JP2003007414A - IC socket - Google Patents

Abstract

(57) Abstract: An elastic biasing member such as a coil spring is used together, a contact is divided into a first terminal and a second terminal, and both terminals are inclined so as to be inclined in the same direction. The movement allows the first terminal and the second terminal to contact and separate from each other. SOLUTION: In an IC socket having a contact for forming an electrical connection by mounting an IC package, an elastic biasing member is provided between a fixed socket main body and a pedestal movable in a vertical direction, and the contact is formed in a first position. 1st, 2nd
Separate the top and bottom with the terminal and incline both terminals in the same direction,
The first and second terminals can be contacted and separated by the movement of the pedestal.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket on which an IC package is mounted, and more particularly to an IC socket having a contact provided so as to be connected to a pedestal on which the IC package is mounted. is there.

[0002]

2. Description of the Related Art Conventionally, in an IC socket in which an IC package or the like as an electric component is mounted, an IC socket having a contact for making an electrical connection with an external terminal of the IC package mounted on a pedestal of a socket body is known. Are known.

[0003]

A conventional IC as described above.
In the socket, for example, as shown in FIG.
The IC socket 100 includes a fixed socket body 101,
A contact 10 provided so as to extend between a pedestal 102 to which the IC package 105 is mounted and which can move in the vertical direction, and a pedestal 102 that is fixed to the socket body 101.
3 and 3.

In such a conventional IC socket 100, the pedestal 102 on which the IC package 105 is mounted
103 extending between the socket and the socket body 101
Has a spring-shaped portion 104 that is formed so as to bend and deform in response to the movement of the pedestal 102, for example, in a V shape, and has a self-spring force. The line path length of the corresponding portion of the contact 103 becomes unnecessarily long, and therefore, the line path length as a whole also becomes considerably long, and a sufficient space as an installation height to obtain this required spring length. Is required, IC
The height of the socket 100 as a whole is increased, and the miniaturization of the IC socket 100 comes to be restricted. further,
The height of the IC socket 100 is suppressed, and the contact 103
If the spring-shaped portion 104 is formed in a large arc shape, there is a concern that the arc-shaped portion may be deformed or a short circuit with an adjacent pin may occur. Furthermore, such contacts 103
With such a shape, when the IC socket 100 is assembled, there are problems such as deformation of the contact 103 and restrictions on the assembly of the IC socket 100, resulting in extra man-hours.

Therefore, an object of the present invention is to use an elastic urging member such as a coil spring in combination and to separate a contact into a first terminal and a second terminal in order to solve such a conventional problem. Inclining both terminals to incline in the same direction, the movement of the pedestal causes the first terminal and the second terminal to contact,
It is an object of the present invention to provide an IC socket which can be separated from each other so that the contact height can be reduced and the space can be reduced and the assembling can be facilitated.

[0006]

In order to achieve the above-mentioned object, an IC socket of the present invention is an IC socket having a contact for mounting an IC package to form an electrical connection, and a fixed socket body and a top and bottom. An elastic biasing member is provided between the pedestal movable in the same direction, and the contact is vertically divided into a first terminal and a second terminal, both terminals are inclined in the same direction, and the pedestal is moved to move the first terminal. The second terminal can be brought into contact with and separated from the second terminal.

Further, the IC socket of the present invention is characterized in that the first terminal of the contact is attached to the pedestal as an upper terminal and the second terminal is fixed to the socket body as a lower terminal. .

Further, the IC socket of the present invention is characterized in that the first terminal and the second terminal are in line contact with each other.

Furthermore, the IC socket of the present invention is characterized in that the elastic biasing member is a coil spring.

The IC socket of the present invention is characterized in that the IC package is a land grid array type or a ball grid array type.

Other objects, features and advantages of the present invention will be apparent from the following detailed description of the embodiments of the IC socket of the present invention shown in the accompanying drawings.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Example) FIG. 1 shows an IC of the present invention.
FIG. 2 is a sectional view showing an embodiment of the socket in a contact open state, FIG. 2 is an enlarged partial view of a contact portion of the IC socket of FIG. 1, and FIG. 3 is a view when the base of the IC socket in FIG. 1 is pressed. FIG. 4 is a sectional view similar to FIG. 1 showing a contact state, and FIG. 4 is an enlarged partial view of a contact portion of the IC socket of FIG.

As shown in FIGS. 1 to 4, an IC socket 1 of the present invention is an IC socket having a contact 5 for mounting an IC package 10 to form an electrical connection, and a fixed socket body 2 And IC package 10
A vertically movable pedestal 3 on which the slab is mounted, an elastic urging member 4 such as a coil spring provided between the socket body 2 and the pedestal 3, an upper terminal 6 of the first terminal and a lower terminal of the second terminal 7 and a contact 5 divided into two parts.
Further, in this embodiment, the IC package 10 includes
For example, land grid array type, ball
A grid array type IC package is used.

In the IC socket 1 of the present invention, the socket body 2 is a fixed member and has a large number of contacts 5.
Are fixedly mounted, and further, these contacts 5 include an upper terminal 6 as a first terminal and a lower terminal 7 as a second terminal.
The upper terminal 6 is attached to a pedestal 4 as an IC mounting substrate, and the lower terminal 7 is fixed to the socket body 2. Moreover, the upper terminal 6 and the lower terminal 7 are inclined in the same direction with the same inclination angle α. Further, the inclination angle α between the upper terminal 6 and the lower terminal 7 of the contact 5 is such that when the pedestal 4 is pressed and moves downward as shown by the arrow in FIG.
Is preferably selected so as to make a good line contact with the lower terminal 7 with a sufficient contact length.

The upper terminal 6 of the contact 5 is attached to the opening 8 provided in the pedestal 3 from the lower surface side by hammering or inserting, and is aligned downward at a predetermined inclination angle α. On the other hand, the lower terminal 7 is inserted into the hole 9 of the socket body 2 and attached thereto, and is fixed to the upper terminal 6 with the same inclination angle α and aligned in the same direction. .

Therefore, when the pedestal 3 is pushed up to the upper position as shown in FIG. 1 by the spring force of the elastic biasing member 4 such as a coil spring, the upper terminal 6 and the lower terminal 7 of the contact 5 are As shown in FIG. 2, they are separated from each other and electrically isolated. On the other hand, as shown in FIG. 3, the pedestal 3 moves downward directly or indirectly through a cover (not shown) or the like against the elastic force such as the spring force of the elastic urging member 4. When pressed, the upper terminal 6 is moved downward toward the lower terminal 7, and as shown in FIG. 4, they are in contact with each other with appropriate lengths and are preferably in line contact. The terminal 6 and the lower terminal 7 are electrically connected.

According to the IC socket of the present invention having such a structure, the first and second contacts 5 are contacted by the elastic force which is the repulsive force of the elastic biasing member 4 such as the coil spring.
The contact force of the upper and lower terminals 6 and 7, which are terminals, is obtained, and the required contact force can be easily set only by selecting the coil spring as the elastic biasing member 4. By eliminating the intermediate spring portion in the contact 5, the line length of the contact 5 can be shortened and the inductance can be reduced, so that the high frequency characteristics are excellent and the contact 5 can be placed above and below the upper terminal 6 and the lower terminal 7. By dividing the contact 5 into two parts, the assembly is facilitated, the handling of the contact 5 is facilitated, and the mounting of the contact 5 such as driving and insertion, and the assembly of parts with the pedestal 3 are facilitated, and the contact 5 The shake due to rattling is eliminated, the accuracy of the contact pitch is improved, and the variation in the contact position of the contact 5 is also reduced. To become.

Further, the I of the present invention thus constructed is
In the C socket 1, the work of inserting the IC package 10 into the IC socket 1 can be suitably performed by an automatic machine such as a robot or by manual work, and accurate positioning can be performed.
It is possible to improve the efficiency of the work of mounting the IC package 10 on the IC socket 1 and improve the efficiency.

[0019]

As described above, the IC socket according to claim 1 of the present invention is an IC socket having a contact for mounting an IC package to form an electrical connection, and is movable vertically with respect to a fixed socket body. An elastic biasing member is provided between the first and second terminals, and the contact is divided into a first terminal and a second terminal vertically to incline both terminals in the same direction, and the first and second terminals are moved by moving the pedestal. Since the terminals can be contacted and separated from each other, a sufficient contact force can be set by the spring force of the coil spring that is the elastic biasing member, and the line path length of the contact portion can be shortened.
The space required for the height is small to obtain the required spring length, the socket height can be reduced, and the contact can be divided into two parts for easy assembly. Can be improved and variation in contact position can be reduced.

The IC socket according to claim 2 of the present invention is
The first terminal of the contact is attached to the pedestal as an upper terminal, and the second terminal is fixed to the socket body as a lower terminal. Therefore, the first and second terminals can be easily driven by inserting or inserting. It can be easily installed and assembled.

The IC socket according to claim 3 of the present invention is
Since the first terminal and the second terminal are in line contact with each other, the terminals can be satisfactorily contacted by a simple means, and the assembly can be easily performed with a simple structure.

The IC socket according to claim 4 of the present invention is
Since the elastic biasing member is a coil spring, it can be mass-produced easily and inexpensively.

The IC socket according to claim 5 of the present invention is
Since the IC package is a land grid array type or a ball grid array type, any of these types of IC packages can be satisfactorily mounted and a simple structure can be formed.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of an IC socket of the present invention.

FIG. 2 is an enlarged partial view of a contact portion of the IC socket of the present invention shown in FIG.

FIG. 3 is a sectional view similar to FIG. 1 when an IC package is mounted and pressed on the base of the IC socket of the present invention.

FIG. 4 is an enlarged partial view of a contact portion in the IC socket of the present invention in FIG.

FIG. 5 is a cross-sectional view showing a conventional IC socket.

[Explanation of symbols]

1 IC socket 2 socket body 3 pedestals 4 coil spring 5 contacts 6 Upper terminal (first terminal) 7 Lower terminal (2nd terminal) 8 openings 9 holes 10 IC package 100 IC socket 101 Socket body 102 pedestal 103 contacts 104 Spring shape part 105 IC package

Claims (5)

[Claims] 1. An IC socket having a contact for mounting an IC package to form an electrical connection, wherein an elastic biasing member is provided between a fixed socket body and a vertically movable pedestal, and the contact is provided. An IC socket, characterized in that the first and second terminals are vertically separated and both terminals are inclined in the same direction so that the first and second terminals can be brought into contact with and separated from each other by movement of the pedestal. 2. The IC socket according to claim 1, wherein the first terminal of the contact is attached to the pedestal as an upper terminal, and the second terminal is fixed to the socket body as a lower terminal. 3. The IC socket according to claim 1, wherein the first terminal and the second terminal are in line contact with each other. 4. The IC socket according to claim 1, wherein the elastic biasing member is a coil spring. 5. The IC socket according to claim 1, wherein the IC package is a land grid array type or a ball grid array type.