board with the joining material interposed is detected, the above In the abutting state, the respective joining materials between the respective electrodes are melted by heating, and the timing of releasing the suction holding to the electronic component by the component holding member is set to the joining material as in the conventional local reflow mounting method. Instead of releasing during the melting, the joining material is released after being melted and then cooled and solidified. That is, the electronic component is not mounted by obtaining the self-alignment effect due to the surface tension of the bonding material in the molten state as in the conventional local reflow mounting method, but the electronic component is mounted at the contact position positioned by the component holding member. The components are mounted on the circuit board. As a result, by vacuum breaking blow that occurs when releasing the suction holding of the electronic component by the component holding member,
It is possible to eliminate the displacement of the joining position of the electronic component. Therefore, rather than obtaining the above self-alignment effect,
It is possible to mount an electronic component having a narrow pitch between the electrodes of the electronic component on the circuit board so that the displacement of the bonding position of the electronic component due to the vacuum break blow in the component holding member becomes a problem. Becomes

According to the fifth to eighth aspects of the present invention, the joining material supply method, the joining material constituent material, or the flux supply method used in the conventional electronic component mounting method is applied. Therefore, it is possible to provide a mounting method of electronic components having general versatility.

According to the ninth aspect of the present invention, in addition to the effects of the above-described aspects, the above-mentioned contacting material between the electrodes of the electronic component and the electrodes of the circuit board is interposed. After detecting the contact, it is determined whether or not the expansion amount of the component holding member due to the heating is corrected, and after the cooling of each of the melted joining materials is started, the shrinkage amount of the component holding member due to the cooling. Make a decision to correct the
Depending on the number of each electrode of the electronic component and the bonding accuracy required for the electronic component, both the expansion amount and the contraction amount of the component holding member are corrected, or the expansion amount or the contraction amount is corrected. It is possible to obtain the required bonding quality of the electronic component by performing only one of them or not performing the correction of the elongation amount and the contraction amount.

According to the tenth aspect or the eleventh aspect of the present invention, by performing only one of the correction of the elongation amount or the contraction amount, the required electronic properties can be obtained similarly to the effect of the ninth aspect. It is possible to obtain the joining quality of parts.

According to the twelfth or thirteenth aspect of the present invention, after detecting the contact between the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed,
The load actually generated between the electrodes due to the contact is kept substantially constant, and then when the decrease in the load is detected, it is judged that the welding of the bonding material has started, and the load is kept substantially constant. The control method for maintaining the contact height position of the electronic component with respect to the circuit board at a substantially constant level by changing the control method to the contact height of the electronic component even when the bonding material is melted. The position can be maintained substantially constant. Accordingly, when the joining material is melted, it is possible to prevent the joining material in a molten state from being crushed by lowering the contact height position of the electronic component. It is possible to reliably control the contact height position of the electronic component even during melting.

Further, in the control system for maintaining the load substantially constant, the load is set to be equal to or more than the contact load at the time of contact detection, and the load is maintained substantially constant to maintain the electronic component and the circuit. When the contact between the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed is detected by applying the bonding material to the board, the height of the bonding material may vary. , Even when the contact between the electrodes with the bonding material interposed is not partially performed, by applying the load while maintaining the load substantially constant, The contact property of the bonding material can be enhanced, and the reliability of the bonding between the electronic component and the circuit board can be enhanced.

According to the fourteenth aspect of the present invention, before the electronic component is brought into contact with the circuit board, the supply height of the respective bonding materials previously supplied onto the respective electrodes of the electronic component is adjusted. By performing the leveling operation to make it uniform,
Even if there is a variation in the supply height of the bonding material on the electrodes of the electronic component, this variation can be eliminated and the supply height of the bonding material can be made uniform. Thereby, when the electrodes of the electronic component and the electrodes of the circuit board are in contact with each other with the bonding material interposed, contact load control due to variation in the supply height of the bonding materials is performed. The impact can be eliminated,
The controllability of the contact load can be improved, and the contact load can be applied more evenly to each of the bonding materials. Therefore, each electrode of the electronic component and each electrode of the circuit board can be reliably brought into contact with each other with a more uniform contact load with the joining material interposed, and the joining quality between the electronic component and the circuit board is stabilized. It becomes possible.

According to the fifteenth aspect of the present invention, in the electronic component mounting method for mounting two kinds of electronic components, a first electronic component and a second electronic component, on a circuit board, the second electronic component is the above-mentioned. In the case where it is required to mount the circuit board on the circuit board with a bonding position accuracy higher than that of the first electronic component, the first electronic component is temporarily bonded to the circuit board by the conventional collective reflow mounting method. The first electronic component is mounted by heating the temporarily bonded first electronic component and the circuit board, and then mounting the second electronic component by the electronic component mounting method of each of the aspects. It will be mounted on the circuit board.

As a result, the first electronic component is temporarily joined to the circuit board individually, and then heated to melt the joining material, and the first electronic component is permanently joined to the circuit board. Since it can be mounted and the mounting work can be performed efficiently, the mounting cost of the first electronic component on the circuit board can be suppressed.

