JP2003078293A - Electronic component mounting device - Google Patents

Abstract

An object of the present invention is to improve the productivity of an electronic component mounting apparatus and the quality of a board to be mounted. SOLUTION: A head 9 movably arranged in a horizontal direction between an electronic component supply station 3 and an electronic component mounting station 2, and a plurality of nozzles 18 constituting the head 9
A plurality of electronic component supply units 4 arranged in parallel corresponding to the above, a nozzle driving means 16 for moving a nozzle 18 provided on the head 9 in the vertical direction, and holding the nozzle 18 at a position eccentric from the center of rotation The apparatus further includes a nozzle position changing means 17 for changing the component suction position in the X-axis direction, and a component supply position changing means for changing the component supply position in the Y-axis direction orthogonal to the X-axis direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to an electronic component mounting apparatus that mounts electronic components (hereinafter referred to as components) on a board.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus holds a nozzle on the same line as the center of rotation of a nozzle support, and the component supply position is fixed.

[0003]

In the conventional electronic component mounting apparatus, the electronic component 7 is moved to the position shown in FIG.
As shown in FIG. 9A, side surface adsorption (vertical adsorption), as shown in FIG. 9C, electrode surface adsorption (vertical adsorption), and as shown in FIG. 9D, electrode angle adsorption (oblique adsorption). Abnormal adsorption may occur.

When such abnormal adsorption occurs, the mounting on the substrate does not become the normal mounting as shown in FIG. 10 (a), but the vertical standing abnormal mounting as shown in FIG. 10 (b).
There is a problem because the abnormal vertical mounting as shown in FIG. Reference numeral 22 indicates an electrode which is printed and wired.

Therefore, either normal adsorption (adsorption shown in FIG. 9A) or abnormal adsorption (adsorption shown in FIGS. 9B to 9D) is judged, and in the case of abnormal adsorption, the adsorption is concerned. As a result of taking measures to dispose of the electronic components, the productivity was low.

Further, when minute components are mounted at narrow intervals, the nozzle may come into contact with other components already mounted, causing displacement of the components, which causes deterioration of the quality of the substrate. Was there.

Therefore, the present invention aims to improve the productivity of equipment and
The purpose is to improve the quality of the board to be mounted.

[0008]

In order to solve this problem, the present invention is directed to a head which is horizontally movable between an electronic component supply station and an electronic component mounting station and in which a plurality of nozzle units are arranged in parallel. And a plurality of electronic component supply units arranged in parallel to the electronic component supply station corresponding to the plurality of nozzle units forming the head, and a plurality of nozzle units provided on the head are moved in the vertical direction. Nozzle driving means, a rotatable nozzle support provided in each of the plurality of nozzle units and holding the nozzle at a position eccentric from the center of rotation, and the nozzle support is rotated to move the component suction position in the X-axis direction. Nozzle position changing means for changing the position and the plurality of electronic component supply units, and the component supply positions are orthogonal to the X-axis direction. An electronic component mounting apparatus having a component supply position changing means for changing the position in the Y-axis direction, which is capable of sucking the center of a component, thereby preventing abnormal suction and improving productivity and quality. You can

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is a head that is horizontally movable between an electronic component supply station and an electronic component mounting station, and has a plurality of nozzle units arranged in parallel. A plurality of electronic component supply units arranged in parallel to the electronic component supply station corresponding to the plurality of nozzle units forming the head, and a plurality of nozzle units provided in the head are moved in the vertical direction. Nozzle driving means, a rotatable nozzle support provided on the plurality of nozzle units and holding the nozzle at a position eccentric from the center of rotation, and the nozzle support is rotated to determine the component suction position in the X-axis direction. Nozzle position changing means for changing and a Y-axis direction which is provided in the plurality of electronic component supply units and whose component supply positions are orthogonal to the X-axis direction. An electronic component mounting apparatus that includes a component feeding position changing means for position change in, it is possible to adsorb the center of the component does not occur abnormal adsorption, it is possible to improve productivity and quality.

The invention according to claim 2 of the present invention is the electronic component mounting apparatus according to claim 1, wherein a plurality of nozzles are provided on the circumference of each of the plurality of nozzle units provided in the head. When mounting components having different sizes, if nozzles corresponding to the respective components are arranged, production can be performed without exchanging nozzles, and productivity of equipment can be improved. Moreover, since the number of components that can be picked up at one time by one head can be increased, the number of times the heads reciprocate between the component supply station and the component mounting station can be reduced, and the productivity of the equipment can be improved.

