JP2003078322A - Built-in antenna for mobile phone and mobile phone - Google Patents
Built-in antenna for mobile phone and mobile phoneInfo
- Publication number
- JP2003078322A JP2003078322A JP2001262100A JP2001262100A JP2003078322A JP 2003078322 A JP2003078322 A JP 2003078322A JP 2001262100 A JP2001262100 A JP 2001262100A JP 2001262100 A JP2001262100 A JP 2001262100A JP 2003078322 A JP2003078322 A JP 2003078322A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- antenna
- mobile phone
- molded product
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 77
- 239000011347 resin Substances 0.000 claims abstract description 77
- 239000002131 composite material Substances 0.000 claims abstract description 30
- 229910052751 metal Inorganic materials 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 29
- 238000007747 plating Methods 0.000 claims abstract description 21
- 238000001746 injection moulding Methods 0.000 claims abstract description 12
- 239000003365 glass fiber Substances 0.000 claims description 8
- 229920010524 Syndiotactic polystyrene Polymers 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 abstract description 11
- 229920003023 plastic Polymers 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000013461 design Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 101100454433 Biomphalaria glabrata BG01 gene Proteins 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Details Of Aerials (AREA)
- Support Of Aerials (AREA)
- Telephone Set Structure (AREA)
Abstract
(57)【要約】
【課題】製造能率を高め、プラスチック成形品のフレキ
シビリティに富み、デザイン性や三次元（立体構造）性
における設計の自由度を向上させた携帯電話機用内蔵ア
ンテナを提供すること、及びそのようなアンテナを使用
した携帯電話機を提供することを目的とする。
【解決手段】難めっき性樹脂からなる成形品２及び易め
っき性樹脂からなる成形品３の複合成形品１を、易めっ
き性樹脂からなる成形品３の少なくとも―部が複合成形
品１の外側表面に露出するように二段階射出成形法によ
り形成し、易めっき性樹脂からなる成形品３の表面にめ
っきされた導電金属層５を形成する。前記複合成形品１
の易めっき性樹脂からなる成形品３に、アンテナ用外部
回路に前記導電金属層５を介して弾性的に嵌合接続され
る構造を有するコンタクト部４を備えた携帯電話機用内
蔵アンテナを得る。及びそのようなアンテナを備えた携
帯電話機を得る。
(57) [Problem] To provide a built-in antenna for a mobile phone, which has improved manufacturing efficiency, has high flexibility of a plastic molded product, and has improved design flexibility in design and three-dimensional (three-dimensional structure). And a mobile phone using such an antenna. A composite molded article (1) comprising a molded article (2) made of a hard-to-plate resin and a molded article (3) made of an easily-plated resin is used. A conductive metal layer 5 is formed on the surface of a molded product 3 made of an easily-platable resin by a two-stage injection molding method so as to be exposed on the surface. The composite molded article 1
A built-in antenna for a mobile phone having a contact portion 4 having a structure to be elastically fitted and connected to an external circuit for an antenna via the conductive metal layer 5 to a molded product 3 made of an easily plating resin. And a mobile phone equipped with such an antenna.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、製造能率に優れた
携帯電話機用内蔵アンテナ及びそのようなアンテナを内
蔵した携帯電話機に関し、さらにはプリント基板等との
構造的接続と電気的接続の両者において高い信頼性を備
えた携帯電話機用内蔵アンテナ及びそのようなアンテナ
を内蔵した携帯電話機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a built-in antenna for a mobile phone, which is excellent in manufacturing efficiency, and a mobile phone having such an antenna built therein. Further, in both structural connection and electrical connection with a printed circuit board or the like. The present invention relates to a highly reliable built-in antenna for a mobile phone and a mobile phone having such an antenna built therein.
【０００２】[0002]
【従来の技術】従来の携帯電話機用内蔵アンテナ１０
は、例えば図４に示す構成である。銅板を所定形状に打
ち抜いたアンテナプレート１１をプラスチック成形品１
２に貼り合わせ、そのプラスチック成形品１２とプリン
ト基板１３とをねじ１４によりねじ止めにより固定し、
機械的（構造的）に接続していた。2. Description of the Related Art A conventional built-in antenna 10 for a mobile phone.
Is, for example, the configuration shown in FIG. An antenna plate 11 obtained by punching a copper plate into a predetermined shape is used as a plastic molded product 1
2, and the plastic molded product 12 and the printed circuit board 13 are fixed by screws 14 with screws,
It was mechanically (structurally) connected.
【０００３】また、アンテナプレート１１をプリント基
板１３に接続するために曲げ加工を施してコンタクト部
１１ａを形成し、金属製のコンタクトピン１５によりア
ンテナプレート１１とプリント基板１３とを電気的に接
続していた。Further, in order to connect the antenna plate 11 to the printed circuit board 13, a bending process is performed to form a contact portion 11a, and the metal contact pin 15 electrically connects the antenna plate 11 and the printed circuit board 13. Was there.
