JP2002299192A - Regulator for power supply - Google Patents

Abstract

(57) [Problem] To provide a power supply regulator that is compact, has excellent high-frequency response, is excellent in mountability, and is excellent in productivity. SOLUTION: A first capacitor portion 16 including a dielectric film 3, a solid electrolyte layer 4, and a current collector layer 5 formed on a porous surface of a valve metal sheet body 1 and an insulating layer 9 covering them is provided. A second capacitor section 17;
And a second capacitor portion 17 connected to the upper surface of the semiconductor component 8 via the connection bumps 11. The current collector layer 5 of the first capacitor portion 16 The semiconductor component 8 is electrically connected by the first connection terminal 12, and the first connection terminal 12 is connected to the current collector layer 5 of the second capacitor unit 17 through the first connection unit 14.
To the electrode portion 2 of the second capacitor portion 17
Is electrically connected to the semiconductor component 8 via the second connection portion 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply regulator having a solid electrolytic capacitor such as a three-terminal positive output regulator and a three-terminal negative output regulator and a semiconductor component, which is used for various electronic device equipment.

[0002]

2. Description of the Related Art A conventional power supply regulator has a solid electrolytic capacitor or the like in a semiconductor component and an input / output portion of the semiconductor component for suppressing oscillation of the semiconductor component. Such a valve metal sheet body as an anode element, a dielectric film is formed on this surface, a solid electrolyte layer such as a functional polymer or manganese dioxide is provided thereon, and a current collector layer is provided on the outer surface thereof, The whole was molded with an exterior, and terminal electrodes electrically connected to the electrode portion and the current collector layer were provided at both ends of the exterior.

[0003]

In the above-mentioned conventional power supply regulator, the solid electrolytic capacitor has a stabilization of an input / output voltage difference and a transient response of the output voltage near an output terminal of the semiconductor component for suppressing oscillation of the semiconductor component. A capacitor with a relatively large capacity and small internal impedance is required for improvement, and a solid electrolytic capacitor is a single chip type capacitor like a resistor and an inductance component, and is mounted together with semiconductor components on a circuit board. Will be used.

However, recent downsizing of electronic devices,
With the digitization of circuits, miniaturization of electronic components and high-frequency response are required.However, in the above-mentioned power supply regulator, a solid electrolytic capacitor surface-mounted on a circuit board together with semiconductor components has a relatively large capacity. It is difficult to reduce the size as a power supply regulator because of the need for a small size, it is difficult to reduce the equivalent series resistance (ESR) to reduce the internal impedance, and the long input / output lines from the board to the semiconductor components are equivalent. In order to increase the series inductance (ESL), there is a problem that there is a problem in high-frequency response.

The present invention eliminates the above-mentioned drawbacks of the prior art, and has a compact and excellent high-frequency response having a capacitor portion composed of a solid electrolytic capacitor that can be electrically connected directly to a semiconductor component via a connection bump. It is another object of the present invention to provide a power supply regulator which realizes high-density mounting on a substrate surface and has excellent productivity.

[0006]

According to a first aspect of the present invention, there is provided a first capacitor portion, and an electrical connection between the first capacitor portion and an upper surface of the first capacitor portion via a connection bump. Semiconductor component, and a second capacitor portion provided so as to be electrically connected to the upper surface of the semiconductor component, the first and second capacitor portions, one surface A valve metal sheet made porous, a dielectric coating provided on the porous surface of the valve metal sheet, a solid electrolyte layer provided on the upper surface of the dielectric coating, and a solid electrolyte A current collector layer provided on the upper surface of the layer, an electrode portion provided on a side surface of the valve metal sheet, and a valve metal sheet, a dielectric coating, a solid electrolyte layer and a current collector layer. The first capacitor is constituted by an insulating layer provided. The current collector layer of the power supply unit and the semiconductor component are electrically connected by the first connection terminal, and the first connection terminal is connected to the current collector layer of the second capacitor unit via the first connection unit. The electrode portion of the second capacitor portion is a power supply regulator electrically connected to the semiconductor component via the second connection portion, and a connection bump is formed on the surface of the first capacitor portion. Is formed, and a semiconductor component can be mounted on the connection bump, so that miniaturization and remarkable improvement in high-frequency response can be achieved.

According to a second aspect of the present invention, there is provided a regulator for a power supply having a solid electrolytic capacitor according to the first aspect, wherein an aluminum foil having one surface etched is used as the valve metal sheet. In addition to the above, productivity can be improved.

According to a third aspect of the present invention, there is provided a power regulator having the solid electrolytic capacitor according to the first aspect, wherein a sintered body of valve metal powder is used as the valve metal sheet.
In addition to the effect of the first aspect, the capacity can be increased.

According to a fourth aspect of the present invention, there is provided a power supply regulator having a solid electrolytic capacitor according to the first aspect, wherein a non-etched surface of an aluminum foil having one surface etched is used as an electrode portion. Can be used as an electrode part, and the number of constituent parts is small, so that productivity can be improved.

According to a fifth aspect of the present invention, there is provided a regulator for a power supply having a solid electrolytic capacitor according to the first aspect, wherein another metal layer formed on an unetched surface of an aluminum foil having one surface etched is used as an electrode portion. By selecting the metal layer, the reliability of connection with the conductor can be improved.

According to a sixth aspect of the present invention, there is provided a regulator for a power supply having a solid electrolytic capacitor according to the first aspect, wherein one side of the sintered body of valve metal powder on which no dielectric film is formed is used as an electrode portion. The number of components can be reduced and the cost can be reduced.

According to a seventh aspect of the present invention, there is provided a power supply having a solid electrolytic capacitor according to the first aspect, wherein a metal layer formed on one surface of a sintered body of valve metal powder on which a dielectric film is not formed is used as an electrode portion. Regulator, and the reliability of the connection with the conductor can be increased by selecting the metal layer.

The invention according to claim 8 is a power regulator having the solid electrolytic capacitor according to claim 1 using a functional polymer as the solid electrolyte layer, and can have a low impedance.

According to a ninth aspect of the present invention, there is provided a regulator for a power supply having a solid electrolytic capacitor according to the first aspect, wherein a manganese dioxide layer is used as a solid electrolyte layer. .

According to a tenth aspect of the present invention, there is provided a power supply regulator having a solid electrolytic capacitor according to the first aspect, wherein the number of connection bumps is equal to or greater than the number of connection bumps of the semiconductor component. Can be mounted, and miniaturization, remarkable improvement in high-frequency response, and improvement in productivity can be achieved.

According to an eleventh aspect of the present invention, there is provided a first capacitor portion, a second capacitor portion provided to be electrically connected to an upper surface of the first capacitor portion, a semiconductor component, and a semiconductor device. A third capacitor portion electrically connected to the semiconductor component on the component upper surface, the first, second and third capacitor portions, a valve metal sheet body having one surface made porous, A dielectric coating provided on the porous surface of the valve metal sheet, a solid electrolyte layer provided on the upper surface of the dielectric coating, and a current collector layer provided on the upper surface of the solid electrolyte layer And an electrode portion provided on a side surface of the valve metal sheet, and an insulating layer provided so as to cover the valve metal sheet, a dielectric film, a solid electrolyte layer and a current collector layer, Current collection for each of the first and second capacitors The layers are electrically connected to each other by a first connection terminal, the semiconductor components are electrically connected to each other through the first connection terminal, and the current collector layer of the third capacitor portion is connected to the semiconductor through the third connection terminal. An electrode portion of the second capacitor portion is electrically connected to a terminal of the semiconductor component on the upper surface via a connection bump; and an electrode portion of the first and third capacitor portions is electrically connected to a terminal of the component. Is a power regulator that is electrically connected to the semiconductor component via the first connection part, forms a connection bump on the surface of the second capacitor part, and allows the semiconductor component to be mounted on the connection bump In addition, it is possible to provide a device that is excellent in miniaturization and high-frequency response.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claims 1 to 11 of the present invention will be described below with reference to FIGS.

FIG. 1 is a sectional view of an embodiment of a power supply regulator according to the present invention, and FIG. 2 is a circuit diagram of the power supply regulator, particularly a three-terminal regulator. In FIG. 1, reference numeral 16 denotes a first capacitor unit, and 17 denotes a second capacitor unit. In the second capacitor portion 17, 1 is a valve metal sheet made of a sintered body of valve metal powder such as aluminum foil or tantalum having one surface etched, and 2 is an electrode portion provided on one surface of the valve metal sheet 1. In the case of an aluminum foil, the electrode portion 2 may use a surface that is not etched as it is, or may be formed by forming another metal layer such as gold, copper, or nickel on the surface that is not etched, In the case of a valve metal powder sintered body, the surface of the sintered body on which the dielectric film is not formed may be used as it is,
A metal layer such as gold, copper, nickel, or tantalum may be formed by a method such as sputtering or vapor deposition. The first capacitor section 16 is formed in the same manner as the second capacitor section 17.

In the first capacitor section 16 and the second capacitor section 17, reference numeral 3 denotes a dielectric film formed on the surface and the hole surface by anodic oxidation except for the electrode section 2 of the metal sheet body 1. Reference numeral 4 denotes a solid electrolyte layer formed on the dielectric film 3;
Can be obtained by forming a functional polymer layer such as polypyrrole or polythiophene by chemical polymerization or electrolytic polymerization, or by impregnating a manganese nitrate solution and thermally decomposing to form a manganese dioxide layer.

Further, in the first capacitor section 16 and the second capacitor section 17, reference numeral 5 denotes a current collector layer formed on the solid electrolyte layer 4, and affixed with a metal foil such as copper,
It can be formed by applying a conductive paste on the solid electrolyte layer 4. Reference numeral 9 denotes an insulating layer covering the whole of the insulating layer, and is formed by molding using an epoxy resin or the like.

In the first capacitor section 16, the hole 6 is a hole provided in the valve metal sheet 1, and 7 is a hole also provided in the insulating layer 9. These holes 6 and 7 are formed by laser processing, etching processing, or the like. It is formed by punching or the like.

A conductor 10 is formed in the holes 6 and 7 by plating of copper or the like, and the conductor 10 in the holes 6 and 7 is electrically connected to the valve metal sheet 1.

The semiconductor component 8 and the second capacitor portion 17 are joined via an insulating layer with an adhesive such as epoxy resin or silicon resin.

In the second capacitor section 17, the electrode section 2
The second connection terminal 13 electrically connected to the current collector layer 5 of the first capacitor section 16, the current collector layer 5 of the second capacitor section 17, and the ground terminal section of the semiconductor component 8. The first connection terminals 12 to be electrically connected are formed on a conductive paste such as Ag in the same manner as in the method for forming electrodes of general electronic components.
i or Sn may be formed by a plating method, may be formed by forming a layer of gold, copper, nickel, or the like by vapor deposition or sputtering, or may be formed by attaching a metal foil, or may be formed by soldering. Alternatively, it may be formed using a conductive resin or the like.

In the first capacitor section 16, holes 6,
The connection bumps 11 made of solder, conductive resin, Au, Sn, or Ag are formed on the exposed surface of the conductor 10 formed in the inside 7, and the number and the pitch of the connection bumps 11 are determined later. Or more than the connection bumps of the semiconductor component 8 to be mounted. The number of connection bumps equal to or larger than the number of connection bumps of the semiconductor component 8 is such that chip components such as a chip resistor, a chip ceramic capacitor, and a chip inductance can be mounted between the remaining connection bumps 11 after the semiconductor component 8 is mounted. It is what it was.

In the second capacitor portion 17, the first connection portion 14 and the second connection portion 15 which are electrically connected to the end surfaces of the first connection terminal 12 and the second connection terminal 13 are formed by soldering or the like. It is formed of a conductive resin, Au, Sn, Ag, or the like.

When the connection bump 11, the first connection part 14, and the second connection part 15 are provided on the semiconductor component 8, the connection bump 11, the first connection part 14, and the second connection part May be formed or may not be formed. The connection bump 11 provided on the semiconductor component 8 and the first connection portion 14 and the second connection portion 15 are formed of solder, conductive resin, Au, Sn, Ag, or the like, and are connected to the capacitor portion or wire-bonded. The connection is made by using such a method. The electrical connection between the semiconductor component 8 and the first capacitor portion 16 using the conductive resin is performed on the exposed surface of the conductor 10 formed in the holes 6 and 7, the first connection terminal 12, and the second connection. Using a STB (Stud Bump Bonding) method in which ball bumps are provided on the terminals 13 and electrical connection is made with a conductive resin such as Ag paste, or the use of an ultraviolet curing resin, the connection reliability is ensured by utilizing the shrinkage of the resin during curing. There is the MBB method mentioned above.

