JP2002334311A - IC package - Google Patents

Abstract

(57) [Problem] To provide an IC package excellent in optical concealing property without deteriorating communication characteristics. SOLUTION: An IC provided with a surface substrate 11, an adhesive layer 12, a data storage element 13, and a concealing layer containing a concealing agent.
It is a mounted body. The pressure-sensitive adhesive layer 12 also functions as a hiding layer. The concealing agent is flaky aluminum powder.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an IC package having a data storage element, and more particularly to an IC package having excellent concealment.

[0002]

2. Description of the Related Art Conventionally, an automatic recognition management system using a bar code has been used for merchandise management in distribution and sales. The barcode is an information of the arrangement state of images (bars), and the information can be read by a dedicated barcode reader. For this reason, for example, merchandise management and distribution management are performed by attaching a barcode recording merchandise information to the merchandise. However, barcodes have problems in that a large amount of information cannot be recorded, information cannot be updated, and forgery is easy. Therefore, in recent years, RFID (Radio Frequency Identificatio
(n: radio frequency recognition) is attracting attention.

In this system, a large amount of information is stored in a semiconductor (IC) chip, and a planar antenna for transmitting and receiving information is connected to the IC chip. Then, when a radio wave of a predetermined frequency emitted by the reader is received by the antenna,
According to this radio wave, information stored in the internal IC chip is transmitted to the reader via the antenna. Update information from the reader is also transmitted to the IC chip via the antenna, and the stored information of the IC chip is updated (hereinafter, the IC chip and the antenna, and further, a predetermined capacitor, etc. are used). The combination is referred to as an “IC module”.)

[0004] This IC module is first put into practical use as an IC card. In this case, an IC card in which the IC module is held in hard plastic is manufactured by sandwiching the IC module with a plastic film or the like and appropriately performing thermocompression bonding. The IC card is provided to the user as appropriate, for example, as an employee ID card. On the other hand, from the viewpoint of merchandise management and distribution management, it is more convenient to be able to attach the IC module to merchandise. Because of this, I
Various adhesive labels incorporating a C module have been proposed.

[0005]

An adhesive label containing an IC card or an IC module (hereinafter, these are collectively referred to as an "IC package") is a plastic base material such as an IC chip and an antenna. It has a configuration that incorporates electronic components. However, since the IC mounting body is usually very thin, having a thickness of 0.4 to 1.0 mm, the plastic base material cannot secure sufficient concealment, and the built-in electronic components are optically transparent. We were able to. Therefore,
There is a problem that confidentiality, which is one of the important characteristics of the IC package, is lacking. Also, if the thickness of the plastic base material is increased in order to secure the concealing property, the communication characteristics of the IC mounted body are undesirably deteriorated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an IC package excellent in optical concealment without deteriorating communication characteristics.

[0007]

The above object can be achieved by an IC package having a surface substrate, an adhesive layer, a data storage element, and a concealing layer containing a concealing agent. It is preferable that the pressure-sensitive adhesive layer also functions as a hiding layer. The masking agent,
It is preferably flaky aluminum powder.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
FIG. 1 is a sectional view showing a data storage element holding label as a first embodiment of an IC package according to the present invention. FIG. 2 is a plan view showing the data storage element holding label of FIG. In the data storage element holding label 10 of this example, an adhesive layer 12 is formed on one surface 11a of a surface substrate 11, and the data storage element 13 is held on the adhesive layer 12. The exposed surface 12a side of the adhesive layer 12, that is,
The surface side on which the surface base material 11 is not provided can be attached to the object 20. The data storage element holding label 10 includes a concealing layer containing a concealing agent (not shown).
have.

In the data storage element holding label 10, the data storage element 13 is provided on the exposed surface 12 a of the adhesive layer 12.
The one side 13 c of the data storage element 13 is disposed from the side and held by the adhesive layer 12.
Adheres to the surface. When the data storage element holding label 10 is attached to the target 20, the other surface 13d of the data storage element is in contact with the target 20, and the entire adhesive layer 12 is covered with the surface base material 11. It has become. Such a data storage element holding label 10 is usually stored in a state in which a release paper 14 is provided on the surface that comes into contact with the object 20, that is, on the exposed surface 12a side of the adhesive layer 12, as shown in FIG. And distributed.