At the same time, the second electronic component has a structure in which the electrodes of the second electronic component and the electrodes of the circuit board are contacted with each other with the bonding material interposed therebetween, and after the bonding material is melted, By adsorbing and holding the second electronic component by the component holding member until solidification, a displacement of the joint position between the second electronic component and the circuit board does not occur, and the second electronic component is highly joined to the circuit board. It can be mounted with positional accuracy.

Therefore, it is required in the electronic component mounting method in the case where a plurality of electronic components having different bonding position accuracy such as the first electronic component and the second electronic component are mixedly mounted on a circuit board. By properly using the mounting method of each electronic component according to the bonding position accuracy of each electronic component, it is possible to achieve both productivity and bonding quality.

According to the sixteenth to eighteenth aspects of the present invention, it becomes possible to provide an electronic component mounting apparatus which can obtain the effects of the first to third aspects.

According to the nineteenth aspect of the present invention, it is possible to provide an electronic component mounting apparatus that can obtain the effects of the fourth aspect.

According to the twentieth aspect of the present invention, the electrodes of the electronic component that are suction-held by the suction-holding mechanism of the component-holding member are aligned so that they can be joined to the electrodes of the circuit board. After that, the pressing load that presses the shaft portion of the tip of the component holding member against the load detecting surface of the load detecting unit by the elastic body is detected by the load detecting unit, and the detected pressing load. To the control unit, by setting the pressure load in the control unit as the load zero point in the load detection unit,
Even if the elastic body changes its elasticity characteristics under the influence of heat or the like, and the pressing load by the tip of the component holding member changes in the load detection unit, There is no difference between the actual contact load at the time of contact between the electrodes of the circuit board with each of the bonding materials interposed, and the contact load detection value detected by the load detection unit. The actual contact load can be controlled according to the applied contact load. Therefore, when repeatedly mounting a plurality of electronic components on the circuit board, each electronic component can be always brought into contact with the circuit board under a preset contact load, and the electronic components are bonded to the circuit board. It is possible to stabilize the quality.

According to the twenty-first aspect of the present invention, the respective centers of the suction holding mechanism, the shaft portion, and the load detecting portion of the component holding member are coaxially arranged, and the coaxial is the lifting and lowering mechanism of the component holding member. Since the suction holding mechanism, the shaft portion, and the load detecting portion are arranged in parallel with the lifting operation axis, the lifting operation is performed on the same axis, and further, in the component holding member, at the tip of the component holding member. The end portion of the shaft portion is pressed against the load detection surface of the load detection portion by the elastic body that is attached to the support portion and supports the shaft portion. The load acting in the coaxial direction can be detected, and each electrode of the electronic component and each electrode of the circuit board suction-held by the suction-holding mechanism of the component-holding member interposes each bonding material. When abutting against each other, the end portion of the shaft portion of the end portion of the component holding member is pressed against the load detecting surface of the load detecting portion by the abutting load generated between the abutting load and the abutting load. Can be reliably detected by the load detection unit.

Therefore, by detecting the abutting load in the load detecting section, it is possible to detect the abutting of the electrodes of the electronic component and the electrodes of the circuit board with the bonding materials interposed therebetween. In addition, it is possible to control the actual contact load more accurately so that the component holding member is slightly lowered by the elevating mechanism and the contact load is set in advance. Therefore, when repeatedly mounting a plurality of electronic components on the circuit board, the actual contact load can be accurately controlled so that the contact load is always set in advance, and the circuit of each electronic component can be accurately controlled. The contact position at the time of contact with the substrate can be made more uniform, the pitch between the electrodes of the electronic component can be narrowed, and high-end electronic component that requires high bonding position accuracy to the circuit board is required. It becomes possible to mount such an electronic component on the circuit board by further stabilizing the bonding position on the circuit board.

According to the twenty-second aspect of the present invention, the component holding member further includes a pressurizing mechanism including two pneumatic cylinders having different inner diameters. General-purpose electronic parts that are not used, and when mounting the above-mentioned general-purpose electronic parts on a circuit board, select a pneumatic cylinder with an inner diameter suitable for the working load from the pneumatic cylinders, and By supplying compressed air, the pressure of the supplied compressed air is used to operate the pneumatic cylinder,
The tip of the component holding member is lowered, and each electrode of the general-purpose electronic component suction-held by the suction-holding mechanism can be pressed by each electrode of the circuit board with a bonding material interposed. Therefore, the pneumatic cylinder is operated by the pressure of the compressed air, and the general-purpose electronic component can be mounted at a high mounting speed by the conventional local reflow mounting method.

