JP2002367114A - Method for manufacturing thin film magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin film magnetic head manufacturing method including milling processing for forming a trim-shaped writing magnetic pole part having a uniform magnetic pole width in a throat-height direction. SOLUTION: While a wiring magnetic pole part 10 constituting a thin film magnetic head is rotated like a pendulum in an in-plane surface including a wafer in which the thin film magnetic head is formed, in both directions from a rotational reference axis C roughly parallel to the center axis of the writing magnetic pole part, preferably to set a rotational angle α to 10 deg. to 135 deg., milling processing is executed for the writing magnetic pole part 10 to define the width of the magnetic pole part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin-film magnetic head, and more particularly to a method for milling a write magnetic pole portion constituting a thin-film magnetic head.

[0002]

2. Description of the Related Art A write magnetic pole portion of a write element constituting a thin film magnetic head forms a first magnetic layer functioning as a lower magnetic pole layer of the write element, and a gap layer is formed on the first magnetic layer via a gap layer. Then, a second magnetic layer functioning as an upper magnetic pole layer is formed by frame plating or the like to form a multilayer structure, and then the multilayer structure is subjected to ion milling.

FIGS. 1 and 2 show a state in which a thin-film magnetic head formed on a wafer is viewed from a surface serving as an air bearing surface. FIG. 3 is a sectional view of the thin-film magnetic head shown in FIG. 1 taken along line AA. In this milling process, as shown in FIG. 1, the first magnetic layer 1 is formed by dry etching using the second magnetic layer 3 as a mask.
Of the second magnetic layer 3 and the portion 1A of the first magnetic layer 1 facing the second magnetic layer 3 by digging down the portion 1A facing the second magnetic layer 3 in the direction of arrow D. And a depth-direction milling step of forming the write magnetic pole portion 10 in a trim shape by making the same. Then, similarly by dry etching, the width of the write magnetic pole portion 10 is reduced in the direction of the arrow W as a whole as shown in FIG. Including.

An MR element 65 is formed below the first magnetic film 1 so as to be buried in the insulating layer 64. The MR element 65 is formed above a substrate 61 made of AlTiC or the like via a substrate underlayer 62 and a lower shield film 63. Note that reference numeral “2” represents a gap layer, and reference numeral “67” represents a coil film. The coil film 67 is embedded in the insulating layer 66.

FIG. 4 is an enlarged view of a part of one thin-film magnetic head on the wafer surface on which the thin-film magnetic head is formed. Such a milling process is usually
The wafer surface on which the thin-film magnetic head is formed is irradiated with the ion beam 5 at a constant angle as shown in FIG. 3, and as shown in FIG. 4, the in-plane direction of the thin-film magnetic head, that is, the direction parallel to the film surface. In the plane, the above-described milling step in the depth direction and the milling step in the width direction are simultaneously performed while continuously rotating in one direction around one point O of the wafer on which the write magnetic pole portion 10 is formed. Hereinafter, in the present invention, such rotation may be referred to as “dynamic rotation”. Further, under the present circumstances, a magnetic pole tip having a size of 0.6 μm or less is becoming mainstream.

[0006]

However, in the above milling process, as shown in FIG.
In some cases, the write magnetic pole width changes in the throat height direction due to the shadow effect of the ion beam 5 due to the magnetic pole portion generated by a step such as a portion spreading behind the second magnetic layer 3 and the second magnetic layer 3. Therefore, there is a problem that the write magnetic pole widths are different between lots or even on the same wafer, and a thin film magnetic head having uniform characteristics cannot be obtained with high yield.

Further, since the change in the write magnetic pole width becomes remarkable from the tip to the base, when the length of the throat height TH (distance from the throat height 0) becomes particularly 0.5 μm or less, the write magnetic pole width becomes small. The influence of the variation of the variation on the size of the write magnetic pole portion becomes significant. Therefore, in such a case, the yield of the thin film magnetic head is further reduced.

According to the present invention, in the throat height direction,
An object of the present invention is to provide a method of manufacturing a thin-film magnetic head including a milling process for forming a trim-shaped write magnetic pole portion having a uniform magnetic pole width.

