JP2002299193A - Chip-type multilayer electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide chip-type multilayer electronic components where a series of electronic components can be obtained by holding the components in a desired definite attitude on a tape-shaped holding member, and mounting in a prescribed attitude is enabled on a mounting substrate by confirming the attitude of the components through external observation. SOLUTION: A means (mark) M for identifying a surface 5 of the outermost layer in a laminating direction is arranged on a ceramic element (thermistor element assembly) 11, constituting the chip-type multilayer electronic component 1. A plurality of numbers of the components are aligned and held in a prescribed attitude by using the tape-shaped holding member 2, in such a manner that the surface 5 of the outermost layer is mounted in an attitude, so as to have a prescribed angle to a mounting surface, when mounting is conducted on a mounting subject (mounting substrate) 4, and a series of the electronic components 3 is obtained. The components are held with the holding member 2, in such a manner that the surfaces 5 of the component 1 have either an attitude which is almost parallel to or almost perpendicular to the mounting surface, when mounting is performed on the mounting subject (mounting substrate) 4, and a series of the electronic components 3 is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type multilayer electronic component, and more particularly, to a chip-type multilayer electronic component supplied in a state where a large number of them are held by a tape-shaped holding member.

[0002]

2. Description of the Related Art As shown in FIG. 7, a plurality of (multiple) chip-type multilayer electronic components 51 are mounted on a tape-like holding member 52 in a chip-type multilayer electronic component. Some are supplied as the held electronic component series 53.

[0003] Such a chip-type laminated electronic component 51 supplied as a series of electronic components 53 usually has an attitude corresponding to the attitude when it is held by a tape-shaped holding member 52, as shown in FIG. , Mounting board 5 by automatic mounting machine
4 and mounted on the mounting board 54 by, for example, a method such as reflow soldering.

However, the mounting substrate 54 on which the chip-type multilayer electronic component 51 is mounted by a method such as reflow soldering is bent as shown in FIG. 9 due to thermal stress or mechanical stress. May be. Therefore, the chip-type multilayer electronic component 51 needs to have a resistance (flexure strength) to a predetermined amount of flexure (the value of X in FIG. 9) of the mounting substrate 54.

Meanwhile, in a chip-type multilayer electronic component manufactured through a step of firing a laminate obtained by laminating green sheets, the lamination direction is orthogonal to the mounting substrate (that is, the lamination surface is parallel to the mounting substrate). The bending strength is different between the case of mounting in the posture and the case of mounting in the posture where the lamination direction is parallel to the mounting board (that is, the lamination surface is perpendicular to the mounting substrate). There is a characteristic that the flexure strength is higher when mounted in a posture in which the direction is orthogonal to the mounting substrate, and the directionality of the chip-type multilayer electronic component becomes a problem during mounting.

[0006] For example, as shown in FIG.
In the chip-type multilayer electronic component 51 having a thickness T and a length L,
When the width W and the thickness T are clearly different, it is possible to easily confirm the direction from the appearance shape. However, as shown in FIG. When the width W and the thickness T are almost the same, it is difficult to confirm the directionality of the chip-type multilayer electronic component 51 from the appearance, and as shown in FIG. In a series of electronic components 53 held by a tape-shaped holding member 52, each chip-type laminated electronic component 5
1 are held by the tape-shaped holding member 52 in different postures. In FIG. 11, the outermost layer surface 55 in the stacking direction of the chip-type multilayer electronic component 51 is hatched for easy understanding.

When the chip-type multilayer electronic component 51 is supplied from such a series of electronic components 53 and mounted on the mounting board 54, as shown in FIG. The mounting is performed not only in a posture in which the direction is orthogonal to the mounting substrate, but also in a posture in which the stacking direction is parallel to the mounting substrate. In FIG. 12 as well, the outermost layer surface 55 of the chip-type multilayer electronic component 51 is hatched.