At the same time, at least one of the two pneumatic cylinders having different inner diameters is provided with a limiting mechanism for limiting the operation of the one cylinder, so that, for example, electronic parts have high joining accuracy. Is a high-end electronic component required to be mounted on the circuit board, the compressed air is supplied to the pneumatic cylinder having the limiting mechanism in each of the pneumatic cylinders, By operating the pressure cylinder, the other pneumatic cylinder is pressed, the operation of the other pneumatic cylinder is restricted, and in this state, the operation of the pneumatic cylinder provided with the restriction mechanism is restricted by the restriction mechanism. By doing so, each operation of the two pneumatic cylinders is restricted, and the component holding member holds the component. Wood tip and the component holding member body, respectively can be the state of integrated structure. Thereby, the component holding member can be in the same structural state as the component holding member in the twenty-first aspect, and similar to the effect in the twenty-first aspect, detection of the contact load in the load detection unit. This makes it possible to detect contact between the electrodes of the high-end electronic component and the electrodes of the circuit board with the bonding materials interposed, and the component holding member is slightly lowered by the elevating mechanism. Thus, the actual contact load can be controlled more accurately so that the contact load is set in advance. Therefore, when repeatedly mounting the plurality of high-end electronic components on the circuit board, the actual contact load can be accurately controlled so that the contact load is always set in advance. The contact position of the electronic component with respect to the circuit board can be made more uniform, the pitch between the electrodes of the electronic component is narrowed, and high accuracy of the bonding position to the circuit board is required. For electronic components such as high-end electronic components, it is possible to mount them on the circuit board by further stabilizing the bonding position on the circuit board.

According to the twenty-third aspect of the present invention, the limiting mechanism is capable of being fitted into the recess of the rod of the pneumatic cylinder provided with the limiting mechanism, the hole of the guide, and the hole through the hole. By including a rod body, by inserting the rod body into the recess through the hole,
With a simpler mechanism, it is possible to mechanically limit the operation of the pneumatic cylinder including the limiting mechanism.

According to the twenty-fourth aspect of the present invention, the component holding member main body is provided with a large cylinder, and the component holding member tip end portion is provided with a small cylinder. It is possible to suppress an increase in weight due to installation of a pneumatic cylinder at the tip of the above-mentioned component holding member supported by the portion, and thereby a smaller contact load can be detected, and the actual contact load can be detected in advance. It is possible to perform control with high controllability so that the contact load is set.

[Brief description of drawings]

FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention.

2A and 2B are diagrams showing a method for mounting an electronic component according to the first embodiment, where FIG. 2A is a sectional view of a circuit board, and FIG.
Is a sectional view of the electronic component and the circuit board in a state where the electronic component is aligned with the circuit board; (c) is a sectional view of the electronic component and the circuit board in a contact state of the electronic component and the circuit board;
(D) is a sectional view of the electronic component and the circuit board in a state where each solder bump of the electronic component and each solder portion of the circuit board are heated and melted, and (e) is an electron in a state where the melted solder is cooled. Sectional drawing of a component and a circuit board, (f) is a sectional view of the circuit board in the state in which the electronic component was mounted.

FIG. 3 is a cross-sectional view of the head tool that schematically shows the structure of the head tool in the electronic component mounting apparatus according to the first embodiment.

FIG. 4 is a flowchart showing a mounting procedure in a mounting method for an electronic component according to the first embodiment.

FIG. 5 is a flowchart showing a procedure for correcting the extension amount and contraction amount of the head tool in the electronic component mounting method according to the first embodiment.

FIG. 6 is a flowchart showing a procedure for performing constant load control of the head tool and tip position control of the suction nozzle in the electronic component mounting method according to the first embodiment.

FIG. 7 is a flowchart showing a contact load control operation procedure by the head tool in the electronic component mounting method according to the first embodiment.

FIG. 8 is a flowchart showing a contact load control operation procedure by the head tool in the electronic component mounting method according to the first embodiment.

FIG. 9 is a vibration operation pattern diagram of a shaping operation by a head tool in the electronic component mounting method according to the first embodiment.

FIG. 10 is a time chart showing each operation of the head tool in the electronic component mounting method according to the first embodiment, (a) is a control height of the head tool, and (b) is a tip height of the suction nozzle. , (C) are time charts showing changes in the temperature of the suction nozzle over time.

FIG. 11 is a control system diagram in the electronic component mounting apparatus according to the first embodiment.

FIG. 12 is a diagram showing a method of mounting an electronic component according to a second embodiment of the present invention, in which (a) is a cross-sectional view of the circuit board in a state where a flux portion is formed on the circuit board;
(B) is a cross-sectional view of the circuit board in a state where the general-purpose electronic components are temporarily joined, (c) is a cross-sectional view of the circuit board in a state in which the general-purpose electronic components temporarily joined to the circuit board are collectively reflowed, (d) [Fig. 4] is a cross-sectional view of a circuit board in a state where general-purpose electronic components are mounted.

FIG. 13 is a diagram showing a method of mounting an electronic component according to the second embodiment, where (e) is a cross-sectional view of the circuit board in a state where a flux portion is formed on the circuit board;
(F) is a cross-sectional view of the high-end electronic component and the circuit board in a state where the high-end electronic component is aligned with the circuit board, and (g) shows the high-end electronic component brought into contact with the circuit board to heat and melt the solder. A sectional view of the circuit board in a state, and (h) is a sectional view of the circuit board in a state where general-purpose electronic components and high-end electronic components are mounted.

FIG. 14 is a cross-sectional view of the head tool that schematically shows the structure of the head tool in the electronic component mounting apparatus according to the third embodiment of the present invention.

FIG. 15 is a cross-sectional view of the head tool that schematically shows the structure of the head tool in the electronic component mounting apparatus according to the third embodiment.

