JP2003023284A - Electronic equipment - Google Patents

Abstract

(57) [Problem] To provide an electronic device having an excellent heat radiation effect. SOLUTION: An electronic device housing 1 in which electronic components are stored, and an internal heat radiating member 9 partitioning the inside into an internal heat radiating chamber 10 and an external heat radiating chamber 11, and the external heat radiating chamber 11 has an external heat radiating chamber. A heat exchanger 3 having an air inlet 5a for taking in outside air and an air outlet 5b for discharging air in the external heat radiating chamber 11 is provided on the wall surface of the electronic device housing 1, and the heat exchanger 3 The heat generated in the device housing 1 is actively released. Further, the air flow path 27 faces the wall of the electronic device housing 1 on which the heat exchanger 3 is provided, and is provided between the heat exchanger 3 and the wall.
The outside air guide is disposed between the heat shield plate 2 and the wall surface forming the air flow, and actively guides the air flow flowing between the heat shield plate 2 and the wall surface into the intake port 5 a of the heat exchanger 3. Plate 6 was provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, and more particularly to a suitable heat radiation technique for protecting an electronic device installed outdoors from high temperatures.

[0002]

2. Description of the Related Art As electronic equipment installed outdoors, there is, for example, a communication device of an automatic toll collection system (ETC). It is expected that the automatic toll collection system will be able to pass through the toll booths on expressways without stopping, and will help alleviate traffic congestion. This automatic toll collection system is a system that wirelessly connects an on-vehicle device and an antenna installed at a tollgate. It requires a high output in order to reliably perform transmission / reception, and generates a lot of internal heat. Further, in many cases, the communication device installs the electronic device directly under the antenna, that is, outdoors, from the viewpoint of suppressing propagation loss to the antenna. For this reason, it is necessary to make the housing of the electronic device a closed structure, and further, it is necessary to prevent the temperature rise from direct sunlight. There is also a demand for downsizing of the device. Therefore, there is a need for a structure in which the heat dissipation effect is improved while suppressing the deterioration of the airtightness and the increase in size of the device.

Therefore, in such a conventional electronic device,
To dissipate heat, provide a gap between the outer wall of the electronic device and cover the outer wall to attach a heat shield or heat sink,
Alternatively, for example, as seen in Japanese Patent Laid-Open No. 10-256767, an electronic device having a plate heat pipe attached to the ceiling surface of an electronic device is used.

[0004]

However, in the conventional electronic device as described above, when the electronic device is installed outdoors, the heat dissipation effect in the state where the electronic device is shielded from the outside is not sufficiently satisfied. There wasn't.

The present invention has been made to solve such a problem, and an object thereof is to provide an electronic device capable of improving the heat radiation effect of equipment installed outdoors.

Another object of the present invention is to provide an electronic device excellent in dustproof and rainproof measures.

Another object of the present invention is to provide an electronic device having excellent security inside the electronic device.

[0008]

According to another aspect of the present invention, there is provided an electronic device housing in which electronic components are housed, and the interior is partitioned by a heat radiating member into an internal heat radiating portion and an external heat radiating portion. Part has an intake port for taking in outside air into the external heat dissipation part and an exhaust port for exhausting air inside the external heat dissipation part, and the internal heat dissipation part has an intake port for taking in the air inside the electronic device housing and the internal heat dissipation part. A heat exchanger having an exhaust port for discharging air inside the unit, the heat exchanger being disposed on an inner surface of a wall of the electronic device housing, and the wall surface facing an outer surface of the wall of the electronic device housing. An air flow path provided between the heat shield plate and air that is provided between the heat shield plate and the outer surface of the wall of the electronic device casing and flows into the air flow path. And an outside air guide plate that guides the flow to the intake port of the external heat radiation unit. With this configuration, when the air heated in the electronic device housing comes into contact with the heat dissipation member of the heat exchanger, the heat is dissipated through the heat dissipation member into the internal heat dissipation chamber of the heat exchanger to cool the inside of the electronic device housing. Further, the heat released into the internal heat radiation chamber is exhausted to the outside by being carried on the airflow that is taken in through the intake port, passes through the exhaust port, and is released to the outside. As a result, the temperature inside the electronic device housing can be efficiently lowered. The distance between the heat shield plate and the outer surface of the wall of the electronic device housing is 30 mm to 1
It is preferable to set it to 00 mm.

Further, the electronic apparatus of the present invention has a structure in which the outside air guide plate is provided with a filter arranged to cover the intake port of the heat exchanger. With this configuration, it is possible to prevent dust and water droplets contained in the outside air taken in through the intake port from the intake port of the heat exchanger by the filter and prevent the inside of the outside heat dissipation unit from becoming dirty.

Further, the electronic device of the present invention has a structure in which a heat radiation fin is integrally provided on the outside air guide plate. With this configuration, the outside air guide plate guides the introduction of outside air,
The heat contained in the outside air can be efficiently released by the radiation fins.

The electronic device of the present invention has a structure in which a fan for agitating the air in the electronic device housing is provided in the electronic device housing. With this configuration, the air inside the housing of the electronic device is also agitated by the fan, touches the heat dissipation member of the heat exchanger, and is efficiently cooled.

Further, in the electronic device of the present invention, the heat shield plate is rotatably attached to the electronic device casing via a hinge, and the heat shield plate exposes a wall surface of the electronic device casing. Locking means that can switch between an open position and a closed position that covers and hides the front wall and that locks the door for opening and closing on the wall surface of the electronic device casing in a releasable manner is provided on the heat shield plate. It has a configuration in which it is hidden and provided on the back surface.
With this configuration, since the locking means is hidden on the back surface of the heat shield plate, it is difficult for the general public to understand the position of the locking means.
It is possible to prevent the inside from being tampered with by removing the locking means and opening the heat shield plate. As a result, security can be improved.

