JP2002298108A - Non-contact IC media interposer and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily manufacture an interposer for a contactless IC medium without need of heat resistance allowing using a sheet with low heat resistance of paper or synthetic resin such as PVC or PET. SOLUTION: Thermosetting conductive ink is printed and hardened on a release sheet 10 with high heat resistance to form opposite lands 5, 7a, 7b and a jumper part 8. Thermosetting insulation ink is printed and cured in such a manner covering the jumper part 8 to form a resist part 6. An IC chip 9 is mounted so as to be connected with the opposite lands 7b, 5. An adhesive sheet 11 with low heat resistance is closely contacted with the sheet 10 and torn off again, and the opposite lands 5, 7a, 7b the resist part 6, the jumper part 8 and the IC chip 9 are integrally transferred to an adhesive face of the adhesive sheet 11. The interposer 4 manufactured in such a manner is adhered to a sheet material 1 having an antenna 3 in a plurally wound coil shape and land parts 2a, 2b to finally form the contactless IC medium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an interposer for non-contact type IC media and a method for manufacturing the same, and more particularly to an interposer for a sheet-shaped non-contact type IC medium having an antenna circuit and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, an information recording medium (RF-ID (Radio Frequenque) such as a non-contact type IC tag capable of transmitting and receiving data in a non-contact state to record and erase data.
A non-contact data transmitter / receiver, which is a non-contact IC medium used as cy IDentification (media), has an antenna section formed on a sheet material, and an IC section is provided on the antenna section.
It has an antenna circuit configured by mounting a chip.

The non-contact type IC media is desirably in the form of a thin and flexible sheet so as to be applicable to a wide range of uses. The antenna portion is usually formed by etching copper or aluminum, conducting wires, or conductive ink. It is formed by a printing method such as printing or conductive paste.

[0004] A method of forming an antenna circuit in this non-contact type IC medium will be described.

[0005] First, a conductive ink is screen-printed on a flexible sheet material and solidified to form a coiled antenna portion having a plurality of loops. Next, an insulating ink is printed so as to straddle the coil-shaped antenna portion and solidified to form a resist portion. Further, a conductive ink is printed and solidified across the resist portion to form a jumper portion which is connected to lands of the plurality of antenna portions and short-circuits them. Then, an IC chip is mounted on the land of the antenna unit. Thereafter, if necessary, the non-contact type IC media is completed by covering with a protective sheet or the like.

In place of such a conventional method of forming an antenna circuit, an intermediate product called an interposer may be used in order to simplify the manufacturing process. Specifically, an antenna portion and land portions (which may include a resist portion) at both ends of the antenna portion are formed on a sheet material as a base material of the non-contact type IC media. On the other hand, an interposer in which an opposing land portion, a resist portion, and a jumper portion are previously formed on another sheet material and an IC chip is mounted in advance so as to be connected to the opposing land portion is prepared.
Then, the interposer is attached to a sheet material on which the antenna section and the land section are formed. At this time, the interposer is positioned with respect to the sheet material such that at least a part of the land part and the opposing land part face each other, the resist part covers a part of the antenna part, and the jumper part crosses over the resist part. . As a result, a non-contact type IC medium having the same antenna circuit as the case where the interposer is not used is manufactured. The use of an interposer simplifies the manufacture of non-contact IC media. Furthermore, the interposer can be used for general purposes by standardizing the dimensions and the shape of the antenna part and the like to some extent. That is, the same interposer can be mass-produced and used for various non-contact IC media, and the production efficiency can be greatly improved.

Usually, the opposing lands of the interposer are formed by etching, printing and solidifying of a conductive ink. In the present invention, it is preferable to use a conductive ink. Volatile ones may be used. In this case, by heating the sheet-shaped substrate on which the conductive ink is printed at, for example, 150 ° C. for about 30 minutes, the conductive ink is thermally cured and solidified.

[0008]

SUMMARY OF THE INVENTION Such a non-contact type I
The interposer for C media is preferably in the form of a thin sheet so as to be applicable to various uses without becoming a large protrusion of the non-contact type IC media.

In the non-contact type IC media, it is necessary that the sensitivity of data transmission / reception with the outside be good, and for that purpose, it is desirable that the area of the antenna unit be as large as possible. In view of this, a coil-shaped antenna portion is formed so as to make a plurality of rounds of a portion near the outer periphery of the non-contact type IC medium. Then, by attaching an interposer to this sheet material, the lands at both ends of the antenna portion and the opposing lands are brought into contact, and the opposing lands contacting the lands at one end of the antenna portion are opposed to each other near the lands at the other end. I routed to the land, and I connected to both opposing lands
The C chip is connected to the antenna unit. For this reason, in the interposer, a resist portion is formed in the antenna portion, and the IC itself crosses over the antenna in some cases. However, usually, an insulating resist that extends over a plurality of coil-shaped antenna portions is used. And a jumper portion for connecting the opposing land portions is formed on the resist portion.

The opposing land and jumper connected to the antenna are required to have low resistance in order to reduce the loss. In the case of a thin card, label, or foam, they are not subject to physical stress. It is required to have strong bending resistance. On the other hand, the opposing lands on which the IC chip is mounted need to improve the reliability of the conductive connection with the connection terminals of the IC chip. Stability, compatibility with anisotropic conductive film, anisotropic conductive paste, non-conductive film, non-conductive paste, conductive paste, sealing resin, etc. It is also necessary to consider that there is no action that hinders the above, but it is desirable to use a conductive ink that satisfies all of these requirements.

Therefore, an object of the present invention is to provide a paper, PVC, P
It is possible to use a sheet-shaped base made of a material with low heat resistance such as synthetic resin such as ET, it can be easily manufactured, and has low resistance and bending resistance. An object of the present invention is to provide a non-contact type IC media interposer having high reliability of conductive connection with connection terminals of an IC chip and a method of manufacturing the same.

[0012]

According to the present invention, there is provided a method of manufacturing an interposer for non-contact type IC media, comprising the steps of: printing conductive ink on a release sheet to form opposed land portions;
Solidifying the conductive ink printed on the release sheet;
A step of mounting the C chip and a step of superimposing the opposed land portion forming surface of the release sheet and the adhesive surface of the adhesive sheet and transferring the solidified opposed land portion and the IC chip to the adhesive surface of the adhesive sheet. .

Further, another method of manufacturing an interposer for a non-contact type IC medium according to the present invention includes a step of printing conductive ink on a release sheet to form an opposing land portion.
A step of solidifying the conductive ink printed on the release sheet, a step of superimposing the opposed land portion forming surface of the release sheet and the adhesive surface of the adhesive sheet, and transferring the solidified opposed land portion to the adhesive surface of the adhesive sheet; Mounting an IC chip on the adhesive sheet so as to be connected to the opposing land portion.

According to these production methods, since the step of solidifying the conductive ink is not performed on the adhesive sheet serving as the base material of the interposer, heat resistance is not required and paper, PVC, P
A material having low heat resistance such as a synthetic resin such as ET is used. Further, the material of the adhesive sheet can be selected by giving priority to properties other than heat resistance, and the characteristics of the interposer for non-contact IC media can be improved.

The step of solidifying the conductive ink may be a step including heating the release sheet.

After the step of forming the opposing land portion and the jumper portion, a step of forming an insulating resist portion on the release sheet may be included. In the transfer step, the resist portion and the jumper portion are also removed at the same time as the opposing land portion. To the adhesive surface of the adhesive sheet.

The adhesive sheet may be one in which an adhesive layer is formed on a flexible sheet substrate.

The release sheet may have a release agent layer formed on the antenna portion forming surface, and preferably has heat resistance.

Preferably, the release sheet is used repeatedly after the opposite land portion is transferred to the adhesive sheet. This makes it possible to stably mass-produce the non-contact IC media interposer by forming the release sheet on which the conductive ink solidification step is performed from a material having excellent heat resistance and strength.

The non-contact type IC media interposer of the present invention further comprises an IC chip, a conductive jumper portion, and a resist portion partially covering the jumper portion on the bonding surface of the bonding sheet. The opposite land portion made of the solidified conductive ink, which is connected to the IC chip, is simultaneously transferred.

