JP2002231848A - Lid for sealing electronic components with adhesive, and package for sealing electronic components - Google Patents

Abstract

(57) [Summary] [PROBLEMS] A lid material for sealing an electronic component with an adhesive and an electronic component seal capable of detecting a sealing failure between a package body and a lid material before mounting on a wiring board or the like. Provide a stop package. SOLUTION: An electronic component sealing lid material 10 with an adhesive according to the present invention is characterized in that a coloring adhesive 30 is formed on a joining surface of an electronic component sealing lid material 11 to be joined to a package body. And Further, the electronic component sealing package of the present invention is characterized in that the package body and the electronic component sealing cover material 11 are hermetically bonded via a colored adhesive 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component with an adhesive suitable for hermetically sealing a package body for accommodating electronic components such as a solid-state imaging device, a quartz oscillator, a light emitting device, and a light receiving device. The present invention relates to an electronic component sealing package obtained by airtightly joining an electronic component sealing lid material to a package body accommodating an electronic component element and an electronic component element.

[0002]

2. Description of the Related Art Conventionally, a solid-state imaging device, a quartz oscillator,
After housing electronic component elements such as a light emitting element and a light receiving element in a box-shaped package body having an opening, a lid material (a lid material for electronic component sealing) is hermetically bonded to an end of the package body on the opening side. By doing so, an electronic component element is housed in a package (package for electronic component sealing) including a package body and a lid member. As a method of airtightly joining the package body and the lid member, for example, after placing the lid member on the package body via a thermosetting adhesive, the package body and the lid member are externally pressurized (compression bonding). ), A method is known in which the package body and the lid member are hermetically bonded by heating and curing the adhesive.

[0003]

According to the above-mentioned joining method, the adhesive is once melted and then cured by heating. However, since the adhesive is pressed by the package body and the lid material, the package body and the lid material are hardened. It is possible to form an adhesive without any gaps between them. However, the pressure when pressing the package body and the lid member may become uneven, and as a result, the thickness and width of the adhesive formed between the package body and the lid member may become uneven. was there.

FIG. 5 shows an example of a package in which an adhesive having a non-uniform thickness and width is formed between a package body and a lid member. FIG. 5 is a schematic cross-sectional view showing a state in which a package is formed by hermetically bonding a lid member 200 to the package body 100 via an adhesive 300, and is cut in a direction substantially perpendicular to the plate surface of the lid member 200. It is sectional drawing at the time. In the package shown in FIG.
Since the pressure at the time of bonding with 0 was uneven, a difference occurred in the spread of the adhesive 300 in the horizontal direction in the figure, and as a result, the bonding formed on the right side of the figure with the adhesive 300 formed on the left side of the figure. The thickness of the agent 300 is large and the width thereof is small, and the lid member 200 is inclined and joined to a joint surface of the package body 100 to be joined to the lid member 200. Also,
The adhesive 300 formed on the left side of the drawing has a part (the right end in the drawing) of which the electronic component storage chamber 12 stores the electronic component element.
It is formed so as to protrude to zero.

As shown in FIG. 5, in a package in which an adhesive having a nonuniform thickness and width is formed between a package body and a lid member, a bonding surface between the package body and the lid member is
In some cases, a portion where the adhesive is not sufficiently formed (for example, a portion indicated by reference numeral a in FIG. 5) occurs, and the adhesion between the package body and the lid member may be reduced. Therefore, when a package containing electronic component elements is surface-mounted on a wiring board or the like, the package is immersed in a high-temperature solder bath, and solder is attached to terminals (not shown) attached to the package. Etc. are implemented directly,
In a package having a part where the adhesive is not sufficiently formed, the package body and the lid member may be partially peeled off at the time of mounting, and the internal airtightness may be reduced. If the package body and the lid material are partially peeled off during mounting on a wiring board or the like, the wiring board itself becomes defective, reducing the production efficiency of the wiring board and increasing the production cost. There was a problem.