The data storage element 13 used here is not particularly limited, and one having a thickness of 50 to 500 μm is used. Generally, the transmission and reception of a substantially flat plate as shown in FIGS. A unit having a unit 13b and a data storage and / or calculation unit (hereinafter, referred to as a "data storage unit") 13a protruding from one surface of the transmission / reception unit 13b is used. As such a data storage element 13, an IC module put into practical use with an IC card or the like can be used, and for example, an IC module 30 as shown in FIG. 4 can be exemplified. This IC module 30 corresponds to the transmission / reception unit 13b having a substantially flat plate shape, and has an antenna coil 16 formed on a substrate 15.
An IC chip 17 corresponding to the data storage unit 13a is disposed on one surface of the IC card. Then, the antenna coil 16
Are connected by an anisotropic conductive tape 16a.
The C chip 17 and the antenna coil 16 maintain conductivity. Further, the transmission / reception unit 13b is not limited to the antenna coil 16, and may be a plate antenna formed on a substrate. Note that various protective films may be provided on the surface of the transmission / reception unit 13b as necessary.

The concealing layer of the data storage element holding label 10 may be formed as a concealing layer by adding a concealing agent to the surface base material 11, the pressure-sensitive adhesive layer 12, or the like. On the surface 11a, on the other surface 11b of the surface substrate, or on the other surface 13d of the data storage element, a concealing agent may be added to the pressure-sensitive adhesive layer 12 so that the pressure-sensitive adhesive layer 12 has a concealing layer. It is preferable to provide the function of. By providing the concealing layer on the data storage element holding label 10 as described above,
Communication radio waves pass through, and optical shielding is achieved.

As the concealing agent, aluminum powder, scaly aluminum powder, titanium oxide, non-conductive ink and the like can be used, but scaly aluminum powder is preferably used. The scaly aluminum powder is a flat aluminum metal powder having an average particle diameter of 50 μm or less, preferably 3 to 30 μm. Such a concealing agent is added to the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12 or the resin forming the surface substrate 11. For example, a concealing agent is added to the pressure-sensitive adhesive and uniformly dispersed by a method such as stirring, so that the pressure-sensitive adhesive layer 12 has concealing properties. By adding a concealing agent to the pressure-sensitive adhesive or the resin forming the surface base material 11 in advance to impart an effect as a concealing layer to the pressure-sensitive adhesive layer 12 or the surface base material 11, Since the step of providing the concealing layer is not required,
Manufacturing costs can be reduced. Further, when a concealing agent is added to the pressure-sensitive adhesive, even when the opacity of the surface base material 11 is low, the color of the object 20 does not affect the appearance of the label, and the data storage element holding label 10 having a high concealment property can be obtained. can do. If the concealability of the data storage element holding label 10 is high, it is difficult to determine the location of the data storage element 13 from the outside, and it is possible to prevent fraudulent acts such as impersonation of the data storage element 13.

The amount of the concealing agent added to the pressure-sensitive adhesive or the resin forming the surface substrate 11 is preferably from 10 to 50% by weight, more preferably from 20 to 40% by weight. If the added amount of the concealing agent is less than 10% by weight, the concealing property cannot be sufficiently ensured. If the added amount exceeds 50% by weight, the communication characteristics of the transmitting / receiving section 13b of the data storage element 13 deteriorate. .

FIG. 5 shows a data storage element holding label as a second embodiment of an IC package according to the present invention, in which a concealing layer 15 is provided on one surface 11a of a surface base material. FIG. The concealing layer 15 is formed by arranging the concealing agent on the surface substrate 11 using a coating material in which the concealing agent is dispersed in an organic solvent or water. Concealment layer 15
Is preferably 0.1 to 100 μm, more preferably 1 to 30 μm. The amount of masking agent applied to the surface substrate 11, 0.1 to 100 g / m ^2, preferably between 1 to 30 g / m ^2. In particular, when the scaly aluminum powder is used as a concealing agent, the coating amount of the scaly aluminum powder is 0.1 to 20 g / m ² , preferably 1 to ²⁰ g / m ² .
10 g / m ² . When the coating amount of the flaky aluminum powder is less than 0.1 g / m ² , the optical shielding property is insufficient, and when it exceeds 20 g / m ² , there is an obstacle in communication characteristics.

