JP2002208767A - Hybrid IC, method of manufacturing the same, and battery pack - Google Patents

Abstract

[PROBLEMS] To provide a hybrid IC, a method of manufacturing the same, and a battery pack, which have less influence on a circuit at the time of mounting. SOLUTION: Secondary battery 30, secondary battery protection module 40, secondary battery 30 and secondary battery protection module 40
In a battery pack including a metal plate 50 for connecting the
And a resin 42 formed on the entire surface of one surface of the printed wiring board 41, and a metal terminal 43 that is connected to the metal plate 50 by welding is embedded in the end surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC used for a secondary battery protection module for preventing overcharge and overdischarge of a secondary battery, and a battery in which a secondary battery and a secondary battery protection module are integrated. About the pack.

[0002]

2. Description of the Related Art FIG.
This will be described with reference to FIG. FIG. 12 is an exploded perspective view illustrating a connection structure between a secondary battery included in a conventional battery pack and a secondary battery protection module.

[0003] This battery pack includes a secondary battery 110 such as a lithium ion battery housed in an outer box (not shown).
, A secondary battery protection module 120 and a secondary battery 110
A metal plate 130 made of nickel, copper, aluminum or the like for connecting the electrode portion 111 of the secondary battery protection terminal 120 with the battery connection terminal electrode 121, and a terminal block 140 on which an external terminal 141 of the battery pack is formed. Is the main component.

[0004] The secondary battery 110 has a thin rectangular external shape, and has an electrode portion 111 at each end in the longitudinal direction. The secondary battery protection module 120 includes a printed wiring board 122 on which a predetermined pattern and the terminal electrodes 121 are formed, and an electronic component 123 mounted on the printed wiring board 122. Secondary battery protection module 120
Of the secondary battery 110 and the metal plate 130
The connection is made by welding such as ultrasonic welding or resistance welding in order to reduce the influence on the welding.

[0005]

However, in this battery pack, since the terminal electrode 121 of the secondary battery protection module 120 and the metal plate 130 are welded, the welding impact adversely affects the secondary battery protection module 120. There was a case. To solve this problem, the terminal electrode 121
Although a method of soldering a second metal plate to the second metal plate and welding the second metal plate to the metal plate 130 is also conceivable, in this method, it takes time and effort to mount the second metal plate. In addition, there is a problem that the second metal plate protrudes from the secondary battery protection module 120, so that the handling is complicated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a hybrid IC, a method of manufacturing the same, and a battery pack, which have less influence on a circuit when mounted.

[0007]

According to one aspect of the present invention, there is provided a printed wiring board, an electronic component mounted on one surface of the printed wiring board, and the printed wiring board. A hybrid IC comprising a resin formed on the entire surface of one surface and sealing the electronic component, wherein the hybrid IC is embedded in the resin and a part thereof is exposed from the resin so as to be flush with the resin surface. A device having a metal terminal is proposed.

According to the present invention, since the metal terminal is embedded in the resin, even when the metal terminal is welded, the impact caused by the welding is reduced by the resin. Thereby, the influence on the module circuit at the time of welding can be reduced. Therefore, this hybrid IC is suitable for applications such as a secondary battery protection module in a battery pack in which a secondary battery and a secondary battery protection module are integrally housed.

According to a second aspect of the present invention, a printed wiring board, an electronic component mounted on one surface of the printed wiring board, and the electronic component formed over the entire surface of the printed wiring board on the one surface are provided. A method for manufacturing a hybrid IC comprising: a resin to be sealed; and a metal terminal embedded in the resin and partially exposed from the resin so as to be flush with the resin surface. Mounting an electronic component on one surface of a collective printed wiring board on which a pattern for use has been formed; and forming a metal member for the metal terminal on the collective printed wiring board, and forming a pattern forming area for a hybrid IC part of which is one. A step of mounting so as to protrude, a step of forming a resin on at least the mounting area of the electronic component on the one surface of the collective printed wiring board to seal the electronic component, and the electronic component and the terminal electrode plate Implementation And a step of cutting the collective printed wiring board on which the resin is formed, the resin and the metal member into unit dimensions of the hybrid IC.

According to the present invention, a metal member for a metal terminal is mounted so that a part thereof protrudes from a pattern formation region for one hybrid IC, a resin is formed on a collective printed wiring board, and then the collective printed wiring board is formed. Since the printed wiring board is cut, the metal terminals are exposed on the cut surface flush with the resin. That is, the hybrid IC according to the first aspect can be reliably manufactured.

