JP2002290024A - Flux coating method and flux coating device - Google Patents

Abstract

(57) [Problem] To provide a flux coating method and a flux coating apparatus capable of maintaining a flux concentration almost constant by a method excellent in productivity. SOLUTION: The flux coating method is necessary for immersing a soldering base material 12 in a flux 20 in which a stock solution is diluted with a volatile solvent, and for returning the concentration of the flux 20 changed during the immersion process. The amount required to return the concentration, including automatically replenishing the amount of solvent, is determined based on previously performed measurements.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a flux coating method and a flux coating apparatus.

[0002]

BACKGROUND OF THE INVENTION When joining conductive members, they are often joined via solder. In that case, for example, it is known to apply a flux before applying the solder to the conductive member. The flux is made by diluting a stock solution with a solvent. The flux is preferably maintained at a constant concentration every time the conductive member is immersed in order to apply the solder in a good condition.

Conventionally, in order to keep the flux concentration constant, the flux concentration was actually measured before the conductive member was immersed, and an appropriate amount of a stock solution or solvent was replenished based on the measurement result. According to this, the flux concentration is actually measured while the flux applying step is being performed, so that the step has to be interrupted during that time, and the productivity cannot be said to be good.

An object of the present invention is to solve this problem, and an object of the present invention is to provide a flux coating method and a flux coating apparatus capable of maintaining a substantially constant flux concentration by a method excellent in productivity.

[0005]

(1) In a flux coating method according to the present invention, a soldering base material is immersed in a flux obtained by diluting an undiluted solution with a volatile solvent, and the flux changes with the immersion step. Automatically replenishing the amount of the solvent necessary to return the concentration of the flux, wherein the amount required to return the concentration is determined based on previously performed measurements.

According to the present invention, the required amount of solvent is automatically replenished based on the measurement performed in advance, so that the flux concentration can be determined based on the flux concentration without actually measuring the concentration during the process. You can go back. Therefore, a flux maintained at a predetermined concentration can be applied by a method excellent in productivity.

(2) In this flux coating method,
The replenishment amount of the solvent is almost proportional to the opening time of the valve,
In the refilling step, the opening time of the valve may be controlled.

According to this, the amount of solvent to be replenished is adjusted by controlling the opening time of the valve, so that the required amount of solvent can be easily replenished.

(3) In this flux coating method,
The flux is put into a flux tank, and the flux tank has a smaller outer circumference and a shallow bottom flux auxiliary tank inside, and the flux auxiliary tank can be shifted up and down the flux tank. Having a second liquid level at a position higher than a first liquid level of the flux tank when shifted upward and filled with the flux of the flux tank when shifted upward. In the immersion step, when the flux auxiliary tank shifts upward, the base material may be immersed in the second liquid level.

[0010] According to this, the second liquid level on which the base material is immersed is arranged at a constant height every time the base material is immersed, so that the flux is applied accurately to a predetermined portion of the base material. be able to. Also, by shifting the flux auxiliary tank up and down, the stock solution and the solvent can be uniformly mixed. Therefore, the flux can be applied to the base material without biasing its components.

(4) In this flux coating method,
The base material may be a wiring formed on a tape.

(5) In this flux coating method,
The solvent may be isopropyl alcohol.

(6) The flux coating apparatus according to the present invention comprises: a flux tank containing a flux obtained by diluting an undiluted solution with a volatile solvent; and a solvent replenishing means for replenishing the flux tank with the solvent. Wherein the solvent replenishing means automatically replenishes an amount of the solvent necessary to return the concentration of the flux which changes as the soldering base material is immersed, and the amount necessary to return the concentration. The amount is determined based on previously performed measurements.

According to the present invention, the required amount of the solvent is automatically replenished based on the measurement performed in advance, so that the flux concentration can be determined based on the flux concentration without actually measuring the concentration during the process. A device that can be returned can be provided. Therefore, a flux maintained at a predetermined concentration can be applied by a method excellent in productivity.