As a method of providing the concealing layer 15 on the surface substrate 11, a coating composition comprising a binder, a dispersion medium, and the like may be coated on a flat plate, a convex plate, screen printing, a Meyer bar coater, a reverse roll coater, a knife coater, or the like. It is provided by printing or coating using a bar coater, a slot die coater, a lip coater, an air knife coater, a reverse gravure coater, a vario gravure coater, or the like.

Examples of the binder include a known heat-drying type, thermosetting resin, and ultraviolet curing resin. For example, polystyrene, polyester, vinyl acetate resin, vinyl chloride resin, acrylic resin, olefin resin, diene resin, natural rubber, gelatin, glue, abietic resin, cellulose derivative resin, polyester resin,
Epoxy resin, vinyl butyral resin, urethane resin,
Polyamide resin, alkyd resin, melamine resin,
Urea resin, phenol formalin resin, petroleum resin,
A simple substance such as a maleic acid copolymer, a mixture or a copolymer may be used.

The above-mentioned concealing agent is dispersed in a simple substance or a mixture of these binders to obtain a coating composition. For example, a water-based or solvent-based coating composition is prepared by adding metallic aluminum as a concealing agent to a scale powder by stamping or the like, or adding an aluminum paste dispersed in a petroleum-based solvent to water or a solvent. Then, the coating composition is printed or coated on the surface base material 11 by the above-described method, and, if necessary, is dried by hot air and irradiated with ultraviolet rays to be solidified. The coating amount depends on the final thickness of the target data storage element holding label, but is usually 0.1 to 10 in terms of dry weight.
0 g / m ² and 0.1 to 100 μm in thickness.

FIG. 6 is a sectional view showing a data storage element holding label as a third embodiment of the IC package according to the present invention. The data storage element holding label 10 of this example includes a first adhesive layer 12c and a second adhesive layer 12d, and is provided on a surface of the data storage element 13 that does not have the first adhesive layer 12c. And a second pressure-sensitive adhesive layer 12d. Also,
In the data storage element holding label 10, the first pressure-sensitive adhesive layer 12c and / or the second pressure-sensitive adhesive layer 12d also serve as a concealing layer. By providing the second pressure-sensitive adhesive layer 12d, the second pressure-sensitive adhesive layer 12d more strongly adheres to the object 20 and is hardly peeled off, and the second pressure-sensitive adhesive layer 12d acts as a buffer material, and the data storage element 13 is more damaged. It becomes difficult to do. First pressure-sensitive adhesive layer 12c and second pressure-sensitive adhesive layer 12d
The adhesive exemplified for the adhesive layer 12 can be used in the same manner.

FIG. 7 is a sectional view showing a data storage element holding label as a fourth embodiment of the IC package according to the present invention. The data storage element holding label 10 of this example uses an elastic material having a thickness greater than that of the data storage element 13 as the surface base material 11.
Is embedded in the surface base material 11 side, and the other surface 13 d of the data storage element 13, that is, the surface facing the object 20 and the exposed surface 12 a of the adhesive layer 12 are flush with each other. In the data storage element holding label 10, the pressure-sensitive adhesive layer 12 also functions as a concealing layer. In the data storage element holding label 10 of this example, the data storage element 13 is embedded on the surface base material 11 side, and the adhesive layer 12 exists between the data storage element 13 and the surface base material 11. In addition, even when an impact is applied to the data storage element holding label 10 from the side and above, the destruction of the data storage unit 13a can be preferably prevented. Also, the surface substrate 1
1 has a flat outer surface.

