JP2002218293A - Imaging device - Google Patents

Abstract

(57) [Problem] To accurately position an imaging element unit in an optical axis direction of a lens unit. SOLUTION: A light transmitting member 31, a wiring substrate 20 adhered to the light transmitting member 31, and a subject image passing through the lens unit 3 and the light transmitting member 31 at an opening of the wiring substrate. An imaging device having an imaging element unit U configured with an imaging element 11 mounted on
The image pickup device unit U is incorporated with a surface on the image pickup device 11 side of the light transmissive member 31 abutting on receiving surfaces 1a and 1b facing the lens unit 3 side of the image pickup apparatus main body. apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an imaging device for electronically capturing an image, and more particularly to a structure in which an imaging device unit is incorporated in an imaging device main body.

[0002]

2. Description of the Related Art In recent years, it can be said that digital cameras for electronically capturing images have become popular alongside silver halide cameras. And with the miniaturization of digital cameras, the image sensor unit incorporated therein is also miniaturized.

For example, Japanese Patent Application Laid-Open No. 7-099214 discloses
Disclosed image sensor unit U ₁ Is shown in Figure 8
As shown, a flexible printed board 62 is
The printed board 62 is adhered to the CCD 6 serving as an image sensor.
3 to the electrode pad 64, the bump 65, and the anisotropic conductive film 66.
It is configured to be connected via 67 is a sealing tree
Fat, 68 is a micro lens.

However, the image sensor unit U ₁ is what is built how in the camera body, the embedded structure is not shown.

Further, JP-A-11-252416, incorporation structure to the camera body imaging device unit U ₂ is shown. This is a positioning structure of an optical axis of the image sensor unit U _2.

[0006] As shown in FIG.
Opposite side of the lens unit 72 of the imaging device unit U ₂ to the camera body 71, i.e., a structure incorporating from the rear of the camera body 71.

That is, the optical low-pass filter 74 is inserted from the rear of the camera main body 71 and the receiving surface 71a of the main body 1 is inserted.
And an optical glass 76 is pressed against the filter 74 from behind via a rubber member 75,
Thereafter, a flexible substrate 77 integrated with the flexible substrate 77 is fixed to the camera body 71 with a leaf spring 78. Reference numeral 79 denotes an image sensor (CCD) coupled to the flexible substrate 77.

However, in this positioning structure, the distance from the lens unit 72 to the CCD 79 varies due to the variation in the thickness of the optical low-pass filter 74 and the optical glass 76, and the dimensional accuracy decreases.

Japanese Patent Application Laid-Open No. 05-102448 discloses a structure for positioning an image sensor in a plane direction orthogonal to the optical axis of a lens unit. This positioning structure, as shown in FIG.
Is fixed to the main body 83 by fitting the positioning holes 82a of the plate 82 to positioning pins 84 of the optical device main body 83. Incidentally, reference numeral 85 denotes a lead portion.

However, in the case of this positioning structure, although the positioning accuracy is good, since the image pickup device is wrapped in the package 81 and provided with a positioning plate, the image pickup device as a component can be used. This makes it difficult to miniaturize optical devices.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem. The present invention relates to an image pickup device unit in an optical axis direction of a lens unit and a plane direction orthogonal to the optical axis. It is an object of the present invention to provide an imaging device capable of performing positioning with high accuracy.

[0012]

The imaging apparatus provided by the present invention is as described in the following (1) to (4).

(1) A light-transmitting member, a wiring board adhered to the light-transmitting member, and an image of a subject passing through the lens unit and the light-transmitting member mounted on an opening of the wiring board. An imaging device having an imaging device unit configured with the imaging device, wherein the imaging device unit abuts a surface of the light transmitting member on the imaging device side against a receiving surface of the imaging device body facing the lens unit side. An imaging device that is incorporated (hereinafter, referred to as a first imaging device).

(2) An image pickup apparatus in which a frame member for forming an optical path necessary for image pickup is mounted between the light transmitting member and the lens unit in the first image pickup apparatus (hereinafter, referred to as a second image pickup apparatus).

(3) A light-transmitting member, a wiring board adhered to the light-transmitting member, and an image of a subject passing through the lens unit and the light-transmitting member are mounted on the opening of the wiring board. An imaging device having an imaging device unit configured with an imaging device, wherein the imaging device unit is incorporated in the imaging device main body by fixing the wiring board to the imaging device main body with positioning means. Imaging device (hereinafter, referred to as a third imaging device).

(4) The positioning means in the third imaging device is provided on the main body of the imaging device and a concave member or a convex member attached to a hole provided in the copper foil portion of the wiring board, which fits with each other. An imaging device including a convex portion or a concave portion (hereinafter, referred to as a fourth imaging device).

[0017]

According to the first image pickup apparatus, the image pickup element unit is incorporated into the image pickup apparatus body by abutting the surface of the light transmitting member on the image pickup element side against the receiving surface facing the lens unit side of the image pickup apparatus main body. The image sensor unit can be accurately positioned in the optical axis direction of the lens unit without being affected by the thickness of the light transmitting member, and therefore, the dimensional accuracy from the lens unit to the image sensor can be improved. .

