JP2003009446A - High thermal conductive insulating coil and rotating electric machine - Google Patents

Abstract

(57) [Problem] To provide a high heat conduction insulating coil having both high heat conductivity and high withstand voltage, and a rotating electric machine using the coil. SOLUTION: A mica particle, a filling particle having a thermal conductivity of at least 5 W / mK or more, a mica particle, and a reinforcing material (glass cloth) on which the filling particle are placed are laminated, and a gap between the mica particle, the filling particle, and the reinforcing material Fill the resin and pressurize,
A highly heat-conductive mica insulating layer (mica insulating tape) 12 formed of a mica layer 1 made of mica particles and resin and a layer 6 made of filled particles, reinforcing material, and resin is wound around the coil conductor 5 and insulated. The resin has a thermal conductivity of 0.6 W / mK or more. High thermal conductivity in the thickness direction of the coil insulation layer and high withstand voltage can be achieved at the same time. It is possible to provide an output rotating electric machine device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high heat conductive insulated coil and a rotating electrical machine device, and more particularly to a high heat conductive insulated coil having both high thermal conductivity and high withstand voltage and a rotary electrical machine device using this coil. For the structure of mica insulating tape for

[0002]

2. Description of the Related Art As a conventional high heat conductive insulated coil, as described in Japanese Patent Laid-Open No. 63-110929, 90% by weight as a filler in a resin layer disposed between mica layers. % Are particles having a particle size of 0.1 to 15 μm, and are boron nitride, aluminum nitride, silicon nitride, aluminum oxide, magnesium oxide, beryllium oxide,
There is a coil in which a filler having a thermal conductivity of at least 5 W / mK or more is inserted and insulation-treated, such as silicon carbide.

However, 0.6 W / m in the thickness direction of the insulating layer
It was difficult to secure a thermal conductivity of K or higher and achieve a dielectric strength of 25 kV / mm or higher as a withstand voltage.

[0004]

SUMMARY OF THE INVENTION In order to manufacture a small and high-power rotary electric machine device, or without using a direct cooling method in which a cooling medium such as water is passed through the inside of a coil using a hollow conductor for cooling. In order to manufacture a high-power rotary electric machine device by an indirect cooling method in which air or hydrogen gas is cooled outside the coil insulation layer, it is necessary to achieve both high thermal conductivity and high withstand voltage in the thickness direction of the coil insulation layer. There is.

An object of the present invention is to provide a high thermal conductivity insulating coil having both high thermal conductivity and high withstand voltage, and a rotary electric machine device using this coil.

[0006]

In order to achieve the above object, the present invention laminates mica particles, filled particles having a thermal conductivity of at least 5 W / mK or more, and mica particles and a reinforcing material on which the filled particles are placed. Then, in a coil in which a mica insulating tape formed by filling a resin between the mica particles, the filling particles and the reinforcing material is wrapped around a conductor for insulation treatment, the thermal conductivity of the resin is 0.6 W / mK or more. We propose a high thermal conductive insulated coil.

According to the present invention, mica particles, filler particles having a thermal conductivity of at least 5 W / mK or more, and mica particles and a reinforcing material on which the filler particles are placed are laminated to form mica particles, the filler particles and the reinforcing material. In the mica insulating tape formed by filling the gap with resin, the thermal conductivity of the resin is 0.6
We propose a high thermal conductive insulation tape with W / mK or more.

The present invention further relates to a rotary electric machine device in which a coil having conductors covered with an insulating material is inserted into a slot formed in a circumferential direction of a core of a rotary electric machine, and a wedge is attached to an upper portion of the slot to fix the coil. In, the coil laminates mica particles, filler particles having a thermal conductivity of at least 5 W / mK or more, and mica particles and a reinforcing material on which the filler particles are placed, and a resin is placed in a gap between the mica particles, the filler particles and the reinforcing material. It is a coil in which a mica insulating tape formed by filling is wrapped around a conductor for insulation treatment, and the thermal conductivity of the resin is
A rotary electric machine device with a power of 0.6 W / mK or more is proposed.

[0009]

FIG. 1 is a sectional view showing the structure of a high thermal conductive mica insulating tape used for coil insulation treatment. The high thermal conductive mica insulating tape is a mica layer 1 composed of mica particles having a withstand voltage property and a resin filling gaps between them.
And a particle-filled resin layer 2 made of high-thermal-conductivity filled particles having a high thermal conductivity and a resin filling the gaps between the particles, and a cloth 3 as a reinforcing material for supporting the mica layer 1 and the particle-filled resin layer 2. Has been done.

In the high thermal conductive mica insulating tape, the part which maintains the high withstand voltage is the mica layer 1 which is mainly composed of mica particles and the resin filling the gaps between them, and the part in charge of the high thermal conductivity of the insulating layer is The particle-filled resin layer 2 is composed of high-thermal-conductivity filled particles and a resin.

In insulating the coil, first, referring to FIG.
As shown in (1), the high thermal conductive mica insulating tape 4 is wound around the coil conductor 5 in which the wires are gathered in advance so as to be overlapped by half the tape width.

Next, as shown in FIG. 3, pressure 7 is applied to the high thermal conductive mica insulating tape 4 wrapped around the coil conductor 5.
And heating to cure the resin in the tape.
As a result, as shown in FIG. 3, a high thermal conductive mica insulating layer 12 in which the mica layer 1 and the layer 6 made of the particle-filled resin and the cloth are alternately laminated is formed.

The thermal conductivity of the resin filled with particles is, for example, "Kansei""composite type thermal conductivity, mainly polymer materials mixed with filler", "Polymer" vol.26, pp557-561, 8 Month issue
As described in (1977), the thermal conductivity of particles and the thermal conductivity of resin represented by the formula (1) 1-Vf = {(λf−λA) / (λf−λr)} × (λr / λA ) ^{1 / (X + 1)} ..... depends on (1). Here, Vf is the volume content of the packed particles, λA is the thermal conductivity of the particle-filled resin layer, λf is the thermal conductivity of the particles, λr is the thermal conductivity of the resin alone, and x is the thermal conductivity of the particles. Coefficient (x determined by shape and thermal conductivity of resin
= Around 2).

The mica layer 1 is made by impregnating a resin into a mica paper which is made by picking up fine flakes of mica crushed in water. Since the mica and the resin are laminated alternately, the thermal conductivity in the thickness direction of the mica layer 1 made of the mica and the resin is expressed by the formula (2) λM = 1 / {hm / λm + (1- hm) / λr} ……… It is expressed by (2). Here, λM is the thermal conductivity in the thickness direction of the mica layer 1, hm is the thickness ratio of the mica part in the mica layer 1, λm is the thermal conductivity of mica, and λr is the thermal conductivity of resin. Is.

The approximate thermal conductivity in the thickness direction of a high thermal conductive mica insulating layer having a layered structure in which a layer 6 made of particle-filled resin and cloth and a mica layer 1 made of mica and resin are alternately layered, (3) Formula λ = 1 / {hA / λA + (1-hA) / λM} ... (3) Here, λ is the thermal conductivity of the high thermal conductive mica insulating layer, hA is the thickness ratio of the particle-filled resin layer 2 in the high thermal conductive mica insulating layer, λA is the thermal conductivity of the particle-filled resin layer 2, λM Is the thermal conductivity of the mica layer 1.

Regarding the thermal conductivity of the layer 6 composed of the particle-filled resin and the cloth, the volume ratio of the cloth to the layer 6 is 10.
%, It was approximated by the particle-filled resin layer 2.

In order to increase the thermal conductivity of the particle-filled resin layer 2 composed of the high thermal conductive filling particles and the resin, the volume ratio of the high thermal conductive filling particles should be increased.

However, if the volume ratio of the high thermal conductive filler particles is increased, it becomes difficult to disperse the filler particles and voids tend to remain, which deteriorates the withstand voltage. Further, since the elastic modulus of the high thermal conductive filling particles such as alumina is higher than that of the resin by two orders of magnitude, almost all the strain applied to the particle filling resin layer 2 is applied to the resin portion.

Therefore, when the volume ratio of the high thermal conductive filling particles is increased, the breaking strain of the insulating layer having the particle filling resin layer 2 is reduced.

The breaking strain ratio Rs of the particle-filled resin layer and the resin not filled with particles is approximately expressed by the equation (4) Rs = 1-Vf (4). Here, Vf is the volume content of the filled particles.

The thermal conductivity of the barrack type epoxy resin used in the conventional high thermal conductive mica insulating tape is 0.2
It is around 4 W / mK.

FIG. 4 shows a thermal conductivity of 0.2 using the equation (1).
The result of having calculated | required the heat conductivity of the material which added the alumina particle | grains of 30 W / mK of thermal conductivity to the resin of 4 W / mK by volume content Vf is shown. FIG. 4 also uses equation (4)
The result of having asked for relation between breaking strain ratio Rs and volume fraction Vf of particles is shown.

When the volume content of alumina particles is increased, the thermal conductivity is improved, but the fracture strain ratio is reduced, and cracks are likely to occur due to electromagnetic force or thermal stress, which lowers the insulating property. Thus, there was an upper limit to the amount of high thermal conductive filler particles that can be filled. The upper limit of the breaking strain ratio is 3 of the breaking strain ratio of 0.6 at the conventional particle volume content of 0.4.
It was about 0.45, which was / 4 times. The volume content of the particles at this time is 0.55 from FIG. 4, and the thermal conductivity of the resin containing the alumina particles in the volume content of 0.55 is 2.2 W / mK.

FIG. 5 shows a thermal conductivity of 30 W using the equation (1).
2 shows the relationship between the thermal conductivity λA of the particle-filled resin layer 2 having a volume content of 0.4 / mK of alumina particles and the thermal conductivity λr of the resin. In order to obtain the particle-filled resin layer 2 having a thermal conductivity of 2.2 W / mK or more with a margin of rupture strain, it is necessary to set the thermal conductivity of the resin to 0.6 W / mK or more from FIG. is there.

FIG. 6 shows a case in which the thermal conductivity λm of mica is set to 0.6 W / mK and the thickness ratio hm of the mica part in the mica layer 1 is set to 0.4 using the equation (2). The result of obtaining the relationship between the thermal conductivity λM of the mica layer 1 in the thickness direction and the thermal conductivity λr of the resin is shown. When the same resin as that used for the particle-filled resin layer 2 is applied to the resin used for the mica layer to increase the thermal conductivity of the resin from 0.24 W / mK to 0.6 W / mK, the mica layer 1 It can be seen that the thermal conductivity increases 1.5 times.

FIG. 7 shows that by using the formulas (1) to (3), the particle-filled resin layer 2 and the mica layer 1 in which alumina particles having a thermal conductivity of 30 W / mK are added in a volume content of 0.4 are alternately formed. The result of obtaining the relationship between the thermal conductivity λ in the thickness direction of the high thermal conductive mica insulating layer having the overlapping structure and the thermal conductivity λr of the resin is shown. Thermal conductivity of resin from 0.24 W / mK to 0.6
It can be seen that the thermal conductivity in the thickness direction of the high thermal conductive mica insulating layer increases 1.8 times when the W / mK is increased.

Therefore, as a result of various investigations on the means for making the resin have a high thermal conductivity, the inventors have found that the thermal conductivity using an epoxy compound having a mesogen in the molecule or a curing agent for an epoxy resin is 0.6 W / mK. The above epoxy resin was found. That is, the inventors have found a resin composition for an insulating tape that can increase the thermal conductivity while maintaining the volume filling rate of particles in the particle filling resin layer 2 to be equal to the conventional one.

Mesogen refers to a functional group that exhibits liquid crystallinity. Specific examples include biphenyl, terphenyl, phenylbenzoate, azobenzene, stilbene and its derivatives. By using this resin, an insulating layer having high thermal conductivity, high strain at break, and high withstand voltage was obtained. Further, in a generator using a coil having a higher thermal conductivity of the insulating layer, the heat dissipated from the conductor is improved, so that more current can be passed through the coil having the same cross-sectional area. That is, it becomes possible to increase the output of the generators of the same size.

[0029]

[Embodiment 1] FIG. 8 shows a process of producing a high thermal conductive mica insulating tape by applying a resin D to a glass cloth lined mica sheet B by a roll coater in the first embodiment of the high thermal conductive mica insulating tape according to the present invention. FIG.

In the first embodiment, 4- (oxiranylmethoxy) benzoic acid-4,4 '-[1,8-octanediylbis (oxy)] bisphenol ester is used as the epoxy resin monomer and the curing agent is used. 4-
4'-diaminodiphenylmethane was used. The resin obtained by curing the resin composition A containing 341 parts by weight of the epoxy resin monomer and 50 parts by weight of the curing agent at 150 ° C. for 10 hours had a thermal conductivity of 0.83 W / mK.

The manufacturing process of Embodiment 1 using this resin composition A is as follows. First, mica was dispersed in water to give mica particles, and a paper machine was used to produce mica paper having a weight per unit area of 160 g / m ² . A glass cloth having a weight per unit area of 32 g / m ² is used as the reinforcing material, and the mica paper and the glass cloth of the reinforcing material are bonded to each other with an adhesive obtained by adding 10% by weight of methyl isobutyl ketone as a solvent to the resin composition A described above. A glass cloth lined mica sheet B was manufactured.

Alumina particles C were used as the high thermal conductive packing particles. This alumina particle C has a total particle size of 0.24.
The average particle size is 1.8 μm in the range of μm to 18.5 μm.
Is. Alumina particles C were added to and mixed with the solvent-containing resin obtained by adding 10% by weight of methyl isobutyl ketone as a solvent to the resin composition A described above so that the weight ratio with the resin composition A was 2.5: 1. A resin D containing high heat conductive filler particles was produced. The volume content Vf of the alumina particles in the composition obtained by removing the solvent from the resin D is 0.4.

Then, according to the procedure shown in FIG. 8, the resin D is applied to the glass cloth lined mica sheet B so that the weight content of the alumina particles C is 0.3 with respect to the total weight of the high thermal conductive mica insulating tape. It was applied with a roll coater. This sheet was cut into a width of 30 mm to produce a high thermal conductive mica insulating tape containing alumina particles.

A coil conductor 5 having a height of 40 mm, a width of 10 mm, and a length of 1000 mm and having a cross section shown in FIG. While at 150 ° C, 1
After heating for 0 hour, a high thermal conductive mica insulating coil 13 which was insulated from the ground by the high thermal conductive mica insulating layer 12 shown in FIG. 9 was manufactured.

The structure of the high thermal conductive mica insulating layer 12 will be described with reference to the schematic sectional view of the insulating layer in FIG. The high thermal conductive mica insulating layer 12 is the coil conductor 5 which is insulated between the wires.
In order from the side, the mica layer 1 made of a resin in which the mica particles and the resin composition A are hardened, and the layer 6 made of a particle-filled resin in which the resin composition A filled with alumina particles is hardened and glass cloth are alternately stacked. There is.

The results of measuring the dielectric breakdown voltage and the thermal conductivity of this coil are shown as Example 1 in FIG. For the thermal conductivity in the thickness direction, a disc-shaped test piece is taken from the location where the PTFE film is wound on the innermost layer and subjected to insulation treatment, and the temperature difference between the front and back of the test piece and the amount of heat that penetrates in a steady state are measured with a heat flow-through sensor. Calculation device (E-MA manufactured by Dynatec Co., Ltd.
TIC). Dielectric breakdown voltage is JIS C21
16 was measured.

[0037]

Embodiment 2 In Embodiment 2, 4- (4-oxiranylbutoxy) benzoic acid-1,4-phenylene ester is used as the epoxy resin monomer and 4-4′-diaminophenylbenzoate is used as the curing agent. Using. 57 to 273 parts by weight of epoxy resin monomer
Resin composition E containing 1 part by weight of a curing agent at 180 ° C.
The thermal conductivity of the resin cured for 0 hours is 0.69 W / mK
Met.

The manufacturing process of Embodiment 2 using this resin composition E is as follows. First, mica was dispersed in water to obtain mica particles, and a paper machine was used to produce mica paper having a weight per unit area of 160 g / m ² .
A glass cloth having a weight per unit area of 32 g / m ² was used as the reinforcing material, and the resin composition E was bonded with 10% by weight of methyl isobutyl ketone as a solvent to bond the mica paper to the glass cloth of the reinforcing material. A glass cloth lined mica sheet F was manufactured.

The same alumina particles C as in Embodiment 1 were used as the high thermal conductive packing particles. Alumina particles C were added to a resin containing a solvent prepared by adding 10% by weight of methyl isobutyl ketone as a solvent to the resin composition E, and mixed so that the weight ratio with the resin composition E was 2.5: 1. Resin G containing the filler particles was manufactured. The alumina particle volume content Vf of the composition obtained by removing the solvent from this resin G is 0.4.

Then, the resin G was applied to the above-mentioned glass cloth lined mica sheet F so that the weight content ratio of the alumina particles C to the total weight of the high thermal conductive mica insulating tape was 0.3.
Was coated with a roll coater. Width of this sheet is 30
After cutting into mm, a high thermal conductive mica insulating tape containing alumina particles was manufactured.

This high thermal conductive mica insulating tape was wound around a coil conductor 5 having a height of 40 mm, a width of 10 mm and a length of 1000 mm, which had been subjected to an insulation treatment between the wires in advance, half-wrapped, and then 180 ° C. under pressure of 5 MPa. Under high temperature for 10 hours, a high thermal conductive mica insulating coil 15 having ground insulation by the high thermal conductive mica insulating layer 14 shown in FIG. 10 was manufactured.

The results of measuring the dielectric breakdown voltage and the thermal conductivity of this coil are shown as Example 2 in FIG. The methods for measuring the dielectric breakdown voltage and the thermal conductivity in the thickness direction are the same as in Example 1.

[0043]

COMPARATIVE EXAMPLE 1 In Comparative Example 1, a resin composition H prepared by blending 100 parts by weight of novolak type epoxy resin monomer with 3 parts by weight of BF3 monoethylamine was used. The resin obtained by curing the resin composition H at 170 ° C. for 1 hour had a thermal conductivity of 0.24 W / mK. Mica was dispersed in water to obtain mica particles, and a paper machine was used to produce mica paper having a weight per unit area of 160 g / m ² . A glass cloth having a weight per unit area of 32 g / m ² was used as a reinforcing material. Mica paper and a glass cloth as a reinforcing material were attached to each other with an adhesive obtained by adding 6% by weight of methyl ethyl ketone to the resin composition H to manufacture a glass cloth-backed mica sheet J.

The same alumina particles C as in Embodiment 1 were used as the high thermal conductive packing particles. Alumina particles C were added to and mixed with a resin composition prepared by adding 6% by weight of methyl ethyl ketone to the resin composition H so that the weight ratio with the resin composition H was 2.5: 1. A compounded resin K was produced. The volume content Vf of the alumina particles in the composition obtained by removing the solvent from the resin K is 0.4.

Thereafter, the resin K was applied to the above-mentioned glass cloth lined mica sheet J by a roll coater so that the weight content of the alumina particles C was 0.3 with respect to the total weight of the high thermal conductive mica insulating tape. This sheet width 3
A mica insulating tape containing alumina particles was manufactured by cutting it to 0 mm.

The height of the cross section, which has been previously insulated from the wires, is 40 m.
m m width 10 mm, length 100 mm, coiled alumina conductor mica insulating tape half wrapped 7 times, then 110
The conventional high thermal conductive mica coil 17 in which the ground insulating layer is formed by the conventional high thermal conductive mica insulating layer 16 shown in FIG. 11, is heated at 170 ° C. for 1 hour while being heated at 5 ° C. for 15 minutes. Was manufactured.

The results of measuring the dielectric breakdown voltage and the thermal conductivity of this coil are shown in FIG. 12 as Comparative Example 1. The breakdown voltage and the thermal conductivity were measured by the same method as in the first embodiment.

[0048]

[Third Embodiment] FIG. 13 is a partial cross-sectional view showing a schematic structure of a rotary electric machine (third embodiment) according to the present invention. The rotating electrical machine includes a stator frame 100 that holds the bearing 20, a stator 90 that is fixed to the stator frame, and a rotor 80 that is rotatably supported by the bearing 20 and that rotates inside the stator. Composed. The stator 90 includes a stator core 30 and a stator coil 40.

FIG. 14 is a perspective view showing the structure of the stator 90 in which the stator coil 40 is incorporated in the stator core 30. The high-thermal-conductivity mica insulating tape 4 containing alumina particles used in Embodiment 1 is wound around the coil conductor, which has been previously subjected to inter-wire insulation treatment, half-wrapped seven times, and then a glass cloth for surface reinforcement is half-wrapped once and the low-resistance corona is applied. Half shield layer 1
The stator coil 40 was wound around and heated at 150 ° C. for 10 hours while being pressurized with a pressure of 5 MPa to manufacture a stator coil 40 which was insulated from the ground by the high thermal conductive mica insulating layer 12.

Then, as shown in FIG.
The stator coil 40 was incorporated into the slot 50 of the stator by sandwiching the glass fiber reinforced plastics plate 23 between the side and bottom surfaces of the slot 50 and the stator coil 40.
The interphase insulating material 24 was sandwiched between the upper and lower two-stage stator coils 40. The glass fiber reinforced plastic sheet 27 was placed on the stator coil 40, the glass fiber reinforced plastic spring 25 was put therein, and the stator coil 40 was fixed to the slot 50 using the wedge 26.

Thereafter, the coil ends 70 of the stator coil 40 incorporated in the slots of FIG. 13 were connected to each other to reinforce the coil ends. A rotor 80 was incorporated in the stator 90 to manufacture an indirect cooling type generator using air.

A withstand voltage test of this generator stator was conducted according to JEC (J
As a result of applying a test voltage of 1000V + 2E to the rated voltage E according to the withstand voltage test specified by the apanese Electrical Committie), it was confirmed that the product passed. In addition, a value obtained by measuring the rise value of the stator coil conductor temperature during operation by the resistance method and a coil which is grounded with the conventional high thermal conductive insulating layer shown in Comparative Example 1 in the same generator are incorporated into the stator coil. The rise in conductor temperature was compared to the measured value.

As a result, in comparison with the case of using the conventional coil which is ground-insulated by the high thermal conductive insulating layer, when the stator coil 40 which is ground-insulated by the high thermal conductive mica insulating layer 12 according to the present invention is used, 13% increase in conductor temperature
It was confirmed to be lower than the above. This means that the output can be increased by √1.13 = 1.06 times when the same temperature rise is allowed.

[0054]

According to the present invention, mica particles, filler particles having a thermal conductivity of at least 5 W / mK or more, and mica particles and a reinforcing material (glass cloth) on which the filler particles are placed are laminated, and the mica particles and the filler are filled. A high thermal conductive mica insulating layer formed of a mica layer made of mica particles and a resin and a layer made of filled particles, a reinforcing material and a resin is filled around the coil conductor with a resin filled in a gap between the particles and the reinforcing material. In coil wound and insulated, the thermal conductivity of resin is 0.6 W / m
Since it is set to K or more, it is possible to achieve both high thermal conductivity in the thickness direction of the coil insulating layer and high withstand voltage, and to cool air and hydrogen gas to the outside of the small and high output rotating electrical machine device or coil insulating layer. It is possible to provide a high-output rotary electric machine device by the indirect cooling method.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing the structure of a high thermal conductive mica insulating tape used for insulating a coil.

FIG. 2 is a partial cross-sectional perspective view showing a situation in which a high thermal conductive mica insulating tape is wound around a conductor that is a bundle of strands so that ½ of the tape width is overlapped and wound.

FIG. 3 is a cross-sectional view showing a situation in which a resin is cured by applying pressure to a coil wound with a high thermal conductive mica insulating tape.

FIG. 4 is a thermal conductivity λA of a particle-filled resin layer obtained by adding alumina particles having a thermal conductivity of 30 W / mK determined by the formula (1) to a resin having a thermal conductivity of 0.24 W / mK in a volume content Vf; FIG. 3 is a diagram showing the relationship between the fracture strain ratio Rs and the volume content Vf of alumina particles, which is obtained using Equation (4).

FIG. 5 shows the relationship between the thermal conductivity λA of the particle-filled resin layer and the thermal conductivity λr of the resin obtained by adding the alumina particles having a thermal conductivity of 30 W / mK in a volume content of 0.4 using the formula (1). It is a figure.

FIG. 6 is a diagram showing a result of a relationship between a thermal conductivity λM in a thickness direction of a mica layer and a thermal conductivity λr of a resin obtained by using Expression (2).

FIG. 7 shows the relationship between the approximate thermal conductivity λ in the thickness direction of the high thermal conductive mica insulating layer and the thermal conductivity λr of the resin as expressed by equations (1), (2),
It is a figure which shows the result calculated | required using (3).

FIG. 8 is a diagram showing a step of producing a high thermal conductive mica insulating tape by applying a resin D to a glass cloth lined mica sheet B by a roll coater in the first embodiment of the high thermal conductive mica insulating tape according to the present invention.

FIG. 9 is a perspective view showing a high thermal conductive mica insulated coil manufactured according to the first embodiment of the present invention.

FIG. 10 is a perspective view showing a high thermal conductive mica insulated coil manufactured according to Embodiment 2 of the present invention.

11 is a perspective view showing a high thermal conductive mica insulated coil manufactured according to Comparative Example 1. FIG.

FIG. 12 is a first and second embodiments according to the present invention and a first comparative example.
3 is a table showing the thermal conductivity and dielectric breakdown characteristics of the coil insulating layer of FIG.

FIG. 13 is a partial cross-sectional view showing a schematic structure of a rotary electric machine according to a third embodiment of the present invention.

FIG. 14 is a stator coil 40 according to a third embodiment of the present invention.
FIG. 3 is a perspective view showing a structure of a stator in a state where the stator is incorporated in a stator core 30.

[Explanation of symbols]

1 Mica layer consisting of mica particles and filled resin 2 Particle-filled resin layer 3 cross 4 High thermal conductive mica insulation tape 5 Coil conductor that bundles the wires 6 Layer consisting of particle-filled resin and glass cloth 7 Pressure applied to the insulating layer 12 High thermal conductivity mica insulation layer 13 High Thermal Conductivity Mica Insulation Coil of Embodiment 1 14 High thermal conductive mica insulation layer 15 High Thermal Conductive Mica Insulation Coil of Embodiment 2 16 High thermal conductivity mica insulating layer of Comparative Example 1 17 High thermal conductive mica insulation coil of Comparative Example 1 20 bearings 23 Glass fiber reinforced plastics board 24 Interphase insulation 25 glass fiber reinforced plastic springs 26 wedges 27 Glass fiber reinforced plastic sheet 30 stator core 40 Stator coil 50 slots 70 Coil end of stator coil 80 rotor 90 Stator 100 stator frame

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masaki Akatsuka             7-1-1, Omika-cho, Hitachi-shi, Ibaraki Prefecture             Inside the Hitachi Research Laboratory, Hitachi Ltd. F-term (reference) 4F100 AA19A AC05A AG00C AK01B                       AK53B CA02B CA23A CC00B                       DE01A DG10A DG11C DH00C                       EH46 GB48 JG04 JG10 JJ01                       JJ01A YY00 YY00A                 5H604 AA01 AA03 BB01 BB10 BB14                       CC01 CC05 CC14 DA01 DA06                       DA07 DA15 DB02 DB26 PB03                       PD02 PD06

Claims (3)

[Claims] 1. A mica particle, a filler particle having a thermal conductivity of at least 5 W / mK or more, and a reinforcing material on which the mica particle and the filler particle are placed are laminated, and a gap is formed between the mica particle, the filler particle and the reinforcing material. A high thermal conductive insulated coil, wherein a mica insulating tape formed by filling a resin is wrapped around a conductor for insulation, and the resin has a thermal conductivity of 0.6 W / mK or more. 2. A mica particle, a filler particle having a thermal conductivity of at least 5 W / mK or more, and a reinforcing material on which the mica particle and the filler particle are placed, and the gap is provided between the mica particle, the filler particle and the reinforcing material. A mica insulating tape formed by filling a resin, wherein the resin has a thermal conductivity of 0.6 W / mK or more. 3. A rotary electric machine device in which a coil having conductors covered with an insulating material is inserted into a slot formed in a circumferential direction of a core of a rotary electric machine, and a wedge is attached to an upper portion of the slot to fix the coil, The coil is a laminate of mica particles, filler particles having a thermal conductivity of at least 5 W / mK or more, and the mica particles and a reinforcing material on which the filler particles are placed, and a resin is provided in a gap between the mica particles and the filler particles and the reinforcing material. Is a coil in which a mica insulating tape formed by being filled with is wound around a conductor for insulation treatment, wherein the resin has a thermal conductivity of 0.6 W / mK or more.