JP2002365331A - Device evaluation holder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device evaluation holder, causing no peeling of the foot pattern of a product device, requiring no wiring area of a printed wiring board, nor use of an IC socket. SOLUTION: This device evaluation tool 1 is to be mounted on a surface opposite to the surface for mounting the product device 6 of a board 5. The holder 1 comprises a frame-like body 1b, an evaluation device 2 which is housed in the central space part of the body 1b, and a pattern 1a for contacting with the lead 2a of the evaluation device 2 is formed on the upper surface of the body 1; and the pattern 1a is extended to the lower surface of the body 1, and the pattern 1a of the lower surface makes contact with the pattern 7 of the board 5. A lid 3 for covering the upper surface of the frame-like body 1 of the device evaluation holder 1 may be provided, and the device evaluation holder 1 is set suitably attachably with respect to the board 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device evaluation jig, and more particularly, to a jig used for evaluating an IC such as a gull wing lead type LSI.

[0002]

2. Description of the Related Art Conventionally, when evaluating a single unit such as a surface mount type LSI (large-scale integrated circuit) or GA (gate array), or an evaluation of a circuit on a substrate on which these components are mounted, it is necessary to evaluate a device. At the time of evaluation, a pattern for mounting the evaluation device in another place on the board is provided separately from the product device so that the evaluation device can be replaced.
C socket was used.

[0003]

However, in the above-mentioned conventional technology, when testing the device for evaluation, the use of the foot pattern of the product device for mounting the device for evaluation makes it possible to reduce the size most. However, if the foot pattern of a product device is detached and attached many times, there is a risk of peeling off the pattern, and directly mounting the evaluation device is a problem.

Therefore, conventionally, when a test is performed by attaching an evaluation device, a foot pattern for the test evaluation device is provided, and the test is performed using an IC socket. In this method, since a test circuit is provided, it is necessary to secure a sufficient wiring area of the printed wiring board. In particular, in the case of a multi-pin LSI, the effect is remarkable. There is a problem that the device cannot be miniaturized. In addition, when there is a restriction on the height of components, a low socket is required for the IC socket.

Accordingly, the present invention has been made in view of the problems in the above-mentioned conventional device evaluation jig,
It is an object of the present invention to provide a device evaluation jig which does not require a wiring area of a printed wiring board and does not require the use of an IC socket without causing peeling of a foot pattern of a product device.

[0006]

In order to explain the above object, an invention according to claim 1 is a device evaluation jig which is mounted on a surface of a substrate opposite to a surface on which a product device is mounted. It is characterized by.

According to the first aspect of the present invention, the device evaluation jig is mounted on the surface of the substrate opposite to the surface on which the product device is mounted, that is, on the solder surface side of the substrate. It is not necessary to provide an evaluation device foot pattern on the surface on which the product device is to be mounted, so that the wiring space for the printed wiring board and the like can be significantly reduced, the man-hour for designing the pattern of the board can be reduced, and the printed wiring board and the like can be reduced in size. Can be Further, since there is no need to use an IC socket as in the related art, it is possible to cope with a case where the height of parts is limited.

According to a second aspect of the present invention, as a preferred embodiment of the device evaluation jig of the first aspect, the device evaluation jig includes a frame-shaped main body, and an evaluation device is provided in a central space of the main body. It is housed, a pattern is formed on the upper surface of the main body to come into contact with the leads of the evaluation device, the pattern extends to the lower surface of the main body, and the pattern on the lower surface contacts the pattern of the substrate. I do.

According to a third aspect of the present invention, in the device evaluation jig of the second aspect, a lid for covering an upper surface of a frame-shaped main body of the device evaluation jig is provided.
This makes it possible to reliably prevent the evaluation device from falling off.

According to a fourth aspect of the present invention, in the device evaluation jig of the first, second or third aspect, the device evaluation jig is detachable from the substrate. Thereby, after the evaluation device is evaluated, the height limitation of the component can be eased by removing the evaluation device from the substrate.

[0011]

Next, a specific example of an embodiment of a device evaluation jig according to the present invention will be described with reference to the drawings.

FIGS. 1 to 4 show an embodiment of a device evaluation jig according to the present invention.
Includes a main body 1b formed in a frame shape. Body 1
b is formed to a thickness similar to that of a surface-mount type LSI evaluation device (hereinafter abbreviated as “evaluation device”) 2 mounted on the device evaluation jig 1, and leads of the evaluation device 2 are formed. Device evaluation jig 1 that contacts 2a
The upper pattern 1a is wired to the back surface. The device evaluation jig 1 is provided with screw holes 1c at four corners.

As shown in FIG. 3, the evaluation device 2
The lead 2a of the evaluation device 2 is attached to the device evaluation jig 1 upside down when mounted directly on the substrate.
Is brought into contact with the pattern 1a on the device evaluation jig 1.
Then, the cover 3 is put on, and the cover 3 is screwed to the device evaluation jig 1 with the screw 4 via the screw hole 1c (see FIG. 1). This can prevent the evaluation device 2 from falling off.

FIG. 4 shows a state where the device evaluation jig 1 is attached to the substrate 5. The device evaluation jig 1 is provided with a conductive adhesive on a surface opposite to a surface on which a product surface mount device (hereinafter abbreviated as “product device”) 6 of the substrate 5 is mounted (upper surface in FIG. 1). It is attached to the board 5 with solder or solder.

Next, a device evaluation method using the device evaluation jig 1 having the above configuration will be described.

At the time of the evaluation test, the evaluation test is performed by mounting only the device evaluation jig 1 and the evaluation device 2 without mounting the product device 6 on the substrate 5. After the evaluation test, the product device 6 is mounted on the substrate 5, and the device evaluation jig 1 is removed together with the evaluation device 1. Therefore, since only one attachment / detachment of the substrate 5 and the device evaluation jig 1 is required,
The foot pattern of the product device 6 is not damaged by soldering.

At the time of the above evaluation, the mounting direction of the evaluation device 2 can be the same as that of the product device 6 with the substrate 5 interposed therebetween. At this time, the pattern 7 on the substrate wired to the product device 6 is arranged on the back surface of the substrate 5 via the through hole 8, where it is connected to the pattern 1 a of the device evaluation jig 1 to conduct.

[0018]

As described above, according to the present invention,
It is possible to provide a device evaluation jig which does not require a wiring area of a printed wiring board and does not require the use of an IC socket, without causing a peeling of a foot pattern of a product device.

[Brief description of the drawings]

FIG. 1 is a top view showing an embodiment of a device evaluation jig according to the present invention, showing a state where a device evaluation jig is mounted on a substrate and a lid is removed.

FIG. 2 is a top view showing a state where a lid is attached to the device evaluation jig of FIG.

FIG. 3 is a sectional view showing the device evaluation jig of FIG. 2;

4 is a cross-sectional view showing a state where the device evaluation jig of FIG. 2 is mounted on a substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Device evaluation jig 1a Pattern 1b Main body 1c Screw hole 2 Evaluation device 2a Lead 3 Lid 4 Screw 5 Board 6 Product device 7 Pattern on board 8 Through hole

Claims (4)

[Claims] 1. A device evaluation jig mounted on a surface of a substrate opposite to a surface on which a product device is mounted. 2. The device evaluation jig includes a frame-shaped main body, an evaluation device is accommodated in a central space portion of the main body, and a pattern that is in contact with a lead of the evaluation device is formed on an upper surface of the main body. 2. The device evaluation jig according to claim 1, wherein the pattern extends to a lower surface of the main body, and the pattern on the lower surface contacts the pattern on the substrate. 3. The device evaluation jig according to claim 2, further comprising a lid that covers an upper surface of a frame-shaped main body of the device evaluation jig. 4. The device evaluation jig according to claim 1, wherein the device evaluation jig is detachable from the substrate.