In the case where the electronic component elements to be housed are optical elements such as a solid-state image sensor, a light emitting element, and a light receiving element, light is applied to the electronic component elements housed in the electronic component housing room from the lid material side. As shown in FIG. 5, when the adhesive protrudes into the electronic component storage chamber, the light incident from the lid material side protrudes into the electronic component storage chamber as shown in FIG. And the function of the electronic component element is hindered by the scattered light, and the performance of the electronic component element may be degraded.

To solve such a problem, attempts have been made to examine the composition of the adhesive to prevent peeling of the package body from the lid and to prevent the adhesive from protruding into the electronic component storage room. , Yet, no solution. Therefore, the present invention has been made in view of such circumstances, and before mounting on a wiring board or the like, it is possible to detect a sealing failure between a package body and a lid member, and to seal an electronic component with an adhesive. An object of the present invention is to provide a lid material for stopping and a package for sealing electronic components.

[0008]

According to the present invention, there is provided a cover for electronic parts with an adhesive according to the present invention, wherein the cover for electronic parts for hermetically sealing a package body accommodating an electronic part is provided. It is characterized in that a colored adhesive is formed on a joint surface to be joined to the main body. In this specification, “colored adhesive” means “colored and colored adhesive”.

The electronic component encapsulating lid material of the present invention has a structure in which a colored adhesive is formed on the joining surface of the electronic component encapsulating lid material that joins the package body. An electronic component sealing package accommodating an electronic component element can be obtained by hermetically joining the electronic component sealing lid material and the package body via a coloring adhesive formed in advance on the cover material. . In the electronic component sealing package thus obtained, a colored adhesive (colored adhesive) is provided between the package body and the lid member.
Is formed, the thickness and width of the adhesive can be optically measured using an optical sensor or the like, and a portion where the adhesive is not sufficiently formed can be detected as a sealing failure. .

Since the package body is generally made of a non-translucent ceramic or the like, if the electronic component sealing cover does not have translucency, the adhesive is exposed on the outermost surface of the package. The optical inspection can be performed only from the side of the package (that is, the side surface of the package), and only the thickness of the adhesive exposed at the outermost surface of the package can be measured. On the other hand, when the electronic component sealing lid material has a light-transmitting property, the optical inspection can be performed not only from the side surface of the package but also from the lid material side. It is possible to measure both widths. Therefore, it is desirable that the lid for electronic component sealing has translucency. With such a configuration, after preparing the package for electronic component sealing, both the thickness and the width of the adhesive are measured. Therefore, a portion where the adhesive is not sufficiently formed can be detected with higher accuracy.

When the electronic component element to be housed is an optical element, the electronic component sealing lid has a light transmitting property. By performing an optical inspection using a sensor or the like, it is possible to detect a portion formed by the adhesive protruding into the electronic component storage chamber as a sealing failure.

As described above, according to the present invention, it is possible to quickly and accurately detect a sealing failure between a package body and a cover member before mounting on a wiring board or the like. Therefore, it is possible to prevent the wiring board and the like from becoming defective, and when the optical element is housed as the electronic component element, it is possible to prevent performance degradation of the electronic component element due to scattered light inside the package. it can.

If the colored adhesive and the lid for sealing electronic components are of the same color, it is difficult to distinguish the colored adhesive from the lid by an optical sensor or the like, and the sealing between the package body and the lid is difficult. There is a possibility that the detection accuracy of the stop failure may decrease. Therefore, it is desirable that the colored adhesive and the cover for electronic component sealing have different colors, and by adopting such a configuration, it is possible to accurately detect a sealing failure between the package body and the cover. .

Further, when the electronic component element to be stored is an optical element, even if the electronic component sealing package formed by sticking out the adhesive into the electronic component storage chamber is mounted on a wiring board or the like, Since the adhesive is colored, light scattering on the surface of the adhesive can be reduced, and a decrease in performance of the electronic component element can be prevented.

