JP2002372651A - Ferrule gripping device and method of manufacturing semiconductor laser module - Google Patents

Abstract

(57) [Problem] To provide a ferrule gripping device capable of preventing an extra load from being applied to a fixed part or a ferrule, and capable of performing optical axis adjustment in a state where the ferrule is clamped so as not to move. When adjusting the optical axis of an optical fiber with a ferrule optically coupled to an optical component such as a semiconductor laser device, a ferrule gripping device (15) contacts a side surface of the ferrule (2) with a contact length of about 2 mm in the longitudinal direction of the ferrule (2). The first holding portion 17 for holding the ferrule 2 and the second holding portion 18 for holding the side surface of the ferrule 2 at a contact length of about 0.5 mm in the longitudinal direction of the ferrule 2 are integrally formed. After fixing to the fixed part 8 of the first ferrule 2, the side surface of the ferrule 2 is
Since the optical axis is adjusted by sandwiching the contact length with a short contact length in the longitudinal direction, a sufficient range of lever movement can be secured, and no extra load is applied to the YAG welding portion of the first fixed component 8 and the ferrule 2. Damage and deformation can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ferrule holding device for holding a ferrule when adjusting the optical axis of an optical fiber with a ferrule optically coupled to an optical component such as a semiconductor laser element, and a method of manufacturing a semiconductor laser module. About the method.

[0002]

2. Description of the Related Art Generally, a light emitting element, a light receiving element, a lens,
When optically coupling an optical component such as a prism with an optical fiber with a ferrule, the optical fiber with a ferrule is moved to perform optical axis alignment. For example, in a semiconductor laser module in which laser light emitted from a semiconductor laser element as a light emitting element is condensed by a lens and is incident on an optical fiber with a ferrule, the semiconductor laser module and the optical fiber with a ferrule are welded with a YAG laser. A total of three optical axes, a plane perpendicular to the optical axis (strictly, a plane parallel to the end face of the semiconductor laser module: an XY plane) and an optical axis direction (a direction perpendicular to the XY plane; Z-axis direction) It is necessary to match.

In order to obtain higher optical coupling efficiency,
2. Description of the Related Art There is known a semiconductor laser module of a type in which laser light emitted from a semiconductor laser element is not condensed by a lens, and is directly optically coupled to an optical fiber with a ferrule whose lens tip is processed by a lens.

FIGS. 15A and 15B schematically show a semiconductor laser module using an optical fiber with a ferrule in which a fiber end is lens-processed. FIG. 15A is a side view and FIG. 15B is a plan view. As shown in FIG. 15, the semiconductor laser module M has a semiconductor laser device 1 that emits laser light and a ferrule 2 into which laser light emitted from the front (right side in FIG. 15) end face of the semiconductor laser device 1 is incident. An optical fiber 3, a photodiode 4 on which a laser beam emitted from a rear (left side in FIG. 15) end face of the semiconductor laser element 1 is incident, an LD carrier 5 on which the semiconductor laser element 1 is mounted, and a photodiode 4 mounted. It has a PD carrier 6 and a base 7 on which the LD carrier 5, the PD carrier 6, and the optical fiber 3 with the ferrule 2 are placed.

[0005] On the end face of the optical fiber 3 on the side of the semiconductor laser element 1, there is provided a lens portion 3a processed into, for example, a wedge shape.

The side surface of the ferrule 2 is sandwiched between a pair of or integral first fixing parts 8 and a pair or integral second fixing parts 9 in order from the side of the semiconductor laser element 1 so as to be Y.
Fixed by AG laser welding. The first fixing component 8 and the second fixing component 9 are fixed on the base 7 by YAG laser welding.

[0007] Laser light emitted from the front end face of the semiconductor laser element 1 enters through the lens portion 3a of the optical fiber 3 with the ferrule 2, and is sent out.

The laser light for monitoring emitted from the rear end face of the semiconductor laser device 1 is received by the photodiode 4, and the light output of the semiconductor laser device 1 is adjusted according to the amount of received light.

In the conventional method of manufacturing the semiconductor laser module M, in the step of adjusting the optical axis of the optical fiber 3 with the ferrule 2, a ferrule gripping device 10 for gripping the ferrule 2 is used.

The ferrule gripping device 10 includes a ferrule 2
And a pair of holding members 11 for holding the pair of holding members 11, and opening and closing members 12 for opening and closing the pair of holding members 11. Opening / closing member 1
2 opens and closes the pair of holding members 11 by expanding and contracting a rod using, for example, an air cylinder device.

The optical axis adjusting method using the conventional ferrule gripping device 10 is performed in the following order.

(1) The first fixed component 8 is arranged along the ferrule 2, and the optical axis alignment of the ferrule 2 in the XYZ-axis direction while securing a gap between the ferrule 2 and the first fixed component 8. Is performed, the first fixing component 8 is attached to the base 7
It is fixed on the top by YAG laser welding.

(2) After the ferrule 2 is moved in the XYZ-axis direction again and the optical axis of the semiconductor laser device 1 and the optical fiber 3 are aligned, the side surface of the ferrule 2 and the first fixed part 8 are YAG laser welded. Fix with.

(3) The second fixed part 9 is arranged along the ferrule 2 and the optical axis of the ferrule 2 in the X and Y directions is adjusted. Fix by laser welding.