When the chip-type multilayer electronic component 51 is mounted not only in the above-described orientation in which the lamination direction is orthogonal to the mounting substrate but also in a posture in which the lamination direction is parallel to the mounting substrate, When the bending of a predetermined level or more occurs in the chip 54, as described above, in the chip-type multilayer electronic component 51 mounted in a posture in which the stacking direction is parallel to the mounting board (that is, the stacking surface is orthogonal to the mounting board). There is a problem that cracking and chipping occur.

The present invention has been made to solve the above-mentioned problems, and it is possible to form a series of electronic components by holding the tape-shaped holding member in a desired fixed posture, and to set the posture to external when mounting. An object of the present invention is to provide a chip-type multilayer electronic component that can be confirmed by observation and can be reliably mounted on a mounting board in a predetermined posture.

[0010]

To achieve the above object, a chip-type multilayer electronic component according to the present invention (claim 1) has a ceramic element formed by firing a laminate in which green sheets are laminated. In a chip-type multilayer electronic component having a structure in which external electrodes are provided at both ends, a ceramic element has means for identifying an outermost layer surface in a stacking direction, and when mounted on a mounting target, A plurality of tapes are held in a predetermined position by a tape-shaped holding member so that the outermost layer surface is mounted at a predetermined angle with respect to the mounting surface so as to be mounted at a predetermined angle with respect to the mounting surface. It is characterized by having.

In the chip-type multilayer electronic component of the present invention, the ceramic element is provided with means for identifying the outermost layer surface in the stacking direction, and the outermost layer surface is fixed to the mounting surface when mounted on the mounting object. Are mounted in a predetermined posture by a tape-shaped holding member so as to be mounted in such a posture as to form an angle, and are connected to the electronic components. The chip-type multilayer electronic component is supplied in a desired constant posture (by mounting the component on a mounting board and confirming whether or not it is in a desired posture by means for identifying the outermost layer surface. For example, it is possible to reliably mount the device in a posture having a high resistance to bending.

Further, the chip-type multilayer electronic component according to claim 2, wherein the tape is mounted such that the outermost layer surface is substantially parallel or substantially perpendicular to the mounting surface when mounted on a mounting object. It is characterized by being held by a shape holding member and being connected to electronic components.

At the time of mounting on an object to be mounted, the outermost layer surface is held by a tape-shaped holding member so as to be in either one of a substantially parallel and a substantially vertical posture with respect to the mounting surface to form a series of electronic components. Depending on the characteristics of the chip-type multilayer electronic component, both mounting is performed so that the outermost layer surface is substantially parallel to the mounting surface, and mounting is performed such that the outermost layer surface is substantially perpendicular to the mounting surface. This makes it possible to mount the chip-type multilayer electronic component in an optimal posture.

The chip-type multilayer electronic component according to a third aspect is characterized in that the ceramic elements have substantially the same width and thickness.

When the width and the thickness of the ceramic element are substantially the same, it is difficult to confirm the posture of the chip-type multilayer electronic component at the time of mounting, so that the mounting reliability tends to be low. When the present invention is applied to such a chip-type multilayer electronic component, mounting reliability can be improved, which is particularly significant.

The chip-type multilayer electronic component according to a fourth aspect is characterized in that a marking is provided on the outermost layer surface of the ceramic element as means for identifying the outermost layer surface.

As means for identifying the outermost layer surface,
When marking is performed on the outermost layer surface of the ceramic element, the posture of the chip-type multilayer electronic component can be surely visually identified, and the present invention can be made more effective.

Further, in the chip-type multilayer electronic component according to a fifth aspect, as the green sheet constituting the outermost layer surface,
A green sheet having a color other than black after firing is used, and the surface of the outermost layer of the ceramic element has a color other than black.

For example, when the chip-type laminated electronic component is a chip-type thermistor, the thermistor element (thermistor element) often has a black color. By using a green sheet that becomes a color other than black after firing as a green sheet constituting, and by making the surface of the outermost layer of the ceramic element a color other than black, the posture of the chip-type multilayer electronic component is visually observed. Can be reliably identified,
It becomes possible to make the present invention effective. In this case, a step of forming a mark or the like is not required, and the manufacturing process can be simplified.

Further, the chip-type multilayer electronic component according to claim 6 is characterized in that the ceramic element is a thermistor element.

In chip-type multilayer electronic components in which the ceramic element is a thermistor element, that is, in many cases, the width and thickness of the thermistor element (ceramic element) are substantially the same, in such a case. By applying the present invention, it becomes possible to hold the chip-type thermistor in a predetermined posture and mount the chip-type thermistor in a desired constant posture with high resistance to the deflection of the substrate.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described, and features thereof will be described in more detail.

[Embodiment 1] FIG. 1 is a diagram showing a chip-type laminated electronic component according to a first embodiment in which a series of electronic components is formed by being held by a tape-shaped holding member. Sectional view cut along the longitudinal direction, (b)
FIG. 4 is a perspective view showing the directionality (posture) of the chip-type multilayer electronic component.

As shown in FIGS. 1 (a) and 1 (b), in the first embodiment, a chip-type multilayer electronic component having substantially the same width W and thickness T (chip-type thermistor in the first embodiment)
A plurality of electronic components 1 are held by a tape-shaped holding member 2 including an upper holding member 2a and a lower holding member 2b, thereby forming a series of electronic components 3.

In the first embodiment, a chip-type multilayer electronic component (chip-type thermistor) 1 is shown in FIG.
As shown in (b), a first opposing electrode 12a and a second opposing electrode 12b are provided on the same plane inside a thermistor element (thermistor element) 11 made of a material containing Mn, Ni, and Co as main components. Are disposed so as to face each other with a predetermined gap G therebetween, and at both ends of the thermistor body 11,
External electrodes 24a and 24b are provided so as to be electrically connected to the first and second counter electrodes 12a and 12b.
Marking for confirming the outermost layer surface 5 of the chip-type multilayer electronic component 1 is provided on the outermost layer surface 5 (upper and lower) in the stacking direction. It has a structure provided with a mark M, which is a means for identifying one direction and posture.

The chip-type multilayer electronic component 1 has a green sheet 21 on which internal electrode patterns serving as the first and second counter electrodes 12a and 12b are provided, and a green sheet 21 on which no internal electrode pattern is provided. Laminate sheet 22,
Laminate formed by crimping (mother laminate)
After baking, a mark for each thermistor element is provided at a predetermined position of the mother laminate, cut and divided into individual thermistor elements 11, and then the external electrodes 24a,
It is manufactured by forming 24b.

In the first embodiment, the mark M is formed using an alumina-based material as the mark forming material, so that the mark M is formed on the surface of the thermistor body 11 made of a material mainly containing Mn, Ni, and Co. A mark M that can be easily visually confirmed is formed. Therefore,
In the chip-type multilayer electronic component 1 of the first embodiment,
The upper and lower outermost surfaces 5 of the chip-type multilayer electronic component 1 are reliably recognized by the mark M, and the posture of the chip-type multilayer electronic component 1 in the state of the electronic component chain 3 and the chip when mounted on the mounting board 4 The mounting posture of the multilayer electronic component 1 can be reliably recognized.

As a result, it is possible to efficiently mount the chip-type multilayer electronic component 1 by using the electronic component series 3 holding the chip-type multilayer electronic component 1 in a desired posture, and to ensure the mounting posture of the chip-type multilayer electronic component 1. For example, as shown in FIG. 3, the posture (the mounting surface of the mounting substrate 4) is such that the outermost layer surface 5 of the chip-type multilayer electronic component 1 is substantially parallel to the surface (mounting surface) of the mounting substrate 4. Posture with high resistance to deflection)
Thus, the chip-type multilayer electronic component 1 can be reliably mounted on the mounting substrate 4.

