JP2002222788A - Substrate cleaning tool and substrate cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate cleaning tool capable of stably discharging a cleaning liquid, preventing contamination and damage of a substrate, and maintaining its shape, and a substrate cleaning apparatus using the substrate cleaning tool. In a substrate cleaning apparatus, pure water supplied from a pure water supply path is supplied to a cleaning brush by flowing into a flow path of a lower member and a flow path of a fixture. The cleaning brush 24 includes a main body 60 and a permeable core material 62.
And a resin sheet 63 coated on the core material 62. The core material 62 has a flow path 66 for flowing pure water to the lower surface of the core material 62 and a shielding for preventing the pure water from leaking to the side surface of the core material. And a seat 68. The air exhaust path 3 is provided in the flow path 36 of the lower member 33.
8 is connected, and the air in the flow paths 36 and 37 is appropriately exhausted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate cleaning tool and a substrate cleaning apparatus used for cleaning a substrate.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process, it is necessary to maintain high cleanliness on the surface of a semiconductor wafer (hereinafter, referred to as "wafer") on which semiconductor devices are formed. For this reason, the surface of the wafer is cleaned using a substrate cleaning apparatus before and after each manufacturing process and processing process, after a film forming step and after a polishing step.

As such a substrate cleaning apparatus, for example, Japanese Patent No. 2875213 has been disclosed. In this apparatus, while rotating the wafer, a brush is pressed against the surface of the wafer, and the wafer and the brush are relatively moved, thereby removing particulate contaminants from the surface of the wafer.

In the above-mentioned substrate cleaning apparatus of Japanese Patent No. 2875213, for example, the surface of a foamed PVA (polyvinyl alcohol) having a cell structure is coated as a brush with a protective film. In addition, as a brush used in the conventional substrate cleaning apparatus, for example, a hard brush made of a nylon brush having a hard bristle, or a soft brush made of a mohair brush having a soft bristle depends on a type of cleaning. Therefore, they are properly used.

[0005]

However, in the substrate cleaning apparatus disclosed in Japanese Patent No. 2875213, particles such as particle contaminants easily adhere to the protective film.
The particles may be transferred to the wafer and remain on the washed wafer. In addition, brushes made of nylon brushes, mohair brushes, etc., may not only contaminate the wafer due to such transfer of particles, but also
Particularly, in the case of a hard brush, there is a possibility that the surface of the wafer may be damaged by friction or scratch (scratch). In these conventional brushes, the surface of the brush is abraded as the number of times of cleaning is increased, resulting in unevenness and “habit”, making it difficult to maintain the initial contact pressure and possibly causing poor cleaning. .

Accordingly, an object of the present invention is to maintain the initial contact pressure without causing adhesion of particles, without causing damage due to friction or scratching, and without causing unevenness or "habiting" due to surface shaving. It is an object of the present invention to provide a substrate cleaning tool capable of satisfactorily cleaning a substrate and stably discharging a cleaning liquid, and a substrate cleaning apparatus using such a substrate cleaning tool.

[0007]

According to one aspect of the present invention, there is provided a cleaning tool for cleaning a substrate, comprising: a cleaning liquid supply path for supplying a cleaning liquid to the substrate; A water-permeable core material to which a cleaning liquid is supplied from a passage, wherein the core material has a flow path for flowing a cleaning liquid supplied from the cleaning liquid supply path provided in the core material to a lower surface of the core material;
A shielding sheet for preventing the leakage of the cleaning liquid to the side surface of the core material is provided, and the core material is covered with a water-permeable porous membrane.

In the substrate cleaning tool according to the first aspect, the lower surface of the substrate cleaning tool is pressed against the substrate while the cleaning liquid is supplied through the cleaning liquid supply path, and the substrate and the substrate cleaning tool are moved relative to each other. Washing is performed by moving it in a suitable manner. In the substrate cleaning tool, the cleaning liquid supplied through the cleaning liquid supply path is
The liquid is easily guided to the lower surface of the core material by a flow path provided in the core material, and is discharged to the substrate through fine holes formed in the porous film. The shielding sheet prevents the cleaning liquid from leaking from the side surface of the core material. For this reason, in the substrate cleaning tool, the cleaning liquid is intensively discharged only from the lower surface of the substrate cleaning tool, and the cleaning liquid is prevented from leaking from the side surface of the substrate cleaning tool and the discharge amount of pure water is prevented from being shaken, thereby stabilizing the discharge of the cleaning liquid. Can be done.

Here, since the cleaning liquid is always discharged from the lower surface of the substrate cleaning tool, there is a concern that particles adhere to the lower surface of the substrate cleaning tool (the surface of the porous film which is just the lower surface of the core material). Absent. For this reason, there is no concern that particles enter the inside of the porous film, and when cleaning the substrate, there is no problem that particles adhered to the porous film are transferred to the substrate and the substrate is contaminated. Further, since the porous film is brought into contact with the substrate in a state where the liquid film is formed on the surface of the substrate by the discharged cleaning liquid, the contact between the porous film and the substrate can be made smooth. For example, the porous film is indirectly contacted with the substrate with the liquid film formed on the surface of the substrate interposed therebetween, and the contact between the porous film and the substrate is smoothed. Since the contact between the porous film and the substrate is smooth as described above, even if the number of times of cleaning is increased, the shape is not lost due to abrasion or the like, and the substrate is not damaged. In addition, it is preferable to press the substrate cleaning tool in such a state that the porous film is indirectly in contact with the substrate with the liquid film interposed therebetween. However, depending on the contamination state of the substrate, the porous film may be directly contacted with the substrate. Alternatively, cleaning may be performed by pressing a substrate cleaning tool. Further, since the core material is covered with the porous film, there is no fear that the porous film is deformed due to the supply pressure of the cleaning liquid or the like, and the porous film can always maintain a predetermined shape.

According to a second aspect of the present invention, there is provided a cleaning tool for cleaning a substrate, comprising: a cleaning liquid supply path for supplying a cleaning liquid to the substrate; and a water-permeable core material to which the cleaning liquid is supplied from the cleaning liquid supply path. The core material has a flow path through which the cleaning liquid supplied from the cleaning liquid supply path provided in the core material flows to the lower surface of the core material, and a plurality of discharge ports for discharging pure water to the lower surface of the core material. An outlet is radially arranged from the lower central portion to the lower peripheral portion, and the flow path of the core material is branched into a plurality of flow paths so as to communicate with each of the plurality of discharge ports. Characterized by being covered with a porous membrane.