【０００４】[0004]
【発明が解決しようとする課題】しかし、従来の携帯電
話機用内蔵アンテナによると、プリント基板とプラスチ
ック成形品とをねじ止めにより固定する必要があり、ま
た、プリント基板と銅板とを金属製コンタクトピンによ
り電気的に接続する必要があった。さらに、銅板を所定
形状に打ち抜いたり、曲げ加工を必要とするなど、多く
の工程が必要であり、製造能率が低く、大量生産が困難
であるという問題があった。However, according to the conventional built-in antenna for mobile phones, it is necessary to fix the printed circuit board and the plastic molded product by screwing, and the printed circuit board and the copper plate are made of metal contact pins. Had to be electrically connected. Furthermore, there are problems that many steps are required such as punching a copper plate into a predetermined shape and bending, and the manufacturing efficiency is low and mass production is difficult.
【０００５】また、プラスチック成形品にアンテナプレ
ートを貼り合わせているため、プラスチック成形品のフ
レキシビリティが劣るという問題があった。Further, since the antenna plate is attached to the plastic molded product, there is a problem that the flexibility of the plastic molded product is poor.
【０００６】更に、銅板を曲げ加工するため、デザイン
性や三次元（立体構造）性における設計の自由度が制限
されるという問題があった。Further, since the copper plate is bent, there is a problem in that the degree of freedom in designing in terms of designability and three-dimensional (three-dimensional structure) property is limited.
【０００７】従って、本発明の目的は、大量生産に適す
るよう製造能率を高めるとともに、プラスチック成形品
のフレキシビリティに富み、デザイン性や三次元（立体
構造）性における設計の自由度を向上させた携帯電話機
用内蔵アンテナを提供すること、及びそのようなアンテ
ナを使用した携帯電話機を提供することにある。Therefore, the object of the present invention is to improve the manufacturing efficiency so as to be suitable for mass production, and to enhance the flexibility of plastic molded products, and to improve the degree of freedom in design in terms of designability and three-dimensional (three-dimensional structure) property. It is to provide a built-in antenna for a mobile phone, and to provide a mobile phone using such an antenna.
【０００８】[0008]
【課題を解決するための手段】本発明は、前記目的を達
成するために、金属めっきが形成され難い樹脂（以下、
「難めっき性樹脂」という）からなる成形品及び金属め
っきが形成され易い樹脂（以下、「易めっき性樹脂」と
いう）からなる成形品の複合成形品と、前記複合成形品
の易めっき性樹脂からなる成形品の表面にめっきされた
導電金属層とからなる携帯電話機用内蔵アンテナにおい
て、前記複合成形品の易めっき性樹脂からなる成形品の
一部に形成され、アンテナ用外部回路に前記導電金属層
を介して弾性的に嵌合接続される構造を有するコンタク
ト部を備えたことを特徴とする携帯電話機用内蔵アンテ
ナを提供する。In order to achieve the above-mentioned object, the present invention provides a resin (hereinafter
A composite molded product of a molded product made of "difficult-to-plate resin" and a resin in which metal plating is easily formed (hereinafter referred to as "easy-platable resin"), and an easily-plated resin of the composite molded product. In a built-in antenna for a mobile phone, which comprises a conductive metal layer plated on the surface of a molded product made of, the conductive product is formed on a part of the molded product made of the easily-platable resin of the composite molded product, and is formed on the external circuit for the antenna. Provided is a built-in antenna for a mobile phone, comprising a contact portion having a structure that is elastically fitted and connected via a metal layer.
【０００９】また、前記複合成形品は、二段階射出成形
によって得られることを特徴とする携帯電話機用内蔵ア
ンテナを提供する。Further, the composite molded article is provided with a built-in antenna for a mobile phone, which is obtained by two-step injection molding.
【００１０】さらに、前記二段階射出成形は、前記易め
っき性樹脂からなる成形品の少なくとも―部が前記複合
成形品の外側表面に露出するように行われることを特徴
とする携帯電話機用内蔵アンテナを提供する。Further, the two-step injection molding is performed so that at least a part of the molded product made of the easily-plated resin is exposed on the outer surface of the composite molded product. I will provide a.
【００１１】前記難めっき性樹脂及び前記易めっき性樹
脂は、少なくとも一方の樹脂がシンジオタクチックポリ
スチレンを主体とした組成物であることを特徴とする携
帯電話機用内蔵アンテナを提供する。There is provided a built-in antenna for a mobile phone, characterized in that at least one of the hardly-plating resin and the easily-plating resin is a composition whose main component is syndiotactic polystyrene.
【００１２】また、前記易めっき性樹脂は、ガラスファ
イバーを含有させないことで弾性率を増加させたことを
特徴とする携帯電話機用内蔵アンテナを提供する。Further, there is provided a built-in antenna for a mobile phone, wherein the easily-platable resin has an increased elastic modulus by not containing glass fiber.