As the surface substrate 11, cellophane, polyethylene, polypropylene, soft polyvinyl chloride, hard polyvinyl chloride, polyester (for example, polyethylene terephthalate, ethylene glycol, 1,4-cyclohexane dimethanol and terephthalic acid are polymerized). Polyester resin having 80 to 95 mol% of ethylene glycol residues and 5 to 20 mol% of 1,4-cyclohexanedimethanol residues), polystyrene, polyurethane, etc. A film composed mainly of the above resins, a foamed film composed mainly of these resins and blended with a foaming agent and foamed, a blend composed mainly of these resins, an inorganic and / or organic pigment, and subjected to a stretching treatment. Films such as porous films with voids , Synthetic papers, non-wovens, or papers such as high-quality paper, art paper, coated paper, cast coated paper, kraft paper, polyethylene laminated paper, impregnated paper, foamed paper, water-soluble paper, and thermal recording paper And known recording sheets such as an ink jet recording paper and a recording sheet such as a thermal transfer receiving sheet. These may be used alone, or a plurality of these may be appropriately laminated and used. .

Further, on the outer surface of the surface substrate 11, printing is performed so as to provide a predetermined design effect or to describe necessary information, and information about the object 20 is printed and displayed. It is preferable to be able to do so. In particular, it is preferable to provide an area that can be printed by various printers on the surface substrate 11 because individual information can be printed by a computer or the like. For example, if at least a part of the surface substrate 11 can be printed by a thermal printer as thermal recording paper, or if at least a part of the surface substrate 11 has predetermined ink receptivity and can be printed by an inkjet printer, Good. In particular, it is preferable to form a rewritable recording paper such as a reversible thermosensitive recording paper because display information can be updated. The thickness of the surface substrate 11 is usually 30 to 300.
μm.

The pressure-sensitive adhesive layer 12 is usually formed with a thickness of 5 to 50 μm, preferably 7 to 30 μm. The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12 is not particularly limited, and is a rubber-based pressure-sensitive adhesive obtained by adding a tackifier resin such as rosin and rosin ester to natural rubber, and a copolymer of acrylic acid and its ester. Acrylic adhesive composed,
Emulsion type such as vinyl ether type adhesive, urethane type adhesive, solvent type, hot melt type adhesive etc. can be used, depending on the application, permanent adhesive, strong adhesive,
Adhesives for cold food and re-peeling can be used. The pressure-sensitive adhesive layer 12 may optionally contain an auxiliary agent such as a tackifier, a crosslinking agent, a pigment, or an ultraviolet absorber.

The pressure-sensitive adhesive layer 12 is formed on the surface substrate 11.
As a method, apply an adhesive on release paper in advance and dry it.
After drying, the surface substrate 11 is laminated thereon,
Of transferring the pressure-sensitive adhesive layer 12 on the surface substrate 11
The adhesive is applied directly to the substrate and dried to provide the adhesive layer 12
There are methods. The adhesive layer 12 is made of a reverse roll coat.
, Knife coater, bar coater, slot die coater,
Lip coater, air knife coater, reverse gravure
Or on a release paper with a coater, bariogravure coater, etc.
It is applied on the surface substrate 11 and then dried. Adhesive
The coating amount is 5 to 50 g / m in dry weight.^Two, More preferably
Is 7 to 30 g / m^Two It is. 5g / m^Two Less than, subject
In some cases, the adhesion to the object 20 may be insufficient.
0 g / m^TwoIf it exceeds, the adhesive may protrude or
When adhering to the object 20, cohesive failure occurs when peeling from release paper.
May cause.

Substrate 15 used for data storage element 13
When the transmitting and receiving unit 13b is the antenna coil 16, polyethylene terephthalate (hereinafter, “PET”)
Abbreviated. ), Polypropylene (hereinafter abbreviated as “PP”), polyethylene (hereinafter abbreviated as “PE”), or a resin having a thickness of 20 to 100 μm. The method of forming the antenna coil 16 on the substrate 15 includes a method of attaching a coil made of a wire such as silver or copper, and a method of etching a vapor-deposited film of copper or aluminum formed on the substrate 15 into a coil shape. And a method of printing conductive ink or the like in a coil shape. As the board used for the plate antenna,
Examples include films and papers such as PET, PP, and PE.
Examples of a method for forming the plate antenna include a method of printing a conductive ink or the like, a method of depositing a metal such as copper or aluminum, and the like. As the IC chip 17,
Usually, the length and width are 0.5 to 10 mm and the thickness is 50 to
Those having a size of about 300 μm are used.

The release paper 14 may be a high density paper such as glassine paper, a clay coated paper, a kraft paper, a high quality paper or the like, and a resin film such as PE laminated on a so-called poly-laminate base paper, or a kraft paper or a high quality paper. Emulsion-type, solvent-type or non-solvent-type on resin-coated base paper provided with a filler layer containing a water-soluble polymer such as polyvinyl alcohol and starch and a pigment as main components, or a film such as PP or PET. After applying a silicone resin, a fluororesin or the like to a dry weight of about 0.05 to 3 g / m ² , a release agent layer formed by heat curing, electron beam curing, ultraviolet curing, or the like is appropriately used. . The thickness of the release paper 14 is not limited, but is usually 30 to
It is 300 μm.

FIG. 8 is a sectional view showing an IC card as a fifth embodiment of the IC package according to the present invention. The IC card 40 has a first pressure-sensitive adhesive layer 34 formed on one surface 31 a of one surface substrate 31, and the data storage element 13 is held on the first pressure-sensitive adhesive layer 34. Further, the exposed surface 34a side of the adhesive layer 34, that is, the surface side on which the surface
Surface 3 of concealing layer 33 formed on one surface 32a of
It is stuck on the second pressure-sensitive adhesive layer 35 formed on 3a.

In the IC card 40, the concealing layer 33 includes:
It is formed in the same manner as the concealing layer 15 of the data storage element holding label 10. That is, the concealing layer 33 is provided on one surface 31a, 32a of the surface base materials 31, 32, or is concealed by the adhesive forming the first adhesive layer 34 and / or the second adhesive layer 35. An agent is added or a concealing agent is added to the resin forming the surface base materials 31 and 32 to impart concealing properties.

The surface substrates 31 and 32 are obtained by polymerizing polyester (for example, polyethylene terephthalate, polybutylene terephthalate, ethylene glycol, 1,4-cyclohexane dimethanol and terephthalic acid), A polyester resin having 80 to 95 mol% of ethylene glycol residues and 5 to 20 mol% of 1,4-cyclohexanedimethanol residues), acrylonitrile, soft polyvinyl chloride, hard polyvinyl chloride, polycarbonate,
Acrylonitrile-butadiene-styrene copolymer (hereinafter abbreviated as "ABS") resin, a film mainly composed of a resin such as cellophane, polyethylene, polypropylene, polystyrene, polyurethane, and the like; A foamed film blended and foamed, a film such as a porous film blended with an inorganic and / or organic pigment containing these resins as a main component, and forming a void by a stretching treatment, a synthetic paper, a nonwoven fabric, or Fine paper, art paper, coated paper, cast coated paper, kraft paper, polyethylene laminated paper, impregnated paper, foamed paper, water-soluble paper and other papers, as well as thermal recording paper, inkjet recording paper, thermal transfer receiving sheets, etc. Well-known insulating sheets such as recording sheets, metal sheets, etc. can be used alone or as a mixture. It is. Also, the surface base materials 31, 33
On the other surfaces 31b and 33b, desired patterns, explanatory characters, and the like may be printed by offset printing, silk screen printing, or the like. The IC card is formed into a card by punching after the respective layers constituting the IC card are laminated. Printing on the surface base materials 31 and 33 may be performed before or after punching.

As the adhesive forming the first pressure-sensitive adhesive layer 34 and the second pressure-sensitive adhesive layer, the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 12 is used.

Hereinafter, specific examples will be described. (Example 1) The IC card 40 shown in FIG. 8 was manufactured as follows. The thickness 188 is used as the surface base materials 31 and 32.
A μm milk-white polyethylene terephthalate film (trade name: Teijin Tetron Film U2W, manufactured by Teijin Limited) was used. 20 parts by weight of aluminum flat powder (average particle diameter 15 μm) on the surface substrate 32 60 parts by weight of urethane resin for paint 0.5 parts by weight of cobalt naphthenate 6 parts by weight of xylene 5.5 parts by weight of mineral spirit 5.5 parts by weight of methyl ethyl ketone From 215 parts by weight of methyl ethyl ketone 6 g / m ^{2 was} applied to form a hiding layer 33. Polyester hot melt films were used as the pressure-sensitive adhesive layers 34 and 35. The surface base material 32 on which the concealing layer 33 is formed, the pressure-sensitive adhesive layer 35, the data storage element 13, the pressure-sensitive adhesive layer 34, and the surface base material 31 are laminated in this order, 120 ° C., pressure 5 k
g / cm ² , IC bonded by hot plate press for 20 seconds
A card 40 was produced.

(Example 2) The data storage element holding label 10 shown in FIG. 3 was manufactured as follows. First, as an adhesive for forming the adhesive layer 12, (trade name: SVP
101, manufactured by Seiden Chemical Co., Ltd.). After adding 30% by weight of aluminum flat powder to the acrylic pressure-sensitive adhesive, using a hand applicator, apply it on a commercially available poly-laminate release paper and dry it at 100 ° C. for 2 minutes. The image was transferred to the opposite side of the recording surface of the reversible thermosensitive recording medium produced by the method (5). The coating amount of the pressure-sensitive adhesive was adjusted so as to be 25 g / m ^{2 in} a state of a dried coating film. (1) Preparation of Dispersion A 3-Dibutylamino-6-methyl-7-anilinofluoran 20 parts by weight 10% aqueous solution of polyvinyl alcohol 10 parts by weight Water 70 parts by weight The above composition was averaged in particle size using a sand grinder. Was reduced to 1.1 μm. (2) Preparation of Dispersion B N-[(4-n-octadecanoylaminophenyl) sulfonyl] benzamide 20 parts by weight 10% by weight aqueous solution of polyvinyl alcohol 10 parts by weight Water 70 parts by weight The above composition was used with a sand grinder. And pulverized until the average particle size became 1.1 μm. (3) Formation of reversible thermosensitive recording layer 100 parts by weight of the dispersion A, 250 parts by weight of the dispersion B, and 250 parts by weight of a 10% by weight aqueous solution of polyvinyl alcohol were mixed and stirred to obtain a coating liquid. Apply this coating solution to a thickness of 1
The coated amount after drying is 5.0 g on one side of a 00 μm support.
/ M ^2, and dried to form a reversible thermosensitive recording layer. (4) Formation of Intermediate Layer 60 parts by weight of a 50% by weight dispersion of kaolinite clay, 1
200 parts by weight of a 0% by weight aqueous solution of polyvinyl alcohol were mixed and stirred to prepare a coating solution for an intermediate layer. This coating solution was applied onto the reversible thermosensitive recording layer so that the coating amount after drying was 1.5 g / m ^2, and dried to form an intermediate layer. (5) Formation of overcoat layer Polyester acrylate (trade name: ARONICS M-
8030, 40 parts by weight, manufactured by Toa Gosei Co., Ltd., 40 parts by weight of polyester acrylate (trade name: Aronix M-6200, manufactured by Toa Gosei Co., Ltd.), 20 parts by weight of calcium carbonate (trade name: Ryton A, manufactured by Bihoku Powder Chemical Industry Co., Ltd.) Was mixed and stirred, and the mixture was applied onto the intermediate layer so that the application amount was 2.5 g / m ² . The obtained coating layer was irradiated with an electron beam under the conditions of an oxygen concentration of 300 ppm or less in an electron beam irradiation chamber, an acceleration voltage of 175 kV, and an absorbed dose of 3 Mrad to form an overcoat layer and obtain a reversible thermosensitive recording medium. . Next, the surface base material 11 on which the pressure-sensitive adhesive layer 12 containing the aluminum flat powder is formed, the data storage element 13, and the release paper 14 are laminated in this order,
A data storage element holding label 10 was produced.

Comparative Example 1 An IC card 40 was prepared in the same manner as in Example 1 except that the concealing layer 33 was not provided.
Was prepared.

(Comparative Example 2) Instead of the aluminum powder of Example 1, 8 μm of barium sulfate ground powder was used. Barium sulfate powder 50 parts by weight Sodium polyacrylate 2 parts by weight SBR latex 20 parts by weight Water 72 parts by weight An IC card 40 was produced by applying a paint of 40 g / m ² .

(Comparative Example 3) An IC card 40 was produced by attaching an aluminum vapor-deposited film to one surface 32a of the surface substrate 32 using hot melt film glue instead of the aluminum powder of Example 1.

