JP2003012320A - Silica-based inorganic compound organosol - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To exhibit excellent dispersion stability in an organic solvent. SOLUTION: The silica-based inorganic compound fine particles having an average particle diameter in the range of 2 to 100 nm, and the silica-based inorganic compound fine particles whose surface is modified with a polyhydric alcohol are dispersed in an organic solvent. Part or all of the silica source is derived from an alkali metal silicate. The inorganic compound fine particles are preferably silica fine particles, and are preferably silica-based composite oxide fine particles comprising one or more of silica and an inorganic oxide other than silica.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inorganic compound organosol in which fine particles of a silica-based inorganic compound, which can be used for paints, hard coating agents, transparent protective films, polymer fillers, etc., are dispersed in an organic solvent.

[0002]

2. Description of the Related Art Generally, in order to obtain an organic solvent dispersion of inorganic oxide fine particles such as silica and alumina, it is necessary to make the surfaces of these fine particles hydrophobic.
Usually, the surface of fine particles is modified (modified). As a method of modifying the surface of such inorganic compound fine particles, there is a method of reacting a reactive monomer or a coupling agent with a hydroxyl group on the surface of the fine particles. As such a method, specifically, a method in which powdery fine particles are dispersed in an organic solvent and then a modifier is added to modify the surface of the fine particles, or water in an aqueous dispersion of fine particles is replaced with an organic solvent as a solvent Then, a method of adding a modifying agent to modify the surface of the fine particles may be used. However, these methods cannot completely suppress the aggregation of fine particles, and it is difficult to obtain an organic solvent sol having good dispersibility. Also,
When the coupling agent is used, there is a problem that the coupling agent is dissociated from the fine particles and desorbed when water is mixed into the organic solvent dispersion liquid of the treated fine particles, and the stability of the fine particles is lowered. Furthermore, when such inorganic compound fine particles are used as a filler for paints, hard coat agents, etc., when these sols are blended in the matrix of the film forming agent, there is a problem that the fine particles easily aggregate in the matrix.

In Japanese Patent Laid-Open No. 63-185439, the surface of inorganic oxide fine particles such as silica obtained by hydrolyzing a hydrolyzable organic metal compound having an average particle size of 0.05 to 5 μm is disclosed. A glycol monodisperse in which a glycol is bound to is disclosed. Further, the applicant of the present application discloses a silica organosol in which silica particles obtained by hydrolysis of alkoxysilane and having an average particle size of about 0.1 μ are dispersed in a polyhydric alcohol such as ethylene glycol (Patent No. 2718431). However, it has been found that when these particles are blended in a paint, the particle size is too large and the strength of the coating film is insufficient, or the adhesion to the substrate is poor. In addition, depending on the type of organic solvent in which these particles are dispersed, the stability is lowered, and the presence of an electrolyte or the like causes instability, which limits the use.

In the method of hydrolyzing the above-mentioned organometallic compound, the average particle diameter is 0.1 μm or less, particularly 0.04 μm.
It is difficult to obtain the following particles having excellent monodispersity.
Further, in the method of hydrolyzing the alkoxysilane,
Since it may have an alkyl group or may have an alkoxy group, the amount of modified polyhydric alcohol decreases, and it is difficult to obtain an inorganic compound organosol having excellent stability.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a silica-based inorganic compound organosol having excellent dispersion stability in an organic solvent.

[0006]

The present invention is an organosol having an average particle diameter in the range of 2 to 100 nm and having silica-based inorganic compound fine particles whose surface is modified with a polyhydric alcohol dispersed in an organic solvent. Then, part or all of the silica source of the silica-based inorganic compound fine particles is derived from an alkali metal silicate.
The inorganic compound fine particles are preferably silica fine particles. The inorganic compound fine particles are preferably silica-based composite oxide fine particles made of one kind or two or more kinds of silica and an inorganic oxide other than silica.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described below. 1. Inorganic Compound Organosol The inorganic compound organosol according to the present invention has an average particle size in the range of 2 to 100 nm, and the inorganic compound fine particles whose surface is modified with a polyhydric alcohol are dispersed in an organic solvent.

[0008] Inorganic compound fine particles of the inorganic compound fine particles have an average particle diameter of 2~100nm
Is in the range. A more preferable range is 2 to 80 nm, and particularly a range of 2 to 40 nm. It is difficult to obtain particles having an average particle diameter of less than 2 nm, and even if obtained, the particle diameter is too small. Therefore, even if a coating film or the like containing fine particles of an inorganic compound is formed, the strength of the film and that of the base material It is difficult to obtain the effect of improving the adhesiveness. Further, even if a film or fiber containing inorganic compound fine particles is manufactured, sufficient slipperiness may not be obtained. If the average particle size exceeds 100 nm, the strength of the film will not be reduced or the adhesion to the substrate will not be improved even if a coating film containing inorganic compound fine particles is formed. In addition, the particles may be too large to maintain a stable dispersed state and may settle.
Further, since the particle size is large, the amount of modified polyhydric alcohol per unit particle weight is small, and it is difficult to obtain an inorganic compound organosol having excellent stability.

The silica-based inorganic compound particles used in the present invention are preferably silica-based composite oxide particles composed of silica alone particles or silica and one or more kinds of inorganic oxides other than silica. Examples of the inorganic oxides other than silica include 1A group, 2A group, 2B group of the periodic table,
3A group, 3B group, 4A group, 4B group, 5A group, 5B group, 6
Examples thereof include oxides of elements selected from Group A, and specific examples include Li ₂ O, Na ₂ O, K ₂ O, Rb ₂ O and B.
eO, MgO, CaO, ZnO, Y ₂ O ₃ , La
₂ O ₃ , Al ₂ O ₃ , Ga ₂ O ₃ , B ₂ O ₃ , Ce ₂ O
₃ , Sb ₂ O ₃ , P ₂ O ₅ , TiO ₂ , ZrO ₂ , Sn
O ₂ , MoO ₃ , WO _{3 and the} like can be mentioned. Specifically as the silica-based composite oxide fine particles, silica-alumina,
Examples thereof include silica-zirconia and silica-titania. The silica particles or the silica-based composite oxide fine particles can easily obtain spherical fine particles and have many surface OH groups, so that more polyhydric alcohol can be bonded to the surface of the fine particles, and the bonded polyhydric alcohol can be easily It is preferable because it is not desorbed (decomposed).

As the silica particles, Japanese Patent Application Laid-Open No. 63-45114 and Japanese Patent Application Laid-Open No. 63-45114 filed by the applicant of the present application.
The silica sol described in Japanese Patent No. 45113, Japanese Patent Laid-Open No. 63-64911, etc. is suitable. Specifically, in a dispersion liquid in which seed particles composed of inorganic oxide fine particles are dispersed,
It is produced by adding a silicic acid solution obtained by desalting an alkali metal silicate such as sodium silicate.
The silica-based complex oxide fine particles are, for example, Japanese Patent Application Laid-Open No. 63-123807 and Japanese Patent Application Laid-Open No. 5-1 (1993) filed by the present applicant.
It is manufactured based on the description in Japanese Patent No. 32309. Specifically, an alkali metal silicate such as sodium silicate or a silicic acid solution obtained by dealkalizing the alkali metal silicate and an alkali-soluble inorganic compound are simultaneously added to an alkaline aqueous solution having a pH of 10 or more to obtain the pH of the reaction solution. Can be obtained by reacting without controlling. Further, the above-mentioned silicate or silicic acid solution and an alkali-soluble inorganic compound are added to a dispersion in which seed particles composed of fine particles of an inorganic oxide such as silica or alumina are dispersed in an alkaline aqueous solution having a pH of 10 or more to grow the particles. It can also be obtained.

The content of the inorganic oxide other than silica in the silica-based composite oxide fine particles is preferably 0.01 to 50% by weight, and particularly preferably 0.1 to 30% by weight. When the content is less than 0.01% by weight, the amount of polyhydric alcohol capable of binding to the surface is the same as that of the silica single particles, and when the content exceeds 50% by weight, the silica-based composite oxide fine particles obtained are The dispersion stability of 1 tends to decrease, the amount of polyhydric alcohol that can be bonded to the surface further increases, and the dispersion stability does not improve.

As the silica source of the silica particles and the silica-based composite oxide fine particles, the alkali metal silicate is used as described above. The silica particles and the silica-based composite oxide fine particles obtained by using the alkali metal silicate can easily have an average particle size in the range of 2 to 100 nm. Further, in the method of growing seed particles using an alkali metal silicate, it takes an extremely long time to obtain particles having an average particle size of more than 100 nm. On the other hand, in the sol-gel method using a hydrolyzable organometallic compound, particle growth easily occurs, and it is difficult to obtain particles having an average particle diameter of 100 nm or less. Further, in the sol-gel method, hydrolysis may be insufficient and alkoxy groups may remain,
In this case, since the OH group decreases, the modification amount of the polyhydric alcohol decreases, and the dispersion stability tends to be insufficient.