Another non-contact type IC media interposer according to the present invention has a conductive jumper portion, a resist portion partially overlapping on the jumper portion, solidified on the bonding surface of an adhesive sheet. An IC chip is mounted on an adhesive surface to which the opposite land portion made of conductive ink has been transferred at the same time and the jumper portion, the resist portion, and the opposite land portion have been transferred, so as to be connected to the opposite land portion. .

[0022]

Embodiments of the present invention will be described below with reference to the drawings.

The non-contact type IC media is a general term for cards, tags, labels, forms, postcards, envelopes, and the like, which have a built-in IC chip and can store and erase data by transmitting and receiving data in a non-contact manner. And an antenna circuit for transmitting and receiving data without contact.

The structure of this non-contact type IC media is shown in FIG.
As shown in (a) and (b), the interposer 4 is attached to the sheet material 1 on which the antenna portion 3 and the land portions 2a and 2b which are the terminal portions of the antenna portion 3 are formed. The interposer 4 shown in FIG. 2 includes opposing lands 7a and 7b opposing the lands 2a and 2b, and opposing lands 5 on a thin sheet-like base material (adhesive sheet 11) such as paper or synthetic resin. A resist portion 6 formed at a position straddling the coiled antenna portion 3, and a counter land portion 7 a and a counter land portion 5 formed so as to cross the resist portion 6.
And an IC chip 9 mounted so as to be connected to the opposing lands 5, 7b.

[First Embodiment] Non-Contact IC of the Present Invention
A first embodiment of a method for manufacturing a media interposer will be described below with reference to FIGS.

First, a release sheet 10 shown in FIG. 3 (a) having at least one surface having a release property is prepared. In the example shown in FIG. 4, the release sheet 10 is a continuous paper. As shown in FIG. 3 (b), a thermosetting conductive ink is screen-printed on the release surface of the release sheet 10, and the conductive ink is cured by heating, and the opposing lands 5, 7a, 7b and the jumper are applied. 8 are formed (step S1).

Next, as shown in FIG. 3C, a resist portion 6 covering the jumper portion 8 is formed by screen-printing a thermosetting insulating ink and heating and solidifying the ink (step S2). .

Next, as shown in FIG. 3D, the IC chip 9 is mounted so as to be connected to the opposing land portions 5, 7b (step S3).

Therefore, as shown in FIGS. 4 and 5 (b), the release sheet 10 has a release surface on which the opposing lands 5, 7a, 7b, the jumper 8, the resist 6, and the IC chip 9 are provided. Then, the adhesive surface of the adhesive sheet 11 serving as the base material of the non-contact type IC media interposer 4 is brought into close contact.
Then, as shown in FIGS.
From the release sheet 10 again, the release sheet 10
Of the opposite land portions 5, 7a, 7b, due to the releasability (non-adhesiveness) of the release surface of
Jumper part 6, resist part 6, and IC chip 9
Is transferred integrally to the adhesive surface of the adhesive sheet 11 (step S4). Thus, the interposer 4 (see FIG. 2) of the present embodiment is completed.

On the other hand, a plurality of coil-shaped antenna portions 3 are formed on the other sheet material 1 by printing and solidifying conductive ink. At the same time, the lands 2a and 2b are integrally formed at positions to be both ends of the antenna portion 3 in a completed state by printing and curing of the conductive ink.

Then, as shown in FIGS. 1A and 1B, the interposer 4 is attached to the sheet material 1 on which the antenna portion 3 and the lands 2a and 2b are formed (step S5). . At this time, the interposer 4 and the sheet material 1 are connected to the lands 2a and 2b and the opposing lands 7
a, 7b at least partially oppose each other,
Are positioned so as to partially cover the antenna unit 3 and are bonded. In addition, as shown in FIG. 1B, the interposer 4 is firmly adhered to each other by deforming the interposer 4 and bringing the interposer 4 into close contact with the base material 1.

In this way, the I of the interposer 4
The C chip 9 is connected to the land 2a at one end of the antenna unit 3 via the opposing land 5, the jumper 8, and the opposing land 7a, and is connected to the other of the antenna via the opposing land 7b. It is connected to the land 2b at the end. Thus, an antenna circuit including the antenna portion 3, the land portions 2a, 2b, the opposing land portions 5, 7a, 7b, the resist portion 6, the jumper portion 8, and the IC chip 9 is formed on the sheet material 1. .

Finally, a protective sheet (not shown) made of a synthetic resin is attached to the sheet material 1 to protect the antenna circuit and the like (step S6). Thus, the non-contact type IC media having the interposer of the present embodiment is completed.

When the adhesive sheet 11 is a continuous paper as shown in FIG. 4, it is cut to an appropriate length to form an interposer. On the other hand, in the release sheet 10, the formed opposing lands 5, 7a, 7b, the resist 6, the jumper 8, and the IC chip 9 are transferred to the adhesive sheet 11, and nothing is mounted on the release surface. Since it is in a state, it can be used again to manufacture a non-contact type IC media interposer. Thus, it is preferable to use the release sheet 10 repeatedly and repeatedly.

According to the present embodiment, the interposer 4
In the manufacture of the resin, the step of heating to a high temperature for solidifying the conductive ink or the like is performed on each part on the release sheet 10, and therefore, the release sheet 10 is made of a material having high heat resistance or strength such as polyimide or metal. Formed by Since this release sheet 10 is not a consumable but is used many times, even if it is somewhat expensive, it does not significantly affect the manufacturing cost. On the other hand, since the adhesive sheet 11, which is the base material of the interposer 4, is not heated to a high temperature, a synthetic resin having low heat resistance such as paper, PVC, or PET can be used. In addition, since synthetic resins having low heat resistance are generally inexpensive, manufacturing costs can be reduced. Furthermore, any material selected with emphasis on various properties other than heat resistance can be used, and a noncontact IC media interposer 4 suitable for practical use can be obtained.

The interposer 4 does not necessarily need to be formed for each non-contact type IC medium each time, but can be mass-produced in advance and used for general purposes.

An example of a more specific process of this embodiment described above will be briefly described below.

[Example 1] As the release sheet 10, a paper made of Lintec SP-8K Ao (trade name) was used as a release sheet, and LS415C-M manufactured by Asahi Chemical Laboratory was used as a conductive ink.
The opposing lands 5, 7a, 7b and the jumper 8 were printed using (trade name) and heated at 150 ° C. for 30 minutes. Next, the resist part 6 was formed by printing of an insulating ink and heat curing. Next, the IC chip 9 was mounted so as to be connected to the opposing land portions 5, 7b. Then, using a tack sheet as the adhesive sheet 11, which the release sheet laminated to 10 (not shown) rubber roller at a temperature of 40 ° C. The pressure of 2 kg / cm ² applied by, peeled then pull both release sheet The transfer of the opposing lands 5, 7a, 7b, the jumper 8, the resist 6, and the IC chip 9 from 10 to the adhesive sheet 11 was performed. Thus, the interposer 4 was formed.

Then, the bonding surface of the bonding sheet 11 of the interposer 4 is connected to the antenna section 3 and the land section 2.
a and 2b are attached to a sheet material 1 made of paper formed in advance by non-impact printing, and a non-contact type I
C media was manufactured. When the sheet material 1 is a heat-sensitive tack paper, a heat-sensitive tack paper is formed as a non-contact type IC medium, and by sticking this to a postcard or a business form, a product capable of data transmission / reception, storage and erasure can be simplified. Can be manufactured.

[Example 2] Tetra A-31 (trade name) manufactured by Teijin DuPont Films was used as the release sheet 10, and FA-353 (trade name) manufactured by Fujikura Kasei was used as the conductive ink. , 7a, 7b and the jumper section 8 were printed and heated. Next, the resist part 6 was formed by printing of an insulating ink and heat curing. Next, the IC chip 9 was mounted so as to be connected to the opposing land portions 5, 7b. Then, as the adhesive sheet 11, a biodegradable plastic film made of Unitika polylactic acid film and a hot melt adhesive (PEA11 made by Toagosei Co., Ltd.)
1EE (trade name)) and bonded to the release sheet 10 while heating to 120 ° C., and then peeling off both.
Transfer of the opposing lands 5, 7a, 7b, the jumper 8, the resist 6, and the IC chip 9 from the release sheet 10 to the adhesive sheet 11 was performed. Thus, the interposer 4 was formed.