FIG. 16 is an overall perspective view of a dual stage electronic component mounting apparatus that is an electronic component mounting apparatus according to a fourth embodiment of the present invention.

FIG. 17 is an overall perspective view of an electronic component mounting apparatus according to a fifth exemplary embodiment of the present invention.

FIG. 18 is a diagram showing a mounting method for electronic components of a first example of a mounting method for electronic components according to a fifth exemplary embodiment of the present invention.

FIG. 19 is a diagram showing a method of mounting the electronic component of the first example in the method of mounting the electronic component according to the fifth embodiment.

FIG. 20 is a diagram showing a mounting method for electronic components of a third example of the mounting method for electronic components according to the fifth exemplary embodiment of the present invention.

FIG. 21 is a diagram showing a method of mounting the electronic component of the third example in the method of mounting the electronic component according to the fifth embodiment.

FIG. 22 is a diagram showing a method of mounting electronic components by a conventional batch reflow mounting method.

FIG. 23 is a diagram showing a method of mounting electronic components by a conventional local reflow mounting method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Electrode, 1b ... Solder bump, 2 ... Solder part, 3 ... Head tool, 3a ... Head tool tip part,
3b ... Head tool main body part, 4 ... Circuit board, 4A ... Circuit board, 4a ... Pad, 5 ... Parts tray, 5A ... Parts tray, 5B ... Parts tray, 6 ... Slide base, 6
A ... slide base, 6B ... slide base, 7 ... stage, 7A ... stage, 7B ... stage, 8 ... leveling stage, 9 ... control part, 11 ... suction nozzle, 12 ... ceramic heater, 13 ... water jacket, 14 ...
Load cell, 15 ... self-weight offset spring, 16 ... frame, 16a ... upper frame, 16b ... lower frame, 1
6c ... Intermediate frame, 16d ... Hole, 17 ... Shaft, 17a ...
Shaft upper part, 17b ... Shaft lower part, 17c ... Step part, 18 ... Spring receiving part, 19 ... Cooling blow nozzle, 21 ... Elevating part, 2
1A ... Elevating part, 21a ... Ball screw shaft, 21b ... Nut part, 21m ... Motor, 22 ... X direction moving mechanism, 23 ... Y
Directional movement mechanism, 31 ... General-purpose electronic component, 31a ... Electrode, 3
1b ... Solder bump, 32 ... Flux part, 33 ... Tool, 34 ... Circuit board, 34a ... Pad, 34b ... Pad, 35 ... Supply nozzle, 41 ... High-end electronic component, 4
1a ... Electrode, 41b ... Solder bump, 42 ... Flux part, 45 ... Supply nozzle, 51 ... Adsorption nozzle, 52 ... Ceramic heater, 53 ... Water jacket, 54 ... Load cell, 55 ... Self-weight offset spring, 56 ... Frame, 56a ... Upper frame, 56b ... Lower frame, 5
6c ... Intermediate frame, 56d ... Hole, 57 ... Shaft, 57a ...
Shaft upper part, 57b ... Shaft lower part, 57c ... Step part, 58 ... Small cylinder, 59 ... Rod, 60 ... Guide, 61 ... Large cylinder, 62 ... Rod, 62a ... Recessed part, 62b ... Thin neck part, 6
3 ... Guide, 63a ... Hole, 64 ... Stopper, 65 ... Pressurized air supply chamber, 66 ... Pressurized air supply chamber, 67 ... Stopper drive cylinder, 68 ... Spring receiving part, 69A-C ...
Compressed air supply / exhaust unit, 70 ... Cooling blow nozzle, 71 ... High-end electronic component, 72 ... General-purpose electronic component, 73 ... IC chip, 74 ... IC chip supply unit, 75 ... Adsorption reversing unit, 7
6 ... Circuit board supply section, 77 ... Loader, 78 ... Circuit board discharge section, 81 ... Electronic component, 81a ... Electrode, 81b ... Solder bump, 82 ... Solder section, 83 ... Head tool, 84 ... Circuit board, 84a ... Pad , 91 ... Electronic component, 91a ... Electrode, 91b ... Solder bump, 92 ... Solder part, 93 ... Tool, 94 ... Circuit board, 94a ... Pad, 101 ... IC chip, 101a ... Electrode, 101b ... Solder bump, 104
... circuit board, 104a ... pad, 104b ... pad, 1
11 ... Electronic component, 111a ... Electrode, 111b ... Solder bump, 113 ... Ultrasonic tool, 121 ... Electronic component, 121
a ... Electrode, 121b ... Au bump, 122 ... Sealing material, 1
23 ... Ultrasonic tool, 124 ... Circuit board, 124a ... Pad, 124b ... Pad, 124c ... Pad, 131 ...
General-purpose electronic components, 131a ... Electrodes, 131b ... Solder bumps, 133 ... Tools, 141 ... High-end electronic components, 1
41a ... Electrodes, 141b ... Solder bumps, 201 ... Electronic component mounting apparatus, 202 ... Electronic component mounting apparatus, 203 ... Electronic component mounting apparatus.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 13/08 H05K 13/08 N (72) Inventor Makoto Akita 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Incorporated (72) Inventor Satoshi Soda 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Takaharu Mae, 1006 Kadoma, Kadoma City, Osaka (72) Invented Person Minamiya Shozo 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5E313 AA02 AA11 CC02 EE02 EE03 EE24 EE38 FG06 5E319 AA03 AB05 AC01 BB04 CC58 CD51 GG01 5F044 LL05 PP16 PP17 PP19