Polyhydric alcohol The surface of the inorganic compound fine particles is modified with a polyhydric alcohol. When treated with a polyhydric alcohol, the bond is stronger than when treated with a silane coupling agent or the like, and the polyhydric alcohol is not easily decomposed or eliminated even when mixed with water or the like. It is possible to obtain an inorganic compound organosol which is stable to organic solvents such as lactones such as γ-butyrolactone as well as polyhydric alcohols. Furthermore, even if an inorganic or organic cation, anion or salt coexists in such an organic solvent, a stable inorganic compound organosol can be obtained. Examples of polyhydric alcohols used for modification include ethylene glycol, (poly) ethylene glycol, propylene glycol, (poly) propylene glycol, neopentyl glycol, catechol, resorcinol, alkylene glycol and other bifunctional alcohols, glycerin, trimethylolpropane. And trifunctional alcohols such as polyvinyl alcohol, and the like.

[0014] The organic solvent used in inorganic compound organosol organic solvent present invention may be a conventionally known desired organic solvent. Specifically, monohydric alcohols such as ethanol, propanol and butanol, polyhydric alcohols such as ethylene glycol and propylene glycol, alcohol ethers such as ethylene glycol monoethyl ether, N-
Methylformamide, N, N-dimethylformamide,
Examples thereof include amide solvents such as N-methylacetamide, γ-butyrolactone and lactones such as N-methyl-2-pyrrolidone. These organic solvents may be used alone or in combination of two or more. The inorganic compound organosol according to the present invention is excellent in stability even when a lactone such as γ-butyrolactone is used as a dispersion medium, and also when an inorganic or organic cation, anion or salt is present in the solvent. Is characteristic. Therefore, these organosols may contain organic acids, inorganic acids or salts thereof. Examples of the organic acid, the inorganic acid and salts thereof include hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, perchloric acid, acetic acid, and ammonium salts and metal salts thereof. The concentration of the inorganic compound fine particles in the inorganic compound organosol is
It is preferably 1 to 50% by weight, particularly 5 to 30% by weight. When the concentration exceeds 50% by weight, the viscosity of the dispersion becomes high and the fluidity is lowered, so that there is a tendency for practical convenience to be lacking.

2. Method for producing inorganic compound organosol The inorganic compound organosol has a polyhydric alcohol bonded to the surface of the silica particles or silica-based composite oxide fine particles, and if this is stably dispersible in an organic solvent, what kind of A manufacturing method can also be adopted. For example, first, an aqueous dispersion of the silica particles or silica-based composite oxide fine particles is prepared. The concentration of the dispersion liquid at this time is preferably in the range of 1 to 50% by weight, particularly 5 to 30% by weight. If the concentration is less than 1% by weight, the concentration is too low to efficiently bond the particles with the polyhydric alcohol, and if the concentration exceeds 50% by weight, the concentration is too high and uniform treatment becomes difficult. .

Polyhydric alcohol is added to this dispersion and, if necessary, it is heat-aged, and then the polyhydric alcohol is reacted with the surface OH groups of the particles while heating and distilling, and water is distilled off. The amount of the polyhydric alcohol added varies depending on the average particle size of the inorganic compound particles, but the inorganic compound particles 100
It is preferably in the range of 1 to 200 parts by weight, especially 10 to 100 parts by weight, per part by weight. When the amount of the polyhydric alcohol added is less than 1 part by weight, the amount of the polyhydric alcohol bound to the surface is small, and the stability of the obtained inorganic compound organosol may be insufficient, particularly when salts are present. There is a risk of gelation. On the other hand, even when the amount of polyhydric alcohol added exceeds 200 parts by weight, the amount of polyhydric alcohol bound to the surface does not increase,
On the contrary, excess and unreacted polyhydric alcohol may remain, and the polyhydric alcohol may remain when it is formed into a paint and formed into a film.

