JP2002288888A - Substrate transfer apparatus and substrate processing apparatus using the same - Google Patents

Abstract

(57) Abstract: The present invention prevents a displacement between an arm position and a substrate holder position due to a heat treatment, and enables simultaneous mounting of a plurality of substrates using two or more robot arms. It is an object to provide a substrate transfer device. A plate-shaped substrate holder having a circular opening into which a disk-shaped substrate is inserted, and a plurality of spring members holding an outer peripheral end surface of the substrate mounted around the opening;
A slider member for mounting the two substrate holders so that the holder surfaces are flush with each other, wherein two predetermined grooves are formed in the slider member so that the lower portion of the substrate holder can be inserted into the slider member. A movable member is arranged inside each groove and at the end on the center side of the slider member, and an elastic body for urging the movable member toward the end of the slider member is arranged. A side end surface of the substrate holder is pressed against and fixed to an end portion of the slider member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transport apparatus for supporting and transporting a plurality of donut-shaped disk substrates used for optical disks, magnetic disks, and the like, and a substrate processing apparatus using the same. The present invention relates to a substrate transfer device capable of stably performing simultaneous mounting of the substrates.

[0002]

2. Description of the Related Art Generally, a magnetic disk has a laminated structure in which a base film, a magnetic thin film, and a protective film are formed on both surfaces of a donut-shaped aluminum substrate having an opening at the center. To manufacture such a magnetic disk, for example, FIG.
Is used. In this apparatus, a substrate is taken out of a cassette in an auxiliary chamber by a robot, and is loaded into a substrate transfer device (carrier) 1.
01, a substrate heating chamber 102, a sputtering chamber or a film forming chamber 103 for plasma CVD (PCVD) or the like, and an unloading chamber 104 for removing the processed substrate from the carrier and returning the processed substrate to the cassette of the auxiliary chamber. Room is gate valve 1
06. The vacuum chambers 105 located at the four corners of the apparatus are direction change chambers for rotating the direction of the carrier by 90 ° and sending the carrier 1 to the next vacuum chamber. Moves on a transport path laid in each room.

FIG. 6 shows a conventional carrier, and a procedure for mounting a substrate will be described. 6A is a schematic front view showing a carrier structure, FIG. 6B is a front view of a substrate holder, and FIG.
It is an arrow view of the -A 'line. As shown in FIG. 6, the carrier 1 includes two plate-like substrate holders 20 and a slider member 10 for holding the plate-like substrate holders, and the slider member moves on a transport path to transport the substrate. As shown in FIG. 6 (c), the cross section of the slider member 10 has a U-shape with a concave portion 10b formed therein, and a slit-like groove for fitting the substrate holder is formed in the upper thick portion 10a. It is formed so as to penetrate into the concave portion 10b. The high-performance magnetic thin film is formed by
Normally, a predetermined bias is applied to the substrate, so that the fitting portion between the groove of the slider member and the substrate holder includes:
The insulating member 11 is attached, and the substrate holder is electrically insulated from the slider member.

On the other hand, as shown in FIG. 6B, the substrate holder 20 has a shape in which the lower portion is narrowed in two stages, and the intermediate portion 20b is fitted with the insulating member 11, and 20
c has a structure that protrudes into the concave portion 10b and can contact a bias terminal (not shown). Also, the substrate holder 2
0, a circular opening 20a into which the substrate 30 is inserted.
Are formed, and three L-shaped Inconel spring members 21, 22, and 23 for supporting the substrate are fixed by screws 24. A V-shaped groove is formed at the tip of the spring member, and this groove acts as a support claw to grip the outer peripheral end surface of the substrate. The opening angle of the groove is, for example, 1 so as not to disturb the film formation.
The angle is as wide as about 60 °. Of the three spring members, a spring member (movable spring member) 23 attached to the lower portion is pushed down by an opening / closing mechanism (not shown) when the substrate is mounted and detached.

[0005] The carrier 1 from which the substrate has been removed in the unloading chamber 104 is transferred to the loading chamber 101, and two unprocessed substrates are mounted thereon. The carrier 1 stops at a position where the direction of entry of the robot arm and the center of the first substrate holder coincide with each other by a positioning pin or the like. During this time, the auxiliary room 10
The robot in 1a is on standby with the arm resting on the upper part of the inner peripheral end faces of the two substrates. When the carrier is positioned, the movable spring member 23 is pushed down and the robot arm moves forward. When the substrate held by the arm reaches the position of the support claw, it stops moving forward, then rises by a predetermined height to bring the outer peripheral end surfaces of the substrate into contact with the support claws 21 and 22 of the upper two spring members. Here, the movable spring member 23 is returned, and the substrate is gripped by the three support claws. After this, the robot arm retreats backward, and again carrier 1
Is moved until the center of the second substrate holder comes to the arm position, and the second substrate is similarly mounted on the holder. The reverse operation is performed for attaching and detaching the substrate in the unloading chamber.

