JP2002331628A - Polyimide sheet molding and method for producing the same - Google Patents

Abstract

(57) Abstract: Provided is a polyimide sheet molded article having a large thickness and excellent heat resistance and suitable as a moldable TAB spacer film, and a method for producing the same. A polyimide film obtained by using 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride or a derivative thereof and 4,4'-diaminodiphenyl ether as essential components is heat-resistant. A polyimide sheet molded article obtained by laminating a thermocompression-bonding thermocompression-bonding multilayer polyimide film having a thermocompression-bonding polyimide layer on both sides of a polyimide layer and processing both ends of a polyimide sheet having a thickness of 150 μm or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyimide sheet molded article having excellent heat resistance and a method for producing the same. More specifically, the present invention relates to a polyimide sheet having a practical level of adhesive strength and heat resistance. The present invention relates to a polyimide sheet molded article suitable as a highly rigid spacer film for TAB and a method for producing the same.

[0002]

2. Description of the Related Art Conventionally, a spacer film in a process of manufacturing a TAB film carrier tape is used for protecting a product such as preventing a resin coat surface from being damaged and preventing pin deformation after pattern processing. It is used. This spacer film has the same width as a film carrier tape (35 mm,
48mm, 70mm) and film carrier tape at both ends
Embossed to match the sprocket hole of the wheel. The spacer film material is mainly composed of a polyester film, a poly-p-phenylene sulfide film, a polyimide film, and the like, and is properly used depending on the purpose. For product transportation and transfer,
Usually, a polyester film of 180 μm is used. The polyimide film is used when the temperature of the equipment reaches a high temperature of 120 ° C. to 180 ° C., such as a step of applying a solder resist, a plating resist, and an electric insulating protective film, and a step of heating and curing.

[0003]

On the other hand, a polyimide film has a thickness 1 thinner than a polyester film.
Since the 25-μm type is used, the waist is weak and the central part is deformed into a concave shape, causing damage to the resin coat surface, contact with the patterned pins, irregularities in the pin pitch and the problem of pin deformation. It has occurred. In addition, since the film is thin, the film is easily deformed when used repeatedly and lacks durability. For this reason, as the densification of electronic equipment is progressing, recently, a fine pattern having a wide width of 70 mm and a large device hole is required, and a thick spacer film which can be molded with a polyimide film is required. Proposed.

[0004] However, it is extremely difficult to produce a thick polyimide film.
In fact, only those with a size of up to 25 μm are on the market. For this reason, it has been studied to increase the thickness by using a polyimide tape obtained by laminating a polyimide film with an epoxy resin adhesive, but a practically usable one has not yet been put on the market. The reason is that there is no polyimide tape which can be embossed and has high rigidity and high adhesive strength, and even if this point is improved, there is a problem in the heat resistance of the epoxy resin adhesive. It is.

An object of the present invention is to solve the problems of the prior art, and it is an object of the present invention to provide a polyimide sheet having a large thickness, excellent heat resistance, and a moldable mold. It is an object of the present invention to provide a polyimide sheet molded article suitable as a spacer film for TAB of polyimide and a method for producing the same.

[0006]

SUMMARY OF THE INVENTION The present invention is directed to a 3, 3 ',
A plurality of polyimide films obtained by using 4,4'-biphenyltetracarboxylic dianhydride or a derivative thereof and 4,4'-diaminodiphenyl ether as essential components are heat-bonded to both surfaces of a heat-resistant polyimide layer. Laminated with a thermocompression-bondable multilayer polyimide film having a polyimide layer,
The present invention relates to a polyimide sheet molded body obtained by processing both ends of a polyimide sheet having a thickness of 150 μm or more.

[0007] Further, the present invention relates to 3,3 ', 4,4'-
A plurality of polyimide films obtained by using biphenyltetracarboxylic dianhydride or a derivative thereof and 4,4′-diaminodiphenyl ether as essential components are prepared by heating a polyimide film having a thermocompression-bonding polyimide layer on both sides of a heat-resistant polyimide layer. The present invention relates to a method for producing a polyimide sheet molded body obtained by laminating a polyimide sheet having a thickness of 150 μm or more, which is obtained by laminating with a pressure-bondable multilayer polyimide film.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be listed below. 1) The above-mentioned molded polyimide sheet having a tensile modulus of 300 kgf / mm ² or more. 2) The calculated value of tensile modulus × thickness of the polyimide sheet is 40 kgf / mm or more, preferably 70 kgf / mm.
mm or more. 3) The above-mentioned polyimide sheet molded body whose processing is embossing. 4) The above polyimide series for a TAB spacer
Molded body. 5) The method for producing a polyimide sheet molded article, wherein the polyimide film has been subjected to a surface treatment such as a corona discharge treatment or a plasma discharge treatment.