In the first image pickup apparatus, since the image pickup element unit is incorporated from the lens unit side of the image pickup apparatus as described above, the optical path of the apparatus body must be unnecessarily large.

Therefore, when adopting the configuration of the first image pickup apparatus, it is desirable to provide a light-shielding frame for cutting off extra light rays so as not to cause ghost due to reflection in the image pickup apparatus main body. The frame member in the second imaging device is for that purpose.

According to the third and fourth image pickup devices, the positioning means positions the wiring board with respect to the image pickup device main body. Therefore, by setting the positions of the positioning means provided on both of them in advance, the position of the lens unit can be reduced. The imaging element unit can be accurately positioned in a plane direction orthogonal to the optical axis.

[0021]

Embodiments of the present invention will be described below with reference to embodiments.

FIG. 1 is a perspective view of a digital camera according to an embodiment, wherein 1 is a camera body, 2 is a lens barrel, 3 is a lens unit, 4 is a finder section, and 5 is a release button.

FIG. 2 is a sectional view of the image pickup device unit U incorporated in the camera body 1. In the figure, 11 is an image sensor, 12 is a micro lens, 13 is an electrode pad,
14 is a bump. Reference numeral 20 denotes a flexible printed wiring board (hereinafter, referred to as a flexible substrate), and a base film 23.
A copper foil pattern portion 22 is formed on the substrate, and a cover lay 21 is formed on the surface thereof. The flexible substrate 20 is bonded to the optical glass 31 with an adhesive, and 24 is an adhesive layer thereof. Reference numeral 26 denotes an opening of the flexible substrate 20.

FIG. 3 is a perspective view of the image sensor unit U from which the image sensor 11 has been removed. The exposed portions of the copper foil pattern portion 22 correspond to the bumps 14 of the image sensor 11 shown in FIG.
, And 25 is an opening. The imaging element 11 is mounted in this opening. The subject light that has passed through the optical glass 31 enters the image sensor 11 through the opening 25. A portion of the copper foil pattern portion 22 where the coverlay 21 is provided is indicated by a broken line.

The lengthwise end portion of the flexible board 20 has a drawing end 20a, there, the positioning hole h ₂ is formed. The other end is a stretched substrate portion 20b,
There, the holes h ₁ is formed, the tip has a connecting end portion 20c to the connector.

Mounting structure of flexible substrate 20 to camera body 1 using positioning holes h ₁ and h ₂ (positioning structure)
Will be described with reference to FIGS.

The image sensor unit U is incorporated into the camera body 1 from the front side, that is, from the lens unit 3 side. At this time, the positioning of the image sensor unit U in the optical axis direction of the lens unit is performed by bringing the upper and lower abutting surfaces 31a and 31b of the optical glass 31 shown in FIG. This is achieved by abutting against the receiving surfaces 1a and 1b provided so as to be positioned and facing the unit lens 3 side.

Since the built-in structure of the imaging element unit U is configured as described above, the dimensional accuracy from the lens unit 3 to the imaging element 11 is not affected by the thickness of the optical glass 31. For this reason, the dimensional accuracy between the two 3 and 11 is higher than the conventional built-in structure.

In FIG. 4, reference numeral 32 denotes a frame member provided on the optical path. As described above, the imaging element unit U is incorporated from the front side of the camera main body 1, so that the optical glass 31
Is larger than the optical path required for shooting. If the optical path is unnecessarily large, ghosting or ghosting due to reflection in the camera body is likely to occur, so that a light-shielding frame for cutting off extra light rays to prevent ghosting is required. This is the reason why the frame member 32 is provided.
In addition, 41 is an eyepiece, and 42 is an LCD, which is configured as a finder.

FIG. 5 is a cross-sectional view of the camera body 1. The flexible substrate 20 of the image sensor unit U is positioned at the first positioning portion A and the second positioning portion B on the camera body 1. Reference numeral 51 denotes another flexible board on which a connector 52 is mounted, and the connection end 20c of the flexible board 20 is inserted into the connector 52. Left and right fixed surfaces 1c of a flexible board 20 provided on the left and right of the optical path of the camera body 1,
1d is formed on the same plane as the receiving surfaces 1a and 1b described above.

FIG. 6 is an exploded enlarged view of the first positioning portion A of FIG. 53 is fixed by the adhesive 54 is inserted into the positioning hole h ₁ opened in flexible substrate 20 by a pin. Hole h ₁ is a cross-sectional circular hole through the flexible board 20 is provided on the copper foil portion 22a of the stretch substrate portion 20b shown in FIG. The hole in the copper foil portion 22a is large enough to allow the pin 53 to be inserted exactly, and the hole in the base film 23 and the coverlay 21 is slightly larger than the hole in the copper foil portion 22a. Reference numeral 55 denotes a pin insertion hole provided on the fixing surface 1c of the flexible board 20 of the camera body 1.

FIG. 7 is an exploded enlarged view of the second positioning portion B of FIG. 56 is a color, and is fixed by the adhesive 59 is fitted into the positioning hole h ₂ bored in the flexible substrate 20. Hole h ₂ is a cross-sectional circular hole through the flexible board 20, are provided on the stretched end 20a shown in FIG. The hole provided in the copper foil portion 22 of the flexible board 20 is large enough to fit the collar 56 exactly.
And the hole in the coverlay 21 is slightly larger than the hole in the copper foil portion 22. 58 is a fixing surface 1 of the flexible board 20 of the camera body 1.
The shaft provided at d is inserted and fitted to the collar 56.

As described above, by having the positioning means with respect to the camera body 1, the image pickup device unit is accurately positioned in the up, down, left, and right directions of the camera body 1.

If the flexible substrate is suddenly incorporated into the camera body without attaching a collar or a shaft to the holes h ₁ and h ₂ of the flexible substrate, even if the flexible substrate is incorporated very slowly, the large image sensor unit is positioned in the camera body. Therefore, a slight pull or a mistake at the time of assembling breaks the hole in the copper foil portion, thereby deteriorating the accuracy of the image sensor. In this regard, if the mounting is performed as in the embodiment, the accuracy does not change even if the mounting is performed very quickly.

Incidentally, pins or collars may be provided in both the holes h ₁ and h ₂ of the flexible substrate 20.

[0036]

As described above, according to the present invention,
Since the light transmitting member of the image sensor unit is positioned in the optical axis direction by abutting the surface of the light transmitting member on the image sensor side with the receiving surface of the imaging device main body, even if the thickness of the light transmitting member varies, regardless of this, The positioning of the image sensor unit in the optical axis direction of the lens unit can be accurately performed.

In addition, since positioning can be performed irrespective of variations in the thickness of the light transmitting member, there is no need to increase the processing accuracy of the light transmitting member, and the cost can be reduced accordingly.

Further, since the positioning in the plane direction orthogonal to the optical axis of the lens unit is performed in the wiring board portion, the positioning in the plane direction is particularly performed in the copper foil portion where the dimensional accuracy is most easily obtained in the wiring board. Can be done accurately.

Further, since the positioning can be performed accurately as described above, the position adjustment and the position check after the image pickup device unit is attached become unnecessary, and the cost can be reduced accordingly.

[Brief description of the drawings]

FIG. 1 is a perspective view of a digital camera according to an embodiment.

FIG. 2 is a cross-sectional view of an image sensor unit incorporated in the digital camera according to the embodiment.

FIG. 3 is a perspective view of a main part of an image sensor unit incorporated in the digital camera according to the embodiment.

FIG. 4 is a longitudinal sectional view of the digital camera of the embodiment.

FIG. 5 is a cross-sectional view of the digital camera according to the embodiment.

6 is an exploded enlarged view of a main part of FIG. 5;

7 is an exploded enlarged view of a main part of FIG. 5;

FIG. 8 is a cross-sectional view of a conventional image sensor unit.

FIG. 9 is a cross-sectional view showing a structure in which a conventional image sensor unit is incorporated into a camera.

FIG. 10 is a cross-sectional view showing a structure in which a conventional image sensor unit is incorporated into a camera.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Camera main body 1a, 1b Receiving surface 1c, 1d Fixing surface 3 Lens unit U Image sensor unit 11 Image sensor 20 Flexible printed wiring board (flexible substrate) 20a Extension end 20b Extension substrate 20c Connection end 21 Coverlay 22 Copper foil pattern portion 22a foil 23 base film 25 opening 31 optical glass 31a, 31b abutting surface h _1, h ₂ positioning holes 32 framing member 53 pin

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) // H04N 101: 00 H04N 101: 00

Claims (4)

[Claims] A light-transmitting member, a wiring board adhered to the light-transmitting member, and an image of a subject passing through the lens unit and the light-transmitting member mounted on an opening of the wiring board. In an imaging device having an imaging device unit configured with an imaging device, the imaging device unit includes:
An image pickup apparatus, wherein a surface of the light transmitting member on the side of the image pickup element is mounted on a receiving surface of the image pickup apparatus body facing the lens unit side. 2. The imaging apparatus according to claim 1, wherein a frame member that forms an optical path required for imaging is mounted between the light transmitting member and the lens unit. 3. A light-transmitting member, a wiring board adhered to the light-transmitting member, and mounted on an opening of the wiring board so as to capture an image of a subject passing through the lens unit and the light-transmitting member. In an imaging device having an imaging device unit configured with an imaging device, the imaging device unit includes:
An image pickup apparatus, wherein the wiring board is fixed to the image pickup apparatus main body by positioning means, thereby being incorporated in the image pickup apparatus main body. 4. The positioning means comprises a concave member or a convex member fitted in a hole provided in a copper foil portion of the wiring board, and a convex or concave member provided in the imaging device body. The imaging device according to claim 3, wherein: