JP2002290101A - High frequency devices - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To improve the adhesion between components and stabilize high frequency characteristics. SOLUTION: The present invention is a high-frequency device in which a main line and a sub line are provided between dielectric substrates 3 and 4, and is provided on an outer surface side of one dielectric substrate 3 and has an inclined surface 25 formed. A grounding plate 22 and a conductor housing 23 which is fitted from the other dielectric substrate 4 side and is provided so as to be able to be engaged with the inclined surface 25 of the grounding plate 22. By being attached to the surface 25, the ground plate 22
Is configured so that a force acts in a direction in which it is brought into close contact with the dielectric substrate 3, and grounding can be reliably performed and high-frequency characteristics can be stabilized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a high-frequency device,
In particular, it relates to a microwave coupler used in a microwave band, and further relates to a triplate directional coupler.

[0002]

2. Description of the Related Art Conventionally, there are various types of microwave couplers. For example, one of those used in a base station of a portable telephone is a triplate type directional coupler.

FIG. 10 shows a conventional triplate directional coupler 1.
Comprises: an intermediate dielectric substrate 2; a first dielectric substrate 3 and a second dielectric substrate 4 sandwiching the intermediate dielectric substrate 2;
A ground plate 5 superposed on the outer surface of the dielectric substrate 3;
The intermediate dielectric substrate 2, the first dielectric substrate 3, the second dielectric substrate 4, and the ground plate 5 are provided in a stack. The intermediate dielectric substrate 2 includes a main line 7 made of copper foil on one surface 6, and main line tabs 8 are joined to both ends of the main line 7,
A sub-line 10 made of copper foil is provided on the other surface 9, and sub-line tabs 11 are joined to both ends of the sub-line 10. The main line 7 and the sub-line 10 are connected to the respective coupling portions 1.
2 and 13 are superimposed two-dimensionally and the main line tab 8
And the sub-line tabs 11 are provided to be diagonal to each other.

A box-shaped conductor housing 14 is fitted on the outer surface of the second dielectric substrate 4. The housing 14 is formed of an outer surface of the second dielectric substrate 4 and the intermediate dielectric. The body substrate 2, the first dielectric substrate 3, and the second dielectric substrate 4 are formed so as to cover the respective side surfaces and to allow the peripheral edge portion 15 to contact the ground plate 5. Notches 16 are formed in the peripheral wall of the housing 14 at positions corresponding to the main line tab 8 and the sub line tab 11, respectively.

[0005] In such a configuration, to assemble the triplate directional coupler 1, the intermediate dielectric substrate 2 is sandwiched between the first dielectric substrate 3 and the second dielectric substrate 4, A ground plate 5 is provided on the outer surface of the first dielectric substrate 3.
The housing 14 is fitted from the outer surface side of the second dielectric substrate 4 in a state where they are superposed. And. Eyelets 17 are passed through both ends of the intermediate dielectric substrate 2, the first dielectric substrate 3, the second dielectric substrate 4, the ground plate 5, and the housing 14,
The tip of the eyelet 17 is swaged, and a required portion of the peripheral portion 15 of the housing 14 is punched against the side wall of the ground plate 5 with a punch, so that the components 2, 3, 4, and 5 are joined.

[0006]

In the above-mentioned conventional high-frequency device, each of the constituent members 2 is formed by the eyelets 17.
Although the eyelets 3, 4, and 5 are brought into close contact with each other, the eyelets 17 are provided at both ends, and the adhesion at the central portion cannot be sufficiently ensured. It was difficult to stabilize.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has an object to provide a high-frequency device capable of improving adhesion between components, reliably grounding, and stabilizing high-frequency characteristics. To provide.

[0008]

SUMMARY OF THE INVENTION The present invention relates to a high-frequency device having a main line and a sub-line provided between dielectric substrates. The high-frequency device is provided on the outer surface of one of the dielectric substrates and has an inclined surface. A ground plate, and a conductor housing that is fitted from the other dielectric substrate side and that can be engaged with the inclined surface of the ground plate, wherein the housing is attached to the inclined surface. Thereby, a force is applied in a direction in which the ground plate is brought into close contact with the dielectric substrate.