(7) In this flux coating device,
The solvent replenishing means may include a valve, and the opening time of the valve may be substantially proportional to the replenishing amount of the solvent.

According to this, the replenishment amount of the solvent is adjusted by controlling the opening time of the valve, so that the required amount of the solvent can be easily replenished.

(8) In this flux coating device,
The flux tank has a smaller outer circumference, and
A flux auxiliary tank having a shallow bottom is provided inside, and the flux auxiliary tank can be shifted up and down of the flux tank, and when shifted downward, is filled with the flux of the flux tank and fills the base material. When immersing, the second liquid level may be shifted to the upper part and higher than the first liquid level of the flux tank.

According to this, the second liquid level on which the base material is immersed is arranged at a constant height every time the base material is immersed, so that the flux is applied accurately to a predetermined portion of the base material. be able to. Further, by shifting the flux auxiliary tank up and down, the stock solution and the solvent can be uniformly mixed. Therefore, it is possible to provide an apparatus for applying the flux to the base material without biasing its components.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. However, the present invention
The present invention is not limited to the following embodiment.

(First Embodiment) FIGS. 1 to 3C
FIG. 1 is a diagram for explaining a flux coating method and a flux coating device according to a first embodiment to which the present invention is applied. In the present embodiment, the tape 10 on which the wiring 12 is formed is prepared, and the wiring 12 (a soldering base material) is immersed in the flux 20. Note that the soldering base material is not limited to wiring 12 shown in the present embodiment, and may be another conductive member.

The tape 10 is a flexible wiring board. The tape 10 may be a substrate for COF (ChipOn Film) or a substrate for TAB (Tape Automated Bonding) (film carrier tape). Tape 10
Often formed of polyimide resin or the like.

The tape 10 has on its surface a plurality of wires 12 routed in a predetermined shape. The wiring 12 is formed of a conductive material such as copper. At least a part of each wiring 12 may be plated. A part of each wiring 12 formed on the tape 10 becomes a soldering base material. Each wiring 12 is formed so as to reach an end of the tape 10, and an end (solder base material) serving as an electrode of each wiring 12 is immersed in the flux 20. For example, the end of the tape 10 where the end of each wiring 12 is located is immersed in the flux 20.

The tape 10 may be provided with at least one semiconductor chip (not shown). The semiconductor chip is often provided at the center of the tape 10. T
When the AB technology is applied, a device hole is provided in the tape 10, and a semiconductor chip is disposed inside the device hole.
Then, a part of the wiring 12 protrudes inside the device hole and is electrically connected to the semiconductor chip. Or,
The semiconductor chip may be mounted face down on the tape 10.

The tape 10 may be connected to an electronic component. Specifically, the wiring 12 of the tape 10 may be connected to an electrode (not shown) of the electronic component. Tape 10
Is connected to the electronic component at the end opposite to the side immersed in the flux 20.

The electronic component may be a liquid crystal panel 14. The liquid crystal panel 14 is configured such that liquid crystal is sealed between two substrates (for example, a glass substrate). And
A part of each wiring 12 of the tape 10 (for example, an end serving as an electrode) is joined to an electrode provided on one of the substrates. In the example shown in FIG. 2, one tape 10 is connected to one liquid crystal panel 14. Alternatively, a plurality of tapes 10 may be connected to an end of one side of one liquid crystal panel 14.

As shown in FIG. 2, the tape 10 is
Handle using 6. Specifically, the liquid crystal panel 14 is fixed with a jig 16. In the illustrated example, the jig 16 is sandwiched so as to cover the surface of the liquid crystal panel 14 from both sides. In that case,
The end of the tape 10 is exposed outside the jig 16. Thus, the end of the wiring 12 can be immersed in the flux 20 using the jig 16.

One or a plurality of liquid crystal panels 14 may be attached to one jig 16. As shown in FIG. 2, when a plurality of liquid crystal panels 14 are attached, the end of each tape 10 is arranged in the same direction of the jig 16.
The end of each tape 10 exposed from the jig 16 is
The tips are arranged so that their tips are at the same height. The plurality of tapes 10 attached to the jig 16 may be sequentially immersed in the flux 20 as one unit.

In the example shown in FIG.
The jigs 16 are arranged side by side in such a direction that
Fixed to. Alternatively, a plurality of liquid crystal panels 14
May be fixed side by side in a direction in which their planes overlap. The liquid crystal panels 14 may be two-dimensionally arranged and fixed to the jig 16.

The flux 20 is a solution for subjecting the wiring 12 to a surface treatment in order to provide solder in a good condition. By this surface treatment, for example, the oxide film of the wiring 12 can be removed, or the wettability of the solder can be increased, so that the solder can be well adapted to the wiring 12.

The flux 20 is formed by diluting a stock solution with a solvent. The stock solution may include a rosin resin or the like. The solvent is often volatile. The solvent may be isopropyl alcohol (IPA). The mixing ratio of the stock solution and the solvent is preferably set to a value within a predetermined standard range. That is, the concentration of the flux 20 is preferably a predetermined concentration. Note that the flux 20 may include other components such as an activator.

As shown in FIGS. 1 and 3 (A) to 3 (C), the flux coating apparatus according to the present embodiment comprises a flux tank 22 containing a flux 20, and a solvent in the flux tank 22. Solvent replenishing means for replenishing. In the illustrated example, the flux tank 22 has a flux auxiliary tank 24 inside thereof. The flux auxiliary tank 24 has a smaller outer circumference and a shallower bottom than the flux tank 22. The flux 20 is also put in the flux auxiliary tank 24.

The flux auxiliary tank 24 is provided for the flux tank 2
It is floating in the flux 20 inside 2 and can be shifted up and down. The flux auxiliary tank 24 shifts to a predetermined height above or below the flux tank 22. The auxiliary flux tank 24 may be shifted up and down by a cylinder. Note that the jig 16 is lowered from above the auxiliary flux tank 24, and the wiring 12 is immersed in the flux 20 of the auxiliary flux tank 24.

As shown in FIG. 3B, the flux auxiliary tank 24 is filled with the flux 20 of the flux tank 22 when shifting to the lower part of the flux tank 22.
That is, the flux auxiliary tank 24 is filled with the maximum allowable amount. In other words, the flux auxiliary tank 24
Is the liquid level of the flux 20 in the flux tank 22 (FIG. 3).
(See (B)), and the flux 20 is supplied. As a result, the flux 20 is applied to the wiring 12 and the liquid level 27 of the flux auxiliary tank 24 is
(See FIG. 3 (A).)
4, the flux 20 can be easily supplied.

As shown in FIG. 3 (C), when the flux auxiliary tank 24 is shifted to the upper part of the flux tank 22, the second liquid level is higher than the first liquid level 26 of the flux tank 22. 28. The flux auxiliary tank 24
After the flux 20 has been replenished in the maximum amount, it shifts to the upper part of the flux tank 22. Then, the wiring 12 is immersed when the flux auxiliary tank 24 shifts upward.
Therefore, the wiring 12 can be immersed in the second liquid surface 28 which is always set at a constant height. That is, even if the amount of the flux 20 in the flux tank 22 decreases, the wiring 12 can always be immersed in the liquid surface 28 set at a constant height. Therefore, the flux 20 can be accurately provided at a predetermined portion of the wiring 12.

The flux auxiliary tank 24 shifts up and down, so that the flux 2
0 can be mixed. That is, the flux 20
Can be made in a uniform state without unevenness in its components (stock solution or solvent). Therefore, the wiring 12
A flux in which each component is uniformly mixed can be applied.

The solvent replenishing means includes a valve 30 which can be opened and closed. In the example shown in FIG. 1, the solvent replenishing means further includes a control unit 34 for controlling the amount of replenishing the solvent, and a tank 36 containing the solvent. The control unit 34 can control the opening / closing of the valve 30 and the amount of replenishment of the solvent fed to the valve 30 per unit time.

