JP2003031423A - Laminated chip component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated chip component which prevents connection failure of lead electrodes formed on a plane approximately perpendicular to the laminating direction and improves the flection strength and bending strength at mounting. SOLUTION: The laminated chip component 9 has lead electrodes for connecting laminated inner electrodes 13, 14 to outer electrodes. The lead electrodes 11, 12 are formed on two inner planes approximately perpendicular to the laminating direction and drawn onto outer planes approximately parallel to the laminating direction. Outside electrodes 11a, 11c, 12a, 12c of the lead electrodes 11, 12 drawn onto the outer planes 1-4 are formed with a narrow width and inner electrodes 11b, 11d, 12b, 12d on the inner planes are formed with a wide width at positions inward away from the outer planes 1-4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component having a laminated structure in which internal electrodes are laminated, and more particularly to a laminated chip component having an extraction electrode formed on a plane substantially orthogonal to the laminating direction.

[0002]

2. Description of the Related Art Conventionally, in a so-called vertical winding type laminated coil in which a coil is formed in the stacking direction, the structure of an extraction electrode for connecting an internal electrode and an external electrode is perpendicular to the stacking direction as shown in FIG. A strip-shaped extraction electrode 51 in which an electrode is extracted in one direction of a plane is known. However, in such a structure, connection failure is likely to occur due to electrode contraction during firing, and in order to increase the electrode withdrawal width in order to reduce such a problem, an external portion perpendicular to the stacking direction as shown in FIG. 9A is used. An extraction electrode structure in which triangular extraction electrodes 52 are formed at the corners of the flat surfaces 61 and 62, or an L-shaped extraction electrode 53 is formed over substantially the entire width of the outer flat surfaces 61 and 62 as shown in FIG. It is known (see Japanese Patent Laid-Open No. 11-162737).

However, the extraction electrode itself is a non-adhesive portion in the laminated structure, and as shown in FIGS. 9 (a) and 9 (b),
If the circumference of the entire electrode exposed and exposed to the external plane becomes too long, the non-adhesive area will increase in the external plane, and the bending strength and bending strength during chip mounting will decrease. There was a problem that the electrode part of (1) became a starting point of crack generation and tended to be easily broken.

[0004]

SUMMARY OF THE INVENTION In view of the problems of the prior art as described above, the present invention prevents the connection failure in the extraction electrode formed on the plane substantially orthogonal to the stacking direction, and prevents the bending strength and the resistance during mounting. It is an object of the present invention to provide a laminated chip part capable of improving folding strength.

[0005]

In order to achieve the above object, a laminated chip component according to the present invention has at least two lead electrodes for connecting an external electrode and a laminated internal electrode which are substantially orthogonal to the laminating direction. A multilayer chip component formed on two internal planes and drawn out to an external plane substantially parallel to the stacking direction, wherein the extraction electrodes are drawn out to the external planes at positions displaced inward from the external planes in the internal planes. It is characterized in that it is formed wider than the outer surface electrode portion.

According to this laminated chip component, since the outer surface electrode portion that is pulled out and exposed to the outer flat surface is configured to have a relatively narrow width, the peripheral length of the outer surface electrode portion on the outer flat surface does not become too long and the laminated structure is obtained. The non-adhered portion in the area is reduced and adhered, and the flexural strength and bending strength during mounting are improved as compared with the conventional structure. Further, since the extraction electrode is relatively wide at the position where the extraction electrode enters the inside from the external plane, it is possible to prevent connection failure, and it is possible to reliably connect the internal electrode and the external electrode by the extraction electrode.

Further, it is preferable that the lead-out electrodes formed on the at least two inner planes are led out on different outer planes so that the outer surface electrode portions are located at symmetrical positions. As a result, it is possible to avoid the occurrence of a difference in electrical characteristics due to a difference in mounting direction when mounting the laminated chip component.

Further, it is preferable that each of the extraction electrodes has a plurality of the outer surface electrode portions, and each of the outer surface electrode portions is extracted to a plurality of different outer planes. This allows
Occurrence of connection failure can be further reduced, and the extraction electrode can be more reliably connected to the external electrode.