Further, in the electronic device of the present invention, the heat shield plate is extended in the vertical direction, and the gap between the heat shield plate and the wall surface of the electronic device housing is gradually increased as it goes upward. In this way, the electronic device housing is provided on the side surface. With this configuration, the gap between the heat shield plate and the wall surface gradually increases toward the upper side,
Even if the air is warmed and expanded above, the air will flow smoothly.

Further, in the electronic device of the present invention, the electronic device housing is formed in a substantially rectangular horizontal cross section, and the heat shield plate can cover two surfaces of the electronic device housing at the same time. It is formed in an L shape, and has a configuration in which a pair of the heat shield plates are provided on the side surface of the electronic device housing in a state of extending in the vertical direction with their L-shaped tips abutting each other. With this configuration, one heat shield plate can be attached to cover the two surfaces of the electronic device casing at the same time, so that the number of assembling steps can be reduced and the manufacturing cost can be reduced.

In the electronic device of the present invention, the housing of the electronic device is formed into a substantially rectangular shape in horizontal cross section, and the heat shield plate can simultaneously cover three surfaces of the electronic device housing. A pair of the heat shields, which are formed in a substantially U shape and extend in the vertical direction on the side surface of the electronic device casing,
The U-shaped tips are provided so as to abut each other. With this configuration, the pair of heat shield plates can be attached so that their U-shaped ends are abutted against each other and simultaneously cover the four side faces of the electronic device housing, so that the number of assembly steps can be reduced and the manufacturing cost can be reduced. It will be possible.

Further, the electronic device of the present invention has a structure in which a part of the pair of heat shield plates abutting each other can be opened from the center in the left-right direction. With this configuration, it is possible to open the heat shield plate in a double-sided manner and widen it to perform maintenance work and the like inside.

Further, the electronic device of the present invention has a structure in which heat radiation fins extending along the air flow path are provided on the inner surface of the heat shield plate. With this configuration, the air flowing between the heat shield plate and the gap can be supplied toward the heat radiation fins.

In the electronic device of the present invention, the outer surface of the heat shield plate is coated with a heat-reflecting effect or a light reflection plate is attached, and the inner surface of the heat shield plate is painted in a dark color. It has a structure formed. According to this configuration, when sunlight or the like hits the heat shield plate from the outside, the sunlight or the like is reflected back by the paint or the light reflection plate, and the heat shield plate is heated even if the light shield plate is exposed to direct sunlight. It is possible to reduce the amount of being done.

The electronic device of the present invention has a structure in which the heat exchanger and the heat shield plate are provided on the top surface of the electronic device casing. According to this configuration, since the heat exchanger and the heat shield plate are provided on the top surface of the electronic device casing, it is possible to eliminate the bulge in the horizontal direction by extending upward, thereby making it vertical. Installation space is small and downsizing is possible.

The electronic device of the present invention has a structure in which a dew condensation guide member is provided inside the electronic device casing so as to cover the upper portion of the electronic component. With this configuration, even if dew condensation occurs due to the heat exchanger inside the top surface of the electronic device housing and the water droplets drop, the dew condensation guide member receives the water droplets and wets the electric parts inside, which may have a bad effect. You can prevent it from being received.

Further, the electronic device of the present invention has a structure provided with a switching means capable of switching the direction in which the outside air flows into the external heat radiation portion of the heat exchanger. According to this configuration, the direction of the air flow can be changed according to the external situation or the like.

Further, the electronic device of the present invention has a structure in which the position of the outside air guide plate is switchable so that foreign matter other than the air flowing into the intake port can be removed at the switching position. With this configuration, it is possible to remove foreign matter other than the air flowing into the intake port by using the outside air guide plate.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 to 7, an electronic device according to a first embodiment of the present invention is, for example, an outdoor communication device used in an automatic toll collection system (ETC), and has a communication control board and a monitor inside. Control board, ET
The electronic device housing 1 has electronic device housings 1 that store electronic components such as a C-processed board, a power supply unit, a terminal board, and a lightning rod, and the rear surface of the electronic device housing 1 is exposed to direct sunlight and the electronic device housing 1 It has a structure in which a heat shield plate 2 for preventing the inside from being heated is attached.

The electronic device housing 1 includes a front surface 1a, a rear surface 1b,
The left and right side surfaces 1c and 1d, the top surface 1e, and the bottom surface 1f are formed in a vertically long box shape having six faces. The heat exchanger 3 is attached to the back surface 1b of the electronic device housing 1 in a state of being embedded in the electronic device housing 1, and the outside is closed by a back door 4 forming a wall surface. ing. An intake port 5a and an exhaust port 5b are separately formed on the rear door 4 at positions corresponding to the heat exchanger 3. The rear door 4 is attached to the rear surface of the electronic device casing 1 via a hinge (not shown), and can be horizontally rotated in the left-right direction with the hinge as a fulcrum to open and close. The rear door 4 can be opened by inserting a predetermined key into the key lock portion 7 (see FIG. 3) attached to the rear door 4 and releasing the key lock. Further, a heat shield plate 2 is attached to the wall surface of the electronic device housing 1 which is closed by the back door 4. Further, when the distance between the heat shield plate 2 and the wall surface is 30 mm or less, the influence of the radiant heat from the heat shield plate 2 heated by sunlight becomes large, and when it exceeds 100 mm, the influence of sunlight at the time of south central is great. Therefore, the effect of the heat shield plate 2 is reduced. In addition, mixing of foreign matter is likely to occur. FIG. 19 shows the result of actual measurement of the relationship between the temperature increase and the distance between the heat shield plate 2 and the main body of this machine.