Claims (24)

[Claims] 1. A plurality of electrodes (1a, 41a, 101a,
141a) electronic component (1, 41, 101, 14)
1) is suction-held by the component holding member (3, 50), and the electrodes (1a, 41a, 101a, 141a) of the electronic component (1, 41, 101, 141) and the circuit board (4, 34, 104). , 124) of the plurality of electrodes (4a, 3
4b, 104a, 124c) and the bonding material (1b, 2, 4
1b, 101b, 141b) so that they can be joined so that they can be joined, and the component holding members (3, 50) are lowered while holding the electronic components (1, 41, 101, 141) by suction, The electronic component (1, 41, 101, 141) with the material (1b, 2, 41b, 101b, 141b) interposed
The contact between the electrodes (1a, 41a, 101a, 141a) and the electrodes (4a, 34b, 104a, 124c) of the circuit board (4, 34, 104, 124) is detected, and the contact is detected. After the detection of the above, the bonding material (1b, 2, 41b,
101b, 141b) is heated to be melted, and is cooled to be solidified. 2. The electronic component (1,
41, 101, 141), the electrodes (1a, 41a,
101a, 141a) and the circuit boards (4, 34, 10)
4, 124) each of the electrodes (4a, 34b, 104a,
124c) and the above bonding material (1b, 2, 41b, 101)
b, 141b), the load actually generated at the time of contact exceeds the contact load expected to be generated at the time of contact, which is detected by the electronic component according to claim 1. How to implement. 3. The electronic component (1,
41, 101, 141), the electrodes (1a, 41a,
101a, 141a) and the circuit boards (4, 34, 10)
4, 124) each of the electrodes (4a, 34b, 104a,
124c) and the above bonding material (1b, 2, 41b, 101)
b, 141b), the component holding members (3, 50) are controlled to be slightly lowered according to the load actually generated at the time of contact, and the load actually generated at the time of contact is The mounting method of the electronic component according to claim 1, wherein the mounting is detected by being controlled so as to exceed a contact load expected to occur at the time of contact. 4. The bonding material (1b, 2, 41b, 101)
b, 141b), the above component holding members (3, 5) are solidified.
0) the above electronic components (1, 41, 101, 141)
The electronic component mounting method according to claim 1, wherein the suction holding to the electronic component is released. 5. The bonding material (1b, 2, 41b, 101)
b, 141b) are the electronic components (1, 41, 101,
141), the electrodes (1a, 41a, 101a, 14)
1a) or the circuit board (4, 34, 104, 12)
4) Each of the electrodes (4a, 34b, 104a, 124)
The electronic component mounting method according to any one of claims 1 to 4, which is supplied in advance to at least one of c). 6. The bonding material (1b, 2, 41b, 101)
6. The electronic component mounting method according to claim 1, wherein b, 141 b) is solder. 7. The electronic component (1, 41, 101, 14)
1) Each of the electrodes (1a, 41a, 101a, 141)
a) or on the circuit board (4, 34, 104, 12)
4) Each of the electrodes (4a, 34b, 104a, 124)
c) on or above the bonding material (1b, 2, 41b, 101)
b, 141b) is preliminarily supplied with a flux, The method for mounting an electronic component according to any one of claims 1 to 6. 8. The bonding material (1b, 2, 41b, 101)
b, 141b) is the electronic component (1, 41, 101,
141) each electrode (1a, 41a, 101a, 141
Solder bumps (1b, 41b, 101) formed on a)
b, 141b) or the electronic component (1, 41, 10)
1, 141) each electrode (1a, 41a, 101a,
141a) solder bumps (1b, 41b, 1)
01b, 141b) and the solder portion (2) formed on each of the electrodes (4a) of the circuit board (4), the method for mounting an electronic component according to any one of claims 1 to 4 or 7. 9. The electrodes (1) of the electronic component (1).
The amount of expansion of the component holding member (3) due to the heating is detected by detecting the contact between the a) and the electrodes (4a) of the circuit board (4) with the bonding materials (1b, 2) interposed. When performing the correction of the expansion amount of the component holding member (3), it is determined based on the change data of the expansion amount of the component holding member (3) due to the heating. While raising the component holding member (3), each bonding material (1b, 2) between each electrode (1a) of the electronic component (1) and each electrode (4a) of the circuit board (4) is removed. When the component holding member (3) is melted by the heating but the elongation amount of the component holding member (3) is not corrected, the electrodes (1a) of the electronic component (1) and the electrodes (1a) of the circuit board (4) ( 4a) bonding material (1
b), 2) is melted by heating, and after the cooling of the melted joining material (1b, 2) is started, it is determined whether or not the shrinkage amount of the component holding member (3) is corrected by the cooling. When performing the correction of the shrinkage amount of the component holding member (3), while lowering the component holding member (3) based on the shrinkage amount change data of the component holding member (3) due to the cooling. , Each bonding material (1b, 2) between each electrode (1a) of the electronic component (1) and each electrode (4a) of the circuit board (4) is solidified by the cooling, while holding the component. When the correction of the shrinkage amount of the member (3) is not performed, the bonding material (1b, between the electrodes (1a) of the electronic component (1) and the electrodes (4a) of the circuit board (4),
The method of mounting an electronic component according to claim 1, wherein 2) is solidified by cooling. 10. The electrodes (1) of the electronic component (1).