Further, the external electrode is formed on an external plane portion where the external electrode portion is formed and an end surface which is substantially orthogonal to the external plane.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, laminated chip parts according to embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing each electrode for explaining the manufacturing process of the laminated chip part according to the present embodiment, FIG. 2 is a flow chart showing the manufacturing process of FIG. 1, and FIG. 2 is a perspective view showing a laminated body of laminated chip components manufactured by the manufacturing process of FIG. 2, and FIG. 4 is a perspective view showing a laminated chip component completed by forming external electrodes on the laminated body of FIG.

In the multilayer chip component 9 shown in FIG. 4, a large number of internal electrodes are stacked in the stacking direction m in the figure to form a coil portion in a winding shape, and then the external electrodes 7, 6 are formed on both end surfaces 5, 6 of FIG. It is a small chip component having a laminated structure in which 8 is formed to have a rectangular parallelepiped shape as a whole, and is mounted on a printed circuit board or the like of an electronic device or the like. Inside the laminated chip component 9, a coil portion having a coil center in the laminating direction m is formed.

The internal structure will be described with reference to FIGS. 1 and 2 and the manufacturing process of the layered chip component 9 of FIG. First, as shown in FIG. 1A, the first extraction electrode 1
In order to form No. 1, silver paste is applied on the flat surface of the ferrite plate 10 by a known printing method (S01). The ferrite plate is relatively wide, and many patterns similar to those of FIG. 1A are formed, and a plurality of patterns are laminated on each pattern as described later.

As shown in FIG. 1A, the above-mentioned first extraction electrode 11 has external planes 1 to 4 parallel to the laminating direction m of the completed laminated chip component 9 as shown in FIGS. Of the outer surface electrode portion 11a formed in a narrow band so as to be drawn out and exposed to the outer flat surface 4 of the inner surface, and wider than the outer surface electrode portion 11a at a position displaced toward the inner surface side along the width direction of the outer flat surface 4. The inner surface electrode portion 11b formed on the outer surface and the outer surface electrode portion 11 formed in a narrow strip shape so as to be drawn out and exposed on the outer flat surface 3.
c and an inner surface electrode portion 11d that is wider than the outer surface electrode portion 11c at a position displaced inward along the width direction of the outer flat surface 3 are integrally provided.

Next, a ferrite paste is applied by a printing method to the right half surface of the drawing of the ferrite plate 10 on which the first extraction electrode 11 of FIG. 1 (a) is applied (S02), and then, thereon.
As shown in FIG. 1B, silver paste is applied to form a pattern 13 for a half turn forming a coil portion (S
03). At this time, one end portion 13a of the pattern 13 is shown in FIG.
It is applied so as to be connected to one end portion 11e of the inner surface electrode portion 11b of the first extraction electrode 11 of (a).

Next, a ferrite paste is applied by a printing method to the left half surface of FIG. 1 (b) on which the pattern 13 for the above-mentioned half turn is applied (S02), and then on top of that, FIG. 1 (c).
As described above, the silver paste is applied by the printing method to form the pattern 14 for another half turn forming the coil portion (S03). At this time, one end portion 14 of the pattern 14
It is applied so that a is connected to the other end 13b of the pattern 13 of FIG. 1 (b). Pattern 1 formed in this way
3 and the pattern 14 form one turn (one winding) of the coil portion.

As described above, the steps of applying the ferrite paste and the silver paste for forming the coil portion (S02, S03) are repeated until the coil portion having a predetermined number of turns is formed (S04), and the coil portion is formed. Are stacked in the stacking direction m shown in FIGS. 3 and 4 (the direction perpendicular to the paper surface of FIG. 1).

Next, a ferrite paste is printed on the right half surface of FIG. 1 (c) in which the uppermost layer pattern similar to the pattern 14 of FIG. 1 (c) of the coil portion formed as described above is applied. Method (S05), and then,
As shown in FIG. 1D, silver paste is applied by a printing method to form the second extraction electrode 12 (S06).

