JP2002298110A - Antenna base material, resonance label, IC package and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture an antenna base material at a low cost. SOLUTION: An electric wire 1 as a linear conductor is arranged on a polyester resin film 2 as a base material in a loop shape to form a plane antenna. The wire 1 is given insulating coating and is fastened and fixed to the film 2 by cotton yarn 3 as a binding member at an appropriate interval. An IC module 4 resin-sealed with an IC chip is additionally loaded on the film 2 and is connected with both ends of the wire 1 via terminals of the module 4 by resistance welding. Lock stitching is performed on the film 2 in a pattern manner using an enamel wire of the wire 1 of 120 μm as bobbin thread and machine sewing thread of #90 as needle thread by an electronic sewing machine to form the plane antenna.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna base having a planar antenna and an electronic recording medium using the same. Examples of the electronic recording medium include IC cards, bank cards, credit cards, and point cards.
It includes an information recording medium such as a C package, an IC tag, an airline tag, and an inventory management tag. Further, the present invention relates to a resonance label used for a shoplifting prevention system or the like using an antenna of an antenna substrate.

[0002]

2. Description of the Related Art For example, in a conventional planar antenna, a copper foil or the like is patterned into an antenna shape by etching.
Alternatively, after forming a coil with an electric wire by a winding machine, the electric wire is fixed to the base material, or the electric wire is arranged on the plastic base material and fixed to the plastic base material by heat (Japanese Patent No. 28105).
No. 47).

[0003]

However, manufacturing an antenna by the etching method is expensive. In the method of forming a coil by a winding machine, it is difficult to fix the electric wire at the beginning and end of the electric wire to the base material. This becomes an obstacle when an IC chip or an IC module is further mounted on a base material as in an IC card and an attempt is made to connect the IC chip or the IC module to a coil. The method of fixing the wires by heat while arranging the wires on the plastic base material has problems such as low production speed and high cost, and it is difficult to respond to future large-scale consumption.

An object of the present invention is to provide an antenna base which can accurately determine the winding start and end positions of a planar antenna and which can be manufactured at low cost, and a resonance label or an IC (semiconductor integrated circuit device) mounting body using the same. , And a method for manufacturing the antenna base material.

[0005]

SUMMARY OF THE INVENTION An antenna substrate according to the present invention comprises: a base; a linear conductor having a predetermined shape which is disposed on at least one side of the base to constitute a planar antenna; And a binding member for binding and fixing at least a part of the base material to the base material.

In the antenna base material of the present invention, since the flat antenna is fixed to the base material by the binding member, the winding start and end positions of the flat antenna can be accurately determined. Further, the linear conductor can be easily fixed by the binding member, and the antenna base material can be manufactured at low cost.

The IC package of the present invention is one in which an IC such as an IC chip or an IC module is mounted on the antenna substrate of the present invention, and this IC is connected to a planar antenna fixed to the antenna substrate. The resonance label of the present invention uses the antenna substrate of the present invention. The method of manufacturing an IC package according to the present invention is a method of assembling the antenna substrate of the present invention by hot pressing.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a top view of an antenna base material according to one embodiment. An electric wire 1 as a linear conductor is disposed in a loop on a polyester resin film 2 as a base material to constitute a planar antenna. The electric wire 1 is coated with an insulating material and fixed to the film 2 at appropriate intervals by a cotton thread 3 as a binding member. An IC module 4 in which an IC chip is resin-sealed is mounted on the film 2, and the IC module 4 is connected to both ends of the electric wire 1 by resistance welding through its terminals.

FIG. 2 is an enlarged sectional view of FIG. 1, showing a state in which the electric wire 1 is fixed. Referring to FIG. 2, the electric wire 1 is disposed on one surface of the film 2, and the yarn 3 passing through the film 2 from the other surface of the film 2 and passing through the electric wire 1 is entangled with the electric wire 1. Electric wire 1 is film 2
It is fixed to.

FIG. 3 shows a non-contact IC card as an example in which the antenna base material of FIG. 1 is processed into a card shape. Here, the antenna base material 20 is sandwiched between thermoplastic resins 21a and 21b, which are intermediate layers, and the card base materials 22a and 22b are further laminated on the outside thereof, and integrated by hot pressing to form a non-contact IC card. .