In the first embodiment, the case where alumina is used as the mark forming material for forming the mark M has been described, but the constituent material of the thermistor body (that is, based on the constituent material of the thermistor body). In consideration of the thermistor element color), it is possible to use various materials having colors that can be easily confirmed.

[Embodiment 2] FIGS. 4A and 4B are diagrams showing a chip-type laminated electronic component according to a second embodiment in which electronic components are connected by being held by a tape-shaped holding member. FIG. Sectional view cut along the longitudinal direction, (b)
FIG. 4 is a perspective view showing the directionality (posture) of the chip-type multilayer electronic component.

In the second embodiment, a chip-type multilayer electronic component (chip-type thermistor) 1 is shown in FIG.
As shown in (b), a first opposing electrode 12a and a second opposing electrode 12b are provided on the same plane inside a thermistor element (thermistor element) 11 made of a material containing Mn, Ni, and Co as main components. Are disposed so as to face each other with a predetermined gap G therebetween, and a green sheet 21 provided with internal electrode patterns serving as the first and second counter electrodes 12a and 12b, After laminating the green sheet 22 on which the electrode pattern is not disposed and the upper and lower outermost green sheets 23a and 23b and pressing the laminate, the laminate (mother laminate) formed is cut, and then the mother laminate is cut. After being divided into individual thermistor element bodies 11 by means of an external electrode 24a, 24b, they are manufactured.

The upper and lower outermost green sheets 23
As a and 23b, green sheets having a color other than black after firing are used, and the outermost layer surface (FIG. 5B) 5 of the thermistor body 11 after firing has a color other than black. ing. In the second embodiment, green sheets made of an alumina-based material are used as the upper and lower outermost green sheets 23a and 23b, and the outermost layer surface 5 of the fired thermistor body 11 has a white color. ing.

That is, in the second embodiment, the outermost layer surface 5 formed by the outermost green sheets 23a and 23b and having a color other than black has a chip like the mark M in the first embodiment. Molded electronic component 1
Is configured to function as a means for identifying the outermost layer surface 5. The other configuration is the same as that of the first embodiment. In FIGS. 4, 5, and 6, the portions denoted by the same reference numerals as those in FIGS. 1, 2, and 3 indicate the same or corresponding portions.

Chip-type multilayer electronic component 1 of Embodiment 2
The outermost layer surface 5 has a color other than black, and the color of the thermistor body 11 is black or a color similar thereto (in the second embodiment, an alumina-based material is used as the thermistor body 11). In this case, the upper and lower outermost layer surfaces 5 are surely recognized, and the posture of the chip-type multilayer electronic component 1 in the state of the electronic component sequence 3 and when mounted on the mounting substrate 4 The mounting attitude of the chip-type multilayer electronic component 1 can be reliably recognized.

Therefore, the mounting posture of the chip-type multilayer electronic component 1 is reliably recognized, and, for example, as shown in FIG.
It is possible to reliably mount the chip-type multilayer electronic component 1 in such a posture that the outermost layer surface 5 of the chip-type multilayer electronic component 1 is substantially parallel to the surface (mounting surface) of the mounting substrate 4 and has a high resistance to bending of the mounting substrate 4. become.

In the second embodiment, a green sheet made of an alumina-based material is used as a green sheet having a color other than black after firing. However, in consideration of the color of the thermistor body 11, the green sheet after firing is used. It is possible to use green sheets made of various materials having a color in which the outermost layer surface 5 can be easily confirmed.

In the first and second embodiments, the chip thermistor has been described as an example. However, the case where the thermistor element constituting the chip thermistor is either a positive characteristic thermistor element or a negative characteristic thermistor element In addition, the present invention can be applied.

In the first and second embodiments, the chip-type thermistor has been described as an example of the chip-type multilayer electronic component. However, the present invention is not limited to the chip-type thermistor, but may be a chip-type multilayer capacitor, a chip-type multilayer varistor, or a chip-type multilayer varistor. The present invention can be widely applied to various chip-type laminated electronic components such as LC composite components.

In the first and second embodiments, the case where the outermost layer surface of the chip-type multilayer electronic component is mounted so as to be substantially parallel to the surface of the mounting substrate has been described as an example. Since the position of the chip-type multilayer electronic component can be reliably recognized, the present invention is also applied to the case where the chip-type multilayer electronic component is mounted in such a position that the outermost layer surface is substantially perpendicular to the mounting surface. It is possible to

The present invention is not limited to Embodiments 1 and 2 in other respects as well. Specific configurations of the thermistor body, specific patterns and arrangement positions of internal and external electrodes, Various applications and modifications can be made within the gist of the invention with respect to the types of semiconductor ceramics constituting the thermistor body, the specific manufacturing method of the chip-type multilayer electronic component of the present invention, and the like.

[0041]

As described above, in the chip-type multilayer electronic component of the present invention (claim 1), the ceramic element is provided with means for identifying the outermost layer surface in the stacking direction, and is mounted on the mounting object. Sometimes, a plurality of tapes are held in a predetermined position by a tape-shaped holding member so that the outermost layer surface is mounted at a predetermined angle with respect to the mounting surface, and the electronic components are connected. Therefore, by sequentially supplying chip-type multilayer electronic components from a series of electronic components onto a mounting substrate, and by means of identifying the outermost layer surface, mounting while confirming whether or not a desired posture is achieved, The chip-type multilayer electronic component can be surely mounted in a desired constant posture (for example, a posture having high resistance to bending).

Further, like the chip-type multilayer electronic component of the second aspect, the outermost layer surface may be in one of substantially parallel and substantially perpendicular to the mounting surface when mounted on the mounting object. By holding a tape-shaped holding member to form a series of electronic components, mounting is performed so that the outermost layer surface is substantially parallel to the mounting surface due to the characteristics of the chip-type multilayer electronic component, and the outermost layer surface is mounted on the mounting surface. Can be mounted so as to be substantially perpendicular to the chip, and the chip-type multilayer electronic component can be mounted in an optimal posture.

When the width and the thickness of the ceramic element are substantially the same, it is difficult to confirm the posture of the chip-type multilayer electronic component at the time of mounting, so that the mounting reliability tends to be low. However, when the present invention is applied to such a chip-type multilayer electronic component as described in claim 3, the mounting reliability can be improved, which is particularly significant.

In the case where the outermost layer surface of the ceramic element is marked as means for identifying the outermost layer surface as in the case of the chip-type multilayer electronic component according to the fourth aspect, the chip-type multilayer electronic component is visually inspected. The posture of the electronic component can be reliably identified, and the present invention can be made effective.

When the chip-type multilayer electronic component is a chip-type thermistor, the thermistor element often has a black color. As an electronic component, as a green sheet constituting the outermost layer, a green sheet having a color other than black after firing is used, and by allowing the surface of the outermost layer of the ceramic element to have a color other than black, by visual observation, It is possible to reliably identify the orientation of the chip-type multilayer electronic component, thereby making it possible to make the present invention effective, and to eliminate the need for a step of forming a mark and the like, thereby simplifying the manufacturing process. Can be.

Further, chip-type laminated electronic components in which the ceramic element is a thermistor element, that is, chip-type thermistors, the width and thickness of which are substantially the same, are not limited. In this case, by applying the present invention as described in claim 6, it becomes possible to hold the chip-type thermistor in a predetermined posture and mount the chip-type thermistor in a desired constant posture with high resistance to the deflection of the substrate. , It is possible to perform highly reliable mounting.

[Brief description of the drawings]

FIG. 1 is a view showing a chip-type multilayer electronic component according to a first embodiment of the present invention in which a series of electronic components is formed by being held by a tape-shaped holding member, and FIG. FIG. 2B is a cross-sectional view taken along the line, and FIG. 2B is a perspective view showing the directionality (posture) of the chip-type multilayer electronic component.