According to a third aspect of the present invention, there is provided a battery pack including a secondary battery and a secondary battery protection module, wherein the secondary battery protection module includes a printed wiring board, and one surface of the printed wiring board. The electronic component mounted on the, the resin formed on the entire surface of the one side of the printed wiring board and sealing the electronic component, for connection with a secondary battery, embedded in the resin and the A metal terminal that is partially exposed from the resin so as to be flush with the resin surface, and a metal piece connected to an electrode of the secondary battery is welded to the metal terminal of the secondary battery protection module. Are proposed.

According to the present invention, since the metal terminal for connecting the battery of the secondary battery protection module is embedded in the resin, when the metal terminal is connected to the electrode plate by welding, the secondary terminal by the welding is used. The effect on the battery protection module is reduced. On the other hand, since the connection between the metal terminal and the electrode plate is made by welding, less heat is generated compared to soldering or the like, and the effect on the secondary battery is reduced. Therefore, the battery pack according to the present invention has high reliability.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A battery pack according to one embodiment of the present invention will be described with reference to the drawings. 1 is an exploded perspective view illustrating a structure of a battery pack, FIG. 2 is an exploded perspective view illustrating a connection structure between a secondary battery and a secondary battery protection module,
FIG. 3 is an external perspective view of the secondary battery protection module. FIG. 3A is a perspective view of the secondary battery protection module as viewed from a resin forming surface side, and FIG. 3B is a perspective view of the secondary battery protection module as viewed from a side opposite to FIG.

As shown in FIG. 1, this battery pack 1
A box-shaped outer box 10 having an open side, a lid 20 for closing the opening of the outer box 10, a secondary battery 30 such as a lithium ion battery housed inside the outer box 10, and a secondary battery 3
Secondary battery protection module 40 for protecting 0 from overcharge and overdischarge, secondary battery protection module 40 and secondary battery 3
0 and a metal plate 50 for connecting the first metal plate to the first metal plate.

The outer case 10 includes a secondary battery protection module 4
The windows 11 are formed to expose the plurality of external terminals 44 formed at 0. That is, the external terminal 41 of the secondary battery protection module 40 exposed to the window 11 becomes the external terminal of the battery pack 1.

The secondary battery 30 has a rectangular parallelepiped shape, and electrodes 31 are formed on both side surfaces in the longitudinal direction.

The secondary battery protection module 40 is disposed on the side of the secondary battery 30, and the side surface thereof is
Are arranged so as to face one end face. The secondary battery protection module 40, as shown in FIGS.
The printed wiring board 41 includes a rectangular printed wiring board 41 having a length substantially equal to the width of the secondary battery 30, and a resin 42 formed on the entire surface of one surface of the printed wiring board 41. ing. Metal terminals 43 for connection to the secondary battery 30 are exposed at both end surfaces of the secondary battery protection module 40.
The exposed surface of the metal terminal 43 is flush with the resin 42 at the end of the secondary battery protection module 40. The external terminals 44 are formed on the other surface of the printed wiring board 41. One end of a metal plate 50 connected to the secondary battery 30 is connected to the metal terminal 43 by welding such as ultrasonic welding or resistance welding.

The metal plate 50 is made of a metal material such as nickel, copper, and aluminum. One end of the metal plate 50 is welded to the electrode 31 of the secondary battery 30. A metal plate connected to the electrode 31 formed on the side of the secondary battery protection module 40 of the secondary battery 30 is bent at a corner of the secondary battery 30,
The end extends to the end of the secondary battery protection module 40. On the other hand, the metal plate 50 connected to the electrode 31 extends along the side surface of the secondary battery 30 to the end of the secondary battery protection module 40. The other end of each metal plate 50 is connected to the metal terminal 43 of the secondary battery protection module 40 by welding such as ultrasonic welding or resistance welding.

Next, the structure of the secondary battery protection module 40 will be described in detail with reference to FIGS. FIG. 4 is a perspective view of the secondary battery protection module with the resin removed, and FIG. 5 is a sectional view of the secondary battery protection module.

The printed wiring board 41 of the battery protection module 40
Is an organic material such as phenolic resin, polyester resin, epoxy resin, fluororesin, or ceramic,
A substrate 41a using an inorganic material such as metal or glass;
A pattern 41b (not shown in FIG. 4) formed on the upper surface of the substrate 41a, and the external terminals 44 formed on the lower surface of the substrate 41a. Various electronic components 45 and metal terminals 43 are mounted on the pattern 41b. In addition,
In the present embodiment, an epoxy-based printed wiring board 41 is used. The electronic components 45 include, for example, semiconductor devices such as ICs, transistors, FETs, and diodes, and passive components such as capacitors, inductors, resistors, and filter devices.