More specifically, the heat exchanger 3 has a heat exchanger housing 25. Inside the heat exchanger housing 25, an intermediate portion is densely divided into upper and lower parts by a heat radiating member 9, and an inner heat radiating chamber 10 as an inner heat radiating portion opened inside the electronic device housing 1 and an electronic device housing. An external heat dissipation chamber 11 is formed as an external heat dissipation portion that is open to the outside of the body 1. The external heat dissipation chamber 11 corresponds to the intake port 5a and the exhaust port 5b of the rear door 4, and the inner port of the rear door 4 has the intake port 5a and the exhaust port 5b.
The protruding plate 12 is formed so as to be located between them and to largely protrude into the external heat dissipation chamber 11. This protruding plate 12
Separates the intake port 5a and the exhaust port 5b to form an air flow path 27 in the external heat dissipation chamber 11, and the outside air entering from the intake port 5a is exhausted from the exhaust port 5b. Have an effect. In addition, an electric fan 13 is mounted in the external heat dissipation chamber 11 so as to cross the air flow path at right angles to the exhaust port 5b. Electric fan 13
Can be rotated in both forward and reverse directions by switching the electric circuit, and when rotated in the forward direction, the air passage 27 that sucks the outside air from the intake port 5a and discharges it from the exhaust port 5b is positively provided in the external heat dissipation chamber 11. When it is rotated in the opposite direction, on the contrary, an air passage 27 that sucks the outside air from the exhaust port 5b and discharges it from the intake port 5a is positively formed in the external heat dissipation chamber 11. On the other hand, the internal heat dissipation chamber 10 is provided with an intake port 14a and an exhaust port 14b, and further, the intake port 14a and the exhaust port 1 are provided.
The protruding plate 16 is disposed between the projecting plate 16 and 4b. The projecting plate 16 divides the intake port 14a and the exhaust port 14b to form an air flow path 28 in the internal heat dissipation chamber 10, and the outside air entering from the intake port 14a is exhausted from the exhaust port 14b. Has the effect of being discharged from. In addition, in the internal heat dissipation chamber 10, an air flow path 28 is provided corresponding to the exhaust port 14b.
An electric fan 17 is attached so as to cross the axis at right angles. The electric fan 17 positively forms an air flow path 28 in the internal heat dissipation chamber 10 that sucks outside air from the intake port 14a and discharges it from the exhaust port 14b. Further, the heat radiating member 9 is made of a metal material having good heat conductivity, and a plurality of heat radiating members are provided so as to extend in the air flow passage 28 of the internal heat radiation chamber 10 and the air flow passage 27 of the external heat radiation chamber 11, respectively. The fin 18 is integrally provided. The heat dissipation member 9 may have a structure using a plate heat pipe. The plate heat pipe encloses, for example, a working fluid (liquid chlorofluorocarbon, etc.) inside a plate-shaped metal member, heat is absorbed by evaporation of the working fluid in the high temperature portion, and the vapor is released by condensation in the low temperature portion. As a result, the cooling device is configured to positively move heat from the high temperature part to the low temperature part, and is a generally well known device. It should be noted that the stirring fan 1 for stirring the air in the electronic device housing 1 is also provided in the electronic device housing 1.
9 are provided.

The heat shield plate 2 is attached via a hidden hinge 8 which is mounted in a hidden state between the heat shield plate 2 and the rear door 4, and is horizontally rotated in the horizontal direction via the hidden hinge 8 to open and close. It has a structure that allows it. Further, between the inner surface of the rotating tip of the heat shield plate 2 and the rear door 4, a lock means 20 for locking the heat shield plate 2 in a closed state in which the heat shield plate 2 is parallel to the rear door 4 is shielded. It is provided so as to be hidden by the heat plate 2. As shown in FIGS. 3 to 5, the lock means 20 corresponds to the lock pin 21 attached to the rear door 4 in a state of protruding toward the heat shield plate 2 and the lock pin 21. And a lock lever 22 attached to the inner surface of the heat shield plate 2. The lock pin 21 is provided with an engaging groove 21a around its tip. On the other hand, the lock lever 22 is rotatable in the up-down direction about a pivot 23 as a fulcrum, and a half-moon-shaped engaging recess 22a is formed at its tip. And the heat shield plate 2
When the lock lever 22 is rotated downward and the inner peripheral edge of the engagement recess 22a is engaged with the engagement groove 21a in a state where the inner surface of the lock pin 21 is closed until it abuts on the tip end surface of the lock pin 21, the lock groove is closed The locked state can be locked, and as shown in FIG. 4, the operator's finger 50 (see FIG. 4) is inserted into the gap between the heat shield plate 2 and the rear door 4 and the lock lever 22 is rotated upward to engage. When the engaging recess 22a is removed from the mating groove 21a, the lock is released, and the heat shield plate 2 is hidden again so that the hinge 8 can be rotated and opened around the hinge 8 as a fulcrum. In addition, when the heat shield plate 2 is in a closed state in which the heat shield plate 2 is overlapped in parallel with the rear door 4, a gap 24 is formed between the heat shield plate 2 and the rear door 4 to allow air to flow. . Further, an outside air guide plate 6 is provided on the inner surface of the heat shield plate 2 so as to correspond to the intake port 5 a of the rear door 4.