On the other hand, RF-600 (trade name) manufactured by Fukuda Metal Foil & Powder Co., Ltd., which is a conductive ink, is printed on a sheet material 1 made of a Unitika polylactic acid film, and heated at 80 ° C. for 30 minutes to form the antenna section 3 and Land portions 2a and 2b were formed. Then, the above-described interposer 4 was attached to the sheet material 1. Further, the same biodegradable plastic film was bonded to the sheet material 1 as a protective sheet (not shown) to produce a non-contact type IC medium used as a card or a tag.

Example 3 The opposite land portions 5, 7a, 7b and the jumper portion 8 were formed using a polyimide film as the release sheet 10 and N-5845-1 (trade name, manufactured by Shoei Chemical Industry Co., Ltd.) as a conductive ink. Print, 160
Heating was performed at 30 ° C. for 30 minutes. Next, the resist part 6 was formed by printing of an insulating ink and heat curing. Next, the IC chip 9 was mounted so as to be connected to the opposing land portions 5, 7b. Then, a hot-melt adhesive (PES111EEW (trade name) manufactured by Toagosei Co., Ltd.) is used as the adhesive sheet 11 using PET film E-20 (trade name) manufactured by Toray.
, And then bonded to the release sheet 10 while heating to 120 ° C., and then peeling them off, and the opposing lands 5, 7a, 7b,
The jumper part 8, the resist part 6, and the IC chip 9 were transferred. Thus, the interposer 4 was formed.

Then, the antenna section 3 and the land section 2
Sheet material 1 in which a and 2b are formed in advance by etching
Then, the above-mentioned interposer 4 was placed at 120 ° C for 0.4
It was pasted under the condition of MPa. Furthermore, this sheet material 1
Non-contact IC used as a card or tag by bonding a PET film as a protective sheet (not shown)
Media manufactured.

Example 4 As the release sheet 10, Teijin
The opposing land portions 5, 7a, 7b and the jumper portion 8 were printed using Tetron A-31 (trade name) manufactured by Dupont Film Co., Ltd., and FA-353 (trade name) manufactured by Fujikura Kasei Co., Ltd. as conductive ink, and heated. . Next, the resist portion 6 was formed by printing and solidifying the insulating ink. Next, the IC chip 9 was mounted so as to be connected to the opposing land portions 5, 7b. Then, a tack film is used as the adhesive sheet 11, which is bonded to the release sheet 10, and a pressure of 2 kg / cm ² is applied at a temperature of 40 ° C. by a rubber roller (not shown). 10
Lands 5, 7a, 7 from the sheet to the adhesive sheet 11
b, the jumper portion 8, the resist portion 6, and the IC chip 9 were transferred. Thus, the interposer 4 was formed.

On the other hand, on a release sheet made of Tetron A-31 (trade name) manufactured by Teijin DuPont Film Co., a conductive ink FA-353 (trade name) manufactured by Fujikura Kasei is printed and solidified to solidify the antenna section 3 and the land section. 2a and 2b were formed. Then, a vinyl resin foil (trade name) of PVC (polyvinyl chloride) film as the sheet material 1 is bonded to a release sheet using a double-sided tape manufactured by Lintec, and a rubber roller (not shown) is applied at a temperature of 40 ° C. ) By 2
The pressure of kg / cm ² was applied to transfer the antenna portion 3 and the lands 2a and 2b to the sheet material 1. Then, the above-described interposer 4 was attached to the sheet material 1. Further, the same PVC film is bonded to this sheet material 1 as a protective sheet (not shown) by a multi-stage press, and a non-contact type I used as a card or a tag is used.
C media was manufactured.

In Examples 2 and 3, a sheet-like member having an adhesive layer formed thereon is used as the adhesive sheet 11, but the adhesive sheet 11 of the present invention is thus prepared by adding an adhesive layer to a sheet material in advance. Is not limited to the configuration in which
This includes all adhesives that are interposed between the two at the time of lamination with the release sheet 10. Further, the sheet material may be formed of a material having adhesiveness.

