JP2003017149A - Electrical connection members and electrical components using them - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent electrical connection failure due to plastic deformation of conductive particles made of a metal material, generation of cracks in a conductive film of conductive particles made of resin balls, and biting of silica filler into connection sites. An object of the present invention is to provide an electric connection member having good connection quality and an electric component using the same, which solves the problems that occur. An electric connection member in which conductive particle groups (6) in which fine conductive particles (7) are aggregated are substantially uniformly dispersed in an insulating resin (5). At a position where the electrode terminal 2 and another electrode terminal 4 electrically connected to the electrode terminal 2 are in contact with each other, the insulating property is reduced in a state where the electrode terminal 2 is electrically connected through the conductive particle group 6 in the electric connection member. The resin 5 is cured to form an electric component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting technique for electronic equipment, and more particularly to an electrical connecting member and an electrical component used for electrical connection between a circuit board and electronic parts or between circuit boards.

[0002]

2. Description of the Related Art In recent years, with the demand for higher performance and smaller size of electronic equipment, higher density and higher functionality of semiconductors have been demanded. Therefore, instead of the conventional electrical connection means using solder or wire bond, flip chip mounting,
Among them, ACP (Anisotoropic Conductive Paste) and ACF (A
A connection method using a nisotoropic Conductive Film) as an electrical connection member is often used, and a large number of electronic devices incorporating electric parts using this are in the market.

FIG. 11 is a sectional view showing the structure of a bare chip module using a conventional ACP as a connecting member. Figure 11
In the figure, 101 is a bare chip, and 102 is an Au bump formed on the electrode of the bare chip 101. On the other hand, 10
3 is a circuit board on which the bare chip 101 is mounted, and 10
A mounting pad 4 is electrically connected to the Au bump 102 of the bare chip 101 formed on the circuit board. ACP108
In the liquid insulating resin 105 that constitutes the
Are in a uniformly dispersed state.

Next, the manufacturing method will be described. In advance, a predetermined amount of ACP 108 is applied to a predetermined region on the circuit board 103 where the bare chip 101 is mounted, and then the Au bump 102 is contacted with a predetermined mounting pad 104 electrically connected to the Au bump 102 via the conductive particles 106. Mount in position. After that, the back surface of the bare chip 101 and / or the circuit board 1
By applying pressure and heat from the back of 03, the Au bump 10
2 and the mounting pad 104 contact each other through the conductive particles 106 to complete the electrical connection, and then the liquid resin 105 of the ACP 108 is cured to mechanically retain the electrical connection, thus completing the bare chip module. .

FIG. 12 is a diagram showing the structure of a bare chip module using a conventional ACF as a connecting member. 12 is the same as FIG. 11 except for the ACF 109 and the sheet-shaped insulating resin 107 that constitutes the ACF 109. In manufacturing a bare chip module using ACF as an electrical connection member, the bare chip 101 mounting area on the circuit board 103 is preliminarily covered over the entire area.
Basically, there is no great difference in the bare chip module fabrication and the bare chip module configuration except that the ACF 109 is attached.

[0006]

However, according to the above-mentioned configuration, the conductive particles 106 are generally as follows.
Spherical metal particle powder such as Ni, Au, Ag having a diameter of about 5 to 10 μm is used. However, as it is plastically deformed by the pressure applied when the module is manufactured, as shown in FIG. Along with the deterioration of the insulating resin 105 that constitutes the ACP 108, the electrical connection cannot be maintained and a problem occurs. On the other hand, in order to solve such a problem, as shown in FIG. 14, as the conductive particles 106, particles in which metal coatings 111 and 112 are formed around a resin ball 110 having a higher elastic restoring force than the metal particles are used. There is also. However, when compressed and deformed, cracks 113 may occur in the surrounding metal coatings 111 and 112, which may cause electrical connection failure, which is a problem.

Further, in order to suppress the thermal expansion and water absorption of the ACP 105 and improve the reliability, in many cases, a large amount of silica filler 114 is added to the resin of the connecting member. As shown, the silica filler 111 may be caught in the electrical connection site, resulting in a defective electrical connection.

The present invention has been made to solve the above problems, and an object of the present invention is to provide an electrical connection member having good connection quality and an electrical component using the same.

[0009]

In order to achieve the above-mentioned object, the first electrical connecting member of the present invention is a resin in which a group of conductive particles in which fine conductive particles are gathered has a liquid electrical insulating property. It has a configuration in which it is dispersed almost uniformly in the inside.

Next, the second electrical connection member of the present invention is
The electroconductive particle group in which fine electroconductive particles are aggregated is substantially uniformly dispersed in a sheet-like resin having an adhesive curing property and having an electrically insulating property.

Next, the electrical component of the present invention uses the electrical connecting member according to any one of the above, at the position where the electrode terminal and another electrode terminal electrically connected to the electrode terminal come into contact with each other. It is provided with a configuration in which the members in the member are electrically connected to each other through the conductive particle group and the resin in the member for electrical connection is cured.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION As a matter common to the present invention, fine conductive particles (primary particles) have an average diameter of 10 to 1000.
It is preferable that the particles (nm) have a diameter of 1 nm to 50 μm and the (secondary particles) of the group of conductive particles that are aggregated are particles having an average diameter of 1 to 50 μm.

In the first electrical connecting member of the present invention, it is preferable that the electrically insulating resin is a thermosetting resin. The thermosetting resin shrinks in the course of curing, but due to this curing and shrinking effect, the conductive particles (primary particles) are packed at a high density, so the contact efficiency between the conductive particles is improved and a stable electrical connection is achieved. This is because it can be obtained.

The composition ratio of the conductive particle group and the liquid electrically insulating resin is in the range of 500 to 1500 parts by weight when the conductive particle group is 100 parts by weight. preferable. If the value is below the lower limit of this range, the conductive particle group becomes excessive and short-circuiting (crosstalk) between adjacent electrodes is likely to occur. Conversely, if it is out of the upper limit of this range, the conductive particle group is too small. This is because open defects occur.

The liquid electrically insulating resin is resin A, and another uncured liquid or solid electrically insulating resin B is present in and around the conductive particle group. Is preferred. Due to the appropriate difference in the physical properties of the resin A and the resin B, the effect of improving the electrical connection can be obtained during the resin curing process or after the resin curing.

Further, both the resins A and B are preferably thermosetting resins. This is because the curing shrinkage effect described above can be obtained.

Further, it is preferable that the curing start temperatures of the resin A and the resin B are different, and that the resin A is higher than the resin B. The electrically conductive particle group (secondary particles) previously solidified by the resin B pushes away the liquid resin A by the applied pressure and surely makes contact with the Au bump and the mounting pad, so that a reliable electrical connection is made. Because you can do it.

It is preferable that the elastic moduli of the resin A and the resin B are different, and that the resin A is higher than the resin B. The resin A is deformed in a direction to alleviate the generation of some stress, but the conductive particle group made of the insulating resin B having flexibility is not broken by easily following this deformation. This is because high contact quality can be obtained by maintaining the contact between the conductive particles.

Further, it is preferable that the resin A and the resin B have different glass transition temperatures, and the resin A is higher than the resin B. Since the conductive particle group composed of the insulating resin B having a low glass transition temperature exhibits a lower elasticity characteristic than the insulating resin A in a high temperature environment, the action due to the flexibility as described above and the high thermal expansion coefficient characteristic are exhibited. Since the contact between the conductive particles is maintained by maintaining the state of being constantly pressurized, it is possible to obtain higher connection quality especially in a high temperature environment.

When the conductive particle group is 100 parts by weight, the total amount of the resin A and the resin B is preferably in the range of 500 to 1500 parts by weight. If the value is below the lower limit of this range, the conductive particle group becomes excessive and short-circuiting (crosstalk) between adjacent electrodes is likely to occur. Conversely, if it is out of the upper limit of this range, the conductive particle group is too small. This is because open defects occur.

Further, it is preferable that the resin A is a thermosetting resin and the resin B is a thermoplastic resin. The reason for this is
Insulating resin A is deformed in a direction to alleviate the generation of stress, but the conductive particle group consisting of thermoplastic resin B exhibits extremely low elastic properties at high temperatures, so follow this deformation. The reason for this is that the high quality of connection can be obtained in a high temperature environment by maintaining the contact between the conductive particles without breaking.

Next, in the second electrical connecting member of the present invention, it is preferable that the sheet-like resin having an adhesive curing property and having an electrical insulation property is an uncured thermosetting resin. The thermosetting resin shrinks in the course of curing, but due to this curing and shrinking effect, the conductive particles (primary particles) are packed at a high density, so the contact efficiency between the conductive particles is improved and a stable electrical connection is achieved. This is because the conductive particles (primary particles) constituting the conductive particle group (secondary particles) do not spread more than necessary as compared with the case of the liquid resin because they are obtained.

Further, it is desirable that the sheet-like resin having an adhesive and hardening performance and having an electrical insulating property is a thermoplastic type. With respect to the stress generated by the difference in thermal expansion between the bare chip and the circuit board in a high temperature environment, the conductive particle group made of a thermoplastic resin exhibits extremely low elastic properties at high temperature, so that it does not break and does not become conductive. By maintaining contact between particles, high quality connection at high temperature can be obtained, and by virtue of being in the form of a sheet, conductive particles (primary particles) constituting the conductive particle group (secondary particles) can be This is because it does not spread more than necessary.

The composition ratio of the conductive particle group and the liquid electrically insulating resin is preferably in the range of 500 to 1500 parts by weight when the conductive particle group is 100 parts by weight. . If the value is below the lower limit of this range, the conductive particle group becomes excessive and short-circuiting (crosstalk) between adjacent electrodes is likely to occur. Conversely, if it is out of the upper limit of this range, the conductive particle group is too small. This is because open defects occur.

It is preferable that an electrically insulating resin B in a solidified state different from the resin A is present in and around the conductive particle group. This is because the suitable difference in the physical properties of the resin A and the resin B brings about the effect of improving the electrical connection during the resin curing process or after the resin curing.

Further, it is preferable that the curing start temperatures of the resin A and the resin B are different, and that the resin A is higher than the resin B. The electrically conductive particle group (secondary particles) previously solidified by the resin B pushes away the liquid resin A by the applied pressure and surely makes contact with the Au bump and the mounting pad, so that a reliable electrical connection is made. Because you can do it.

It is desirable that the elastic moduli of the resin A and the resin B are different, and that the resin A is higher than the resin B. The resin A is deformed in a direction to alleviate the generation of some stress, but the conductive particle group made of the insulating resin B having flexibility is not broken by easily following this deformation. This is because high contact quality can be obtained by maintaining the contact between the conductive particles.

Further, it is preferable that the resin A and the resin B have different glass transition temperatures, and that the resin A is higher than the resin B. The reason for this is that the conductive particle group consisting of the insulating resin B having a low glass transition temperature exhibits a lower elasticity property than the insulating resin A in a high temperature environment, and therefore, as described above, the action due to the flexibility and the high thermal expansion coefficient are obtained. By being in a state of being constantly pressurized to show the characteristics,
Since the contact between the conductive particles is maintained, higher connection quality can be obtained especially in a high temperature environment.

When the conductive particle group is 100 parts by weight, the total amount of resin A and resin B is preferably in the range of 500 to 1500 parts by weight. The reason for this is that if the lower limit of this range is not reached, the conductive particle group becomes excessive and short-circuiting (crosstalk) between adjacent electrodes easily occurs. Conversely, if the upper limit of this range is not reached, the conductivity This is because the number of particles is too small and open defects occur.

Further, it is preferable that an adhesive layer for further adhesive curing is formed on at least one surface selected from the front surface and the back surface of the sheet. As a result, the adhesive strength required for the sheet-shaped insulating resin may be small, so that it is possible to select a material that adds other properties or stretches.

Further, it is preferable that the sheet-shaped resin having electric insulation is a thermosetting resin material in a state where the curing is substantially completed. As a result, the conductive particles forming the conductive particle group are less likely to spread due to the melting and softening of the insulating resin due to the heat treatment during the bare chip module manufacturing process, and thus the effect of suppressing the occurrence of a short circuit due to the diffusion of the conductive particles is obtained. To be

Further, it is preferable that a part of the conductive particles is exposed on the surface of the sheet. As a result, the conductive particles surely come into contact with the mounting electrodes on the circuit board and the Au bumps on the bare chip, so that more reliable connection can be performed. In particular, it is effective in a configuration using an insulating resin sheet that is substantially cured and has a small degree of melting and softening.

Specific embodiments will be described below.

(First Embodiment) An ACP as an electrical connecting member and a bare chip module using the same in one embodiment of the present invention will be described below with reference to FIG. FIG. 1 shows the ACP (Anisotoropic Conductive P) of the present invention.
FIG. 3 is a cross-sectional view showing a configuration of a bare chip module using aste) as a connecting member. In FIG. 1, 1 is a bare chip,
Reference numeral 2 is an Au bump formed on the electrode of the bare chip 1.
On the other hand, 3 is a circuit board on which the bare chip 1 is mounted, and 4
Is a mounting pad electrically connected to the Au bump 2 of the bare chip 1 formed on the circuit board. Reference numeral 5 is an insulating resin A that constitutes ACP. In the present embodiment, a liquid thermosetting resin material is used.

The liquid thermosetting resin material used in this embodiment is a rubber-modified epoxy resin and has a viscosity of 500.
It is about poise (rotor speed of the rotor when measuring viscosity 0.5 rpm, 25 ° C).

Six groups of conductive particles are uniformly dispersed in the insulating resin A5. The conductive particle group 6 is an aggregate of fine conductive particles 7. The conductive particles used in the present embodiment are silver-palladium alloy powders, and the average particle size is about 0.3 μm for primary particles and about 5 μm for secondary particles.

Next, a method for manufacturing a bare chip module using the ACP of the present invention will be described. In advance, a predetermined amount of the ACP of the present invention is applied to a predetermined area on the circuit board 3 where the bare chip 1 is mounted, and then the conductive particle group 6 is applied to the predetermined mounting pad 4 to which the bare chip 1 is electrically connected by the Au bump 2. It was mounted at the position where it abuts via. In this embodiment, the amount of the liquid resin applied is about 15 mg for a bare chip size # of 10 mm □. After that, the Au bumps 2 and the mounting pads 4 are electrically conductive particles 6 by applying pressure and heat from the back surface of the bare chip 1 or the back surface of the circuit board 3.
After the electrical connection is completed by abutting via
By curing the liquid resin A5, the electrical connection was mechanically held, and the bare chip module was completed. In the present embodiment, heating is performed at a connection portion temperature of about 200 ° C. for about 2 minutes.
Heat for 0 seconds. The amount of pressurization at that time is 0.8 N on average per bump.

According to the present invention, as shown in FIG. 2, before the pressure is applied, that is, before the bare chip 1 is mounted, there is a gap between the conductive particles 7 constituting the conductive particle group 6 in the ACP. Therefore, even if the pressure necessary for mounting the bare chip 1 is applied, the deformation rate of each conductive particle 7 that contributes to the electrical connection is
It is sufficiently smaller than the deformation rate of the conductive particles that contributed to electrical connection in the conventional ACP. As a result, since the conductive particles 7 are less likely to undergo plastic deformation, many conductive particles 7 have a constant restoring force.
It becomes possible to maintain the electrical connection by following the relaxation action due to the deterioration of the insulating resin A5 constituting the above, and the connection quality is improved.

Furthermore, as shown in FIG. 3, even when the silica filler 8 is caught in the electrical connection site, the silica filler is buried in the conductive particle group 6 and thus becomes an obstacle to electrical connection. Therefore, the electrical connection can be secured extremely stably. The reason for this is that first, there is room for the silica filler 8 to be buried due to the presence of the gaps between the conductive particles 7, and because the conductive particles 7 are fine, the area in contact with the silica filler 8 is small and occurs. Friction is also small. As a result, the silica filler 8 that comes into contact with the conductive particles 7 under pressure slips out.

In the present invention, the insulating resin A5 is a thermosetting resin material, but the present invention is not limited to this.
A curable resin material that uses both UV and heat may be used.

(Second Embodiment) An ACP which is an electric connecting member and a bare chip module using the same in another embodiment of the present invention will be described with reference to FIGS. 4 and 5. FIG. 4 is a sectional view showing the structure of a bare chip module using the ACP of the present invention as a connecting member, and FIG. 5 is an enlarged view of the conductive particle group constituting the ACP of the present invention.

In FIG. 4, 9 is an insulating resin B which constitutes the conductive particle group 6. Others are the same as those in FIGS. 1 and 2 described in the first embodiment, and therefore the description thereof will be omitted. In the present embodiment, the insulating resin B9 is made of a liquid thermosetting resin and has physical properties different from those of the insulating resin A5. Further, the method of manufacturing the bare chip module is also the same as that of the first embodiment, and therefore its explanation is omitted.

The liquid thermosetting resin material used in this embodiment is a rubber-modified epoxy resin for both A and B, and has a viscosity of about 500 poise (rotor speed 0.5 rpm, 25 ° C.). Others are the same as those in the first embodiment.

The ACP of this embodiment has the following effects in addition to the effects described in the first embodiment. First, in the above configuration, the insulating resin A5 and the insulating resin B9
When the curing reaction start temperature is different, that is, the insulating resin B9
However, in the configuration in which the thermosetting resin material that cures at a lower temperature than the insulating resin A5 is used, the amount of pressurization required at the time of mounting may be small, resulting in less damage to the bare chip 1 and the circuit board 3. Therefore, stable and high quality electrical connection can be performed. The reason for this is that the electrical connection is such that the conductive particle group 6 is made into the insulating resin A5 by applying pressure.
It is established by pushing away and contacting the bump 2 and the mounting pad 4, but in the case of this configuration, the conductive particle group 6 that has been previously hardened can be easily applied to the insulating resin A5 that is still in the melt-softened state even with a low pressure. It is possible to push forward.

Next, when the insulating resin A5 and the insulating resin B9 have different elastic moduli, that is, when the insulating resin A5 has a higher elastic modulus than the insulating resin B9, higher connection quality can be obtained. The reason for this is that the insulating resin A5 is deformed in a direction to alleviate the generation of some stress, but the conductive particle group 6 made of the insulating resin B9 having further flexibility easily follows this deformation. As a result, there is no breakage and the contact between the conductive particles 7 is maintained.

Further, when the glass transition temperatures of the insulating resin A5 and the insulating resin B9 are different, that is, when the glass transition temperature of the insulating resin A5 is higher than that of the insulating resin B9, higher connection quality can be obtained especially in a high temperature environment. . The reason for this is that the conductive particle group 6 made of insulating resin B9 having a low glass transition temperature is used.
In the high temperature environment, since it exhibits a low elasticity property compared to the insulating resin A5, it exhibits the effect of flexibility as described above, and in addition, it exhibits a high coefficient of thermal expansion, so that the state of being constantly pressurized is maintained. This is because the contact between the conductive particles 7 is maintained as a result.

(Third Embodiment) An ACP which is an electrical connecting member and a bare chip module using the same in another embodiment of the present invention will be described with reference to FIGS. 4 to 5. In the figure, the insulating resin B in FIG. 9 is a thermosetting insulating resin in a solidified state in the present embodiment. Since the other points are the same as those in the second embodiment, description thereof will be omitted. Further, since the manufacturing method of the bare chip module is the same, the explanation is omitted.

The insulating resin material B used in this embodiment is a solidified rubber-modified epoxy resin. Others are the same as those in the second embodiment.

In this embodiment, the insulating resin B of 9 is a thermosetting insulating resin in a solidified state, so that the insulating resin B9 is melted by the heat treatment in the bare chip module manufacturing process as compared with the configuration using the liquid resin. Since the phenomenon that the conductive particles 7 are softened and the conductive particles 7 spread is suppressed, the occurrence of an initial short circuit between the adjacent conductive particle groups 6 is suppressed. Furthermore, since the dispersion density of the conductive particle group 6 can be increased, there is an effect that electrical connection with a narrower connection pitch can be stably realized.

Also in this configuration, when the insulating resin A5 and the insulating resin B9 have different elastic moduli, that is, the insulating resin A5 is the insulating resin.
When the elastic modulus is higher than that of B9, or when the glass transition temperatures of the insulating resin A5 and the insulating resin B9 are different, that is, when the insulating resin A5 has a higher glass transition temperature than the insulating resin B9, the second The same effect as that described in the embodiment can be obtained.

(Fourth Embodiment) Another embodiment of an ACP, which is an electrical connecting member, and a bare chip module using the same in another embodiment of the present invention will be described with reference to FIGS. 4 and 5. In the figure, in the present embodiment, the insulating resin B 9 is a thermoplastic resin in a solidified state. Since the other points are the same as those in the second embodiment, description thereof will be omitted. Further, since the manufacturing method of the bare chip module is the same, the explanation is omitted.

The thermoplastic insulating resin material B used in this embodiment is a solidified polyester resin. Others are the same as those in the second embodiment.

In the present embodiment, 9 is a thermoplastic insulating resin, so that higher connection quality can be obtained especially in a high temperature environment. The reason for this is that the insulating resin A5 is deformed in a direction to alleviate the occurrence of some stress, but the conductive particle group 6 made of the thermoplastic insulating resin B9 exhibits extremely low elasticity at high temperatures. By easily following this deformation, there is no breakage and the contact between the conductive particles 7 is maintained.

The conductive particle group 6 made of the thermoplastic insulating resin B9 exhibits extremely low elasticity at high temperatures.
In the bare chip module manufacturing process, even when the silica filler 8 is caught in the electrical connection site, it has the effect of being easily embedded in the conductive particle group 6 when the applied pressure is extremely low. Therefore, the electrical connection can be secured extremely stably.

(Fifth Embodiment) An ACF which is an electrical connecting member and a bare chip module using the same in an embodiment of the present invention will be described with reference to FIG. FIG. 6 is a diagram showing a configuration of a bare chip module using the ACF of the present invention as a connecting member. In FIG. 6, reference numeral 5 is a sheet-shaped insulating resin A that constitutes the ACF, and is made of a thermosetting insulating resin material in the present embodiment. For others, first
The description is omitted because it is the same as the embodiment.

Next, a method of manufacturing a bare chip module using the ACF of the present invention will be described. The ACF of the present invention is attached in advance over the entire predetermined area on the circuit board 3 where the bare chip 1 is mounted, and then the bare chip 1 is attached to the Au bumps 2.
Is mounted at a position where it abuts on a predetermined mounting pad 4 electrically connected thereto via the conductive particle group 6. After that, by applying pressure and heating from the back surface of the bare chip 1 and / or the back surface of the circuit board 3 to bring the Au bump 2 and the mounting pad 4 into contact with each other through the conductive particle group 6, the electrical connection is completed, By curing the sheet-shaped insulating resin A5, the electrical connection is mechanically held, and the bare chip module is completed.

Insulating resin A used in this embodiment
Is a rubber-modified epoxy resin. The conductive particles used in the present embodiment are silver-palladium alloy powders, and the average particle size is about 0.3 μm for primary particles and about 5 μm for secondary particles. The size of the attached sheet is slightly larger than the bare chip size. In the present embodiment, the heating is performed at a connection portion temperature of about 200 ° C. for about 20 seconds. The amount of pressurization at that time is 0.8 N on average per bump.

Also in this embodiment, as described in the first embodiment, as shown in FIG. 2, the conductive particle group 6 is formed before the pressure is applied, that is, before the bare chip 1 is mounted. Since there are gaps between the conductive particles 7, the deformation rate of each conductive particle 7 that contributes to the electrical connection even if the pressure necessary for mounting the bare chip 1 is applied is the same as that in the conventional ACP. The deformation rate of the conductive particles that contributed to the dynamic connection,
Small enough. As a result, since the conductive particles 7 are less likely to undergo plastic deformation, many conductive particles 7 are
Has a constant restoring force, the holding force of the electrical connection against the relaxing action of the insulating resin A5 forming the ACF is high, and the connection quality is improved.

Furthermore, as shown in FIG. 3, even when the silica filler 8 is caught in the electrical connection portion, the silica filler is buried in the conductive particle group 6 and becomes an obstacle to electrical connection. Instead, the electrical connection can be secured extremely stably.

Although the sheet-shaped insulating resin A5 is also a thermosetting resin material in the present invention, it is not limited to this, and a UV curing type or a combination UV and heat curing type resin material may be used.

(Sixth Embodiment) An ACF as an electrical connecting member and a bare chip module using the same in another embodiment of the present invention will be described with reference to FIG. In the present embodiment, the sheet-shaped insulating resin A in FIG. 5 is a thermoplastic resin material. Since the other points are the same as those in the fifth embodiment, description thereof will be omitted. The method of manufacturing the bare chip module is also the same as that described in the fifth embodiment, and therefore the description thereof is omitted.

The sheet-shaped insulating resin A used in this embodiment is a polyester resin. Others are the same as those in the fifth embodiment.

In this embodiment, in addition to the effect described in the fifth embodiment, since the sheet-shaped insulating resin A5 is made of a thermoplastic resin, it is softened by the heat treatment in the bare chip module manufacturing process. As a result, the insulating resin in the gap between the conductive particles 7 can be easily formed when the resulting pressure is extremely low.
A5 is eliminated. Further, since the silica filler 8 bitten into the electrical connection site is also easily buried in the conductive particle group 6, it does not become an obstacle to electrical connection. Therefore, the electrical connection can be secured extremely stably.

(Seventh Embodiment) An ACF as an electrical connecting member and a bare chip module using the same in another embodiment of the invention will be described with reference to FIG. FIG. 7 is a sectional view showing the structure of another bare chip module using another ACF of the present invention as a connecting member. In the figure,
Reference numeral 9 is an insulating resin B that constitutes the conductive particle group 6. In the present embodiment, the sheet-shaped insulating resins A and 9
As the insulating resin B, a thermosetting resin material in a solidified state is used. Since the other points are the same as those in the second embodiment, description thereof will be omitted. The method of manufacturing the bare chip module is also the same as that described in the fifth embodiment, and therefore the description thereof is omitted.

In the present embodiment, both thermosetting resin materials A and B are rubber-modified epoxy resin. Others are the same as those in the fifth embodiment.

In addition to the effects described in the fifth embodiment, the ACF of the present invention has the following effects in the same manner as described in the second embodiment.

Specifically, in the above structure, when the insulating resin A5 and the insulating resin B9 have different elastic moduli, that is, when the insulating resin A5 has a higher elastic modulus than the insulating resin B9, a higher connection quality is obtained. can get. Insulation resin A5 and insulation resin
When the glass transition temperature of B9 is different, that is, when the glass transition temperature of the insulating resin A5 is higher than that of the insulating resin B9, higher connection quality can be obtained especially in a high temperature environment.

(Eighth Embodiment) An ACF as an electrical connecting member and a bare chip module using the same in another embodiment of another invention will be described with reference to FIG. In the figure, in the ACF of this embodiment, a sheet-like insulating resin A5 and an insulating resin which are thermosetting resins in a solidified state are used.
It is made of the same material as B9, but has a different curing reactivity. Since the other points are the same as those in the second embodiment, description thereof will be omitted. The method of manufacturing the bare chip module is also the same as that described in the fifth embodiment, and therefore the description thereof is omitted. In the present embodiment, both thermosetting resin materials A and B are rubber-modified epoxy resin. Others are the same as those in the fifth embodiment.

In the ACF of the present invention, the insulating resin B9 is in a hard state because the curing reaction of the insulating resin B9 is more advanced than that of the sheet-shaped insulating resin A5, so that the amount of pressurization required at the time of mounting is small. Since, as a result, the damage to the bare chip 1 and the circuit board 3 is reduced, stable electrical connection with higher quality can be performed. The reason for this is that the electrical connection is established by the conductive particle group 6 pushing away the insulating resin A5 by pressure and contacting the bump 2 and the mounting pad 4, but in the case of this configuration, the insulating resin B9 in a hard state is formed. This is because the conductive particle group 6 composed of 6 easily pushes even in the stage where the pressure applied to the insulating resin A5 in the soft state is extremely low.

(Ninth Embodiment) An electric connection member and a bare chip module using the same according to another embodiment of the invention will be described with reference to FIGS. 8 and 9. FIG. 8 is a sectional view showing the structure of the electrical connecting member of the present invention, and FIG. 9 is a sectional view showing the structure of a bare chip module using the electrical connecting member of the present invention.

In the figure, 10 is an adhesive layer. In the present embodiment, the sheet-shaped insulating resin A of 5 is made of a thermosetting resin material. Since the other points are the same as those in the fifth embodiment, description thereof will be omitted. The manufacturing method of the bare chip module is also the same as that described in the fifth embodiment, and therefore its description is omitted.

The sheet-shaped insulating resin A and the adhesive layer are rubber-modified epoxy resins. Others are the same as those in the fifth embodiment.

The electrical connecting member of the present invention has a structure in which the adhesive layer 10 is formed on the two front and back surfaces of the sheet-shaped insulating resin A of 5. As a result, the required adhesive strength with respect to the sheet-shaped insulating resin A5 is reduced, so that a resin material that has been substantially cured may be used. As a result, the conductive particles 7 constituting the conductive particle group 6 are heated by the insulating resin A by the heat treatment during the process of manufacturing the bare chip module.
5 does not spread due to melting and softening, and the occurrence of an initial short circuit between adjacent conductive particle groups 6 is suppressed. Therefore, it is possible to connect at a narrower connection pitch, and stable electrical connection with high quality can be performed.

Further, if both ends of the conductive particle group 6 are exposed from the sheet-like insulating resin A5 as shown in the figure, more stable electrical connection can be achieved.

(Tenth Embodiment) An electrical connecting member and a bare chip module using the same according to another embodiment of the invention will be described with reference to FIG. FIG. 10 is a cross-sectional view showing the structure of a bare chip module using the electrical connecting member of the present invention.

In FIG. 10, the conductive particle group 6 is the same as that of the ninth embodiment except that it is composed of an aggregate of the conductive particles 7 and the insulating resin B9, and the description thereof will be omitted. In this embodiment, the insulating resin B9 is made of a thermosetting resin material. Further, the method of manufacturing the bare chip module is the same as that described in the fifth embodiment, and therefore its explanation is omitted.

The insulating resin B is a rubber-modified epoxy resin. Others are the same as those in the ninth embodiment.

In addition to the effects of the invention described in the ninth embodiment, the electrical connecting member of the present invention also has the following effects in the same manner as described in the second embodiment. Specifically, in the above configuration, if the sheet-shaped insulating resin A5 and the insulating resin B9 have different elastic moduli, that is, if the insulating resin A5 has a higher elastic modulus than the insulating resin B9, higher connection quality can be obtained. . Further, when the glass transition temperatures of the insulating resin A5 and the insulating resin B9 are different, that is, when the glass transition temperature of the insulating resin A5 is higher than that of the insulating resin B9, higher connection quality can be obtained especially in a high temperature environment.

(Eleventh Embodiment) An electrical connecting member and a bare chip module using the same according to another embodiment of the invention will be described with reference to FIG.

In this embodiment, the insulating resin B of 9 is used.
Differs from the ninth embodiment in that is made of a thermoplastic resin material. Others are the same and the description is omitted.
The manufacturing method of the bare chip module is also the same as that described in the fifth embodiment, and therefore its description is omitted.

In addition to the effects of the invention described in the ninth embodiment, the electrical connecting member of the present embodiment also has the following effects in the same manner as described in the fourth embodiment.

That is, since the insulating resin B9 is a thermoplastic type insulating resin, higher connection quality can be obtained especially in a high temperature environment. Further, in the bare chip module manufacturing process, even when foreign matter such as silica filler 8 is caught in the electrical connection site, it is easily buried in the conductive particle group 6 when the applied pressure is extremely low, so that it is extremely stable. Then, electrical connection can be secured.

In all of the embodiments, the bare chip 1 and the circuit board 3 are electrically connected to each other in the module configuration. However, this is an electrical connection between an electronic component such as a chip resistor and a circuit board, or between circuit boards. It can also be applied to any electrical connection. Further, although the gold bump 2 is formed on the bare chip 1, a material other than the gold bump 2 may be used.
Further, depending on the required quality level, it is not necessary to form bumps.

[0084]

As described above, the electric connecting member of the present invention and the electric component using the electric connecting member have a resilience by eliminating the plastic deformation of the conductive particles, as compared with the conventional example, so that the insulating resin It becomes possible to follow the relaxation action due to deterioration,
It has an effect that an electric component having extremely high connection quality can be manufactured. In addition, since the silica filler contained in the electrical connecting member that has been bitten into the electrical connecting portion in the mounting step is easily buried in the conductive particle group, there is an effect that a stable electrical component can be manufactured.

Further, by devising and combining the characteristics of the resin A and the characteristics of the resin B, it is possible to more stably manufacture an electric component having higher quality.

[Brief description of drawings]

FIG. 1 is a sectional view illustrating a configuration of a bare chip module using an ACP as a connecting member according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a state where the conductive particle group forming the ACP is pressurized.

FIG. 3 is a cross-sectional view illustrating a mechanism for avoiding the occurrence of defective connection due to the silica filler being caught in the ACP.

FIG. 4 is a cross-sectional view illustrating a configuration of a bare chip module using ACPs as connection members according to Embodiments 2 to 4 of the present invention.

FIG. 5 is an enlarged cross-sectional view of a conductive particle group that constitutes an ACP according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view illustrating a configuration of a bare chip module using an ACF as a connecting member according to a sixth embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating the configuration of a bare chip module using ACFs as connection members according to Embodiments 7 to 8 of the present invention.

FIG. 8 is a sectional view illustrating a configuration of an electrical connecting member according to a ninth embodiment of the present invention.

FIG. 9 is a sectional view illustrating the configuration of the bare chip module of the same.

FIG. 10 is a sectional view illustrating the configuration of a bare chip module using a connecting member according to a tenth embodiment of the present invention.

FIG. 11 is a cross-sectional view illustrating the configuration of a bare chip module using a conventional ACP as a connecting member.

FIG. 12 is a cross-sectional view illustrating the configuration of a bare chip module using a conventional ACF as a connecting member.

FIG. 13 is a cross-sectional view explaining a connection failure due to a relaxation action of the ACP resin.

FIG. 14 is a sectional view for explaining a connection failure when resin balls are used as the conductive particles.

FIG. 15 is a sectional view for explaining the occurrence of connection failure due to the silica filler being bitten in.

[Explanation of symbols]

1,101 Bare chip module 2,102 Au bump 3,103 circuit board 4,104 mounting pad 5,105 Insulation resin A 6 Conductive particle group 7,106 conductive particles 8,114 Silica filler 9 Insulating resin B 10 Adhesive layer 105 Liquid insulating resin that constitutes ACP 107 Sheet-shaped insulating resin that constitutes ACF 108 ACP 109 ACF 110 resin balls 111 Ni film 112 Au film 113 crack

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/36 H05K 3/36 AF terms (reference) 5E085 BB08 BB17 BB30 DD06 JJ36 5E319 AA01 AC01 BB11 CC61 CD26 GG20 5E344 CD02 DD06 EE16 5G301 DA03 DA11 DA42 DD03 5G307 HA02 HB03 HC01

Claims (24)

[Claims] 1. An electrical connecting member in which a group of conductive particles in which fine conductive particles are aggregated is dispersed almost uniformly in a liquid resin having an electrically insulating property. 2. The electrical connecting member according to claim 1, wherein the resin having an insulating property is a thermosetting resin. 3. The composition ratio of the conductive particle group and the liquid electrically insulating resin is in the range of 500 to 1500 parts by weight when the conductive particle group is 100 parts by weight. The electrical connection member according to 1 or 2. 4. A liquid A resin having electrical insulation is a resin A.
The electrical connection member according to any one of claims 1 to 3, wherein another uncured liquid or solid state electrically insulating resin B is present in and around the conductive particle group. 5. The electrical connecting member according to claim 4, wherein both the resins A and B are thermosetting resins. 6. The electrical connecting member according to claim 4, wherein the curing start temperatures of the resin A and the resin B are different, and the resin A is higher than the resin B. 7. The electrical connecting member according to claim 4, wherein the elastic moduli of the resin A and the resin B are different, and the resin A is higher than the resin B. 8. The electrical connecting member according to claim 4, wherein the resin A and the resin B have different glass transition temperatures, and the resin A is higher than the resin B. 9. The electrical connecting member according to claim 4, wherein the total amount of the resin A and the resin B is in the range of 500 to 1500 parts by weight when the conductive particle group is 100 parts by weight. . 10. The resin A is a thermosetting resin, and the resin B
Is a thermoplastic resin, The electrical connecting member according to claim 4. 11. An electrical connecting member in which a group of conductive particles, in which fine conductive particles are aggregated, is dispersed substantially uniformly in a sheet-like resin having an adhesive curing property and having an electrical insulating property. 12. The electrical connecting member according to claim 11, wherein the sheet-like resin having an adhesive curing property and having an electrical insulating property is an uncured thermosetting resin. 13. The electrical connecting member according to claim 11, wherein the sheet-shaped resin having an adhesive and hardening property and having an electrical insulating property is a thermoplastic resin. 14. The composition ratio of the electrically conductive particle group and the liquid electrically insulating resin is in the range of 500 to 1,500 parts by weight based on 100 parts by weight of the electrically conductive particle group. The electrical connection member according to any one of 11 to 13. 15. The electricity according to claim 12, wherein a resin B having an electric insulation property in a solidified state different from the resin A is present in and around the conductive particle group. Connection member. 16. The resins A and B having the electrical insulation property
16. The electric connecting member according to claim 15, wherein both are thermosetting resins. 17. The electrical connecting member according to claim 15, wherein the curing start temperatures of the resin A and the resin B are different, and the resin A is higher than the resin B. 18. The electrical connecting member according to claim 15, wherein the elastic moduli of the resin A and the resin B are different, and the resin A is higher than the resin B. 19. The electrical connecting member according to claim 15, wherein the glass transition temperatures of the resin A and the resin B are different, and the resin A is higher than the resin B. 20. The electrical connecting member according to claim 15, wherein the total amount of the resin A and the resin B is in the range of 500 to 1500 parts by weight when the conductive particle group is 100 parts by weight. 21. The electrical connecting member according to claim 11, wherein an adhesive layer that is adhesively cured is further formed on at least one surface selected from the front surface and the back surface of the sheet. 22. The electrical connecting member according to claim 11, wherein the sheet-shaped resin having electrical insulation is a thermosetting resin material in a state where curing is substantially completed. 23. The electrical connecting member according to claim 11, wherein a part of the conductive particles is exposed on the surface of the sheet. 24. The electric connecting member according to claim 1, wherein the electrode terminal and another electrode terminal electrically connected thereto are in contact with each other in the electric connecting member. An electrical component which is connected in a state of being electrically connected through the conductive particle group and in which a resin in the electrical connection member is cured.