The amount of expansion of the component holding member (3) due to the heating is detected by detecting the contact between the a) and the electrodes (4a) of the circuit board (4) with the bonding materials (1b, 2) interposed. Each joining material between each electrode (1a) of the electronic component (1) and each electrode (4a) of the circuit board (4) while raising the component holding member (3) based on the change data. (1
9. The electronic component mounting method according to claim 1, wherein b) and 2) are melted by the heating. 11. After the cooling of the melted joining materials (1b, 2) is started, the component holding member (3) is lowered based on the shrinkage amount change data of the component holding member (3) due to the cooling. However, each bonding material (1) between each electrode (1a) of the electronic component (1) and each electrode (4a) of the circuit board (4).
9. The electronic component mounting method according to claim 1, wherein b) and 2) are solidified by the cooling. 12. The electrodes (1) of the electronic component (1).
After the contact between the electrode (a) and the electrodes (4a) of the circuit board (4) with the bonding material (1b, 2) interposed, the contact causes a gap between the electrodes (1a, 4a). The load actually generated in the circuit is kept substantially constant, and after the melting of the bonding material (1b, 2) by heating is started, the maintenance of the load actually generated is released, and the circuit of the electronic component (1) is released. The electronic component mounting method according to any one of claims 1 to 11, wherein the contact height position with respect to the substrate (4) is maintained substantially constant. 13. The electrodes (1a, 4) due to the contact.
The mounting method for an electronic component according to claim 12, wherein when the decrease of the load generated during a) is detected, the melting of the bonding material (1b, 2) is started. 14. The bonding material (1b), which is previously supplied onto each of the electrodes (1a) of the electronic component (1) after the electronic component (1) is suction-held by the component holding member (3). After making the supply height of 2) uniform, the above-mentioned electronic parts are arranged so that the electrodes (1a) of the electronic parts (1) and the electrodes (4a) of the circuit board (4) can be joined. The electronic component mounting method according to any one of claims 1 to 13, wherein (1) and the circuit board (4) are aligned with each other. 15. An electronic component mounting method for mounting two types of electronic components, a first electronic component (31) and a second electronic component (41), on a circuit board (34), said second electronic component (41). ) Is a case where it is required to be mounted on the circuit board (34) with a bonding position accuracy higher than that of the first electronic component (31), and the first electronic component (31) is attached to the component holding member ( 33) is adsorbed and held by 33), and the plurality of electrodes (31a) of the first electronic component (31) and the plurality of electrodes (34a) of the circuit board (34) can be joined via a joining material (31b). Alignment, and the component holding member (33) is lowered while the first electronic component (31) is suction-held, and the first electronic component (3
1) The electrodes (31a) of the circuit board (34) and the electrodes (34a) of the circuit board (34) are pressed together with the bonding material (31b) interposed therebetween to perform temporary bonding, and then the temporary bonding is performed. The electrodes (31a) of the first electronic component (31) and the electrodes (3 of the circuit board (34).
4a), the bonding material (31b) is heated and melted, and then cooled and solidified to perform main bonding, and the electrodes (31a) of the first electronic component (31) and the circuit board. The respective electrodes (34a) of (34) are mounted with the bonding material (31b) interposed, and then the second electronic component (41) is used as the electronic component according to claim 1, and the second electronic component is used. The circuit board (34) having a plurality of electrodes (34b) capable of being joined to the respective electrodes (41a) of the component (41) and having the first electronic component (31) mounted thereon. 15. The mounting method for an electronic component according to any one of 1 to 14. 16. Electronic components (1, 41, 101, 14)
1) is suction-held by the component holding member (3, 50), and the plurality of electrodes (1) of the electronic component (1, 41, 101, 141) are held.
a, 41a, 101a, 141a) and the circuit board (4, 3)
4, 104, 124) multiple electrodes (4a, 34b, 1
04a, 124c) to the bonding material (1b, 2, 41b, 10
1b, 141b) so as to be in contact with each other, and the bonding material (1b, 2, 41b, 101b, 141b) is heated and melted, and the electronic component (1, 41, 101, 141).
Each of the electrodes (1a, 41a, 101a, 141a) and each of the electrodes (4a, 34b, 104a, 124c) of the circuit board (4, 34, 104, 124) of the bonding material (1b, 2, 41b, 101b, 141b) and an electronic component mounting apparatus for joining the electronic components (1, 4) to the component holding member (3, 50).
Suction holding mechanism (11, 51) for sucking and holding 1, 101, 141), lifting mechanism (21) for lowering or raising the component holding member (3, 50), and the suction holding mechanism (11, 51) The electronic component (1, 41, 101, 141) is sucked and held by the electronic component (1, 41, 101, 141), and the electronic component (1, 41, 101, 141) is lowered by the elevating mechanism (21).