As shown in FIG. 1D, the above-mentioned second extraction electrode 12 has the same structure as the first extraction electrode 11,
As shown in FIGS. 3 and 4, the outer surface electrode portion 12a is formed in a narrow strip shape so as to be drawn out and exposed to the outer flat surface 1 of the outer flat surfaces 1 to 4, and the inner surface along the width direction of the outer flat surface 1. The inner surface electrode portion 12b formed to be wider than the outer surface electrode portion 12a at a position displaced to the side, the outer surface electrode portion 12c formed in a narrow band so as to be drawn out to the outer surface 2 and exposed, and the outer surface 2 The inner surface electrode portion 11d, which is formed wider than the outer surface electrode portion 11c, is integrally provided at a position displaced toward the inner surface side along the width direction.

When the above-mentioned silver paste is applied (S06), the second
The one end 12e of the inner electrode portion 12b of the extraction electrode 12 is applied so as to be connected to one end of the uppermost layer pattern similar to the one end 14b of the pattern 14 of FIG.

As shown in FIG. 1 (d), the above-mentioned second extraction electrode 12 is formed in a shape substantially symmetrical to the first extraction electrode 11 of FIG. 1 (a) with respect to the diagonal line c, and the outer surface electrode portion 11a.
And 12c are respectively formed on the outer planes 4 and 2 which are parallel to each other and are located symmetrically on the plane of FIG.
1c and 12a are respectively formed on outer planes 3 and 1 which are parallel to each other, and are located symmetrically on the plane of FIG.

Next, a ferrite paste is applied to the entire surface on which the second lead electrode 12 is formed (S0
7), cut along the broken line of the quadrangle of FIG. 1 (S08),
Baking is performed at a temperature of about 900 ° C. (S09).

As described above, the pair of extraction electrodes 11, 1
2 and the coil portion are laminated to form a rectangular parallelepiped laminated body 9 ′ as shown in FIG. 3. Next, the end surface 5 of the laminated body 9 ′ of FIG. The outer surface electrode portions 12a and 12c of the extraction electrode 12 are soaked and dried (S10), and then the end surface 6 of the laminated body 9'is made a lower surface and the outer surface electrode portion 11a of the first extraction electrode 11 is immersed in the silver paste solution. 1
It is dipped to a level of 1c and dried (S11).

Next, firing is performed at a temperature of about 900 ° C. (S
12) As a result, as shown in FIG. 4, a laminated chip component 9 is obtained in which the first external electrode 7 and the second external electrode 8 are formed on the end surfaces 5 and 6, respectively, and the size of the finished product is
For example, width 0.8 x width 0.8 x length 1.6 (mm).

In the laminated chip component 9 obtained as described above, both ends of the conductor of the coil portion are drawn out to the external planes 1 to 4 perpendicular to the chip stacking direction m by the extraction electrodes 11 and 12, as shown in FIG. , Their outer surface electrode portions 11a, 11c, 1
2a, 12c and the external electrodes 7, 8 are connected as shown in FIG. 4 to form a chip component. As a result, a chip component having a so-called vertical winding type laminated structure can be obtained, and a coil chip component compatible with high frequency can be obtained.

Further, in FIG. 1A, the width a (the linear width exposed on the outer flat surfaces 4 and 3) of the outer surface electrode portions 11a and 11c of the first extraction electrode 11 is 100 to 15 after firing.
Within the range of 0 μm, the amount b of displacement of the inner surface electrode portions 11b and 11d from the outer flat surfaces 4 and 3 is 100 after firing.
˜150 μm. In addition, the second extraction electrode 1
The same applies to 2.

As described above, according to the laminated chip component of the present embodiment, as compared with the conventional structure, in the extraction electrode formed in one direction of the plane perpendicular to the lamination direction as shown in FIG.
When the chip component is fired, the volume of the extraction electrode itself is small, which may cause a connection failure in which the extraction electrode contracts and is drawn in. When the extraction width of the extraction electrode is increased as shown in FIG. Although there is a problem that the bending strength and the bending strength at the time of chip mounting are reduced due to the reduction of the contact area between the chip base materials in the vicinity of the plane, the structure shown in FIGS. , The relatively narrow outer surface electrode part does not impair the adhesion between the chip base materials in the vicinity of the outer flat surface of the extraction electrode, and the bending strength and bending strength during chip mounting are improved as compared with the conventional one. By securing the electrode volume with the wide inner electrode portion, it is possible to prevent the connection failure due to the contraction and drawing of the extraction electrode.

Further, by setting the extraction directions of the extraction electrodes to two directions as shown in FIG. 1, it is possible to further reduce the occurrence of connection failure of the extraction electrodes. In addition, the input terminals and the output terminals of the laminated chip component are formed as the extraction electrodes 11 and 12 above and below in the stacking direction, respectively. Since the position patterns of the outer surface electrode portions of the extraction electrodes are configured so as to be symmetrical with each other, it is possible to avoid the occurrence of characteristic differences due to the difference in the mounting direction when mounting the laminated chip component 9.
preferable.

Next, a modified example of the extraction electrode will be described with reference to FIGS. In the example of FIG. 5, one outer surface electrode portion is provided and is drawn out in one direction, and similarly to FIG. 1, silver paste and ferrite paste are repeatedly applied by a printing method. That is, as shown in FIG. 5A, the extraction electrode 2
1 is formed on the plane of the ferrite plate. The extraction electrode 21 has an outer surface electrode portion 21a formed in a narrow strip shape so as to be extracted and exposed on the outer plane 1 of FIG. The outer electrode portion 1 is placed opposite to the inner surface along the direction.
The inner surface electrode portion 12b formed wider than 2a is integrally provided.

Next, as shown in FIGS. 5 (b), 5 (c) and 5 (d), a pattern 2 for half a turn for forming a coil portion is formed.
3 and 24 are laminated so as to have a predetermined number of turns, a pattern 25 is formed on the uppermost surface, and then a second lead electrode portion 22 as shown in FIG. 5E is formed. Extraction electrode 22
Is an outer surface electrode portion 22a formed in a narrow strip shape so as to be drawn out and exposed to the outer flat surface 3 in FIG. 3, and an outer surface electrode portion 22a that is offset to the inner surface side along the width direction of the outer flat surface 3.
The inner surface electrode portion 22b formed wider than that is integrally provided.

According to the configuration of FIG. 5, the same effects as those of FIGS. 1 to 4 can be obtained, and since the extraction electrode is configured to be drawn out in one direction, the extraction electrode structure is simplified.

Next, different modified examples will be described with reference to FIGS. The example of FIG. 6 has three outer surface electrode parts and is drawn out in three directions. The extraction electrode 31 is formed into a narrow strip shape so as to be extracted and exposed on the outer flat surfaces 1, 2, and 3 of FIG. 3, respectively. The formed outer surface electrode portions 31a, 31c, 3
1e and the outer surface electrode portions 31a, 31c, 31 on opposite sides of the outer surfaces 1, 2 and 3 which are displaced inward along the width direction.
inner electrode portions 31b, 31d formed wider than e.
31f and 31f are integrally provided.

According to the configuration of FIG. 6, the same effects as those of FIGS. 1 to 4 can be obtained, and since the extraction electrode configuration is drawn out in three directions, the occurrence of connection failure of the extraction electrodes is further reduced. It becomes possible. The other extraction electrode is formed such that the outer surface electrode portion corresponding to the outer surface electrode portion 31c is drawn out to the outer flat surface 4 and is exposed, and are arranged at symmetrical positions.