【００１３】本発明は、前記目的を達成するために、携
帯電話機本体と前記携帯電話機本体に内蔵された携帯電
話機用内蔵アンテナを備えた携帯電話機において、前記
携帯電話機用内蔵アンテナは、金属めっきが形成され難
い樹脂（以下、「難めっき性樹脂」という）からなる成
形品及び金属めっきが形成され易い樹脂（以下、「易め
っき性樹脂」という）からなる成形品の複合成形品と、
前記複合成形品の易めっき性樹脂からなる成形品の表面
にめっきされた導電金属層とからなり、前記複合成形品
の易めっき性樹脂からなる成形品の一部に形成され、ア
ンテナ用外部回路に前記導電金属層を介して弾性的に嵌
合接続される構造を有するコンタクト部を備えた携帯電
話機用内蔵アンテナであることを特徴とする携帯電話機
を提供する。In order to achieve the above object, the present invention provides a mobile phone having a mobile phone main body and a mobile phone internal antenna built in the mobile phone main body, wherein the mobile phone internal antenna is metal-plated. A composite molded product of a molded product made of a resin that is difficult to form (hereinafter referred to as “hard plating resin”) and a resin that is easily formed with metal plating (hereinafter referred to as “easy plating resin”),
An external circuit for an antenna, comprising a conductive metal layer plated on the surface of a molded article of the composite molded article made of an easily plateable resin and formed on a part of the molded article made of the easily plated resin of the composite molded article. And a built-in antenna for a mobile phone having a contact portion having a structure that is elastically fitted and connected via the conductive metal layer.
【００１４】[0014]
【発明の実施の形態】本発明においては、難めっき性樹
脂からなる成形品及び易めっき性樹脂からなる成形品の
複合成形品は、上記の目的を達成することが可能であれ
ばよく、三次元射出回路部品（ＭＩＤ：Ｍｏｌｄｅｄ
Ｉｎｔｅｒｃｏｎｎｅｃｔ Ｄｅｖｉｃｅ）とすること
が好ましい。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a composite molded product of a molded product made of a difficult-to-plate resin and a molded product made of an easily-platable resin may be any as long as it can achieve the above-mentioned object. Original injection circuit component (MID: Molded
It is preferable to use the Internet Device).
【００１５】本発明における複合成形品であるＭＩＤ
は、二段階射出成形により得ることができる。難めっき
性樹脂及び易めっき性樹脂を二段階射出成形して複合成
形品を得る場合、難めっき性樹脂と易めっき性樹脂のど
ちらを一次成形品としても良いが、一次成形品を金型上
に保持したまま、二次成形用樹脂を射出成形する。特
に、難めっき性樹脂を成型したのち、易めっき性樹脂を
成型することが好ましい。MID which is a composite molded article in the present invention
Can be obtained by two-stage injection molding. When a composite molded product is obtained by two-step injection molding of a difficult-to-plate resin and an easily-platable resin, either the difficult-to-plate resin or the easily-platable resin may be the primary molded product. While being held at, the secondary molding resin is injection-molded. In particular, it is preferable to mold the difficult-plating resin and then mold the easily-plating resin.
【００１６】本発明において、難めっき性樹脂として
は、ポリエステル、ポリフェニレンサルファイド、ポリ
エーテルエーテルケトン、ポリエーテルイミド、ポリス
ルホン、ポリエーテルスルホン、シンジオタクチックポ
リスチレンから選ばれる樹脂が挙げられる。In the present invention, examples of the plating-resistant resin include resins selected from polyester, polyphenylene sulfide, polyether ether ketone, polyether imide, polysulfone, polyether sulfone, and syndiotactic polystyrene.
【００１７】易めっき性樹脂としては、上記難めっき性
樹脂と同様の樹脂に無電解めっき用触媒を充填したもの
が挙げられる。無電解めっき用触媒の代表例としては、
粉末珪酸アルミニウムにパラジウムを吸着させたものを
挙げることができる。Examples of the easily-platable resin include those obtained by filling the same resin as the hard-to-plate resin with a catalyst for electroless plating. As a typical example of the electroless plating catalyst,
Examples thereof include powder aluminum silicate in which palladium is adsorbed.
【００１８】難めっき性樹脂及び易めっき性樹脂は、と
もに、低誘電率、低誘電正接であり、ガラスファイバー
を含有させないことで弾性率（バネ特性）の低下を防
ぎ、かつ、軽量であるシンジオタクチックポリスチレン
が好ましいが、少なくとも易めっき性樹脂は、ガラスフ
ァイバーを含有しないシンジオタクチックポリスチレン
であることが好ましい。The hard-to-plate resin and the easily-platable resin both have a low dielectric constant and a low dielectric loss tangent. By not containing glass fiber, the elastic modulus (spring characteristic) is prevented from lowering, and the synergistic weight is low. Otatic polystyrene is preferable, but at least the easily-platable resin is preferably syndiotactic polystyrene containing no glass fiber.
【００１９】本発明の前記複合成形品においては、易め
っき性樹脂からなる成形品の少なくとも―部が複合成形
品の外側表面に露出するように二段階射出成形を行う。
これにより、後述の前記導電金属層とアンテナ用外部回
路（プリント基板）との電気的接続にとってより良い構
成となる。In the composite molded article of the present invention, two-stage injection molding is performed so that at least part of the molded article made of the easily-plated resin is exposed on the outer surface of the composite molded article.