[0009]

In order to achieve the above object,
The present invention is a method for manufacturing a thin-film magnetic head having a write pole portion including a first magnetic layer and a second magnetic layer formed via a gap layer adjacent to the first magnetic layer. Then, the write magnetic pole portion is reciprocally rotated so as to form a predetermined angle in both directions from a rotation reference axis substantially parallel to the central axis of the write magnetic pole portion in a plane direction including the wafer on which the thin-film magnetic head is formed. The present invention also relates to a method for manufacturing a thin-film magnetic head (first manufacturing method), characterized in that the write pole portion is subjected to a milling process.

Further, the present invention provides a thin-film magnetic head having a write pole portion including a first magnetic layer and a second magnetic layer formed via a gap layer adjacent to the first magnetic layer. Wherein the write pole portion forms a predetermined angle in both directions from a rotation reference axis substantially parallel to a central axis of the write magnetic pole portion in a plane direction including a wafer on which the thin-film magnetic head is formed. Wherein the milling process of the write magnetic pole portion is performed by fixing the write magnetic pole portion for a fixed time, respectively.
Production method).

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings according to embodiments of the present invention.
The present inventors have conducted intensive studies to solve the above problems. As a result, it has been found that the change in the write pole width in the throat height direction caused by the shadow effect is originally caused by the dynamic rotation at the time of performing the milling process. Therefore, in order to form the write pole width uniformly in the throat height direction instead of the dynamic rotation, a study was made to find a new milling method, and the above two methods were found.

FIGS. 5 to 10 conceptually illustrate the first and second manufacturing methods of the present invention by focusing on a part of one thin-film magnetic head from the wafer surface on which the thin-film magnetic head is formed. FIG. FIG. 5 is a perspective view showing the write magnetic pole portion 10 of the write element of the thin-film magnetic head. 1
Is a first magnetic layer, 2 is a gap layer made of an insulating layer, and 3 is a second magnetic layer. This second magnetic layer 3
Is a base surface 1 serving as a base for forming an air bearing surface.
1 is a pole part magnetic layer. A yoke magnetic layer 13 is formed on the second magnetic film so as to sandwich a coil layer (not shown) between the second magnetic film and the first magnetic film. An MR element 65 is formed below the first magnetic film 1 so as to be embedded in the insulating layer 64. This M
The R element 65 is formed above a substrate 61 made of AlTiC or the like via a substrate underlayer 62 and a lower shield film 63.

In the first manufacturing method of the present invention, FIG.
As shown in the figure, in the plane direction of the thin-film magnetic head, that is, in a plane parallel to the film surface, the wafer on which the write magnetic pole portion 10 is formed is at least one as shown by an arc-shaped arrow.
Rotate in a reciprocating pendulum. During this reciprocating rotation, the ion beam 5 is irradiated from one direction to the direction of the surface including the wafer surface at a predetermined angle to perform a milling process. Further, the predetermined angle of the ion beam 5 with respect to the surface direction of the wafer may be set so as to change during the milling process.

In the second manufacturing method of the present invention, as shown in FIG. 9, the write magnetic pole portion is formed in the in-plane direction of the wafer on which the thin-film magnetic head is formed, that is, in the plane parallel to the film surface. 10 is fixed for a predetermined time during the milling process so that the rotation reference axis C and the irradiation angle of the ion beam form a predetermined angle.

Instead of the conventional dynamic rotation, a milling process is performed by applying the reciprocating rotation as described above to the write magnetic pole portion, or the central axis of the write magnetic pole portion 10 and the irradiation angle of the ion beam form a predetermined angle. The state is fixed for a predetermined time. Thereby, the width of the write magnetic pole portion can be formed uniformly in the throat height direction. Therefore, a thin film magnetic head having desired characteristics can be manufactured with high yield.

[0016] In a preferred embodiment of the present invention,
The first manufacturing method and the second manufacturing method can be used in combination. Thereby, the width of the write magnetic pole portion can be more uniformly defined in the throat height direction.

Furthermore, at least one of the first manufacturing method and the second manufacturing method can be combined with the above-described dynamic rotation. This will be described in more detail below.

As shown in FIGS. 6 to 8, the first manufacturing method of the present invention requires reciprocating rotation. As long as the object of the present invention can be achieved, the conditions such as the magnitude of the reciprocating rotation and the rotation speed are not particularly limited.

FIG. 6 shows a first embodiment of the first manufacturing method of the present invention. The vicinity of the magnetic pole of the write element of one thin-film magnetic head formed on a wafer is conceptually enlarged. FIG. Reference numeral 10 denotes a write magnetic pole portion of the thin-film magnetic head, which is formed on the wafer 20. The write magnetic pole portion 10 shown by a solid line is in the first state in which the base surface 11 serving as the base of the air bearing surface faces the irradiation direction 51 of the ion beam 5. Around a substantially central point O ₁ of the wafer 20 from this state, is reciprocally rotated in both directions by a predetermined angle α relative to the rotation reference axis C as shown in the arcuate double arrow. This angle α corresponds to a stage angle in the XY plane including the wafer.

In the write magnetic pole portion 10a indicated by a dotted line, the wafer is rotated by a predetermined angle α, and the rotation reference axis C is
When the state indicated by a is reached, the write magnetic pole unit 10 is rotated and positioned in the second state. The write magnetic pole part 10b indicated by the dotted line is the third magnetic pole part 10 at which the write magnetic pole part 10 is rotated when the wafer is rotated by the predetermined angle α and the rotation reference axis C is in the state indicated by the one-dot chain line Cb.
Represents the state of.

The state in which the trimming process is performed may be started from the first state or from another state, but it is preferable that the trimming be performed at least one reciprocating rotation, and the ion beam 5 is constantly irradiated during the reciprocating rotation. Have been. According to the present embodiment, since the center 0 ₁ of the reciprocating rotation is located substantially at the center of the wafer, the rotation Koyoru shake of the wafer without thereby reciprocating rotation at a small area.

FIG. 7 shows a second embodiment of the first manufacturing method of the present invention. The vicinity of the magnetic pole of the write element of one thin film magnetic head formed on a wafer is conceptually enlarged. FIG. Reference numeral 10 denotes a write magnetic pole portion of the thin-film magnetic head, which is formed on the wafer 20. The write magnetic pole portion 10 shown by a solid line is in a state in which the base surface 11 serving as the base of the air bearing surface faces the irradiation direction 51 of the ion beam 5. Around a different one point O ₂ is substantially the center point of the wafer 20 from this state, is reciprocally rotated in both directions by a predetermined angle α relative to the rotation reference axis C as shown in the arcuate double arrow.

In the write magnetic pole portion 10c shown by a dotted line, the wafer is rotated by a predetermined angle α, and the rotation reference axis C is
The state shown by c indicates the state where the write magnetic pole unit 10 is rotated and positioned when the state of the wafer 20c is reached. When the wafer rotates by a predetermined angle α, the rotation reference axis C changes to the state shown by the one-dot chain green Cd, and the writing magnetic pole section 10 rotates when the wafer 20c changes. It represents the state where it was positioned as follows.

As in the first embodiment, in this embodiment, it is possible to start from any state, but it is desirable to rotate at least one reciprocation, during which the ion beam 5 is continuously irradiated. In this example, a point O ₂ which is different from the approximate center point of the wafer 20 as shown in figure 1 on the wafer
It may be a point or one point (not shown) outside the wafer. This case is effective when processing a plurality of wafers simultaneously.

FIG. 8 shows how the relative irradiation direction of the ion beam 5 changes when viewed from the write magnetic pole section 10 shown in FIGS. The irradiation direction 51 shown by the solid line is
FIGS. 6 and 7 show the case where the write magnetic pole part 10 is in the state of the solid line, and the state where the ion beam 5 is irradiated from the base surface 11 direction which is the base of the air bearing surface of the write magnetic pole part 10. .

The irradiation direction 51a indicated by a dotted line is the state of the write magnetic pole section 10a in FIG. 6 and the state of the write magnetic pole section 10c in FIG. Irradiation is performed from an angle that forms α with 10 center lines CH. The irradiation direction 51b indicated by a dotted line is the state of the write magnetic pole part 10b in FIG. 6 or the state of the write magnetic pole part 10d in FIG. Line CH
Irradiation from an angle that makes α. The first manufacturing method
In the case of the embodiment and the second embodiment, the ion beam moves between the irradiation direction 51a and the irradiation direction 51b relatively continuously with the write magnetic pole portion 10.

In the first and second embodiments shown in the first manufacturing method of the present invention, it is preferable that the rotation angle α is 10 degrees to 135 degrees in both directions. Thereby, the write magnetic pole width can be more uniformly defined in the throat height direction in a trim shape.

The reciprocating rotation may be at least one reciprocation during the milling process as described above, but is usually reciprocated 5 to 20 times during the milling process.

The first manufacturing method, that is, the milling process by the reciprocating rotation can be performed over the entire process of the milling process of the write magnetic pole portion. However, as shown in FIG. It is preferably performed in the milling step.

In the case where the first manufacturing method is carried out in the milling step in the depth direction, the milling step in the width direction preferably uses a conventional milling process utilizing dynamic rotation. As a result, a write magnetic pole portion having a uniform magnetic pole width in the throat height direction can be formed in a relatively short time. When using milling using dynamic rotation,
During the milling process, it is necessary to rotate the write pole at least one revolution about its base.

In carrying out the first manufacturing method, the angle between the surface including the wafer and the irradiation direction of the ion beam 5 may be changed during the irradiation with the ion beam 5. Thus, a desired trim amount process can be performed by the trim process in the width direction of the magnetic pole portion and the trim process in the direction perpendicular to the gap layer 2 with respect to the first magnetic layer during the trim process.

In the second manufacturing method, FIGS.
As shown in (1), the write magnetic pole section 10 is fixed in a plane direction including the wafer at a predetermined angle from the central axis CH in both directions for a certain period of time. As long as the object of the present invention can be achieved, various conditions such as the swing width and the moving speed of the reciprocating motion are not particularly limited.

FIG. 9 is a diagram showing the state of the wafer in both directions in the present manufacturing method. 10e indicated by solid line
Shows a state in which the center line CH of the write magnetic pole portion 10 forms an angle of β with the irradiation direction 51 of the ion beam 5 on the surface including the wafer, and the state of the wafer at this time is indicated by a solid line. 20e. In addition, 1 indicated by a dotted line
0f indicates that the center line CH of the write magnetic pole portion 10 forms an angle β with the irradiation direction 51 of the ion beam 5 in a direction opposite to the previous state on the surface including the wafer. Is 20f indicated by the dotted line. The angle β in this case also corresponds to the stage angle in the XY plane including the wafer. In this description, the position of the wafer is shifted in the two states for easy understanding. However, the rotation may be controlled so that the wafer state 20e and the wafer state 20f substantially coincide with each other.

FIG. 10 shows the write magnetic pole portion 1 shown in FIG.
The relative irradiation direction of the ion beam 5 as viewed from 0 is shown. The irradiation direction 51e indicated by a dotted line is the state of the write magnetic pole portion 10e in FIG. 9 and is irradiated from the angle between β and the center line CH of the write magnetic pole portion 10 indicated by a dashed line in the plane direction including the wafer. . Irradiation direction 51f indicated by dotted line
9 shows a state of the write magnetic pole portion 10f shown in FIG.
From the center line CH in the direction opposite to the above. In the case of this manufacturing method, the ion beam 5 is irradiated in the irradiation direction 51e and the irradiation direction 51f for a certain period of time.

In the case of this manufacturing method, as shown in FIG. 9, the incident angle β of the ion beam with respect to the central axis CH of the write magnetic pole part 10 is 90 in both directions of the central axis CH.
It is preferable to fix it so that it is not more than the temperature. Thereby, the width of the write magnetic pole portion in the throat height direction can be more uniformly defined. As described above, the fixing may be performed at least once during the milling process. However, the fixing is usually performed 4 to 10 times. The fixed time in each direction is preferably 15 seconds to 5 minutes.

As in the first manufacturing method, the milling process according to the second manufacturing method can be performed over the entire milling process of the write pole portion.
It is preferable to carry out in a depth direction milling step as shown in FIG.

When the second manufacturing method is carried out in the milling step in the depth direction, the milling step in the width direction preferably uses a conventional milling process utilizing dynamic rotation. As a result, a write magnetic pole portion having a uniform magnetic pole width in the throat height direction can be formed in a relatively short time. When using milling using dynamic rotation,
As described above, it is necessary to rotate the write magnetic pole part at least once around the central axis CH during the milling process.

The first manufacturing method and the second manufacturing method can be used alone or in combination. In this case, the order in which the first manufacturing method and the second manufacturing method are used is not limited.
Thereby, the width of the write magnetic pole portion in the throat height direction can be more uniformly defined. Also in this case, as for the preferable rotation angle of the reciprocating rotation, the rotation angle α is preferably 135 degrees or less and the incident angle β of the milling particles is preferably 90 degrees or less, as described above. Rotation angle α
Exceeds 135 degrees or the incident angle β exceeds 90 degrees, as described with reference to FIG. 3, the shadow effect becomes remarkable, and it may not be possible to obtain a uniform write pole width in the throat height direction. is there. Also, the rotation angle α
Is less than 10 degrees, the amount of retreat of the flare point in the pole volume increases.

When the first manufacturing method and the second manufacturing method are used in combination, at least one of these manufacturing methods is preferably used in a depth milling step as shown in FIG. Further, as described above, it is preferable to use a conventional milling process using dynamic rotation for the milling step in the width direction.

The milling process itself in the present invention can be performed by using dry etching such as ion milling or reactive ion etching (RIE).

FIG. 11 is a graph showing the dependence of the write pole width in the throat height direction when the write pole is milled using the first manufacturing method of the present invention. FIG. 12 is a graph showing the dependency of the write magnetic pole portion width in the throat height direction when the write magnetic pole portion is milled using the conventional dynamic rotation.

As is apparent from FIGS. 11 and 12, by following the method of the present invention, over the length direction of the throat height (distance from the throat height 0) of about 1 μm,
It can be seen that a uniform magnetic pole width of about 0.70 μm was obtained. A uniform magnetic pole width is obtained even up to a depth of 0.5 μm in the throat height direction, and a large variation in the magnetic pole width when the size of the throat height, which has been a conventional problem, becomes 0.5 μm or less. Is suppressed.

As described above, the present invention has been described in connection with the embodiments of the present invention with reference to specific examples. However, the present invention is not limited to the above contents, and various modifications and changes are possible.

[0044]

As described above, according to the method of manufacturing a thin-film magnetic head of the present invention, the width of the write pole portion can be specified to be uniform in the throat height direction through the milling process. Therefore, it is possible to effectively prevent a change in the write magnetic pole width due to the subsequent processing.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a milling process in a depth direction.

FIG. 2 is a schematic view showing a milling process in a width direction.

FIG. 3 is a schematic view for explaining a shadow effect in a milling step.

FIG. 4 is an enlarged plan view showing a part of one thin-film magnetic head formed on a wafer surface.

FIG. 5 is a perspective view showing a write magnetic pole portion 10 of a write element of the thin-film magnetic head.

FIG. 6 is a plan view showing a first example of the first manufacturing method of the present invention.

FIG. 7 is a plan view showing a second embodiment of the first manufacturing method of the present invention.

FIG. 8 is a diagram showing a change in the relative irradiation direction of the ion beam viewed from the write magnetic pole portion of the thin-film magnetic head shown in FIGS. 6 and 7.

FIG. 9 is a view for explaining a second manufacturing method of the present invention.

FIG. 10 is a view showing a relative irradiation direction of an ion beam viewed from a write magnetic pole portion of the thin-film magnetic head shown in FIG.

FIG. 11 is a graph showing the dependence of the width of the write magnetic pole portion milled by the first manufacturing method of the present invention in the length direction of the throat height (distance from the throat height 0).

FIG. 12 is a graph showing the dependency of the width of a write magnetic pole portion milled by a conventional manufacturing method in the throat height length direction (distance from throat height 0).

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 1st magnetic film 2 gap film 3 2nd magnetic film 5 ion beam 10 writing magnetic pole part 20 wafer O ₁ substantially center point of wafer C rotation reference axis CH center line of writing magnetic pole part

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Tetsuo Miyazaki 1-1-13 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Shin Narukushima 1-13-1 Nihonbashi, Chuo-ku, Tokyo (72) Inventor Hiroyuki Miyamoto 1-1-13 Nihonbashi, Chuo-ku, Tokyo F-term (reference) 5D033 BA13 DA08 DA31

Claims (24)

[Claims] 1. A method of manufacturing a thin-film magnetic head having a write pole portion including a first magnetic layer and a second magnetic layer formed via a gap layer adjacent to the first magnetic layer. The write magnetic pole part is reciprocated to make a predetermined angle in both directions from a rotation reference axis substantially parallel to the central axis of the write magnetic pole part in a plane direction including the wafer on which the thin-film magnetic head is formed. A method of manufacturing the thin-film magnetic head, wherein the write magnetic pole portion is subjected to a milling process. 2. An air bearing surface of the thin-film magnetic head is provided with an ion beam in a plane direction including a wafer on which the thin-film magnetic head is formed. 2. The method of manufacturing a thin-film magnetic head according to claim 1, wherein the head is oriented in an irradiation direction. 3. The method according to claim 1, wherein the center of rotation of the reciprocating rotation is substantially the center of the wafer. 4. The milling process uses the second magnetic film as a mask to reduce the width of a portion of the first magnetic film that faces the second magnetic film.
4. The method of manufacturing a thin-film magnetic head according to claim 1, wherein the method is performed in a milling process in a depth direction to match the width of the magnetic film. 5. The milling process according to claim 5, wherein the write pole portion is formed at an angle of 10 ° to 135 ° in both directions from the rotation reference axis in the in-plane direction including the wafer on which the thin film magnetic head is formed. The method for manufacturing a thin-film magnetic head according to claim 1, wherein the method is performed by reciprocating rotation. 6. A method for manufacturing a thin-film magnetic head having a write pole portion including a first magnetic layer and a second magnetic layer formed via a gap layer adjacent to the first magnetic layer. The write magnetic pole part is fixed at a predetermined angle in both directions from a rotation reference axis substantially parallel to the central axis of the write magnetic pole part in a plane direction including the wafer on which the thin-film magnetic head is formed. A method for manufacturing a thin-film magnetic head, characterized in that the milling process of the write magnetic pole portion is performed with time fixed. 7. The milling process uses the second magnetic film as a mask to reduce the width of a portion of the first magnetic film facing the second magnetic film.
7. The method of manufacturing a thin-film magnetic head according to claim 6, wherein the method is performed in a milling process in a depth direction that matches the width of the magnetic film. 8. In the milling process, the angle of incidence of the milling particles in the in-plane direction of the thin-film magnetic head is 90 degrees or less in both directions from the rotation reference axis of the write magnetic pole part. The method according to claim 6, wherein the method is performed in a state. 9. A method of manufacturing a thin-film magnetic head comprising a write pole portion comprising a first magnetic film and a second magnetic film formed on the first magnetic film via a gap film. The write magnetic pole portion is reciprocally rotated so as to form a predetermined angle in both directions from a rotation reference axis substantially parallel to the central axis of the write magnetic pole portion in an in-plane direction including the wafer on which the thin film magnetic head is formed. First milling process
Milling process, and in the in-plane direction including the wafer on which the thin-film magnetic head is formed, at a predetermined angle from the rotation reference axis substantially parallel to the central axis of the write pole portion, for a predetermined time, respectively. A method for manufacturing a thin-film magnetic head, characterized in that the width of the write magnetic pole portion is defined in combination with a second milling process in which a fixed milling process is performed. 10. The first milling process includes the step of:
A milling process in a depth direction in which the width of a portion of the first magnetic film facing the second magnetic film matches the width of the second magnetic film by using the magnetic film as a mask. 10. The method of manufacturing a thin-film magnetic head according to claim 9, wherein the method is performed. 11. The first milling process may include setting the write magnetic pole portion to a position between 10 degrees and 135 degrees in both directions from the rotation reference axis in the in-plane direction including the wafer on which the thin-film magnetic head is formed. The method of manufacturing a thin-film magnetic head according to claim 9, wherein the method is performed by reciprocating rotation at an angle. 12. The thin film magnetic device according to claim 9, wherein the second milling process is performed in a width direction milling process for reducing a width of the write magnetic pole portion. Head manufacturing method. 13. The second milling process according to claim 12, wherein
A milling process in a depth direction in which the width of a portion of the first magnetic film facing the second magnetic film matches the width of the second magnetic film by using the magnetic film as a mask. 10. The method according to claim 9, wherein
12. The method for manufacturing a thin-film magnetic head according to any one of the eleventh to eleventh aspects. 14. In the second milling process, the writing magnetic pole part is set such that an incident angle of milling particles is set at a center of the writing magnetic pole part in the in-plane direction including the wafer on which the thin film magnetic head is formed. 14. The method of manufacturing a thin-film magnetic head according to claim 9, wherein the method is performed in a state where the angle is 90 degrees or less in the left-right direction from the axis. 15. A method of manufacturing a thin-film magnetic head having a write pole portion comprising a first magnetic film and a second magnetic film formed on the first magnetic film via a gap film. A first milling process in which the write magnetic pole portion is fixed at a predetermined angle in both directions from a rotation reference axis substantially parallel to a central axis of the write magnetic pole portion for a fixed time, and the write magnetic pole portion is subjected to milling processing. Processing, milling while continuously rotating in one direction around the rotation reference axis of the write magnetic pole portion in the in-plane direction including the wafer on which the thin-film magnetic head is formed, in the write magnetic pole portion A method of manufacturing a thin-film magnetic head, wherein the width of the write magnetic pole portion is defined by using a second milling process for processing. 16. The method according to claim 1, wherein the first milling process is performed by the second milling process.
A milling process in a depth direction in which the width of a portion of the first magnetic film facing the second magnetic film matches the width of the second magnetic film by using the magnetic film as a mask. 16. The method according to claim 15, wherein:
3. The method for manufacturing a thin-film magnetic head according to item 1. 17. The method according to claim 1, wherein the first milling process is performed such that an angle of incidence of milling particles is set so that the write magnetic pole portion is in an in-plane direction including a wafer on which the thin film magnetic head is formed.
17. The method of manufacturing a thin-film magnetic head according to claim 15, wherein the method is performed in a state where the write magnetic pole portion is at 90 degrees or less in both directions from the rotation reference axis. 18. The thin film according to claim 15, wherein the second milling process is performed in a width direction milling process for reducing a width of the write magnetic pole portion. A method for manufacturing a magnetic head. 19. A method for manufacturing a thin-film magnetic head comprising a write pole portion comprising a first magnetic film and a second magnetic film formed on the first magnetic film via a gap film. In the in-plane direction including the wafer on which the thin-film magnetic head is formed, the write magnetic pole portion is reciprocally rotated so as to form a predetermined angle in both directions from a rotation reference axis substantially parallel to the central axis of the write magnetic pole portion. First milling process
Milling process, in the in-plane direction including the wafer on which the thin-film magnetic head is formed, in a state where the predetermined angle in both directions from the rotation reference axis substantially parallel to the central axis of the write pole portion, respectively A second milling process in which the milling process is fixed for a fixed time, and the rotation reference axis substantially parallel to the central axis of the write magnetic pole portion in the in-plane direction including the wafer on which the thin-film magnetic head is formed. A method of manufacturing a thin-film magnetic head, wherein a width of the write magnetic pole portion is defined by using a third milling process of performing a milling process while continuously rotating in one direction as a center. 20. The method according to claim 19, wherein the first milling is performed by the second milling.
A milling process in a depth direction in which the width of a portion of the first magnetic film facing the second magnetic film matches the width of the second magnetic film by using the magnetic film as a mask. 20. The method according to claim 19, wherein
3. The method for manufacturing a thin-film magnetic head according to item 1. 21. The first milling process comprises: moving the write magnetic pole part in both directions from the rotation reference axis of the write magnetic pole part in the in-plane direction including the wafer on which the thin film magnetic head is formed. 21. The method of manufacturing a thin-film magnetic head according to claim 19, wherein the method is performed by reciprocating rotation at an angle of about 135 degrees to 135 degrees. 22. The method according to claim 22, wherein the second milling process includes
A milling process in a depth direction in which the width of a portion of the first magnetic film facing the second magnetic film matches the width of the second magnetic film by using the magnetic film as a mask. 20. The method according to claim 19, wherein
22. The method for manufacturing a thin-film magnetic head according to any one of items 21 to 21. 23. The method according to claim 23, wherein the writing magnetic pole part is formed such that an incident angle of milling particles is set at a center of the writing magnetic pole part in the in-plane direction including the wafer on which the thin film magnetic head is formed. 23. The method of manufacturing a thin-film magnetic head according to claim 19, wherein the method is performed in a state where the angle is 90 degrees or less in the left-right direction from the axis. 24. The thin film according to claim 19, wherein the third milling process is performed in a width direction milling process step of reducing a width of the write magnetic pole portion. A method for manufacturing a magnetic head.