JP2002222834A - Ultrasonic vibration junction device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce vibration loss. SOLUTION: The ultrasonic vibration junction device has projections 33 and 37 on either one of a resonator 1 or a support mechanism 30 to support the other in a point or line.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic vibration joining apparatus for joining a plurality of articles to be joined by ultrasonic vibration.

[0002]

2. Description of the Related Art In a resonator supporting device disclosed in Japanese Patent Application Laid-Open No. 11-307584, a flat surface parallel to a bonding action surface of a resonator is provided on a supporting portion projected outside a minimum vibration amplitude point of the resonator. The holder attached to the movable end of the pressurizing mechanism has a flat surface parallel to the flat surface of the support portion, and the flat surface of the support portion and the flat surface of the holder are vertically contacted and fixed to each other. It has become.

[0003]

When a plurality of articles to be joined are joined by ultrasonic vibration, the actual minimum vibration amplitude point of the resonator is reduced by a theoretical minimum oscillation amplitude due to a load applied to the article by the resonator. Deviated from the point, the support of the resonator may vibrate. When the support portion vibrates, the conventional example has a structure in which the flat surface of the support portion and the flat surface of the holder are in full contact with each other over a wide surface. It is undeniable that the vibration of the resonator is lost.

Accordingly, an object of the present invention is to provide an ultrasonic vibration bonding apparatus capable of reducing vibration loss.

[0005]

According to the present invention, when a plurality of articles to be joined are joined by ultrasonic vibration, an actual minimum vibration amplitude point of the resonator depends on a load received by the resonator from the articles to be joined. Is shifted from the theoretical minimum vibration amplitude point, even if the support part of the resonator vibrates, by supporting the other point or linearly with the projection provided on one of the resonator and the support mechanism, The load on the support mechanism from the support portion can be dispersed, and the loss of vibration such that the support mechanism stops the vibration of the support portion can be reduced. Further, in the present invention, if the projection is provided on the support mechanism, the support mechanism is commonly used even if the resonator is replaced, so that it is more economically advantageous than the case where the projection is provided on the resonator. It is.

[0006]

1 to 5 show an embodiment of the present invention. FIG. 1A shows a front view of a main part, and FIG. 1B shows a side view of the main part. 2 shows an upper surface of the resonator 1, FIG. 3 shows a rear surface of the resonator 1, FIG. 4 shows an exploded appearance of the resonator 1, the vibrator 25 and the support mechanism 30, and FIG. 61 shows a front view.

Referring to FIG. 1, a main part of the embodiment will be described. Resonator 1 has bonding action parts 3 and 4 and support part 5 outside horn body 2. The support mechanism 30 is provided with the upper and lower support arms 3 so as to sandwich the support portion 5 of the resonator 1 from above and below.
This is a form divided into 1:32. The upper support arm 31 has a mounting portion 33 protruding over the horn body 2 in a non-contact manner.
And a projection 34 protruding downward from the lower surface of the mounting portion 33.
Having. The protrusion 34 has a cross-sectional shape such as a semicircle, triangle, or trapezoid that gradually becomes thinner as it goes below the mounting portion 33 as shown in FIG. A, and a shape continuous from one side to the other side as shown in FIG. Having. Lower support arm 3
Reference numeral 2 denotes a front and rear divided form, in which each lower support arm 32 has a mounting portion 36 and a projection 37 protruding upward from the upper surface of the mounting portion 36. The projection 37 has a semi-circular, triangular or trapezoidal cross-sectional shape that gradually becomes thinner as it goes upward from the mounting portion 36 as shown in FIG.
It has a shape that is continuous from one side to the other side as shown in the figure.
When the support mechanism 30 is mounted so as to sandwich the resonator 1 by connecting the upper and lower support arms 31 and 32 with the elastic body 40 shown in FIG. The mounting surfaces 6; 7 are linearly supported by contacting the surfaces 6;

When the mount table 67 and the support mechanism 30 facing the joining action portions 3 and 4 move relatively so as to approach each other, the joining action portion 3 and 4 and the mount table 67 are moved between them. A plurality of articles to be joined 12; 13 are sandwiched in a laminate and pressurized, and ultrasonic vibrations act on the articles to be joined from the resonator 1, so that the articles to be joined 12; Joined. In this case, the actual minimum vibration amplitude point of the resonator 1 is shifted from the theoretical minimum vibration amplitude point due to the load that the resonator 1 receives from the articles 13 and 14 to be joined, and the support portion 5 of the resonator 1 vibrates. Even in this case, the support portion 5 is provided with the projections 34; 3 of the support mechanism 30.
7 is linearly contacted and supported, and the load from the support portion 5 to the attachment portions 33 and 36 is dispersed. Therefore, the attachment portions 33 and 36 of the support mechanism 30 stop the vibration of the support portion 5.
Vibration loss can be reduced.

The resonator 1 will be described in detail with reference to FIGS. The resonator 1 is composed of a horn body 2 and a joining action part 3;
Formed as a single body made of a material having good acoustic characteristics such as an alloy such as aluminum or titanium, or quenched iron, etc., having a support portion 5, a connecting portion 15, and suction suction holes 8; . The horn body 2 has a rod shape having a length of at least one wavelength (the length from the maximum vibration amplitude point f1 to the maximum vibration amplitude point f5) of the resonance frequency of the ultrasonic vibration transmitted from the vibrator 25 shown in FIG. . An imaginary line L1 shown in FIG. 3 is a waveform indicating the displacement of the vibration amplitude. The joining action parts 3 and 4 are arranged on the upper and lower outer surfaces of the horn body 2 at the position of the center maximum vibration amplitude point f3 in the horn body 2 and formed in a larger plane area than the article 12 to be joined in FIG. It has a front end surface, and may be flush with the upper and lower surfaces of the horn main body 2 or may be depressed from the upper and lower surfaces, but if it protrudes from the upper and lower surfaces of the horn main body 2 as shown in FIG. When the thin joining object 12 is joined, the joining action portions 3 and 4 come into contact with the joining object 12 and the surface around the joining action portions 3 and 4 of the horn body 2 does not contact with the joining objects 12 and 13. Is the best. The distal end surfaces of the joining portions 3 and 4 are flat surfaces parallel to the vibration direction X.

The supporting portion 5 is located on the front and rear outer surfaces of the horn main body 2 at the positions of the minimum vibration amplitude points f2 and f4 equidistant to the left and right sides from the maximum vibration amplitude point f3. In addition, they are arranged at symmetrical positions with the center line L3 passing through the maximum vibration amplitude point f3 and orthogonal to the center line L2 as a line symmetric axis, and have a front-rear, left-right symmetrical shape. The support part 5 has a mounting surface 6; 7, a root part 16, an intermediate part 17, and a tip part 18. The mounting surfaces 6 and 7 are upper and lower surfaces of the tip portion 18 and are formed as flat surfaces parallel to the joining action portions 3 and 4. The root 16 is a thick plate that protrudes straight out of the horn body 2 at a position of the minimum vibration amplitude point f2; f4 so as to be orthogonal to the vibration direction X. The intermediate portion 17 connects the root portion 16 and the distal end portion 18 and has a thin plate shape in a direction parallel to the vibration direction X. The tip portion 18 has a thick plate shape in a direction parallel to the vibration direction X.