The invention according to claim 3 of the present invention is the electronic component mounting apparatus according to claim 1 or 2, further comprising nozzle unit up-and-down means for individually moving up and down a plurality of nozzle units. By individually setting the suction heights of the nozzles for different parts, it is possible to collectively suck the nozzles and improve the productivity.

The invention according to claim 4 of the present invention is the electronic component mounting apparatus according to claim 1 or 2, further comprising nozzle unit elevating means for collectively elevating and lowering a plurality of nozzle units. An inexpensive apparatus can be provided by selecting only the nozzle unit to be used with one shaft and connecting it to the vertical drive shaft.

According to a fifth aspect of the present invention, the electronic component according to any one of the first to fourth aspects, wherein the component supply position changing means in the Y-axis direction moves the entire component supply station. In the component mounting apparatus, it is possible to suck the center of the component by moving the component supply station so that the component supply position of the component supply unit to be sucked matches the lowered position of the nozzle unit, improving productivity. And quality can be improved.

According to a sixth aspect of the present invention, the component supply position changing means in the Y-axis direction moves the component supply position of each component supply unit. The electronic component mounting apparatus according to item 1, wherein batch suction is possible by individually changing the component supply position according to the pitch deviation and the component supply position deviation of the plurality of nozzle units and the component supply unit. It is possible to improve the sex.

The invention according to claim 7 of the present invention has a plurality of electronic component supply stations facing each other with the electronic component mounting station interposed therebetween, and a head is provided for each of the supply stations. In the electronic component mounting apparatus described in any one of 6, the productivity can be improved by alternately mounting the two substrates on one substrate.

The invention according to claim 8 of the present invention is the electronic component according to any one of claims 1 to 7, wherein the arrangement pitch of the plurality of nozzle units is an integer multiple of the arrangement pitch of the electronic component supply unit. In the mounting device, the components can be collectively sucked by the plurality of nozzle units, and the productivity can be improved.

The invention according to claim 9 of the present invention is the electronic component mounting apparatus according to any one of claims 1 to 8, wherein the head is mounted on a moving frame which moves in the XY directions. The head can be moved the shortest distance between the component picking station and the component mounting station, and the productivity can be improved.

According to a tenth aspect of the present invention, a component position recognizing means for correcting the suction position so that the central position of the component is sucked by the nozzle is provided between the component supply station and the component mounting station. The electronic component mounting apparatus according to any one of claims 1 to 9, wherein the component supply position for the nozzle is determined during production, the information is added to change the suction position from the next time, and the quality is improved. Can be improved.

According to the eleventh aspect of the present invention, the recognition means for discriminating the central position of the component transferred to the component supply position is provided in the head. Since it is an electronic component mounting device, it is possible to perform more detailed position adjustment by determining the component supply position before suction.
The quality can be improved.

According to a twelfth aspect of the present invention, the electronic component mounting according to any one of the first to eleventh aspects is that the nozzle position changing means for changing the component suction position in the X-axis direction is driven by a motor. Since it is a device, it is possible to change the position more finely and improve the quality.

(First Embodiment) A first embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing a component mounting apparatus according to this embodiment.

In FIG. 1, reference numeral 1 indicates a circuit board provided with, for example, printed wiring. The board 1 is transferred to an electronic component mounting station 2 for holding the board 1 in a horizontal state by a belt conveyor (not shown). To be done.

An electronic component supply station 3 is arranged before and after the electronic component mounting station 2. A plurality of electronic component supply units 4 shown in FIG. 2 are arranged in parallel in the electronic component supply station 3, and can be attached to and detached from the electronic component supply station 3.

A component reel 5 made of, for example, paper or plastic is supported by the electronic component supply unit 4. As shown in FIG. 3, recesses 6 are formed on the component reel 5 at predetermined intervals. Electronic components 7 are housed in the recesses 6, respectively, and a gear 21 screwed to a component feed motor 20. Each electronic component 7 can be sent out from this component reel 5 to the component supply position 8 of the electronic component supply unit 4 shown in FIG. 2 by rotating.

Above the substrate 1 in FIG. 1, an X frame 10 for holding the head 9 movably in the X direction and a Y frame 11 for holding the X frame 10 movably in the Y direction are provided. It is possible to move the head 9 in the X-Y directions.

Next, the head 9 will be described with reference to FIG.

The hollow shaft 12 is rotatably attached to the frame 13 so as to be orthogonal to the XY plane.
The frame 13 is attached to the guide 14, and the feed screw 15
It is screwed together and can be moved up and down by the rotation of the nozzle up / down motor 16. Further, the shaft 12 is connected to a nozzle rotation motor 17 so that it can rotate.

A nozzle 18 having a tip at a position eccentric from the rotation center of the shaft 12 is attached to the tip of the shaft 12, and air inside the shaft 12 and the nozzle 18 is sucked by suction means (not shown). As a result, the electronic component 7 can be vacuum-sucked.

Next, the electronic component suction / mounting operation by the electronic component mounting apparatus thus configured will be described with reference to FIGS. 1 to 6.

In FIG. 1, the head 9 moves to the component supply position 8 of the electronic component supply unit 4 arranged on the electronic component supply station 3, and the details of the component 7 are detected by the component position determination camera 19 attached to the head 9. The correct position.
Then, it is collated with the data of the known tip position of the nozzle 18, and based on the difference, the nozzle rotation motor 17
To rotate. As shown in FIG. 5, since the tip of the nozzle 18 is eccentric from the center of rotation, the change in the suction position in the XY direction due to the rotation is used to make the X of the component 7 X.
The tip of the nozzle 18 can be aligned with the center position of the direction.

Next, the component feed motor 20 of the component supply unit 4 shown in FIG. 2 is rotated to deliver the component 7 until the position of the tip of the nozzle 18 and the center position of the component 7 in the Y direction coincide. This operation is performed by a plurality of nozzles 18 and a plurality of components 7 for each of the plurality of nozzles 18 and the component supply unit 4.
It becomes possible to adsorb the center of the.

Next, the head 9 is moved to above the component inspection unit 22 shown in FIG. The substrate 1 is mounted at a predetermined position. At this time, since the center of the component 7 is sucked by the nozzle 18, it is possible to properly mount the component 7 as shown in FIG. 6B without touching the adjacent component as shown in FIG. 6A.

When there is a difference between the information on the center position of the component 7 obtained by the component inspection unit 22 and the known position of the nozzle 18, there is a difference in the nozzle 18 at the next suction.
The reliability can be further improved by reflecting the rotation amount and the feed amount of the component 7. In addition, the component supply position 8 in the Y direction
When changing, the same effect can be obtained by moving the entire component supply unit 4. Further, although the collective suction may be impossible, the entire electronic component supply station 3 may be moved.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.

The present embodiment is different from the above-described first embodiment only in the structure of the head and has the same structure in other respects, and therefore, the same structure parts will be described. Are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 7, the hollow shaft 12 is rotatably attached to the frame 13 so as to be orthogonal to the XY plane. The frame 13 is attached to the guide 14 and is engaged with a nozzle selection mechanism (not shown).
The nozzle selection mechanism is screwed with a feed screw (not shown), and the nozzle up / down motor 1 connected to this feed screw is used.
Up and down movement is possible by rotation of 6. Further, the shaft 12 is connected to a nozzle rotation motor 17 so that it can rotate.

A plurality of nozzles 18 are attached to the tip of the shaft 12 on the circumference around the rotation center of the shaft 12, and the inside of the nozzle 18 selected as the shaft 12 is selected by a suction means (not shown). The electronic component 7 can be vacuum-sucked by sucking the air.

Next, the operation of sucking the electronic component thus configured will be described with reference to FIGS. 1 to 3 and 6 to 8.

In FIG. 1, the head 9 moves to the component supply position 8 of the electronic component supply unit 4 arranged on the electronic component supply station 3, and the component discriminating camera 19 mounted on the head 9 moves the component 7 in detail. Determine the position. Then, the nozzle rotation motor 17 is rotated based on the difference with the known tip position data of the nozzle 18. As shown in FIG. 8, since the tip of the nozzle 18 is eccentric from the center of rotation, the nozzle 18 is located at the center position of the component 7 in the X direction by utilizing the change in the suction position in the XY direction due to the rotation. The tips of 18 can be aligned.

Next, the component feed motor 20 of the component supply unit 4 shown in FIG. 2 is rotated to feed the component 7 until the tip position of the nozzle 18 and the center position of the component 7 in the Y direction coincide. After that, the nozzle 18 can be moved up and down by connecting only the frame 13 that holds the nozzle 18 that needs to suck the component 7 according to a previously specified mounting program to the nozzle selection mechanism. I do.

The subsequent mounting operation is the same as that in the first embodiment, and therefore its explanation is omitted.

With the contents described above, the same effect as that of the first embodiment can be obtained, and since a plurality of nozzles 18 can be arranged on one shaft 12, various parts can be dealt with. It is a thing. Further, since the nozzle 18 is vertically driven by a single axis, it is possible to provide a more inexpensive device.

Further, by using a motor as the suction position changing means in the X direction, it is possible to change the position in more detail.
We are working to improve quality.

[0045]

As described above, according to the present invention, a head which is horizontally movable between the electronic component supply station and the electronic component mounting station, and in which a plurality of nozzle units are arranged in parallel, and the head are configured. A plurality of electronic component supply units arranged in parallel with the electronic component supply station corresponding to the plurality of nozzle units, a nozzle drive means for vertically moving the plurality of nozzle units provided in the head, A rotatable nozzle support provided in a plurality of nozzle units and holding the nozzle at a position eccentric from the center of rotation, and a nozzle position changing means for rotating the nozzle support to change the component suction position in the X-axis direction. And provided on the plurality of electronic component supply units and changing the component supply position in the Y-axis direction orthogonal to the X-axis direction. An electronic component mounting apparatus that includes a goods supply position changing means, it is possible to adsorb the center of the component does not occur abnormal adsorption, it is possible to improve productivity and quality.

[Brief description of drawings]

FIG. 1 is a plan view showing an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a component supply unit according to the embodiment of the present invention.

FIG. 3 is a side sectional view showing a part of the parts reel.

FIG. 4 is a perspective view showing a head according to the first embodiment of the present invention.

FIG. 5 is a plan view showing a state after the suction position correction according to the first embodiment of the present invention.

FIG. 6 is a side view showing a state during mounting according to the embodiment of the present invention.

FIG. 7 is a perspective view showing a head according to a second embodiment of the present invention.

FIG. 8 is a plan view showing a state after the suction position correction according to the second embodiment of the present invention.

FIG. 9 is a perspective view showing a component suction posture for each posture.

FIG. 10 is a perspective view showing components mounted at predetermined positions according to component suction postures.

[Explanation of symbols]

1 substrate 2 Electronic component mounting station 3 Electronic parts supply station 9 heads 10 X frame 11 Y frame 19 Parts position determination camera

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Claims (12)

[Claims] 1. A head that is horizontally movable between an electronic component supply station and an electronic component mounting station and that has a plurality of nozzle units arranged in parallel and a plurality of nozzle units that compose the head. A plurality of electronic component supply units arranged in parallel to the electronic component supply station, a nozzle drive means for moving a plurality of nozzle units provided in the head in the vertical direction, and provided in the plurality of nozzle units, A rotatable nozzle support body that holds a nozzle at a position eccentric from the center of rotation, a nozzle position changing means that rotates the nozzle support body to change the component suction position in the X-axis direction, and the plurality of electronic component supplies It is provided in the unit, and the parts supply position is
An electronic component mounting apparatus comprising: a component supply position changing unit that changes a position in a Y-axis direction orthogonal to the axial direction. 2. A plurality of nozzles are provided on the circumference of each of the plurality of nozzle units provided on the head.
The electronic component mounting device according to. 3. The electronic component mounting apparatus according to claim 1, further comprising a nozzle unit elevating means for vertically elevating a plurality of nozzle units. 4. A nozzle unit raising / lowering means for raising and lowering a plurality of nozzle units collectively is provided.
The electronic component mounting device according to. 5. The component supply position changing means in the Y-axis direction moves the entire component supply station.
The electronic component mounting apparatus according to any one of 4 to 4. 6. The electronic component mounting apparatus according to claim 1, wherein the component supply position changing means in the Y-axis direction moves the component supply position of each component supply unit. 7. A plurality of electronic component supply stations facing each other with an electronic component mounting station interposed therebetween, and a head is provided for each of the supply stations.
The electronic component mounting apparatus according to any one of items 1 to 6. 8. The electronic component mounting apparatus according to claim 1, wherein the arrangement pitch of the plurality of nozzle units is an integral multiple of the arrangement pitch of the electronic component supply unit. 9. The electronic component mounting apparatus according to claim 1, wherein the head is mounted on a moving frame that moves in the XY directions. 10. The component position recognizing means for correcting the suction position so that the central position of the component is sucked by the nozzle is provided between the component supply station and the component mounting station. The electronic component mounting device according to. 11. The head is provided with a recognizing means for discriminating the central position of the component transferred to the component supply position.
10. The electronic component mounting device according to any one of 10. 12. The electronic component mounting apparatus according to claim 1, wherein the nozzle position changing means for changing the component suction position in the X-axis direction is driven by a motor.