In the substrate cleaning tool according to the present invention, the lower surface of the substrate cleaning tool is pressed against the substrate while the cleaning liquid is supplied through the cleaning liquid supply path, and the substrate and the substrate cleaning tool are moved relative to each other. Washing is performed by moving it in a suitable manner. In the substrate cleaning tool, the cleaning liquid supplied through the cleaning liquid supply path is
The liquid is easily guided to the lower surface of the core material by a flow path provided in the core material, and is discharged to the substrate through fine holes formed in the porous film. The flow path of the core material branches into a plurality of flow paths and communicates with each of the plurality of discharge ports on the lower surface of the core material. Can be widely and easily guided. Therefore, the substrate cleaning tool can discharge the cleaning liquid from the entire lower surface without leakage.

According to a third aspect of the present invention, there is provided a cleaning tool for cleaning a substrate, comprising: a cleaning liquid supply path for supplying a cleaning liquid to the substrate; and a water-permeable core material to which the cleaning liquid is supplied from the cleaning liquid supply path. The core material includes a flow path through which a cleaning liquid supplied from the cleaning liquid supply path provided in the core material flows to a lower surface of the core material, and a flow path of the core material with respect to a flow path of the core material. An air exhaust path for exhausting the air inside is connected, and the core material is coated with a water-permeable porous membrane.

In the substrate cleaning tool according to the third aspect, the lower surface of the substrate cleaning tool is pressed against the substrate while the cleaning liquid is supplied through the cleaning liquid supply path, and the substrate and the substrate cleaning tool are moved relative to each other. Washing is performed by moving it in a suitable manner. In the substrate cleaning tool, the cleaning liquid supplied through the cleaning liquid supply path is
The liquid is easily guided to the lower surface of the core material by a flow path provided in the core material, and is discharged to the substrate through fine holes formed in the porous film. Also, when bubbles are mixed in the cleaning liquid supplied from the cleaning liquid supply path, if there is no escape place, the bubbles gradually accumulate and are compressed to apply pressure in the flow path of the core material. Unnecessary pure water is discharged from the lower surface, which is not preferable. However, by appropriately exhausting the air through the air exhaust passage, the pressure in the flow path of the core material can be maintained, and a predetermined amount of pure water can be discharged from the lower surface of the substrate cleaning tool. Further, since the air is appropriately exhausted by the air exhaust path, the inside of the flow path can be filled with the cleaning liquid, and the substrate cleaning tool does not discharge the cleaning liquid containing bubbles to the substrate. If the cleaning liquid containing air bubbles is discharged, the air bubbles may be mixed in the liquid film formed on the surface of the substrate, causing a cleaning failure. By filling, poor cleaning can be prevented.

In the substrate cleaning tool according to any one of the first to third aspects, as described in the fourth aspect, a flat portion is formed on a lower surface of the core material, and the flat portion is covered with the porous film. Is preferred. According to such a configuration, the porous film coated on the flat surface formed on the lower surface of the core material can be brought into surface contact with the substrate. For this reason, the contact area with the substrate can be increased, an excessive contact pressure can be prevented from being applied to a specific portion of the substrate, and good cleaning can be performed without damaging the substrate by eliminating a scratch (scratch). .

According to a second or third aspect of the present invention, as described in the fifth aspect, the substrate cleaning tool may include a shielding sheet for preventing the cleaning liquid from leaking to the side surface of the core material.

In the substrate cleaning tool according to the first or third aspect,
As described in claim 6, a plurality of discharge ports for discharging pure water are radially arranged on the lower surface of the core member from the lower central portion to the lower peripheral portion, and communicate with each of the plurality of discharge ports. As described above, the flow path of the core material may be branched into a plurality of flow paths.

[0017] As described in claim 7, the core material may be attached to the main body. In this case, the core is detachably attached to the main body as described in claim 8, and the porous membrane is attached to the main body using a fastening member as described in claim 9. Is preferred. Then, when attaching the core material to the main body,
The gap between the core material and the main body is closed, and the cleaning liquid leaks from this gap to make the discharge of pure water from the lower surface of the substrate cleaning tool unstable, or the porous film is deformed by the supply pressure of the cleaning liquid leaking from this gap. Can be prevented. Further, it is possible to prevent the porous film from peeling off from the core material.

The core material may be a resin having a large number of fine holes, for example.
The cleaning liquid is transmitted through fine holes formed in the core material. Of course, as described above, since the core has the shielding sheet, the cleaning liquid is passed only from the lower surface of the core.

In order to prevent the porous film from peeling off from the core material, the porous film may be fixed to the core material as described in claim 11.

[0020] The porous membrane may be made of a hydrophilic resin. Further, the porous film may be made of a water-repellent resin. The porous film made of resin can have a small friction coefficient on the outer surface, and particles are hardly generated. Even if particles are mixed in the cleaning liquid that has passed through the cleaning liquid supply passage, the particles may be outside the porous film due to the fine pores of the porous film as described above. It does not come out and contaminate the substrate. If the porous membrane is hydrophilic, the cleaning liquid can easily pass through the fine pores of the porous membrane. If the porous film is water-repellent, particles peeled off from the substrate by the cleaning can be repelled together with the cleaning liquid, and the particles can be more reliably prevented from adhering to the porous film.

According to a fourteenth aspect of the present invention, there is provided an apparatus for cleaning a substrate, comprising the steps of:
A thrust force with respect to the substrate cleaning tool according to any one of 9, 10, 11, 12 and 13, a support member that supports the substrate cleaning tool, and a pressing shaft that presses the substrate cleaning tool via the support member. And a drive section for applying the cleaning liquid, the cleaning liquid supply path is connected to the support member, and a flow path for flowing the cleaning liquid supplied from the cleaning liquid supply path into the core material is provided in the support member. It is characterized by:

According to the substrate cleaning apparatus of the present invention, a thrust is applied to the pressing shaft by the driving unit, and the substrate cleaning tool is indirectly or directly contacted with the substrate at a predetermined contact pressure. Also, the cleaning liquid supply path is connected to the support member,
The cleaning liquid supplied from the cleaning liquid supply path flows through the flow path of the support member and is supplied into the core material.

According to a fourteenth aspect of the present invention, in the substrate cleaning apparatus according to the fifteenth aspect, an air exhaust path for exhausting air in a flow path of the support member is connected to the support member. preferable. If bubbles are mixed in the cleaning liquid supplied from the cleaning liquid supply path, the bubbles accumulate in the flow path of the support member, and the air in the flow path is compressed. If the inside of the flow path of the support member is left as it is, pressure is applied to the flow path of the support member by the compressed air, and unnecessarily pure water is discharged from the lower surface of the substrate cleaning tool. . However, by appropriately exhausting air from the inside of the flow path of the support member by the air exhaust path, the pressure in the flow path of the support member is maintained, and a predetermined amount of pure water is discharged from the lower surface of the substrate cleaning tool. It becomes possible. Further, since the cleaning liquid flows into the core material from the flow path filled with the cleaning liquid, the substrate cleaning tool does not discharge the cleaning liquid mixed with air bubbles to the substrate. If the cleaning liquid containing air bubbles is discharged, the air bubbles may be mixed in the liquid film formed on the surface of the substrate, causing a cleaning failure. By filling, poor cleaning can be prevented.

According to another aspect of the present invention, the liquid level detecting means detects that the height of the liquid level in the flow path of the support member reaches the opening position of the cleaning liquid supply path. A sensor for detecting that the height of the liquid surface in the flow path of the support member has reached the ceiling of the flow path of the support member, and detecting whether air is accumulated in the flow path of the support member. A bubble sensor for detecting, and a control unit for controlling an on-off valve provided in the air exhaust path based on a detection signal output from the liquid level sensor and a detection signal output from the bubble sensor. good. For example, when the cleaning liquid supplied from the cleaning liquid supply path accumulates in the flow path of the support member and the liquid level rises, and the height of the liquid level rises to the opening position of the cleaning liquid supply path,
The liquid level sensor detects this, and outputs a detection signal to the control unit. The control unit that has received the detection signal controls the open / close valve to open, and releases the air accumulated in the flow path of the support member to the air exhaust path. When the liquid level reaches the ceiling of the flow path of the support member, the bubble sensor detects this and outputs a detection signal to the control unit. The control unit that has received the detection signal performs control to close the on-off valve. Thus, the inside of the flow path of the support member is filled with the cleaning liquid. Thereafter, when air bubbles are mixed in the cleaning liquid supplied from the cleaning liquid supply path and air accumulates on the ceiling of the flow path of the support member, the height of the liquid level also decreases. Will not be output. Then, the control unit controls the opening and closing valve to be opened, appropriately releases air accumulated on the ceiling of the flow path of the support member to the air exhaust path, and maintains the pressure in the flow path of the support member.

It is preferable that an ultrasonic oscillation mechanism is provided for oscillating ultrasonic waves by oscillating ultrasonic waves in the cleaning liquid passing through the flow path of the support member. According to such a configuration, the cleaning liquid is supplied to the surface of the substrate in a state of being ultrasonically vibrated, so that the cleaning power is improved.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of the present invention will be described based on a substrate cleaning apparatus configured to clean the front and back surfaces of a wafer as an example of a substrate. Figure 1
1 is a perspective view of a cleaning system 1 incorporating a substrate (front surface) cleaning device 7 according to the present embodiment. The cleaning system 1 is configured to carry in the wafers W on a carrier C basis, clean and dry the wafers W one by one, and carry out the wafers W on a carrier basis.

The cleaning system 1 is provided with a mounting portion 2 on which four carriers C containing wafers W can be mounted. At the center of the cleaning system 1, an unloading arm 3 for taking out the wafers W before the cleaning step one by one from the carrier C mounted on the mounting section 2 and storing the wafers W after the cleaning step in the carrier C. Is arranged. A transfer arm 4 serving as a transfer mechanism for exchanging wafers W with the take-out storage arm 3 is on standby at the back of the take-out storage arm 3. The transfer arm 4 is provided movably along a transfer path 6 provided at the center of the cleaning system 1. Various processing devices are arranged on both sides of the transport path 6.
Specifically, on one side of the transfer path 6, the substrate cleaning device 7 for cleaning the front surface of the wafer W and the substrate (back surface) cleaning device 8 for cleaning the back surface of the wafer W are provided. They are arranged side by side. These substrate cleaning devices 7 and 8 are configured to rotate the wafer W and spin dry. On the other side of the transport path 6, four heating devices 9 are provided in a stacked manner. The heating device 9 is a means for heating and drying the wafer W. Two wafer reversing devices 10 are stacked adjacent to the heating device 9.

Here, the configuration of the substrate cleaning apparatus 7 will be described. FIG. 2 is a plan view of the substrate cleaning apparatus 7, and FIG.
Is a longitudinal sectional view thereof. A spin chuck 22 that is rotated by a motor 21 while horizontally holding a wafer W by suction at a substantially center of a case 20;
2 and a cup 23 which surrounds the wafer W and prevents the cleaning liquid or the like supplied to the surface of the wafer W from scattering around. A scrub cleaner 25 for cleaning the wafer W with a cleaning brush 24 as a substrate cleaning tool is arranged near one side of the case 20. The scrub cleaning machine 25 shown in FIG. 2 shows a state where the scrub cleaner 25 stands by at a position away from the wafer W. Also, on the front side of the case 20,
A loading / unloading port 7a that can be opened and closed by a shutter (not shown) is provided, and the wafer W is loaded into and unloaded from the substrate cleaning apparatus 7 by the transfer arm 4 via the loading / unloading port 7a. Note that, besides the spin chuck 22, for example, a mechanical chuck that holds the peripheral portion of the wafer W using claws or a ring may be used to hold the wafer W horizontally.

In the scrub cleaning machine 25, a cleaning brush 24 is attached to a tip end of an arm member 26, and the arm member 26 is fixed to an upper end of a shaft 27 in a horizontal posture. The shaft 27 is configured to be vertically movable and rotatable by a drive mechanism (not shown). Therefore,
The arm member 26 is moved by the rotation of the drive mechanism, as shown in FIG.
It turns in the θ direction inside and can reciprocate above the wafer W.

As shown in FIG. 4, the arm member 26 has a frame 26a and a cover 26b. At the tip of the arm member 26, an air bearing cylinder 30 as a drive unit for moving the cleaning brush 24 up and down is fixedly disposed on a frame 26a. In the air bearing cylinder 30, a rod 31 as a pressing shaft is projected both above and below the air bearing cylinder 30, and this rod 31 is floated in the air bearing cylinder 30 by using air pressure to have no friction. It is designed to be raised and lowered in a state. For this reason, the air bearing cylinder 30 has a sliding resistance equal to zero and has excellent wear resistance. No components such as a motor, a pulley, and a belt for rotating the cleaning brush 24 are provided in the arm member 26. For this reason, the scrub cleaning machine 25 cleans the wafer W without rotating the cleaning brush 24. On the other hand, parts such as a motor for driving the cleaning brush 24 to rotate and a pulley, a belt, etc.
6, the cleaning brush 24 may be rotated to clean the wafer W.

On the other hand, the lower member 3
2. The cleaning brush 24 is supported via the attachment 33, and the lower member 32 and the attachment 33 play a role as a support member. Therefore, the air bearing cylinder 3
The rod 31 and the cleaning brush 24 are integrally moved up and down (in the direction of the reciprocating arrow A in FIG. 4) with the operation of the rod 31. The lower member 3
A mounting member 33 is detachably attached to 2 by a screw structure. Therefore, when the product life of the old cleaning brush 24 has expired, it can be easily replaced with a new cleaning brush 24. Further, various cleaning brushes can be easily attached to the scrub cleaning machine 25 in accordance with various cleaning.

FIG. 5 is an explanatory sectional view of the rod 31, the lower member 32, the attachment 33, and the cleaning brush 24. As shown in FIG. 5, the lower member 32 is connected to a pure water supply path 35 as a cleaning liquid supply path for supplying pure water as a cleaning liquid to the wafer W, for example. A flow path 36 for flowing pure water supplied from a pure water supply path 35 into the core 62 is provided in the lower member 32. The channel 36 is provided with the fixture 3
3, and communicates with the flow paths 37, 3.
The pure water having passed through 7 flows into the cleaning brush 24 and is discharged from the flat portion 65 to the wafer W as described later. The lower member 32 is connected to an upper end portion of the flow path 36 for exhausting air accumulated in the flow paths 36 and 37. An open / close valve 39 is provided in the air exhaust path 38.

As shown in FIG. 6, the pure water supply path 35
An air operated valve 40, a variable regulator 41 including a mass flow controller and the like, a filter 42, and a flow meter 43 including a digital flow meter and the like are sequentially provided. The air operation valve 40 is openable and closable (ON / OFF), and connects or disconnects the pure water supply path 35. The variable regulator 41 is based on a process recipe or the like.
The pure water flow rate of the pure water supply path 35 is appropriately changed. In the process recipe, the flow rate of pure water is set according to the type of wafer cleaning, the progress of processing, and the like. The filter 42 is connected to the pure water supply path 3
The pure water flowing through the inside 5 is purified, and the flow meter 43 monitors whether the pure water flow rate is actually the flow rate set in the process recipe or the like. Thus, pure water adjusted to an optimal flow rate according to the type of wafer cleaning, the progress of processing, and the like is supplied from the pure water supply path 35.

As shown in FIG. 5, a liquid level sensor 45 and a bubble sensor 46 are attached to the flow path 36. The liquid level sensor 45 detects that the height of the liquid level in the flow path 36 has just risen to the position (height) where the pure water supply path 35 is connected, that is, the opening position of the pure water supply path 35,
The foam sensor 46 is configured to detect that the liquid level in the flow path 36 has risen to the ceiling of the flow path 36 and to detect whether or not bubbles are accumulated on the ceiling of the flow path 36. I have. The detection signals from the liquid level sensor 45 and the foam sensor 46 are output to a controller 47 as a control unit.
The opening and closing of the on-off valve 39 is controlled based on the detection signal from the controller 6.

Here, the on-off valve 3 by the controller 47 is used.
9 will be described with reference to FIGS. 7 to 9. First, the air operation valve 40 is opened (ON), and pure water is supplied from the pure water supply path 35 to the flow path 36 of the lower member 32. The supplied pure water passes through the flow paths 36 and 37 and passes through the core 62.
It flows through the inside and is discharged from the flat portion 65 of the cleaning brush 24 onto the wafer W. For example, when pure water is started to be supplied from the pure water supply path 35, the discharge amount of the cleaning brush 24 becomes smaller than the pure water supply path 35.
When the supply amount is large, as shown in FIG. 7, pure water accumulates in the flow path 36 and the liquid level rises. On the other hand, controller 4
7 controls the on-off valve 39 to be closed, so that air bubbles mixed in the pure water gradually accumulate in the flow path 36, and the air in the flow path 36 is compressed.

As shown in FIG. 8, when the liquid level of the flow path 36 rises to the opening position of the pure water supply path 35, the liquid level sensor 45 detects this and outputs a detection signal to the controller 47. I do. Upon receiving this detection signal, the controller 47
Control is performed to open the on-off valve 39. Then, the flow path 36
Air compressed from inside flows into the air exhaust passage 38 and is exhausted to the outside.

Thereafter, as shown in FIG. 9, the height of the liquid surface of the flow path 36 reaches the ceiling of the flow path 36, and the bubble sensor 46 detects this, and outputs a detection signal to the controller 47. The controller 47 receiving this detection signal controls the on-off valve 39 to close. Thus, the flow paths 36, 3
The inside of 7 is filled with pure water. In addition, the flow path 3
The cleaning brush 2 is filled by filling the inside of the 6, 37 with pure water.
No bubbles are mixed into the pure water discharged from the nozzle 4. Thereafter, for example, the supply amount of the pure water supply path 35 is reduced to balance the supply amount of the pure water supply path 35 and the discharge amount of the cleaning brush 24 so that the insides of the flow paths 36 and 37 are filled with pure water. By discharging pure water containing no air bubbles from the nozzle, or by maintaining the supply amount of the pure water supply path 35 as it is, the water pressure in the flow paths 36 and 37 is increased to increase the discharge amount of the cleaning brush 24, The supply amount of the pure water supply path 35 and the discharge amount of the cleaning brush 24 are balanced so that the inside of the flow path 36 is filled with pure water, and at the same time, pure water containing no air bubbles is discharged from the cleaning brush 24.

On the other hand, even after the insides of the flow paths 36 and 37 are filled with pure water, bubbles may be mixed in the pure water supplied from the pure water supply path 35 and air may accumulate on the ceiling of the flow path 36. . If air accumulates on the ceiling of the flow path 36 in this manner, the level of the liquid level also drops, so that, for example, a detection signal from the bubble sensor 46 is not output to the controller 47.
Then, the controller 47 controls the opening and closing valve 39 to open, and releases the air accumulated on the ceiling of the flow path 36 to the air exhaust path 38. When the liquid level reaches the ceiling of the flow path 36 again, the detection signal from the bubble sensor 46 is transmitted to the controller 4.
7, and the controller 47 again outputs the on-off valve 3
9 is closed. When the air accumulated on the ceiling of the flow path 36 is not released, the accumulated air is compressed and pressure is applied to the flow paths 36 and 37. Then,
A situation in which pure water whose flow rate, flow velocity, and the like are excessively large is discharged from the cleaning brush 24, adversely affecting cleaning. However, by appropriately releasing the air collected on the ceiling of the flow path 36, pure water can be normally discharged from the flat portion 65 of the cleaning brush 24.

As shown in FIG.
An ultrasonic oscillation mechanism 50 is provided at a tip end of 7, and a plurality of ring-shaped ultrasonic oscillators 51 surrounding the flow path 37 are provided inside the ultrasonic oscillation mechanism 50. In this case, the ultrasonic oscillation mechanism 50 may be configured to be able to be turned on / off by a power supply control unit (not shown).
Further, the configuration may be such that the intensity of ultrasonic vibration of the ultrasonic oscillation mechanism 50 can be adjusted. Further, it is possible to provide an ultrasonic oscillation mechanism 50 outside the cleaning brush 24.

Next, the structure of the cleaning brush 24 will be described. As shown in FIG. 10, the cleaning brush 24 includes a column-shaped main body 60 mounted on the lower end of the attachment 33. A resin such as PTFE (polytetrafluoroethylene) is used as a material of the main body 60.
A flow channel 61 is provided inside. In this body 60,
A water-permeable core material 62 is detachably attached by a screwing method. A resin sheet 63 is provided on the outer peripheral surface of the core material 62.
Is coated.

The material of the core member 62 can be kept in a predetermined shape without deformation even when water pressure is applied when supplying pure water, and the material components are not dissolved in the pure water. It is preferable to use a resin so that the shape can be freely and easily changed by cutting as needed. Examples of such a resin material include a resin such as PE (polyethylene). The same is required for the material of the core material 62 even when a chemical solution is used as the cleaning liquid. In the illustrated example, the core member 62 is formed in a circular cylindrical shape, and a screw portion 64 to be inserted into the main body 60 is formed at an upper portion.
A flat portion 65 is formed on the surface facing the wafer W, that is, on the lower surface. Thus, when the pure water flows into the core material 62, the core material 62 allows the pure water to pass through the resin sheet 63 without being deformed or dissolved. It should be noted that a large number of fine holes are formed in the core material 63, and pure water may be transmitted through these many fine holes. The same is required for the material of the core material 62 even when a chemical solution is used as the cleaning liquid.

In order to allow pure water to permeate in a short time, a flow path 66 for flowing pure water supplied from the pure water supply path 35 to the lower surface of the core material 62 is provided in the core material 62. Channel 6
Numeral 6 communicates with the air exhaust path 38 via the flow paths 36 and 37, and is filled with pure water similarly to the flow paths 36 and 37.
The flow path 66 of the core material is formed in a straight line along the vertical axis direction from the screw portion 64 to the middle, and thereafter, the plurality of flow paths 66a, 66b, 66c, 66d, 66e, 6
6f, 66g... On the other hand, as shown in FIG. 11, a plurality of discharge ports 67a, 67
, 67c, 67d, 67e, 67f, 67g... are radially arranged from the center of the lower surface to the periphery of the lower surface. The plurality of discharge ports 67a, 67b, 67c, 67
With respect to d, 67e, 67f, 67g, etc., the shape of the core member 62 formed at the center of the lower surface and the one formed at the peripheral portion of the lower surface change from a circular shape to an elliptical shape toward the peripheral portion of the lower surface. It gradually becomes deformed. Then, the plurality of flow paths 66a, 66b, 66c, 66
.., d, 66e, 66f, 66g... correspond to a plurality of discharge ports 67a, 67b, 67c, 67d, 67e, 6 respectively.
7f, 67g... Respectively. In this manner, the core member 62 guides the pure water widely from the central portion of the lower surface to the peripheral portion of the lower surface, and allows the pure water to pass through the resin sheet 63. Also, for example, the flow path 66d connected to the discharge port 67d formed at the center of the lower surface of the core material 62 is formed linearly and has a short distance.
The flow path 66a connected to the discharge port 67a formed on the lower surface peripheral portion of the device may be formed to be inclined at a long distance and a long distance may cause a pressure loss. By gradually changing the shape of the discharge port to an elliptical shape to increase the opening area, it becomes possible to discharge pure water equally from the entire lower surface of the core member 62 and, consequently, the entire flat portion 65.

On the side surface of the core member 62, a shielding sheet 6 for waterproofing is provided.
The resin sheet 63 is fixed to the core member 62 with the shielding sheet 68 interposed therebetween. Thus, the shielding sheet 6
By providing pure water 8, it is possible to prevent pure water from permeating from the side of the core material and prevent the pure water from leaking from the side surface of the cleaning brush 24, and to concentrate the pure water on the lower surface of the core material 62 for cleaning. The ink is stably discharged from the flat portion 65 of the brush 24. The resin sheet 63 extends to the main body 60 and also covers the outer peripheral surface of the main body 60, and is caulked at the lower part of the main body 60 by a clamp ring 69 so as not to peel off from the core material 62. As described above, the core member 62 is screwed into the main body 60, and the resin sheet 6 is attached to the main body 60.
By tightening 3 with the clamp ring 69,
The gap between the main body 60 and the core member 62 is closed, and pure water is prevented from leaking from this gap, so that the pure water is more stably discharged from the flat portion 65. Further, the resin sheet 63 is prevented from being deformed by the supply pressure of pure water leaking from the gap. The fixing of the resin sheet 63 is performed by, for example, heat welding, and the core material 62 and the shielding sheet 68 are air-tightly covered with the resin sheet 63. Alternatively, the resin sheet 63 may be adhered to the core 62 and the shielding sheet 68 using an adhesive (one in which the adhesive component does not dissolve in pure water). The resin sheet 63 may be pressed against the 62 and the shielding sheet 68.

The resin sheet 63 is made of a porous material having a small coefficient of friction on its surface so that particles are less likely to be generated by abrasion, and having a large number of fine holes formed therein so that pure water can be discharged. Is used. Examples of such a resin include a fluorine resin and a polyolefin resin. For example, the thickness is 0.1 mm, for example.
For example, a PTFE sheet or the like having a size of about 0.01 mm to several mm and a hole size of about 0.01 μm to several hundred μm is used. In this way, the resin sheet 63 functions as a water-permeable porous membrane, is hard to be worn down, and can be used for a long time.

The scrub cleaner 25 forms a liquid film on the wafer W with pure water discharged from the cleaning brush 24 and performs a cleaning process. The thickness of the liquid film depends on the number of rotations of the wafer W, the contact pressure (weight) of the cleaning brush 24, the cleaning brush 2
The amount of pure water is determined by three factors. That is, as shown in FIG.
The rotation speed from the motor 21, for example, the supply amount (discharge amount) of pure water from the flow meter 43 of the pure water supply path 35, the vertical thrust (that is, the vertical thrust applied to the cleaning brush 24 from the air bearing cylinder 30 through the rod 31. Cleaning brush 2
4) are input. The contact pressure of the cleaning brush 24 is the sum of the weight of the cleaning brush 24 and the pressing force of the cleaning brush 24. Since the weight of the cleaning brush 24 is a known value, the thrust is input from the air bearing cylinder 30. Then, the contact pressure of the cleaning brush 24 is automatically determined. Based on these three inputs, the controller 47 controls the air bearing cylinder 30 so as to maintain the cleaning brush 24 at a predetermined height, and determines the thickness L of the liquid film 70 (the distance between the wafer W and the cleaning brush 24). It is supposed to.

In addition, the substrate cleaning apparatus 7 is provided with a pure water supply nozzle 80 that can reciprocate in the θ ′ direction in FIG. 2 at a position symmetrical to the scrub cleaner 25 with the spin chuck 22 interposed therebetween. A nozzle 81 is provided at the tip of the pure water supply nozzle 80.
The nozzle 81 supplies pure water.

Next, the wafer W performed in the cleaning system 1 provided with the substrate cleaning apparatus 7 configured as described above.
Will be described. First, a transfer robot (not shown) places a carrier C containing, for example, 25 wafers W that have not been cleaned yet, on the placement unit 2. Then, the wafers W are loaded one by one from the carrier C placed on the placing section 2.
Is taken out, and the transfer arm 4 is
Passed to. Then, the wafers W are cleaned one by one by using the substrate cleaning device 7 and the substrate cleaning device 8.
Particles such as particle contaminants adhering to the front and back surfaces are removed. The wafer W having undergone the predetermined cleaning step is transferred from the transfer arm 4 to the unloading and storing arm 3 and stored in the carrier C again.

Here, the cleaning in the substrate cleaning apparatus 7 will be described. The wafer W is rotated by the spin chuck 22. On the other hand, in the scrub cleaning machine 25 in the standby state of FIG. 2, the arm member 26 is turned to move the cleaning brush 24 above the wafer W, for example, near the center of the wafer W. Next, the cleaning brush 24 is pressed against the surface of the wafer W by the operation of the air bearing cylinder 30 while supplying pure water through the pure water supply path 35.
The cleaning is performed by relatively moving the wafer W and the cleaning brush 24. For example, the surface of the wafer W is uniformly cleaned by reciprocating the arm member 26 from the center of the wafer W to the periphery.

The pure water supplied from the pure water supply passage 35 flows through the core member 62 through the flow passage 36 of the lower member 32 and the flow passage 37 of the mounting portion 33. Then, the liquid is discharged from the flat portion 65 of the cleaning brush 24 to the wafer W through the fine holes formed in the resin sheet 63, and the liquid film 70 is formed on the surface of the wafer W. If necessary, the pure water supply nozzle 80 may also be moved above the wafer W to supply pure water to the surface of the wafer W.

When bubbles are mixed in the pure water supplied from the pure water supply path 35, the bubbles accumulate in the upper part of the flow path 36, and the air in the flow path 36 is compressed. Channel 3
If the inside of the channel 6 is left as it is, pressure is applied to the channels 36 and 37 and further to the channel 66 by the compressed air,
Unnecessary pure water is discharged from the lower surface of the cleaning brush 24, which is not preferable. While doing, the air exhaust passage 3
By appropriately evacuating the air from inside the flow path 36 by using the pressure 8, the pressure in the flow paths 36, 37, and 66 can be maintained, and a predetermined amount of pure water can be discharged from the lower surface of the cleaning brush 24. Can be carried out.

For example, as shown in FIG.
The pure water supplied from 5 accumulates in the flow path 36 and the liquid level rises. When the height of the liquid level rises to the opening position of the pure water supply path 35 as shown in FIG. Is detected by the liquid level sensor 45 and a detection signal is output to the controller 47. The controller 47 that has received the detection signal controls the opening and closing valve 39 to open, and releases the air accumulated in the flow path 36 to the air exhaust path 38. Also, as shown in FIG.
When the liquid level reaches the ceiling of the flow path 36, the bubble sensor 46 detects this and outputs a detection signal to the controller 47. Upon receiving this detection signal, the controller 47
The on-off valve 39 is controlled to be closed. Thus, channel 3
6, 37 and 66 are filled with pure water. Thereafter, when air bubbles are mixed in the pure water supplied from the pure water supply path 35 and air accumulates on the ceiling of the flow path 36, the height of the liquid level also decreases. It is no longer output to the controller 47. Then, the controller 47 controls the opening / closing valve 39 to open, and appropriately releases the air accumulated on the ceiling of the flow path 36 to the air exhaust path 38 to maintain the pressure in the flow path 36.

Since the pure water flows from the flow paths 36 and 37 filled with the pure water into the core material 62 to fill the flow path 66 with the pure water, the cleaning brush 24 applies the cleaning liquid containing bubbles to the wafer W. Is not discharged. If the pure water mixed with the bubbles is discharged, the bubbles may be mixed in the liquid film 70 and a cleaning failure may occur.
By filling the insides of 6, 37 and 66 with pure water, it is possible to prevent poor cleaning.

At the tip of the flow path 37, ultrasonic waves are oscillated from the ultrasonic oscillator 51 into pure water, and the pure water is discharged to the wafer W in a state of being vibrated by the ultrasonic waves. When the pure water vibrated in this way is supplied to the surface of the wafer W, the cleaning power can be improved as compared with the case where pure water not vibrated is supplied.

In the cleaning brush 24, pure water flows from the channel 61 of the main body 60 to the channel 66 of the core 62. This flow path 66
Are a plurality of flow paths 66a, 66b, 66c, 66d, 66
, 66f, 66g,... and a plurality of discharge ports 67a, 67b, 67c, 67d, 67e, on the lower surface of the core member 62.
67f, 67g,..., So that pure water can be easily and widely introduced from the central portion of the lower surface of the core member 62 to the peripheral portion of the lower surface. Therefore, the cleaning brush 24 can discharge pure water from the entire lower surface without leakage. Further, the shielding sheet 68 prevents pure water from leaking from the side surface of the core member 62. Therefore, in the cleaning brush 24, pure water is concentrated and discharged only from the lower surface of the cleaning brush 24, and pure water leaks from the side surface of the cleaning brush 24 to prevent the discharge amount of the pure water from being blurred. Discharge can be stabilized.

The core material 62 is screwed and fixed to the main body 60, and the core material 62 and the main body 60 are covered with a resin sheet 63. The resin sheet 63 is attached to the main body 60 by using the clamp ring 69. The gap between the material 62 and the main body 60 can be closed, and pure water leaks from this gap, and the discharge of pure water from the lower surface of the cleaning brush 24 becomes unstable. The sheet 63 can be prevented from being deformed. Also,
The resin sheet 63 can be prevented from peeling off from the core material 62.