The crank shape composed of the base portion 16, the intermediate portion 17, and the distal end portion 18 has a symmetrical shape in the front-rear and left-right directions. The coupling part 15 is provided with a resonator 25 shown in FIG. 3 or a booster (not shown) in the resonator 1 and a headless screw 26 shown in FIG.
A screw hole formed with a female screw for mounting coaxially, and the maximum vibration amplitude point f1; f5 of the horn body 2
Is formed at the center of the left and right end faces where the exists. The resonator 1 has a constricted portion 19 formed in the intermediate portion 17 of the horn main body 2 located between the support portions 5 in order to amplify the vibration amplitude of the ultrasonic vibration transmitted from the vibrator 25. It may not be provided. The suction suction holes 8 and 9 are provided for accurately joining one of the articles 12 to be joined to the other article 13 like the semiconductor chip 12 shown in FIG. When the object to be joined 12 does not require high-precision alignment such as the semiconductor chip 12 or is large, the suction suction holes 8 and 9 may not be provided.

The suction holes 8 and 9 are provided at the maximum vibration amplitude point f3 of the horn body 2. One of the suction suction holes 8 is a vertical hole 2 that is opened from the center of the distal end surface of the joint 3 to the inside of the horn body 2 through the inside of the joint 3.
1 and a horizontal hole 22 opened from the center of the rear surface of the horn body 2 to the vertical hole 21 via the inside of the horn main body 2.
The opening of the horizontal hole 22 in the horn body 2 is a suction side port for connecting the suction pad 51 of FIG. The other suction suction hole 9 has a vertical hole 23 extending from the center of the distal end face of the joining section 4 to the inside of the horn main body 2 through the inside of the joining section 4, and from the center of the rear surface of the horn body 2. It is formed by a horizontal hole 24 opened so as to be connected to the vertical hole 23 via the inside, and the opening of the vertical hole 23 in the joint action portions 3 and 4 is a suction side port for sucking the article 12 to be joined. The opening of the horizontal hole 24 in the horn body 2 is a suction side port for connecting the suction pad 51. The vertical hole 21 and the vertical hole 22 are separated from each other.

Further, the resonator 1 has the joining action portions 3 and 4 at positions equidistant from the center line L2 extending in the longitudinal direction of the horn main body 2 between the upper and lower sides of the horn main body 2 at equal distances H1. 5 are provided at positions equidistant H2 above and below the center line L2. For this reason, when joining the articles 12 and 13 to be joined in FIG. 1 by ultrasonic vibration, the resonator 1 can be inverted and used so that the resonator 1 is turned upside down with respect to the support mechanism 30. is there. In other words, in the case where the articles 12 and 13 to be joined are joined under ultrasonic vibration using one of the joining action sections 3, the one mounting surface 7 of the support section 5 is connected to the support mechanism 3.
In the case where the object to be joined 12; 13 is joined under ultrasonic vibration using the other joining action part 4 by using the other joining action part 4, one attachment surface 6 of the support part 5 is attached to the support mechanism 30. It is attached to the part 33. Thus, the mounting portion 3 of the support mechanism 30
Even if the resonator 1 is turned upside down with respect to
The distance from No. 3 to the joining action portions 3 and 4 used for joining is constant. For this reason, even when any of the joining action sections 3 and 4 is used, the joining action sections 3 and 4 and the mount table 67 are used.
And the moving distances for approaching each other are the same, and the articles 12 and 13 to be joined can be appropriately joined.

When the objects 12 and 13 to be joined are joined by using both heat and ultrasonic vibration, an indirectly heated or directly heated heater can be used. In the case of an indirectly heated heater, it can be realized by using hot air or by arranging an electric heat source having a heater wire around the resonator 1. In the case of a directly heated heater, the horn body is indicated by an imaginary line in FIG. If the electric heating source 85 having a heater wire is attached to one or both of the minimum vibration amplitude points f2 and f4, the durability of the heater wire is increased. When the electric heat source 85 is mounted on the horn main body 2, a hole may be formed in the horn main body 2, and the electric heat source 85 may be inserted into the hole so as to be in contact therewith. Even when the resonator 1 is heated in this way,
As shown in FIG. 1, the support portion 5
4; 37, the amount of heat transmitted from the horn main body 2 to the upper and lower support arms 31; 32 via the support portion 5 and the mounting portions 33; 36 is reduced, and the heat from the electric heat source is reduced. The transmission can be made effectively from the resonator 1 to the article 12 to be joined.

The suction holes 8 and 9 have suction side ports at equal distances H3 above and below the center line L2. For this reason, when joining objects to be joined by ultrasonic vibration,
The resonator 1 can be used upside down so that the resonator 1 is upside down with respect to the support mechanism 30 of FIG. That is, in the state where the distance between the center line L2 and the suction pad 51 shown in FIG.
Is used, the resonator 1 is mounted on the mounting portion 33 of the support mechanism 30 with reference to the upper mounting surface 7 and FIG.
The suction pad 51 is connected to the upper suction side port, so that the joining section 3 can suck and adsorb the article 12 to be joined. When the upper joining section 4 is used, the resonator 1 is turned upside down. As a result, the resonator 1 is mounted on the mounting portion 33 of the support mechanism 30 with the lower mounting surface 6 as a reference, and the suction pad 51 is connected to the lower suction side port, so that the bonding section 4 sucks the product 12 to be bonded. Can be adsorbed.

Further, instead of providing the projections 34 and 37 on the support mechanism 30, the projections 34 and 37 may be provided on the resonator 1, but it is better to provide the projections 34 and 37 on the support mechanism 30 as in the embodiment. It is economical. The reason is that when the projections 34; 37 are provided on the resonator 1, the projections 34;
However, if the projections 34 and 37 are provided on the support mechanism 30, the support mechanism 30 may be provided even if the resonator 1 is replaced.
Is commonly used.

Referring to FIG. 4, the support mechanism 30 will be described in detail. The support mechanism 30 is formed by upper and lower support arms 31:32 and an elastic body 40. The upper support arm 31 is formed as a single body made of an iron-based material and provided with a mounting portion 33, a connecting portion 35, and a projection 34. The mounting portion 33 projects downward from the four corners of the upper support arm 31 so that the mounting portion 33 corresponds to the position of the support portion 5. The lower surface of the mounting portion 33 is a flat surface parallel to the mounting surfaces 6 and 7 of the support portion 5 and has a plurality of projections 34. The connecting portion 35 is a screw hole formed with a female screw for attaching the upper support arm 31 to a piston rod 75 of an air cylinder 74 which is a pressing mechanism of the ultrasonic vibration bonding apparatus 61 shown in FIG. 31 is formed at the center.

The lower support arm 32 is divided into front and rear portions, and each of the lower support arms 32 is formed as a single body made of an iron-based material and having a mounting portion 36 and a projection 37.
The mounting portion 36 of each lower support arm 32 projects upward from the left and right ends of each lower support arm 32 so that the position thereof corresponds to the support portion 5 of the resonator 1. The upper surface of the mounting portion 36 is the mounting surface 6 of the support portion 5;
7 is a flat surface parallel to 7 and has a plurality of protrusions 37. Spring hooks 38 and 39 for anchoring the elastic body 40 are attached to the upper and lower support arms 31 and 32. The elastic body 40 urges the upper and lower support arms 31:32 toward each other, and is formed by a coil spring. The upper end of the elastic body 40 is hooked on the spring hook 38 of the upper support arm 31, and the elastic body 4
The lower end of the upper support arm 31 and the lower support arm 3
And 2.

In order to connect and disconnect the suction pad 51 to and from the suction suction holes 8 and 9 of the resonator 1, a support mechanism 30 is provided.
Is provided with a bracket 47 attached to the outside of the upper support arm 31 with bolts 46. An air cylinder 48 is attached to a bracket 47 extending below the center of the upper support arm 31 in the left-right direction. A hose joint 50 is attached to the piston rod 49 of the air cylinder 48.
Is attached. A trumpet-shaped suction pad 51 made of an elastic synthetic resin is mounted on the front surface of the hose joint 50. One end of a suction hose 52 made of rubber or synthetic resin is attached to the hose joint 50. The other end of the suction hose 52 is connected to a suction source such as a vacuum pump (not shown) via a valve (not shown).