In the present embodiment, the replenishment amount of the solvent is determined based on a measurement performed in advance before performing the flux coating step. Here, the concentration of the flux 20 changes as the wiring 12 is immersed. Specifically, the concentration of the flux 20 increases as the wiring 12 is immersed. The reason is, for example, that the solvent volatilizes more than the stock solution with the passage of time. Therefore, the concentration of the flux 20 is returned by periodically replenishing a necessary amount of the solvent.

The means for measuring the amount required to return the concentration of the flux 20 may actually measure the concentration. For example, the wiring 12 to be immersed at one time is changed X times by flux 20
After immersion, the concentration of the flux 20 may be measured. Then, calculate the replenishment amount of the solvent from the change in concentration,
The amount of the solvent to be replenished after the wiring 12 is immersed X times may be determined. Alternatively, the amount of the solvent to be replenished after the wiring 12 is immersed Y times (Y ≠ X) may be calculated and determined from the above measurement.

The valve 30 is provided with a needle 32. In that case, the solvent is discharged by the needle 32. The needle 32 has a predetermined diameter, and the discharge amount can be adjusted according to the diameter. Further, the valve 30 is configured so that the discharge amount of the solvent can be adjusted by the control unit 34. Further, in order to feed the solvent into the valve 30 in a constant amount, the inside of the solvent tank 36 is preferably pressurized at a constant pressure. The amount of the solvent to be replenished is preferably determined in consideration of the area of the portion of the wiring 12 immersed in the flux 20, the ambient temperature and the humidity, in addition to the pressure of the needle 32 and the tank 36.

The control section 34 has a storage section (not shown). Then, the storage unit may store the replenishing amount of the solvent determined based on the measurement performed in advance.
In that case, the control unit 34 automatically controls the valve 30 based on the data stored in the storage unit. Alternatively, data (for example, the concentration of the flux 20 after immersion X times) serving as a reference for calculating the replenishing amount of the solvent is stored in the storage unit, and the calculation processing unit (not shown) of the control unit 34 stores the data. The valve 30 may be automatically controlled by calculating data.

The amount of the solvent to be replenished is approximately proportional to the opening time of the valve 30. Thus, by controlling the opening time of the valve 30, the replenishment amount of the solvent can be adjusted. The opening time of the valve 30 may be automatically controlled by the control unit 36. In this case, the opening time that satisfies the replenishing amount of the solvent may be stored in the storage unit of the control unit 36, and the valve 30 may be automatically controlled based on the data.

According to the flux coating apparatus according to the present embodiment, the necessary amount of the solvent is automatically replenished based on the measurement performed in advance, so that it is not necessary to actually measure the concentration during the process. , A device that can restore the concentration of the flux 20 can be provided. Therefore, a controller for measuring the concentration during the process is not required, and a low-cost apparatus can be provided. Further, since the solvent is automatically replenished, the step of applying the flux to the wiring 12 is not interrupted. Therefore, flux can be easily applied by a method excellent in productivity.

The flux coating apparatus according to the present embodiment is configured as described above, and the manufacturing method will be described below.

As shown in FIG. 1, the wiring 12 of the tape 10
Is immersed in the flux 20. In the illustrated example, the flux 20 is applied to the wirings 12 of the plurality of tapes 10 attached to one jig 16 by one dipping.

As shown in FIG. 1, a plurality of tapes 10 to be dipped for the first time are dipped in a flux 20 of a flux auxiliary tank 24. Specifically, the jig 16 is lowered to a predetermined height, and the ends of the plurality of tapes 10 are simultaneously immersed in the flux 20. At this time, the flux auxiliary tank 24 has shifted to the upper part of the flux tank 22.
The flux auxiliary tank 24 contains the flux 20 having the maximum allowable amount. As a result, a plurality of tapes 10
Is higher than the first liquid level 26 of the flux tank 22.
It is immersed in the second liquid level 28 at a high position. The ends of the plurality of tapes 10 are immersed in the flux 20 for a predetermined time (for example, several seconds), and then the jig 16 is lifted up from the flux 20. Thus, the flux 20 is provided at the end of the wiring 12.

Thereafter, as shown by the arrow in FIG.
6 is transported above a solder tank 42 in which the molten solder 40 is placed. Then, the jig 16 is lowered, and the ends of the plurality of tapes 10 are immersed in the molten solder 40. Specifically, a portion of the tape 10 immersed in the flux 20 is immersed in the molten solder 40. Thus, the solder is provided at the end of the wiring 12. In addition, the solder tank 42
By being heated, the solid solder is kept in the liquid molten solder 40.

After the plurality of tapes 10 to be immersed for the first time are transported to the solder tank 42, a preparation is made to immerse the plurality of tapes 10 to be immersed for the second time in the flux 20. In the example shown in the present embodiment, a process of replenishing the solvent in the flux tank 22 and shifting the flux auxiliary tank 24 up and down is performed during that time.

The replenishment of the solvent into the flux tank 22 may be performed by using the above-described solvent replenishing means. Valve 30
As described above, the amount of the solvent to be discharged is determined almost in proportion to the opening time. Then, the valve 30 is opened for a time sufficient to satisfy the amount of replenishing the solvent determined by the measurement performed in advance. Valve 3
0 may be opened only once before the second immersion, or may be opened a plurality of times. When the openings are made a plurality of times, the total time is set so as to satisfy a predetermined amount of the solvent to be replenished. The needle 32 attached to the tip of the valve 30
Are disposed inside the flux tank 22 and outside the flux auxiliary tank 24.

Almost simultaneously with the step of replenishing the solvent described above,
The flux auxiliary tank 24 is shifted.

The flux auxiliary tank 24 contains a plurality of tapes 1
0 is immersed in the upper part of the flux tank 22 during immersion. Then, the flux 20 is consumed by immersing the plurality of tapes 10 for the first time. Therefore, as shown in FIG. 3A, the height of the liquid surface 27 of the flux auxiliary tank 24 after immersion is lower than before the immersion.

Therefore, as shown in FIG. 3B, the flux auxiliary tank 24 is shifted downward. Specifically, the flux auxiliary tank 24 is shifted to a position lower than the liquid level of the flux tank 22. Thus, the flux auxiliary tank 24 is replenished with the flux 20 so as to be full.

Thereafter, as shown in FIG. 3C, the flux auxiliary tank 24 is shifted upward again. The flux auxiliary tank 24 is shifted to the height set when the plurality of tapes 10 are dipped for the first time. Since the flux auxiliary tank 24 is once shifted downward and supplied with the maximum amount of the flux 20, the second liquid level 28 is set to the same position as when the plurality of tapes 10 were dipped for the first time. be able to.

According to this, the second in which the wiring 12 is immersed
The liquid level 28 is arranged at a constant height each time the wiring 12 is immersed, so that the flux 20 can be applied accurately to a predetermined portion of the wiring 12. Further, by shifting the flux auxiliary tank 24 up and down, the undiluted solution and the solvent can be uniformly mixed. Therefore,
The flux 20 can be applied to the wiring 12 without biasing its components.

Apart from the above, the step of shifting the flux auxiliary tank 24 may be performed after the step of replenishing the solvent. According to this, the flux auxiliary tank 24 is shifted after the solvent is supplied to the flux tank 22, so that the supplied solvent can be uniformly mixed with the flux 20. Alternatively, the step of shifting the flux auxiliary tank 24 may be before the step of replenishing the solvent.

Thereafter, the plurality of tapes 10 to be dipped for the second time are dipped in the second liquid level 28 of the flux auxiliary tank 24 shifted upward, and then dipped in the molten solder 24 in the same manner as in the first time. Then, solder is applied to the end of the wiring 12. The undiluted solution may be periodically replenished to the flux tank 22 each time the wiring 12 is processed a plurality of times.

In the above-described example, after one dipping of the wiring 12 is completed, the solvent is replenished and the flux auxiliary tank 2 is immersed.
Although an example in which 4 is shifted up and down has been described, the present embodiment is not limited to this. That is, the solvent may be replenished after the wiring 12 has been dipped a plurality of times. In that case,
The flux auxiliary tank 24 may be shifted up and down after one dipping of the wiring 12, or may be shifted up and down only after replenishing the solvent.

According to the flux coating method of the present embodiment, the necessary amount of the solvent is automatically replenished based on the measurement performed in advance, so that it is not necessary to actually measure the concentration during the process. , The concentration of the flux 20 can be restored. Also, since the solvent can be automatically refilled,
There is no interruption in the process of applying the flux to the wiring 12. Therefore, flux can be easily applied by a method excellent in productivity.

(Second Embodiment) FIGS. 4 and 5 are views showing a flux coating method according to a second embodiment to which the present invention is applied. In the present embodiment, the flux coating device described in the above embodiment can be used.

As shown in FIG. 5, one liquid crystal panel 54
A plurality of tapes (for example, first and second tapes 50, 5
1) may be connected. In that case, each tape (for example, the first and second tapes 50 and 51) is
May be connected to ends along different sides. For example,
The first tape 50 may be connected to an end of one side of the liquid crystal panel 54, and the second tape 51 may be connected to an end of a side next to the side. The first tape 50 has a first wiring 5
2 is formed, and the second wiring 53 is formed on the second tape 51. Note that the contents described in the above embodiment can be applied to the form of the tape, the wiring, and the liquid crystal panel.

In the example shown in FIG.
Are fixed to one jig 56 in such a manner that the surfaces thereof are arranged in a plane overlapping direction. In that case, the ends of the first and second tapes 50 and 51 are exposed outside the jig 56. The ends of the first and second tapes 50 and 51 are preferably arranged in the same direction of the jig 56. According to this, by rotating the jig 56 with the direction in which the liquid crystal panels 54 are aligned as the axial direction, the plurality of first tapes 50 are rotated.
Alternatively, any one of the plurality of second tapes 51 can be directed to the liquid surface side. Also, a plurality of first tapes 50
Or the ends of the plurality of second tapes 51 are arranged such that the leading ends thereof are at the same height. In addition, separately from the above, one liquid crystal panel 54 may be attached to one jig 56.

As shown in FIG. 5, the jig 56 is disposed above the flux auxiliary tank 24, the jig 56 is lowered to a predetermined height, and the end portions of the plurality of first tapes 50 are simultaneously fluxed. 20. At this time, the flux auxiliary tank 24 has shifted to the upper part of the flux tank 22.
After the ends of the plurality of first tapes 50 are immersed in the flux 20 for a certain period of time, the jig 56 is lifted up from the flux 20. In this manner, the flux 20 can be accurately provided at a predetermined portion of the first wiring 52.

Thereafter, as shown by the arrow in FIG.
6 is transported above a solder tank 42 in which the molten solder 40 is placed. Then, the jig 56 is lowered to immerse the ends of the plurality of first tapes 10 in the molten solder 40. After the end portions of the plurality of first tapes 50 are immersed in the molten solder 40 for a certain period of time, the jig 56 is lifted up from the molten solder 40. Thus, the first wiring 52
Is provided with solder at the end.

Thereafter, the jig 56 is moved to the auxiliary flux tank 2.
4 is transported above. Then, the jig 56 is rotated with the direction in which the plurality of liquid crystal panels 54 are aligned as an axial direction, and the plurality of second tapes 51 are directed toward the liquid surface side of the flux 20. At this time, the direction of the first tape 50 also changes, but the first wiring 52 of the first tape 50 is hardened so that the solder does not flow (or hardly flows), so that the liquid flux flows down. The problem does not arise. Therefore, at predetermined portions of the first and second wirings 52 and 53,
It is possible to accurately provide solder. After that, the ends of the plurality of second tapes 51 are dipped in the flux 20 and then dipped in the molten solder 40.

Before dipping the plurality of first tapes 50 attached to the jig 56 to be dipped for the second time into the flux 20, the flux tank 22 is replenished with a solvent, and
The flux auxiliary tank 24 is shifted so as to reciprocate up and down. These are as described in the above embodiment. In addition, the solvent is replenished to the flux tank 22,
In addition, the step of shifting the flux auxiliary tank 24 so as to reciprocate up and down is performed after the ends of the plurality of first tapes 50 attached to the first jig 56 are immersed in the flux 20, This may be performed before the end of the second tape 51 is dipped.

This embodiment includes the contents described in the above embodiments as much as possible.

According to the flux applying method according to the present embodiment, even if a plurality of tapes (for example, first and second tapes 50 and 51) are connected to one liquid crystal panel 54, each wiring Solder can be provided in a part of the (first and second wirings 52, 53) with high productivity.

[Brief description of the drawings]

FIG. 1 is a view for explaining a flux applying method and a flux applying apparatus according to a first embodiment to which the present invention is applied.

FIG. 2 is a diagram for explaining a flux applying method and a flux applying apparatus according to a first embodiment to which the present invention is applied.

FIGS. 3A to 3C are views for explaining a flux coating method and a flux coating apparatus according to a first embodiment to which the present invention is applied.

FIG. 4 is a view for explaining a flux applying method and a flux applying apparatus according to a second embodiment to which the present invention is applied.

FIG. 5 is a view for explaining a flux applying method and a flux applying apparatus according to a second embodiment to which the present invention is applied.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Tape 12 Wiring 14 Liquid crystal panel 16 Jig 20 Flux 22 Flux tank 24 Flux auxiliary tank 26 First liquid level 28 Second liquid level 30 Valve 40 Melting solder

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4D075 AB02 AB13 AB36 AB41 AB54 AB55 CA47 DA03 DA34 DB06 DB53 DC19 DC21 DC24 EA07 EA60 EC30 4F040 AA02 AA12 AB20 AC02 BA42 BA44 CC02 CC03 CC14 4F042 AA02 AA06 BA17 CA01 CA05 CB02 5319 CD22

Claims (8)

[Claims] 1. A soldering base material is immersed in a flux obtained by diluting an undiluted solution with a volatile solvent, and an amount of the solvent necessary for returning the concentration of the flux changed during the immersion step is removed. A flux application method, comprising automatically replenishing, wherein the amount required to return the concentration is determined based on previously performed measurements. 2. The flux applying method according to claim 1, wherein the replenishing amount of the solvent is substantially proportional to an opening time of the valve, and the opening time of the valve is controlled in the refilling step. 3. The flux coating method according to claim 1, wherein the flux is put into a flux tank, and the outer circumference of the flux tank is smaller than that of the flux tank.
A flux auxiliary tank having a shallow bottom is provided inside, and the flux auxiliary tank can be shifted up and down of the flux tank. When the flux auxiliary tank is shifted downward, it is filled with the flux of the flux tank and shifted upward. A second liquid level at a position higher than the first liquid level of the flux tank, and when the flux auxiliary tank shifts upward in the immersion step, the base material is moved to the second liquid level. A flux coating method that immerses the liquid surface. 4. The flux applying method according to claim 1, wherein the base material is a wiring formed on a tape. 5. The flux coating method according to claim 1, wherein the solvent is isopropyl alcohol. 6. A flux tank containing a flux obtained by diluting an undiluted solution with a volatile solvent, and a solvent replenishing means for replenishing the flux tank with the solvent, wherein the solvent replenishing means includes soldering. The amount of the solvent necessary to return the concentration of the flux that changes with the immersion of the base material is automatically replenished, and the amount required to return the concentration is based on a measurement performed in advance. Flux coating equipment determined by 7. The flux applying device according to claim 6, wherein the solvent replenishing means includes a valve, and the opening time of the valve is approximately proportional to the replenishing amount of the solvent. 8. The flux coating device according to claim 6, wherein the flux tank has a smaller outer periphery than the flux tank, and
A flux auxiliary tank having a shallow bottom is provided on the inside, and the flux auxiliary tank can be shifted up and down of the flux tank, and when shifted downward, is filled with the flux of the flux tank and fills the base material. A flux coating apparatus which shifts upward when immersed and has a second liquid level higher than a first liquid level in the flux tank.