By using the above-mentioned lid material for sealing electronic parts with an adhesive of the present invention, the following package for sealing electronic parts of the present invention can be provided. An electronic component encapsulating package according to the present invention is an electronic component encapsulating package in which an electronic component enclosing a package main body is sealed with an electronic component encapsulating lid, wherein the package main body and the electronic component encapsulating lid are provided. The material is air-tightly bonded via a colored adhesive.

According to the electronic component sealing package of the present invention, the same effect as the above-mentioned electronic component sealing lid material with adhesive of the present invention can be obtained. That is, according to the electronic component sealing package of the present invention, since the package body and the lid member are air-tightly joined via the colored adhesive, the package body and the lid member are mounted before being mounted on a wiring board or the like. In addition to being able to quickly and accurately detect sealing failure with the package, it is possible to reduce scattered light inside the package, prevent a wiring board or the like from becoming defective, and use an optical element as an electronic component element. When the device is housed, it is possible to prevent performance degradation of the electronic component device due to scattered light inside the package.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a cover material for sealing an electronic component with an adhesive and a package for sealing an electronic component according to an embodiment of the present invention will be described in detail.

[Lid for Sealing Electronic Parts with Adhesive] FIG.
Based on FIG. 2, the structure of the lid for sealing electronic components with an adhesive of this embodiment and the structure of the package body to which the lid for sealing electronic components with an adhesive is attached will be described. FIG.
FIG. 2 is a schematic perspective view showing the structure of an electronic component-sealing lid with adhesive and a package body. FIG. 2 is a diagram in which the electronic component-sealing lid with adhesive shown in FIG. FIG. 4 is a schematic perspective view when viewed from a side where the package body is mounted.

The package body 20 is made of ceramics such as aluminum oxide (alumina), aluminum nitride, silicon nitride, zirconium, mullite, stearite, silicon carbide or the like, silicon, epoxy resin or the like. As shown in FIG. It has an electronic component storage chamber 21 in which an upper end in the drawing is open, which can store elements.

On the other hand, as shown in FIG. 1 and FIG. 2, the lid 10 for sealing electronic parts with an adhesive of the present embodiment is the same as the lid 11 for sealing electronic parts with the colored adhesive formed on its plate surface. Agent 30. The electronic component sealing lid member 11 is attached to the opening side end (upper end in the figure) of the package main body 20 to seal the opening of the package main body 20, and as shown in FIG. The outer shape of the sealing lid 11 and the upper end of the package body 20 are configured to be substantially the same shape. FIGS. 1 and 2 illustrate, as an example, a case where the package body 20 has a substantially rectangular box shape at the bottom and upper ends, and the electronic component sealing lid material 11 has a substantially rectangular shape. However, the invention is not limited to these shapes.

More specifically, as shown in FIG. 2, a substantially circular colored adhesive 30 is formed on the periphery of the surface of the electronic component sealing lid 11 on the side to be joined to the package body 20. . Further, the coloring adhesive 30 is located on the joining surface 20 a of the upper end of the package main body 20 with the electronic component sealing lid 11 when joining the electronic component sealing lid 10 with the adhesive to the package main body 20. As shown in FIG.
It is formed at a predetermined position on one plate surface.

The colored adhesive 30 may be formed annularly around the periphery of the electronic component sealing lid 11 without any gap. However, when the electronic component sealing lid 11 is joined to the package body 20, As shown in FIG. 2, it is preferable to provide a gap 31 in a part of the colored adhesive 30 on the surface of the lid 11 for sealing electronic components in order to easily release air from the package body 20. . The gap 31 is very small. When the package body 20 and the electronic component encapsulating lid 11 are joined, the colored adhesive 30 is melted and spread, and the gap 31 is adjacent to the gap 31. The gap 31 disappears because the colored adhesive 30 is connected.

The thickness of the colored adhesive 30 formed on the electronic component sealing lid 11 is preferably 20 to 300 μm, and 50 to 300 μm.
200 μm is more preferred. The thickness of the colored adhesive 30 is 2
If the thickness is less than 0 μm, a gap may be formed between the package body 20 and the electronic component sealing lid 11 when the package main body 20 and the electronic component sealing lid 11 are joined via the colored adhesive 30. When it exceeds 300 μm,
When the package body 20 and the electronic component sealing lid material 11 are joined via the colored adhesive 30, the colored adhesive 30 is prone to protrude into the electronic component storage chamber 21 and is not preferable.

Hereinafter, the structure of the electronic component sealing lid 11 constituting the electronic component sealing lid 10 of the present invention, the composition of the colored adhesive 30, etc., and the electronic component sealing lid 11 will be described. A method of forming the colored adhesive 30 having the above-described pattern on the plate surface will be described in detail.

(Electronic Component Sealing Lid) The electronic component encapsulating lid 11 constituting the electronic component sealing lid 10 of the present invention is made of, for example, ceramics such as alumina, quartz glass, and soda. It is made of glass, glass such as borosilicate glass, hard resin such as acrylic resin, and the like, but the present invention is not limited to these, and may be made of any material. However, it is preferable that the electronic component sealing lid member 11 is made of a light-transmitting material (specifically, glass, a transparent resin such as an acrylic resin, or the like).

(Coloring Adhesive) As the coloring adhesive 30 formed on the electronic component sealing lid 11, any kind of adhesive containing a coloring agent may be used. Curable, photo-curable, natural-curable adhesives and the like can be used. Among them, a thermosetting adhesive is particularly preferable, so that the case where the coloring adhesive 30 formed on the electronic component encapsulating lid 11 is a thermosetting adhesive will be described below, and its preparation method and composition will be described. explain.

A curing agent, a coloring agent, and a filler, if necessary, are added to a thermosetting resin as a main component, and these materials are dissolved or dispersed in a solvent to form a thermosetting coloring adhesive 30. Can be prepared. In addition, as a method of dissolving or dispersing the thermosetting resin, the colorant, and the like in a solvent, a method of kneading these materials using a ball mill, three rolls, or the like can be used.

As the thermosetting resin, known thermosetting resins can be used. Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, phenol novolak type epoxy resin And cresol novolak type epoxy resins, and one or more of these resins can be used.

As the curing agent, known curing agents can be used, and examples thereof include amine compounds such as imidazole and dicyandiamide, aromatic acid anhydrides, and aliphatic acid anhydrides.

As the coloring agent, known coloring agents can be used, and examples thereof include carbon black, inorganic pigments, organic pigments, dyes and extender pigments. In particular,
ZnO, TiO2, 2PbCO3.P as inorganic pigments
b (OH) 2, white pigment such as ZnS / BaSO4 mixture, PbCrO4, CdS / ZnO mixture, K3 [C
o (NO2) 6], PbCrO4 / PbS
Yellow pigment such as O4 / PbMoO4 mixture, CdS / Cd
Red pigments such as Se mixture, Fe2O3, Pb3O4, K
Fe [Fe (CN) 6], NaFe [Fe (CN)
6], a blue pigment such as NH4Fe [Fe (CN) 6], C
oO / ZnO mixture, green pigment such as Cr2O3, Fe
Examples thereof include black pigments such as 3O4.

Examples of organic pigments include azo, anthraquinone, quinacridone red and orange pigments, purple pigments such as triphenylmethane lake, blue pigments such as phthalocyanine and triphenylmethane lakes, phthalocyanine and anthraquinone pigments. And the like. Examples of the dye include a violet dye such as an oxazine dye and an anthraquinone dye, a blue dye such as an indanthrone dye and an anthraquinone dye, and a black dye such as diamond black which is an oxidized condensate of aniline. Examples of the extender include calcium carbonate, barium sulfate, aluminum hydroxide, barite powder, aluminum powder, bronze powder and the like.

As the filler to be added as required, known fillers can be used, and inorganic powders such as silica, quartz powder, alumina, calcium carbonate, and magnesium oxide are preferably used, but they have a filling function. Organic powders may be used as long as they are fine.

(Method of Forming Colored Adhesive on Electronic Component Sealing Lid) Next, a method of forming the colored adhesive 30 on the surface of the electronic component sealing lid 11 will be described. After applying the colored adhesive 30 having a desired pattern to the plate surface of the electronic component sealing lid 11 by a method such as a dispense method, a screen printing method, a transfer method, etc., and drying or semi-curing, the electronic component sealing lid The colored adhesive 30 having the pattern shown in FIG. 2 can be formed on the surface of the lid 11. In addition, the colored adhesive 3 having a desired pattern is provided on the surface of the electronic component sealing lid 11.
The method of applying 0 is not limited to the method described above, and any method may be employed as long as dimensional accuracy, shape pattern, and the like can be controlled. Examples of a method for drying or semi-curing the colored adhesive 30 applied to the surface of the electronic component sealing lid 11 include natural drying, heat drying, reduced pressure drying, and reduced pressure heating drying.

In the dispensing method, a cylinder filled with a coloring adhesive is mounted on a dispenser, and the electronic component sealing lid 11 is moved relative to the discharge port of the dispenser. By applying a coloring adhesive to a predetermined position on the plate surface of the closing lid material 11, a desired pattern of the coloring adhesive 30 is applied to the surface of the electronic component sealing lid material 11.
Is a method that can be applied.

In the screen printing method, the coloring adhesive is supplied onto the screen printing plate on which the pattern of the coloring adhesive 30 is formed, and the squeegee is moved on the screen printing plate while being pressed against the electronic component sealing lid 11. This is a method by which the colored adhesive 30 having a desired pattern can be applied to the surface of the electronic component sealing lid 11.

In the transfer method, a desired pattern of a colored adhesive is applied to the surface of a release sheet by screen printing or the like, and then the colored adhesive is transferred to the surface of the electronic component sealing lid 11 to obtain an electronic component. This is a method in which a colored adhesive 30 having a desired pattern can be applied to the plate surface of the component sealing lid 11. Examples of the release sheet include a polyethylene terephthalate film, a polypropylene film, a fluororesin film, a release-treated paper, and the like, which are coated with a silicone resin or the like and have a releasing property.

[Electronic Component Sealing Package] The electronic component sealing cover 10 of the present embodiment shown in FIG. A package 50 can be provided. FIG. 3 shows an electronic component sealing package 5 of the present embodiment.
0 is a schematic cross-sectional view when the electronic component sealing cover 11 is cut in a direction perpendicular to the plate surface.

As shown in FIG. 3, an electronic component sealing package 50 according to the present embodiment has a package body 20 and an electronic component sealing lid material 11 which are hermetically bonded via a colored adhesive 30. It is. In the actual manufacturing process, after an electronic component element (not shown) is stored in the electronic component storage chamber 21 of the package main body 20, the electronic component sealing lid 11 is joined to the upper end of the package main body 20.

Hereinafter, a method of joining the package body 20 and the lid 11 for sealing electronic components will be described by taking as an example the case where the coloring adhesive 30 is a thermosetting type. Colored adhesive 30
Is a thermosetting adhesive, the package main body 20 is placed such that the colored adhesive 30 is on the package main body 20 side.
After placing the electronic component sealing lid material 10 with the adhesive thereon,
The package body 20 and the electronic component sealing lid 11 are heated while being pressed (compressed) from the outside while the coloring adhesive 30 is cured, so that the electronic component sealing lid 11 and the package main body 20 are hermetically sealed. Can be joined. According to this method, the colored adhesive 30 is once melted and then cured by heating. However, since the colored adhesive 30 is pressed by the package body 20 and the lid 11 for sealing electronic components, the colored adhesive 30 is It is possible to form the colored adhesive 30 without any gap between the component sealing lid 11 and the component sealing lid 11.

[Method of Detecting Insufficiency of Sealing] By the way, when the package body 20 and the lid 10 for sealing electronic parts with an adhesive are joined to prepare the package 50 for sealing electronic parts, The pressure for pressurizing the lid 11 may be non-uniform. As a result, for example, as shown in FIG.
In some cases, the thickness and width of the colored adhesive 30 formed between them may be non-uniform. In the electronic component sealing package 50 shown in FIG. 4, the thickness of the colored adhesive 30 formed on the right side of the drawing is smaller and larger than that of the colored adhesive 30 formed on the left side of the drawing. Lid material 1
The cover member 11 is inclined and joined to a joint surface 20a to be joined to the cover member 1.

In FIG. 4, the thickness and width of the colored adhesive 30 are exaggerated in order to explain the non-uniformity. However, in actuality, the package body 20 and the lid member 11 are formed between them. The colored adhesive 30 to be formed is very fine, and the thickness and width of the colored adhesive 30 vary very little. Then, the colored adhesive 30 formed between the package body 20 and the lid member 11 as described above.
When the thickness and width of the colored adhesive 30 are not uniform, sealing is performed at a portion A where the colored adhesive 30 is not sufficiently formed or at a portion B where the colored adhesive 30 is formed to protrude into the electronic component storage chamber 21. Failure may occur.

The electronic component sealing package 5 of the present embodiment.
0, a colored adhesive (colored adhesive) 30 is formed between the package body 20 and the lid member 11,
By performing an optical inspection using an optical sensor or the like, a portion A where the colored adhesive 30 is not sufficiently formed is obtained.
In addition, it is possible to detect a defective sealing at a portion B or the like formed by the colored adhesive 30 protruding into the electronic component storage chamber 21.

Hereinafter, an example of a method for detecting a sealing failure will be described with reference to the electronic component sealing package 50 shown in FIG. Side 2 present on all sides of package body 20
By performing an inspection using an optical sensor or the like from the 0b side, the thickness of the portion where the colored adhesive 30 is exposed on the outermost surface can be measured. Utilizing this, for example, the thickness T1 of the colored adhesive 30 formed on the left side of the drawing and the thickness T2 of the colored adhesive 30 formed on the right side of the drawing are measured, and the thickness T2 of the colored adhesive 30 formed on the right side of the drawing is measured. By automatically determining whether or not this difference belongs to the set range using a computer or the like, it is possible to inspect whether or not the thickness of the colored adhesive 30 belongs to the set range. The case where it does not belong can be detected as a sealing failure.

When the electronic component encapsulating lid 11 is translucent, the inspection can be performed from the lid 11 side using an optical sensor or the like. Thirty widths can also be measured. Utilizing this, for example, the width W1 of the colored adhesive 30 formed on the left side in the figure and the width W2 of the colored adhesive 30 formed on the right side in the figure
To determine whether or not the color adhesive 30 is formed with a sufficient width by automatically determining, using a computer or the like, whether or not these W1 and W2 are equal to or greater than the set lower limit. And the case where it is less than the set lower limit can be detected as sealing failure.

By any of the above methods or a combination of these methods, it is possible to quickly and accurately detect a portion A where the colored adhesive 30 is not sufficiently formed as a sealing defect. In particular, when the electronic component sealing lid material 11 has a light transmitting property, the coloring adhesive 30
Can measure both the thickness and the width, so that the portion A where the colored adhesive 30 is not sufficiently formed can be detected with higher accuracy.

When the electronic component element to be housed is an optical element, an inspection is performed from the side of the light-transmitting lid member 11 using an optical sensor or the like, so that the colored adhesive 30
However, the portion B protruding into the electronic component storage chamber 21 can be detected quickly and accurately as a sealing failure.

If the colored adhesive 30 and the electronic component sealing lid 11 are of the same color, it becomes difficult to distinguish the colored adhesive 30 and the electronic component sealing lid 11 by an optical sensor or the like. In addition, the detection accuracy of the sealing failure between the package body 20 and the lid member 11 may be reduced. Therefore, it is desirable that the colored adhesive 30 and the electronic component sealing lid material 11 have different colors.
Insufficient sealing between the package body 20 and the lid member 11 can be accurately detected.

As described above, the lid 10 for sealing the electronic component with the adhesive according to the present embodiment is the same as the lid 1 for sealing the electronic component.
1 has a structure in which the colored adhesive 30 is formed on the joining surface that is joined to the package body 20, so that the electronic component sealing lid is formed via the colored adhesive 30 formed in advance on the electronic component sealing lid 11. By joining the material 11 and the package body 20 in an airtight manner, the electronic component sealing package 50 of the present embodiment that houses the electronic component elements can be obtained.

In the thus obtained electronic component encapsulating package 50 of the present embodiment, a colored adhesive (colored adhesive) 30 is formed between the package body 20 and the lid member 11. Therefore, the thickness and width of the adhesive 30 can be optically measured using an optical sensor or the like, and a portion A where the adhesive 30 is not sufficiently formed can be detected as a sealing failure. When the electronic component element to be stored is an optical element, the adhesive 30 is protruded into the electronic component storage chamber 21 by performing an inspection using an optical sensor or the like from the light-transmitting lid member 11 side. The formed portion B can be optically detected as a sealing failure.

As a result, before mounting on the wiring board or the like, it is possible to quickly and accurately detect a sealing failure between the package body 20 and the lid member 11 and mount only a good product. Can be prevented, and when an optical element is housed as an electronic component element, performance degradation of the electronic component element due to scattered light inside the package 50 can be prevented.

If the electronic component element to be stored is an optical element, the electronic component sealing package 50 formed by protruding the colored adhesive 30 into the electronic component storage chamber 21 is mounted on a wiring board or the like. Even so, since the adhesive 30 is colored, light scattering on the surface of the adhesive 30 can be reduced, and a decrease in performance of the electronic component element can be prevented.

[0052]

Next, examples according to the present invention and comparative examples will be described. Example 1 100 parts by weight of a bisphenol A type epoxy resin was dissolved in 100 parts by weight of methyl ethyl ketone, 4 parts by weight of 2-phenyl-4,5-dihydroxymethylimidazole was added as a curing agent, and a phthalocyanine pigment was further used as a coloring agent. By adding 5 parts by weight, stirring and dispersing, a blue colored adhesive was obtained. Next, a borosilicate glass plate having a size of 8 × 8 mm square and a thickness of 3 mm was used as a lid material.
After preparing 0 pieces, the above-mentioned colored adhesive was applied to the peripheral portion of each lid material by a dispensing method, and then heated and semi-cured to obtain a lid material for sealing electronic parts with an adhesive of the present invention.

Next, the material is alumina ceramics, the opening size is 8 × 8 mm, and the volume of the electronic component storage chamber is 0.96.
Prepare 1000 package bodies of cm ³ , and use the automatic sealing device, apply the above-mentioned adhesives for sealing electronic components with the adhesive to the package body side at the opening side end of each package body. After being mounted as described above, the adhesive was cured by heating at 150 ° C. for 3 hours while applying a load of 98 kPa to obtain an electronic component sealing package of the present invention.

Using the optical sensor from the side of the package body, the thickness of the adhesive exposed at the outermost surface was measured for the 1000 electronic component sealing packages obtained as described above. The difference between the maximum and minimum thickness is 10
Those having a thickness of not less than μm were detected as defective sealing. As a result, three adhesives whose difference between the maximum thickness and the minimum thickness of the adhesive was 10 μm or more could be identified.

Next, the resulting 1000 electronic component sealing packages were immersed in a solder bath at 265 ° C. for 10 seconds 10 times, and then subjected to a gross leak test (12).
A test was performed in which the package was immersed in an inert liquid at 0 ° C. (trade name “Fluorinert” manufactured by Sumitomo 3M Limited) to check for leaks. As a result, it was found that only the three packages detected as defective sealing had partial peeling between the package body and the lid member.

