JP2003069295A - Substrate support device and substrate support method in electronic component mounting apparatus - Google Patents

Abstract

An object of the present invention is to provide a substrate receiving device and a substrate receiving method in an electronic component mounting device capable of simplifying a setup change operation for various types of substrates. I do. In a lower receiving device for supporting a mounted surface of a substrate from below, a lower receiving portion, which is raised and lowered by a lifting mechanism, accommodates an electrorheological fluid therein and has an upper surface formed of an elastic film. When the lower receiving portion 2 is raised with respect to the lower surface of the substrate 11 at the time of lower receiving, and the elastic film 6 is brought into contact with the lower surface of the substrate 11 and is made to follow the lower surface of the substrate 11, A voltage is applied to the electrorheological fluid 7 by the electrode member 5, and the substrate is supported from below by the electrorheological fluid 7 'having increased viscosity. Thereby, the same lower receiving portion 2
Thus, a wide variety of substrates can be targeted, and the work of changing the underlay can be simplified.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate lowering device and a substrate lowering method for an electronic component mounting device.

[0002]

2. Description of the Related Art Substrates on which electronic components are mounted include so-called double-sided mounting substrates in which electronic components are mounted not only on one side but also on both sides. In the mounting process of this double-sided mounting board,
First, after the mounting on the first surface, the substrate is turned over to the second surface.
Mounting work such as solder printing, electronic component mounting, and reflow is performed on the surface. At the time of mounting on the second surface, the already mounted surface on which the electronic components have already been mounted faces downward, so in a device such as screen printing of solder or component mounting that requires positioning and holding of the substrate, This already-mounted surface is supported from below. When sub-supporting the already-mounted surface, the pre-mounted parts interfere and cannot support the lower surface of the substrate.Therefore, select the sub-supportable part where the pre-mounted parts do not exist conventionally and select this position. There are used a method of supporting by a substrate lower support pin and a method of supporting by a dedicated lower support block. In the conventional undercoating device, every time the work target substrate is changed, it is necessary to rearrange the pins in the underreceiver-compatible portion corresponding to the new substrate, or perform the setup change to replace the undergarment block. .

[0003]

However, in recent years, the mounting board tends to be highly densified, so that it is difficult to secure a portion which can be received as the underlay during this setup change, and the conventional setup change work is This is a complicated and labor-intensive task such as attaching / detaching required lower support pins, and checking the lower support state that is performed using the actual mounting board after the pins are attached, so this setup change requires a long time. There was a problem that productivity improvement was hindered.

It is therefore an object of the present invention to provide a board undercoating apparatus and a board undercoating method for an electronic component mounting apparatus, which can simplify the setup change operation for a wide variety of boards. .

[0005]

According to a first aspect of the present invention, there is provided a substrate lowering device for an electronic component mounting apparatus, wherein the substrate lowering device is for supporting the substrate from below in the electronic component mounting apparatus. And a container that contains an electrorheological fluid therein, at least the upper surface of which is made of an elastic film, and which constitutes an abutting portion that receives the underlying surface of the elastic film by abutting the elastic film, and elevating means for moving the container up and down. And an electrode member arranged in the container for applying a voltage to the electrorheological fluid in the container, and a voltage application control means for controlling voltage application by the electrode member.

According to a second aspect of the present invention, there is provided a substrate under-supporting method in an electronic component mounting apparatus, which is a substrate under-supporting method in an electronic component mounting apparatus for supporting a substrate from below in the electronic component mounting apparatus. Raising a container containing an electrorheological fluid and having at least an upper surface made of an elastic film with respect to the lower surface of the substrate; and bringing the elastic film into contact with the lower surface of the substrate to make the elastic film follow the lower surface of the substrate And a step of applying a voltage to the electrorheological fluid in the container by the electrode member arranged in the container, and a step of supporting the substrate from the lower surface by the electrorheological fluid whose viscosity is increased by the voltage application.

According to the present invention, a container containing an electrorheological fluid therein and having an upper surface made of an elastic film is raised with respect to the lower surface of the substrate, and the elastic film is brought into contact with the lower surface of the substrate so that the lower surface of the substrate is smoothed. By applying a voltage to the electrorheological fluid in the container in a mixed state and supporting the substrate from the lower surface by the electrorheological fluid with increased viscosity, the work of changing the underlay for a variety of substrates can be simplified. be able to.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a substrate lowering device of an embodiment of the present invention, FIGS. 2 and 3 are process explanatory diagrams of a substrate lowering method of an embodiment of the present invention, and FIG. 4 is a diagram of the present invention. FIG. 3 is a cross-sectional view of a substrate lowering device of the embodiment.

First, with reference to FIG. 1, a substrate lowering device will be described. This substrate under-supporting device is used in a component mounting station of an electronic component mounting device to support from below a substrate on which electronic components have already been mounted on the lower surface in a previous step.

In FIG. 1 (a), a substrate lowering device 1
Is provided with a lower receiving portion 2 which is moved up and down by a lifting mechanism 3. The lower receiving portion 2 is disposed below the two substrate transport paths 10, and the substrate transport path 10 holds a substrate 11 sandwiched between a clamper 12 and the substrate transport path 10 from above and below. ing. The electronic component 13 has already been mounted on the lower surface of the substrate 11 in the previous step, and the mounting head 14 newly mounts the electronic component on the upper surface of the substrate 11.

The structure of the lower receiving portion 2 will be described. The lower receiving portion 2 is configured by a rectangular container 4 having a side wall portion 4b on the periphery and an open upper surface. An elastic film 6 made of a flexible material such as rubber is attached in a bag shape to the openings on the inner side surface and the upper surface of the container 4, and the bottom surface of the container 4 and the elastic film 6 form a sealed container 4a. . This closed container 4a
An electrorheological fluid 7 is contained therein, and electrode members 5 for applying a voltage to the electrorheological fluid 7 are arranged at both ends of the sealed container 4a.

The electrorheological fluid 7 will be described below.
The electrorheological fluid 7 is a substance having a property that the viscosity is significantly increased by applying a voltage, and is used in an electrically insulating oily dispersion medium such as spindle oil or silicon oil, and a dielectric substance such as cellulose or silica gel. It consists of dispersed fine particles. When a voltage is applied to such an electrorheological fluid, the viscosity instantly increases and the properties change from the flow state.
At this time, the degree of increase in viscosity varies depending on the voltage applied, and a desired viscosity can be realized from a fluid having a unit high viscosity to a semisolid state. Further, this reaction has a reversibility of returning to the original viscosity when the voltage application is released.

The electrode member 5 is connected to a voltage applying unit 9 having a power supply unit 9a and an open / close switch 9b. By closing the open / close switch 9b, a voltage is applied between the two electrode members 5 by the power supply unit 9a. Is applied. As a result, the electrorheological fluid 7 having a low viscosity fluidity, which is normally contained in the closed container 4a, can be transformed into a high viscosity semi-solid state.

A damper 8 is attached to the lower surface of the container 4, and a piston 8a and a piston 8 are provided in the damper 8.
A spring 8b for urging a upward is provided.
When an external force acts on the elastic film 6 from above, the inside of the closed container 4a is pressurized by the external force. At this time, the electrorheological fluid 7 is allowed to flow into the damper 8 from the closed container 4a, and when the external force is removed, the electrorheological fluid 7 is urged by the biasing force of the spring 8b.
Is pushed back into the closed container 4a.

FIG. 1B shows a state in which the elevating mechanism 3 is driven to raise the lower receiving portion 2. In this state,
The upper end of the side wall 4b of the container 4 contacts the lower surface of the substrate transport path 10, and the elastic film 6 on the upper surface of the closed container 4a contacts the lower surface of the substrate 11 on which the electronic component 13 is mounted. At this time, since the electrorheological fluid 7 has a low viscosity and has fluidity, the elastic film 6 is flexibly deformed in the shape of the electronic component 13, and thereby the shape of the lower surface of the substrate 11 is obtained.