The outside air guide plate 6 is formed in a box shape having an opening on the front surface facing the rear door 4, and an air intake hole 25 is formed on the lower surface. A filter 26 is detachably attached to the front surface of the outside air guide plate 6. Then, when the heat shield plate 2 is arranged at the closed position, the outside air guide plate 6 is arranged so that the filter 26 covers the intake port 5a. FIG. 1 shows this state. Therefore, in this state, the air sucked from the intake port 5a is introduced into the outside air guide plate 6 through the air intake hole 25, further passes through the filter 26, and the filter 26
After the dust is removed by, the air is sucked into the intake port 5a.
When the filter 26 becomes dirty, it is removed from the outside air guide plate 6 and cleaned or replaced.

Next, the operation of the electronic device configured as described above will be described. Stirring fan 1 in electronic device housing 1
9 is constantly rotating, and the electric fans 13 and 17 of the heat exchanger 3 are driven when the temperature inside the electronic device casing 1 becomes equal to or higher than the set temperature. When the electric fan 17 is driven, the air in the electronic device housing 1 is taken in from the intake port 14a in the internal heat dissipation chamber 10 and the air in the internal heat dissipation chamber 10 is introduced into the electronic device housing 1 from the exhaust port 14b. The air channel 28 for discharging is positively formed. On the other hand, the electric fan 13
When is driven, in the external heat dissipation chamber 11, the air in the external heat dissipation chamber 11 is discharged from the exhaust port 5b to the gap 24 between the heat shield plate 2 and the rear door 4 and discharged from the upper part to the outside. The external heat dissipation chamber 1 is taken into the outside air guide plate 6 through the gap 24 between the heat shield plate 2 and the rear door 4 and passes through the filter 26.
The air flow path 27 sucked into the inside 1 is positively formed.
Then, when the air flows in the inner heat dissipation chamber 10 and the outer heat dissipation chamber 11 and touches the heat dissipation fins 18, the temperature in the inner heat dissipation chambers 10 is released into the outer heat dissipation chambers 11 through the heat dissipation fins 18, At the same time, the temperature in the internal heat radiation chamber 10 is lowered, and the cooling is positively and effectively performed. It should be noted that the electric fans 13 and 17 of the heat exchanger 3 are stopped again when the temperature inside the electronic device housing 1 is below the set temperature, and are driven again when the temperature is above the set temperature.

Therefore, in the electronic device according to the first embodiment having such a configuration, the following effects can be expected regarding heat dissipation. Since the heat exchanger 3 is used to actively dissipate the heat generated in the electronic device housing 1 to the outside to cool the electronic device housing 1,
The internal temperature can be lowered efficiently. Since the filter 26 is provided on the outside air guide plate 6 so as to close the intake port 5a of the heat exchanger 3, it is included in the outside air drawn into the outside heat dissipation chamber 11 of the heat exchanger 3 through the intake port 5a. It is possible to prevent dust and water drops that are generated by the filter 26 and prevent the inside of the external heat dissipation chamber 11 from being contaminated. Since the stirring fan 19 for stirring the air in the electronic device housing 1 is provided in the electronic device housing 1, the air inside the electronic device housing 1 is stirred by the stirring fan 19 and the efficiency is improved. Well chilled. The heat shield plate 2 is rotatably attached to the electronic device housing 1 via the hidden hinge 8, and the heat shield plate 2 exposes the wall surface (rear door 4) of the electronic device housing 1 and the wall surface. A lock means 20 for closing and closing the rear door 4 of the electronic device housing 1 is provided on the rear surface of the heat shield plate 2 so as to be able to switch to a closed position in which the electronic device housing 1 is covered and hidden. Therefore, it is difficult for a general person to know the position of the lock means 20.
For this reason, it is possible to prevent the heat shield plate 2 from being opened and being tampered with by removing the locking means 20, so that the security can be improved. Since the filter 26 is detachably attached to the front surface of the outside air guide plate 6 attached to the back surface of the heat shield plate 2, the heat shield plate 2 is rotated to the open position and opened to expose the outside air guide plate 6. By doing so, the filter 26 can be easily attached and detached, and cleaning processing or replacement can be easily performed.

(Second Embodiment) FIG. 8 shows an electronic device according to a second embodiment of the present invention. In the electronic device according to the second embodiment, the heat shield plate 2 and the outside air guide plate 6 having the configuration shown in FIG. 1 are partially modified, and other configurations are the same as those in FIG. Are denoted by the same reference numerals, and redundant description will be omitted.

In FIG. 8, in this electronic device, a plurality of heat radiation fins 6a are integrally provided on the outer circumference of the outside air guide plate 6. In this way, the radiation fins 6 are provided on the outer periphery of the outside air guide plate 6.
When a is integrally provided, the heat contained in the outside air can be efficiently radiated by the heat radiation fins 6a while the outside air guide plate 6 guides the introduction of the outside air.

As shown in the schematic structure of FIGS. 9 and 10, the heat shield plate 2 has an inner surface facing the rear door 4,
Rib-shaped radiating fins 2a extending continuously in the vertical direction are provided. Further, the heat shield plate 2 is made of a stainless steel plate, and the outer surface, which is directly exposed to the sunlight, is formed as a mirror surface as it is to reduce the heat from reflecting the sunlight and conversely, the inner surface is shielded from the rear door 4 by the opposite. In order to easily absorb the heat in the airflow flowing through the gap 24 (air passage 27) between the heat plate 2 and the heat plate 2, a dark black coating such as black is applied. If the heat shield plate 2 does not use a stainless steel plate, that is, if the heat shield plate 2 cannot be made as a mirror surface, heat reflection coating is performed with a coating material such as white that easily reflects sunlight, or a light reflection plate. Etc.