The extension of the air cylinder 48 causes the hose joint 50 to move forward, causing the suction pad 51 to come into contact with the suction side port or the back surface of the horn body 2 around the suction side port. Is elastically deformed outward and expands, and the suction suction hole 8 or the suction suction hole 9 is connected to the internal hole of the suction hose 52 via the internal hole of the hose joint 50 and the internal hole of the suction pad 51. Is done. In this state, a valve (not shown) is switched from the open-to-atmosphere side to the suction side, so that the suction suction hole 8 or the suction suction hole 9 is switched.
The suction side port of the bonding section 3 or the suction side port of the bonding section 4 sucks the outside air by the suction operation from the suction generating source, thereby sucking one of the items 12 to be bonded in FIG.

Conversely, when the valve is switched from the suction side to the atmosphere opening side, the suction suction hole 8 or the suction suction hole 9 is filled with the atmosphere, and the article 12 to be joined is released. Further, the hose joint 50 is retracted by the contraction operation of the air cylinder 48, the suction pad 51 is separated from the suction side port or the back surface of the horn body 2 around the suction side port, and the suction suction hole 8 or the suction suction hole 9 is formed. The connection between the suction hose 52 and the suction hose 52 is released. Left and right guide rods 53 projecting from the hose joint 50 on the back side are provided with brackets 47 around the air cylinder 49.
Slidingly engages with the guide hole 54 formed in the
0 is prevented from rotating and moves forward or backward.

When the resonator 1 is supported by the upper and lower support arms 31:32, portions of the resonator 1 other than the mounting surfaces 6 and 7 are not in contact with the upper and lower support arms 31:32. A vibrator 25 coupled to one end of the resonator 1 by a headless screw 26 generates and outputs longitudinal ultrasonic vibration having a predetermined frequency by electric energy received from an ultrasonic oscillator (not shown). Things.

Referring to FIG. 5, an ultrasonic vibration bonding apparatus 61 for performing processing for bonding articles 12 and 13 to be bonded by ultrasonic vibration using resonator 1 attached to support mechanism 30.
Will be described. For the products to be joined 12 and 13, a semiconductor chip is assumed as one product to be joined 12, and a circuit board is assumed as the other product 13 to be joined. The ultrasonic vibration bonding apparatus 61 will be described as an example of an apparatus for surface mounting the semiconductor chip 12 on the circuit board 13. The semiconductor chip 12 has a plurality of flat or spherical pads 12a on one surface as connection terminals. The circuit board 13 has a plurality of flat or spherical pads 13a as connection terminals at a chip mounting position on one surface thereof. The chip-side pads 12a and the substrate-side pads 13a have the same number, and their positions correspond to each other. The semiconductor chip 12 is surface-mounted on the circuit board 13 by bonding the chip-side pad 12a and the board-side pad 13a by ultrasonic vibration.

The ultrasonic vibration bonding apparatus 61 includes a mounting mechanism 63, an ultrasonic vibration bonding mechanism 64, and a measuring mechanism 65 on an installation standard 62 such as a factory floor. The mounting mechanism 63 includes an XYθ driving unit 66 provided on the installation reference 62 and a mount table 67 mounted on the XYθ driving unit 66. Then, based on the output from the measuring mechanism 65, XY
drive unit 66 moves mount table 67 in the X and Y directions, which are the vertical and horizontal directions of a plane parallel to installation reference 62, and moves the mount table 67 in a plane parallel to installation reference 62 around a certain point in the plane. The mount table 67 is rotated in the θ direction, which is the rotation angle of, and the position of the mount table 67 is controlled so that the chip mounting position of the circuit board 13 mounted on the upper surface of the mount table 67 parallel to the installation reference 62 becomes a predetermined mounting position. I do. X
Drive unit 66 includes an X-direction elevation angle adjustment unit 68 with respect to installation reference 62, and a Y-direction elevation angle adjustment unit 69 with respect to installation reference 62.
And