FIG. 2A is an exploded perspective view showing a configuration of a chip-type multilayer electronic component of Embodiment 1, and FIG. 2B is a perspective view showing an external configuration thereof.

FIG. 3 is a perspective view showing a state in which the chip-type multilayer electronic component of the first embodiment is mounted on a mounting board.

FIG. 4 is a diagram showing a chip-type laminated electronic component according to a second embodiment of the present invention in which a series of electronic components is formed by being held by a tape-shaped holding member. FIG. 2B is a cross-sectional view taken along the line, and FIG.

FIG. 5A is an exploded perspective view showing a configuration of a chip-type multilayer electronic component of a second embodiment, and FIG. 5B is a perspective view showing an external configuration thereof.

FIG. 6 is a perspective view showing a state in which the chip-type multilayer electronic component of Embodiment 2 is mounted on a mounting board.

FIG. 7 is a cross-sectional view showing a series of electronic components formed by holding a conventional chip-type laminated electronic component on a tape-shaped holding member.

FIG. 8 is a perspective view showing a state in which a conventional chip-type multilayer electronic component is mounted on a mounting board.

FIG. 9 is a diagram illustrating a state in which a mounting substrate on which the chip-type multilayer electronic component is mounted has a flexure.

10A and 10B are diagrams illustrating the shape of a chip-type multilayer electronic component, wherein FIG. 10A is a perspective view illustrating a chip-type multilayer electronic component having a shape in which a width W and a thickness T are clearly different, and FIG. It is a perspective view which shows the chip-type laminated electronic component in which T is almost the same.

FIG. 11 is a diagram showing a conventional series of electronic components in which a chip-type laminated electronic component is held by a tape-shaped holding member.

FIG. 12 is a perspective view showing a state in which a conventional chip-type multilayer electronic component is mounted on a mounting board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Chip-type laminated electronic component (chip-type thermistor) 2 Tape-shaped holding member 2a Upper holding member 2b Lower holding member 3 Electronic component connection 4 Mounting board 5 Outermost layer surface in stacking direction 11 Thermistor element body (Thermistor element) 12a First Counter electrode 12b Second counter electrode G gap 21 Green sheet on which internal electrode pattern is provided 22 Green sheet without internal electrode pattern 23a, 23b Outermost green sheet 24a, 24b External electrode M mark

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3E067 AA24 AB47 AC04 BA34A BA39A BC10A EA29 EB27 EC08 FA01 FA09 FC01 3E096 AA06 BA09 CA14 DA04 5E034 BB01 BC01 5E082 AA01 FF05 FG16 FG26

Claims (6)

[Claims] 1. A chip-type multilayer electronic component having a structure in which external electrodes are provided at both ends of a ceramic element formed by firing a laminate in which green sheets are stacked, wherein the ceramic element is arranged in a stacking direction. Means for identifying the outermost layer surface, and a plurality of such that the outermost layer surface is mounted at a predetermined angle with respect to the mounting surface at the time of mounting on a mounting object. A chip-type laminated electronic component, wherein the individual components are aligned and held in a predetermined posture by a tape-shaped holding member and are connected to electronic components. 2. The semiconductor device according to claim 1, wherein said outermost layer surface is held by a tape-shaped holding member so that said outermost layer surface is at least one of substantially parallel and substantially vertical with respect to a mounting surface. The chip-type multilayer electronic component according to claim 1, wherein: 3. The chip-type multilayer electronic component according to claim 1, wherein said ceramic element has substantially the same width and thickness. 4. The chip-type laminated electronic device according to claim 1, wherein a marking is provided on the outermost layer surface of the ceramic element as means for identifying the outermost layer surface. parts. 5. A green sheet having a color other than black after firing as a green sheet constituting the surface of the outermost layer, wherein the surface of the outermost layer of the ceramic element has a color other than black. The chip-type multilayer electronic component according to claim 1, wherein: 6. The chip-type multilayer electronic component according to claim 1, wherein said ceramic element is a thermistor element.