Therefore, in the electronic device of the second embodiment having such a configuration, the following effects can be expected in addition to the effect of the structure of the first embodiment with respect to heat dissipation. Since the heat radiation plate 6 has a structure in which the fins 6a for heat radiation extending along the air flow path 27 are provided on the inner side surface of the heat shield plate 2, the space between the heat shield plate 2 and the gap 24, that is, in the air flow path 27. The air that flows in can be smoothly guided and supplied along the heat radiation fins 6a. Since the inner surface of the heat shield plate 2 including the heat radiation fins 6a is coated with a dark black color such as black that easily absorbs heat, a space between the heat shield plate 2 and the gap 24 is provided. The heat in the flowing outside air is absorbed by the heat dissipation fins 6a, and the outside air cooled by the heat absorption is guided to the outside heat dissipation chamber 11 through the outside air guide plate 6, so that efficient cooling can be obtained. Since the outer surface of the heat shield plate 2 is coated with a heat-reflecting effect, or a light reflection plate is attached, and the inner surface of the heat shield plate is coated with a dark color, When sunlight hits the heat shield plate from the outside, the sun light is reflected back by the paint or the light reflection plate, and the heat shield plate is less heated even if the light shield plate is exposed to direct sunlight. be able to.

Although the heat dissipation structure in the second embodiment discloses the structure in which the heat dissipation fins 6a are provided only on the inner surface of the heat shield plate 2, the heat dissipation fins are also provided on the outer surface of the heat shield plate 2. The structure may be provided. In the case where the heat-dissipating plate 2 is also provided with the heat-dissipating fins on the outer surface thereof, the cooling effect is further improved and the outer surface is made uneven by the heat-dissipating fins, which makes it difficult to paste the paper. It is possible to prevent an advertisement such as a leaflet that is not displayed from being attached to the heat shield plate 2.

(Third Embodiment) FIGS. 11 and 12 show an electronic device according to a third embodiment of the present invention. In the electronic device according to the third embodiment, a part of the heat shield plate 2 having the configuration shown in FIG. 1 is modified, and other configurations are the same as those in FIG. Therefore, redundant description will be omitted. 11 is a top view of the electronic device with a heat dissipation structure, and FIG. 12 is a schematic vertical sectional side view taken along the line AA of FIG.

11 and 12, in this electronic device, a side surface heat shield plate 29 provided around the front surface 1a, the back surface 1b, the left and right side surfaces 1c, 1d of the electronic device housing 1, and the top surface 1e. The roof heat shield 30 is provided so as to cover the top. As shown in FIG. 13, the side surface heat shield plate 29 is
A combination of a pair of side surface heat shields 29A and 29B, and one side surface heat shield (29A, 29B) can cover three surfaces of the electronic device housing 1 at the same time. It is formed into a shape. The heat shields (29A, 29B) for the side surfaces extend in the vertical direction on the side surfaces of the electronic device casing 1, and the pair of heat shields (29A, 29B).
B) is attached to the electronic device housing 1 with the mounting screws 31 in a state where the U-shaped tips thereof are butted against each other. In addition, a pair of heat shield plates (29A, 29
The parts (29a) of B) that are butted against each other are
The center parts are hinged to each other so that they can be opened in the left-right direction, and by this opening, the side heat shield plate 29 is opened to expose the electronic device housing 1, and the rear door 4 or the front door (not shown) is opened. The electronic device housing 1 can be opened for maintenance work. In the present embodiment, the heat exchanger 3 and the outside air guide plate 6 are omitted in structure, but they are attached in the same manner as in the case of the structure shown in FIG. 1 or 8.

On the other hand, the roof heat shield plate 30 is formed in a V-shape that gradually decreases from the center toward both sides, and the top surface 1e of the electronic device housing 1 is exposed to strong sunlight. In addition to preventing rain, it also serves to prevent direct contact with rain. Further, the roof heat shield plate 30 is attached with a mounting screw 31 with a gap provided between the roof heat shield plate 30 and the top surface 1e of the electronic device housing 1, and the roof heat shield plate 30 is mounted between the top surface 1e and the roof heat shield plate 30. When air flows as indicated by an arrow 32 in FIG. 12, a negative pressure is generated between the heat shield plate 29 for the side surface and the wall surface of the electronic device casing 1 (in the air flow path 27), and the heat shield plate 29 for the side surface is formed. An airflow (shown by an arrow 33 in FIG. 12) flowing from the lower side to the upper side flows between and the wall surface of the electronic device housing 1 to increase the outside air toward the outside air guide plate 6. There is.

Therefore, in the electronic device of the third embodiment having such a configuration, the following effects can be expected in addition to the effects of the structure of the first embodiment with respect to heat dissipation. -One side heat shield plate 29 is formed in a substantially U-shaped horizontal cross section capable of simultaneously covering three surfaces of the electronic device housing 1, and extends in the vertical direction on the side surface of the electronic device housing 1. Since the pair of side surface heat shield plates 29 are provided with their U-shaped ends butted against each other, the pair of side surface heat shield plates 29 have their U-shaped ends butted against each other during assembly. It is possible to simultaneously cover and attach four side surfaces of the electronic device housing, reducing the number of assembling steps and manufacturing at low cost. Since the parts 29a of the pair of side heat shields 29 facing each other can be opened in the left-right direction from the center, the parts 29a of the heat shield 29 can be opened in the double-sided view during maintenance. , Work can be performed in a wide open state.