This provides a better structure for electrical connection between the conductive metal layer described later and the antenna external circuit (printed circuit board).
【００２０】また、プリント基板との固定のため、弾性
的に嵌合接続される構造を有するコンタクト部、好まし
くは弾性（バネ性）を有する成形樹脂で形成されたパチ
ンと嵌める構造であるスナップフィット構造を有する電
気的接続用コンタクト部が易めっき性樹脂からなる成形
品の部分に設けられる。Further, for fixing to the printed circuit board, a snap fit which is a structure to be fitted with a contact portion having a structure to be elastically fitted and connected, preferably a snap formed of a molding resin having elasticity (spring property). An electrically connected contact portion having a structure is provided on a portion of a molded product made of an easily plating resin.
【００２１】そして、めっき、好ましくは無電解めっき
により前記複合成形品の易めっき性樹脂からなる成形品
の表面に導電金属層を形成し、前記複合成形品に一体化
された弾性を有したスナップフィット構造付き樹脂製コ
ンタクト部は、前記導電金属層を介してアンテナ用外部
回路（プリント基板）と電気的に接続するように構成す
る。Then, a conductive metal layer is formed on the surface of the molded product of the easily molded resin of the composite molded product by plating, preferably electroless plating, and the snap having elasticity integrated with the composite molded product is formed. The resin contact portion with a fit structure is configured to be electrically connected to the antenna external circuit (printed circuit board) through the conductive metal layer.
【００２２】このような二段階射出成形によるアンテナ
は、プリント基板とのコンタクト部分も含め、一体成形
が可能であり、製造能率に優れ、大量生産が容易とな
る。また、所望の曲面型等の三次元形状を容易に実現で
き、デザイン性や三次元（立体構造）性における設計の
自由度が向上する。更に、フレキシビリティに富むプラ
スチック成形品を提供することができる。Such an antenna formed by two-step injection molding can be integrally molded including the contact portion with the printed circuit board, is excellent in manufacturing efficiency, and can be easily mass-produced. In addition, a desired three-dimensional shape such as a curved surface type can be easily realized, and the degree of freedom in design in terms of designability and three-dimensional (three-dimensional structure) is improved. Further, it is possible to provide a plastic molded product having a great flexibility.
【００２３】一方、プリント基板とのコンタクト部分も
含めアンテナ全体がプラスチック成形品により構成され
るため、長期間の使用により樹脂の塑性変形が起こり、
プリント基板への電気的接続の信頼性低下も危惧される
ことから、より高い信頼性を保持するため、少なくとも
樹脂製コンタクト部は、バネ性に富んだ樹脂を採用する
必要がある。特にガラスファイバーを含有しないで弾性
率の低下を防ぎ、バネ性に富んだ樹脂を採用することが
望ましい。また、必要に応じて突起形状を設けても良
い。On the other hand, since the entire antenna including the contact portion with the printed circuit board is made of a plastic molded product, plastic deformation of the resin occurs due to long-term use.
Since the reliability of electrical connection to the printed circuit board may be deteriorated, at least the resin contact portion needs to be made of a resin having a high spring property in order to maintain higher reliability. In particular, it is desirable to use a resin that does not contain glass fibers to prevent a decrease in elastic modulus and has a high spring property. Moreover, you may provide a protrusion shape as needed.
【００２４】本発明においては、上記の弾性的に嵌合接
続される構造を有するコンタクト部を有するため、従来
の携帯電話機用内蔵アンテナと同等のプリント基板との
構造的接続と電気的接続の両者における高い信頼性を保
持できる携帯電話機用内蔵アンテナを提供できる。In the present invention, since the contact portion having the above-mentioned elastically fitted connection structure is provided, both the structural connection and the electrical connection with the printed circuit board equivalent to the conventional built-in antenna for a mobile phone are provided. It is possible to provide a built-in antenna for a mobile phone, which can maintain high reliability.
【００２５】また、上記のような材質及び構成のアンテ
ナを内蔵した携帯電話機は、所望の曲面型等の三次元形
状の筐体を有することができるとともに、電気的接続に
おいて高い信頼性を保持できる。Further, the mobile phone having the antenna of the above-mentioned materials and structure built therein can have a three-dimensional housing such as a desired curved surface type, and can maintain high reliability in electrical connection. .
【００２６】[0026]
【実施例】以下、本発明の実施例について、図面を参照
しながら説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００２７】図１は、本発明の一実施例である立体図、
図２は、図１のＩ-Ｉ線に沿う断面図である。FIG. 1 is a perspective view showing an embodiment of the present invention,
FIG. 2 is a sectional view taken along the line II of FIG.
【００２８】本発明に係る携帯電話機用アンテナは、以
下のように複合成形品１に形成する。複合成形品１は、
難めっき性樹脂を射出成形した第１の成形品２と、易め
っき性樹脂を射出成形した第２の成形品３を２段階射出
成形法により形成する。The mobile phone antenna according to the present invention is formed in the composite molded article 1 as follows. The composite molded article 1 is
A first molded product 2 made by injection-molding a hard-to-plate resin and a second molded product 3 made by injection-molding an easily-platable resin are formed by a two-stage injection molding method.
