JP2002359315A - Manufacturing method of heat conductive substrate - Google Patents

Abstract

(57) [Problem] To provide a method of manufacturing a thermoconductive substrate capable of reliably positioning a land, which is a part that needs to be electrically isolated independently, and preventing contamination by a thermosetting resin composition. It is assumed that. SOLUTION: After forming a terminal plate and a circuit forming portion on a conductive metal plate 11 having a pattern formed by a resist 14, a masking 16 is performed on the circuit forming portion to perform solder plating 1.
5 and removing the masking 16, patterning of the connecting bar 17 and the circuit forming portion that electrically connect the portions that need to be electrically isolated, and attaching the film 18 to the printed surface of the resist 14 , Connecting splice 17 to film 18
And the lead frame 12 is formed by punching and removing, and the thermosetting resin composition 21
The heat-dissipating metal plate 23 is laminated, and cured by heating and pressing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thermally conductive substrate (high heat dissipation substrate) composed of a lead frame, a thermosetting resin composition, or the like, which is used for a high power circuit in an electronic device. Things.

[0002]

2. Description of the Related Art In recent years, with the demand for higher performance and smaller size of electronic devices, higher density and higher function of semiconductors are required.

[0003] As a result, the circuit board for mounting them also requires a small and high-density structure.
Heat and pressure molding, in which a thermosetting resin composition in which a thermosetting resin is filled with an inorganic heat conductive filler is integrated with a lead frame that constitutes a main body, wiring, electrodes or extraction terminals, or a separate metal plate for heat radiation Has proposed a thermally conductive substrate.

A conventional method of manufacturing a heat conductive substrate will be described with reference to a side sectional view and a plan view of FIG.
That is, in FIG. 7, reference numeral 1 denotes a thermosetting resin composition in the form of a sheet in which a thermosetting resin is filled with a thermally conductive filler.

[0005] Reference numeral 2 denotes a predetermined pattern and a positioning hole 4 such as a terminal and a circuit forming portion which are processed and provided by etching or pressing, etc., and a circuit forming conductor (lead frame) made of a conductive metal plate such as copper or an alloy thereof; Reference numeral 3 denotes a cylindrical projection corresponding to the hole 4 provided on the operation surface of the lower pressurizing member 6 having a heating portion in a mold or the like. And
Reference numeral 5 denotes a movable upper pressing body having a heating unit corresponding to the lower pressing body 6.

The manufacturing method will be described first.
As shown in (b), the projections 3 arranged on the operating surface of the lower pressure body 6 are inserted into the holes 4 provided in the circuit forming conductor 2 (lead frame) to position the circuit forming conductor 2. While being placed on the upper surface of the lower pressure body 6.

[0007] Subsequently, as shown in FIG. 7 (a), after the thermosetting resin composition 1 is laminated on the circuit portion of the circuit-forming conductor 2, the upper pressurizing body 5 is lowered and heated and pressed to perform thermosetting. The curing of the resin composition 1 is completed, and the thermosetting resin composition 1 and the circuit-forming conductor 2 are integrated. Thereafter, if necessary, predetermined electronic components and devices are mounted to complete the heat conductive substrate.

[0008]

However, in the conventional method for manufacturing a heat conductive substrate, the thermosetting resin composition 1 is used.
Softens and flows when heated and pressurized. In order to prevent the circuit-forming conductor 2 from shifting or moving due to the softening and the flow, it is necessary to fit the two holes 4 and the projections 3 for positioning and regulation.

That is, for the above, the holes 4 and the projections 3 also need to be provided at two or more places.
When molding with the thermosetting resin composition 1, a large number of projections 3 must be arranged on the lower pressure body 6, and the apparatus becomes complicated and expensive.

[0010] Further, when the land or the circuit forming conductor 2 which is a part which needs to be electrically isolated independently is small, it is difficult to provide the hole 4.

SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned problem, and it is possible to reliably position and regulate a land, which is a part that needs to be electrically isolated independently, or a small conductor for forming a circuit, with a simple structure. It is another object of the present invention to provide a method for manufacturing a heat conductive substrate which can prevent contamination due to bleeding or adhesion of a thermosetting resin composition.