In the above embodiment, the release sheet 1
Although a small amount of heating is performed when the adhesive sheet 11 and the adhesive sheet 11 are bonded, the heating temperature is adjusted in consideration of the properties of the material of the adhesive sheet 11 or a bonding step that does not involve heating is selected. be able to. In any case, the heating step after the bonding step does not need to be performed at an extremely high temperature as in the conductive ink solidification step, and is not indispensable, and an alternative processing step is possible. Therefore, a material having lower heat resistance or lower strength than the above-described embodiment can be used as the adhesive sheet 11.

[Second Embodiment] Non-Contact IC of the Present Invention
Regarding the second embodiment of the method for manufacturing media, FIGS.
This will be described below with reference to FIG. Note that the same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

First, as shown in FIG. 7B, a thermosetting conductive ink is screen-printed on the release surface of the release sheet 10 shown in FIG. 5, 7a, 7b and a jumper 8 are formed (step S1).

Next, as shown in FIG. 7C, a thermosetting insulating ink is screen-printed so as to partially cover the jumper portion 8 and is cured by heating to form a resist portion 6 (FIG. 7C). Step S2).

Then, the adhesive surface of the adhesive sheet 11 is brought into close contact with the release surface of the release sheet 10 as shown in FIGS. 8 (b) and 9, and peeled off again as shown in FIGS.
The opposite land portions 5, 7a, 7b, the resist portion 6, and the jumper portion 8 on the peeling surface are transferred to the bonding surface (step S).
7).

Thereafter, as shown in FIGS. 8D and 9,
The IC chip 12 is mounted such that connection terminals (not shown) come into contact with the opposing land portion 7b and the land portion 5 (step S8). In this way, the jumper 8, the resist 6, the opposing lands 5, 7a, 7b, and the IC chip 12 are arranged on the adhesive sheet 11, which is the base material of the interposer. Thus, the interposer 4 (see FIG. 10) of the present embodiment is completed.

On the other hand, the antenna part 3 and the land part 2 are printed on the other sheet material 1 by printing and solidifying conductive ink.
a and 2b are formed.

Then, as shown in FIGS. 11A and 11B, the interposer 4 is attached to the sheet material 1 (step S5). In this way, the IC chip 12 of the interposer 4 is connected to the land 2a at one end of the antenna unit 3 via the opposing land 5, the jumper 8, and the opposing land 7a. 7b, the land 2 at the other end of the antenna section
b. Thus, an antenna circuit is formed on the sheet material 1.

Finally, a protective sheet (not shown) made of synthetic resin is attached to the sheet material 1 to protect the antenna circuit and the like (step S6). Thus, a non-contact type IC medium having the interposer 4 of the present embodiment is completed.

In the present embodiment, substantially the same effects as in the first embodiment can be achieved. Further, the portions (facing lands 5, 7a, 7b, resist 6, jumper 8) which are easy to transfer and are formed by printing and solidifying the ink are mounted on the adhesive sheet 11 by the transfer, and the solid IC chip 12 is transferred. The mounting accuracy can be further improved by mounting directly on the adhesive sheet 11 instead of the transfer. Other parts are the same as those of the first embodiment, and therefore, the same materials and processes as those of Examples 1 to 4 of the first embodiment can be adopted.

The materials of the members described in the above description are merely examples. Hereinafter, other examples will be listed.

The base material of the adhesive sheet 11 of the interposer for non-contact type IC media of the present invention is a woven fabric, nonwoven fabric, mat, or inorganic or organic fiber such as glass fiber, alumina fiber, polyester fiber, or polyamide fiber. Paper or a combination of these, or a composite substrate formed by impregnating a resin varnish into these, a polyamide resin substrate, a polyester resin substrate, a polyolefin resin substrate, a polyimide resin substrate, ethylene
Vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin substrate, polycarbonate resin substrate, acrylonitrile butadiene styrene copolymer resin Substrate, plastic substrate such as polyethersulfone resin substrate, or matte treatment, corona discharge treatment, plasma treatment, ultraviolet irradiation treatment,
A known material such as one subjected to a surface treatment such as an electron beam irradiation treatment, a flame plasma treatment and an ozone treatment, or various easy adhesion treatments can be used.

The conductive ink of the present invention contains conductive particles and a binder as main components. As the conductive particles, metal powder, especially silver powder is preferable. Further, a conductive metal other than silver, for example, a powder of gold, platinum, palladium, rhodium or the like may be added for controlling the resistance value and compatibility with the solder. However, the conductive particles are not indispensable when the binder itself has conductivity.
As the binder, any known materials such as a permeation drying type, a solvent volatilization type, and a thermosetting type can be used.

In particular, it is desirable that the conductive ink constituting the opposing lands 5, 7a, 7b is excellent in conductivity, resistance to bending, adhesion to a substrate (adhesive sheet) or quick drying. . For example, when a polyester-based resin is used as the adhesive sheet, it contains conductive particles in an amount of 60% by weight or more and contains only a thermoplastic resin or a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin made of polyester and isocyanate). And a binder resin containing 10% or more of a polyester resin is preferred. That is, a solvent volatile type or a combined crosslinking / thermoplastic type (however, the thermoplastic type is 50% or more) is preferable.
When paper is used as the adhesive sheet, it is preferable to add an adhesive such as polyvinyl alkyl ether or polybutadiene or an inorganic filler such as silica or talc to the above-described ink.

The members and the method of forming the resist portion 6 are not particularly limited, but it is preferable to provide an insulating ink made of a thermosetting resin, a photocurable resin, or the like by a printing method. May be attached to each other.

The material and manufacturing method of the sheet material 1 having the antenna section are not limited. As an example, the antenna portion 3 and the lands 2a and 2b can be formed by etching aluminum or copper or printing and solidifying a conductive ink using a PET film as a base material.

In the manufacture of the interposer 4, the conductive ink and the insulating ink may be printed by screen printing or the like, and a solidification step may be separately provided. The type of the conductive ink is not limited.

As the IC chips 9 and 12, non-contact type I
Any known media that can be used for C media can be used.
What is necessary is just to design a and 7b arbitrarily. Further, the resist section 6 and the jumper section 8 and, consequently, the antenna section 3 and the land sections 2a and 2b are arbitrarily designed. IC chips 9 and 12 are mounted using wire bonding, anisotropic conductive film, conductive ink, insulating resin, cream solder balls, etc.
This can be performed by various known methods. If necessary, protection or reinforcement including the connection portions and the IC chips 9 and 12 using a known underfill material or glove top material may be performed. When the adhesive force of the adhesive surface of the adhesive sheet 11 is used, the IC chips 9 and 12 can be efficiently fixed. An expensive bonder, which has been conventionally required for mounting an IC chip, is not required, and since no heating is required, an inexpensive mounter can be used. Therefore, the initial investment cost can be reduced, and the speed of the mounting process can be increased, so that the manufacturing cost can be reduced.

After the interposer 4 is attached to the sheet material 1, the protective sheet is attached as described above,
Various post-processes can be performed, such as applying a sealant to solidify, cutting or cutting into arbitrary shapes, printing and recording various characters and figures, and laminating separate members. it can.

[0066]

According to the present invention, since the step of solidifying the conductive ink forming the opposing lands and the like is not performed on the adhesive sheet serving as the base material of the interposer for non-contact type IC media, paper, PVC, PET or the like is not used. Sheets having low heat resistance, such as synthetic resins, can be used, and since these are generally inexpensive, manufacturing costs can be reduced. Further, by selecting a material for the adhesive sheet with priority given to properties other than heat resistance, it is possible to manufacture an interposer for non-contact IC media having excellent various properties. Also,
As a result, there is a possibility that the use of the non-contact type IC media will be wider than before.

Since the release sheet in which the step of solidifying the conductive ink forming the opposing land portion and the like is performed can be used repeatedly, if it is formed of a material having excellent heat resistance and strength, it does not significantly increase the manufacturing cost and can be used in a non-contact manner. It is possible to stably mass produce interposers for IC media.

Further, since the interposer can be used for general purposes, it is possible to reduce the manufacturing cost and simplify the manufacturing process of the non-contact type IC media.

[Brief description of the drawings]

FIG. 1A is a plan view of a non-contact type IC medium having an interposer manufactured according to a first embodiment of the present invention, and FIG. 1B is a side sectional view thereof.

FIG. 2 is a plan view of the interposer according to the first embodiment.

FIG. 3 is a plan view showing a first half of a method of manufacturing the interposer according to the first embodiment;

FIG. 4 is a schematic view illustrating a method of manufacturing the interposer according to the first embodiment.

FIG. 5 is a schematic side view showing the second half of the method of manufacturing the interposer according to the first embodiment;

FIG. 6 is a flowchart illustrating a method of manufacturing the interposer according to the first embodiment.

FIG. 7 is a plan view showing the first half of a method of manufacturing a non-contact type IC media interposer according to a second embodiment of the present invention.

FIG. 8 is a schematic side view showing the second half of the method of manufacturing the interposer according to the second embodiment.

FIG. 9 is a schematic view illustrating a method of manufacturing the interposer according to the second embodiment.

FIG. 10 is a plan view of an interposer according to a second embodiment.

FIG. 11A is a plan view of a non-contact IC medium having an interposer according to a second embodiment, and FIG.
It is the side sectional view.

FIG. 12 is a flowchart illustrating a method of manufacturing the interposer according to the second embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Sheet material (base material of non-contact type IC media) 2a, 2b Land part 3 Antenna part 4 Interposer 5 Opposing land part 6 Resist part 7a, 7b Opposing land part 8 Jumper part 9 IC chip 10 Peeling sheet 11 Adhesive sheet ( Interposer substrate) 12 IC chip

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2C005 MA07 MA11 MA18 MA19 MA31 NA09 PA04 PA18 PA40 RA30 WA01 5B035 BB09 CA01 CA23

Claims (10)

[Claims] A step of printing conductive ink on a release sheet to form opposed land portions; a step of solidifying the conductive ink printed on the release sheet; connecting the release sheet to the opposed land portions; Mounting the IC chip such that the opposing land portion forming surface of the release sheet and the bonding surface of the adhesive sheet are overlapped, and the solidified counter land portion and the IC chip are bonded to the adhesive sheet. Transferring to the bonding surface. 2. A step of printing conductive ink on a release sheet to form opposing lands, a step of solidifying the conductive ink printed on the release sheet, and a step of forming the opposing lands on the release sheet. Superposing the bonding surface of the bonding sheet on the bonding surface and transferring the solidified counter land portion to the bonding surface of the bonding sheet; and mounting the IC chip on the bonding sheet so as to be connected to the counter land portion. And manufacturing a non-contact type IC media interposer. 3. The method for manufacturing an interposer for a non-contact type IC media according to claim 1, wherein the step of solidifying the conductive ink includes a step of heating the release sheet. 4. A step of forming an insulating resist portion on the release sheet after the facing land portion forming step, and a step of forming a conductive jumper portion crossing over the resist portion of the release sheet. 4. The method according to claim 1, further comprising, in the transferring step, transferring the resist part and the jumper part from the release sheet to the bonding surface of the bonding sheet simultaneously with the opposing land part. 5. Of manufacturing an interposer for non-contact type IC media. 5. The adhesive sheet according to claim 1, wherein an adhesive layer is formed on a flexible sheet substrate.
The method for producing an interposer for non-contact type IC media according to any one of the above items. 6. The method of manufacturing an interposer for a non-contact type IC media according to claim 1, wherein the release sheet has a release agent layer formed on the surface on which the opposing land portion is formed. Method. 7. The release sheet has heat resistance,
A method for manufacturing the non-contact type IC media interposer according to claim 1. 8. The non-contact type IC media interposer according to claim 1, wherein the release sheet is repeatedly used after the opposed land portion is transferred to the adhesive sheet. Production method. 9. An IC chip on an adhesive surface of an adhesive sheet,
The conductive jumper part, the insulating resist part partially covering the jumper part, and the opposed land part made of the solidified conductive ink connected to the IC chip were simultaneously transferred. Interposer for non-contact IC media. 10. A conductive jumper portion, an insulating resist portion partially overlapping the jumper portion, and an opposing land portion made of solidified conductive ink are simultaneously formed on the bonding surface of the bonding sheet. A non-contact type IC in which an IC chip is mounted on the adhesive surface to which the jumper portion, the resist portion, and the opposing land portion have been transferred so as to be connected to the opposing land portion.
Interposer for C media.