JP2002329968A - Method of manufacturing primary laminate for use in manufacture of multilayer printed wiring board - Google Patents
Method of manufacturing primary laminate for use in manufacture of multilayer printed wiring boardInfo
- Publication number
- JP2002329968A JP2002329968A JP2001135449A JP2001135449A JP2002329968A JP 2002329968 A JP2002329968 A JP 2002329968A JP 2001135449 A JP2001135449 A JP 2001135449A JP 2001135449 A JP2001135449 A JP 2001135449A JP 2002329968 A JP2002329968 A JP 2002329968A
- Authority
- JP
- Japan
- Prior art keywords
- eyelet
- insertion hole
- eyelets
- heating
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、熱プレスなどによ
って多層プリント配線板を製造する際に使用される一次
積層体の製造方法に関し、さらに詳しくは、マスラミネ
ーション法の改良に係る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a primary laminate used for manufacturing a multilayer printed wiring board by hot pressing or the like, and more particularly, to an improvement of a mass lamination method.
【0002】[0002]
【従来の技術】片面又は両面に電気回路を有する内層コ
ア材の複数枚と、プリプレグの複数枚をを交互に積層さ
せて多層プリント配線板の製造方法としては、40層程
度の多層プリント配線板を一挙に製造できるピンラミネ
ーション法(ピンラミ法)と、4〜8層程度の積層させ
て一旦一次積層体を作成し、この一次積層体を2枚の銅
箔間に挟んで加熱プレスするマスラメネーション法(マ
スラミ法)が知られている。ピンラミ法は、内層コア
材、プリプレグに予め位置合わせ用の穴を開け、冶具板
に設けられている基準ピンに、銅箔、プリプレグ、内層
コア材、プリプレグ、内層コア材、プリプレグ、内層コ
ア材、プリプレグ、銅箔と積層してから加熱プレスする
方法であって、この方法によれば、一次積層体を経るこ
となく、40層程度の多層プリント配線板を一挙に製造
できる利点がある。2. Description of the Related Art A method of manufacturing a multilayer printed wiring board by alternately laminating a plurality of inner core materials having an electric circuit on one or both sides and a plurality of prepregs is known as a multilayer printed wiring board having about 40 layers. Lamination method (pin lamination method), which can be manufactured all at once, and a lamination of about 4 to 8 layers to temporarily create a primary laminate, and then heat press the sandwich between the two copper foils. The nation method (masurami method) is known. In the pin lamination method, holes for positioning are made in the inner core material and prepreg in advance, and copper foil, prepreg, inner core material, prepreg, inner core material, prepreg, and inner core material are formed in reference pins provided on the jig plate. , Prepreg, and copper foil, and then hot pressing. This method has an advantage that a multilayer printed wiring board of about 40 layers can be manufactured at once without passing through a primary laminate.
【0003】しかしながら、ピンラミ法では冶具板に垂
直に立てられた複数本のピンに、複数枚の内層コア材と
プリプレグを挿入させるため、その作業に時間を要する
欠点がある。これに加えて、ピンラミ法では、加熱プレ
ス時にプリプレグが融けてピンに絡まるため、製造され
た多層プリント配線板を冶具板から取り外す際のピン抜
きに専用工具を必要とし、プリプレグの溶解硬化した残
滓が冶具板のピン穴に詰まった場合には、その除去にも
専用工具を必要とする。また、ピンラミ法では製造せん
とする多層プリント配線板の寸法に合わせて冶具板を製
作するので、冶具板の種類が多くなり、その保守管理が
面倒な不都合がある。[0003] However, in the pin-laminating method, a plurality of inner core materials and prepregs are inserted into a plurality of pins set upright on a jig plate. In addition, the prepreg melts and becomes entangled with the pins during the hot pressing in the pin laminating method, so a special tool is required to remove the pins when the manufactured multilayer printed wiring board is removed from the jig plate, and the prepreg melt-hardened residue When a pin is clogged in the pin hole of the jig plate, a special tool is required to remove it. In addition, since the jig plate is manufactured in accordance with the dimensions of the multilayer printed wiring board to be manufactured in the pin lamination method, the types of the jig plate are increased, and there is a disadvantage that the maintenance management is troublesome.
【0004】一方、マスラミ法は、複数枚のプリプレグ
と内層コア材を交互に積層させ、プリプレグと内層コア
材との界面をスポット接合して一次積層体をまず作製す
る。次いで、この一次積層体を典型的には2枚の銅箔で
挟み、全体を熱プレスして各積層部材間を面接着させる
ことによって多層プリント配線板を製造する方法であ
る。一次積層体を製造する際しては、その最外層の両面
又は片面に、銅箔を予め配設しておく場合もあるが、い
ずれにしても、従来のマスラミ法は、各積層部材をそれ
ぞれの界面で部分的に接合させる手段の違いによって次
の二つに大別される。その一つは、プリプレグと内層コ
ア材とを熱溶着によってスポット接合する熱溶着法であ
り、他の一つはハトメを使用して各積層部材を一括して
スポット接合するハトメ法である。ここで、スポット接
合とは、各積層部材間の界面が局部的に、換言するば、
部分的に接合され、面接着していないことを意味する。
熱溶着法による一次積層体は、積層部材同士の接着力が
必ずしも充分でなく、内層コア材やプリプレグの枚数が
増加すると、一次積層体の厚さ方向中央部で接着力が一
段と低下するため、積層部材間で剥離を起こし易い。こ
れに対して、ハトメ法は各積層部材を一次積層体の厚さ
方向に貫通するハトメで固定するものであるから、部材
間で剥離を起こす心配はないものの、ハトメをかしめる
際のハトメ胴部の変形により、ハトメ穴の内壁が圧迫さ
れることに起因して部材間にずれが発生し易く、この傾
向は内層コア材やプリプレグの枚数が増加すると増大す
る。こうした理由から、従来のマスラミ法で製造できる
一次積層体は、12層程度が限度であるのが通例であ
る。[0004] On the other hand, in the mass lamination method, a plurality of prepregs and an inner layer core material are alternately laminated, and an interface between the prepreg and the inner layer core material is spot-joined to produce a primary laminate first. Next, a method of manufacturing a multilayer printed wiring board by sandwiching the primary laminated body typically between two copper foils and hot-pressing the whole to surface-bond each laminated member. When manufacturing the primary laminate, copper foil may be provided in advance on both surfaces or one surface of the outermost layer, but in any case, the conventional mass lamination method requires each laminated member to be Are roughly classified into the following two types according to the difference in the means for partially joining at the interface. One of them is a heat welding method in which a prepreg and an inner core material are spot-welded by heat welding, and the other is a eyelet method in which each laminated member is spot-joined collectively using eyelets. Here, the spot joining means that the interface between the respective laminated members is locally, in other words,
Partially joined and not surface bonded.
The primary laminated body by the thermal welding method, the adhesive strength between the laminated members is not always sufficient, and when the number of inner layer core materials and prepregs increases, the adhesive strength at the center in the thickness direction of the primary laminated body is further reduced, Peeling easily occurs between the laminated members. On the other hand, since the eyelet method fixes each laminated member with an eyelet that penetrates in the thickness direction of the primary laminate, there is no fear of peeling between the members, but the eyelet cylinder when caulking the eyelet is used. Due to the deformation of the portion, the inner wall of the eyelet hole is likely to be compressed, causing a shift between the members, and this tendency increases as the number of inner core materials and prepregs increases. For these reasons, the number of primary laminates that can be manufactured by the conventional mass lamination method is generally limited to about 12 layers.
【0005】[0005]
【発明が解決しようとする課題】本発明は、従来のマス
ラミ法を改良し、一次積層体の層間をスポット接合する
手段として、熱溶着とハトメ固定を併用し、上記した不
都合を解消すると共に、従来法では製造することができ
なかった、40層程度の一次積層体を製造する方法を提
供する。SUMMARY OF THE INVENTION The present invention is an improvement of the conventional mass laminating method. As a means for spot joining between the layers of the primary laminate, heat welding and eyelet fixing are used together to solve the above-mentioned disadvantages. Provided is a method for manufacturing a primary laminate of about 40 layers, which cannot be manufactured by a conventional method.
【0006】[0006]
【課題を解決するための手段】本発明に係る一次積層体
の製造方法の一つは、複数枚のプリプレグと内層コア材
を交互に積層させ、各積層部材間の界面をスポット接合
させて一次積層体を製造する方法において、各積層部材
間の界面を熱溶着によってスポット接合し、さらに、各
積層部材を貫通し、内径がハトメ胴部の外径に等しい寸
法にある挿入穴に、ハトメを差し込んでその先端部をか
しめることを特徴とする。本発明に係る一次積層体製造
法の他の一つは、複数枚のプリプレグと内層コア材を交
互に積層させ、各積層部材間の界面をスポット接合させ
て一次積層体を製造する方法において、各積層部材間の
界面を熱溶着によってスポット接合し、さらに、各積層
部材を貫通し、内径がハトメ胴部の外径より大きく、ハ
トメのフランジ直径より小さいハトメ挿入穴に、ハトメ
を差し込んでその先端部をかしめることを特徴とする。
上記した二つのいずれの方法でも、ハトメによるスポッ
ト接合に際しては、プリプレグがCステージに至る温度
にハトメを予め加熱して挿入穴に差し込むか、あるいは
挿入穴にハトメを差し込んだ後、プリプレグがCステー
ジに至る温度にこれを加熱してハトメ先端部をかしめる
ことができる。このようなハトメ加熱の手法を採用すれ
ば、ハトメ接合部は結果的に熱溶着されることになるの
で、単純な熱溶着によりスポット接合を省略することが
できる。One method of manufacturing a primary laminate according to the present invention comprises alternately laminating a plurality of prepregs and an inner layer core material, and spot-joining the interface between the laminated members to form a primary laminate. In the method of manufacturing a laminated body, the interface between each laminated member is spot-joined by heat welding, and further, an eyelet is inserted into each of the laminated members and inserted into an insertion hole having an inner diameter equal to the outer diameter of the eyelet body. It is characterized by being inserted and crimping its tip. Another one of the primary laminate production methods according to the present invention is a method for producing a primary laminate by alternately laminating a plurality of prepregs and an inner layer core material and spot-joining an interface between respective laminated members, The interfaces between the respective laminated members are spot-welded by heat welding, and furthermore, each of the laminated members is penetrated, the inner diameter is larger than the outer diameter of the eyelet body, and the eyelet is inserted into the eyelet insertion hole smaller than the flange diameter of the eyelet. It is characterized by caulking the tip.
In any of the above two methods, in the case of spot bonding by eyelets, the prepreg is preheated to a temperature at which the prepreg reaches the C stage and inserted into the insertion hole, or after the eyelet is inserted into the insertion hole, the prepreg is moved to the C stage. This can be heated to a temperature up to and caulking the eyelet tip. If such a method of eyelet heating is adopted, the eyelet bonding portion will be thermally welded as a result, so that spot welding can be omitted by simple thermal welding.
【0007】[0007]
【発明の実施の形態】本発明の実施形態を添付図面に沿
って説明する。図1は、プリプレグ1と、両面に回路パ
ターンが形成された内層コア材2を交互に積層させ、本
発明の方法によって製造された一次積層体を示す斜視図
であって、符号3は各積層部材の界面をスポット接合し
ている熱溶着接合部を示し、符号4は各積層部材を一括
して機械的にスポット接合しているハトメ接合部を示
す。便宜上、図1ではプリプレグを3枚、内層コア材を
2枚使用し、最外層にプリプレグを配した6層構造の一
次積層体を示したが、本発明によれば、プリプレグ及び
内層コア材の使用枚数を増加させて、40層程度の一次
積層体を一挙に製造することができる。また、図示を省
略したが、一次積層体の最外層の片面又は両面に銅箔を
配し、その銅箔をプリプレグ1及び内層コア材と共にス
ポット接合させることができることは、先に説明したと
おりである。また、図1の一次積層体は、最外層にそれ
ぞれプリプレグが配されているが、本発明方法によれ
ば、最外層にそれぞれ内層コア層が位置する一次積層体
を製造することもできる。図1に示す一次積層体では、
対向する2辺周縁部それぞれに、2つの熱溶着接合部と
ハトメ接合部を設けているが、板状を呈する一次積層体
のXY方向の寸法(二次元的な広がりの大小を言い、Z
方向の寸法は一次積層体の厚さに相当する。)に応じ
て、一次積層体の周縁部任意個所に任意の個数で、熱溶