Comparative Example 4 188 μm milky white polyethylene terephthalate sheet for card (trade name: Teijin Tetron Film U2W, manufactured by Teijin Limited) was coated with TiO ₂ (average particle diameter: 0.1 μm, trade name: FA-55W, Furukawa Kikai Metal) 90 parts by weight of styrene-butadiene rubber 20 parts by weight Dispersant 0.1 part by weight A coating consisting of 90 parts by weight of water was applied at 6 g / m ² to prepare an IC card 40.

(Measurement of Light Shielding Effect) I of each Example and Comparative Example
The degree of light shielding of the C card 40 is determined by the sensor unit (model: L
X2-01T, manufactured by Keyence Corporation, an amplifier unit (model: LX2-V10, manufactured by Keyence Corporation), and a power supply unit (model: KZ-U3, manufactured by Keyence Corporation) is a light shielding effect measuring device. Measured using As a result, it was found that the IC card 40 of Example 1 hardly transmits light, and a sufficient light shielding effect was obtained. Further, the data storage element holding label 10 of Example 2 hardly transmits light, and a sufficient light shielding effect was obtained.

(Measurement of Communication Distance) The communication distance between the data storage element holding label 10 and the IC card 40 in each of the examples and the comparative examples was measured. These data storage element holding labels 10
And the resonance frequency of the IC card 40 was measured. A data storage element holding label 10 and an IC are measured by a measuring instrument in which a loop antenna having a diameter of 5 cm is connected to a network analyzer (model R3754B, manufactured by Advantest).
The resonance frequency of the card 40 was measured. As a result, the resonance frequency of the IC card 40 according to the first embodiment is 13.56 MHz.
Was confirmed. In addition, it was confirmed that the data storage element holding label 10 was 13.55 MHz. Next, the communication distance between the data storage element holding label 10 and the IC card 40 of each example and comparative example was measured using a reader / writer (manufactured by Siemens) connected to a personal computer. As a result, the IC card 4 of the first and second embodiments
0 and the data storage element holding label 10 were confirmed to be able to communicate from a distance of 90 mm. As described above, it was confirmed that the IC card 40 and the data storage element holding label 10 of Examples 1 and 2 satisfied the required resonance frequency and communication distance.

[0038]

As described above, the IC package of the present invention is provided with the surface base material, the pressure-sensitive adhesive layer, the data storage element, and the concealing layer containing the concealing agent. Even when the opacity of the surface base material is low, the hiding property can be made high without affecting the color of the object on the appearance of the IC package. Further, since the pressure-sensitive adhesive layer also serves as the concealing layer, a step of providing the concealing layer is not required at the time of manufacturing the IC package, and the manufacturing cost can be reduced. And since the concealing agent is a flaky aluminum powder,
I with excellent optical concealment without deteriorating communication characteristics
A C package can be provided.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of an IC package according to the present invention.
It is sectional drawing which shows a data storage element holding label.

FIG. 2 is a plan view showing the data storage element holding label of FIG. 1;

FIG. 3 is a cross-sectional view showing an example of a data storage element holding label and showing a state where release paper is provided.

FIG. 4 is a plan view illustrating one mode of a data storage element.

FIG. 5 shows a second embodiment of the IC package according to the present invention.
It is sectional drawing which shows a data storage element holding label.

FIG. 6 shows a third embodiment of the IC package according to the present invention.
It is sectional drawing which shows a data storage element holding label.

FIG. 7 shows a fourth embodiment of the IC package according to the present invention.
It is sectional drawing which shows a data storage element holding label.

FIG. 8 shows a fifth embodiment of the IC package according to the present invention.
It is sectional drawing which shows an IC card.

[Explanation of symbols]

10: data storage element holding label, 11: surface substrate, 1
2: adhesive layer, 13: data storage element, 13a: data storage unit, 13b: transmission / reception unit, 14: release paper, 15: concealment layer, 20: object

Claims (3)

[Claims] 1. An IC package comprising a surface substrate, an adhesive layer, a data storage element, and a concealing layer containing a concealing agent. 2. The IC package according to claim 1, wherein the pressure-sensitive adhesive layer also functions as a hiding layer. 3. The IC package according to claim 1, wherein the concealing agent is flaky aluminum powder.