The resin 42 is formed on the entire upper surface of the printed wiring board 41. The side surface of the resin 42 is perpendicular to the printed wiring board 41. The upper surface of the resin 42 is formed parallel to the printed wiring board 41. That is, the resin 4
2 and the printed wiring board 41 are integrally formed in a substantially rectangular parallelepiped shape. The resin 42 is formed at a height such that all the electronic components 45 and the metal terminals 43 are embedded in the resin 42.

The resin 42 is made of a thermosetting resin having an insulating property. As thermosetting resins, urea-based, melamine-based,
Phenol type, epoxy type, unsaturated polyester type, alkyd type, urethane type and the like can be mentioned. In addition, resin 4
2 includes water resistance, acid resistance, alkali resistance, heat resistance,
Those having good corrosion resistance and the like are preferable. Further, the resin 42
It is preferable that the thermal conductivity of the electronic component 45 is good in consideration of heat radiation. For example, a component having the same thermal conductivity as the exterior of the electronic component 45 may be used. Further, the resin 42 preferably has a coefficient of thermal expansion equivalent to that of the electronic component 45. In the present embodiment, as the resin 42,
The same epoxy resin as that used for the exterior of the electronic component 45 was used. Further, it is preferable that the resin 42 has a small particle diameter so that the resin 42 can be easily filled in the gap between the substrate 41a and the electronic component 45. Specifically, the condition is that the minimum particle size of the resin 42 is smaller than the distance between the substrate 41a and the electronic component 45. The resin 42 has an average particle diameter of the substrate 41.
It is preferable that the distance between a and the electronic component 45 be smaller than
Further, it is preferable that the maximum particle size is smaller than the distance between the substrate 41a and the electronic component 45. In this embodiment, a resin having a particle size of 25 μm is used.

The metal terminal 43 is formed of a rectangular parallelepiped metal block. Examples of the material of the metal terminal 43 include nickel, copper, and aluminum. Metal terminal 43
Are mounted on the pattern 41b formed at both ends in the longitudinal direction of the printed wiring board 41 by soldering or the like.

Next, a method of manufacturing the secondary battery protection module 40 will be described with reference to FIGS. 6 to 9 are diagrams for explaining a manufacturing process of the secondary battery protection module.

First, as shown in FIG. 6, a collective printed wiring board 60 having a pattern 41b formed on one surface and the above-described external terminals 44 formed on the other surface is prepared. The electronic component 45 is mounted on the board 60.

In the collective printed wiring board 20, a pattern 41b for a plurality of secondary battery protection modules 40 is formed in a matrix. That is, each pattern 41b is formed so that the printed wiring board 41 is continuously formed in the width direction and the length direction. In FIG. 6, the shape of the printed wiring board 41 of each secondary battery protection module 40 is represented by a dashed line.

A mark 6 for confirming a cutting position in a cutting step to be described later is provided on the periphery of the collective printed wiring board 60.
0a is printed. Note that a cutout or a concave portion may be provided instead of printing such as the mark 60a.

Next, as shown in FIG. 7, a prismatic metal block 6 is mounted on the mounting surface of the collective printed wiring board 60 on which the electronic component 45 is mounted.
1 is implemented. This metal block 61 is cut at the center in the length direction in a cutting step described later,
The above-mentioned metal terminal 43 is formed. Therefore, the metal block 61 has substantially the shape in which the two metal terminals 43 described above are connected. The metal block 61 is arranged over a plurality of secondary battery protection modules 40 adjacent in the length direction. That is, one side of the metal block 61 is mounted on the pattern 41b of one secondary battery protection module 40, and the other side is mounted on the pattern 41b of the other secondary battery protection module 40. If there is no pattern 41b adjacent in the length direction, the pattern 41b
One side of the metal block 61 is mounted only on the upper side. In addition,
In FIG. 7, the shape of the printed wiring board 41 of each secondary battery protection module 40 is represented by a dashed line.

Next, the flux residue adhering to the collective printed wiring board 60 is removed by an ultrasonic cleaning method or the like. This is because if the flux is attached to the collective printed wiring board 60, the adhesive strength between the resin and the collective printed wiring board 60 is reduced.

Next, the collective printed wiring board 60 is heated to remove excess water contained in the collective printed wiring board 60 and the like. If the moisture remains, moisture in the resin evaporates when the module is heated. At this time, cracks may occur in the collective printed wiring board 60 due to the generated water vapor pressure. Then, when the solder flows into the crack, a short circuit of the pattern or the like may occur. Therefore, the step of removing water is effective.

Next, as shown in FIG. 8, the collective printed wiring board 60 is placed on a support base 71 having a horizontal upper surface, and a frame 72 is arranged on the periphery of the collective printed wiring board 60. Then
The space around the collective printed wiring board 60 is evacuated. At this time, the vacuum pressure is, for example, 2 Torr (= 266.644P).
a) Do the following. Next, a thermosetting resin 62 is injected into the collective printed wiring board 60 in this vacuum state. At this time, since the resin 62 has low viscosity and fluidity, it spreads over the entire surface of the frame 72. The peripheral portion of the resin 62 is curved by surface tension, and the upper surface is substantially horizontal.

Next, the space around the collective printed wiring board 60 is raised to atmospheric pressure. Thereby, for example, the electronic component 4
The resin 62 is filled into a gap formed between the substrate 5 and the collective printed wiring board 60 and the like, a through hole formed in the substrate, and the like.

It is preferable that the series of steps of pressure reduction, resin application, and pressure increase be repeated a plurality of times as necessary. That is, the resin is filled into the gap between the collective printed wiring board 60 and the electronic component 45 or the inside of the through hole due to the differential pressure in the pressure increasing step, and as a result, a concave portion is formed on the surface of the resin. Thus, by further applying a resin, the resin surface can be formed in a shape with less unevenness. Also,
By repeatedly reducing and increasing the pressure, the collective printed wiring board 6
The filling of the resin into the gap between the zero and the electronic component 45 and the inside of the through hole is ensured.

Next, the resin 62 is cured by heating.
In the present embodiment, the heating was carried out by changing the conditions such as the heating temperature and the time in two steps.

Next, as shown in FIG. 9, the collective printed wiring board 60 on which the resin 62 is formed is cut into unit dimensions of the secondary battery protection module 40 using a dicer 73 or the like. Here, the collective printed wiring board 60 is cut along the outer edge of the printed wiring board 41 of each secondary battery protection module 40 (see the dashed line in FIGS. 6, 7, and 9). At this time, since the metal block 61 is arranged on the outer edge of the secondary battery protection module 40, the resin 62 and the collective printed wiring board 6
The metal block 61 is cut along with 0, and the metal block 61 is exposed on the cut surface flush with the resin 62. It should be noted that accurate cutting can be performed by performing positioning using the mark 60a formed on the collective printed wiring board 60 at the time of this cutting. Through the above steps, the secondary battery protection module 40 is obtained.

As described above, according to the secondary battery protection module 40 according to the present embodiment, since the metal terminal 43 for connection to the secondary battery 30 is embedded in the resin 42, the metal terminal 43 , The impact caused by the welding is alleviated by the resin 42. Thereby, the influence on the module circuit at the time of welding can be reduced. Therefore, for example, it is suitable for manufacturing the battery pack 1 in which the secondary battery 30 and the secondary battery protection module 40 are integrally housed. That is, the battery pack 1 according to the present embodiment has high reliability.

Further, according to the method for manufacturing the secondary battery protection module 40 according to the present embodiment, the metal terminal 43 is formed so that a part thereof protrudes from the pattern formation region for one secondary battery protection module 40. Mount the metal block 61,
Since the resin 62 is formed on the collective printed wiring board 60 and then the collective printed wiring board 60 is cut, the metal terminals 43 are exposed on the cut surface flush with the resin 42. Therefore, the secondary battery protection module 40 can be reliably manufactured. Further, since the metal blocks 61 are arranged over the adjacent secondary battery protection modules 40, a large number of secondary battery protection modules 40 can be efficiently manufactured with a small number of mounting steps.

Although the embodiment of the present invention has been described above, the present invention is not limited to this. For example, in the present embodiment, the secondary battery protection module has been described as one mode of the hybrid IC, but the present invention is not limited to this. It can be used for other uses.

Further, in the above embodiment, in the manufacturing process of the secondary battery protection module, the resin is injected in a vacuum pressure atmosphere, and then the atmospheric pressure atmosphere is formed to form the resin. However, the present invention is not limited to this. That is, the resin may be applied and formed only in the atmospheric pressure atmosphere.

Further, in each of the above embodiments, as a method of forming the resin, a method is described in which a frame is arranged on the upper surface of the printed wiring board and the resin is poured into the frame. However, the present invention is not limited to this. Not something. For example, as shown in FIGS. 10 and 11, a mask 95 in which a hole 95a corresponding to a region where a resin is formed may be used. Specifically, the mask 9
5 may be arranged above printed wiring board 98 and resin 97 may be poured with squeegee 96 to form a resin having a shape substantially corresponding to hole 95 a on the upper surface of printed wiring board 98. In this case, the height of the resin is determined by the thickness of the mask 95.

[0041]

As described in detail above, according to the first aspect of the present invention, since the metal terminal is embedded in the resin, even if the metal terminal is welded, The impact caused by the resin is reduced by the resin. This allows
The effect on the module circuit during welding can be reduced. Therefore, this hybrid IC is suitable for applications such as a secondary battery protection module in a battery pack in which a secondary battery and a secondary battery protection module are integrally housed.

According to the second aspect of the present invention, a metal member for a metal terminal is mounted so that a part thereof protrudes from one hybrid IC pattern formation region, and a resin is formed on the collective printed wiring board. Thereafter, the collective printed wiring board is cut, so that the metal terminals are exposed on the cut surface flush with the resin. That is, the hybrid IC according to claim 1
Can be reliably manufactured.

Further, according to the third aspect of the present invention, since the metal terminal for connecting the battery of the secondary battery protection module is embedded in the resin, when the metal terminal is connected to the electrode plate by welding, The effect of the welding on the secondary battery protection module is reduced. On the other hand, since the connection between the metal terminal and the electrode plate is made by welding, less heat is generated compared to soldering or the like, and the effect on the secondary battery is reduced. Therefore, the battery pack according to the present invention has high reliability.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view illustrating the structure of a battery pack.

FIG. 2 is an exploded perspective view illustrating a connection structure between a secondary battery and a secondary battery protection module.

FIG. 3 is an external perspective view of a secondary battery protection module.

FIG. 4 is a perspective view of the secondary battery protection module with the resin removed.

FIG. 5 is a sectional view of a secondary battery protection module.

FIG. 6 is a diagram illustrating a manufacturing process of a secondary battery protection module.

FIG. 7 is a diagram illustrating a manufacturing process of the secondary battery protection module.

FIG. 8 is a diagram illustrating a manufacturing process of the secondary battery protection module.

FIG. 9 is a diagram illustrating a manufacturing process of the secondary battery protection module.

FIG. 10 is a diagram illustrating a resin forming process according to another example.

FIG. 11 is a diagram illustrating a resin forming process according to another example.

FIG. 12 is an exploded perspective view illustrating a connection structure between a secondary battery included in a conventional battery pack and a secondary battery protection module.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Battery pack, 10 ... Outer box, 20 ... Lid, 30 ... Secondary battery, 40 ... Secondary battery protection module, 41 ... Printed wiring board, 42 ... Resin, 43 ... Metal terminal, 44 ... External terminal, 6
0: collective printed wiring board, 61: metal block, 50: metal plate,

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor succeeded Tejima, 6-16-20 Ueno, Taito-ku, Tokyo Inside Taiyo Denki Co., Ltd. (72) Inventor Teru Furuta 6-16-20 Ueno, Taito-ku, Tokyo Taiyo F-term (in reference) 5K314 AA24 BB06 FF21 GG08 5E336 CC55 CC60 GG01 5H040 AA40 AS11 AY08 DD06 DD10 DD15

Claims (3)

[Claims] 1. A printed wiring board, an electronic component mounted on one surface of the printed wiring board, and a resin formed on the entire surface of the one surface of the printed wiring board to seal the electronic component. A hybrid IC comprising a metal terminal embedded in the resin and partially exposed from the resin so as to be flush with the surface of the resin. 2. A printed wiring board, an electronic component mounted on one surface of the printed wiring board, and a resin formed on the entire surface of the printed wiring board to seal the electronic component. ,
In a method of manufacturing a hybrid IC comprising a metal terminal embedded in the resin and partially exposed from the resin so as to be flush with the resin surface, a plurality of patterns for the hybrid IC are formed. Mounting an electronic component on one surface of the collective printed wiring board, and mounting the metal member for the metal terminal on the collective printed wiring board so that a part thereof protrudes from one hybrid IC pattern formation region. A step of forming a resin on at least one mounting area of the electronic component on the one side of the collective printed wiring board to seal the electronic component; and mounting the electronic component and the terminal electrode plate and forming the resin. Hybrid printed wiring board, resin and metal members
Cutting the semiconductor device into C unit dimensions. 3. A battery pack including a secondary battery and a secondary battery protection module, wherein the secondary battery protection module includes a printed wiring board and an electronic component mounted on one surface of the printed wiring board. A component, a resin formed entirely on the one surface of the printed wiring board and sealing the electronic component, and a resin for connection with a secondary battery, embedded in the resin and a part of which is embedded in the resin surface. And a metal terminal exposed from the resin so as to be flush with the metal terminal of the secondary battery protection module, wherein a metal piece connected to an electrode of the secondary battery is welded. Battery pack.