When the cleaning brush 24 is brought into contact with the surface of the wafer W, the cleaning brush 24 is lowered to a predetermined height, as shown in FIG.
0, the resin sheet 63 is indirectly brought into contact with the wafer W, and the contact between the resin sheet 63 and the wafer W is made smooth.
Therefore, the wafer W is not damaged.
A predetermined contact pressure is applied to the surface of the wafer W in such a state of indirect contact. Here, the pressing force of the cleaning brush 24 is adjusted so as to have a predetermined contact pressure. For example, when the weight of the cleaning brush 24 is about 30 gf, for example, 20
By applying a downward thrust of gf (the pressing force of the cleaning brush 24 is plus 20 gf), the contact pressure of the cleaning brush 24 can be adjusted to 50 gf, and the weight of the cleaning brush 24 is about 100 gf. When an upward thrust of, for example, 80 gf is applied to the rod 31 by the air bearing cylinder 30 (the pressing force of the cleaning brush 24 is minus 80 gf), the contact pressure of the cleaning brush 24 becomes 20 gf.
It is possible to adjust.

When the cleaning brush 24 is lowered to a predetermined height, the controller 47 informs the controller 21 of the rotation speed.
The supply amount (discharge amount) of pure water from the flow meter 43 of the pure water supply path 35 and the thrust applied to the cleaning brush 24 through the rod 31 from the air bearing cylinder 30 are input, and the controller 4 is controlled based on these three inputs.
7 is a distance L between the wafer W and the cleaning brush 24, that is, the liquid film 7
A thickness L of 0 is determined.

Further, since pure water is always discharged from the surface of the cleaning brush 24, there is a concern that particles adhere to the lower surface of the cleaning brush 24 (the surface of the resin sheet 63 which is just the lower surface of the core member 62). Absent. For this reason, there is no fear that particles enter the inside of the resin sheet 63, and when cleaning the wafer W, the resin sheet 6
There is no problem that the particles attached to 3 are transferred to the wafer W and the wafer W is contaminated.

Further, in the PTFE resin sheet 63, the coefficient of friction on the surface of the sheet is reduced, so that the adhesion between the surface of the resin sheet 63 and the particles is reduced, and the particles are less likely to adhere reliably. In addition, PT
Since FE has high chemical resistance to chemicals, for example, ozone water, electrolytic ionized water, hydrochloric acid / hydrogen peroxide, ammonia / hydrogen peroxide, phosphoric acid solution, sulfuric acid solution, hydrofluoric acid solution or the like can be used as the cleaning solution. Therefore, the cleaning effect can be enhanced.

Since the core 62 is covered with the resin sheet 63, the resin sheet 63 does not have to be deformed by the supply pressure of pure water or the like, and the resin sheet 63 can always maintain a predetermined shape. In addition, since the contact between the resin sheet 63 and the wafer W is smooth, even if the number of times of cleaning is increased, the shape is not lost due to abrasion or the like. In this manner, the cleaning brush 24 is not biased or “habited”, and the initial contact pressure can be maintained.

Further, in this case, the resin sheet 63 covering the flat portion 65 formed on the core member 62 can be brought into surface contact with the wafer W. Therefore, the wafer W
The contact area with the wafer W can be increased, and an excessive contact pressure can be prevented from being applied to a specific portion of the wafer W, and good cleaning can be performed without a scratch (scratch) and without damaging the wafer W.

Although an example of the embodiment of the present invention has been described, the present invention is not limited to this example but can take various forms. For example, FIG. 13 shows a modification of the pure water supply path. In the pure water supply path 90 shown in FIG. 13, the air operation valve 40, the quantitative regulator 91, and the filter 42
And a switching valve 92 are sequentially provided. From the switching valve 92, the pure water supply path 90 is set to 100 milliliters (mL) / mi.
n conduit 94 in which n flow meters 93 are provided;
Branches into conduits 96 provided with a flow meter 95 of milliliter (mL) / min. These conduits 94 and 96 communicate with the flow passages 36 of the lower member 32, respectively. The output of the metering regulator 91 is 100 milliliter (mL)
/ Min and 500 milliliters (mL) / min
The switching valve 92 switches the pipelines 94 and 96 in accordance with the output of the metering regulator 91.

It is also possible to remove the main body from the cleaning brush. FIG. 14 shows an example of such a cleaning brush. In the cleaning brush 100 shown in FIG.
3 is detachably attached. In this case, a female screw part 101 is formed at the lower part of the attachment 33 so that the screw part 64 of the core member 62 can be screwed therein. The resin sheet 63 is attached to a lower portion of the attachment 33 using a clamp ring 69. The size of the cleaning brush 100 from which the main body has been removed can be reduced. The cleaning brush 100 has substantially the same configuration as the previously described cleaning brush 24 except that the main body is removed.
The same reference numerals are given to the same components as those described above, and the description thereof will not be repeated.

For example, as the material of the resin sheet 63, in addition to the above-mentioned PTFE, the size of the hole is several μm to several tens μm.
It is also possible to use a porous material such as a polyolefin resin which has been subjected to an antistatic treatment.

A resin sheet 63 made by dipping PTFE in alcohol to make it hydrophilic can be used. In this case, since the resin sheet 63 becomes hydrophilic, it becomes easier for pure water to pass through the fine holes of the resin sheet 63. Here, even if particles may be mixed in the pure water that has passed through the pure water supply path 35, the particles may be mixed in the resin sheet 63 because the holes of the resin sheet 63 are minute as described above. Out of the wafer W to contaminate the wafer W.

On the other hand, it is also possible to use a resin sheet 63 which has been made water-repellent (hydrophobic) by subjecting PTFE to a water-repellent treatment. In this case, since the resin sheet 63 becomes water-repellent, particles peeled off from the wafer W by washing can be repelled together with pure water. Therefore, the resin sheet 6
3 can be more reliably prevented from adhering particles.

The present invention is also applicable to a case where an oxide film is etched with a hydrofluoric acid solution, a case where a nitride film is etched with a phosphoric acid solution, and a case where aluminum is etched with a mixed solution of phosphoric acid, acetic acid and nitric acid. Applicable to cleaning processing. In addition, APM
When removing particles with a solution (ammonia + hydrogen peroxide + pure water) or when cleaning metal contamination with an HPM solution (hydrochloric acid + hydrogen peroxide + pure water), the SPM
The present invention can be applied to a case where an organic substance in a resist film is removed by a solution (nitric acid + hydrogen peroxide solution).

Further, it is also possible to carry out cleaning by rotating the cleaning brush about the vertical direction and bringing the cleaning brush and the wafer into direct contact with each other while rotating the cleaning brush. Further, the substrate is not limited to a wafer as in the above-described embodiment of the present invention, and may be an LCD substrate, a CD substrate, a printed substrate, a ceramic substrate, or the like.

[0069]

According to the present invention, the cleaning liquid can be stably discharged from the lower surface of the substrate cleaning tool. Further, contamination and damage of the substrate can be prevented, and the substrate cleaning tool can always be kept in a predetermined shape. Therefore, the substrate can be favorably cleaned while maintaining the initial contact pressure. Further, since bubbles are not mixed into the cleaning liquid supplied to the substrate from the substrate cleaning tool, it is possible to prevent defective cleaning.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cleaning apparatus provided with a substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of the substrate cleaning apparatus according to the embodiment of the present invention.

FIG. 3 is a longitudinal sectional view of the substrate cleaning apparatus according to the embodiment of the present invention.

FIG. 4 is a vertical sectional view of the scrub cleaning machine.

FIG. 5 is a longitudinal sectional view of a rod, a lower member, a fixture, and a cleaning brush.

FIG. 6 is a pipeline diagram of a pure water supply path.

FIG. 7 is an explanatory diagram showing a state in which pure water is supplied from a pure water supply path and a liquid level in a flow path of a lower member is rising.

FIG. 8 is an explanatory view showing a state in which pure water is supplied from a pure water supply path, and the height of the liquid surface in the flow path of the lower member has risen to an opening position of the pure water supply path.

FIG. 9 is an explanatory view showing a state in which pure water is supplied from a pure water supply path and the height of the liquid surface in the flow path of the lower member rises to the ceiling of the flow path of the lower member.

FIG. 10 is an enlarged longitudinal sectional view showing a part of a fixture and a cleaning brush.

FIG. 11 is an explanatory diagram of a lower surface of a core material.

FIG. 12 is an explanatory diagram showing a state in which the controller controls the thickness of the film thickness (the distance between the cleaning brush and the wafer).

FIG. 13 is a pipeline diagram showing a modification of the pure water supply path.

FIG. 14 is a longitudinal sectional view showing a modification of the cleaning brush.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cleaning system 7 Substrate cleaning device 24 Cleaning brush 30 Air bearing cylinder 31 Rod 32 Lower member 33 Attachment 35 Pure water supply path 36, 37, 61, 66 Flow path 38 Air exhaust path 51 Ultrasonic vibration mechanism 60 Body 62 Core material 63 Resin sheet 65 Flat part 68 Shielding sheet 69 Clamp ring 70 Liquid film W Wafer

Claims (17)

[Claims] 1. A cleaning tool for cleaning a substrate, comprising: a cleaning liquid supply path for supplying a cleaning liquid to the substrate; and a water-permeable core material to which the cleaning liquid is supplied from the cleaning liquid supply path. Is provided with a flow path for flowing the cleaning liquid supplied from the cleaning liquid supply path provided in the core material to the lower surface of the core material, and a shielding sheet for preventing the cleaning liquid from leaking to the side surface of the core material. Is a substrate cleaning tool characterized by being coated with a water-permeable porous membrane. 2. A cleaning tool for cleaning a substrate, comprising: a cleaning liquid supply path for supplying a cleaning liquid to the substrate; and a water-permeable core material to which the cleaning liquid is supplied from the cleaning liquid supply path. Is provided with a flow path through which the cleaning liquid supplied from the cleaning liquid supply passage provided in the core material flows to the lower surface of the core material, and a plurality of discharge ports for discharging pure water are formed on the lower surface of the core material at the lower central portion. From the lower surface to the periphery of the lower surface, the flow path of the core material is branched into a plurality of flow paths so as to communicate with each of the plurality of discharge ports, and a water-permeable porous membrane is formed in the core material. A substrate cleaning tool characterized by being coated. 3. A cleaning tool for cleaning a substrate, comprising: a cleaning liquid supply path for supplying a cleaning liquid to the substrate; and a water-permeable core material to which the cleaning liquid is supplied from the cleaning liquid supply path. Has a flow path for flowing the cleaning liquid supplied from the cleaning liquid supply path provided in the core material to the lower surface of the core material, and exhausts air in the flow path of the core material with respect to the flow path of the core material. A substrate cleaning tool, wherein an air exhaust path is connected to the substrate, and the core material is covered with a water-permeable porous film. 4. The substrate according to claim 1, wherein a flat portion is formed on a lower surface of the core material, and the flat portion is coated with the porous film. Cleaning tools. 5. The substrate cleaning tool according to claim 2, further comprising a shielding sheet for preventing a cleaning liquid from leaking to a side surface of the core material. 6. A plurality of discharge ports for discharging pure water are radially arranged on a lower surface of the core material from a central portion of the lower surface to a peripheral portion of the lower surface, and the core is connected to each of the plurality of discharge ports. 4. The substrate cleaning tool according to claim 1, wherein a flow path of the material is branched into a plurality of flow paths. 7. The substrate cleaning tool according to claim 1, wherein said core material is attached to a main body. 8. The substrate cleaning tool according to claim 7, wherein the core material is detachably attached to the main body. 9. The body according to claim 7, wherein the porous membrane is attached to the main body using a fastening member.
A substrate cleaning tool according to item 1. 10. The method according to claim 1, wherein the core material is a resin having a large number of fine holes.
The substrate cleaning tool according to any one of 5, 6, 7, 8 and 9. 11. The method according to claim 1, wherein said porous film is fixed to said core material.
The substrate cleaning tool according to any one of 6, 7, 8, 9 and 10. 12. The method according to claim 1, wherein the porous membrane is made of a hydrophilic resin.
The substrate cleaning tool according to any one of 7, 8, 9, 10 and 11. 13. The method according to claim 1, wherein the porous film is a water-repellent resin.
The substrate cleaning tool according to any one of 7, 8, 9, 10 and 11. 14. An apparatus for cleaning a substrate, wherein the apparatus is for cleaning a substrate.
14. A substrate cleaning tool according to any one of 2 and 13, a support member for supporting the substrate cleaning tool, and a drive unit for applying a thrust to a pressing shaft pressing the substrate cleaning tool via the support member. Wherein the cleaning liquid supply path is connected to the support member, and a flow path for flowing the cleaning liquid supplied from the cleaning liquid supply path into the core material is provided in the support member. Substrate cleaning equipment. 15. The apparatus according to claim 14, wherein an air exhaust path for exhausting air in a flow path of the support member is connected to the support member. 16. A liquid level sensor for detecting in the flow path of the support member that the liquid level in the flow path of the support member has reached the opening position of the cleaning liquid supply path, A bubble sensor is provided for detecting that the liquid level in the flow path has reached the ceiling of the flow path of the support member and detecting whether air is accumulated in the flow path of the support member. A control unit that controls an on-off valve provided in the air exhaust path based on a detection signal output from the liquid level sensor and a detection signal output from the foam sensor. Item 16. A substrate cleaning apparatus according to item 15. 17. The cleaning device according to claim 14, further comprising an ultrasonic oscillation mechanism for oscillating ultrasonic waves by oscillating ultrasonic waves in the cleaning liquid passing through the flow path of the support member. Substrate cleaning equipment.