JP2002231668A - Slurry transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent cogging in a valve due to the deposition of liberation abrasive grain by a slurry transfer device, and to enhance durability in the valve. SOLUTION: Pinch valves V1 and V2 are arranged in the slurry channel. Even if the slurry containing the liberation abrasive grain flows, liquid cannot be collected easily in the inner channel of the valve casing, thus preventing clogging in the valve due to the deposition of the liberation abrasive grain in the liquid reservoir or the like. Especially, since the sleeve of the pinch valve is made of a copolymerization elastomer of tetrafluoroethylene resin and silicone rubber, the liberation abrasive grain cannot easily adhere onto the inner- periphery surface, even if the slurry is made to flow. Additionally, durability of the sleeve is superior, thus prolonging the life time of the valve, and enabling the slurry transfer device to be applied to a slurry supply pipe for the polishing device of a semiconductor wafer, CMP, a substrate-polishing device for liquid crystal, or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slurry transfer device, and more particularly, to a slurry transfer device which is less likely to cause clogging in a valve portion when transferring highly viscous slurry used for wafer polishing or the like.

[0002]

2. Description of the Related Art Etched silicon wafers are:
In the next polishing step, the surface is subjected to mechanical and chemical polishing. Here, a polishing apparatus is used to finish the surface of the wafer to a smooth and non-distorted mirror surface. 2. Description of the Related Art Conventionally, as one type of polishing apparatus, a single wafer type wafer polishing apparatus for polishing a surface of a silicon wafer one by one has been known. This single wafer type wafer polishing apparatus has a polishing platen on which a polishing cloth is spread on an upper surface, a polishing head arranged opposite to and above the polishing platen, and is detachably attached to the polishing head. And a disc-shaped carrier plate to which the silicon wafer is attached. At the time of single wafer polishing of a silicon wafer, an abrasive (slurry) containing free abrasive grains such as colloidal silica (silica sol) is supplied onto a polishing cloth through a nozzle by a slurry supply device, and the polishing cloth and the silicon wafer are separated. One silicon wafer is polished by applying a predetermined load and a relative speed therebetween.

[0003] The abrasive in the circulation tank provided in the slurry supply device is pressure-fed to the nozzle by the operation of a slurry pump connected to a slurry supply pipe. Usually, a valve for opening and closing the flow path of the slurry supply pipe is provided in the middle of the slurry supply pipe. A conventional valve is a diaphragm type valve in which an internal flow path formed inside a valve box is closed by an elastic rubber diaphragm (valve element). This internal flow path is generally formed through a partial flow path on the inflow side and a valve seat having an opening formed therein.
The downstream portion of the inflow-side partial flow path is divided into two outflow-side partial flow paths that are communicated at substantially right angles. When the slurry supply pipe is closed, the valve shaft rotatably supported on the upper part of the valve box is rotated, and the center of the diaphragm is elastically returned by the valve shaft so as to be elastically returned. By closing the opening of the valve seat with, this internal flow path is closed.

[0004]

By the way, in a conventional slurry supply apparatus, a diaphragm valve is employed as a valve for closing a flow path of a slurry supply pipe. Therefore, there were the following problems. That is, in the case of the diaphragm valve, the shape of the internal flow path is complicated, and the liquid pool of the abrasive tends to appear in the middle of the internal flow path. As a result, there is a concern that free abrasive grains contained in the abrasive are deposited in such a liquid pool portion and solidified to block the valve.

Therefore, the inventor of the present invention has conducted intensive studies and found that if a pinch valve is used instead of a diaphragm valve, the sleeve housed in the valve box is a substantially straight tube material, and this sleeve has a highly viscous abrasive. The present inventors have found that even if the liquid is flowed, it is difficult for the liquid pool to appear as in the case of the diaphragm valve, and completed the present invention. Furthermore, if a copolymer elastomer of ethylene tetrafluoride resin and silicone rubber, which has good releasability and durability, is adopted as the material of this sleeve, free abrasive grains are less likely to adhere to the inner peripheral surface of the sleeve, and the valve is closed. The present inventors have found that the high hermeticity of the valve at the time can be maintained for a long period of time, and that the life of the sleeve and, consequently, the life of the pinch valve are prolonged, and thus the present invention has been completed.

[0006]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a slurry transfer device in which a liquid pool is less likely to appear in an internal flow path, and therefore, a valve can be prevented from being clogged due to the accumulation of free abrasive grains. I have. It is another object of the present invention to provide a slurry transfer device in which loose abrasive grains are less likely to adhere to the inner peripheral surface of the sleeve and the durability of the sleeve is enhanced.

[0007]

According to the first aspect of the present invention, a plurality of slurry pipes for transferring a slurry containing free abrasive grains, an adjacent slurry pipe and a slurry pipe are provided to a facility using the slurry. And a slurry transfer device provided with a pinch valve for opening and closing a flow path of the slurry formed inside the slurry pipe, and a slurry transfer means for transferring the slurry through the flow path of the slurry. It is.

[0008] Examples of equipment using the slurry include equipment for manufacturing semiconductor wafers, equipment for manufacturing glass substrates and quartz substrates, and various hard disk manufacturing equipment. More specifically, an ingot cutting device such as a wire saw, a semiconductor wafer wrapping device, a PCR processing device for polishing a chamfered surface of an outer peripheral portion of a semiconductor wafer, a grinding device for grinding a surface of a semiconductor wafer, a mirror surface for a semiconductor wafer A polishing apparatus for polishing, CMP, or the like. The slurry pipe may be a slurry supply pipe for supplying the slurry to a predetermined semiconductor wafer polishing apparatus or the like, or a slurry discharge pipe for discharging used slurry from the apparatus. The type of slurry is not limited. Usually, the type of slurry and the mixing ratio of various components constituting the slurry are determined by the semiconductor wafer manufacturing apparatus to which the slurry tube is connected. For example, in the case of a semiconductor wafer polishing apparatus, the slurry becomes an abrasive. As the abrasive, for example, a mixture of calcined silica, colloidal silica (free abrasive), amine (processing accelerator), organic polymer (haze suppressor), and the like can be used (eg, RODEL2398 manufactured by Rodel Nitta). .

The structure of the pinch valve is not limited. In short, a valve box having an internal flow path communicating with the slurry flow path, a sleeve made of an elastic material housed in this internal flow path with its axis aligned with the axis of the internal flow path, and a sleeve in the valve box And a valve shaft that closes the internal flow path by squeezing the sleeve from the outside in the radial direction so as to be able to return elastically. The material, size, shape, and the like of the valve box are not limited. In short, it is only necessary that an internal flow path for the fluid is formed therein, and that the sleeve can be housed in this internal flow path. The sleeve forms the valve body of the pinch valve. The diameter, length, etc. are not limited. The material of the sleeve is not limited. For example, the material is not limited as long as the material is more elastic than a rigid body such as a metal such as rubber or foamable synthetic resin. Further, as the elastic material other than these, for example, a copolymer elastomer of ethylene tetrafluoride resin and silicone rubber can be used. In short, a cylinder that can be stored in the internal flow path of the valve box.
It is only required that the valve shaft can be squeezed elastically from the outside in the radial direction by the protrusion of the valve shaft.

The material, sectional shape, thickness, etc. of the valve shaft are not limited. The cross-sectional shape of this valve stem is usually circular. In addition, the shape may be, for example, an elliptical shape, a triangular or more rectangular shape, or the like. The support structure of the valve shaft for the valve box is not limited. For example, a screw structure may be used. The point is that the valve box is supported so as to be movable in the radial direction of the sleeve so that the sleeve can be crushed from the outside in the radial direction. The pinch valve may be provided not only in the slurry tube but also in, for example, an etchant transfer tube connected to an etching apparatus of a semiconductor wafer manufacturing facility. In addition, it is provided on a transfer pipe of a cleaning liquid connected to a cleaning device for cleaning an exposed surface of a semiconductor wafer, or provided on a transfer pipe of a resist liquid connected to a resist film forming apparatus for forming a resist film on an exposed surface of a semiconductor wafer. You may.

The type of the slurry transfer means is not limited. Usually, it is a slurry pump that pumps the slurry from the upstream side to the downstream side of the slurry pipe. The type of the slurry pump is not limited. For example, a type in which the rotor is rotated inside the valve box to continuously transfer the slurry may be used. In addition, a type in which a piston is linearly moved in a cylinder to transfer slurry intermittently may be used. As a means for transferring the slurry other than the slurry pump, for example, a slurry suction transfer device for sucking the slurry from the downstream side of the slurry pipe by a negative pressure may be employed.

Further, the invention according to claim 2 is the slurry transfer device of a semiconductor wafer manufacturing facility according to claim 1, wherein the slurry tube is a slurry supply tube for supplying a slurry to a semiconductor wafer polishing apparatus.

According to a third aspect of the present invention, the pinch valve includes:
A valve box having an internal flow path communicating with the slurry flow path, a sleeve made of an elastic material housed in the internal flow path with its axis aligned with the axis of the internal flow path, and a sleeve in the valve box. And a valve shaft that closes the internal flow path by squeezing this sleeve elastically from the outside in the radial direction of the sleeve so as to be able to return elastically.
3. The slurry transfer device according to claim 1, wherein the elastic material of the sleeve is a copolymer elastomer of tetrafluoroethylene resin and silicone rubber. 4. The material of the sleeve is a copolymer elastomer of ethylene tetrafluoride resin and silicone rubber.

[0014]

According to the present invention, the flow of the slurry being transferred in the slurry flow path by the slurry transfer means is cut off by closing the pinch valve. Specifically, the sleeve accommodated in the valve box is crushed from the outside in the radial direction so as to be able to return elastically. The sleeve is a cylindrical body made of a substantially straight elastic material that is not bent. Therefore, even when the slurry containing the free abrasive grains flows through the sleeve, unlike the conventional diaphragm valve, a liquid pool hardly appears in the internal flow path of the valve box. As a result, clogging of the valve due to the accumulation of free abrasive grains in the liquid pool or the like can be prevented.

According to the third aspect of the present invention, since the sleeve is made of a copolymer elastomer of tetrafluoroethylene resin and silicone rubber, the sleeve itself has good releasability from slurry. I have. Therefore, even if the slurry flows in the slurry flow path, there is little possibility that loose abrasive grains adhere to the inner peripheral surface of the sleeve and the valve is clogged. Moreover, the copolymer elastomer of the tetrafluoroethylene resin and the silicone rubber has excellent durability. Therefore, the sleeve is less likely to be damaged, and the life of the sleeve and, consequently, the life of the pinch valve can be extended.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration diagram of a slurry transfer device according to one embodiment of the present invention. FIG. 2 is a longitudinal sectional view of a pinch valve constituting a part of a slurry transfer device of a semiconductor wafer manufacturing facility according to one embodiment of the present invention. FIG. 3 is a front view including a partial cross-sectional view of a pinch valve constituting a part of the slurry transfer device according to one embodiment of the present invention. In FIG. 1, reference numeral 10 denotes a slurry transfer device of a semiconductor wafer manufacturing facility (hereinafter, slurry transfer device).
The slurry transfer device 10 continuously supplies the slurry to a single wafer type wafer polishing device 11 for polishing the surface of the silicon wafer W one by one.

Hereinafter, the configuration of the slurry transfer device 10 will be described in detail. The slurry transfer device 10 includes a mixing tank 12 for mixing the abrasive, a circulation tank 14 for temporarily storing the mixed abrasive via a first slurry supply pipe 13A and a second slurry supply pipe 13B, A pinch valve V1 disposed between the first slurry supply pipe 13A and the second slurry supply pipe 13B to open and close a slurry flow path formed inside the slurry supply pipes 13A and 13B; The polishing slurry stored in the circulation tank 14 is supplied to the third slurry supply pipe 15A and the fourth slurry supply pipe 15A.
B, a nozzle 18 for supplying a polishing cloth 17 spread on an upper surface of a polishing platen 16 constituting a part of the wafer polishing apparatus 11, a third slurry supply pipe 15A and a fourth slurry supply pipe 15B. And a pinch valve V2 that opens and closes a slurry flow path formed inside the slurry supply pipes 15A and 15B, and is provided at an upstream end of the third slurry supply pipe 15A. Circulating tank 1
A slurry pump (slurry transfer means) 20 for pumping the abrasive in the wafer 4 toward the wafer polishing apparatus 11 and a third slurry supply pipe 15A are provided downstream of the slurry pump 20 and discharged from the circulation tank 14. A filter 21 for removing foreign matter in the abrasive, and a third slurry supply pipe 15
A heat exchanger 22 is provided downstream of the filter 21 of A and heats the abrasive, which has filtered foreign substances, by heat exchange with an arbitrary heating medium.

In the mixing tank 12, an abrasive is produced. Specifically, 50 liters of “RO”
DEL2398 "and dilute about 10-fold. Around 50 liters of abrasive is stored in the circulation tank 14. Below the liquid level of the abrasive, the concentration detecting section of the densitometer 24 is immersed.

The slurry transfer device 10 collects the slurry containing the polishing residue after polishing and returns the slurry to the circulation tank 14 for reuse. That is, a liquid receiving tank 23 for receiving the used abrasive is disposed below the polishing platen 16, and the used abrasive collected in the liquid receiving tank 23 is formed on the bottom of the liquid receiving tank 23. From the outlet, it is returned to the circulation tank 14 via the slurry return pipe 25. A slurry pump 26 for pumping the used abrasive under pressure is connected to an upstream portion of the slurry return pipe 25.

Here, the above single wafer polishing apparatus 1
The configuration of No. 1 will be briefly described. Above the polishing platen 16,
A polishing head 27 is provided. This polishing head 27
A silicon wafer W is adhered to a lower surface of the substrate via a carrier plate 28 by wax. At the time of single wafer polishing, the polishing head 27 being rotated at a predetermined speed is lowered while supplying the polishing agent from the nozzle 18, and the surface (lower surface) of the silicon wafer W attached to the carrier plate 28 is polished. 16 is pressed against the polishing surface (upper surface) of the rotating polishing pad 17 at a predetermined speed together with the polishing pad 16 to polish one by one.

Next, the pinch valves V1 and V2 will be described in detail with reference to FIGS. Note that both pinch valves V1 and V2 have the same configuration. Therefore, the pinch valve V2 will be described here as an example. The pinch valve V2 supplies the third slurry supply pipe 15A and the fourth slurry supply pipe 15A by supplying and discharging compressed air into the valve.
B is a fully automatic valve that opens and closes the flow path of the abrasive formed inside B. The pinch valve V2 mainly includes a valve box 30 having an internal flow passage 30a that can communicate with a flow passage between the third slurry supply pipe 15A and the fourth slurry supply pipe 15B, and an axial line of the internal flow passage 30a. The internal flow path 3
And a sleeve 31 made of an elastic material housed in the sleeve 3a.
1 has a valve shaft 32 that closes the internal flow passage 30a by being crushed elastically from outside in the radial direction.

The valve box 30 is a vertically long rectangular prism in plan view. Here, the bottom of the valve box 30 is formed separately for the sake of design. At the time of assembling the pinch valve V2, this bottom is integrally fixed to the main body of the valve box 30. The internal flow passage 30a has a rectangular cross section and is formed in a lower portion of the valve box 30 so as to penetrate the front and rear surfaces of the valve box 30.
The front and rear lower portions of the valve box 30 have a
Short rubber connecting plug 3 having a pair of circular cross sections
3, 33 are attached respectively. At the base of both connecting plugs 33, 33, fixing flanges 3 are provided, respectively.
3a and 33a are integrally formed. These fixing flanges 33a, 33a are respectively formed in annular catching grooves 3 formed in the corresponding formation portions of the front end of the internal flow passage 30a.
Ob, or by engaging in an annular engaging groove 30b formed in the rear end forming portion of the internal flow path 30a, the two connecting plugs 33, 33 are firmly fixed to the valve box 30. . External threads are formed on the outer peripheral surfaces of the connecting plugs 33, 33, respectively.

The sleeve 31 is made of a copolymer elastomer of tetrafluoroethylene resin and silicone rubber. The sleeve 31 has a circular cross section, and both ends in the axial direction protrude outward from the internal flow path 30a. Both ends of the sleeve 31 are connected to both connecting plugs 33, 33.
Each is inserted into the internal space of. The small-diameter base portions of a pair of cylindrical insert pushes 34, 34 are fitted into both ends of the sleeve 31, respectively. On the other hand, inner threads are formed at large-diameter ends of both the inside pushes 34, 34, respectively. On the other hand, the downstream end of the third slurry supply pipe 15A,
External threads are formed at the upstream end of the fourth slurry supply pipe 15B. Accordingly, the downstream end of the third slurry supply pipe 15A is screwed into the upstream inside push 34 via the corresponding internal screw and external screw. Also, the downstream inside push 34 is connected to the fourth push through the corresponding internal screw and external screw.
The end on the upstream side of the slurry supply pipe 15B is screwed. Then, the respective inside plugs 34, 3 are connected to the respective connecting plugs 33, 33 via the external screws.
Nuts 35, 35 are screwed together so as to enclose 4 from outside. Thus, the pinch valve V2 is firmly connected between the third slurry supply pipe 15A and the fourth slurry supply pipe 15B.

On the other hand, the valve shaft 32 is attached to the upper half of the valve box 30 by introducing or discharging compressed air.
An actuator portion 36 is provided integrally with the internal flow passage 30a from outside in the radial direction. The actuator section 36 mainly includes a cylinder 37 having an open upper end surface, and a piston 38 housed in the cylinder 37.
And a spring 39 which is housed in an upper chamber (upper side) of the cylinder 37 opposite to the sleeve 31 side (lower side) and constantly urges the piston 38 toward the sleeve 31 side, and a lower chamber of the cylinder 37 on the sleeve 31 side. And an air supply / discharge unit 40 for supplying compressed air that pushes up the piston 38 and discharging compressed air from the lower chamber.

One O-ring 38a is externally inserted on the outer peripheral surface of the piston 38. A cylindrical projection 3 is provided at the center of the surface (lower surface) of the piston 38 on the sleeve 31 side.
8b is provided vertically. The cylindrical projection 38b is provided in the valve box 3
The internal passage 30a is loosely inserted into a valve shaft hole 30c formed in the center of the upper surface forming portion of the internal passage 30a and extending in the vertical direction orthogonal to the axis of the internal passage 30a. One small-diameter O-ring 30d is inserted into the formation of the inner peripheral surface at the upper end of the valve shaft hole 30c. The lower portion of the valve shaft hole 30c has a horizontally long rectangular shape so that a rubber cap 41 described later can be stored. The valve shaft 32 is inserted into the internal space of the cylindrical projection 38b. The lower end of the valve shaft 32 projects downward from the distal end surface of the cylindrical projection 38b.
An external thread is formed on the protruding portion, and a laterally long rubber cap 41 is screwed to the lower end of the valve shaft 32 via the external thread. The rubber cap 41 crushes the sleeve 31 from above when the valve shaft 32 projects into the internal flow passage 30a by the spring force of the spring 39.

The air supply / discharge unit 40 is provided so as to protrude from a part of the outer peripheral surface at the lower end of the cylinder 37, and is connected to a distal end of a compressed air supply hose extending from a compressed air generator (not shown). . The flow path in the air supply / discharge unit 40 and the lower chamber of the cylinder 37 are communicated by a small hole formed at the lower end of the cylinder 37. Therefore, the compressed air from the compressed air generator is supplied to the lower chamber via the connecting hose, the air supply / discharge unit 40, and the pores. 2 and 3, reference numeral 42 denotes a lid of the cylinder 37.

Next, the operation of the slurry transfer device 10 according to this embodiment will be described. As shown in FIG. 1, first, an abrasive (RODEL2) containing free abrasive grains is provided inside the preparation tank 12.
398). The abrasive thus obtained is supplied to the first slurry supply pipe 13 by opening the pinch valve V1.
A, the liquid is temporarily stored in the circulation tank 14 via the second slurry supply pipe 13B. Thereafter, the pinch valve V2 is opened, and the slurry pump 20 is operated. This allows
From the bottom of the circulation tank 14, a third slurry supply pipe 15A
The abrasive pumped into the inside passes through the internal flow path 30a of the pinch valve V2 after removing foreign matter by the filter 21 and raising the temperature by about 30 ° C. by the heat exchanger 22, and through the fourth slurry supply pipe 15B. Then, the liquid is supplied from the nozzle 18 to the upper surface of the central portion of the polishing pad 17 at a rate of 1 liter / minute. Polishing cloth 17
Is rotated integrally with the polishing platen 16, and this polishing cloth 1
The rotating polishing head 27 is pressed against the polishing surface (upper surface) 7. Thus, the surface of the silicon wafer W is polished at a predetermined polishing rate. At the time of this polishing, the used abrasive containing the polishing residue accumulates in the liquid receiving tank 23. The waste liquid of the accumulated abrasive is returned to the circulation tank 14 from the outlet of the liquid receiving tank 23 through the slurry return pipe 25 by the slurry pump 26.

The operation of the pinch valves V1 and V2 will now be described with reference to FIGS. Here, the pinch valve V2 will be described as an example. When the valve is opened, the compressed air from the compressed air generator is supplied from the air supply / discharge unit 40 to the lower chamber of the cylinder 37 via the small hole. Then, the piston 38 is pushed up in the cylinder 37 against the spring force of the spring 39. Accordingly, the valve shaft 32 is pulled up integrally with the piston 38, and the rubber cap 41 is housed in the rectangular hole below the valve shaft hole 30c. Thereby, the flow path in the sleeve 31, that is, the internal flow path 30a of the valve box 30 is opened.

On the other hand, when the valve is closed, the supply of compressed air to the lower chamber is stopped. Accordingly, the piston 38 is pushed down by the spring force of the spring 39, and the air in the lower chamber is discharged to the outside through the small holes. At the same time, the valve shaft 32 descends along with the cylindrical projection 38b in the valve shaft hole 30c. As a result, the rubber cap 41 comes into contact with the upper portion of the intermediate portion of the sleeve 31. As the descent proceeds further, the sleeve 31 is crushed from the outside in the radial direction (above). Finally, the crushed portion is pressed against the lower portion of the intermediate portion of the sleeve 31 with a strong force. As a result, the flow path in the sleeve 31, that is, the valve box 3
0 internal flow path 30a is closed. The operation of the pinch valve V1 is the same.

As described above, in this embodiment, the sleeve 3
As a material for (1), a copolymer elastomer of tetrafluoroethylene resin having high releasability and silicone rubber was employed. Therefore, the first to fourth slurry supply pipes 13A, 13A, 1
Even when the abrasive containing free abrasive particles flows through 3B, 15A, and 15B, the free abrasive particles of the abrasive hardly adhere to the inner peripheral surface of sleeve 31. In addition, the copolymer elastomer of the ethylene tetrafluoride resin and the silicone rubber has excellent durability. Therefore, the sleeve 31 is less likely to be damaged, and the life of the sleeve 31 and, consequently, the life of the pinch valves V1 and V2 are prolonged. Therefore, for example, the number of times of maintenance of the pinch valves V1 and V2 performed in one year can be reduced.

[0031]

According to the present invention, since the pinch valve is provided between the slurry pipes, the liquid pool is less likely to appear in the internal flow path of the pinch valve, and the valve is prevented from accumulating by the free abrasive grains. Clogging can be prevented.

In particular, according to the invention of claim 3, since the copolymer elastomer of the highly releasable tetrafluoroethylene resin and silicone rubber is used as the material of the sleeve, the slurry is flowed through the slurry flow path. At this time, loose abrasive grains adhere to the inner peripheral surface of the sleeve, and the valve is hardly clogged. In addition, since the copolymer elastomer of the tetrafluoroethylene resin and the silicone rubber has excellent durability, the service life of the sleeve and the service life of the pinch valve can be extended.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a slurry transfer device of a semiconductor wafer manufacturing facility according to one embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a pinch valve constituting a part of a slurry transfer device of a semiconductor wafer manufacturing facility according to one embodiment of the present invention.

FIG. 3 is a front view including a partial cross-sectional view of a pinch valve constituting a part of a slurry transfer device of a semiconductor wafer manufacturing facility according to one embodiment of the present invention.

[Explanation of symbols]

Reference Signs List 10 slurry transfer equipment of semiconductor wafer manufacturing equipment, 11 wafer polishing equipment (semiconductor wafer manufacturing equipment), 13A first slurry supply pipe, 13B second slurry supply pipe, 15A third slurry supply pipe, 15B fourth Slurry supply pipe, 20 slurry pump (slurry transfer means), 30a internal flow path, 30 valve box, 31 sleeve, 32 valve shaft V1, V2 pinch valve, W semiconductor wafer.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) // B24B 37/00 F16L 55/00 M (72) Inventor Tadashi Tadashi 1-5 Otemachi, Chiyoda-ku, Tokyo No. 1 Mitsubishi Materials Silicon Co., Ltd. (72) Inventor Yoshiki Kobayashi 508-2 Nakagami, Iruma-shi, Saitama Xevi Male Co., Ltd. F-term (reference) 3C047 GG00 3C058 AA07 AC01 AC04 CB06 DA02 DA17 3H025 BA21 BB05

Claims (3)

[Claims] 1. A plurality of slurry pipes for transferring slurry containing free abrasive grains to equipment using the slurry, and a plurality of slurry pipes disposed between adjacent slurry pipes and inside of the slurry pipes. A slurry transfer device comprising: a pinch valve for opening and closing a slurry flow path formed in the slurry; and a slurry transfer means for transferring the slurry through the slurry flow path. 2. The slurry transfer device according to claim 1, wherein the slurry tube is a slurry supply tube for supplying a slurry to a semiconductor wafer polishing apparatus. 3. A valve box in which the pinch valve has an internal flow path communicating with the flow path of the slurry, and an elastic material stored in the internal flow path with its axis aligned with the axis of the internal flow path. And the valve case is supported by the valve box so as to be movable in the radial direction of the sleeve,
A valve shaft that closes the internal flow path by crushing the sleeve from the radial outside of the sleeve so as to be able to elastically return, and wherein the elastic material of the sleeve is a copolymer elastomer of ethylene tetrafluoride resin and silicone rubber. The slurry transfer device according to claim 1 or 2, wherein