[0015]

In the optical axis adjusting method using the conventional ferrule gripping device 10, the optical axis alignment of the ferrule 2 in the XY directions in the steps (3) and (4) is performed by the first method. Lever movement of the ferrule 2 is performed using a YAG welded portion where the fixed component 8 and the side surface of the ferrule 2 are fixed as a fulcrum. At this time, when the ferrule 2 is moved up, down, left, and right, as shown in FIG.
1 and the end of the holding groove 11b and the oblique ferrule 2
Of the ferrule 2 is restricted. When the ferrule 2 is forcibly moved, the YA for fixing the first fixing component 8 and the ferrule 2 is used.
An extra load is applied to the welding spots b1 and b2 of the G laser, and cracks are generated in the welding spot of the YAG laser, thereby lowering the reliability of the semiconductor laser module.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and can prevent an extra load from being applied to a fixed part or a ferrule, and can prevent a ferrule from being clamped at an appropriate position or an appropriate clamping force. An object of the present invention is to provide a ferrule holding device capable of performing optical axis adjustment and a method for manufacturing a semiconductor laser module.

The present invention also provides a ferrule holding apparatus and a method for manufacturing a semiconductor laser module, which can prevent an extra load from being applied to a fixed part or a ferrule, and can shorten the time required for optical axis alignment. The purpose is to:

[0018]

According to a first aspect of the present invention, there is provided a ferrule holding device for holding an optical fiber with a ferrule optically coupled to an optical component when adjusting the optical axis of the ferrule. The ferrule has a pair of holding members for holding a side surface of the ferrule with a short contact length or a point contact in a longitudinal direction of the ferrule.

The ferrule may further include a pair of holding members for holding the ferrule with a long contact length in the longitudinal direction.

[0020] A pair of holding members for holding the ferrule with a short contact length or a point contact in the longitudinal direction of the ferrule and a pair of holding members for holding with a long contact length in the longitudinal direction of the ferrule may be integrally formed.

[0021] There may be at least two or more places where the side surface of the ferrule is sandwiched by a short contact length or point contact in the longitudinal direction of the ferrule.

It is preferable that the short contact length is not less than 0.001 mm and less than 1 mm.

According to a second aspect of the present invention, there is provided a ferrule holding device comprising a pair of holding members for holding the ferrule for adjusting the optical axis of an optical fiber with a ferrule optically coupled to an optical component. The pair of holding members may each have a holding groove formed along an axis of the ferrule.

[0024] The holding groove may be formed in a shape symmetrical with respect to an axis of the ferrule.

The at least one holding member may have a measuring means for measuring a distance between the pair of holding members.

A first method for manufacturing a semiconductor laser module according to the present invention is directed to a method for manufacturing a semiconductor laser module including a semiconductor laser element and an optical fiber with a ferrule for receiving laser light emitted from the semiconductor laser element. A step of holding the side surface of the ferrule with a short contact length or point contact in the longitudinal direction of the ferrule to adjust the optical axis of the optical fiber with the ferrule.

According to a second method for manufacturing a semiconductor laser module of the present invention, there is provided a method for manufacturing a semiconductor laser module including a semiconductor laser element and an optical fiber with a ferrule for receiving a laser beam emitted from the semiconductor laser element. A first step of clamping the side surface of the ferrule at two or more places with a long contact length, a short contact length, or a point contact in a ferrule longitudinal direction to adjust the optical axis of the optical fiber with a ferrule; And a second step of adjusting the optical axis of the optical fiber with a ferrule by holding the side surface of the ferrule with a short contact length or a point contact in the longitudinal direction of the ferrule.

According to a third method of manufacturing a semiconductor laser module of the present invention, the side face of the ferrule is held by holding grooves formed in a pair of holding members of a ferrule holding device, and the optical axis of the optical fiber with a ferrule is adjusted. Is carried out.

A step of adjusting the optical axis of the optical fiber with a ferrule by holding the side surface of the ferrule in a swingable state with the interval between the pair of holding members being set to a predetermined length. You may.

[0030] The method may further include a step of adjusting the optical axis of the optical fiber with the ferrule by holding the side surface of the ferrule in a non-swingable state with the holding grooves of the pair of holding members of the ferrule holding device.

The above-described ferrule gripping device may be the one described above.

According to a fourth method of manufacturing a semiconductor laser module of the present invention, there are provided a step of fixing a semiconductor laser element to a base, a step of fixing a cooling device in a package, and a step of fixing the base on the cooling device. And a step of introducing an optical fiber with a ferrule into the package through a through hole formed in a side portion of the package, and the method according to any one of claims 9 to 14, Adjusting the optical axis of the optical fiber with the optical axis and fixing the optical fiber with the ferrule and the through hole in the through hole of the package, that is, the step of fixing the package, and attaching the lid to the package. And hermetically sealing the inside of the package.

[0033]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 1 shows a ferrule holding device according to a first embodiment of the present invention, and FIG.
(B) is a plan view. The same parts as those in the related art are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 1, the semiconductor laser module M comprises a semiconductor laser element 1, an optical fiber 3 with a ferrule 2, a photodiode 4, and an LD carrier 5
, A PD carrier 6 and a base 7. Base 7
Is mounted on a cooling device 13 for cooling heat generated from the semiconductor laser device 1.

In the method for manufacturing a semiconductor laser module according to the embodiment of the present invention, in the step of adjusting the optical axis of the optical fiber 3 with the ferrule 2, a ferrule gripping device 15 for gripping the ferrule 2 is used.

The ferrule gripping device 15 has a pair of holding members 16 and an opening / closing member 12 for opening and closing the pair of holding members 16 by driving an air cylinder. The ferrule gripping device 15 moves Z along the rail 18a laid on the top.
It can move axially.

FIGS. 2A and 2B show a pair of holding members 16 used in the ferrule gripping device 15 according to the first embodiment of the present invention, wherein FIG. 2A is a perspective view thereof, and FIG. FIG. 4C is a front view showing a state where the ferrule 2 is sandwiched.