着接合部3とハトメ接合部4を設けることができる。Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing a primary laminate manufactured by a method of the present invention in which a prepreg 1 and an inner layer core material 2 having a circuit pattern formed on both sides are alternately laminated, and reference numeral 3 denotes each laminate. Reference numeral 4 denotes a heat-welded joint that spot-joins the interfaces of the members, and reference numeral 4 denotes an eyelet joint that mechanically spot-joins the respective laminated members. For the sake of convenience, FIG. 1 shows a primary laminate having a six-layer structure in which three prepregs and two inner core materials are used and the prepreg is disposed on the outermost layer. By increasing the number of sheets used, a primary laminate of about 40 layers can be manufactured at once. Although not shown, a copper foil is arranged on one or both surfaces of the outermost layer of the primary laminate, and the copper foil can be spot-joined together with the prepreg 1 and the inner layer core material, as described above. is there. Further, in the primary laminate of FIG. 1, prepregs are respectively arranged on the outermost layers, but according to the method of the present invention, it is also possible to produce a primary laminate in which the inner core layers are respectively located on the outermost layers. In the primary laminate shown in FIG.
Two heat-welded joints and eyelet joints are provided on each of two opposing peripheral edges, but the dimensions of the plate-shaped primary laminate in the XY directions (the magnitude of the two-dimensional spread, Z
The dimension in the direction corresponds to the thickness of the primary laminate. According to (1), any number of heat-welded joints 3 and eyelet joints 4 can be provided at arbitrary positions on the periphery of the primary laminate.
【0008】個々の積層部材を積層させるに当り、複数
枚の内層コア材相互の位置合わせは、常法通り、基準ピ
ンを用いて行うことができるほか、予め内層コア材に付
けた基準マークを光学的に認識して各層の位置を合わせ
ることができる。積層させる各部材には、所定の位置に
ハトメ挿入穴が設けられる。ハトメ挿入穴は、各部材を
積層させるに先立って、各積層部材に予め穿設しておく
ことができるが、積層後に各部材を貫通するように穿設
することも可能である。ハトメ挿入穴の内径は、ここに
差し込まれるハトメの胴部外径と同一寸法であるか、あ
るいはハトメ胴部の外径より大きく、ハトメのフランジ
部の直径より小さい寸法のいずれかが選ばれるが、これ
については後述する。In laminating the individual laminated members, a plurality of inner core materials can be aligned with each other by using a reference pin in a usual manner, and a reference mark previously attached to the inner core material can be used. The position of each layer can be adjusted by optical recognition. Each member to be laminated is provided with an eyelet insertion hole at a predetermined position. The eyelet insertion hole can be drilled in advance in each laminated member before laminating the members, but can also be drilled so as to penetrate each member after lamination. The inner diameter of the eyelet insertion hole is either the same size as the outer diameter of the eyelet body to be inserted here, or one of dimensions larger than the outer diameter of the eyelet body and smaller than the diameter of the eyelet flange. This will be described later.
【0009】積層された各部材間相互を熱溶着によって
スポット接合させるには、各積層部材を局部的に加熱す
る必要がある。加熱手段としては、当業界での常套手段
であるハンダごて等による直接加熱や誘電加熱を任意に
採用することができる。8層以上の多層一次積層体を製
造する場合には、誘電加熱を採用することが好ましい。
各積層部材は、この加熱によって局部的にBステージか
らCステージに移行してスポット接合される。本発明で
は、各積層部材相互を熱溶着によってスポット接合させ
ることに加えて、積層部材全てを厚さ方向に貫通するハ
トメによってスポット接合させる。このハトメ接合は、
積層された各部材を貫通するハトメ挿入穴に、ハトメの
胴部を差し込み、先端をかしめることで行われる。前述
したとおり、ハトメ挿入穴の内径は、挿入されるハトメ
の胴部外径と同一寸法とすることでき、また、ハトメ胴
部の外径より大きく、しかも、ハトメのフランジ部の直
径より小さい寸法とすることもできる。挿入穴の内径を
ハトメ胴部の外径と同一寸法とする場合には、ハトメに
よるスポット接合に先立って、熱溶着によるスポット接
合を先行させることが好ましい。熱溶着によるスポット
接合を先行させておけば、ハトメをかしめる際にハトメ
胴部がたとえ変形しても、積層部材間における層間ずれ
を未然に防止できるからである。In order to perform spot joining between the laminated members by heat welding, it is necessary to locally heat the laminated members. As the heating means, direct heating with a soldering iron or the like, which is a common means in the art, or dielectric heating can be arbitrarily adopted. When producing a multilayer primary laminate of eight or more layers, it is preferable to employ dielectric heating.
Each of the laminated members locally shifts from the B stage to the C stage by this heating and is spot-joined. According to the present invention, in addition to the spot joining of the respective laminated members by thermal welding, all the laminated members are spot joined by eyelets penetrating in the thickness direction. This eyelet junction is
This is performed by inserting the body of the eyelet into an eyelet insertion hole that penetrates the stacked members and caulking the tip. As described above, the inner diameter of the eyelet insertion hole can be the same size as the outer diameter of the eyelet body to be inserted, and larger than the outer diameter of the eyelet body and smaller than the diameter of the eyelet flange. It can also be. When the inner diameter of the insertion hole is the same as the outer diameter of the eyelet body, it is preferable that spot welding by heat welding be performed prior to spot welding by eyelets. This is because, if spot bonding by thermal welding is performed in advance, even if the eyelet body is deformed when caulking the eyelets, interlayer displacement between the laminated members can be prevented.
【0010】挿入穴の内径をハトメ胴部の外径より大き
く、しかも、ハトメのフランジ部の直径より小さい寸法
とした場合には、熱溶着によるスポット接合とハトメに
よるスポット接合のいずれを先行させても差し支えな
く、また、両者を同時に行なっても差し支えない。図2
は、ハトメ胴部5の外径dより大きく、ハトメのフラン
ジ部6の直径Dより小さい寸法にある挿入穴に、ハトメ
を差し込んだ状態を示す断面図である。ハトメ胴部の外
周とその挿入穴の内壁との間のクリアランスは、ハトメ
胴部の外径及びフランジ部の幅の大小に応じて選ぶこと
が好ましいが、一般的には100〜400ミクロン程度
の範囲で選ばれる。クリアランスの存在は、ハトメ先端
部をかしめる際にハトメ胴部が万一変形しても、その変
形による挿入穴内壁への圧迫を防止ないしは軽減させ
る。ハトメには、真鍮(黄銅)製、アルミニウム製など
の金属製ハトメが使用でき、また、金属粉を混在させた
合成樹脂製のハトメが使用できる。In the case where the inner diameter of the insertion hole is larger than the outer diameter of the eyelet body and smaller than the diameter of the eyelet flange, either the spot welding by heat welding or the spot welding by eyelet is performed first. Or both may be performed simultaneously. FIG.
FIG. 4 is a cross-sectional view showing a state in which the eyelets are inserted into an insertion hole having a dimension larger than the outer diameter d of the eyelet body 5 and smaller than the diameter D of the eyelet flange 6. The clearance between the outer periphery of the eyelet body and the inner wall of the insertion hole is preferably selected according to the size of the outer diameter of the eyelet body and the width of the flange, but is generally about 100 to 400 microns. Selected by range. The presence of the clearance prevents or reduces pressure on the inner wall of the insertion hole due to the deformation even if the eyelet body deforms when the eyelet tip is swaged. For the eyelet, a metal eyelet made of brass (brass), aluminum or the like can be used, and a synthetic resin eyelet mixed with metal powder can be used.
【0011】本発明のハトメ接合では、上記したクリア
ランスの有無に拘わりなく、ハトメに熱を付与してその
温度をプリプレグ及び/又は内層コア材がCステージに
至る温度に加熱することができる。ハトメへの熱の付与
は、ハトメを挿入孔に差し込む前であっても、差し込ん
だ後であっても差し支えない。ハトメの加熱手段として
は、ハトメが電気的良導体である場合には、通電加熱、
直接加熱、高周波誘導加熱などが、絶縁体の場合には、
直接加熱、高周波誘電加熱などが任意に採用可能であ
る。ハトメに熱を付与してハトメ接合を行うハトメ溶着
接合法を利用すると、当然のことながら、ハトメに付与
された熱によって挿入穴の内壁近傍は液状化させてCス
テージに移行させることができるので、そのハトメ接合
部は熱溶着されることになる。ハトメ先端部のかしめ操
作を行う時期は、挿入穴近傍がCステージに移行する前
又は移行した後のいずれであっても差し支えないが、C
ステージに移行する以前にかしめ操作を行えば、ハトメ
胴部は液状化樹脂に取り囲まれた状態にあるので、万一
ハトメ胴部が変形してもその変形は液状化樹脂で緩衝さ
せ、積層部材にずれが起こることがない。図1に例示し
た一次積層体は、その周縁部に熱溶着接合部4とハトメ
接合部5が併設されているが、上記したハトメ溶着接合
法を採用すれば、ハトメを全く使用しない熱溶着接合部
3の一部又は全部を、ハトメ溶着接合法による接合部に
置き換えることができ、同様にして、加熱なしのハトメ
接合部4の一部又は全部を、ハトメ溶着接合法による接
合部に置き換えることができる。In the eyelet bonding of the present invention, regardless of the presence or absence of the above-described clearance, heat can be applied to the eyelets to raise the temperature to a temperature at which the prepreg and / or the inner core material reaches the C stage. The heat may be applied to the eyelets either before or after inserting the eyelets into the insertion hole. As the means for heating the eyelets, when the eyelets are a good electrical conductor, energizing heating,
When direct heating, high-frequency induction heating, etc. are insulators,
Direct heating, high-frequency dielectric heating and the like can be arbitrarily adopted. The use of the eyelet welding method, which applies heat to the eyelets to perform eyelet bonding, naturally allows the vicinity of the inner wall of the insertion hole to be liquefied by the heat applied to the eyelets and transferred to the C stage. The eyelet joint is thermally welded. The timing of performing the caulking operation of the eyelet tip may be either before or after the vicinity of the insertion hole shifts to the C stage.
If the caulking operation is performed before moving to the stage, the eyelet body is in a state surrounded by liquefied resin, so if the eyelet body is deformed, the deformation is buffered with liquefied resin, and the laminated member No deviation occurs. The primary laminate illustrated in FIG. 1 has a heat-welded joint 4 and an eyelet joint 5 at its peripheral edge. However, if the eyelet-weld joint method described above is adopted, the heat-welded joint using no eyelet is used. Part or all of the part 3 can be replaced with a joint formed by the eyelet welding method, and similarly, part or all of the eyelet bonded part 4 without heating can be replaced with a joint formed by the eyelet welding method. Can be.
【0012】[0012]
【発明の効果】本発明の方法は、各積層部材を熱溶着接
合とハトメ接合とによって接合する方法であるため、従
来のマスラミ法では実質的に製造できない40層程度の
多層一次積層体を、積層部材間の剥離やずれを懸念する
ことなく一挙に製造することができる。Since the method of the present invention is a method of joining each laminated member by heat welding and eyelet joining, a multilayer primary laminate of about 40 layers, which cannot be substantially manufactured by the conventional mass lamination method, is used. It can be manufactured at once without fear of peeling or displacement between the laminated members.
【図1】本発明の方法の一実施例によって製造された一
次積層体の斜視図。FIG. 1 is a perspective view of a primary laminate manufactured according to an embodiment of the method of the present invention.
【図2】本発明の方法で採用されるハトメ接合を説明す
るためのハトメ挿入穴附近の部分拡大断面図。FIG. 2 is a partially enlarged sectional view near an eyelet insertion hole for explaining eyelet bonding employed in the method of the present invention.
1 プリプレグ 2 内層コア材 3 熱溶着接合部 4 ハトメ接合部 5 ハトメ胴部 6 ハトメフランジ部 7 ハトメ先端部 DESCRIPTION OF SYMBOLS 1 Pre-preg 2 Inner-layer core material 3 Heat welding joint 4 Eyelet joint part 5 Eyelet body part 6 Eyelet flange part 7 Eyelet tip part
フロントページの続き Fターム(参考) 4F100 AT00B AT00D BA08 BA32 DH01A DH01C DH01E EC031 EC032 EJ081 EJ262 EJ331 EJ421 EJ422 EJ951 GB43 JK06 JL01 JL02 5E346 AA12 AA26 CC08 CC32 DD02 DD12 EE04 EE06 EE09 EE16 EE18 GG15 GG28 HH31 Continued on front page F-term (reference) 4F100 AT00B AT00D BA08 BA32 DH01A DH01C DH01E EC031 EC032 EJ081 EJ262 EJ331 EJ421 EJ422 EJ951 GB43 JK06 JL01 JL02 5E346 AA12 AA26 CC08 CC32 DD02 DD12 EE04 EE16 EE06 EE09
Claims (9)
に積層させ、各積層部材間の界面を部分的に接合させて
一次積層体を製造する方法において、各積層部材間の界
面を熱溶着によって部分的に接合し、さらに各積層部材
に穿設された貫通孔であって、内径がハトメ胴部の外径
と等しい寸法にある挿入穴に、ハトメを差し込んでかし
めることを特徴とする一次積層体の製造方法。1. A method of manufacturing a primary laminate by laminating a plurality of prepregs and an inner layer core material alternately and partially joining an interface between the laminated members, wherein the interface between the laminated members is thermally welded. Is partially joined, and furthermore, it is characterized in that the eyelets are inserted and caulked into an insertion hole having an inner diameter equal to the outer diameter of the eyelet body, which is a through hole formed in each laminated member. A method for producing a primary laminate.
め加熱されたハトメを挿入穴に差し込むか、あるいは挿
入穴に差し込まれたハトメをプリプレグがCステージに
至る温度に加熱してハトメ先端部をかしめることを特徴
とする請求項1記載の方法。2. Inserting the eyelets preheated to the temperature at which the prepreg reaches the C stage into the insertion hole, or heating the eyelets inserted into the insertion hole to the temperature at which the prepreg reaches the C stage and fixing the eyelet tip. 2. The method according to claim 1, further comprising the step of:
に積層させ、各積層部材間の界面を部分的に接合させて
一次積層体を製造する方法において、各積層部材間の界
面を熱溶着によって部分的に接合することなく、各積層
部材に穿設された貫通孔であって、内径がハトメ胴部の
外径と等しい寸法にある挿入穴に、プリプレグがCステ
ージに至る温度に予め加熱されたハトメを挿入穴に差し
込むか、あるいは挿入穴に差し込まれたハトメをプリプ
レグがCステージに至る温度に加熱してハトメ先端部を
かしめることを特徴とする一次積層体の製造方法。3. A method of manufacturing a primary laminated body by alternately laminating a plurality of prepregs and an inner core material and partially bonding an interface between the laminated members, wherein the interface between the laminated members is thermally welded. The prepreg is pre-heated to a temperature at which the prepreg reaches the C-stage in an insertion hole having an inner diameter equal to the outer diameter of the eyelet body, which is a through hole formed in each laminated member without being partially joined by A method for manufacturing a primary laminate, comprising inserting the inserted eyelets into an insertion hole, or heating the eyelets inserted into the insertion hole to a temperature at which a prepreg reaches a C stage, and caulking the eyelet tip.
熱、誘電加熱又は誘導加熱の何れかを利用する請求項2
又は請求項3記載の方法。4. The method according to claim 2, wherein the heating means for the eyelets uses any one of direct heating, electric heating, dielectric heating and induction heating.
Or the method of claim 3.
に積層させ、各積層部材間の界面を部分的に接合させて
一次積層体を製造する方法において、各積層部材間の界
面を熱溶着によって部分的に接合し、さらに、各積層部
材に穿設された貫通孔であって、内径がハトメ胴部の外
径より大きく、ハトメフランジ部の直径より小さい挿入
穴に、ハトメを差し込んでハトメ先端部をかしめること
を特徴とする一次積層体の製造方法。5. A method of manufacturing a primary laminate by alternately laminating a plurality of prepregs and an inner layer core material and partially bonding an interface between the laminated members, wherein the interface between the laminated members is thermally welded. The eyelet is inserted into an insertion hole having an inner diameter larger than the outer diameter of the eyelet body portion and smaller than the diameter of the eyelet flange portion. A method for producing a primary laminate, comprising crimping a tip portion.
め加熱されたハトメを挿入穴に差し込むか、あるいは挿
入穴に差し込まれたハトメをプリプレグがCステージに
至る温度に加熱してハトメ先端部をかしめることを特徴
とする請求項5記載の方法。6. Inserting the eyelets preheated to the temperature at which the prepreg reaches the C stage into the insertion hole, or heating the eyelets inserted into the insertion hole to the temperature at which the prepreg reaches the C stage, and fixing the eyelet tip. 6. The method according to claim 5, wherein the tightening is performed.
に積層させ、各積層部材間の界面を部分的に接合させて
一次積層体を製造する方法において、各積層部材間の界
面を熱溶着によって部分的に接合することなく、各積層
部材に穿設された貫通孔であって、内径がハトメ胴部の
外径より大きく、ハトメフランジ部の直径より小さい挿
入穴に、プリプレグがCステージに至る温度に予め加熱
されたハトメを挿入穴に差し込むか、あるいは挿入穴に
差し込まれたハトメをプリプレグがCステージに至る温
度に加熱してハトメ先端部をかしめることを特徴とする
一次積層体の製造方法。7. A method of manufacturing a primary laminate by alternately laminating a plurality of prepregs and an inner core material and partially bonding an interface between the laminated members, wherein the interface between the laminated members is thermally welded. The prepreg is inserted into the through hole formed in each laminated member without being partially joined, the inner diameter of which is larger than the outer diameter of the eyelet body, and the diameter of the eyelet flange, which is smaller than the diameter of the eyelet flange. Inserting the eyelets preheated to the maximum temperature into the insertion hole, or heating the eyelets inserted into the insertion hole to a temperature at which the prepreg reaches the C stage and caulking the eyelet tip portion, Production method.
熱、誘電加熱又は誘導加熱の何れかを利用する請求項6
又は請求項7記載の方法。8. The heating means for the eyelets uses one of direct heating, electric heating, dielectric heating and induction heating.
Or the method of claim 7.
内層コア材が交互に積層され、各積層部材のハトメ接合
部が熱溶着されている一次積層体。9. A primary laminate in which a plurality of prepregs and an inner core material are alternately laminated between two copper foils, and the eyelet joints of each laminated member are thermally welded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001135449A JP4766772B2 (en) | 2001-05-02 | 2001-05-02 | Method for producing primary laminate used for production of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001135449A JP4766772B2 (en) | 2001-05-02 | 2001-05-02 | Method for producing primary laminate used for production of multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002329968A true JP2002329968A (en) | 2002-11-15 |
| JP4766772B2 JP4766772B2 (en) | 2011-09-07 |
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ID=18982914
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001135449A Expired - Lifetime JP4766772B2 (en) | 2001-05-02 | 2001-05-02 | Method for producing primary laminate used for production of multilayer printed wiring board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130186674A1 (en) * | 2011-12-15 | 2013-07-25 | Peking University Founder Group Co., Ltd. | Multi-layer printed circuit board (pcb) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56131996A (en) * | 1980-03-18 | 1981-10-15 | Matsushita Electric Works Ltd | Method of producing multilayer printed circuit board |
| JPH10224032A (en) * | 1997-02-04 | 1998-08-21 | Shiizu:Kk | Lay up method for printed wiring board |
-
2001
- 2001-05-02 JP JP2001135449A patent/JP4766772B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56131996A (en) * | 1980-03-18 | 1981-10-15 | Matsushita Electric Works Ltd | Method of producing multilayer printed circuit board |
| JPH10224032A (en) * | 1997-02-04 | 1998-08-21 | Shiizu:Kk | Lay up method for printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130186674A1 (en) * | 2011-12-15 | 2013-07-25 | Peking University Founder Group Co., Ltd. | Multi-layer printed circuit board (pcb) |
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| Publication number | Publication date |
|---|---|
| JP4766772B2 (en) | 2011-09-07 |
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