[0012]

According to the present invention, there is provided a method of manufacturing a thermally conductive substrate, comprising: forming a terminal portion and a circuit forming portion on a conductive metal plate having a pattern formed by a resist; After that, the plating is performed by applying masking to the circuit forming portion, and subsequently removing the masking,
Performs a predetermined pattern processing of the connecting bars and the circuit forming part that mechanically connect the parts that need to be electrically isolated independently, and after attaching the film to the resist printing surface, punches out the connecting bars together with the film and removes the lead frame. Is formed by laminating a thermosetting resin composition or a thermosetting resin composition and a metal plate for heat radiation on the circuit forming portion of the lead frame, and curing by heating and pressing. And regulation and prevention of contamination due to bleeding or adhesion by the thermosetting resin composition.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, after forming a terminal portion and a circuit forming portion on a conductive metal plate having a pattern formed with a resist, the circuit forming portion is masked. The plating process is performed, followed by removing the masking, performing a predetermined pattern processing of a connecting bar and a circuit forming portion for mechanically connecting portions that need electrically independent insulation, and applying a film on the resist printing surface. After sticking, the connecting bar is punched and removed together with the film to form a lead frame, and a thermosetting resin composition or a thermosetting resin composition and a metal plate for heat dissipation are laminated on the circuit forming portion of the lead frame, and heated and pressed. The method is a method of manufacturing a thermally conductive substrate that is hardened by curing. It has the effect of preventing.

According to a second aspect of the present invention, a circuit forming portion of a conductive metal plate on which a pattern is formed by using a resist is subjected to a plating process by performing a masking process. 2. A method for manufacturing a thermally conductive substrate according to claim 1, wherein a lead frame is formed by processing a predetermined pattern of a connecting bar and a circuit forming portion for mechanically connecting portions requiring insulation. Has the effect of reducing the number of steps.

The invention according to claim 3 comprises 70 to 95 parts by weight of an inorganic filler and 5 to 30 parts by weight of at least a thermosetting resin, a curing agent and a curing accelerator, and can be used in a semi-cured or partially cured state. The method for producing a heat conductive substrate according to claim 1 or 2, wherein the thermosetting resin composition in the form of a sheet having flexibility is used, which shortens the production process time and facilitates maintenance. Has an action.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a heat conductive substrate according to the first or second aspect, wherein the masking is performed by applying a masking film or applying a resist. Has the effect of preventing the application of solder plating.

According to a fifth aspect of the present invention, after attaching a film to a resist-printed surface, a connecting bar is punched and removed together with the film, and then the thermosetting resin composition or The method for producing a heat conductive substrate according to claim 1 or 2, wherein the thermosetting resin composition and the metal plate for heat radiation are laminated, and cured by heating and pressing. It has the effect of enabling a circuit.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a thermally conductive substrate according to the first or second aspect, wherein a lead frame is formed by pressing, etching or laser processing a conductive metal plate. And has an effect that a lead frame having a predetermined pattern can be formed.

According to a seventh aspect of the present invention, a lead frame and a thermosetting resin composition or a thermosetting resin composition and a heat-dissipating metal plate are laminated by a forming die or a hot press machine, and cured by heating and pressing. Claim 1 or 2 which is made to
The method has a function of forming a heat conductive substrate which is modularized and has high heat dissipation.

According to an eighth aspect of the present invention, there is provided a method for manufacturing a thermally conductive substrate according to the first or second aspect, wherein the plating process is performed by nickel plating and solder plating. This has the effect that the improvement and the mounting in the post-process can be reliably performed.

According to a ninth aspect of the present invention, there is provided a method for manufacturing a thermally conductive substrate according to the first or second aspect, wherein copper or an alloy thereof is used as the conductive metal plate. It has the effect of improving strength, electrical properties and thermal conductivity.

According to a tenth aspect of the present invention, the entire lead frame is plated without masking the circuit forming portion, and the plating of the circuit forming portion is removed by blasting. The method has the function of roughening the plating-removed surface.

According to an eleventh aspect of the present invention, there is provided a method for manufacturing a thermally conductive substrate according to the first or second aspect, wherein a pattern made of a resist is formed on a conductive metal plate on which terminals have been formed in advance. , And can be used for sharing terminals and checking electrical characteristics.

According to a twelfth aspect of the present invention, there is provided the method for manufacturing a thermally conductive substrate according to the first or second aspect, wherein the direction of the punching process on the conductive metal plate is the resist printing surface side. Punching burrs have the effect of preventing resist flow.

According to a thirteenth aspect of the present invention, there is provided a method of manufacturing a thermally conductive substrate according to the first or second aspect, wherein a conductive metal plate having at least one surface roughened is used. It has the effect of improving the releasability of masking and the adhesion of the solder plating or thermosetting resin composition.

According to a fourteenth aspect of the present invention, there is provided the method for producing a thermally conductive substrate according to the first or second aspect, wherein the film is attached to a resist-printed surface. And has the effect of preventing contamination due to adhesion.

According to a fifteenth aspect of the present invention, there is provided the method for manufacturing a thermally conductive substrate according to the first or second aspect, wherein a film is adhered to the entire lead frame except for a positioning portion. Has the effect that the surface can be protected.

According to a sixteenth aspect of the present invention, there is provided the method for manufacturing a thermally conductive substrate according to the first or second aspect, wherein the positioning with respect to the portion that needs to be electrically isolated is performed by the attached film. This has the effect of eliminating the need for mechanical positioning means.

According to a seventeenth aspect of the present invention, a connecting frame and a film are removed from a conductive metal plate to which a film is attached by punching from a surface opposite to a surface to which the film is attached to form a lead frame. 3. The method for producing a thermally conductive substrate according to claim 1, wherein burrs due to punching are generated on a film surface side, and at the same time, an adhesive of the film which is provided on a surface to be bonded to the conductive metal plate is also punched. In the direction of the film surface side, and as a result, the above-mentioned adhesive is prevented from entering between the wiring patterns and is filled with the thermosetting resin composition, thereby increasing the formability of the wiring patterns and increasing the airflow. Can smoothly deaerate from between the wiring pattern and the heat conductive sheet made of the thermosetting resin composition, so the heat from the wiring pattern to the metal plate for heat radiation through the heat conductive sheet Guide is enhanced.

Hereinafter, a method of manufacturing a heat conductive substrate according to an embodiment of the present invention will be described with reference to FIGS.

The same reference numerals are given to the components described in the related art, and the detailed description will be simplified.

First, a description will be given of a configuration example of a heat conductive substrate (high heat dissipation substrate) having excellent heat dissipation, which is used for a high power circuit or the like in an electronic device.

In FIG. 6, reference numeral 21 denotes a sheet-shaped thermosetting resin composition. The thermosetting resin composition 21 is composed of, for example, 70 to 95 parts by weight of an inorganic filler and 5 to 30 parts by weight of at least a thermosetting resin, a curing agent and a curing accelerator, and is flexible in a semi-cured or partially cured state. Having a thickness of at least 0.8 to 2 mm, preferably 0.1 to 2 mm.
It is formed by a doctor blade method, a coater method, an extrusion molding method or a rolling method so as to have a thickness of 8 to 1.6 mm.

Reference numeral 22 denotes a circuit forming conductor (lead frame) formed into a predetermined pattern or shape by pressing, etching, laser processing, or the like, and is made of aluminum, copper, silver, iron, or an alloy thereof. At least the upper surface of FIG. 6 of the conductive and heat conductive metal plate is roughened to improve adhesion, and then mounted on the lower surface of FIG. 6 in a later step by printing a solder resist and heat or ultraviolet curing. A predetermined pattern is formed for an electronic component or the like.

Reference numeral 23 denotes a heat-dissipating metal plate which is formed by processing a metal material having excellent thermal conductivity, such as iron, copper, aluminum, anodized aluminum, or an alloy thereof, into a predetermined shape.

Reference numeral 20 denotes a terminal for cutting and removing an unnecessary portion of the circuit forming conductor 22 and for connecting to the outside formed by bending or the like.

Then, a sheet-shaped thermosetting resin composition 21 and a heat-dissipating metal plate 23 are laminated and mounted or adhered on the upper surface of the circuit-forming conductor 22, and after heating and pressing to complete the curing, the terminal is further added. 20 is formed by the above-described method, and a predetermined heat conductive substrate is formed.

Next, an embodiment of a method for manufacturing a heat conductive substrate according to the present invention will be described with reference to FIGS. In FIG. 1, reference numeral 11 denotes a conductive metal plate (substrate) made of aluminum, copper, silver, iron, or an alloy thereof, and having at least one surface roughened to improve adhesion. , 14 are conductive metal plates 11 (base material)
Is a resist which is printed on a predetermined portion of one side and has excellent electrical insulation, heat resistance and chemical resistance.

Reference numeral 13 denotes a processing hole formed by pressing, etching, laser processing, or the like, and a predetermined pattern is processed on the base material 11 to form a lead frame 12 serving as a main body. Reference numeral 15 denotes a solder plating applied on the nickel base plating, which is applied to a predetermined portion of the lead frame 12.

Reference numeral 16 denotes masking provided on the circuit forming portion on the lower surface of the lead frame 12 by pasting a masking film or applying a resist, and 17 denotes a portion formed on the lead frame 12 and requiring electrically independent insulation. This is a connecting bar that mechanically connects the lands.

Reference numeral 18 denotes a film which is made of a resin material which is excellent in heat resistance and chemical resistance and has little change in physical shape, and which can be adhered on one side.

The manufacturing method will be described.
(A) Conductive metal plate 1 serving as lead frame 12 shown in FIG.
On one surface (upper surface) of 1 (substrate), a pattern of a resist 14 is printed at a predetermined position as shown in FIG. 1B, and cured by heat or ultraviolet rays.

Subsequently, as shown in FIG. 1C, a processing hole 13 is provided by press punching, laser processing, or the like to form a lead frame 12 having a terminal portion and a circuit forming portion. Then, as shown in FIG. 1D, after masking 16 is performed on the circuit forming portion on the back surface (the surface on which the resist 14 is not printed) of the lead frame 12, nickel base plating and solder plating 15 are applied to the lead frame 12. Apply to the whole.

Incidentally, the cut surface of the processing hole 13 is also provided with the nickel base plating and the solder plating 15 described above.

Next, as shown in FIG. 1E, after removing the masking 16, processing of a predetermined pattern in the circuit forming portion is performed by the same method as described above. At this time, the punching direction is the surface direction on which the resist 14 is printed, and the connecting bar 17 for mechanically connecting the lands formed on the lead frame 12 and requiring electrically independent insulation is used.
Is also formed at the same time.

Subsequently, as shown in FIG. 2F, a film 18 is attached to the circuit forming portion on the resist printing surface (upper surface) of the lead frame 12. Then, as shown in FIG. 2 (g) and FIG. 2 (j) which is a detailed view of the main part (A part) of FIG. Punch and remove from opposite side.

At this time, the lands, which are parts that need to be electrically isolated independently, are separated from the lead frame 12 of the main body and are separated from each other.

As shown in FIG. 2 (j), burrs due to the punching are generated on the film 18 side, and at the same time, the adhesive of the film 18 on the bonding surface with the lead frame 12 is also removed from the film 18 in the punching direction. It moves to the 18th side.

Next, as shown in FIG. 2 (h), a thermosetting resin composition 21 in a sheet shape or the like and a metal plate 23 for heat radiation are laminated, and a die or a hot press for forming is formed while the film 18 is adhered. It is cured by heating and pressing with a machine and integrated.

At this time, since the adhesive of the film 18 has moved to the film 18 side (the film surface side), as a result, the adhesive is prevented from entering between the wiring patterns and is filled with the thermosetting resin composition 21. As a result, the formality of the wiring pattern is increased. Further, since air can be smoothly degassed from between the wiring pattern and the heat conductive sheet made of the thermosetting resin composition 21, the heat conductivity from the wiring pattern to the metal plate 23 for heat dissipation through the heat conductive sheet is reduced. Will increase.

Subsequently, as shown in FIG. 2 (i), after peeling and removing the film 18, predetermined electronic components and devices are mounted if necessary to complete a predetermined heat conductive substrate. .

Next, another embodiment of the method for manufacturing a heat conductive substrate of the present invention will be described with reference to FIGS. First, one side (upper surface) of a conductive metal plate 11 (base material) serving as a lead frame 12 shown in FIG.
As shown in FIG. 2B, a pattern of the resist 14 is printed at a predetermined position and is cured by heat or ultraviolet rays.

Subsequently, as shown in FIG. 3C, masking 16 was performed on the circuit forming portion on the back surface (the surface on which the resist 14 was not printed) of the conductive metal plate 11 (substrate) to be the lead frame 12. Thereafter, nickel base plating and solder plating 15 are applied to the entire conductive metal plate 11 (base material).

Next, as shown in FIG. 4D, the masking 16 is removed to mechanically connect a predetermined pattern, a terminal portion, and a land, which is a portion that needs to be electrically isolated independently, in the circuit forming portion. The connecting bar 17 is formed by forming a processing hole 13 by press punching or laser processing to form a lead frame 12 having a terminal portion and a circuit forming portion.

The cut surface of the processing hole 13 is not coated with the nickel base plating and the solder plating 15, and the punching direction is the surface direction on which the resist 14 is printed.

Subsequently, as shown in FIG. 3E, a film 18 is attached to a circuit forming portion on the resist printing surface (upper surface) of the lead frame 12. Then, as shown in FIG. 4 (f) and FIG. 4 (i) which is a detailed view of a main part (part B) of FIG. 4 (f), the connecting bar 17 is attached to the surface on which the film 18 is attached together with the film 18. Is punched out from the opposite side and removed.

As described above, the lands, which are parts that need to be electrically isolated independently, are held at predetermined positions by the film 18.

As shown in FIG. 4 (i), burrs due to the punching are generated on the film 18 side, and at the same time, the adhesive of the film 18 on the bonding surface with the lead frame 12 is also removed from the film 18 in the punching direction. It moves to the 18th side.

Next, as shown in FIG. 4 (g), a thermosetting resin composition 21 in a sheet shape or the like and a heat dissipation metal plate 23 are laminated, and a mold or a hot press is formed while the film 18 is adhered. It is cured by heating and pressing with a machine and integrated.

At this time, since the adhesive of the film 18 has moved to the film 18 side (the film surface side), as a result, the adhesive is prevented from entering between the wiring patterns and is filled with the thermosetting resin composition 21. As a result, the formality of the wiring pattern is increased. In addition, since air can be smoothly degassed from between the wiring pattern and the heat conductive sheet made of the thermosetting resin composition 21, the heat conductivity from the wiring pattern to the metal plate 23 for heat dissipation via the heat conductive sheet is reduced. Will increase.

Subsequently, as shown in FIG. 4H, after the film 18 is peeled and removed, if necessary, predetermined electronic components and devices are mounted to complete a predetermined heat conductive substrate. .

If the plating process is also required for the punched cross section of the terminal portion, the method described with reference to FIGS. 1 and 2 is used. If the plating process is not required, the method described with reference to FIGS. You just have to select

FIG. 5 is a plan view showing an example of a lead frame on which a circuit forming portion and a terminal portion are formed.
The land 19, which needs to be electrically insulated, is mechanically connected to the lead frame 12 by the connecting bar 17.

Reference numeral 24 denotes a terminal for connection with the outside in the terminal portion, and 25 denotes two positioning holes provided for forming a heat conductive substrate.

[0065]

As described above, according to the method of manufacturing a heat conductive substrate according to the present invention, a land, which needs to be electrically insulated by a film, a projection or a hole in a mold or a hot press machine. The positioning of the land can be accurately and reliably performed, and the film can prevent contamination or bleeding or adhesion to the land due to melting or flowing of the thermosetting resin composition. Having.

[Brief description of the drawings]

FIGS. 1A to 1E are manufacturing process diagrams illustrating a method for manufacturing a thermally conductive substrate according to an embodiment of the present invention.

FIGS. 2 (f) to (j) are manufacturing process diagrams illustrating a method for manufacturing a thermally conductive substrate according to an embodiment of the present invention.

FIGS. 3A to 3C are manufacturing process diagrams illustrating a method for manufacturing a thermally conductive substrate according to another embodiment.

FIGS. 4D to 4I are manufacturing process diagrams illustrating a method for manufacturing a thermally conductive substrate according to another embodiment.

FIG. 5 is a plan view of a configuration example of the lead frame.

FIG. 6 is a side sectional view of a configuration example of the heat conductive substrate (high heat dissipation substrate).

7A and 7B are a side sectional view and a plan view for explaining a conventional method for manufacturing a heat conductive substrate.