(Fourth Embodiment) FIGS. 14 and 15 show an electronic device according to a fourth embodiment of the present invention. The electronic device according to the fourth embodiment is obtained by modifying a part of the heat shield plate 2 having the configuration shown in FIG. 1, and other configurations are the same as those in FIG. Therefore, redundant description will be omitted. 14 is a top view of the electronic device with a heat dissipation structure, and FIG. 15 is a schematic vertical sectional side view taken along the line BB of FIG.

In FIG. 14 and FIG. 15, in this electronic device, a side surface heat shield plate 39 provided around the front surface 1a, the rear surface 1b, and the left and right side surfaces 1d of the electronic device housing 1, and the top surface 1e.
The roof heat shield plate 40 is provided so as to cover the above. The side heat shields 39 are a pair of side heat shields 39A, 39B.
One side heat shield (39
A, 39B) is formed in a substantially L-shaped horizontal cross section capable of simultaneously covering two surfaces of the electronic device housing 1. And
The heat shields (39A, 39B) for each side are the electronic device housing 1
A configuration in which a pair of heat shield plates (39A, 39B) are attached to the electronic device housing 1 with the attachment screws 31 in a state of extending in the vertical direction on the side surface of the Have In addition, a pair of heat shield plates (39
A, 39B) are provided so as to be gradually separated from the wall surface of the electronic device casing 1 from the lower side toward the upper side. This pair of heat shield plates (39A, 39B)
Since the gap above the electronic device housing 1 is gradually increased from the lower side to the upper side, even if the air is warmed and expanded, the air smoothly escapes upward, The flow of can be smooth.

Therefore, in the electronic device according to the fourth embodiment having such a structure, the following effects can be expected in addition to the effect of the structure of the first embodiment with respect to heat dissipation. With the side heat shields (39A, 39B) extending vertically, the gap between the heat shields and the wall surface of the electronic device housing is gradually increased as it goes upward. Since it is provided on the side surface of the electronic device casing 1, even if the air is warmed upward and expanded, the air smoothly flows upward. · A pair of side heat shield plates 39A, 39B are formed in a substantially L-shaped horizontal cross section capable of simultaneously covering two surfaces of the electronic device housing, and are arranged to extend vertically on the side surface of the electronic device housing 1. Since it is provided as a single heat shield plate (39A, 39A)
In B), the two surfaces of the electronic device housing 1 can be simultaneously covered and attached. As a result, it is possible to reduce the number of assembly steps and manufacture at low cost.

(Fifth Embodiment) FIG. 16 shows an electronic device according to a fifth embodiment of the present invention. The electronic device according to the fifth embodiment is obtained by modifying the outside air guide plate 6 of the heat shield plate 2 having the configuration shown in FIG. 1, and other configurations are the same as those in FIG. A duplicate description will be omitted.

In FIG. 16, in this electronic device, a flap 41 is provided as the outside air guide plate 6. Flap 4
1 is a plate-like member that is laid out by extending in the left-right direction,
It is located between the intake port 5a and the exhaust port 5b, and one side is attached to the inner surface of the heat shield plate 2 via the pivot 42. Then, the pivot 42 can be switched to three positions of an upper position, an intermediate position, and a lower position in FIG.

The flap 41 controls the direction of the air passage 27 depending on the position where it is switched. That is, the electric fan 1 is usually arranged at the intermediate position.
When 3 is rotated, the outside air is sucked into the external heat radiation chamber 11 from the lower side of the electronic device main body 1 through the intake port 5a, and is discharged from the inside of the external heat radiation chamber 11 through the exhaust port 5b into the gap 24. Further, cooling air is caused to flow through the path discharged above the electronic device housing 1. Next, when the electric fan 13 is rotated in a state where the flap 41 is switched to the upper position, the outside air passes through the intake port 5a from below and the external heat dissipation chamber 1
Cooling air is flown through a path that is sucked into the external heat radiation chamber 1 and discharged into the gap 24 from the inside of the external heat dissipation chamber 11 through the exhaust port 5b. In the state in which the flap 41 is switched to the upper position, the flap 41 covers the outside of the exhaust port 5b from above. Therefore, for example, on a rainy day, when the rainwater drips from above, the flap 41 is protected from rain. Therefore, rainwater can be prevented from entering the exhaust port 5b. Further, when the electric fan 13 is rotated while the flap 41 is switched to the lower position, the outside air is sucked from the upper side to the intake port 5a.
Is sucked into the external heat dissipation chamber 11 through
Cooling air is made to flow from the inside of 1 through the exhaust port 5b into the gap 24. Further, in the state in which the flap 41 is switched to the lower position, the flap 41 covers the outside of the intake port 5a from below, so that, for example, on a rainy day, rainwater or the like is blown up from the lower side of the electronic device housing 1. When it comes, it is possible to prevent the rain water from entering the intake port 5a because the flap 41 acts as a rain shield.

Therefore, in the electronic device of the fifth embodiment having such a structure, the following effects can be expected in addition to the effects of the structure of the first embodiment with respect to heat dissipation. The forward direction (the direction from the bottom) and the reverse direction (the direction from the top) by rotating the flap (outside air guide plate) 41 to switch the position in which the outside air flows into the external heat dissipation chamber 11 of the heat exchanger 3. ), It is possible to easily change the direction of the air flow according to the external conditions. For example,
By covering the intake port 5a or the intake port 5b with the flap 41, it is possible to eliminate foreign substances other than air flowing into the intake port 5a or the exhaust port 5b.

(Sixth Embodiment) FIG. 17 shows an electronic device according to a sixth embodiment of the present invention. The electronic device according to the sixth embodiment is obtained by modifying the outside air guide plate 6 of the heat shield plate 2 having the configuration shown in FIG. 16, and the other components are the same as those in FIGS. Are denoted by the same reference numerals and redundant description will be omitted.

In FIG. 17, the electronic device shown in FIG.
The heat dissipation structure in the fifth embodiment shown in FIG. 6 is provided from the side surface of the electronic device housing 1 to the top surface 1e of the electronic device housing 1. Also in this heat dissipation structure, the flap 41 serving as an outside air guide plate is a plate-like member that extends in the left-right direction and is laid down. The flap 41 is located between the intake port 5a and the exhaust port 5b, and has one side through the pivot 42. It is attached to the inner surface of the heat shield plate 2. Then, the pivot 42 can be switched to three positions of a front position, an intermediate position, and a rear position in FIG. 16 with the fulcrum as a fulcrum.

The flap 41 in the sixth embodiment is also
Normally, it is arranged at an intermediate position, and when the electric fan 13 is rotated, outside air is sucked into the external heat radiation chamber 11 from the front side through the air intake port 5a, and a gap is passed from the inside of the external heat radiation chamber 11 through the air exhaust port 5b. Cooling air flows through a path that is discharged into the inside of the electronic device housing 24 and further to the rear of the electronic device housing 1.
Next, when the electric fan 13 is rotated while the flap 41 is switched to the front position, the outside air is sucked into the external heat dissipation chamber 11 from the front side of the electronic device housing 1 through the intake port 5a, Cooling air flows from the inside of the heat dissipation chamber 11 through the exhaust port 5b and into the gap 24.
In the state where the flap 41 is switched to the front position, the flap 41 covers the outside of the intake port 5a from above. Therefore, for example, on a rainy day, when the rainwater blows in from the front, the flap 41 is protected from rain. Therefore, it is possible to prevent rainwater from entering the intake port 5a. Further, when the electric fan 13 is rotated while the flap 41 is switched to the rear position, the outside air is sucked from the front side to the intake port 5a.
Is sucked into the external heat dissipation chamber 11 through
Cooling air is made to flow from the inside of 1 through the exhaust port 5b into the gap 24. In the state where the flaps 41 are switched to the rear position, the flap 41 covers the outside of the exhaust port 5b from above, so that, for example, on a rainy day, rainwater or the like is blown from behind the electronic device housing 1. At this time, the flap 41 can prevent rainwater from entering the exhaust port 5b as a rain shield.

Therefore, in the sixth embodiment thus configured, the following effects can be expected in addition to the effects of the structure of the first embodiment with respect to heat dissipation. -Similar to the structure of the fifth embodiment, the flap (outside air guide plate) 41 is rotated in the direction in which the outside air flows into the external heat dissipation chamber 11 of the heat exchanger 3, and the position of the flap 41 is switched to correct it. By switching between the direction (from the front) and the opposite direction (from the rear), the direction of the air flow can be changed according to the external situation. For example, by covering the intake port 5a or the intake port 5b with the flap 41, the intake port 5a
It is possible to eliminate foreign substances other than air flowing into the exhaust port 5a or the exhaust port 5b. Since the heat dissipation structure is provided on the top surface 1e of the electronic device housing 1 and the entire structure is extended upward, it is possible to eliminate the bulge in the horizontal direction and to make it vertical. This enables miniaturization.

(Embodiment 7) FIG. 18 shows an electronic device according to a seventh embodiment of the present invention. In the electronic device according to the seventh embodiment, as in the structure shown in FIG. 17, a heat dissipation structure is provided on the top surface 1e of the electronic device housing 1. Further, in the inside of the electronic device casing 1, the communication control board, the monitor control board, the ETC processing board, the power source section, the terminal board, the lightning rod, and other electronic components 45 housed inside are covered. Condensation guide plate 46a,
46b is provided. Further, members corresponding to those of the sixth embodiment shown in FIG. 17 are designated by the same reference numerals. When the dew condensation attached to the heat dissipation member 9 of the heat exchanger 3 drops into the electronic device housing 1 as water drops, the dew condensation guide plates 46a and 46b receive the water drops and receive the electronic components 4a and 4b.
This is for protecting the electronic component 45 by guiding it to a position deviated from 5 and discharging it so as not to get wet. Therefore, by providing the dew condensation guide plates 46a and 46b in this manner, it is possible to prevent the electronic component 45 from getting wet and broken due to water generated by dew condensation.

[0051]

As described above, the electronic device of the present invention is expected to have excellent effects such as being able to efficiently lower the temperature inside the housing of the electronic device, as is clear from the above embodiments. It is possible.

[Brief description of drawings]

FIG. 1 is a schematic vertical sectional side view showing an electronic device according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing the electronic device according to the first embodiment with a heat shield plate closed.

FIG. 3 is a perspective view showing the electronic device according to the first embodiment with a heat shield plate opened.

FIG. 4 is a top view showing the electronic device according to the first embodiment with a heat shield plate closed.

FIG. 5 is a top view showing the electronic device according to the first embodiment with a heat shield plate opened.

FIG. 6 is an explanatory diagram of a lock unit in the electronic device according to the first embodiment.

FIG. 7 is an explanatory diagram of a lock unit in the electronic device according to the first embodiment.

FIG. 8 is a schematic vertical sectional side view showing an electronic device according to a second embodiment of the present invention.

FIG. 9 is a top view of a heat shield plate in the electronic device according to the second embodiment.

FIG. 10 is a rear view of the heat shield plate in the electronic device according to the second embodiment.