As in the case of mounting preparation work, when the resonator 1 is exchanged, or when the mount table 67 is exchanged, the upper surface of the mount table 67 and the joining action portions 3 and 4 in the resonator 1 are replaced. When it is not clear whether or not the parallelism with the tip surface is maintained, the X-direction elevation angle adjustment unit 68 and the Y-direction elevation angle adjustment unit 69 are manually operated to raise the elevation angle of the XYθ driving unit 66 in the X direction with respect to the installation reference 62. And the elevation angle of the XYθ driving unit 66 in the Y direction with respect to the installation reference 62,
The degree of parallelism between the upper surface of the mount table 67 and the distal end surfaces of the joint portions 3 and 4 is ensured.

The ultrasonic vibration bonding mechanism 64 has an installation reference 62
, A fixed motor 70 such as a servomotor mounted on the fixed base 70, and a bolt / nut mechanism 72 connected to an output shaft of the motor 71.
A lift base 73 in which nuts of a bolt and nut mechanism 72 are formed; an air cylinder 74 attached to the lift base 73; a support mechanism 30 connected to a piston rod 75 of the air cylinder 74; The resonator 1 includes a mounted resonator 1 and a vibrator 25 coupled to one end of the resonator 1.

When the motor 71 rotates forward, the screw bar of the bolt / nut mechanism 72 rotates forward, and the lift base 73 is lowered by the nut screw-fitted to the screw bar.・ Nut mechanism 72
Is reversed, and the lift base 73 rises via the nut. The lift base 73 is slidably engaged with left and right guide poles 76 erected below the fixed base 70, is prevented from rotating, and moves up and down. The lower end of a guide shaft 77 housed inside each guide pole 76 so as to be able to move up and down is connected to the support mechanism 30, and is moved up and down by elevating and lowering the lift base 73 and expanding and contracting the air cylinder 74.
0 is kept parallel to the installation reference 62.

Next, using the ultrasonic vibration bonding apparatus 61,
The method of ultrasonic vibration bonding will be described. The resonator 1 of the ultrasonic vibration bonding mechanism 64 stops at the upper limit position as shown in FIG. 5, and the semiconductor chip 12 is connected to the bonding action portion 3 of the resonator 1;
4, the chip side pad 12a faces downward, and the circuit board 13 is mounted on the mounting table 6 of the mounting mechanism 63.
7 and the substrate-side pad 13a faces upward. In this state, the measurement mechanism 65 moves from the position indicated by the solid line to the position indicated by the dotted line, and the measurement light source and the two-field optical system lens 81 (not shown) enter the space between the semiconductor chip 12 and the circuit board 13 in a non-contact manner. I do. Then, when the measurement light source is turned on, the CCD camera 82 is moved to the chip side pad 1.
2a and the board side pad 13a are imaged.

Then, an image processing device (not shown) which receives an electric output from the CCD camera 82 is connected to the chip side pad 12a.
The position deviation between the substrate and the substrate-side pad 13a is measured and calculated. Based on the calculation result, the mount table 67 drives the XY and θ to move the circuit board 13 based on the semiconductor chip 12 so that the position of the chip-side pad 12a and the position of the board-side pad 13a can be accurately matched. Correct the position. When the position of the board-side pad 13a, which is the mounting position of the circuit board 13 by this position correction, is vertically opposed to the chip-side pad 12a, the measuring mechanism 65 moves from the dotted line position to the solid line position, and performs measurement. The light source for use, the two-field optical system lens 81, and the CCD camera 82 return to their original positions.

Thereafter, the resonator 1 descends to press the chip-side pad 12a against the substrate-side pad 13a to apply pressure, and the vibrator 25 oscillates ultrasonic vibration. The resonator 1 resonates with the ultrasonic vibration, and the ultrasonic vibration caused by the resonance is transmitted from the semiconductor chip 12 to the chip-side pad 12 a and the substrate-side pad 13.
a, the chip-side pad 12a and the board-side pad 13a are joined, and the semiconductor chip 12 is surface-mounted at the chip mounting position of the circuit board 13. The method of pressing the semiconductor chip 12 against the circuit board 13 is performed by lowering by the air cylinder 74 and lowering of the bolt / nut mechanism 72 by the motor 71. The pressure control is performed by the output of the air cylinder 74.

Chip side pad 12a and substrate side pad 13
In the control of the joining time with “a”, the image processing apparatus determines the joining end time based on, for example, the time information of the elapsed time from the start of the ultrasonic vibration of the transducer 25 and the temperature information input from the thermometer. Then, when the joining end time comes, the image processing apparatus instructs the vibrator 25 to stop the vibration, the valve of the pressure supply system to the air cylinder to perform the upward switching, and the motor 71 to perform the upward switching. As a result, the resonator 1 rises, and the resonator 1 is separated from the semiconductor chip 12 surface-mounted on the circuit board 13 and stops at the rising limit position.

In the embodiment, the mounting surfaces 6 and 7 can be similarly applied even if they are formed on inclined surfaces. Further, the resonator 1 can be attached to the upper support arm 31 with bolts. In that case, the lower support arm 32 may be omitted. Further, the suction side ports may be provided on the opposite sides of the horn body 2 such that the suction side port is provided on the front surface of the horn body 2 and the suction side port is provided on the rear surface of the horn body 2.

Although the projections 34 and 37 of the embodiment have a shape that is continuous from one side to the other side as shown in FIG. 1B, the projections 34 and 37 have a shape such as a hemisphere, a mountain, or a truncated cone. As described above, the support portions 6 and 7 may be formed in a convex shape so as to be supported at points on the upper or lower surface of the mounting portions 33 and 36. Although the projections 34 and 37 are formed as a single body with the mounting portions 33 and 36, a structure in which a sphere or a roller as a separate member is embedded in the mounting portion as the projections 24 and 27, or a roller is mounted on the mounting portion may be used. .

In FIG. 3, the mounting surfaces 6;
A predetermined position for distributing the suction side port up and down at the same distance H3 is equal to H1.
Although the example in which the center line L2 between the upper and lower sides of the horn main body 2 is aligned is shown in the drawing, the present invention can be similarly applied even if the predetermined position is shifted upward or downward from the center line L2. In other words, the predetermined position is the center of the vertical division between the mounting surfaces 6 and 7 and the suction side port.

The equidistant distance H1 for distributing the joining action portions 3 and 4 up and down may not be exactly the same as long as the resonance balance of the resonator 1 transmitted from the vibrator 25 can be maintained. When the resonator 1 is turned upside down, the inner hole of the suction pad 51 may cause suction leakage with the suction side port or the suction side port. They need not be exactly the same as long as they can be connected so that they are not connected.

[Brief description of the drawings]

FIG. 1 shows a main part of an embodiment, wherein FIG. 1A is a front view and FIG. 1B is a side view.

FIG. 2 is a top view showing the resonator of the embodiment.

FIG. 3 is a rear view showing the resonator of the embodiment.

FIG. 4 is an exploded perspective view showing the resonator, the vibrator, and the support mechanism of the embodiment.

FIG. 5 is a front view showing the ultrasonic vibration bonding apparatus of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resonator 5 Support part 6 Mounting surface 7 Mounting surface 30 Support mechanism 33 Mounting part 34 Projection 36 Mounting part 37 Projection

Claims (2)

[Claims] 1. An ultrasonic vibration bonding apparatus characterized in that one of a resonator and a support mechanism for mounting the resonator is provided with a projection for supporting the other in a dotted or linear manner. 2. The ultrasonic vibration bonding apparatus according to claim 1, wherein the projection is provided on the support mechanism.