As shown in FIG. 2, the pair of holding members 16 used in the ferrule gripping device 15 according to the first embodiment of the present invention are made of a material such as Fe, Al, stainless steel, or another alloy. A first holding portion 17, which is formed of the main body 16 a and holds the side surface of the ferrule 2 with a long contact length (for example, about 2 mm) in the longitudinal direction of the ferrule 2, and a short contact length ( For example, about 0.5 mm) or a second holding portion 18 that is held by point contact is integrally formed. Here, the short contact length is preferably 0.001 mm or more and less than 1 mm. 0.001 mm or more is 0.001 mm
If it is less than this, it is difficult to manufacture.

The first holding portion 17 and the second holding portion 18
The V-shaped groove is formed on the inner side surface of the main body 16a along the module longitudinal direction Z.
Is a plane groove having a certain width in the longitudinal direction Z, whereas the second holding portion 18 is a knife-edge-shaped groove having almost no width in the longitudinal direction Z.

FIGS. 3A to 3D are explanatory diagrams for explaining a method of adjusting the optical axis of the optical fiber 3 with the ferrule 2 using the ferrule gripping device 15 according to the first embodiment of the present invention. 4 (A) and 4 (B) are plan sectional views showing a state in which the side surface of the ferrule 2 is in contact with the inner side surface of the main body 16a.

First, the L with the semiconductor laser device 1 attached
PD with D carrier 5 and photodiode 4
The carrier 6 is fixed on the base 7 by soldering.

Next, the side surface of the ferrule 2 is clamped by the first clamping portions 17 of the pair of clamping members 16 of the ferrule gripping device 15 (see FIG. 4A). After arranging the first fixed component 8 so as to match the ferrule 2 and securing a gap between the ferrule 2 and the second fixed component 8 as necessary, after the optical axis alignment of the ferrule 2 in the XYZ-axis direction is performed. Then, the first fixing part 8 is fixed on the base 7 by YAG laser welding (welding spots a1 to a8 in FIG. 3A).
reference).

Next, the X of the ferrule 2 is kept in the same state as above.
After re-aligning the optical axes in the YZ axis directions, the ferrule 2
The front side (the side closer to the semiconductor laser element 1) and the first fixing component 8 are fixed by YAG laser welding (FIG. 3B).
(See welding spots b1 and b2)).

Next, the pair of holding members 16 are opened to the extent that the ferrule 2 is not moved by the opening / closing member 12, and the ferrule gripping device 15 is moved rearward (to the right in FIG. 3) along the Z-axis direction. The pair of holding members 16 are closed, and the side surface of the ferrule 2 is held only by the second holding portion 18 (see FIG. 4B).

In this state, the first fixed component 8 is arranged along the ferrule 2 while the second fixed component 9 is arranged along the ferrule 2.
After the ferrule 2 is leveraged with the welding spots b1 and b2 of the ferrule 2 as fulcrums to align the optical axis of the ferrule 2 in the X and Y directions, the second fixed part 9 is placed on the base 7 with a YAG laser. It is fixed by welding (see welding spots a9 to a16 in FIG. 3C).

Lastly, the ferrule 2 is moved in the Y-axis direction or the XY-axis direction while the side surface of the ferrule 2 is held by the second holding portion 18, and the welding spot b 1 of the first fixed component 8 and the ferrule 2 is moved. , B2 as a fulcrum, the ferrule 2 is moved by leverage so that the optical axis of the semiconductor laser device 1 and the optical fiber 3 are aligned again, and the side surface of the ferrule 2 and the second fixed component 9 are YAG laser welded (Weld spots b3 and b4 in FIG. 3D)
reference).

According to the first embodiment of the present invention, after the ferrule 2 is fixed to the first fixing part 8, the side surface of the ferrule 2 is clamped with a short contact length or point contact in the longitudinal direction of the ferrule 2. Since the optical axis adjustment is performed, the range of the lever movement can be sufficiently ensured, and no extra load is applied to the YAG welding portion of the first fixed component 8 and the ferrule 2, and the welding spots b 1 and b 2 or a 1 To a8 can be prevented from being damaged such as cracks or deformation. As a result, the reliability of the product is improved.
In addition, as shown in FIG. 2 (D), the second holding portion 18
It may be formed in a U-shape when viewed from above. Nipping member 1
The width Xb of the distal end portion may be smaller than the width Xa of the main body of No. 6. When the ferrule 2 is clamped by the second clamping portion 18, if the gap Xc between the clamping members 16 is within the range of Xc ≧ 0, X
The width of b may be reduced.

(Second Embodiment) FIG. 5 shows a second embodiment of the present invention.
3A and 3B are plan sectional views showing a state in which a side surface of a ferrule is clamped, and FIGS. 3C and 3D are modified examples of the clamp member. It is a plane sectional view showing.

As shown in FIG. 5, the pair of holding members 19 according to the second embodiment of the present invention are composed of a main body 19a made of a material such as Fe, Al, stainless steel, or another alloy. The holding groove 20 symmetrical with respect to the axis is formed along the longitudinal direction Z. As shown in FIGS. 5A and 5B, the holding groove 20 is formed so as to be convexly curved in the X direction, and has a short contact length at each of the distal end and the proximal end of the ferrule 2. The first to pinch
And second edge portions 20a and 20b.

A pair of holding members 1 according to the second embodiment
9, the first and second edge portions 20 of the holding groove 20
In a state where the side surface of the ferrule 2 is sandwiched between the two positions a and 20b (see FIG. 5A), the side surface in front of the ferrule 2 (the side closer to the semiconductor laser element 1) and the first fixed component 8
Are fixed by YAG laser welding. Then, the opening and closing member 1
2, the pair of holding members 19 are opened to such an extent that the ferrule 2 does not move, the ferrule gripping device 15 is moved rearward along the Z-axis direction, and then the pair of holding members 19 are closed again to form the first edge. The side surface of the ferrule 2 is held by the portion 20a (see FIG. 5B).

The ferrule 2 has a side surface of ferrule 2
There may be three or more locations that are pinched by a short contact length or point contact in the longitudinal direction. For example, as shown in FIGS. 5C and 5D, the holding groove 20 is formed to be curved in two convex shapes in the X direction.
First to third edge portions 20a, 20b, and 20c are provided to sandwich the side surface of the ferrule 2 with a short contact length. According to the modified example of the holding member 19, in a state where the side surface of the ferrule 2 is held by the first to third edge portions 20 a, 20 b, and 20 c of the holding groove 20 (see FIG. 5C), The front side of the ferrule 2 (the side closer to the semiconductor laser device 1) and the first fixed component 8 are
Fix by laser welding. Thereafter, the pair of holding members 19 are opened to the extent that the ferrule 2 is not moved by the opening / closing member 12, and the ferrule holding device 15 is moved rearward along the Z-axis direction, and then the pair of holding members 19 are closed again. First
The side surface of the ferrule 2 is sandwiched between the edge portions 20a (see FIG. 5D).

(Third Embodiment) FIG. 6 shows a third embodiment of the present invention.
Shows a ferrule gripping device 21 according to an embodiment of the present invention,
(A) is a perspective view showing the first holding member 22, (B) is a front view showing the second holding member 23, and (C) shows a state where the ferrule 2 is held by the second holding member 23. FIG. 4D is a plan view showing a state in which the ferrule 2 is held by the second holding member 23.

As shown in FIG. 6, in the ferrule gripping device 21 according to the third embodiment, the side surface of the ferrule 2 has a long contact length (for example, 1.5 m) in the longitudinal direction of the ferrule 2.
m) and a pair of second holding members 23 that hold the side surface of the ferrule 2 with a short contact length (0.8 mm) in the longitudinal direction of the ferrule 2 or a point contact. Have.

The first holding member 22 is made of a main body 22 made of a material such as Fe, Al, stainless steel, or another alloy.
The V-shaped holding groove 22b is formed on the side surface of the main body 22a. The side surface of the ferrule 2 is held between the holding grooves 22b of the pair of first holding members 22.

The second holding member 23 is formed of a rod-like member, and has a V-shaped bent portion 23a formed at a predetermined position. Bent portions 23a of a pair of second holding members 23
The first holding member 22 and the second holding member 23 between which the side surface of the ferrule 2 is held can be independently opened and closed by the opening and closing member 12.

Next, a method of adjusting the optical axis of the optical fiber 3 with the ferrule 2 using the ferrule gripping device 21 according to the third embodiment of the present invention will be described.

First, the L with the semiconductor laser element 1 attached
PD with D carrier 5 and photodiode 4
The carrier 6 is fixed on the base 7 by soldering.

Next, the side surface of the ferrule 2 is clamped by the clamping grooves 22b of the pair of first clamping members 22 of the ferrule gripping device 21. At this time, the second holding member 2
The side surface of the ferrule 2 may be held between the three bent portions 23a. The first fixed component 8 is arranged along the ferrule 2, and if necessary, a gap between the ferrule 2 and the first fixed component 8 is secured.
After performing the optical axis alignment in the YZ axis directions, the first fixed component 8
Is fixed on the base 7 by YAG laser welding (welding spots a1 to a8).

Next, in the same state as above, the X
After re-aligning the optical axes in the YZ axis directions, the ferrule 2
The front side (the side closer to the semiconductor laser element 1) and the first fixing component 8 are fixed by YAG laser welding (welding spots b1, b2).

Next, the first holding member 22 is opened by the opening and closing member 12, and the side surface of the ferrule 2 is held by the bent portion 23 a of the second holding member 23.

In this state, the second fixed component 9 is arranged along the ferrule 2 and then the first fixed component 8
And ferrule 2 YAG laser welding spots b1 and b
After the ferrule 2 is pivoted around the fulcrum 2 to adjust the optical axis of the ferrule 2 in the XY axis directions, the second fixing component 9 is fixed on the base 7 by YAG laser welding (welding spots b9 to b9). b16).

Finally, the ferrule 2 is moved in the Y-axis direction or XY direction.
By moving the first fixed part 8 and the welding spots b1 and b2 of the YAG laser of the ferrule 2 in the axial direction,
Lever movement of the ferrule 2 causes the optical axis of the semiconductor laser device 1 and the optical fiber 3 to be aligned again. Then, the side surface of the ferrule 2 and the second fixed part 9 are fixed to the YAG.
Fix by laser welding (welding spots b3, b4).

According to the third embodiment of the present invention, since the optical axis adjustment is performed using the two first holding members 22 and the second holding member 23, the alignment of the optical axis is more reliably performed. be able to. After the ferrule 2 and the first fixing component 8 are fixed, there is no need to move the ferrule gripping device 21 backward.

(Fourth Embodiment) FIG. 7 shows a pair of holding members 24 used in a ferrule gripping device according to a fourth embodiment of the present invention, (A) is a perspective view thereof, and (B). FIG. 4 is a front view showing a state where a ferrule 2 is held.

As shown in FIGS. 7A and 7B, a pair of holding members 24 used in the ferrule holding device of the fourth embodiment of the present invention are made of Fe, Al, stainless steel, other alloys or the like. A V-shaped holding groove 24b is formed along the longitudinal direction on the inner surface of the main body 24a made of a material.

FIGS. 8A to 8D are views for explaining a method for manufacturing a semiconductor laser module according to the fourth embodiment of the present invention. The fourth embodiment is characterized in that the optical axis of a ferrule-fitted optical fiber is adjusted using a ferrule gripping device 25 provided with a holding member 24 shown in FIG.

First, the L with the semiconductor laser device 1 attached
PD with D carrier 5 and photodiode 4
The carrier 6 is fixed on the base 7 by soldering.

Next, the side surface of the ferrule 2 is clamped by the clamping grooves 24b of the pair of first clamping members 24 of the ferrule gripping device 25. The first fixed component 8 is arranged along the ferrule 2, and if necessary, a gap between the ferrule 2 and the first fixed component 8 is secured, and then the optical axis of the ferrule 2 in the XYZ axis direction is adjusted. After the first
Is fixed on the base 7 by YAG laser welding (see welding spots a1 to a8 in FIG. 8A).

Next, the X of the ferrule 2 is kept in the same state as above.
After re-aligning the optical axes in the YZ axis directions, the ferrule 2
The front side (the side closer to the semiconductor laser element 1) and the first fixing part 8 are fixed by YAG laser welding (FIG. 8B).
(See welding spots b1 and b2).

Next, the pair of holding members 24 are opened to the extent that the ferrule 2 is not moved by the opening / closing member 12, and the ferrule gripping device 25 is moved rearward (to the right in FIG. 8) along the Z-axis direction. The pair of holding members 24 are closed, and the side surface of the ferrule 2 is held by the front edge of the holding groove 24b.

In this state, while the second fixed component 9 is arranged along the ferrule 2, the X
After performing the optical axis alignment in the Y-axis direction, the second fixing component 9 is fixed on the base 7 by YAG laser welding (FIG. 8C).
(See welding spots a9 to a16).

Finally, the ferrule 2 is moved in the Y-axis direction or XY direction.
By moving the first fixed part 8 and the welding spots b1 and b2 of the YAG laser of the ferrule 2 in the axial direction,
Lever movement of the ferrule 2 causes the optical axis of the semiconductor laser device 1 and the optical fiber 3 to be aligned again. Then, the side surface of the ferrule 2 and the second fixed part 9 are fixed to the YAG.
Fix by laser welding (weld spot b in FIG. 8D)
3, b4). According to the fourth embodiment, since the holding member 24 in which the holding groove 24b that can be easily processed is formed is used, the processing cost of the holding member can be reduced.

(Fifth Embodiment) FIG. 9 is a perspective view showing a pair of holding members used in a ferrule gripping device according to a fifth embodiment of the present invention.

A pair of holding members 2 according to the fifth embodiment
Reference numeral 5 denotes a main body 25a made of a material such as Fe, Al, stainless steel, or another alloy, and has a long contact length (for example, about 4 m
m), and a second holding portion 27 for holding the side surface of the ferrule 2 by a short contact length (for example, about 0.5 mm) in the longitudinal direction of the ferrule 2 or a point contact. Is formed. The first holding portion 26 and the second holding portion 27 are V-shaped grooves formed on the inner surface of the main body 25a along the module longitudinal direction Z, and the first holding portion 26 is formed in the longitudinal direction Z. Is a flat groove having a certain width, while the second holding portion 27 has a notch 28 on the front side.
And a knife-edge-shaped groove having almost no width in the longitudinal direction Z. First holding portion 26 and second holding portion 2
7 is different from the holding member 16 according to the first embodiment in that it is formed separately on the upper and lower sides. Therefore, the first
After the side surface of the ferrule 2 is held by the holding portion 26 of the ferrule 2, the side surface in front of the ferrule 2 (the side closer to the semiconductor laser device 1) and the first fixing component 8 are fixed by YAG laser welding, and then opened and closed by the opening / closing member 12. The pair of holding members 25 are opened to the extent that the ferrule 2 does not move, the ferrule gripping device 15 is moved upward along the Y-axis direction, and then the pair of holding members 24 are closed again. The side surface of the ferrule 2 will be clamped.

(Sixth Embodiment) FIG. 10 shows a pair of holding members 30 used in a ferrule gripping device 29 according to a sixth embodiment of the present invention, and FIG.
(B) is a front view thereof, (C) is a front view showing a state in which the pair of holding members 30 are closed and the side surface of the ferrule 2 is held in a non-swingable state, and (D) is a view of the pair of holding members 30. FIG. 6 is a front view showing a state in which a gap between the ferrules is set to a predetermined length and a side surface of the ferrule 2 is held in a swingable state.

As shown in FIG. 10, a pair of holding members 30 used in the ferrule gripping device 15 according to the first embodiment of the present invention include a main body 30a made of a material such as Fe, Al, stainless steel, or another alloy. And a V-shaped holding groove 31 symmetrical with respect to the axis of the ferrule 2 is formed along the longitudinal direction Z. Two holding grooves 31,
Reference numeral 31 is formed in a shape symmetrical with respect to the axis of the ferrule 2.

FIGS. 11A to 11D are explanatory diagrams for explaining a method of adjusting the optical axis of the optical fiber 3 with the ferrule 2 using the ferrule gripping device 29 according to the first embodiment of the present invention. It is.

First, the L with the semiconductor laser device 1 attached
PD with D carrier 5 and photodiode 4
The carrier 6 is fixed on the base 7 by soldering.

Next, the pair of holding members 30 of the ferrule holding device 29 are closed, and the ferrule 2 is held by the holding grooves 31.
(See FIG. 10 (C)). The first fixed component 8 was arranged so as to match the ferrule 2, and if necessary, a gap between the ferrule 2 and the second fixed component 8 was secured, and then the optical axis of the ferrule 2 in the XYZ axis directions was adjusted. Then, the first fixing part 8 is
It is fixed thereon by YAG laser welding (see welding spots a1 to a8 in FIG. 11A).

Then, the X of the ferrule 2 is kept in the same state as above.
After re-aligning the optical axes in the YZ axis directions, the ferrule 2
The front side (the side closer to the semiconductor laser element 1) and the first fixing part 8 are fixed by YAG laser welding (FIG. 11).
(See welding spots b1 and b2) in (B)).

Next, the pair of holding members 30 are opened by a predetermined length (for example, 0.2 mm) so that the ferrule 2 can be swung by the opening / closing member 12, and the side surfaces of the ferrule 2 are held (FIG. 10D). reference).

In this state, the first fixed component 8 is arranged while the second fixed component 9 is arranged along the ferrule 2.
After the ferrule 2 is leveraged with the welding spots b1 and b2 of the ferrule 2 as fulcrums to align the optical axis of the ferrule 2 in the X and Y directions, the second fixed part 9 is placed on the base 7 with a YAG laser. It is fixed by welding (see welding spots a9 to a16 in FIG. 11C).

Finally, the ferrule 2 is moved in the Y-axis direction or XY direction.
The semiconductor laser element 1 and the optical fiber 3 are again aligned by moving the ferrule 2 in the axial direction and levering the ferrule 2 with the welding spots b1 and b2 of the first fixed component 8 and the ferrule 2 as fulcrums. After ferrule 2
And the second fixing component 9 are fixed by YAG laser welding (see welding spots b3 and b4 in FIG. 11D).

According to the sixth embodiment of the present invention, after the ferrule 2 is fixed to the first fixing part 8, the ferrule 2 is held in a state in which the interval between the pair of holding members 30 is set to a predetermined length. And the optical axis of the optical fiber 3 with the ferrule 2 is adjusted by sandwiching the side surface of the first fixed component 8 and the YAG of the ferrule 2.
No extra load is applied to the welded portion, and damage such as cracks or deformation of any of the welding spots b1 and b2 or any of a1 to a8 can be prevented. As a result, the reliability of the product is improved. Further, since the two holding grooves 17, 17 formed in the pair of holding members 30 used in the ferrule gripping device 29 are symmetrical with respect to the axis of the ferrule 2, the holding grooves 17.
The movement of the ferrule 2 in the inside is stabilized, and the time for optical axis alignment can be shortened.

(Seventh Embodiment) FIG. 12 is a front view showing a ferrule gripping device according to a seventh embodiment of the present invention. FIG. 12A is a side view of the ferrule with a pair of holding members closed. FIG. 4B is a front view showing a state in which the ferrule is pinched in a non-swingable state, and FIG. FIG.

As shown in FIG. 12, in the seventh embodiment, one (left side in the example of FIG. 12) holding member 30 is
A measuring device 32 such as a digital micrometer that measures the interval between the pair of holding members 30 is provided. Measuring device 3
2 is movably inserted into a through-hole 30b formed in the holding member 30. Further, the measured value by the measuring device 32 is displayed on a monitor device 33 connected to the measuring device 32.

According to the seventh embodiment, one of the holding members 30 is provided with the measuring device 32 for measuring the distance between the pair of holding members 30. Therefore, even if the diameter of the ferrule 2 varies, By monitoring using the measuring device 32, the holding member 30 can always be opened to a fixed length. The measuring device 32 may be provided on both of the holding members 30, 30.

FIGS. 13A to 13D are front views showing modified examples of the holding member 30. FIG. The holding groove 31 formed in the holding member 30 preferably has a shape that is symmetrical with respect to the axis of the ferrule 2, for example, an elliptical holding groove 31 a (FIG. 13).
(A) or a concave holding groove 31b (see FIG. 13B). The entire shape of the pair of holding members 30 does not need to be substantially the same, for example, as shown in FIG.
As shown in FIG. 13, one of them (the left side in the example of FIG. 13C)
The holding member 30 may be formed wide. Note that FIG.
As shown in (D), the holding grooves 31 and 31 a formed in the holding member 30 may have shapes that are asymmetric with respect to the axis of the ferrule 2.

(Eighth Embodiment) FIG. 14 is an explanatory diagram for explaining a method of manufacturing a semiconductor laser module according to an eighth embodiment of the present invention.

First, the L with the semiconductor laser device 1 attached
PD with D carrier 5 and photodiode 4
The carrier 6 is fixed on the base 7 by soldering.

Next, the cooling device 13 is placed in the package 14.
Is fixed by soldering.

Next, the base 7 is fixed on the cooling device 13 by soldering.

Next, the optical fiber 3 with the ferrule 2 is introduced into the package 14 through the through hole 14b formed in the side portion 14a of the package 14.

Next, the optical axis of the optical fiber 3 with the ferrule 2 is adjusted by the method described in each of the above embodiments and fixed to the base 7 by laser welding.

Next, the optical fiber 3 with the ferrule 2 and the package 1 are inserted through the through hole 14b of the package 14.
4 and is fixed by soldering via a connecting member 34.

Next, a cover 35 is put on the top of the package 14, and its peripheral edge is soldered or laser-welded. The inside of the package 14 is hermetically sealed by the connection member 34 and the lid 35.

Light emitting devices other than the semiconductor laser device,
The present invention can also be applied to a case where an optical component such as a light receiving element or an optical fiber with a ferrule is optically coupled to an optical fiber with a ferrule.

According to the embodiment of the present invention, after the ferrule is fixed to the first fixing part, the optical axis is adjusted by clamping the side surface of the ferrule with a short contact length or point contact in the longitudinal direction of the ferrule. And a sufficient range of lever movement can be ensured, and no extra load is applied to the YAG welded portion of the first fixed component and the ferrule, and the welding spot b
It is possible to prevent damage such as cracks or deformation from occurring in any one of a, b2, and a1 to a8. As a result, the reliability of the product is improved.

After the ferrule is fixed to the first fixed part, the side surface of the ferrule is clamped while keeping the interval between the pair of clamping members at a predetermined length to adjust the optical axis of the optical fiber with the ferrule. In this case, a sufficient range of lever movement can be ensured, and no extra load is applied to the first fixed part and the YAG welded portion of the ferrule, and any one of the welding spots b1 and b2 or a1 to a8 can be used. Damage such as cracks or deformation can be prevented. As a result, the reliability of the product is improved.

When the two holding grooves formed in the pair of holding members used in the ferrule holding device are symmetrical with respect to the axis of the ferrule, the movement of the ferrule in the holding groove is reduced. It is stable and the time for optical axis alignment can be shortened.

The present invention is not limited to the above embodiment, and various modifications can be made within the scope of the technical matters described in the claims.

For example, in the semiconductor laser module M according to the first embodiment shown in FIG. 1, the base 7 is directly mounted without using the cooling device 13, for example.
The semiconductor laser device 1 may be directly mounted on the base 7 without using the D carrier 5. Further, the ferrule 2 may be fixed by, for example, only the fixing component 8. further,
The ferrule 2 may be fixed not by YAG laser welding but by a resin or an adhesive.

[0103]

According to the present invention, after the ferrule is fixed to the first fixing part, the side of the ferrule is clamped with a short contact length or a point contact in the longitudinal direction of the ferrule to adjust the optical axis. A sufficient range of movement can be ensured, and no extra load is applied to the first fixed component and the YAG welded portion of the ferrule, so that damage and deformation can be prevented. As a result, the reliability of the product is improved.

After the ferrule is fixed to the first fixed part, the side surface of the ferrule is clamped with the gap between the pair of clamping members being set to a predetermined length to adjust the optical axis of the optical fiber with the ferrule. In this case, the range of lever movement can be sufficiently ensured, and no extra load is applied to the YAG welded portion of the first fixed component and the ferrule, so that damage and deformation can be prevented. As a result, the reliability of the product is improved.

When the two holding grooves formed in the pair of holding members used in the ferrule holding device are symmetrical with respect to the axis of the ferrule, the movement of the ferrule in the holding groove is reduced. It is stable and the time for optical axis alignment can be shortened.

[Brief description of the drawings]

FIG. 1 shows a ferrule holding device according to a first embodiment of the present invention, wherein (A) is a side view and (B) is a plan view.

FIGS. 2A and 2B show a pair of holding members used in the ferrule holding device according to the first embodiment of the present invention, wherein FIG. 2A is a perspective view thereof and FIG. 2B is a front view showing a state before the ferrule is held; (C) is a front view showing a state in which a ferrule is held, and (D) is a plan view showing a modification of a pair of holding members.

FIGS. 3A to 3D are explanatory diagrams for explaining a method of adjusting the optical axis of an optical fiber with a ferrule using the ferrule gripping device according to the first embodiment of the present invention.

FIGS. 4A and 4B are plan sectional views showing a state in which a side surface of a ferrule and an inner side surface of a main body are in contact with each other.

FIGS. 5A and 5B show a pair of holding members according to a second embodiment of the present invention, wherein FIGS. 5A and 5B are plan sectional views showing a state where a side surface of a ferrule is held; FIGS. D) is a sectional plan view showing a modification of the holding member.

FIG. 6 shows a ferrule gripping device according to a third embodiment of the present invention, wherein (A) is a perspective view showing a first holding member,
(B) is a front view showing the second holding member, (C) is a front view showing a state where the ferrule is held by the second holding member, and (D) is a case where the ferrule is held by the second holding member. FIG.

7A and 7B show a pair of holding members used in a ferrule holding device according to a fourth embodiment of the present invention, wherein FIG. 7A is a perspective view thereof, and FIG. .

FIGS. 8A to 8D are explanatory views illustrating a method for manufacturing a semiconductor laser module according to a fourth embodiment of the present invention.

FIG. 9 is a perspective view showing a pair of holding members used in a ferrule holding device according to a fifth embodiment of the present invention.

10A and 10B show a pair of holding members used in a ferrule holding device according to a sixth embodiment of the present invention, wherein FIG. 10A is a perspective view, FIG. 10B is a front view thereof, and FIG. 10C is a pair of holding members. FIG. 3D is a front view showing a state in which the member is closed and the side surface of the ferrule is pinched so that the side surface of the ferrule is not swingable. FIG. It is a front view showing the state where it is pinched.

FIGS. 11A to 11D are explanatory diagrams for explaining a method of adjusting the optical axis of the optical fiber 3 with the ferrule 2 using the ferrule gripping device 29 according to the first embodiment of the present invention. is there.

FIG. 12 is a front view showing a ferrule gripping device according to a seventh embodiment of the present invention, wherein (A) shows a state in which a pair of holding members are closed and a side surface of the ferrule is held in a non-swingable state. FIG. 7B is a front view showing a state in which a gap between a pair of holding members is set to a predetermined length and a side surface of the ferrule is held in a swingable state.