FIG. 11 is a schematic top view showing an electronic device according to a third embodiment of the present invention.

FIG. 12 is a schematic vertical sectional side view taken along line AA of FIG.

FIG. 13 is a perspective view of a heat shield plate in the electronic device of the third embodiment.

FIG. 14 is a schematic top view showing an electronic device according to a fourth embodiment of the present invention.

FIG. 15 is a schematic vertical sectional side view taken along the line BB in FIG.

FIG. 16 is a schematic vertical sectional side view showing an electronic device according to a fifth embodiment of the present invention.

FIG. 17 is a schematic vertical sectional side view showing an electronic device according to a sixth embodiment of the present invention.

FIG. 18 is a schematic vertical sectional side view showing an electronic device according to a seventh embodiment of the present invention.

FIG. 19 is a graph showing the results of actual measurement of the relationship between the temperature rise and the distance between the heat shield plate and the body of the electronic device of the present invention.

[Explanation of symbols]

1 Electronic device housing 2 heat shield 3 heat exchanger 4 rear door 5a intake port 5b exhaust port 6 Outside air guide plate 6a Heat dissipation fin 7 Key lock part 8 hidden hinges 9 Heat dissipation member 10 Internal heat dissipation room 11 External heat dissipation room 13 Electric fan 14a intake port 14b exhaust port 16 protruding plate 17 Electric fan 18 Heat dissipation fin 19 stirring fan 20 Locking means 24 gaps 25 air intake holes 26 filters 27 Air flow path 28 Air flow path 29 Side heat shield 30 Heat shield for roof 39 Side heat shield 40 Heat shield for roof 41 flaps 45 Electronic components 46a, 46b Condensation guide plate

Claims (17)

[Claims] 1. An electronic device housing in which electronic components are housed, and the inside is partitioned by a heat dissipation member into an internal heat dissipation part and an external heat dissipation part, and the outside heat dissipation part draws outside air into the outside heat dissipation part. It has an intake port and an exhaust port for discharging the air in the external heat dissipation unit, and the internal heat dissipation unit has an intake port for taking in the air in the electronic device housing and an exhaust port for exhausting the air in the internal heat dissipation unit. And an air flow path is provided between the heat exchanger arranged on the inner surface of the wall of the electronic device housing and the wall surface facing the outer surface of the wall of the electronic device housing. Is provided between the heat shield plate and the outer surface of the wall of the electronic device housing, and guides the air flow flowing through the air flow path to the intake port of the external heat dissipation portion. An electronic device comprising an outside air guide plate. 2. The electronic device according to claim 1, wherein a distance between the heat shield plate and the outer surface of the wall of the electronic device housing is 30 mm or more and 100 mm or less. 3. The electronic device according to claim 1, wherein the outside air guide plate is provided with a filter that covers the intake port of the heat exchanger. 4. The electronic device according to claim 1, wherein at least one of an intake port and an exhaust port of the heat exchanger casing is provided with a filter having air permeability by closing the intake port or the exhaust port. apparatus. 5. The electronic device according to claim 1, wherein a radiation fin is integrally provided on the outside air guide plate. 6. The electronic device according to claim 1, wherein a fan for stirring air in the electronic device housing is provided in the electronic device housing. 7. The heat shield plate is rotatably attached to the electronic device housing via a hinge, and the heat shield plate covers an open position where a wall surface of the electronic device housing is exposed and a front wall. A lock means that can be switched to a closed position that is hidden and that locks the opening and closing door on the wall surface of the electronic device casing in a releasable manner is hidden on the back surface of the heat shield plate. The electronic device according to claim 1, wherein: 8. The heat shield plate extending vertically,
2. The electronic device housing is provided on a side surface of the electronic device housing such that a gap between the heat shield plate and a wall surface of the electronic device housing is gradually increased toward an upper side. Electronic device. 9. The electronic device housing is formed to have a substantially rectangular horizontal cross section, and the heat shield plate is formed to have a substantially L-shaped horizontal cross section capable of simultaneously covering two surfaces of the electronic device housing. The electronic device according to claim 1, wherein a pair of the heat shield plates are provided on the side surface of the electronic device housing in a state of extending in the vertical direction, with their L-shaped tips abutting each other. 10. The electronic device housing is formed in a substantially rectangular horizontal cross section, and the heat shield plate is formed in a substantially U-shaped horizontal cross section capable of simultaneously covering three surfaces of the electronic device housing. The electronic device according to claim 1, wherein a pair of the heat shield plates are provided on a side surface of the electronic device housing in a state of extending in the vertical direction, with their U-shaped tips abutting each other. 11. The electronic device according to claim 10, wherein the parts of the pair of heat shield plates that are in contact with each other are configured so that they can be opened from the center in the left-right direction. 12. The electronic device according to claim 1, wherein a heat radiation fin extending along an air flow path is provided on a surface of the heat shield plate. 13. The outer surface of the heat shield plate is coated with a heat reflection function, or a light reflection plate is attached, and the inner surface of the heat shield plate is coated with a dark color. The electronic device according to claim 11, which is characterized in that. 14. The electronic device according to claim 1, wherein the heat exchanger and the heat shield plate are provided on a top surface of the electronic device casing. 15. The electronic device according to claim 14, wherein a dew condensation guide member is provided inside the electronic device casing so as to cover an upper portion of the electronic component. 16. The electronic device according to claim 1, further comprising a switching unit that can switch a direction in which outside air flows into the external heat radiation section of the heat exchanger. 17. The outside air guide plate is provided so as to be switchable in position so that foreign matter other than air flowing into the intake port can be eliminated depending on the switching position. Electronic device.