As described above, the power supply regulator having the capacitor portion that can be directly electrically connected to the semiconductor component 8 via the connection bump 11 has a large capacity, a small internal impedance, and a large lead because it uses a solid electrolytic capacitor. Since the conductive pattern is unnecessary, the miniaturization and the high-frequency response are remarkably improved, and the capacitor is not mounted on the substrate surface, so that the productivity is excellent.

The use of an aluminum foil having an etched surface on one side as the valve metal sheet body 1 can use the aluminum foil of an aluminum electrolytic capacitor which has already been established. By doing so, it is possible to easily obtain the valve metal sheet body 1 having the desired etching pits, and to improve the productivity.

The reason why the sintered body of valve metal powder such as tantalum is used as the porous valve metal sheet 1 is that the obtained capacitance becomes large.

Further, since one side of the sintered body of aluminum foil or valve metal powder is used as the electrode part 2, the metal layer as another electrode part 2 is not required, the number of components is small, the production efficiency is improved, and the cost is reduced. This is advantageous in terms of surface. However, when it is desired to improve the reliability of connection with the conductor 10 formed in the holes 6 and 7, it is desirable to form a metal layer such as gold, copper or nickel on one surface of the valve metal sheet 1.

In addition, by using a functional polymer such as polypyrrole or polythiophene as the solid electrolyte layer 4, a solid electrolytic capacitor having a low impedance can be obtained, and the high-frequency response can be further improved. However, as a completely established technique, there is a method of forming manganese dioxide, and it is possible to improve productivity and reliability by adopting a method that is dense and can be freely controlled in thickness.

Further, the first connection terminal 12, the second connection terminal 13, the first connection portion 14, and the second connection portion 15 are not always necessary. 12, the second connection terminal 13, the first connection portion 14, and the second connection portion 15 can be used as substitutes, and the semiconductor component 8 or the chip component mounted on the connection bump 11 can be used as a lead electrode. It is also possible.

In FIG. 2, reference numeral 8 denotes a semiconductor component, 12 denotes a first connection terminal, 16 denotes a first capacitor unit, 17 denotes a second capacitor, Vin denotes an input terminal, and Vout denotes an output terminal.

Next, an example of a method for manufacturing a solid electrolytic capacitor of the present invention will be described with reference to FIGS. First, FIG.
As shown in (1), an aluminum foil having one surface etched is prepared as a valve metal sheet 1. This aluminum foil can be easily obtained by masking one side and etching. This valve metal sheet 1
The hole 6 is formed at a predetermined position on one surface of the substrate by laser processing, etching processing, punching processing or the like.

Next, as shown in FIG. 4, the porous surface of the valve metal sheet 1 is anodized in a chemical solution to form a dielectric film 3 on the surface and the surface of the pores. 3
Is immersed in a solution containing polypyrrole, then immersed in an oxidizing agent solution to form a thin polypyrrole layer on the dielectric film 3 by chemical oxidative polymerization, and the resulting polypyrrole layer contains polypyrrole. The solid electrolyte layer 4 is formed by forming a polypyrrole layer having a sufficient thickness on the polypyrrole layer by electrolytically polymerizing the polypyrrole layer by immersing it in a solution with the polypyrrole layer on the positive side and the electrode in the solution on the negative side.

Next, as shown in FIG. 5, a current collector layer 5 made of copper is formed on one surface, and the current collector layer 5 is adhered to the solid electrolyte layer 4 so as to be electrically conductive. As shown in FIG. 5, an insulating layer 9 provided with a hole 7 which is connected to a hole 6 provided at a predetermined position of the porous sheet 1 is formed of epoxy resin.

Next, as shown in FIG. 7, a conductor 10 is formed by plating copper or the like on the inner surfaces of the holes 6 and 7 and the opening, and solder, conductive resin, Au, S
A connection bump 11 made of n, Ag, or the like is formed.

Then, as shown in FIG. 8, a first connection terminal 12 electrically connected to the current collector layer 5 is made of a layer of gold, copper, nickel or the like by using a conductive paste, vapor deposition, sputtering or the like, or a metal foil. To form a completed first capacitor portion 16.

As shown in FIG. 9, the second capacitor unit 1
7 is manufactured in the same manner as the first capacitor unit 16.
However, the second capacitor portion 17 is a completed product by forming the electrode portion 2 by sputtering, vapor deposition, or sticking a copper foil to the unetched surface of the porous valve metal sheet body 1 made of aluminum foil. .

As shown in FIG. 10, the first capacitor unit 1
The first capacitor terminal 16 and the semiconductor component 8 are electrically connected by the connection bumps 11 at the same time as the first connection terminal 12 and the semiconductor component 8 are electrically connected.

Finally, as shown in FIG. 11, the first connection portion 1 made of solder, conductive resin, Au, Sn, Ag, etc.
4 and the second connection portion 15 are electrically connected to the end faces of the first connection terminal 12 and the second connection terminal 13 to complete the power supply regulator.

In the case of a four-terminal regulator, FIG. 12 is a sectional view of one embodiment, and FIG. 13 is a circuit diagram.
As shown in FIG. 12, the current collector layers 5 of the first capacitor section 16 and the second capacitor section 17 are electrically connected to each other by the first connection terminal 12, and It is electrically connected to the semiconductor component 8. The current collector layer 5 of the third capacitor section 18 is electrically connected to the terminal of the semiconductor component 8 through the third connection terminal 19, and the electrode section 2 of the second capacitor section 17 is connected via the connection bump 11. It can be electrically connected to the terminals of the semiconductor component 8 on the upper surface. Finally, the electrode portions 2 of the first capacitor portion 16 and the third capacitor portion 18 are connected to the first connection portion 14.
And is electrically connected to the semiconductor component 8 through the device to form a power supply regulator.

As another example, when a sintered body of valve metal powder is used as the valve metal sheet 1, as shown in FIG. 14, tantalum, niobium, aluminum or the like is provided on one side of a valve metal sheet foil 20. The valve metal sheet body 1 is formed by combining valve metal sintered bodies 21 such as niobium and aluminum.

In the other steps, the same steps as those in the case of using the aluminum foil having one surface etched are used to manufacture a capacitor portion.

[0046]

As described above, the power supply regulator of the present invention has a small size and excellent high-frequency response having a capacitor portion which can be directly electrically connected to a semiconductor component via a connection bump, and is capable of mounting the capacitor on the substrate surface. It is possible to eliminate the mounting and improve the productivity, which is effective in configuring a digital circuit.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a power regulator according to an embodiment of the present invention.

FIG. 2 is a circuit diagram of the same power regulator, particularly a three-terminal regulator.

FIG. 3 is a cross-sectional view of a state in which a valve metal sheet and holes are used for a solid electrolytic capacitor of the power supply regulator.

FIG. 4 is a sectional view showing a state in which a dielectric film and a solid electrolyte layer are formed on a solid electrolytic capacitor of the power supply regulator.

FIG. 5 is a cross-sectional view showing a state where a current collector layer of the solid electrolytic capacitor of the power supply regulator is formed.

FIG. 6 is a cross-sectional view showing a state where an insulating layer of a solid electrolytic capacitor of the power supply regulator is formed.

FIG. 7 is a cross-sectional view of the solid-state electrolytic capacitor of the regulator for a power supply in which a first connection terminal and a connection bump are formed.

FIG. 8 is a cross-sectional view of a first capacitor portion on which a first connection terminal and an insulating layer of the solid electrolytic capacitor of the power supply regulator are formed.

FIG. 9 is a cross-sectional view of a second capacitor portion in which an electrode portion is formed on a valve metal sheet used for a solid electrolytic capacitor of the power supply regulator.

FIG. 10 is a sectional view showing a state where the first capacitor portion and the semiconductor component are joined.

FIG. 11 is a cross-sectional view of the power supply regulator in a state where the capacitor is connected to the semiconductor component via a first connection portion, a second connection portion, and a connection bump of the capacitor.

FIG. 12 is a sectional view of an embodiment of a four-terminal regulator.

FIG. 13 is the same circuit diagram.

