JP2002326384A - Optical printer head - Google Patents

Abstract

(57) [Problem] To provide a highly reliable optical printer head capable of obtaining a predetermined image corresponding to image data and having excellent productivity. A light emitting element array chip having, on an upper surface thereof, a plurality of light emitting elements and a plurality of connection pads electrically connected to the thin film wiring on a substrate having a plurality of thin film wirings, and An optical printer head comprising a driver IC 7 on which an electronic circuit 10 for controlling light emission of the light emitting element 4 and a large number of connection pads 8 electrically connected to the thin film wiring 2 are mounted. The upper surface of the light emitting element array chip 3 and the upper surface of the driver IC 7 are positioned at substantially the same height, one end of the thin film wiring 2 extends up to the connection pad 5 of the light emitting element array chip 3, and the other end connects to the driver IC 7. The connection pads 5 and 8 are electrically connected to each other via the thin film wiring 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical printer head used as an optical writing means for an electrophotographic printer or the like.

[0002]

2. Description of the Related Art Conventionally, an optical printer head has been used as an optical writing means for an electrophotographic printer or the like.

[0005] Such a conventional optical printer head is, for example, as shown in FIG.
A light emitting element array chip 13 having a plurality of light emitting elements 14 and connection pads 15 on an upper surface, an electronic circuit 19 for controlling light emission of the light emitting elements 14 and a connection pad 1 on an upper surface
A driver IC 17 having a mounting wire 8 is mounted, and the connection pads 15, 18 and the circuit wiring 12 are electrically connected to each other by a bonding wire 16 made of a metal such as gold (Au). The light emitting elements 14 of the light emitting element array chip 13 are selectively and individually emitted according to the driving of the driver IC 17 based on image data from the outside, and the emitted light is transmitted through an optical system such as a rod lens array (not shown). By irradiating and forming an image on an external photoconductor drum via the photoconductor drum, a predetermined latent image is formed on the photoconductor drum, thereby functioning as an optical printer head.

The latent image formed on the photoreceptor drum then undergoes a development process to become a toner image, and this toner image is transferred and fixed on the recording paper to form a predetermined print on the recording paper. .

[0005]

However, the above-mentioned conventional optical printer head is, for example, an A3 size, 600
When configured with the product specifications of dpi (dot per inch),
There are approximately 15,000 connection points between the connection pads 15 and 18 and the circuit wiring 12, and both are individually connected by a large number of bonding wires 16 of about 15,000. Therefore, if these bonding wires 16 are bonded by a conventionally well-known wire bonding method, the connecting operation takes an extremely long time, and cannot be used for improving the productivity of the optical printer head. At the time of use, the bonding wire 16 may fall down due to external vibrations or shocks, and short-circuit the adjacent bonding wires, which lowers the reliability of the optical printer head.

The bonding wires 16 in the above-described optical printer head are connected to the circuit wiring 12, the light emitting element array chip 13, and the like by a conventionally known wire bonding method. On the 13th side, second bonding is performed on the circuit wiring 12 side. In this case, since a ball-shaped nail head 16a is formed at one end of the bonding wire 16 bonded to the connection pad 15, when the optical printer head is used, the light emitting element 14
When a part of the light emitted is reflected by the nail head 16a of the bonding wire 16 and such reflected light is applied to an external photosensitive member, an unnecessary latent image caused by the reflected light irradiation is applied to the photosensitive member. Is formed, and it is impossible to obtain an accurate image corresponding to the image data.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object to provide a highly reliable optical printer head capable of obtaining a predetermined image corresponding to image data and having excellent productivity. To provide.

[0008]

An optical printer head according to the present invention comprises, on a substrate having a plurality of thin film wirings, a large number of light emitting elements and a plurality of connection pads electrically connected to the thin film wirings on an upper surface. An optical printer head having mounted thereon a light emitting element array chip, and a driver IC on which an electronic circuit for controlling light emission of the light emitting element and a number of connection pads electrically connected to the thin film wiring are integrated. Wherein the upper surface of the light emitting element array chip and the upper surface of the driver IC are positioned at substantially the same height, one end of the thin film wiring extends to a connection pad of the light emitting element array chip, and the other end of the driver IC. The connection pad of the light emitting element array chip and the connection pad of the driver IC corresponding to the pad are electrically extended through the thin film wiring. It is characterized in that it has connections.

The optical printer head according to the present invention may further comprise a corner formed between the side surface of the light emitting element array chip and the upper surface of the substrate, and a corner formed between the side surface of the driver IC and the upper surface of the substrate. A resin material, and the thin-film wiring extends from over the substrate to over the connection pads of the light emitting element array chip and the driver IC via the surface of the resin material. .

Further, in the optical printer head according to the present invention, the top of the resin material is located near the outer periphery of the light emitting element array chip and the driver IC, and the thickness thereof is away from the light emitting element array chip and the driver IC. It is characterized by being gradually thinned toward.

Further, the optical printer head according to the present invention is characterized in that a corner of the upper surface of the light emitting element array chip is covered with the resin material.

According to the optical printer head of the present invention, a light emitting element array having a plurality of light emitting elements on its upper surface and a plurality of connection pads electrically connected to the thin film wirings on a substrate having a plurality of thin film wirings. A chip and a driver IC in which an electronic circuit for controlling light emission of the light emitting element and a number of connection pads electrically connected to the thin film wiring are mounted on the upper surface, and one end of the thin film wiring emits light. The other end extends to the connection pad of the element array chip and the other end to the connection pad of the driver IC. The connection pad of the light emitting element array chip and the connection pad of the driver IC corresponding to the pad extend through the thin film wiring. When a large number of thin film wirings are patterned on the upper surface of a substrate or the like, these thin film wirings are connected to a light emitting element array. Can be simultaneously and collectively connected to a large number of connection pads provided on the upper surface of the chip or driver IC, and the time required for connection work is significantly greater than when these are connected by wire bonding etc. And the productivity of the optical printer head can be improved.

Further, according to the optical printer head of the present invention, since the upper surface of the light emitting element array chip on which a large number of connection pads are provided and the upper surface of the driver IC are set at substantially the same height, a large number of thin films are provided. When the wiring is patterned by a conventionally known photolithography technique, the distance from the exposure source to the connection pad of the light emitting element array chip is substantially equal to the distance from the exposure source to the connection pad of the driver IC. By setting the exposure conditions to be optimal at the height position of the upper surface of the driver IC, it is possible to perform simultaneous exposure under the optimal conditions for both in the vicinity of two types of connection pads that require particularly high exposure accuracy And accurately pattern a large number of thin-film wiring lines to maintain high productivity of optical printer heads. It is possible to become.

According to the optical printer head of the present invention,
In the corner formed between the side surface of the light emitting element array chip and the upper surface of the substrate, and in the corner formed between the side surface of the driver IC and the upper surface of the substrate, near the outer periphery of the light emitting element array chip and the driver IC By disposing a resin material having a top portion and gradually decreasing the thickness of the resin material in a direction away from the light emitting element array chip and the driver IC, the upper surface of the light emitting element array chip and the driver IC and the substrate Since the upper surface is cross-linked with a resin material, when forming the above-mentioned many thin film wirings in a pattern, these thin film wirings are formed on the substrate through the surface of the resin material and the light emitting element array chip or the driver IC is formed. Can be satisfactorily formed on the connection pad, thereby effectively preventing disconnection or the like of the thin film wiring. Further, in this case, since the upper surface of the light emitting element array chip and the upper surface of the driver IC are set at substantially the same height, the precursor of the resin that has been liquefied is mixed with the light emitting element array chip and the driver IC.
When forming a resin material by applying and polymerizing it on both sides under the same conditions, by adjusting the viscosity and the like of the liquid resin, all the resin material can be adjusted at once according to the thickness of the light emitting element array chip and the driver IC. This enables the productivity of the optical printer head to be maintained at a high level.

Further, according to the optical printer head of the present invention,
Many of the thin film wirings described above are directly attached to the upper surface of a substrate, a light emitting element array chip, a driver IC, a resin material, or the like. Even if the voltage is applied, there is no problem that adjacent thin film wirings are short-circuited, and it is also possible to improve the reliability of the optical printer head.

Further, according to the optical printer head of the present invention, since the plurality of thin film wirings extending up to the connection pads are in the form of a film, a bonding wire nail head is provided on the light emitting element array chip. There is no large object that reflects light as described above.Therefore, when an optical printer head is used, it is possible to effectively prevent unnecessary light such as reflected light from irradiating the photoconductor and forming an unnecessary latent image. Thus, an accurate image corresponding to the image data can be obtained.

Further, according to the optical printer head of the present invention, by covering the upper surface corners of the light emitting element array chip and the driver IC with the above-described resin material, the light emitting element array chip and the driver IC can be simply used as a base. When crystalline silicon or the like is used, the single-crystal silicon or the like exposed on the outer periphery of the light emitting element array chip or the driver IC and the thin film wiring are electrically short-circuited, or the thin film wiring is formed on the outer periphery of the light emitting element array chip. The problem of disconnection due to the sharp corners is effectively prevented.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a sectional view showing the configuration of an optical printer head according to an embodiment of the present invention. FIG. 2 is an enlarged plan view showing the vicinity of a light emitting element array chip of the optical printer head of FIG. Is a substrate, 2 is a thin film wiring, 3 is a light emitting element array chip, 4 is a light emitting element, 5 is a light emitting element array chip connection pad, 6, 9 is a resin material, 7 is a driver IC, and 8 is a driver IC connection pad. is there.

The substrate 1 is formed of glass, alumina ceramics, glass cloth epoxy resin or the like so as to form a rectangular shape, and on its upper surface, a number of thin film wirings 2, light emitting element array chips 3, driver ICs 7 and the like are attached. And functions as a supporting base material for supporting them.

When the substrate 1 is made of, for example, glass, it is manufactured by first forming a glass plate having a predetermined thickness by a conventionally known floating method or the like, cutting this into a rectangular shape, and processing the outer shape.

A large number of thin film wirings 2 provided on the upper surface of the substrate 1 function as power supply wirings for supplying an output signal from the driver IC 7 to the light emitting elements 4 of the light emitting element array chip 3. , For example, gold (A
u), a metal material such as aluminum (Al), chromium (Cr), or the like, is formed in a predetermined pattern on the upper surface of the substrate 1, the light emitting element array chip 3, the driver IC 7, the resin materials 6, 9, and the like.

More specifically, one end of the thin film wiring 2 extends up to the connection pad 5 of the light emitting element array chip 3 via the surface of the resin material 6, and the other end thereof corresponds to the corresponding connection pad 8 of the driver IC 7. The connection pads 8 of the driver IC 7 and the corresponding connection pads 5 of the light emitting element array chip 3 are electrically connected by the thin film wiring 2.

The thin film wiring 2 employs a conventionally known thin film forming technique, specifically, a conventionally known vacuum evaporation method or sputtering method. It is formed by, for example, applying a thickness of 0.5 μm to 3.0 μm on the upper surface of the element array chip 3, the driver IC 7, and the like, and finely processing this into a predetermined pattern by a conventionally known photolithography technique and etching technique. .

The light emitting element array chip 3 mounted on the substrate 1 has, for example, 600 dpi on its upper surface.
And a large number of connection pads 5 electrically connected to the respective light emitting elements 4 via an electrode layer or the like (not shown).

The light emitting element 4 of the light emitting element array chip 3
Is formed of a GaAlAs-based or GaAsP-based compound semiconductor. One end of the thin film wiring 2 extends to the connection pad 5 and is electrically connected to the connection pad 5.

The light emitting element 4 has a structure in which a p-type semiconductor such as GaAlAs and an n-type semiconductor are stacked and a pn junction is provided between the two semiconductors. When power (output signal) from the driver IC 7 is applied to the light-emitting element 4 through the interface, electrons are injected into the p-type semiconductor of the light-emitting element 4 and holes are injected into the n-type semiconductor. The light-emitting element 4 emits light at a predetermined luminance by re-combining in the vicinity of the portion and converting the energy generated during the coupling into light.