【００２９】第２の成形品３には、プリント基板６を固
定するため、ばね性を有する樹脂で形成したスナップフ
ィット構造を有する電気的接続用コンタクト部４が形成
されている。また、スナップフィット構造を有する電気
的接続用コンタクト部４の下端４１が折り曲げられるこ
とで、プリント基板６との面接触が確保されている。In order to fix the printed circuit board 6, the second molded product 3 is provided with an electrical connection contact portion 4 having a snap-fit structure formed of a resin having a spring property. Further, by bending the lower end 41 of the electrical connection contact portion 4 having the snap-fit structure, surface contact with the printed circuit board 6 is ensured.
【００３０】また、第２の成形品３の一部は、複合成形
品１の外側表面に露出している。このため、アンテナ形
状を確保するために易めっき性樹脂をマスキング等する
工程数の低減が図れる。第２の成形品３は、無電解銅め
っき法により所定形状に形成した導電金属層５が設けら
れている。この導電金属層５は、アンテナの放射素子の
役目を果たす。A part of the second molded product 3 is exposed on the outer surface of the composite molded product 1. Therefore, it is possible to reduce the number of steps for masking the easily-platable resin to secure the antenna shape. The second molded product 3 is provided with a conductive metal layer 5 formed in a predetermined shape by an electroless copper plating method. This conductive metal layer 5 serves as a radiating element of the antenna.
【００３１】また、導電金属層５は、スナップフィット
構造を有する電気的接続用コンタクト部４を介してプリ
ント基板６と電気的に接続される。すなわち、プリント
基板６は、導電金属層５を形成した後に、電気的接続用
コネクタ部４を介して複合成形品１に組み付けられる。Further, the conductive metal layer 5 is electrically connected to the printed circuit board 6 via the electrical connection contact portion 4 having a snap fit structure. That is, the printed circuit board 6 is assembled to the composite molded article 1 via the electrical connection connector portion 4 after forming the conductive metal layer 5.
【００３２】ここで、電気的接続用コンタクト部４は、
ばね性を有する樹脂で形成されるため、電気的接続用コ
ンタクト部４がプリント基板６を押し付けることから長
期間にわたって安定した電気的接触が達成できる。ま
た、電気的接続用コンタクト部４は、ガラスファイバー
を含有しない組成とすることにより、弾性率の低下を防
止する。従って、電気的接続用コンタクト部４は、ばね
性の低下が防止されるので、プリント基板との電気的接
触において、長期間にわたって安定した電気的接触が達
成できることになり、電気的接触においてより高い信頼
性を保持することができる。Here, the contact portion 4 for electrical connection is
Since the contact portion 4 for electrical connection presses the printed circuit board 6 because it is formed of a resin having a spring property, stable electrical contact can be achieved for a long period of time. Moreover, the contact portion 4 for electrical connection has a composition containing no glass fiber, thereby preventing a decrease in elastic modulus. Therefore, since the electrical connection contact portion 4 is prevented from being deteriorated in springiness, it is possible to achieve stable electrical contact with the printed board for a long period of time, which is higher in electrical contact. The reliability can be maintained.
【００３３】図３は、電気的接続用コンタクト部４の他
の実施例を示す図である。電気的接続用コンタクト部４
の下端４１に、突起４２を設けることによっても、プリ
ント基板６との電気的接触において安定した電気的接触
が達成でき、より高い信頼性を保持することができる。FIG. 3 is a view showing another embodiment of the contact portion 4 for electrical connection. Contact part 4 for electrical connection
Providing the projection 42 on the lower end 41 of the can also achieve stable electrical contact with the printed circuit board 6 and maintain higher reliability.
【００３４】次に、従来のネジ止め固定による金属片コ
ンタクト方式と本発明のスナップフィット構造を有する
樹脂製の電気的接続用コンタクト方式で作製したアンテ
ナにおける各環境試験の結果を表１に示す。本実施例に
おいて、難めっき性樹脂及び易めっき性樹脂として、と
もにガラスファイバーを含有しないシンジオタクチック
ポリスチレンを使用した。
＜試験方法＞
（１）高温高湿試験：槽温度８５℃、湿度８５％に保た
れた恒温槽に複合成形品から形成したアンテナを１００
０時間保持する。
（２）高温放置：槽温度１２５℃の恒温槽にアンテナを
１０００時間保持する。
（３）熱衝撃試験：−４０℃で３０分〜８５℃で３０分
を１サイクルとして、１０００サイクル実施する。
＜評価方法＞Next, Table 1 shows the results of each environmental test for the antenna manufactured by the conventional metal piece contact method by screw fixing and the resin contact method for electrical connection having the snap-fit structure of the present invention. In this example, syndiotactic polystyrene containing no glass fiber was used as the difficult-to-plate resin and the easily-platable resin. <Test Method> (1) High-temperature and high-humidity test: 100 antennas formed from the composite molded product were placed in a constant temperature bath maintained at a bath temperature of 85 ° C and a humidity of 85%.