Of the electrodes (1a, 41a, 101a, 141a) and the electrodes (4a, 34b, 104a, 124c) of the circuit board (4, 34, 104, 124) on the bonding material (1b, 2, 41b). , 101b, 141b), the electronic parts (1, 41, 10)
1, 141) each electrode (1a, 41a, 101a,
141a) and the circuit board (4, 34, 104, 12)
4) Each of the electrodes (4a, 34b, 104a, 124)
load detection unit (1) for detecting the contact load generated during c)
4, 54) and the above bonding material (1b, 2, 41b, 101b, 141b)
And a cooling mechanism (19, 70) for cooling the bonding material (1b, 2, 41b, 101b, 141b) heated by the heating mechanism (12, 52). The suction holding mechanism (11, 51), the lifting mechanism (2
1), the load detection unit (14, 54), the heating mechanism (12, 52), and the control unit (9) for controlling the cooling mechanism (19, 70) are provided, and the control unit (9) includes , The heating mechanism (12, 54) after the contact load is detected by the load detection unit (14, 54).
52) by heating with the above bonding material (1b, 2, 41)
b, 101b, 141b) is melted, and then the bonding material (1b, 2, 4) is cooled by the cooling mechanism (19, 70).
1b, 101b, 141b) to be solidified by cooling, and the electrodes (1a, 41a, 101a, 141a) of the electronic component (1, 41, 101, 141) and the circuit board (4, 34, 104). , 124) each of the electrodes (4
a, 34b, 104a, 124c) the above bonding material (1
b, 2, 41b, 101b, 141b) and the above-mentioned joining materials (1b, 2, 41b, 101b, 1).
41b) is melted until the load detection unit (14,
54) An electronic component mounting apparatus, which is configured to control the raising / lowering operation of the component holding member (3, 50) by the raising / lowering mechanism (21) according to the contact load detected by 54). 17. The contact load is detected by the electrodes (1a, 4a) of the electronic component (1, 41, 101, 141) detected by the load detector (14, 54).
1a, 101a, 141a) and the circuit board (4, 3)
4, 104, 124) and the electrodes (4a, 34b, 1)
04a, 124c) and the above bonding material (1b, 2, 41)
b, 101b, 141b), the load actually generated at the time of contact exceeds the contact load predicted to be generated at the time of contact, and is detected by the control unit (9). 16. An electronic component mounting apparatus according to item 16. 18. The contact load is detected by the electrodes (1a, 4a) of the electronic component (1, 41, 101, 141) detected by the load detector (14, 54).
1a, 101a, 141a) and the circuit board (4, 3)
4, 104, 124) and the electrodes (4a, 34b, 1)
04a, 124c) and the above bonding material (1b, 2, 41)
b, 101b, 141b), the component holding members (3, 50) are slightly moved downward by the elevating mechanism (21) according to the load actually generated at the time of contact.
The electronic component mounting apparatus according to claim 16 or 17, wherein the load actually generated at the time of contact exceeds the contact load predicted to be generated at the time of contact and is detected by the control unit (9). . 19. The control section (9) is configured so that the bonding material (1b, 2, 41b) formed by the heating mechanism (12, 52),
101b, 141b) also during the melting of the adsorption holding mechanism (1
1, 51) maintains the suction holding of the electronic component (1, 41, 101, 141) to the component holding member (3, 50), and the bonding material (1b, 1b by the cooling mechanism (19, 70). 2, 41b, 101b, 141b) after solidification by cooling, the electronic component (1, 1, 50) to the component holding member (3, 50) by the suction holding mechanism (11, 51).
41, 101, 141) is an electronic component mounting apparatus according to any one of claims 16 to 18, which is controlled so as to release the suction holding. 20. The electronic component (1, 41, 101, 1)
41) each of the electrodes (1a, 41a, 101a, 141)
a) and the electrodes (4a, 34b, 104a, 124c) of the circuit board (4, 34, 104, 124) with the bonding material (1b, 2, 41b, 101b, 141b) interposed therebetween After matching, the electronic parts (1, 4)
1, 101, 141) until the component holding member (3, 50) sucking and holding the load is detected, the control unit (9) detects the load detected by the load detection unit (14, 54). The load detection unit (14, 5)
20. The load zero point in 4) is set as the load zero point.
An electronic component mounting apparatus according to any one of 1. 21. An electronic component (1, 41) is attracted and held by a component holding member (3), and a plurality of electrodes (1a, 41a) of the electronic component (1, 41) and a circuit board (4, 34) are attached. Joining material (1b, 2, 41b) with a plurality of electrodes (4a, 34b)
And abut on each other, and the bonding material (1b, 2, 41
b) is heated and melted, and the electrodes (1a, 41a) of the electronic component (1, 41) and the circuit board (4, 3) are melted.
4) The electrodes (4a, 34b) of 4) are connected to the bonding material (1
(b, 2, 41b), and an electronic component mounting apparatus for bonding the electronic component (1, 41) to the component holding member (3) by suction. The electronic component (1, 4) is constituted by an elevating mechanism (21) for lowering or raising the member (3) and the suction holding mechanism (11).
The component holding member (3) that holds the electronic component (1) by suction is lowered by the lifting mechanism (21), and the electronic components (1, 4) are