FIG. 4 shows an example of an IC label using the antenna substrate of FIG. This IC label has a label substrate 31
Is coated with an adhesive material 32 as a second intermediate layer.
2, an antenna base material 33 is superimposed, an adhesive material 34 as a third intermediate layer is further superposed on the opposite side of the antenna base material 33, and a release sheet 35 is stuck on the adhesive material 34. If this IC label is subjected to slitting or punching as required, a flexible IC label can be obtained.

The linear conductor used in the present invention includes an electric wire, a conductive fiber, a conductive foil and the like. Among them, electric wires are the most common and inexpensive. Electric wires are usually divided into single metal wires, alloy wires, bimetal wires, synthetic stranded wires, etc.
The wires are respectively divided into bare wires and insulated wires. For insulated wires, coat bare wires with rubber, synthetic resin, paper, varnish, or enamel, or braid with fiber materials such as silk or artificial silk, or use lead, metal, rubber synthetic resin, or wax-based admixtures. Is used as a protective coating material. In the case of the antenna shape as shown in FIG. 1, since the linear conductors cross each other, an electric wire coated with an insulating material is selected. The wire has a different diameter and length depending on the desired resonance frequency. However, when used for a card or a sheet-like antenna substrate, a wire having a smaller diameter is preferable.

The binding member for fixing the linear conductor only needs to be able to fix the linear conductor, and the material is preferably a fibrous material such as a natural fiber or a synthetic fiber. Natural fibers are made of cotton, flax, manila hemp, or coconut fibers, animal fibers are made of wool or silk, and synthetic fibers are made of low-molecular-weight compounds that are chemically synthesized from high-molecular-weight compounds. Fibers such as acrylic, acetate, aramid, nylon, vinylon, vinylidene, polyurethane, polyester, polypropylene, polyethylene and viscose rayon. Each fiber is used alone or as a mixture, and if a thermoplastic plastic fiber that is melted by heat is used, the linear conductor can be more firmly fixed.
In addition, the use of conductive fibers or the like in which conductive particles are kneaded into an acrylic resin is also reasonable when joining a binding member and a linear conductor, and is effective as a booster that easily receives radio waves. It can also be expected to have a conductive effect on the back side of the base material, and when a circuit is formed on the back side, it becomes a kind of through-hole circuit.

The interval at which the linear conductor is fixed to the substrate is not limited, and is suitably from 0.5 mm to 20 mm. When arranging the linear conductor on a rectangular loop, the corner of the rectangle may be simply stopped.

The substrate for fixing the linear conductor is not particularly limited as long as it is a leaf material capable of forming a hole, and examples thereof include paper, cloth, synthetic paper, nonwoven fabric, film, printed board, and rubber plate. A soft material is preferable because burrs do not appear when a hole is made with a needle or the like. In addition, films, nonwovens,
Synthetic paper made of thermoplastic plastic is more preferable because it is further fixed to the antenna when heat is applied. The melting point of thermoplastic film, non-woven fabric and synthetic paper is 12
It is preferably 0 ° C or lower, and those having no melting point preferably have a softening temperature of 90 ° C or lower.

A fibrous binding member is passed through the perforated foil leaf in a loop, and the linear conductor is fixed to form one entangled portion. As an example, the fixing method is JIS B 9003 (199
There is a method based on the lock stitch shown in FIG. 6 or a method based on the basting stitch shown in FIG. In the final sewing, as shown in FIG. 6, the cloths 72a and 73a are sewn together with the upper thread 74a and the lower thread 71a, and the entanglement of the threads is located in the middle of the sewing object. In the basting sewing, as shown in FIG. 7, the entanglement of the thread can be shifted to one surface side from the combined surface of the sewing objects 72b and 73b by disturbing the tension balance between the upper thread 74b and the lower thread 71b. . Further, as in the case of basting shown in FIG. 8, the distance between the upper thread 74c and the lower thread 71c can be increased. In the present invention, the material corresponding to the two cloths to be sewn is the base material, the material corresponding to the upper threads 74a, 74b, 74c is the linear conductor, and the lower threads 71a, 71b,
The one corresponding to 71c is a binding member. In addition to the so-called sewing that can be sewn as represented by the above examples,
For example, a mode is also possible in which each knot of the lower thread 72b in FIG. 7 is made independent and each knot is tied with a single thread, that is, a plurality of binding members are used.

It is preferable that the linear conductor is in close contact with the base material. However, if the tension of the binding member is too high for the close contact, the binding member is liable to break, and the foil leaf may have protrusions such as burrs. If this is the case, the fixation of the linear conductor is weakened, and the binding member is easily cut.

The base material to which the linear conductor is fixed is formed by connecting electronic components such as an IC to the linear conductor by laser welding, resistance welding, soldering, or the like, to form a sheet called an inlet. Hereinafter, those in which electronic components such as ICs are connected to an antenna on a base material are collectively referred to as an “inlet”. The inlet is sandwiched between a thermoplastic sheet or a card substrate as an intermediate layer, hot-pressed, and can be formed into an IC card.

FIG. 9 is a plan view of an essential part showing a state where the connecting portion of the IC module is sewn. Modular I
Connections 53a, 53b between C chip 50 and its antenna
The wires 51a, 51b are fastened to upper holes 52a, 52b, which are used to connect the wires 51a, 51b. Further, thereafter, it can be fixed by solder welding, resistance welding, laser welding, or the like.

FIG. 10 shows a printed conductive ink portion 63a,
It is a principal part top view showing the state where IC chip 60 was connected to 63b. Electric wires 61a and 61b are connected to the conductive ink portion with sewn IC chips by binding yarns 62a and 62b. Further, thereafter, it can be fixed by solder welding, resistance welding, laser welding, or the like.

The card base material used is, for example, vinyl acetate resin, vinyl chloride resin, acrylic resin, olefin resin, diene resin, natural rubber, gelatin, glue, abietic resin, cellulose derivative resin, polyester resin, Epoxy resin, vinyl butyral resin, urethane resin, polyamide resin, alkyd resin, melamine resin, urea resin, phenol formalin resin, petroleum resin, maleic acid copolymer, etc., alone or in mixture or copolymer There is.

The card base may be coated with a release varnish for imparting releasability to the metal plate for compression, a varnish for imparting luster, or a varnish for improving abrasion resistance to a thickness of 0.0.
It may be printed or coated to 5 mm or less. In addition, melting point and TG
By using a varnish that shows a higher temperature than the card substrate at the (glass transition point) and softening point, a card with a smooth surface can be obtained without being affected by the flow of printing or the built-in antenna or IC. can get. If the varnish is a UV (ultraviolet) curable resin or an EB (electron beam) curable resin, it can be cured without applying heat, and an IC card with excellent surface properties can be obtained. As the UV-curable resin, known materials may be used. For example, as the monomer, acrylic acid,
Monoacrylates such as methyl acrylate, ethyl acrylate, n-butyl acrylate, isodecyl acrylate, phenoxy acrylate, stearyl acrylate, n-hexyl acrylate, lauryl acrylate ethoxy ethyl acrylate, glycidyl acrylate and cyclohexyl acrylate, and 1,3-butanediol diacrylate Tri- or more functional acrylates such as polyethylene glycol diacrylate, trimethylolpropane triacrylate, dipentaerythritol, hexaacrylate, methacrylates such as methacrylic acid, lauryl methacrylate, glycidyl methacrylate, maleic acid, itaconic acid, N-methylol Acrylamide, vinyltoluene, vinyl acetate, acrylonitrile and the like. That.

Other polymers and oligomers that can be polymerized by ultraviolet rays can be used. For example, polyacrylate,
Examples include polyester acrylate, urethane acrylate, epoxy acrylate, silicone acrylate, polyether acrylate, pobutadiene acrylate, and thiol / polyene.

As the EB-curable resin, a UV-curable resin can be used as it is. As the photopolymerization initiator used for the UV-curable resin, known materials, for example, acetophenone-based, benzophenone-based, quinone derivatives and the like can be mentioned. Further, sensitizers such as n-butylamine and tri-n-butylphosphine may be used.

On the surface of the front and back card base material used in the present invention, desired patterns, explanatory characters, etc. are printed by offset printing, silk screen printing, or gravure printing. The card is stamped and molded into a card after molding, but printing is performed before or after the stamping. The varnish is applied or printed after printing a picture or an explanatory note. Depending on the printing process, the printing or coating of the varnish may be before or after the card molding.

A thermoplastic resin is used for the intermediate layer. The thermoplastic resin used is preferably a thermoplastic polymer material having a Vicat softening point of 100 ° C. or less, preferably 80 ° C. or less. Thermoplastic films include PETG, for example, olefin resins, ionomers, vinyl chloride resins, ABS (acrylonitrile-butadiene-styrene) resins, AS (acrylonitrile-styrene) resins, polystyrene, acrylic resins, methacrylic resins, polyvinyl acetate, Vinyl butyral resin, EVA (ethylene-vinyl acetate copolymer), cellulose derivative resin, urethane resin, polyester resin, polyamide resin, nylon, polyacetal, polycarbonate, fluororesin, polyester resin, polyetherimide, polyimide, etc. Alone, a mixture, a copolymer and the like.

The softening temperature of the thermoplastic resin is 50 to 2
The conditions of 00 ° C. and the pressure are 9.8 to 980 kPa and the pressure time is about 50 to 5000 seconds. It can also be degassed during pressurization to prevent entrapment of bubbles. When the pressing is performed at a pressing speed of 5 mm / min or less, preferably 1 mm / min or less, the unevenness of the built-in material is absorbed, and a flat card surface is obtained.

FIG. 5 shows an example of a method for manufacturing a card. An electric wire is sewn on the base material 45 of the inlet according to the present invention to form the antenna 42. The IC module 41 is placed at a predetermined position of the antenna 42 and welded to connect the antenna 42 and the module 41 to form an inlet sheet.

A thermoplastic resin as an intermediate layer 44a, 44b is disposed on both the front and back sides of the inlet sheet, and is sandwiched between card bases 43a, 43b from the outside to form a laminate of card members. Then, the card member laminate is sandwiched between the metal compression plates 46a and 46b, and hot pressed to create a card stock. afterwards,
Create a card by punching out the size of the card.

Furthermore, lamination processing of a transparent over sheet, processing for making a hybrid IC in which a contact type IC chip is embedded by punching (counterboring) processing, bar code,
It is processed into a multifunctional IC card through processes such as numbering, magnetic stripe processing, photo pasting, embossing for inserting Braille and embossed characters, and rewriting film processing for pasting a rewrite film.

In the case of processing into an IC label, an inlet sheet may be attached to a label base material coated with an adhesive as a second intermediate layer, and a release sheet may be placed on the opposite side of the inlet sheet. Further, an adhesive as a third intermediate layer may be applied between the inlet sheet and the release sheet. The label substrate to be used is not limited as a constituent component, but may be paper, film, foil, or the like, and it is preferable that the label substrate has been processed so as to be easily printed.

The pressure-sensitive adhesives of the second and third intermediate layers are not limited as constituents, but may be rubber-based, acrylic-based,
Solvent type, emulsion type, hot melt type and the like can be used as the form such as vinyl ether type, urethane type and silicone type. In particular, an acrylic resin containing an acrylic premonomer or an acrylic monomer as a main component is preferable from the viewpoint of weather resistance. The acrylic resin is not limited, vinyl monomer containing an acrylic group, vinyl monomer having an epoxy group, vinyl monomer having an alkoxyl group, vinyl monomer having an ethylene oxide group, vinyl monomer having an amino group,
Vinyl monomer having an amide group, vinyl monomer having a halogen atom, vinyl monomer having a phosphate group,
Those containing a vinyl monomer having a sulfonic acid group, a vinyl monomer having a silane group, a vinyl monomer having a phenyl group, a vinyl monomer having a benzyl group, a vinyl monomer having a tetrahydrofurfuryl group, and other copolymerizable monomers No.

In order to improve the adhesive properties of these acrylic resins, various additives, for example, natural resins such as rosin, modified rosin, rosin and derivatives of modified rosin, polyterpene resins, modified terpene, aliphatic hydrocarbon resins, Tackifiers and antioxidants including cyclopentadiene resins, aromatic petroleum resins, phenolic resins, alkyl-phenol-acetylene resins, cumarone-indene resins, vinyl toluene-α-methylstyrene copolymers , Stabilizers, softeners such as oils, fillers, stabilizers, pigments, colorants, and the like can be added as necessary. These may be used in combination of two or more as necessary. The acrylic resin is a bulk polymerization method, a solution polymerization method,
Polymerization is carried out by any method such as a suspension polymerization method and an emulsion polymerization method in which a monomer insoluble or hardly soluble in water is dispersed together with an emulsifier and polymerization is carried out using a water-soluble polymerization initiator. In addition, the mixing ratio of the tackifier is the above-mentioned acrylate polymer 1
It is 1 to 50 parts by weight with respect to 00 parts by weight. By the way, 1
If the amount is less than 5 parts by weight, the effect of improving the adhesive strength is poor and 5
If it exceeds 0 parts by weight, the adhesive strength tends to decrease. An organic UV absorber such as a benzophenone-based or benzotriazole-based agent may be added to the pressure-sensitive adhesive layer to increase weather resistance.

To form the pressure-sensitive adhesive layer, the pressure-sensitive adhesive as described above is applied to a release sheet, dried if necessary to form a pressure-sensitive adhesive layer, and bonded to a surface base material.
The pressure-sensitive adhesive layer used in the present invention is obtained. As a device for applying the pressure-sensitive adhesive, a reverse roll coater, a knife coater, a bar coater, a slot die coater, an air knife coater, a reverse gravure coater, a vario gravure coater, a hot melt coater, or the like is used. in the range of to 50 g / m ^2, and more preferably is adjusted from 10 to 30 g / m ^2. If the amount is less than 5 g / m ² , the adhesive strength to the adherend will be insufficient. On the other hand, if it exceeds 50 g / m ² , the adhesive may protrude, cause cohesive failure at the time of peeling, or cause rise at the time of punching. is there.

The release sheet for covering the pressure-sensitive adhesive layer is not particularly limited, and is a high-density base paper such as glassine paper, clay-coated paper, kraft paper or high-quality paper laminated with a film such as polyethylene, or high-quality paper. A fluororesin, a silicone resin, etc., on a paper coated with polyvinyl alcohol or acrylate copolymer resin or a plastic film such as polyethylene terephthalate, polypropylene, etc., in a dry weight of about 0.1 to 3 g / m ^2. What has been applied and provided with a release agent layer by thermal curing, ionizing radiation curing, or the like is appropriately used. As a coating device in this case, a bar coater, an air knife coater,
A direct gravure coater, an offset gravure coater, a multi-stage roll coater and the like are appropriately used. Incidentally, when transparency is required, the transparency and the smoothness using a plastic film release sheet rather than a paper release sheet may be sufficient. The completed IC label can be used as needed.
Printing, varnishing, barcode processing, punching, slitting, perforation processing and half cutting are performed.

[0036]

EXAMPLES (Example 1) (1) A thermoplastic film having a thickness of 150 μm (Polyester adhesive film manufactured by Toa Gosei, Aronmelt PES-1)
11EES, Vicat softening point 65 ° C) and a lower thread of 120 μm in the lower thread of an electronic sewing machine (manufactured by Brother Industries, BS-300)
Using a # 90 sewing thread as the enamel wire and the upper thread, lock stitching was performed in a pattern to form a planar antenna.

(2) Further, both ends of the planar antenna prepared in (1) are connected with a Motorola Co., Ltd. My Fair module chip, which is an IC, by a resistance welding machine (Miyachi Technos IP-100B), and the inlet sheet is connected. Created.

(3) On the surface of the inlet sheet of (2) (the surface on which the antenna and the IC are arranged), a 100-μm-thick thermoplastic film (Polyester adhesive film manufactured by Toa Gosei, Aronmelt PES-111)
EES, Vicat softening point 65 ° C.), and a PETG film (product name: PG-WHI, thickness 200 μm, TG 60 ° C., manufactured by Mitsubishi Plastics, Inc.) as a front and back substrate of the card.
The card base material sandwiched between the sheets at a Vicat softening temperature of 70 ° C. and stacked like a sheet is compressed with a metal plate (thickness: 2 mm, SUS30).
1, No. 6 finish surface roughness Ra = 0.10 μm, Rmax
= 1.20 µm, Rz = 1.00 µm, manufactured by Nissin Steel Co., Ltd.), and heated to 120 ° C using a hot press machine. After the card base material and the thermoplastic film were in a molten state, they were pressed in. The compression was performed at a speed of 0.01 mm / min and a pressure of 196 kPa.