Hold for 0 hours. (2) High temperature storage: The antenna is held for 1000 hours in a constant temperature bath at a bath temperature of 125 ° C. (3) Thermal shock test: 1000 cycles are performed, with one cycle consisting of 30 minutes at -40 ° C to 30 minutes at 85 ° C. <Evaluation method>
【００３５】アンテナ（メッキ部分）とプリント基板の
間の電気抵抗の変化を測定し、試験前後で電気抵抗の変
化が無い場合を○とし、試験完了後電気抵抗がゼロ（電
気的接続なし）の場合を×とした。The change in the electric resistance between the antenna (plated portion) and the printed circuit board was measured, and when there was no change in the electric resistance before and after the test, it was evaluated as ○, and the electric resistance was zero (no electrical connection) after the test was completed. The case was marked as x.
【００３６】試験結果は、従来のネジ止め固定による金
属片コンタクト方式と比較してプリント基板とスナップ
フィット構造を有する樹脂製の電気的接続用コンタクト
部の接続性を電気抵抗値から３段階で相対的に比較した
ものである。The test results show that the connectivity of the resin-made electrical connection contact portion having a snap-fit structure with the printed circuit board is compared with the conventional metal piece contact method by screw fixing in three steps from the electrical resistance value. It is a comparative comparison.
【００３７】比較のためにガラスファイバーを含有した
樹脂で形成した電気的接続用コンタクト部の接続信頼性
も合わせて示す。For comparison, the connection reliability of the electrical connection contact portion formed of a resin containing glass fiber is also shown.
【表１】 [Table 1]
【００３８】上記の結果より明らかなように、本発明に
よる携帯電話機用内蔵アンテナは、従来のネジ止め固定
による金属片コンタクト方式と同等以上の高信頼性の電
気接続構造を有する。As is clear from the above results, the built-in antenna for a mobile phone according to the present invention has a highly reliable electrical connection structure equivalent to or better than the conventional metal piece contact method by screw fixing.
【００３９】また、本発明による携帯電話機用内蔵アン
テナを内蔵した携帯電話機は、プリント基板への電気的
接続において高い信頼性を有するため、携帯電話機の使
用時において、安心して使用することができる。Further, since the mobile phone having the built-in antenna for the mobile phone according to the present invention has a high reliability in the electrical connection to the printed circuit board, the mobile phone can be used with peace of mind when it is used.
【００４０】本発明においては、易めっき性樹脂として
使用される他の樹脂、例えば液晶ポリマー等もアンテナ
要求特性に応じて適用可能である。In the present invention, other resins used as the easily-platable resin, such as liquid crystal polymer, can be applied depending on the required characteristics of the antenna.
【００４１】尚、本発明の実施形態は、上述の図示例に
のみ限定されるものではなく、本発明の要旨を逸脱しな
い範囲内において種々変更を加え得ることは勿論であ
る。The embodiment of the present invention is not limited to the above illustrated examples, and it goes without saying that various modifications can be made without departing from the gist of the present invention.
【００４２】[0042]
【発明の効果】以上説明したように、本発明による携帯
電話機用内蔵アンテナによれば、プリント基板とのコン
タクト部を含め、一体成形が可能で大量生産に適するよ
う製造能率を高めるとともに、ＭＩＤによる立体回路基
板により３次元（立体）構造性における設計の自由度を
向上させ、所望の曲面形状等の三次元アンテナ形状品を
実現できる。As described above, according to the built-in antenna for a mobile phone according to the present invention, the manufacturing efficiency can be increased so that it can be integrally molded including the contact portion with the printed circuit board and is suitable for mass production. The three-dimensional circuit board can improve the degree of freedom in designing the three-dimensional (three-dimensional) structure and realize a three-dimensional antenna-shaped product having a desired curved surface shape or the like.
【００４３】また、携帯電話機用ＭＩＤアンテナをプリ
ント基板に固定するという工数低減も図れるという利点
も有する。There is also an advantage that the number of steps for fixing the MID antenna for a mobile phone to the printed board can be reduced.
【００４４】更に、易めっき性樹脂で形成し、表面に導
電金属層をめっきしたスナップフィット構造を有する電
気的接続用樹脂製コンタクト部をバネ性に富んだ性状に
設定することとしたため、プリント基板への位置合わせ
等の接続性に信頼性を向上させることができ、プリント
基板への電気的接続において高い信頼性を達成できる携
帯電話機用内蔵アンテナが実現される。Further, the contact portion made of resin for electrical connection, which is formed of an easily-plating resin and has a snap-fit structure in which a conductive metal layer is plated on the surface, is set to have a spring-rich property. There is realized a built-in antenna for a mobile phone, which can improve the reliability of the connection such as positioning to the printed circuit board and can achieve high reliability in the electrical connection to the printed circuit board.
【００４５】また、以上のようなアンテナを搭載するこ
とにより、コスト・性能・デザインに優れ、電気的接続
において高い信頼性を有する携帯電話機の提供を可能と
する。By mounting the antenna as described above, it is possible to provide a mobile phone which is excellent in cost, performance and design and has high reliability in electrical connection.