The light emitting element array chip 3 is manufactured by a conventionally known semiconductor manufacturing technique, specifically, MOCVD (metal
Organic Chemical Vapor Deposition)
A light-emitting element array chip obtained by epitaxially growing the above-described compound semiconductor on the upper surface of a base made of single-crystal silicon or the like and patterning the connection pads 5 and the like with a metal by a conventionally known thin-film forming technique or the like. Reference numeral 3 is attached and mounted at a predetermined position on the upper surface of the substrate.

On the other hand, the driver IC 7 is for individually controlling the light emission of the light emitting element 4 based on image data from the outside and the like, and has an electronic circuit 10 such as a shift register or a switching transistor on its upper surface. And a large number of connection pads 8 are integrated at a high density.

The driver IC 7 has a base made of the same single-crystal silicon or the like as the light emitting element array chip 3, and the other end of the thin film wiring 2 extends on the connection pad 8 on the upper surface. And is electrically connected to the connection pad 8.

Further, the corner formed between the side surface of the driver IC 7 and the upper surface of the substrate and the corner formed between the side surface of the light emitting element array chip 3 and the upper surface of the substrate described above. Are provided with resin materials 6 and 9 respectively, and the tops of the resin materials 6 and 9 are located near the outer peripheral portions of the light emitting element array chip 3 and the driver IC 7 and the thickness thereof is 3. The thickness is gradually reduced in a direction away from the driver IC 7.

The resin materials 6 and 9 function as an adhesive for fixing the light emitting element array chip 3 and the driver IC 7 at predetermined positions on the upper surface of the substrate, a step between the upper surface of the substrate and the upper surface of the light emitting element array chip, and It has a function as a bridging member that fills a step between the upper surface of the substrate and the upper surface of the driver IC and facilitates the thin film wiring 2 to be led out from the upper surface of the substrate to the upper surface of the light emitting element array chip and the upper surface of the driver IC. It is formed of a resin material such as a resin or an epoxy resin.

For example, the thickness of the resin materials 6 and 9 is 1.0 to 2.0 times the thickness of the light emitting element array chip 3 at the top provided near the outer periphery of the light emitting element array chip 3 and the driver IC 7. The thickness is set to be slightly thicker than the light emitting element array chip 3 so as to be thick, and the surface thereof is arranged to be inclined by, for example, 30 degrees to 60 degrees with respect to the upper surface of the substrate.

Here, the above-mentioned many thin-film wirings 2
The light-emitting element array chip 3 and the connection pads 5 and 8 of the driver IC 7 are extended from the upper surface of the substrate 1 through the surfaces of the resin materials 6 and 9 described above. The corresponding connection pads (5, 8) are electrically connected to each other via the thin film wiring 2 by making connection with the connection pads 5, 8.

Therefore, when a large number of thin film wirings 2 are patterned on the upper surface of the substrate 1 or the like, the thin film wirings 2 are formed on a plurality of connection pads 5 provided on the upper surface of the light emitting element array chip 3 or the driver IC 7. 8 are connected simultaneously and collectively, so that the time required for the connection work is greatly reduced as compared with the case where these are connected by wire bonding or the like, and the productivity of the optical printer head is improved. Can be improved.

In this case, the large number of thin film wirings 2
Are the substrate 1, the resin materials 6, 9, the light emitting element array chip 3,
Since it is directly attached to the upper surface of the driver IC 7, even if external vibration or shock is applied when the optical printer head is used, there is no problem that adjacent thin film wirings are short-circuited. Also, it can be used to improve the reliability of the optical printer head.

Further, in this case, since the plurality of thin film wirings 2 extending up to the connection pads 5 are entirely in the form of a film, a bonding wire nail head is provided on the light emitting element array chip 3. There is no large object that reflects light as described above.Therefore, when an optical printer head is used, unnecessary light such as reflected light is irradiated on an external photosensitive member to form an unnecessary latent image. And an accurate image corresponding to the image data can be obtained.

The resin materials 6 and 9 described above are formed on both sides of the light emitting element array chip 3 and the driver IC 7 so that the upper surface thereof and the upper surface of the substrate form a gentle inclined surface so as to bridge the upper surface of the substrate. There is no surface or the like that stands perpendicularly to the upper surface of the substrate between the upper surface of the light emitting element array chip 3 and the driver IC 7 and the upper surface of the substrate. Therefore, when patterning a large number of thin film wirings 2 by a conventionally known thin film forming technique or the like, these thin film wirings 2 are formed on the substrate 1 through the surfaces of the resin materials 6 and 9 and the light emitting element array chip 3 and the driver IC 7. Connection pads 5, 8
By extending the thin film wiring 2, the thin film wiring 2 can be well-patterned by a conventionally known thin film forming technique, thereby effectively preventing problems such as disconnection of the thin film wiring 2. .

In this embodiment, the upper surface of the light emitting element array chip 3 and the upper surface of the driver IC 7 are set at substantially the same height (within ± 0.07 mm).

Therefore, when patterning a large number of thin film wirings 2 by a conventionally known photolithography technique,
Exposure conditions are set so that the distance from the exposure source to the connection pad 5 and the distance from the exposure source to the connection pad 8 are substantially equal, and are optimal at the height position of the upper surface of the light emitting element array chip 3 and the driver IC 7. This makes it possible to collectively perform exposure in the vicinity of the two types of connection pads 5 and 8 that require particularly high exposure accuracy under conditions that are optimal for both of them. Therefore, it is possible to maintain high productivity of the optical printer head.

When the above-described exposure process is performed using a reduction projection type optical system, the focal position is made to coincide with the upper surface of the light emitting element array chip 3 and the like. By exposing the mask as close as possible to the upper surface of the light emitting element array chip 3 and the driver IC 7, the exposure accuracy in the vicinity of the connection pads 5 and 8 can be made extremely high.

The resin materials 6 and 9 are formed by mixing a liquid-state resin precursor with the light emitting element array chip 3 and the driver IC.
7 is formed by applying and polymerizing on both sides under the same conditions by a conventionally known dispenser method or the like. At this time, since the light emitting element array chip 3 and the driver IC 7 are set to have substantially the same thickness as described above, by adjusting the viscosity and the like of the liquid resin, all the resin materials 6, 9 can be removed from the light emitting element array. It can be formed at a time according to the thickness of the chip 3 and the driver IC 7, thereby maintaining high productivity of the optical printer head.

In this case, the light emitting element array chip 3
And the driver IC 7 can be easily removed from the substrate 1 only by removing the resin materials 6 and 9 on both sides.
Even if a defect occurs in the light emitting element array chip 3 or the driver IC 7 or a defect is found, the light emitting element array chip 3 or the driver IC 7 can be easily removed and replaced with a non-defective one. There is also an advantage that labor required for work is greatly reduced.

Further, since the resin materials 6 and 9 are provided so as to partially cover the upper surface corners of the light emitting element array chip 3 and the driver IC 7, the light emitting element array chip 3 and the driver IC 7 are made of silicon. When cutting out from the wafer and processing the outer shape, the insulating layer (not shown) formed on the upper surface of the silicon wafer is peeled off near the upper surface corners of the light emitting element array chip 3 and the driver IC 7, and the surface of single crystal silicon or the like is removed. Even if it is partially exposed, the exposed portion is satisfactorily covered with the resin materials 6 and 9, so that the thin film wiring 2 and single crystal silicon or the like are electrically short-circuited or the thin film wiring 2 emits light. Problems such as disconnection due to sharp corners on the periphery of the element array chip can also be effectively prevented, which also improves the productivity of the optical printer head.

Thus, the optical printer head described above causes the light emitting elements 4 of the light emitting element array chip 3 to selectively and individually emit light based on external image data, and emits the emitted light to a rod lens array (not shown) or the like. It functions as an optical printer head by irradiating and forming an image on an external photoconductor via an optical system and forming a predetermined latent image on the photoconductor.

Then, the latent image formed on the photoreceptor becomes a toner image through a developing process, and the toner image is transferred and fixed on the recording paper, whereby a predetermined image is recorded on the recording paper. Becomes

It should be noted that the present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

For example, in the embodiment of FIG. 1 described above, the side surfaces of the light emitting element array chip 3 and the driver IC 7 are arranged substantially perpendicular to the upper surface of the substrate.
Instead, the light emitting element array chip 3 and the driver IC 7 may be formed in a trapezoidal shape as shown in FIG. Also in this case, resin materials 6 and 9 are applied from the side surfaces of the light emitting element array chip 3 and the driver IC 7 to the upper surface of the substrate, and one end of the thin film wiring 2 is connected to the light emitting element array chip 3 through the surfaces of the resin materials 6 and 9. The other end extends to above the connection pad 5 and to above the connection pad 8 of the driver IC 7.

In the above-described embodiment, the resin material 6, 9 is formed by applying a liquid resin precursor by a conventionally well-known dispenser method. A liquid resin precursor is applied by a conventionally well-known spin coating method, and after heating and polymerization,
The resin materials 6 and 9 may be formed by removing unnecessary portions by etching.

Further, in the above-described embodiment, the light emitting element array chip 3 and the driver IC 7 are mounted on the upper surface of the flat substrate 1. However, as shown in FIG. Is provided with a predetermined concave portion 1a,
A part or all of the light emitting element array chip 3 and the driver IC 7 may be embedded in such a concave portion 1a. In this case, since it is not necessary to secure a large space for disposing the resin materials 6 and 9 on the upper surface of the substrate, the substrate 1 and the optical printer head can be reduced in size, and the thin film wiring 2 can be used for the substrate 1 and the optical printer head. Since the entire pattern will be formed on a substantially flat surface with few steps,
There is also an advantage that patterning of the thin film wiring 2 by a conventionally known thin film forming technique or the like becomes easy.

Further, in the above embodiment, an LED array head using a light emitting diode as a light emitting element has been described as an example. However, other optical printer heads, for example, an EL head, a plasma dot head, a liquid crystal shutter head, a fluorescent light The present invention is applicable to a head, PLZT, and the like.

[0051]

According to the optical printer head of the present invention, on a substrate having a large number of thin film wirings, a light emitting device having a large number of light emitting elements on a top surface and a large number of connection pads electrically connected to the thin film wirings. An element array chip, and a driver IC on which an electronic circuit for controlling light emission of the light emitting element and a large number of connection pads electrically connected to the thin film wiring are mounted on an upper surface, and one end of the thin film wiring Extending to the connection pad of the light emitting element array chip and the other end to the connection pad of the driver IC, and connecting the connection pad of the light emitting element array chip and the connection pad of the driver IC corresponding to the pad to the thin film wiring. When a large number of thin film wirings are patterned on the upper surface of a substrate or the like, these thin film wirings are connected to the light emitting element array. It can be connected simultaneously and collectively to a large number of connection pads provided on the upper surface of the chip or driver IC, and the time required for connection work is significantly longer than when these are connected by wire bonding etc. By shortening, the productivity of the optical printer head can be improved.

Further, according to the optical printer head of the present invention, since the upper surface of the light emitting element array chip on which a large number of connection pads are provided and the upper surface of the driver IC are set at substantially the same height, a large number of thin films are provided. When the wiring is patterned by a conventionally known photolithography technique, the distance from the exposure source to the connection pad of the light emitting element array chip is substantially equal to the distance from the exposure source to the connection pad of the driver IC. By setting the exposure conditions to be optimal at the height position of the upper surface of the driver IC, it is possible to perform simultaneous exposure under the optimal conditions for both in the vicinity of two types of connection pads that require particularly high exposure accuracy And accurately pattern a large number of thin-film wiring lines to maintain high productivity of optical printer heads. It is possible to become.

According to the optical printer head of the present invention,
In the corner formed between the side surface of the light emitting element array chip and the upper surface of the substrate, and in the corner formed between the side surface of the driver IC and the upper surface of the substrate, near the outer periphery of the light emitting element array chip and the driver IC Arranging a resin material having a top,
The thickness of the resin material is determined by the light emitting element array chip, driver I
By gradually decreasing the thickness in the direction away from C, the upper surface of the light emitting element array chip or the driver IC and the upper surface of the substrate are cross-linked with a resin material. When forming, these thin film wirings can be formed satisfactorily from the substrate through the surface of the resin material to the connection pads of the light emitting element array chip and the driver IC, thereby effectively preventing disconnection of the thin film wirings. It is possible to do. Also in this case,
Since the upper surface of the light emitting element array chip and the upper surface of the driver IC are set at substantially the same height, the precursor of the resin which has been liquefied is mixed with the light emitting element array chip and the driver IC.
When the resin material is formed by applying and polymerizing under the same conditions on both sides of C, by adjusting the viscosity and the like of the liquid resin, all the resin materials are once adjusted to the thickness of the light emitting element array chip and the driver IC. , So that the productivity of the optical printer head can be kept high.

Further, according to the optical printer head of the present invention,
Many of the thin film wirings described above are directly attached to the upper surface of a substrate, a light emitting element array chip, a driver IC, a resin material, or the like. Even if the voltage is applied, there is no problem that adjacent thin film wirings are short-circuited, and it is also possible to improve the reliability of the optical printer head.

Further, according to the optical printer head of the present invention, since the plurality of thin film wirings extending up to the connection pads are entirely in the form of a film, the thin film wirings are formed on the light emitting element array chip. There is no large object that reflects light, such as a bonding wire nail head. Therefore, when using an optical printer head, unnecessary light such as reflected light is irradiated on the photoconductor to form an unnecessary latent image. Is effectively prevented, and an accurate image corresponding to the image data can be obtained.

Further, according to the optical printer head of the present invention, by covering the outer periphery of the light emitting element array chip and the driver IC with the above-described resin material, the light emitting element array chip and the driver IC can be simply used as a base. When crystalline silicon or the like is used, the single-crystal silicon or the like exposed on the outer periphery of the light emitting element array chip or the driver IC and the thin film wiring are electrically short-circuited, or the thin film wiring is formed on the outer periphery of the light emitting element array chip. Problems such as disconnection due to sharp corners are also effectively prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view of an optical printer head according to an embodiment of the present invention.

FIG. 2 is an enlarged plan view showing the vicinity of a light emitting element array chip of the optical printer head of FIG. 1;

FIG. 3 is a sectional view of an optical printer head according to another embodiment of the present invention.

FIG. 4 is a sectional view of an optical printer head according to another embodiment of the present invention.

FIG. 5 is a sectional view of a conventional optical printer head.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... board | substrate, 2 ... thin film wiring, 3 ... light emitting element array chip, 4 ... light emitting element, 5 ... connection pad of light emitting element array chip, 6, 9 ... resin material, 7 ...
Driver IC, 8 ... Connection pad for driver IC

Claims (4)

[Claims] 1. A light emitting element array chip having, on a substrate having a plurality of thin film wirings, a plurality of light emitting elements on an upper surface and a plurality of connection pads electrically connected to the thin film wirings, and the light emitting elements on an upper surface. An optical printer head on which a driver IC in which an electronic circuit for controlling light emission of light and a plurality of connection pads electrically connected to the thin film wiring are mounted is mounted, wherein an upper surface of the light emitting element array chip and The driver IC
Of the thin film wiring is extended to a connection pad of the light emitting element array chip, and the other end is extended to a connection pad of the driver IC, thereby connecting the light emitting element array chip. An optical printer head, wherein a pad and a connection pad of a driver IC corresponding to the pad are electrically connected via the thin film wiring. 2. A corner formed between a side surface of the light emitting element array chip and a top surface of the substrate, and the driver IC.
A resin material is disposed at a corner formed between the side surface of the substrate and the upper surface of the substrate, and the thin film wiring is disposed on the connection pad of the light emitting element array chip and the driver IC from the substrate via the surface of the resin material. The optical printer head according to claim 1, wherein the optical printer head is extended to at least one of the optical printer heads. 3. A top portion of the resin material is located near an outer peripheral portion of the light emitting element array chip and the driver IC, and the thickness thereof is gradually reduced in a direction away from the light emitting element array chip and the driver IC. 3. The optical printer head according to claim 2, wherein: 4. The optical printer head according to claim 2, wherein a corner of the upper surface of the light emitting element array chip is covered with the resin material.