(4) After being compressed and cooled, it was punched into a card by a punching machine to obtain a sample of an IC card. The obtained inlet sheet and card have a resonance frequency of 15
Communication was possible at HMz.

Example 2 (1) In Example 1, a hot-melt adhesive (ESDINE 9 manufactured by Sekisui Chemical Co., Ltd.) was applied to the back surface of the inlet sheet of (2).
190) was heated and applied. Furthermore, it was stuck into an adhesive sheet (OETSUCK Co., Ltd., PETSW100, surface substrate: white PET, adhesive: acrylic, release sheet: glassine separator). The obtained sheet is cut into a suitable size,
An IC label was manufactured. (2) The obtained IC label has a resonance frequency of 15 HMz.
Communication was possible.

[0041]

According to the present invention, a base material, a linear conductor having a predetermined shape which is arranged on at least one side of the base material to form a planar antenna, and at least a part of the linear conductor is formed on the base material. Since the antenna base having the binding member fixed and bound is configured, in the planar antenna, the positions of the winding start and the winding end of the electric wire can be precisely defined.
In addition, since the work of connecting the linear conductor to the base material with the connecting member is easy, the antenna base material can be manufactured at low cost.
Further, since the antenna base can be manufactured at low cost, a resonance label and an IC package using the antenna base can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of an antenna substrate of the present invention.

FIG. 2 is a partially enlarged sectional view of FIG. 1;

FIG. 3 is a cross-sectional view showing one embodiment of a non-contact IC card which is an example of the IC package of the present invention.

FIG. 4 is a cross-sectional view showing one embodiment of an IC label as an example of the IC package according to the present invention.

FIG. 5 is a cross-sectional view showing another embodiment of the non-contact IC card which is an example of the IC package of the present invention.

FIG. 6 is a cross-sectional view showing an example of lockstitching.

FIG. 7 is a cross-sectional view showing an example of basting;

FIG. 8 is a sectional view showing another example of basting;

FIG. 9 is a main part plan view showing a state in which a connection portion of the IC module is sewn;

FIG. 10 is a main part plan view showing a state where an IC chip is connected to printed conductive ink.

[Explanation of symbols]

1, 51a, 51b, 61a, 61b Electric wire of linear conductor 2 Polyester resin film of base material 3, 52a, 52b, 62a, 62b Thread of binding member 4, 41, 50, 60 IC module 20, 33 Antenna base material 21a, 21b, 44a, 44b Thermoplastic resin 22a, 22b, 43a, 43b Card base material 31 Label base material 32, 34 Adhesive material 35 Release sheet 45 Inlet base material 42 Antenna

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Naobu Sugiyama 4-3-1 Jokoji, Amagasaki-shi, Hyogo Prefecture Oji Paper Co., Ltd. Amagasaki Research Center F-term (reference) 2C005 MA18 MA40 MB08 MB10 NA09 PA03 PA04 PA14 PA18 PA21 PA27 RA04 RA09 5B035 AA04 CA01 5J046 AA07 AA14 AB11 PA07

Claims (9)

[Claims] 1. A base material, a linear conductor having a predetermined shape which is arranged on at least one side of the base material to form a planar antenna, and at least a part of the linear conductor is connected to the base material. An antenna base comprising a fixed binding member. 2. The antenna substrate according to claim 1, wherein the binding is sewing. 3. The binding member according to claim 1, wherein the binding member is a linear member, and the linear member binds and fixes the linear conductor to the base material by lockstitching or temporary stitching. Antenna base material. 4. The antenna substrate according to claim 1, wherein the substrate is a thermoplastic plastic sheet. 5. The antenna substrate according to claim 1, wherein the linear member is a thermoplastic plastic. 6. The semiconductor device further comprising an IC chip and / or a circuit terminal member on the side of the substrate on which the linear conductor is provided, and the terminal member is also fixed to the substrate by the linear member. The antenna base according to any one of claims 1 to 5, wherein the terminal member is connected to the linear conductor. 7. An IC mounted body, wherein an IC is mounted on the antenna substrate according to any one of claims 1 to 6, and the IC is connected to the linear conductor. 8. A resonance label using the antenna substrate according to any one of claims 1 to 6. 9. A method of manufacturing an IC mounted body assembled by hot pressing using the antenna base material according to claim 1. Description: