JP2003053561A - Laser processing equipment - Google Patents

Abstract

(57) [Summary] (With correction) PROBLEM TO BE SOLVED: To provide a laser processing apparatus capable of reducing a processing time in a laser processing apparatus, reducing the number of parts / cost and adjusting time. A beam damper is provided outside the optical path of laser light output from a laser oscillator and guided to a galvano scanner.
Are disposed on the beam damper 4 using the acousto-optic conversion element 3, and the control of the discard pulse is performed on the acousto-optic conversion element control unit 1.
2 does not move the target portion of the galvano scanner 7 and the processing time can be shortened, and a discarded pulse is irradiated outside the optical path before the laser beam reaches the galvano scanner 7. Stable processing can be performed without causing scratches due to erroneous irradiation due to beam light movement for irradiating a discarded pulse.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus for performing processing by irradiating a workpiece with laser light, particularly pulsed laser light. In recent years, a laser processing apparatus is frequently used for drilling a printed circuit board made of resin. In this laser processing apparatus, a pulsed laser beam output from a laser oscillator is reflected by a galvano scanner to irradiate a desired hole on a printed circuit board to be processed, thereby performing a hole processing. It was. In this type of laser processing apparatus, a pulsed laser beam does not have a predetermined intensity, for example,
When the control of the intensity of the first laser beam irradiated after a certain pause period is not successful, the printed circuit board is not irradiated until a steady-state laser beam can be output. As an example, JP-A-11-285872.
As shown in Fig. 2, the galvano scanner was controlled so that the laser beam was directed to a dummy target arranged separately from the printed circuit board (hereinafter referred to as "discard pulse"). However, in such a conventional configuration, a galvano scanner moving time required for irradiating a dummy target with a discarded pulse occurs. Moreover, since the laser beam is guided to the vicinity of the workpiece and the dummy target is irradiated with the laser beam, there is a possibility that the workpiece is erroneously irradiated and the processing quality is deteriorated. In addition, parts cost and adjustment time such as mounting position adjustment to prevent dummy target production, mounting and mis-irradiation occurred. In view of the above problems, the present invention can irradiate the workpiece with the optimum laser beam and reduce the processing time.
It is an object of the present invention to provide a laser processing apparatus with reduced dummy target and dummy target adjustment time. In order to solve the above problems, the present invention provides a laser oscillator, a control unit for controlling the laser oscillator, and a laser beam output from the laser oscillator as a workpiece. A galvano scanner that leads to a desired part of the laser, an acousto-optic conversion element is disposed in the optical path of the laser light output from the laser oscillator and guided to the galvano scanner, a beam damper is disposed outside the optical path, and the acousto-optic conversion element This is a laser processing apparatus in which a control unit performs control to irradiate the beam damper with laser light using a laser. DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a block diagram showing an outline of a laser processing apparatus according to the present embodiment. In the figure, a laser oscillator 1 outputs a pulsed laser beam 2a. The laser beam 2a is configured to be incident on the acousto-optic conversion element 3. The acousto-optic conversion element 3 is divided by the acousto-optic conversion element controller 12 into laser light not used for processing, or a discarded pulse 2b (hereinafter referred to as laser light 2b) and laser light 2c used for processing. The light 2b is applied to the beam damper 4. The direction of the laser beam 2c is changed by the reflecting mirror 5a. The direction-converted laser beam 2d is applied to the mask 6
It is comprised so that it may inject into. In this mask 6, the incident laser beam 2d
The laser beam 2e is output with the diameter of the laser beam being reduced to a desired diameter. The direction of the laser beam 2e is changed by the reflecting mirror 5b, and the direction-converted laser beam 2f is made incident on the galvano scanner 7. In this galvano scanner 7, a laser beam 2 is provided at a hole machining position in the plane direction of the printed circuit board 9 to be processed.
The position is adjusted by the galvano scanner control unit 13 using the internal X direction adjustment mirror and the Y direction adjustment mirror so that g is irradiated. The laser beam 2g is incident on the fθ lens 8, converted into a laser beam 2h perpendicular to the printed circuit board 9, and output. The printed circuit board 9 is an XY table 10.
To prevent it from slipping by sucking with air,
The position can be adjusted by the XY table driving unit 10a in the XY direction (the plane direction of the printed circuit board 9). The laser oscillator 1 controls the laser oscillation by the laser oscillator control unit 11, the acousto-optic conversion element 3 controls the irradiation direction of the laser light 2a by the acousto-optic conversion element control unit 12, and the galvano scanner 7 Control is performed by the scanner control unit 13, and the XY table drive unit 10a is driven and controlled by the XY table control unit 14. These laser oscillator control unit 11, acousto-optic conversion element control unit 12, galvano scanner control unit 13, and XY table control unit. 14 is configured to be connected to the main control unit 15. The main control unit 15 is connected to an input unit 16 and a recognition unit (storage means) 17, and laser processing conditions are input from the input unit 16 or selected from a menu displayed on a display unit (not shown). 14 is used for the processing in No.14. The main control unit 15 has a recognition unit (storage means).
The laser oscillator control unit 11 and the acousto-optic conversion element control unit 1 are combined with the information input from the input unit 16 together with the operation program and control parameters of the laser processing apparatus stored in 17.
2. The galvano scanner control unit 13 and the XY table control unit 14 are controlled. According to the above configuration, an acousto-optic conversion element is disposed in the optical path of the laser beam output from the laser oscillator and guided to the galvano scanner, and a beam damper is disposed outside the optical path. Since the acousto-optic conversion element control unit controls the laser beam that irradiates the beam damper with a pulse using the galvano scanner, the machining site targeted by the galvano scanner does not move, and the machining time can be shortened. Since the discard pulse is irradiated to the outside of the optical path before arriving at the workpiece, the workpiece is not damaged by erroneous irradiation due to the beam light movement for irradiating the discard pulse, and stable processing can be performed. Further, by discarding the beam damper outside the optical path and irradiating it with a pulse, a dummy target becomes unnecessary, and the parts cost and adjustment time required for position adjustment can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a laser processing apparatus according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 Laser oscillator 2a Laser light 2b Laser light (laser light not used for processing and discarded pulse) 2c Laser beam 2d Laser beam 2e Laser beam 2f Laser beam 2g Laser beam 2h Laser beam 3 Acousto-optic conversion element 4 Beam damper 5a Reflector 5b Reflector 6 Mask 7 Galvano scanner 8 fθ lens 9 Work piece 10 XY table 10a XY table drive unit DESCRIPTION OF SYMBOLS 11 Laser oscillator control part 12 Acousto-optic conversion element control part 13 Galvano scanner control part 14 XY table control part 15 Main control part 16 Input part 17 Recognition part (memory | storage means)

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Claims (1)

1. A laser oscillator, a control unit for controlling the laser oscillator, and a galvano scanner for guiding laser light output from the laser oscillator to a desired part of a workpiece, An acousto-optic conversion element is placed in the optical path of the laser beam output from the laser oscillator and guided to the galvano scanner,
A laser processing apparatus in which a control unit performs control to dispose a beam damper outside the optical path and irradiate the beam damper with laser light using the acousto-optic conversion element.