(Example 2) A white colored adhesive was obtained in the same manner as in Example 1 except that TiO2 was used as a coloring agent. Component Sealing Lid and Electronic Component Sealing Package 10
00 were obtained. Next, when the sealing failure was detected in the same manner as in Example 1, the difference between the maximum thickness and the minimum thickness of the adhesive was 10 μm.
The above five items could be identified. Next, in the same manner as in Example 1, a gross leak test was performed after immersion in a solder bath, and only the above-mentioned five packages detected as defective sealing were partially interposed between the package body and the lid member. It was found that serious peeling occurred.

(Comparative Example) An adhesive was obtained in the same manner as in Example 1 except that no coloring agent was used, and then a lid material for sealing an electronic component with an adhesive and an electronic component were sealed in the same manner as in Example 1. 1000 stop packages were obtained. The color of the cured adhesive was colorless and transparent. Next, detection of a sealing failure was attempted in the same manner as in Example 1, but it was not possible to identify an adhesive having a difference between the maximum thickness and the minimum thickness of the adhesive of 10 μm or more.
Next, as in Example 1, a gross leak test was performed after immersion in a solder bath. As a result, partial peeling occurred between the package body and the lid member in six of the 1,000 packages. Turned out to be.

From the results of Examples 1 and 2 and Comparative Example, by using a colored adhesive, it is possible to immerse the electronic component sealing package in a solder bath (before mounting it on a wiring board or the like),
It turned out that the sealing failure can be easily detected.

[0059]

As described above in detail, according to the lid for sealing electronic parts with an adhesive and the package for sealing electronic parts of the present invention, the adhesive for joining the package body and the lid is colored. Before mounting on a wiring board etc., the part where the adhesive is not sufficiently formed or the part where the adhesive protrudes into the electronic component storage room before mounting on the wiring board etc. And prevent the wiring board and the like from becoming defective, and when an optical element is housed as an electronic component element, the performance of the electronic component element is degraded due to scattered light inside the package. Can be prevented. In addition, when the electronic component element to be stored is an optical element, even if the electronic component sealing package formed by sticking out the adhesive into the electronic component storage chamber is mounted on a wiring board or the like, the adhesive is not removed. Because of being colored, light scattering on the surface of the adhesive can be reduced, and performance degradation of the electronic component element can be prevented.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a structure of an electronic component sealing lid material with an adhesive and a package body according to an embodiment of the present invention.

FIG. 2 is a schematic perspective view showing the structure of an electronic component sealing lid material with an adhesive according to an embodiment of the present invention.

FIG. 3 is a schematic sectional view showing the structure of an electronic component sealing package according to an embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view for explaining a method of detecting a sealing failure of an electronic component sealing package in the embodiment according to the present invention.

FIG. 5 is a schematic cross-sectional view showing an example of sealing failure in a conventional electronic component sealing package.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 lid material for sealing electronic components with adhesive 11 lid material for sealing electronic components 30 colored adhesive 20 package body 21 electronic component storage room 50 package for sealing electronic components

Claims (4)

[Claims] 1. A colored adhesive is formed on a joint surface of an electronic component sealing lid member for hermetically sealing a package main body containing an electronic component element, the joining surface being joined to the package main body. Lid for sealing electronic components with adhesive. 2. The electronic component sealing lid according to claim 1, wherein the colored adhesive and the electronic component sealing lid have different colors. 3. The lid material for sealing an electronic component with an adhesive according to claim 1, wherein the lid material for sealing an electronic component has a light-transmitting property. 4. An electronic component sealing package in which a package main body for housing an electronic component element is sealed with an electronic component sealing lid, wherein the package main body and the electronic component sealing lid are colored adhesive. A package for sealing electronic components, which is hermetically bonded via a seal.