Further, the example of FIG. 7 has four outer surface electrode parts and is drawn out in four directions. The extraction electrode 41 is extracted and exposed on the outer planes 1, 2, 3 and 4 of FIG. 3, respectively. The outer surface electrode portion 41a formed in a narrow strip shape,
41c, 41e, 41g and the outer surface electrode portion 41 in a pair opposite to the inner surface side along the width direction of the outer flat surfaces 1 to 4, respectively.
The inner surface electrode parts 41b, 41d, 41f, 41h formed wider than a, 41c, 41e, 41g are integrally provided. The inner surface electrode portions 41b, 41d, 41f, 41h are formed in a ring shape as a whole.

According to the structure of FIG. 7, the same effects as those of FIGS. 1 to 4 can be obtained, and since the extraction electrode structure is drawn out in four directions, the occurrence of connection failure of the extraction electrode is further reduced. It becomes possible. The layered chip component having the extraction electrode structure of FIGS. 6 and 7 can be manufactured by the printing method as in FIGS. 1 to 4.

Although the present invention has been described above with reference to the embodiments, the present invention is not limited to these.
Various modifications are possible within the scope of the technical idea of the present invention. For example, in the present embodiment, the base body of the laminated chip component is a magnetic body, but it may be a dielectric body, and the manufacturing method may be not only a printing method but also a sheet method.

[0037]

According to the laminated chip component of the present invention, it is possible to prevent defective connection in the lead electrode formed on the plane substantially orthogonal to the laminating direction and to improve the flexural strength and bending strength during mounting.

[Brief description of drawings]

FIG. 1 is a plan view showing each electrode for explaining manufacturing steps (a) to (d) of a laminated chip part according to the present embodiment.

2 is a flowchart showing the manufacturing process of FIG. 1. FIG.

FIG. 3 is a perspective view showing a laminated body of a laminated chip component manufactured by the manufacturing process of FIGS. 1 and 2.

FIG. 4 is a perspective view showing a laminated chip component completed by forming external electrodes on the laminated body of FIG.

FIG. 5 is a plan view showing each electrode for explaining manufacturing steps (a) to (e) of the laminated chip part according to the modification of the present embodiment.

FIG. 6 is a plan view showing an extraction electrode in a layered chip component according to another modification of the present embodiment.

FIG. 7 is a plan view showing extraction electrodes in a laminated chip component according to still another modification of the present embodiment.

FIG. 8 is a plan view of an extraction electrode in a conventional layered chip component.

FIG. 9 is a plan view (a) and (b) of an extraction electrode in another conventional laminated chip component.

[Explanation of symbols]

1 to 4 external planes 5 and 6 end surfaces 7 and 8 first external electrode, second external electrode 9 laminated chip component 9 ′ laminated body 11,12 first extraction electrode, second extraction electrode 13,14 half turn Minute pattern (internal electrode) 11a, 11c Outer surface electrode portions 12a, 12c of the first extraction electrode Outer surface electrode portions 11b, 11d of the second extraction electrode Inner surface electrode portions 12b, 12d of the first extraction electrode Second extraction Inner electrode parts 21, 22 of the first extraction electrode, second extraction electrodes 23, 24, 25 Half turn pattern (internal electrode) 31,41 Extraction electrode m Stacking direction a Width of outer electrode part b Inner surface electrode Amount of inward displacement of part

Claims (4)

[Claims] 1. A laminated structure in which lead-out electrodes for connecting an external electrode and a laminated internal electrode are formed on at least two internal planes substantially orthogonal to the laminating direction and are drawn out to an external plane substantially parallel to the laminating direction. A chip component, wherein the extraction electrode is formed to be wider than the external electrode portion drawn to the external plane at a position displaced inward from the external plane in each of the internal planes. parts. 2. The lead-out electrodes formed on the at least two inner planes are led out on different outer planes so that the outer-surface electrode portions are in symmetrical positions. Multilayer chip parts. 3. The extraction electrode according to claim 1, wherein each of the extraction electrodes has a plurality of outer surface electrode portions, and each of the outer surface electrode portions is drawn out to a plurality of different outer planes. Multilayer chip parts. 4. The outer electrode is formed on an outer flat surface portion where the outer electrode portion is formed and an end surface which is substantially orthogonal to the outer flat surface.
The laminated chip component according to.