At the time of contact between the electrodes (1a, 41a) of 1) and the electrodes (4a, 34b) on the circuit board (4, 34) with the bonding material (1b, 2, 41b) interposed therebetween. , The electrodes (1a, 4) of the electronic component (1, 41)
1a) and the electrodes (4) of the circuit board (4, 34).
a, 34b), a load detection unit (14) for detecting a contact load, a heating mechanism (12) for heating the bonding material (1b, 2, 41b), and the heating mechanism (12). The heated bonding material (1
b, 2, 41b) is provided with a cooling mechanism (19), and in the component holding member (3), the component holding member (3) is a tip of the component holding member (3).
a) and a component holding member main body portion (3b), the component holding member distal end portion (3a) includes the suction holding mechanism (11), the heating mechanism (12), the cooling mechanism (19), and And a support part (16) for supporting the tip part (3a) of the component holding member, and the load attached to the support part (16). A detection part (14), the suction holding mechanism (11), the heating mechanism (12), the shaft part (17), and the load detection part (14) are coaxially arranged at their respective centers. The coaxial is the lifting mechanism (2
1) is arranged in parallel with the vertical movement axis of the component holding member (3), and the load detection unit (14) has an end portion of the shaft portion (17) in the component holding member distal end portion (3a). By being pressed against the load detection surface of the load detection part (14) by the elastic body (15) attached to the support part (16) and supporting the shaft part (17), the load detection part (1)
4) The electronic component mounting apparatus is characterized in that the load acting in the coaxial direction of the tip portion (3a) of the component holding member can be detected. 22. The component holding member (50) further comprises a pressurizing mechanism for pressurizing the electronic component (1) onto the circuit board (4), the pressurizing mechanism comprising two pneumatic cylinders having different inner diameters. (5
8, 61), one of the pneumatic cylinders (58, 61) is provided in the component holding member main body (50b), and another pneumatic cylinder is provided at the tip of the component holding member. Division (50
a pneumatic cylinder having an inner diameter suitable for the abutting load is selected from the pneumatic cylinders (58, 61) and is operated, whereby the tip of the component holding member (50a) is moved. Each of the electrodes (1a) of the electronic component (1) lowered on the same axis and suction-held by the suction-holding mechanism (51).
The component holding member is configured so as to have a pressurizing function of pressurizing the electrodes (4a) of the circuit board (4) by interposing the bonding materials (1b, 2) therebetween. At least one pneumatic cylinder of the pressure cylinders (58, 61) includes a limiting mechanism that mechanically limits the operation of the one pneumatic cylinder, and the limiting mechanism is a pneumatic cylinder including the limiting mechanism. By restricting the operation of the pneumatic cylinder having the limiting mechanism while pressing the pneumatic cylinder not having the limiting mechanism to limit the operation of the pneumatic cylinder not having the limiting mechanism, Cylinder (58, 61)
22. The electronic component mounting apparatus according to claim 21, wherein the operation of the component holding member (50) is limited, and the pressing function of the component holding member (50) is limited. 23. A cylindrical guide (63) and a cylindrical rod (62) arranged inside the guide (63).
The restricting mechanism provided in the pneumatic cylinder (61) having the above-mentioned structure includes a groove-shaped recess (62a) formed on the outer periphery of the cylindrical side surface of the rod (62) and the guide (63). The rod (6
2) The hole (63a) formed at a position that can be matched with the recess (62a) and the hole (63a) of the guide (63) are penetrated to the recess (62a) of the rod (62). A rod body (64) that can be fitted inside, and in the limiting mechanism, the rod body is provided with the guide (63).
The air cylinder (61) by penetrating the hole (63a) of the guide (63) from the outside of the and inserting the rod body (64) into the inside of the recess (62a) of the rod (62). 23. The electronic component mounting apparatus according to claim 22, wherein the operation of the electronic component is restricted. 24. Of the two pneumatic cylinders having different inner diameters in the pressurizing mechanism, a large cylinder (61) having a larger inner diameter is provided in the component holding member main body portion (50b), and a small inner diameter is provided. A small cylinder (58) is provided at the tip (50a) of the component holding member, and the centers of the large cylinder (61) and the small cylinder (58) are arranged coaxially with each other. ) Is provided with the limiting mechanism, and in the component holding member main body portion (50b), the guide (63) of the large cylinder (61) is the support portion (56).
Of the large cylinder (61), the rod (62) of the large cylinder (61) is attached to the load detection part (54), and at the tip of the component holding member (50a), the guide (58) of the small cylinder (58). 60) is attached to the end portion of the shaft portion (57), and the rod (59) of the small cylinder (58) can contact the load detection surface of the load detection portion (54). Item 22. The electronic component mounting apparatus according to Item 22 or 23.