Preferably, the inclined surface is formed by chamfering an outer corner of the ground plate.

Further, a groove is formed in a side wall of the ground plate in a thickness direction of the ground plate so as to reach the inclined surface, and the housing is engaged with the groove so that the housing is formed. It is configured to be fixed to the ground plate.

[0011] Further, a relief portion is cut out in a peripheral portion of the housing, and the relief portion is provided so as to be located between the grooves.

Further, on the side wall of the ground plate,
A V-groove is formed along the length direction, and the inclined surface is formed in the V-groove.

In such a configuration, a main line and a sub line are interposed between the dielectric substrates, and the other dielectric substrate is overlapped with the ground plate on the outer surface of the one dielectric substrate. When the housing is fitted from the side and the housing is engaged with the inclined surface, a force acts in a direction in which the ground plate is brought into close contact with the dielectric substrate, and grounding can be reliably performed. In addition, high frequency characteristics can be stabilized.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. Note that, for simplicity of explanation,
The same components as those in the related art are denoted by the same reference numerals in the drawings, and detailed description thereof is omitted.

FIGS. 1 to 6 show a directional coupler 21 according to an embodiment of the present invention.
Is formed by the intermediate dielectric substrate 2, the first dielectric substrate 3, the second dielectric substrate 4, and the ground plate 22 in a laminated shape, and a conductor housing is formed from the outer surface side of the second dielectric substrate 4. 23
Is fitted.

The ground plate 22, as best shown in FIGS. 5 and 6, has an elongated flat plate shape, and has round holes 24 at both ends. Each corner is chamfered to form an inclined surface 25. Further, a required number, preferably three, of a total of six grooves 27 are formed on both side walls 26 of the ground plate 22 along the thickness direction of the ground plate 22 so as to reach the inclined surface 25. Have been. As described above, the ground plate 22 has a shape suitable for press working, and a large number of the ground plates 22 are formed by a single press working from a plate-shaped material.
Can be molded, so that mass productivity can be improved.

As shown best in FIGS. 7 and 8, the housing 23 has a box shape made of a metal plate, and has an outer surface of the second dielectric substrate 4 and the intermediate dielectric substrate 2, The first dielectric substrate 3 and the second dielectric substrate 4 are formed so as to cover respective side surfaces and to be able to contact the ground plate 22. The peripheral wall 28 of the housing 23 has cutouts 29, 30 at positions corresponding to the main line tab 8 and the sub line tab 11, respectively.
Are formed on the peripheral portion 31 between the cutout portions 29, 30.
2 is notched, and the escape portion 32 is provided with the directional coupler 21.
Are assembled between the grooves 27 when assembled. Further, at both ends of the housing 23, circular holes 3 are respectively provided at positions corresponding to the circular holes 24 of the ground plate 22.
3 are drilled.

The procedure for assembling the directional coupler 21 will be described below.

The intermediate dielectric substrate 2 is sandwiched between the first dielectric substrate 3 and the second dielectric substrate 4, and a ground plate 22 is superposed on the outer surface of the first dielectric substrate 3. The housing 23 is fitted from the outer surface side of the second dielectric substrate 4 to each of the intermediate dielectric substrate 2, the first dielectric substrate 3, the second dielectric substrate 4, the ground plate 22, and the housing 23. Round hole 2
The eyelets (not shown) are passed through 4, 33 and the tip of the eyelets is swaged. Then, the peripheral portion 31 of the housing 23 is bent inward along the inclined surface 25, and a portion of the peripheral portion 31 corresponding to the groove 27 is punched with a punch along the forming direction of the groove 27. As a result, the housing 23 is engaged with the groove 27 and is fixed to the ground plate 22.
The groove 27 is formed along the thickness direction of the ground plate 22, and since the clearance portion 32 is formed between the grooves 27, the peripheral portion 31 and the ground plate 2 are formed.
There is no gap between the housing 23 and the peripheral portion 31 of the housing 23 firmly and securely adheres to the ground plate 22. When the peripheral portion 31 comes into close contact with the inclined surface 25, a force acts in a direction in which the constituent members 2, 3, 4, and 22 come into close contact with each other. Characteristics can be stabilized.

By providing a V-groove 44 in the side wall 43 of the ground plate 42 along the length direction like a directional coupler 41 shown in FIG. 9, an inclined surface to which the housing 23 can be engaged. 45 may be provided. In this case, when the housing 23 is fitted from the second dielectric substrate 4 side and a required portion of the peripheral portion 31 is punched and engaged with the inclined surface 45 of the V groove 44, the peripheral portion 31 Are firmly and securely adhered to the ground plate 22, and the components 2, 3, 4, 4
The force acts in the direction in which the two 2 are brought into close contact (downward in FIG. 9). Therefore, grounding can be reliably performed, and high-frequency characteristics can be stabilized.

Instead of punching the peripheral portion 31 of the housing 23 to the ground plates 22 and 42 with a punch, the housing 23 is engaged with the ground plates 22 and 42 by other coupling means such as screws. You may.

In the above embodiment, an example of a triplate directional coupler has been described. However, the present invention can be applied to other high-frequency devices such as a distributor / synthesizer.

[0023]

As described above, according to the present invention, since the housing is engaged with the inclined surface, a force acts in a direction in which the ground plate is brought into close contact with the dielectric substrate. The adhesion between the components can be improved, and the high-frequency characteristics can be stabilized.

When the inclined surface is formed by chamfering the outer corner of the ground plate, the contact area between the housing and the ground plate is increased, and the adhesion between the two is further improved. Grounding can be performed more reliably,
Further, the high frequency characteristics can be further stabilized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a plan view showing an embodiment of the present invention.

FIG. 3 is a side view showing the embodiment of the present invention.

FIG. 4 is a sectional view taken along line AA of FIG. 2;

FIG. 5 is a plan view showing a ground plate according to the embodiment of the present invention.

FIG. 6 is a side view showing a ground plate according to the embodiment of the present invention.

FIG. 7 is a plan view showing a housing according to the embodiment of the present invention.

FIG. 8 is a side view showing a housing according to the embodiment of the present invention.

FIG. 9 is a partial perspective view showing another example of the embodiment of the present invention.

FIG. 10 is an exploded perspective view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Directional coupler 22 Ground plate 23 Housing 25 Slope 27 Groove 32 Escape part 41 Directional coupler 42 Ground plate 44 V groove 45 Slope

Claims (5)

[Claims] 1. A high-frequency device having a main line and a sub-line provided between dielectric substrates, comprising: a ground plate provided on an outer surface side of one of the dielectric substrates and having an inclined surface; A conductor housing that is fitted from the body substrate side and that can be engaged with the inclined surface of the ground plate, and the housing is attached to the inclined surface, whereby the ground plate is A high-frequency device characterized in that a force acts in a direction in which the device is brought into close contact with a dielectric substrate. 2. The high-frequency device according to claim 1, wherein the inclined surface is formed by chamfering an outer corner of the ground plate. 3. A groove is formed on a side wall of the ground plate in a thickness direction of the ground plate so as to reach the inclined surface, and the housing is engaged with the groove, whereby the housing is The high-frequency device according to claim 2, wherein the high-frequency device is configured to be fixed to the ground plate. 4. An escape portion is cut out in a peripheral portion of the housing,
4. The high-frequency device according to claim 3, wherein the escape portion is provided so as to be located between the grooves. 5. The high-frequency device according to claim 1, wherein a V-groove is formed in a side wall of the ground plate along a length direction, and the inclined surface is formed in the V-groove.