[Explanation of symbols]

 1,21 Thermosetting resin composition 2,12,22 Conductor for circuit formation (lead frame) 3 Protrusion 4 Hole 5 Upper pressing body 6 Lower pressing body 11 Conductive metal plate (base material) 13 Processing hole 14 Resist 15 Solder plating 16 Masking 17 Connecting bar 18 Film 19 Land 23 Metal plate for heat dissipation 24 Terminal 25 Positioning hole

Continued on the front page (72) Inventor Tsuneaki Miyaoka 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (17)

[Claims] After forming a terminal portion and a circuit forming portion on a conductive metal plate having a pattern formed by a resist,
The circuit forming portion is subjected to a plating process by masking, subsequently removing the masking, performing a predetermined pattern processing of a connecting bar and a circuit forming portion that mechanically connects a necessary portion of the electrically independent insulation, and After affixing the film on the resist printing surface, the connecting bar is punched and removed together with the film to form a lead frame, and a thermosetting resin composition or a thermosetting resin composition and a metal plate for heat radiation are formed on the circuit forming portion of the lead frame. A method for manufacturing a heat conductive substrate, which is formed by laminating and curing by heating and pressing. 2. A circuit forming portion of a conductive metal plate on which a pattern is formed by a resist is subjected to a plating process by performing masking, and subsequently, the masking is removed, and the terminal portion, a portion which needs to be electrically independent insulated, is machined. The method according to claim 1, wherein a lead frame is formed by processing a predetermined pattern of a connecting bar and a circuit forming portion to be electrically connected. 3. An inorganic filler of 70 to 95 parts by weight,
3. A sheet-shaped thermosetting resin composition comprising 5 to 30 parts by weight of at least a thermosetting resin, a curing agent and a curing accelerator and having flexibility in a semi-cured or partially cured state. 3. The method for producing a thermally conductive substrate according to item 1. 4. The method for producing a thermally conductive substrate according to claim 1, wherein masking is performed by applying a masking film or applying a resist. 5. After affixing the film to the resist printing surface, the connecting bar is punched and removed together with the film, and then the thermosetting resin composition or the thermosetting resin composition and the heat radiation are formed on the circuit forming portion of the lead frame from which the film has been removed. The method for producing a thermally conductive substrate according to claim 1 or 2, wherein the metal plates are laminated and cured by heating and pressing. 6. The method for manufacturing a thermally conductive substrate according to claim 1, wherein the lead frame is formed by pressing, etching, or laser processing the conductive metal plate. 7. A lead frame and a thermosetting resin composition or a thermosetting resin composition and a heat-dissipating metal plate are laminated by a forming die or a hot press machine, and heated and pressed to be cured. 3. The method for producing a thermally conductive substrate according to item 2. 8. The method for producing a thermally conductive substrate according to claim 1, wherein a plating process is performed by nickel plating and solder plating. 9. The method according to claim 1, wherein copper or an alloy thereof is used as the conductive metal plate. 10. The circuit forming portion according to claim 1, wherein plating is applied to the entire lead frame without masking the circuit forming portion, and plating of the circuit forming portion is removed by blasting.
3. The method for producing a thermally conductive substrate according to item 1. 11. A resist pattern is formed on a conductive metal plate having a terminal portion processed and formed in advance.
Alternatively, the method for producing a heat conductive substrate according to 2. 12. The method for manufacturing a heat conductive substrate according to claim 1, wherein the direction of the punching process on the conductive metal plate is the resist printing surface side. 13. The method for producing a heat conductive substrate according to claim 1, wherein a conductive metal plate having at least one surface roughened is used. 14. The method for producing a thermally conductive substrate according to claim 1, wherein a film is attached to a resist printing surface. 15. The method according to claim 1, wherein a film is attached to the entire lead frame except for the positioning portion. 16. The method for manufacturing a heat conductive substrate according to claim 1, wherein the positioning with respect to a portion requiring electrically independent insulation is performed by using an attached film. 17. The heat-generating device according to claim 1, wherein the connecting frame and the film are removed from the surface of the conductive metal plate to which the film is attached by punching from the surface opposite to the surface to which the film is attached, thereby forming a lead frame. A method for manufacturing a conductive substrate.