The temperature during the heat aging or heat distillation is preferably in the range of 30 to 200 ° C, particularly 50 to 180 ° C. If the temperature is lower than 30 ° C., the reaction may not proceed sufficiently even if it takes a long time. On the other hand, if the temperature exceeds 200 ° C., the effect of further shortening the treatment time cannot be obtained. The treatment time varies depending on the treatment temperature, but is usually about 0.5 to 24 hours. Then, a desired organic solvent is added, and the mixture is heated and distilled again until the residual amount of water becomes about 0.1 to 20% by weight to distill off water and obtain the inorganic compound organosol of the present invention. The distillation time at this time is about 0.5 to 10 hours. It is difficult to make the residual amount of water less than 0.1% by weight and the stability of the obtained inorganic compound organosol may be impaired. If the residual amount of water exceeds 20% by weight, the coating film-forming property and the adhesion with the base material may be reduced when used as a coating material. The concentration of the inorganic compound fine particles in the inorganic compound organosol is 1 to 5
It is preferably contained in an amount of 0% by weight, especially 5 to 30% by weight.

[0018]

The silica-based inorganic compound organosol according to the present invention is excellent in dispersion stability of inorganic compound fine particles in an organic solvent, and the fine particles do not aggregate. Further, even if an inorganic acid, an organic acid, or a salt thereof coexists in the organosol, the inorganic compound fine particles do not aggregate. When the inorganic compound organosol is mixed in a coating material as a coating material, a protective film, a filler for a hard coating agent, etc., the dispersibility in the coating material is good, and the coating film obtained is dense and has excellent adhesion to a substrate, In addition, the occurrence of cracks and the deterioration of transparency due to the aggregation of particles hardly occur. Therefore, the inorganic compound organosol is useful as a filler for various resins in addition to various paints, protective films, hard coating agents, etc., and is also suitable for applications such as magnetic tape fillers and film antiblocking agents. Is.

[0019]

EXAMPLES The present invention will be described in more detail with reference to the following examples.

Example 1 [Preparation of surface modified sol] Silica sol (manufactured by Catalysts & Chemicals Industry Co., Ltd .: SI-50, average particle diameter 25 nm, SiO ₂
(Concentration 48 wt%) was diluted with water to a SiO ₂ concentration of 25 wt%, which was ion-exchanged with a cation exchange resin and then ion-exchanged with an anion exchange resin to give a SiO ₂ concentration of 20 wt%.
Of silica sol (A) was prepared. Silica sol (A) 18
Take 00g in a container, and mix 180g of ethylene glycol as a polyhydric alcohol with this, and heat-distill to add water 78g.
0 g was distilled off. Next, 660 g of γ-butyrolactone as an organic solvent is mixed, and similarly heated and distilled to give water 66.
0 g was distilled off to prepare an ethylene glycol-modified silica organosol (A) having a solid content concentration of 30% by weight. The silica organosol (A) was evaluated for stability, adhesion to a substrate, and coating film hardness as follows, and the evaluation results are shown in Table 1 together with its properties.

[Evaluation of Stability of Sol] (1) 100 parts by weight of organosol (A) was mixed with 10 parts by weight of aqueous sulfuric acid solution (concentration 2% by weight) and aqueous hydrochloric acid solution (concentration 2% by weight). Stability (I) was evaluated. (2) Mix 100 parts by weight of the organosol (A) with 10 parts by weight of an ammonium sulfate aqueous solution (concentration: 5% by weight),
After stirring for 0 minutes, the mixture was allowed to stand in a constant temperature bath at 70 ° C. and the time until solidification was measured to evaluate the stability (II) of the sol. (3) To 100 parts by weight of the obtained organosol (A), 10 parts by weight of an aqueous sodium chloride solution (concentration: 5% by weight) was mixed, stirred for 10 minutes, and then allowed to stand in a constant temperature bath at 70 ° C. to stabilize the sol. The sex (III) was evaluated. The above-mentioned stability was evaluated by measuring the time until gelation or the formation of a precipitate, and evaluated according to the following criteria. ○: No change for one month or more △: Viscosity increased and gelation started within 1 week X: Viscosity increased and gelation started within 1 day after addition

[Evaluation of adhesion between coating film and substrate and coating film hardness] Butyral resin (Sekisui Chemical Co., Ltd .: S-REC BM-2) was dissolved in n-butanol to obtain a resin having a resin concentration of 10% by weight. A solution was prepared. 70 g of this resin solution and 10 g of the silica organosol (A) were added to n-butanol 2
Mix with organosol diluted with 0 g to obtain Bar No. 10
After coating on the polycarbonate plate using the wire bar of
It was cured at 150 ° C. for 30 minutes to form a coating film. The adhesiveness was evaluated by a cellotape (registered trademark) peeling test, and the coating film hardness was evaluated by a pencil hardness method.

Example 2 In Example 1, 72 g of ethylene glycol and γ-
An ethylene glycol-modified silica organosol (B) having a solid content concentration of 30% by weight was prepared in the same manner as in Example 1 except that 768 g of butyrolactone was used. The obtained silica organosol (B) was evaluated for stability, adhesion to a substrate and coating film hardness.

Example 3 1800 g of silica sol (A) ion-exchanged with the anion exchange resin prepared in Example 1 and having a SiO ₂ concentration of 20% by weight
Γ-butyrolactone was mixed with 660 g, and the mixture was heated and distilled to remove 1440 g of water, followed by ethylene glycol 1
After mixing 80 g, the mixture was heat-aged at 95 ° C. for 1 hour to prepare an ethylene glycol-modified silica organosol (C) having a solid content concentration of 30% by weight. The obtained silica organosol (C) was evaluated for stability, adhesion to a substrate and coating film hardness.

Example 4 As an inorganic compound particle, silica / alumina aqueous dispersion sol (manufactured by Catalysts & Chemicals Industry Co., Ltd .: Cataloid SN, average particle size 12)
nm, SiO ₂ · Al ₂ O ₃ concentration 20% by weight, Al ₂ O
An ethylene glycol-modified silica / alumina organosol (D) having a solid concentration of 30% by weight was prepared in the same manner as in Example 1 except that the ₃ / SiO ₂ weight ratio = 0.003) was used. Obtained silica-alumina organosol (D)
The stability, the adhesion to the substrate and the coating film hardness were evaluated.

Example 5 Silica / titania water dispersion sol as inorganic compound particles (manufactured by Catalysts & Chemicals Industry Co., Ltd .: TiO ₂ / SiO ₂ weight ratio = 0.
1, an average particle diameter of 10 nm, and a SiO ₂ TiO ₂ concentration of 20% by weight) were used to prepare an ethylene glycol-modified silica-titania organosol (E) having a solid concentration of 30% by weight in the same manner as in Example 1. Prepared. Obtained silica
The alumina organosol (E) was evaluated for stability, adhesion with a substrate and coating film hardness.

Example 6 In the same manner as in Example 1 except that 660 g of n-butanol was used in place of 660 g of γ-butyrolactone, an ethylene glycol-modified silica organosol (F having a solid content concentration of 30% by weight) was prepared. ) Was prepared. The obtained silica organosol (F) was evaluated for stability, adhesion to a substrate and coating film hardness.

Comparative Example 1 A mixed solution of 31440 g of ethanol, 5680 g of ammonia water having a concentration of 28% by weight, and 41520 g of pure water was used as 35 parts.
1440 g of tetraethoxysilane was added to the mixed solution while maintaining the temperature at ℃. 2 more after addition
After continuing stirring for an hour, 4000 g of ammonia water having a concentration of 28% by weight was added to this mixed solution to adjust the pH to 12.5, and then the mixture was concentrated to a concentration of silica particles dispersed in a water-ethanol mixed solution at a concentration of 20. A wt% silica particle dispersion was prepared. The average particle size of the silica particles was 110 nm. Next, in place of 1800 g of silica sol in Example 1, 180 wt.
An ethylene glycol-modified silica organosol (G) having a solid content concentration of 30% by weight was prepared in the same manner as in Example 1 except that 0 g was used. With respect to the obtained silica organosol (G), stability, adhesion to a substrate and coating film hardness were evaluated in the same manner as in Example 1.

Comparative Example 2 As inorganic compound particles, SiO ₂ was used in the same manner as in Example 1.
A silica sol (A) having a concentration of 20% by weight was prepared. 1800 g of this silica sol (A) was placed in a container, then 840 g of an organic solvent γ-butyrolactone was mixed, and the mixture was heated and distilled to remove 840 g of water to prepare a silica organosol (H). The obtained silica organosol (H) was evaluated for stability, adhesion with a substrate and coating film hardness.

Comparative Example 3 As inorganic compound particles, SiO ₂ was used in the same manner as in Example 1.
A silica sol (A) having a concentration of 20% by weight was prepared. The solvent was replaced with methanol for water using an ultrafiltration device to obtain a methanol-dispersed sol having a solid content concentration of 30% by weight. This sol 3
After mixing 00g and 2700g of ethanol, γ-glycidoxypropyltrimethoxysilane 8.
4 g was added and stirred for 1 hour to prepare a sol (I) in which the surface of silica-alumina particles was modified with γ-glycidoxypropyltrimethoxysilane. The obtained silica-alumina organosol (I) was evaluated for stability, adhesion to a substrate and coating film hardness.

Comparative Example 4 As an inorganic compound particle, silica / alumina aqueous dispersion sol (manufactured by Catalysts & Chemicals Industry Co., Ltd .: Cataloid SN, average particle size 12)
nm, SiO ₂ · Al ₂ O ₃ concentration 20% by weight, Al ₂ O
1800 g of ₃ / SiO ₂ weight ratio = 0.003) was placed in a container, and then 840 g of γ-butyrolactone was mixed and heated to distill 840 g of water to prepare a silica organosol (J). Obtained silica organosol (J)
The stability, the adhesion to the substrate and the coating film hardness were evaluated.

Comparative Example 5 A mixed solution of 39300 g of ethanol, 7100 g of ammonia water having a concentration of 28% by weight, and 51900 g of pure water was used.
The mixture solution was kept at ℃, and while stirring this mixed solution, 740 g of methyltrimethoxysilane and 900 parts of tetraethoxysilane.
g was added. After the addition was completed, the mixture was further stirred for 2 hours, and the mixed solution was added with 50% ammonia water of 50% by weight.
The pH was adjusted to 12.5 by adding 00 g and then concentrated to prepare a silica particle dispersion liquid having a concentration of 20% by weight in which silica particles were dispersed in a water-ethanol mixed solution. The average particle size of the silica particles was 80 nm. Next, Example 1
Instead of 1800 g of silica sol, the above concentration 2
An ethylene glycol-modified silica organosol (K) having a solid content concentration of 30 wt% was prepared in the same manner as in Example 1 except that 1800 g of 0 wt% silica particle dispersion was used. With respect to the obtained silica organosol (K), stability, adhesion to a substrate and coating film hardness were evaluated in the same manner as in Example 1.

[0033]

TABLE 1 Inorganic fine Al soluble conc average STABILITY tight pencil type MO / SiO ₂ call medium degree particle size I II II I wear hardness Example (weight) parts by weight (wt%) (nm) of 1 SiO ₂ 0 50 γ 30 25 ○ ○ ○ ○ 3H 2 SiO ₂ 0 20 γ 30 25 ○ ○ ○ ○ 2H 3 SiO ₂ 0 50 γ 30 25 ○ ○ ○ ○ 3H 4 Al ₂ O ₃ / 0.003 50 γ 30 12 ○ ○ ○ ○ 3H SiO ₂ 5 TiO ₂ / 0.1 50 γ 30 10 ○ ○ ○ ○ 4H SiO ₂ 6 SiO ₂ 0 50 n 30 25 ○ ○ ○ ○ 3H Comparative Example 1 SiO ₂ 0 50 γ 30 110 ○ ○ ○ × B 2 SiO ₂ 0 0 γ 30 25 △ △ △ × H 3 SiO ₂ 0 0 γ 30 25 × × × ○ 2H 4 Al ₂ O ₃ / 0.003 0 γg 30 12 △ △ △ × H SiO ₂ 5 SiO ₂ 0 50 γ 30 80 △ △ △ △ B In the above "solvent" column, γ: γ-butyrolactone, n: n-
Butanol and γg: γ-glycidoxypropyltrimethoxysilane are shown, respectively.

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 4G072 AA28 BB05 CC02 DD05 DD06                       DD07 EE06 EE07 GG01 GG02                       HH18 HH23 TT01 UU07 UU30                 4J002 AA001 DJ006 DJ016 FB086                       GH01                 4J037 AA08 AA09 AA10 AA11 AA18                       AA22 AA25 CB04 CB07 CB13                       CB17 DD05 EE02 EE28 EE43

Claims (3)

[Claims] 1. An organosol in which silica-based inorganic compound particles having an average particle diameter in the range of 2 to 100 nm and whose surface is modified with a polyhydric alcohol are dispersed in an organic solvent. Inorganic compound organosol, wherein a part or all of the silica source is derived from an alkali metal silicate. 2. The inorganic compound organosol according to claim 1, wherein the inorganic compound particles are silica particles. 3. The inorganic compound organosol according to claim 1, wherein the fine particles of the inorganic compound are fine particles of a silica-based composite oxide composed of silica and one or more kinds of inorganic oxides other than silica.