FIG. 14 is a sectional view showing another valve metal sheet body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Valve metal sheet body 2 Electrode part 3 Dielectric film 4 Solid electrolyte layer 5 Current collector layer 6, 7 hole 8 Semiconductor component 9 Insulating layer 10 Conductor 11 Connection bump 12 First connection terminal 13 Second connection terminal 14 First connection part 15 Second connection part 16 First capacitor part 17 Second capacitor part 18 Third capacitor part 19 Third connection terminal 20 Valve metal sheet foil 21 Valve metal sintered body

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Tetsuhiro Koerika 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroshi Takahashi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (11)

[Claims] A first capacitor portion, a semiconductor component electrically connected to an upper surface of the first capacitor portion via connection bumps, and a semiconductor component electrically connected to the upper surface of the semiconductor component. The first and second capacitor portions are provided with a second capacitor portion, and the first and second capacitor portions are formed of a valve metal sheet body having one surface made porous, and the valve metal sheet body made porous. A dielectric film provided on the surface, a solid electrolyte layer provided on the top surface of the dielectric film, a current collector layer provided on the top surface of the solid electrolyte layer, and a side surface of the valve metal sheet body. And an insulating layer provided so as to cover the valve metal sheet, the dielectric coating, the solid electrolyte layer and the current collector layer, and the current collector layer and the semiconductor of the first capacitor unit. Parts are electrically connected by the first connection terminal. In addition, the first connection terminal is electrically connected to the current collector layer of the second capacitor portion via the first connection portion, and the electrode portion of the second capacitor portion is connected to the second connection portion. A power regulator that is electrically connected to semiconductor components via a unit. 2. A regulator for a power supply having a solid electrolytic capacitor according to claim 1, wherein an aluminum foil having one surface etched is used as the valve metal sheet. 3. A power regulator having a solid electrolytic capacitor according to claim 1, wherein a sintered body of valve metal powder is used as the valve metal sheet body. 4. A regulator for a power supply having a solid electrolytic capacitor according to claim 1, wherein an unetched surface of an aluminum foil having one surface etched is used as an electrode portion. 5. The regulator for a power supply having a solid electrolytic capacitor according to claim 1, wherein another metal layer formed on an unetched surface of the aluminum foil having one surface etched is used as an electrode portion. 6. The regulator for a power supply having a solid electrolytic capacitor according to claim 1, wherein one side of the sintered body of valve metal powder on which no dielectric film is formed is used as an electrode portion. 7. A regulator for a power supply having a solid electrolytic capacitor according to claim 1, wherein a metal layer formed on one surface of a valve metal powder sintered body having no dielectric film formed thereon is used as an electrode portion. 8. A power regulator having a solid electrolytic capacitor according to claim 1, wherein a functional polymer is used as the solid electrolyte layer. 9. A regulator for a power supply having a solid electrolytic capacitor according to claim 1, wherein a manganese dioxide layer is used as the solid electrolyte layer. 10. A power supply regulator having a solid electrolytic capacitor according to claim 1, wherein the number of connection bumps is equal to or greater than the number of connection bumps of the semiconductor component. 11. A first capacitor portion, a second capacitor portion provided to be electrically connected to an upper surface of the first capacitor portion, a semiconductor component, and a semiconductor component on an upper surface of the semiconductor component. It comprises a third capacitor portion electrically connected, the first, second and third capacitor portion, a valve metal sheet body having one surface made porous,
A dielectric coating provided on the porous surface of the valve metal sheet, a solid electrolyte layer provided on the upper surface of the dielectric coating, and a current collector layer provided on the upper surface of the solid electrolyte layer And an electrode portion provided on a side surface of the valve metal sheet, and an insulating layer provided so as to cover the valve metal sheet, a dielectric film, a solid electrolyte layer and a current collector layer, First and second collector portions of the second capacitor portion are electrically connected to each other by the first connection terminal, and are electrically connected to the semiconductor component through the first connection terminal. The current collector layer is electrically connected to the terminal of the semiconductor component through the third connection terminal, and the electrode portion of the second capacitor portion is electrically connected to the terminal of the semiconductor component on the upper surface through the connection bump. And the power of the first and third capacitor sections. Parts are power regulator comprising electrically connected to the semiconductor component via a first connecting portion.