13A to 13D are front views showing modified examples of the holding member.

FIG. 14 is an explanatory diagram illustrating a method for manufacturing a semiconductor laser module according to an eighth embodiment of the present invention.

15A and 15B show a pair of holding members used in a conventional ferrule gripping device, FIG. 15A is a perspective view thereof, and FIG. 15B is a front view showing a state where the ferrule is held.

FIG. 16 is an explanatory diagram for explaining a problem of the related art.

[Explanation of symbols]

 M: semiconductor laser module 1: semiconductor laser element 2: ferrule 3: optical fiber 4: photodiode 5: LD carrier 6: PD carrier 7: base 8: first fixed component 9: second fixed component 10: ferrule grip Apparatus 11: clamping member 12: opening / closing member 13: cooling device 14: package 15: ferrule gripping device 16: clamping member 17: first clamping portion 18: second clamping portion 19: clamping member 20: clamping groove 21: ferrule Holding device 22: First holding member 23: Second holding member 24: Holding member 25: Ferrule holding device 26: First holding portion 27: Second holding portion 28: Notch 29: Ferrule holding device 30: Nipping member 31: Nipping groove 32: Measuring device 33: Monitoring device 34: Connecting member 35: Lid

Continued on the front page F-term (reference) 2H037 BA02 BA11 DA03 DA04 DA06 DA12 DA18 DA36 DA38 5F073 AB15 AB28 BA02 FA07 FA23 FA25

Claims (15)

[Claims] 1. A ferrule gripping device for gripping said ferrule when adjusting an optical axis of an optical fiber with a ferrule optically coupled to an optical component, wherein a side of said ferrule has a short contact length or point in a longitudinal direction of the ferrule. A ferrule holding device comprising a pair of holding members for holding by contact. 2. The ferrule gripping device according to claim 1, further comprising a pair of holding members for holding the ferrule with a long contact length in the longitudinal direction of the ferrule. 3. A pair of clamping members that clamps with a short contact length or a point contact in the longitudinal direction of the ferrule and a pair of clamping members that clamps with a long contact length in the longitudinal direction of the ferrule are formed integrally. The ferrule holding device according to claim 2, characterized in that: 4. The ferrule according to claim 1, wherein the ferrule has at least two or more locations for holding a side surface of the ferrule with a short contact length or a point contact in the longitudinal direction of the ferrule.
The ferrule holding device according to any one of the above items. 5. The ferrule gripping device according to claim 1, wherein the short contact length is not less than 0.001 mm and less than 1 mm. 6. A ferrule holding device comprising a pair of holding members for holding the ferrule for adjusting the optical axis of an optical fiber with a ferrule optically coupled to an optical component, wherein the pair of holding members are A holding groove formed along each axis of the ferrule. 7. The ferrule gripping device according to claim 6, wherein the holding groove is formed in a shape symmetrical with respect to an axis of the ferrule. 8. The ferrule gripping device according to claim 1, wherein said at least one holding member has a measuring means for measuring an interval between the pair of holding members. 9. A method of manufacturing a semiconductor laser module comprising a semiconductor laser device and an optical fiber with a ferrule for receiving a laser beam emitted from the semiconductor laser device, wherein a side surface of the ferrule is brought into short contact with the ferrule in a longitudinal direction. A method for manufacturing a semiconductor laser module, comprising the step of adjusting the optical axis of the optical fiber with a ferrule while holding the optical fiber with a length or point contact. 10. A method for manufacturing a semiconductor laser module comprising a semiconductor laser device and an optical fiber with a ferrule for receiving a laser beam emitted from the semiconductor laser device, wherein a side surface of the ferrule is in long contact with a longitudinal direction of the ferrule. A first step of adjusting the optical axis of the optical fiber with a ferrule by pinching the optical fiber with the ferrule at two or more locations by a length or a short contact length or a point contact; A second step of adjusting the optical axis of the optical fiber with a ferrule by sandwiching the optical fiber with a point contact, and a method of manufacturing a semiconductor laser module. 11. A method for manufacturing a semiconductor laser module comprising a semiconductor laser element and an optical fiber with a ferrule for receiving a laser beam emitted from the semiconductor laser element, wherein the semiconductor laser module is formed on a pair of holding members of a ferrule holding device. A step of clamping the side surface of the ferrule with the clamping groove and adjusting the optical axis of the optical fiber with a ferrule. 12. A step of adjusting the optical axis of the optical fiber with a ferrule by holding the side surface of the ferrule in a swingable state with the interval between the pair of holding members being set to a predetermined length. The method for manufacturing a semiconductor laser module according to claim 11, wherein: 13. A method for adjusting the optical axis of the optical fiber with a ferrule by clamping a side surface of the ferrule in a non-swingable state with a clamping groove of a pair of clamping members of the ferrule gripping device. A method for manufacturing a semiconductor laser module according to claim 11. 14. A method for manufacturing a semiconductor laser module according to claim 9, wherein said ferrule gripping device uses the one described in any one of claims 1 to 8. . 15. A step of fixing a semiconductor laser device to a base, a step of fixing a cooling device in a package, a step of fixing the base on the cooling device, and a through hole formed on a side portion of the package. Introducing the optical fiber with a ferrule into the package through a hole; adjusting the optical axis of the optical fiber with the ferrule by the method according to any one of claims 9 to 14; A semiconductor laser comprising: a step of fixing the optical fiber with a ferrule and a side portion of the package in a through hole of the package; and a step of hermetically sealing the inside of the package. Module manufacturing method.