【図１】 本発明の一実施例である立体図を示す図であ
る。FIG. 1 is a diagram showing a three-dimensional view which is an embodiment of the present invention.
【図２】 図１のＩ-Ｉ線に沿う断面図である。FIG. 2 is a cross-sectional view taken along the line II of FIG.
【図３】 電気的接続用コンタクト部４の他の実施例を
示す図である。FIG. 3 is a diagram showing another embodiment of the contact portion 4 for electrical connection.
【図４】 従来の携帯電話機用内蔵アンテナの構成を示
す図である。FIG. 4 is a diagram showing a configuration of a conventional built-in antenna for a mobile phone.
１ 複合成形品
２ 難めっき性樹脂で形成した成形品
３ 易めっき性樹脂で形成した成形品
４ スナップフィット構造を有する樹脂製の電気的接続
用コンタクト部
５ 導電金属層
６ プリント基板
１０ 携帯電話機用内蔵アンテナ
１１ アンテナプレート
１１ａ コンタクト部
１２ プラスチック成形品
１３ プリント基板
１４ ねじ
１５ コンタクトピン
４１ 電気的接続用コンタクト部下端
４２ 突起1 Composite Molded Product 2 Molded Product Made of Difficult-to-Plate Resin 3 Molded Product Made of Easily Plated Resin 4 Electrically-Connecting Contact Part 5 Made of Resin Having Snap-Fit Structure 5 Conductive Metal Layer 6 Printed Circuit Board 10 For Mobile Phones Built-in antenna 11 Antenna plate 11a Contact part 12 Plastic molded product 13 Printed board 14 Screw 15 Contact pin 41 Lower end 42 of contact part for electrical connection Protrusion
フロントページの続き (72)発明者 鈴木 伸一郎 茨城県日立市日高町５丁目１番１号 日立 電線株式会社日高工場内 Ｆターム(参考） 5J046 AA09 AA19 AB13 PA07 5J047 AA09 AA19 AB13 BG01 FD01 5K023 AA07 BB04 LL01 LL05 QQ03 QQ05 RR01 RR05 Continued front page (72) Inventor Shinichiro Suzuki Hitachi, 1-1 Hidaka-cho, Hitachi City, Ibaraki Prefecture Electric Wire Co., Ltd. Hidaka Factory F-term (reference) 5J046 AA09 AA19 AB13 PA07 5J047 AA09 AA19 AB13 BG01 FD01 5K023 AA07 BB04 LL01 LL05 QQ03 QQ05 RR01 RR05
Claims (6)
「難めっき性樹脂」という）からなる成形品及び金属め
っきが形成され易い樹脂（以下、「易めっき性樹脂」と
いう）からなる成形品の複合成形品と、前記複合成形品
の易めっき性樹脂からなる成形品の表面にめっきされた
導電金属層とからなる携帯電話機用内蔵アンテナにおい
て、 前記複合成形品の易めっき性樹脂からなる成形品の一部
に形成され、アンテナ用外部回路に前記導電金属層を介
して弾性的に嵌合接続される構造を有するコンタクト部
を備えたことを特徴とする携帯電話機用内蔵アンテナ。1. A resin in which metal plating is difficult to form (hereinafter,
A composite molded product of a molded product made of "difficult-to-plate resin" and a resin in which metal plating is easily formed (hereinafter referred to as "easy-platable resin"), and an easily-plated resin of the composite molded product. In a built-in antenna for a mobile phone, which comprises a conductive metal layer plated on the surface of a molded product made of, a part of a molded product made of the easily-platable resin of the composite molded product is formed, and the conductive film is formed on the external circuit for the antenna. A built-in antenna for a mobile phone, comprising a contact portion having a structure that is elastically fitted and connected via a metal layer.
て得られることを特徴とする請求項１記載の携帯電話機
用内蔵アンテナ。2. The built-in antenna for a mobile phone according to claim 1, wherein the composite molded article is obtained by two-step injection molding.
脂からなる成形品の少なくとも―部が前記複合成形品の
外側表面に露出するように行われることを特徴とする請
求項２記載の携帯電話機用内蔵アンテナ。3. The two-step injection molding is performed so that at least a part of the molded product made of the easily-platable resin is exposed on the outer surface of the composite molded product. Built-in antenna for mobile phones.
脂は、少なくとも一方の樹脂がシンジオタクチックポリ
スチレンを主体とした組成物であることを特徴とする請
求項１又は３のいずれか１項に記載の携帯電話機用内蔵
アンテナ。4. The composition according to claim 1, wherein at least one of the difficult-plating resin and the easily-plating resin is a composition whose main component is syndiotactic polystyrene. Built-in antenna for mobile phone according to.
を含有させないことで弾性率の低下を防止したことを特
徴とする請求項１、３又は４のいずれか１項に記載の携
帯電話機用内蔵アンテナ。5. The built-in mobile phone according to claim 1, 3 or 4, wherein the easily-platable resin prevents a decrease in elastic modulus by not containing glass fiber. antenna.
蔵された携帯電話機用内蔵アンテナを備えた携帯電話機
において、前記携帯電話機用内蔵アンテナは、金属めっ
きが形成され難い樹脂（以下、「難めっき性樹脂」とい
う）からなる成形品及び金属めっきが形成され易い樹脂
（以下、「易めっき性樹脂」という）からなる成形品の
複合成形品と、前記複合成形品の易めっき性樹脂からな
る成形品の表面にめっきされた導電金属層とからなり、
前記複合成形品の易めっき性樹脂からなる成形品の一部
に形成され、アンテナ用外部回路に前記導電金属層を介
して弾性的に嵌合接続される構造を有するコンタクト部
を備えた携帯電話機用内蔵アンテナを備えたことを特徴
とする携帯電話機。6. A mobile phone having a mobile phone body and a mobile phone built-in antenna built in the mobile phone body, wherein the mobile phone built-in antenna is made of a resin (hereinafter referred to as "difficult plating Resin)) and a molded product of a resin (hereinafter referred to as “easy-plating resin”) in which metal plating is easily formed, and a molding of the composite molded product of the easily-platable resin. It consists of a conductive metal layer plated on the surface of the product,
A mobile phone having a contact part formed on a part of the composite molded product made of an easily-platable resin and elastically fitted and connected to the external circuit for the antenna via the conductive metal layer. A mobile phone having a built-in antenna for mobile phones.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001262100A JP2003078322A (en) | 2001-08-30 | 2001-08-30 | Built-in antenna for mobile phone and mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001262100A JP2003078322A (en) | 2001-08-30 | 2001-08-30 | Built-in antenna for mobile phone and mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003078322A true JP2003078322A (en) | 2003-03-14 |
Family
ID=19089040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001262100A Pending JP2003078322A (en) | 2001-08-30 | 2001-08-30 | Built-in antenna for mobile phone and mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003078322A (en) |
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| JP2004328108A (en) * | 2003-04-22 | 2004-11-18 | Nec Corp | Subsidiary antenna mounting structure, radio apparatus, antenna unit, and grand mounting structure |
| JP2007198483A (en) * | 2006-01-26 | 2007-08-09 | Kyocera Corp | Fixing structure of plated resin member, electronic device, and fixing method of plated resin member |
| JP2008160215A (en) * | 2006-12-20 | 2008-07-10 | Toshiba Corp | Electronics |
| KR100849805B1 (en) | 2007-02-02 | 2008-07-31 | 삼성전기주식회사 | Built-in antenna and built-in antenna manufacturing method |
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| DE112008001154T5 (en) | 2007-05-02 | 2010-02-25 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Antenna structure and wireless communication device having the same |
| US7678853B2 (en) | 2004-06-16 | 2010-03-16 | Ntn Corporation | Highly dielectric elastomer composition and dielectric antenna |
| CN103155279A (en) * | 2010-09-28 | 2013-06-12 | Ntn株式会社 | Chip antenna and production method thereof |
| CN104283988A (en) * | 2013-07-04 | 2015-01-14 | 安诺电子股份有限公司 | Selective plating method of plastic part and shell of mobile communication device |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004328108A (en) * | 2003-04-22 | 2004-11-18 | Nec Corp | Subsidiary antenna mounting structure, radio apparatus, antenna unit, and grand mounting structure |
| US7468709B2 (en) | 2003-09-11 | 2008-12-23 | Pulse Finland Oy | Method for mounting a radiator in a radio device and a radio device |
| US7678853B2 (en) | 2004-06-16 | 2010-03-16 | Ntn Corporation | Highly dielectric elastomer composition and dielectric antenna |
| JP2007198483A (en) * | 2006-01-26 | 2007-08-09 | Kyocera Corp | Fixing structure of plated resin member, electronic device, and fixing method of plated resin member |
| JP2008160215A (en) * | 2006-12-20 | 2008-07-10 | Toshiba Corp | Electronics |
| KR100849805B1 (en) | 2007-02-02 | 2008-07-31 | 삼성전기주식회사 | Built-in antenna and built-in antenna manufacturing method |
| DE112008001154T5 (en) | 2007-05-02 | 2010-02-25 | Murata Mfg. Co., Ltd., Nagaokakyo-shi | Antenna structure and wireless communication device having the same |
| US8264411B2 (en) | 2007-05-02 | 2012-09-11 | Murata Manufacturing Co., Ltd. | Antenna structure and wireless communication device having the same |
| CN103155279A (en) * | 2010-09-28 | 2013-06-12 | Ntn株式会社 | Chip antenna and production method thereof |
| CN103155279B (en) * | 2010-09-28 | 2015-09-02 | Ntn株式会社 | Antenna component and manufacture method thereof |
| US9634384B2 (en) | 2010-09-28 | 2017-04-25 | Ntn Corporation | Chip antenna and manufacturing method thereof |
| CN104283988A (en) * | 2013-07-04 | 2015-01-14 | 安诺电子股份有限公司 | Selective plating method of plastic part and shell of mobile communication device |
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