At this time, since the substrate 11 is pressed down from above by the clamper 12, the elastic film 6 is attached to the substrate 1.
The substrate 11 is not pushed upward by coming into contact with the lower surface of the substrate 1, and the elastic film 6 is, on the contrary, in a state in which it is partially pushed down by the electronic component 13 on the lower surface of the substrate 11. Then, the electrorheological fluid 7 in an amount corresponding to the volume of the portion where the elastic film 6 is partially pushed is pushed out into the damper 8 and pushes down the piston 8a against the biasing force of the spring 8b.

By closing the open / close switch 9b and applying a voltage between the two electrode members 5 in this state, the viscosity of the electrorheological fluid 7 in the closed space 4a increases, and the electrorheological fluid in the thickened state is increased. Change to 7 '. As a result, the closed container 4
The electrorheological fluid 7'in a loses fluidity and is in contact with the inner surface of the elastic film 6 in a semi-solid state. Therefore, the external force transmitted from above to the elastic film 6 via the substrate 11 and the electronic component 13 is supported not only by the tension of the elastic film 6 but also by the electrorheological fluid 7 ′ in the semi-solid state in a dispersed state.

That is, in the above-mentioned structure, the closed container 4a formed by the container 4 and the elastic film 6 is a container which contains an electrorheological fluid inside and at least the upper surface is made of the elastic film 6, and the container 4 rises to generate electricity. In the state where the viscous fluid 7 has changed to the thickened state, the elastic film 6 constitutes an abutting portion which abuts and underlies the lower surface of the substrate 11. And lifting mechanism 3
Corresponds to an elevating means for elevating the closed container 4a,
The voltage application unit 9 serves as a voltage application control unit that controls voltage application by the electrode member 5.

Next, with reference to FIGS. 2 and 3, a method of receiving the substrate by the substrate lowering device 1 will be described. Figure 2
In (a), the board 11 having the electronic component 13 already mounted on the lower surface in the previous step is held in the board transport path 10. The lower receiving portion 2 arranged below is in the lowered position, and in this state, no voltage is applied to the electrorheological fluid 7 inside, and it has low viscosity and fluidity. The elastic film 6 on the upper surface maintains a flat state.

Next, as shown in FIG. 2B, the lower receiving portion 2 is raised with respect to the lower surface of the substrate 11. As a result, the upper end of the side wall 4b of the container 4 contacts the lower surface of the substrate transport path 10, and the elastic film 6 contacts the lower surface of the substrate 11 pressed from above by the clamper 12 from below. The elastic film 6 is flexibly deformed following the shape of the lower surface of the substrate 11 on which the electronic component 13 is mounted.

Next, as shown in FIG. 2 (c), the open / close switch 9b is closed and the two electrode members 5 are connected by the power source 9a.
A predetermined voltage is applied between the two. As a result, the electrorheological fluid 7 is transformed into the thickened electrorheological fluid 7 ', and the entire range of the elastic film 6 is supported from below in a semi-solid state. Then, in this state, the electronic component 15 is mounted on the upper surface of the substrate 11 by the mounting head 14 as shown in FIG.

When the mounting of the electronic component 15 on the upper surface of the substrate 11 is completed, the open / close switch 9b is opened and the voltage application to the electrode member 5 is stopped as shown in FIG. 3 (b). As a result, the electrorheological fluid 7 inside returns from the thickened state to a normal low-viscosity fluid. And in this state, FIG.
As shown in (c), the lower receiving portion 2 is lowered. As a result, the elastic film 6 returns to the flat state.

As described above, according to the present embodiment, as compared with the conventional lower receiving method using the lower receiving pins, the same operation can be performed without performing complicated and troublesome work such as attaching and detaching the lower receiving pins. The undercoating device can carry out the underlaying of various kinds of substrates. At this time, with respect to the lower surface of the substrate, the same base receiving device can be used as it is, regardless of whether there are already-mounted components or the case where the lower surface is a completely flat surface, and the applicable range can be expanded. Has become.

The substrate lower receiving device 1'shown in FIG. 4 shows an example of the structure of the lower receiving portion 2'using the electrorheological fluid 7 as described above. In this example, as an electrode member arranged in the closed container 4a, a conductive film 5a arranged parallel to the bottom surface of the container 4 and an elastic film 6 directly below the elastic film 6 on the upper surface of the container 4 are parallel to the elastic film 6. Two conductive films, that is, the conductive films 5b arranged in this way are used, and the other configuration is the same as the example shown in FIG.

Also in this example, as shown in FIG. 4B, by closing the open / close switch 9b and applying a voltage between the two conductive films 5a and 5b, the electrorheological fluid is in the thickened state. It is transformed into a fluid 7 ', and similarly supports the substrate 11 from below via the elastic film 6. At this time, the upper conductive film 5b follows the elastic film 6 and is bent and deformed.

The present invention is not limited to the above embodiment, and various application examples are possible. For example, in the above-described embodiment, the elastic film 6 is mounted inside the container 4 having the side wall portion 4b to form the closed container 4a.
The closed container may be formed only by a bag-shaped elastic film having a fixed bottom surface without b, or a flat elastic film may be spread on the upper surface of the concave container.

Further, in the present embodiment, an example in which the substrate lowering device 1 is applied to an electronic component mounting apparatus is shown. However, in addition to this, an electronic component such as a screen printing device for carrying out work on the mounting substrate. The present invention can now be applied to mounting devices in general.

[0028]

According to the present invention, the container containing the electrorheological fluid therein and having the upper surface made of the elastic film is moved upward with respect to the lower surface of the substrate, and the elastic film is brought into contact with the lower surface of the substrate to cause the lower surface of the substrate. By applying a voltage to the electrorheological fluid in the container in a state of conforming to, and supporting the substrate from the lower surface by the electrorheological fluid whose viscosity has increased, it is possible to set up the receiving plate for a wide variety of substrates. Can be simplified.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a substrate lowering device according to an embodiment of the present invention.

FIG. 2 is a process explanatory diagram of a substrate under-receiving method according to an embodiment of the present invention.

FIG. 3 is a process explanatory diagram of a substrate under-receiving method according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view of the substrate lowering device of the embodiment of the present invention.

[Explanation of symbols]

1,1 'Substrate receiving device 2,2 'Lower receiving part 3 lifting mechanism 4 containers 4a closed container 5 electrode members 5a, 5b conductive film 6 elastic membrane 7,7 'Electrorheological fluid 9 Voltage application section 9a Power supply section 9b Open / close switch 11 board

Claims (2)

[Claims] 1. An undercoating device for a substrate in an electronic component mounting apparatus for supporting a substrate from below in an electronic component mounting apparatus, wherein an electrorheological fluid is housed inside and at least an upper surface is made of an elastic film. A container forming an abutting part for abutting against and lowering the lower surface of the substrate, an elevating means for elevating and lowering the container, and an electrode member arranged in the container for applying a voltage to an electrorheological fluid in the container. A substrate under-supporting device in an electronic component mounting device, comprising: a voltage application control means for controlling voltage application by the electrode member. 2. A method of receiving a substrate in an electronic component mounting apparatus, wherein the substrate is supported from below in the electronic component mounting apparatus, wherein a container containing an electrorheological fluid therein and at least an upper surface of which is made of an elastic film is provided. A step of raising the lower surface of the substrate relative to the lower surface of the substrate; a step of bringing the elastic film into contact with the lower surface of the substrate so that the elastic film follows the lower surface of the substrate; and A substrate undercoating method for an electronic component mounting apparatus, comprising: a step of applying a voltage to an electrorheological fluid; and a step of supporting the substrate from the lower surface by the electrorheological fluid whose viscosity has been increased by the voltage application.