In the present invention, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride or a derivative thereof and 4,4'-
A polyimide film obtained by using diaminodiphenyl ether as an essential component is used.

The structure of the polyimide sheet according to the present invention includes, for example, the following combinations. Among them, PIF is a polyimide film, PIF-
A means a thermocompression-bondable multilayer polyimide film. 1) PIF / PIF-A / PIF 2) PIF / PIF-A / PIF / PIF-A / PIF In the present invention, when heat resistance is not a problem, these layers may be combined with another layer, for example, epoxy resin. An adhesive layer may be added.

The above-mentioned polyimide film preferably has a glass transition temperature (Tg) of 270 to 330 ° C., and maintains the uneven shape of the heat processing by embossing. The polyimide film preferably has a thickness of 75 to 125 μm, and preferably has a width of about 35 mm, about 48 mm, about 70 mm, or about 96 mm by cutting a wide polyimide film raw material.
mm and the width is substantially the same as the film carrier tape.

The above-mentioned polyimide film is preferably obtained from 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and 4,4′-diaminodiphenyl ether. Part of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride may be replaced by pyromellitic dianhydride or 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride . When a polyimide film obtained from 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride or a derivative thereof and p-phenylenediamine is used as the polyimide film, embossing is difficult and the heating temperature is increased. Even if embossing is performed, the shape is not retained for a long time, which is not preferable as a spacer film for TAB.

The above-mentioned polyimide film can be prepared by, for example, converting the above-mentioned aromatic diamine and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride into N-methyl-2-pyrrolidone, N, N-dimethylacetamide or the like. A solution composition in which an inorganic filler and an organic phosphorus compound are added to a polyamic acid solution obtained by polymerization in an organic solvent is used as a dope, and the solution composition is cast onto a support surface such as a mirror surface of a stainless steel or a belt surface. , Dried at 100-200 ° C, and the resulting self-supporting film is heated to a temperature of 300-500 ° C (surface temperature measured by a surface thermometer) (preferably heated at this temperature for 1-60 minutes). T) dried and imidized,
A polyimide film can be manufactured.

In the present invention, a thermocompression-bondable multilayer polyimide film having a thermocompression-bondable polyimide layer on both sides of a heat-resistant polyimide layer is used. The thermocompression-bondable multilayer polyimide film has a thermal expansion property and a linear expansion coefficient (50 to 200 ° C.) (MD) of 30 × 10 ⁻⁶ cm / cm.
/ ° C or lower is preferable, and the tensile modulus (MD, A
(STM-D882) is preferably 300 kgf / mm ² or more.

The above-mentioned thermocompression-bondable multilayer polyimide film is preferably prepared by a coextrusion-casting film forming method (also referred to simply as a multilayer extrusion method) and a heat-resistant polyimide precursor solution and thermocompression-bondable polyimide on both surfaces thereof. Laminating the precursor solution,
Drying, a method of obtaining a thermocompression-bondable multilayer polyimide film by imidization, or the precursor solution of the heat-resistant polyimide is applied by casting onto a support, and the thermocompression-bondable polyimide precursor solution is applied to both sides of the dried gel film. It can be obtained by a method of applying, drying and imidizing to obtain a thermocompression-bondable multilayer polyimide film. In any of the above methods, the precursor layer of the thermocompression-bondable polyimide is formed in a thickness of 250 to 420.
It is preferable to dry and imidize at the maximum heating temperature of ° C. In particular, the self-supporting film obtained by the coextrusion-casting method is dried at a maximum heating temperature of 250 to 420 ° C,
Those imidized are preferred.

The heat-resistant polyimide as the base layer of the thermocompression-bondable multilayer polyimide film is preferably 3,
3 ′, 4,4′-biphenyltetracarboxylic dianhydride (hereinafter may be simply abbreviated as s-BPDA) and paraphenylenediamine (hereinafter may be simply abbreviated as PPD), and optionally 4 more. , 4'-diaminodiphenyl ether (hereinafter sometimes abbreviated simply as DADE).

The heat-resistant polyimide used as the base layer includes 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, pyromellitic dianhydride, paraphenylenediamine, and 4,4'-diaminodiphenyl. It is manufactured from ether. The heat-resistant polyimide as the base layer is produced from pyromellitic dianhydride, paraphenylenediamine and 4,4'-diaminodiphenyl ether. In this case, DADE / PPD (molar ratio) is 90
It is preferably / 10 to 10/90.

Further, the heat-resistant polyimide used as the base layer includes 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and pyromellitic dianhydride (PMDA) and paraphenylenediamine (PPD). ) And 4,4'-diaminodiphenyl ether (DAD)
E). In this case, BTD in acid dianhydride
A is 20 to 90 mol%, PMDA is 10 to 80 mol%,
30 to 90 mol% of PPD and 10 of DADE in diamine
It is preferably about 70 mol%.

As the above-mentioned heat-resistant polyimide as the base layer, it is preferable that the glass transition temperature cannot be confirmed to be 300 ° C. or more when a single polyimide film is used. In particular, the linear expansion coefficient (50 to 200 ° C.) ) (MD) is preferably 5 × 10 ^{−6 to} 20 × 10 ⁻⁶ cm / cm / ° C. In addition, the tensile modulus (MD, ASTM-D88
2) is preferably 300 kgf / mm ² or more. In the synthesis of the substrate layer polyimide, if the proportion of each component is finally within the above range, random polymerization, block polymerization, or synthesis of two kinds of polyamic acids in advance, mixing of both polyamic acid solutions, and then reaction conditions To obtain a homogeneous solution.

The thermocompression-bondable polyimide as the thermocompression-bonding layer in the present invention can be selected from various known thermoplastic polyimides, and is preferably 1,3-bis (4
-Aminophenoxy) benzene (hereinafter sometimes abbreviated as TPER), 2,3,3 ', 4'-biphenyltetracarboxylic dianhydride (hereinafter sometimes abbreviated as a-BPDA) and / Or 3, 3 ', 4, 4'
-Biphenyltetracarboxylic dianhydride. Further, as the thermocompression bonding polyimide as the thermocompression bonding layer, 1,3-bis (4-aminophenoxy) -2,
2-dimethylpropane (DANPG), 4,4'-oxydiphthalic dianhydride (ODPA) and a-BPDA
And manufactured from. Alternatively, it is produced from 4,4′-oxydiphthalic dianhydride (ODPA) and pyromellitic dianhydride and 1,3-bis (4-aminophenoxy) benzene.

Other diamines such as 4,4'-diaminodiphenyl ether, 4,4'-diaminobenzophenone, 4,4'-diaminodiphenylmethane, 2,4 2-bis (4-aminophenyl) propane, 1,4-bis (4
-Aminophenoxy) benzene, 4,4'-bis (4-
Aminophenyl) diphenyl ether, 4,4′-bis (4-aminophenyl) diphenylmethane, 4,4′-
Bis (4-aminophenoxy) diphenyl ether,
4,4'-bis (4-aminophenoxy) diphenylmethane, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoro Flexible aromatic diamines having multiple benzene rings such as propane, 1,4
-Diaminobutane, 1,6-diaminohexane, 1,8
-Diaminooctane, 1,10-diaminodecane, 1,
It may be replaced by an aliphatic diamine such as 12-diaminododecane, or a diaminodisiloxane such as bis (3-aminopropyl) tetramethyldisiloxane. The proportion of other aromatic diamines used is preferably at most 20 mol%, particularly at most 10 mol%, based on all diamines. The proportion of the aliphatic diamine and diaminodisiloxane used is preferably 20 mol% or less based on the total diamine. Exceeding this ratio lowers the heat resistance of the thermocompression bonding polyimide. In order to block the amine end of the thermocompression-bondable polyimide, dicarboxylic anhydrides, for example, phthalic anhydride and its substitution products, hexahydrophthalic anhydride and its substitution products, succinic anhydride and its substitution products, and the like, Phthalic anhydride may be used.

When the thermocompression-bondable polyimide is obtained, a diamine (as the number of moles of amino group) is used in the organic solvent.
Is the total number of moles of the acid anhydride (as the total moles of the acid anhydride groups of the tetraacid dianhydride and the dicarboxylic anhydride)
Is preferably 0.92 to 1.1, particularly 0.98 to 1.1, and particularly preferably 0.99 to 1.1.
Each component can be reacted in such a ratio that the amount of the dicarboxylic anhydride used is preferably 0.05 or less as a ratio to the molar amount of the acid anhydride group of the tetracarboxylic dianhydride.

For the purpose of limiting the gelling of the polyamic acid, a phosphorus-based stabilizer such as triphenyl phosphite, triphenyl phosphate or the like is used in an amount of 0.01 to 0.01% with respect to the solid content (polymer) concentration during the polymerization of the polyamic acid. It can be added in the range of １1%. Further, for the purpose of accelerating imidization,
A basic organic compound can be added to the solution. For example, imidazole, 2-imidazole, 1,2-dimethylimidazole, 2-phenylimidazole, benzimidazole, isoquinoline, substituted pyridine and the like are added in an amount of 0.05 to 10% by weight based on polyamic acid. %, Especially 0.1
２2% by weight. Since these form a polyimide film at a relatively low temperature, they can be used to avoid insufficient imidization.

For the purpose of stabilizing the adhesive strength, an organic aluminum compound, an inorganic aluminum compound or an organic tin compound may be added to the thermocompression-bondable polyimide raw material dope. For example, aluminum hydroxide, aluminum triacetylacetonate, or the like is 1 ppm or more, particularly 1 to 1000 p
pm.

The organic solvent used in the production of the polyamic acid is N-methyl-2-pyrrolidone, N,
N-dimethylformamide, N, N-dimethylacetamide, N, N-diethylacetamide, dimethylsulfoxide, hexamethylphosphoramide, N-methylcaprolactam, cresols and the like. These organic solvents may be used alone or in combination of two or more.

The above-mentioned thermocompression-bondable multilayer polyimide film is preferably formed by laminating a polyamic acid solution or a polyimide solution that provides a thermocompression-bondable polyimide on both surfaces of the extruded material layer that provides the base layer polyimide. After the product is formed and dried, the temperature is not higher than the glass transition temperature (Tg) of the thermocompression-bondable polyimide and lower than the temperature at which deterioration occurs.
It is preferably heated to a temperature of 250 to 420 ° C. (surface temperature measured by a surface thermometer) (preferably 1 to 6
It can be prepared by drying and imidization (heating for 0 minutes).

The thermocompression-bondable polyimide according to the present invention comprises:
By using the acid component and the diamine component, the glass transition temperature is preferably 190 to 275 ° C., the glass transition temperature is not higher than the glass transition temperature and 300 ° C. or lower, and the elastic modulus is not higher. (Usually, the elastic modulus at 275 ° C. is about 0.001 to 0.5 times the elastic modulus at 50 ° C.) is preferable.

The thermocompression-bondable multilayer polyimide film of the present invention has a base layer polyimide film thickness of 10 to 40.
It is preferable that the thickness of the thermocompression bonding polyimide layer is 2 to 10 μm, particularly 3 to 6 μm.

In the present invention, a polyimide sheet having a thickness of 150 μm or more is formed by laminating a plurality of polyimide films with a thermocompression-bondable multilayer polyimide film.

In the present invention, it is preferable that the surface of the polyimide film is subjected to a discharge treatment such as a low-temperature plasma treatment or a normal-pressure plasma treatment for improving the adhesion. The normal pressure plasma treatment includes Ar, N ₂ , He,
It refers to a method of performing discharge treatment in an atmosphere such as CO ₂ , air, and steam. The processing conditions are: processing equipment, type of processing gas,
Although it differs depending on the flow rate, the frequency of the power supply, and the like, optimal conditions may be appropriately used in each case.

The low-temperature plasma treatment can be performed under reduced pressure, and the method is not particularly limited. For example, the low-temperature plasma treatment is carried out in a discharge treatment apparatus having a plurality of rod-shaped counter electrodes arranged in two rows. After passing through the processing substrate, the processing gas is discharged by applying a high voltage of DC or AC between the electrodes in a state where the processing gas is adjusted to 0.1 to 300 Torr, and a plasma of the processing gas is generated. A method in which the surface of the base material is exposed to water and treated.

The conditions for the low-temperature plasma treatment are as follows:
Although it differs depending on the processing apparatus, the type of processing gas, the pressure, the frequency of the power supply, and the like, optimal conditions may be appropriately used. The processing gas is not particularly limited.
F ₄ , N ₂ , He, CO ₂ , air, steam, O _{2 and the} like can be used alone or in combination. Corona discharge treatment has a smaller effect of improving adhesiveness than low-temperature plasma treatment, so it is necessary to select treatment conditions.

Next, an example of manufacturing a spacer film for TAB which is an example of the present invention will be described in detail. In other words, with the treated surface of the discharge-treated polyimide film inside, sandwiching the thermocompression-bonding multilayer polyimide film therebetween, the glass transition temperature of the thermocompression-bondable polyimide or more, preferably from the glass transition temperature of the thermocompression-bondable polyimide. Thermocompression bonding is performed continuously or intermittently at a temperature as high as about 70 to 150 ° C. for 1 to 60 minutes.

The conditions for the temperature and pressure for the pressure bonding can be appropriately selected depending on the kind and the film thickness of the thermocompression-bondable polyimide. Further, a preferred method of the heat press bonding can be selected according to a manufacturing process such as a heat press and a heating roll.

In the present invention, a polyimide sheet having a thickness of 150 μm or more, preferably a central portion (flat portion) having a 90 ° peel strength of about 450 gf / cm or more at room temperature is obtained. , Having a tensile modulus of 300 kgf / mm ² or more, and the calculated value of tensile modulus × thickness is 40
95 kg at gf / mm or more, especially 40 kgf / mm or more
Heat treatment such as embossing is applied to both ends of the polyimide sheet having a thickness of f / mm or less to obtain a polyimide sheet molded body. The embossing is preferably performed at 150 to 250 ° C.
Can be done with

[0036]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments, but the present invention is not limited to these embodiments. In the following description, heat resistance was evaluated and measured by the following method.

REFERENCE EXAMPLE Synthesis Example 1 of Dope for Heat-Resistant Polyimide Production
2-Pyrrolidone was added, and paraphenylenediamine (PPD) and 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride (s-BPDA) were further added at 1000: 9.
At a molar ratio of 98, the monomer concentration was 18% (% by weight, the same applies hereinafter). After completion of the addition, the reaction was continued for 3 hours while maintaining the temperature at 50 ° C. The obtained polyamic acid solution is a brown viscous liquid, and the solution viscosity at 25 ° C. is about 15
It was 00 poise. This solution was used as a dope.

Synthesis of Dope for Production of Thermocompression Bondable Polyimide
1 In a reaction vessel equipped with a stirrer and a nitrogen inlet tube, add N-methyl-
2-Pyrrolidone was added, and 1,3-bis (4-aminophenoxy) benzene (TPE-R) and 3,3 ′,
4,4'-biphenyltetracarboxylic dianhydride (s-
BPDA) and 2,3,3 ', 4'-biphenyltetracarboxylic dianhydride (a-BPDA) at 1000: 80.
Triphenyl phosphate was added in an amount of 0.1% based on the weight of the monomer so that the monomer concentration became 18% at a molar ratio of 0: 200. After completion of addition, keep 25 ° C for 1
The reaction was continued for hours. Solution viscosity at 25 ° C. is about 700
Poise. This solution was used as a dope.

Production of thermocompression-bondable multilayer polyimide film The above-mentioned base layer polyimide production dope and thermocompression-bondable polyimide production dope were provided with a three-layer extrusion molding die (multi-manifold die). Using a membrane device, the mixture was cast from a three-layer extrusion die onto a metal support and dried continuously with hot air at 140 ° C. to form a solidified film. After the solidified film is peeled from the support, the film is heated at 200 ° C.
Then, the temperature was gradually raised to 320 ° C. to remove the solvent and imidize, and a long thermocompression-bondable multilayer polyimide film was taken up on a take-up roll. The obtained thermocompression-bondable multilayer polyimide film has a thickness of each layer of 4 μm / 17 μm / 4 μm.
m, and the coefficient of linear expansion (50 to 200 ° C.) is MD: 1.
9 ppm / ° C, TD: 16 ppm / ° C, average: 17 pp
m / ° C., the tensile elastic modulus was 714 kg / mm ² , the glass transition temperature of the heat-resistant polyimide was not confirmed at a temperature of 400 ° C. or lower, and the polyimide of the thermocompression bonding layer had a glass transition temperature of 241 ° C.

Example 1 Polyimide film obtained from 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride and 4,4'-diaminodiphenyl ether: Upilex 75R (thickness 75 μm) Was subjected to a plasma discharge treatment under the following conditions. Plasma discharge conditions Atmosphere containing 90% oxygen, flow rate 3 L / min,
1. 250 Torr, 6000 W, 10 minutes Atmosphere containing 100% oxygen, flow rate 3L / mi
n, 250 Torr, 6000 W, 10 minutes

Each of the obtained surface-treated pieces has a width of 250 mm.
No. 75x and a thermocompression bonding polyimide film having a width of 210 mm were laminated under the following conditions to obtain a polyimide sheet. Adhesion conditions: 40 kg / cm2, 360 ° C, 1.5 cm /
The obtained polyimide sheet has a 90 ° peel strength of 700.
gf / cm, a thickness of 173 μm, and a tensile modulus of 43
At 0 Kgf / mm ² , the calculated value of elastic modulus × thickness is 59 kg.
f / mm. This polyimide sheet was embossed at 200 ° C. to obtain a polyimide sheet processed product. This polyimide sheet processed product was rigid and free from twisting, and could be suitably used as a spacer film for TAB.

Comparative Example 1 Polyimide film obtained from 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride and p-phenylenediamine: UPILEX 75S (thickness: 75 μm) having a width of 35 mm was used. Otherwise in the same manner as in Example 1, a polyimide sheet was obtained. The resulting polyimide sheet is 9
0 ° peel strength is 495 gf / cm and thickness is 173 μm
The tensile modulus was 786 kgf / mm ² and the calculated value of elastic modulus × thickness was 136 kgf / mm. This polyimide sheet was embossed at 200 ° C., but no sufficient unevenness was obtained, and it could not be used as a TAB spacer film.

[0043]

According to the present invention, it is possible to stably provide a polyimide sheet processed product which is excellent in heat resistance and has high rigidity and is suitable as a thick spacer film for TAB.

[Brief description of the drawings]

FIG. 1 is a schematic plan view and a schematic cross-sectional view of a spacer film for TAB to which the present invention is applied.

FIG. 2 is a schematic cross-sectional view (multilayer film structure) of an end embossed portion of a TAB spacer film to which a processed polyimide sheet obtained in Example 1 of the present invention is applied.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08J 7/00 CFG C08J 7/00 CFG // C08L 79:08 C08L 79:08 Z (72) Inventor Abu Toshihiko Ube City, Ube City, Ube City, Kobe, 1978, 10 Ube Industries, Ltd. Ube Chemical Factory F-term (reference) JL12B JL12C 4J043 PA02 QB15 QB26 RA35 SA06 SB01 TA22 TB01 UA131 UA132 UB121 UB402 XA16 XA17 XA19 YA06 ZA32 ZB11

Claims (7)

[Claims] 1. A polyimide film obtained by using 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride or a derivative thereof and 4,4′-diaminodiphenyl ether as essential components. A polyimide sheet molded article obtained by laminating a thermocompression-bondable multilayer polyimide film having a thermocompression-bondable polyimide layer on both sides of a heat-resistant polyimide layer and processing both ends of a polyimide sheet having a thickness of 150 μm or more. 2. A polyimide sheet having a thickness of 300 kgf / mm ²
The molded polyimide sheet according to claim 1, which has the above tensile modulus. 3. Tensile modulus of polyimide sheet ×
The calculated value of the thickness is 40 kgf / mm or more, preferably 70 kgf / mm or more.
The molded polyimide sheet according to claim 1, which has a Kgf / mm or more. 4. The polyimide sheet molded article according to claim 1, wherein the processing is embossing. 5. The polyimide sheet molded article according to claim 1, which is used for a spacer for TAB. 6. A polyimide film obtained by using 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride or a derivative thereof and 4,4′-diaminodiphenyl ether as essential components, comprising: A polyimide sheet molded body obtained by laminating a thermocompression-bonding multilayer polyimide film having a thermocompression-bonding polyimide layer on both sides of a heat-resistant polyimide layer and heating both ends of a polyimide sheet having a thickness of 150 μm or more. Production method. 7. The polyimide film according to claim 6, wherein the polyimide film has been subjected to a surface treatment such as a corona discharge treatment or a plasma discharge treatment.
Method for manufacturing molded articles.