[0006] In this manner, the carrier on which the two substrates are mounted moves simultaneously with the carrier in each chamber and is sent to the next processing chamber. The carrier on which the unprocessed substrate is mounted first moves to the heating chamber 102, and the two substrates are heated from both sides to, for example, about 220 ° C. by a carbon heater or the like. Subsequently, the substrates are sequentially sent to the film forming chamber 103, and two underlayers, magnetic thin films, and protective films are simultaneously formed on both sides, and then the processed substrate is removed from the carrier in the unloading chamber 104. In this way, magnetic disks having a laminated structure are continuously manufactured. The number of processing chambers such as a film forming chamber is determined according to a film configuration of a magnetic disk to be manufactured and a tact time of each processing.

[0007]

With the above-described manufacturing apparatus, it has become possible to stably produce a high-performance magnetic disk. On the other hand, a manufacturing apparatus having higher productivity has been strongly desired, and for that purpose, it has been necessary to further shorten the carrier transport time and the substrate mounting time on the carrier. Accordingly, the present inventor has studied, for example, Japanese Patent Application Laid-Open No. H10-15993 as a study for shortening the carrier transport time.
By using the transfer mechanism utilizing magnetic coupling disclosed in Japanese Patent Publication No. 4 and reducing the weight by using an Al-based metal material for the carrier, high-speed movement of 600 mm / sec or more was made possible. As shown in FIG. 4, the transport mechanism includes a magnet 14 vertically magnetized on the bottom surface of the slider member 10.
A rotating roller 4 having a plurality of spiral magnets mounted on the outer peripheral surface while alternately mounting the
0 is arranged along the transport path, and is a mechanism for moving the carrier in a floating state by rotating the roller 40.

However, in order to move the carrier at a high speed, it is necessary to accelerate and decelerate rapidly, and the substrate holder 20 is displaced from the slider member 10 by an impact at the time of stopping or the like. In some cases, the attachment / detachment of the device was hindered. Therefore, the holding mechanism of the substrate holder has been improved, and as shown in FIG. 4, the outer insulating member 11a among the two insulating members arranged inside the groove of the slider member 10 is made movable, and this is set to a large spring strength. A carrier having a structure in which the slider is pressed down toward the center of the slider member by an Inconel leaf spring 12 and fixed by screws 13 is provided. With such a configuration, the substrate holder is not displaced, and high-speed substrate transfer is enabled, so that the transfer time can be reduced.

On the other hand, in order to shorten the process of attaching and detaching the substrate to and from the carrier, as shown in FIG. The method of mounting on the substrate holder was studied. However, when a magnetic disk was continuously produced by mounting a substrate on the carrier shown in FIG. 4 using a robot having a two-armed arm, the support claws were scratched on the outer peripheral surface of the substrate, resulting in a defective product. Alternatively, there has been a situation in which a manufacturing apparatus must be stopped when an accident occurs in which a substrate is dropped.

Various investigations have been conducted to clarify the cause,
It rarely happens with conventional robot arms, especially
Since this phenomenon is more likely to occur when a crotch arm is used, the relationship between the positioning accuracy of the robot arm position and the substrate holder center position and the above-mentioned phenomenon was examined. It has been found that even if there is a slight deviation of about 0.5 mm, problems such as scratches and dropping of the substrate occur. This is because if there is a shift, a strong force will be applied to one of the upper support claws when raising the arm to a predetermined height, and it will be damaged, and the contact point between the claw and the outside of the board will not slip, When the movable claw 23 is raised, the substrate is not evenly supported by the three claws. In an extreme case, it is considered that the substrate is supported at two points and the substrate drops.

Therefore, while investigating various causes of the deviation between the arm center axis distance and the substrate center distance, the temperature measurement during continuous operation was performed by focusing on the thermal expansion of the slider member and the substrate holder accompanying the substrate heating. As a result, for example, the substrate was 220
4, the point A of the substrate holder is 280 ° C., the insulating member (B) is 150 ° C., the center of the carrier (C) is 100 ° C., and the hollow (D) is about 93 ° C. in FIG. I understood. Then, when the distance from the carrier center to the substrate holder center was calculated from the coefficient of thermal expansion of each member, the distance between the substrate holder center and the carrier center was 3.5 in the case of a 3.5-inch substrate, compared with that at room temperature. About 0.4m
m. That is, it was found that a deviation of about 0.4 mm could occur between the robot arm and the center of the substrate holder due to the heat treatment, and it was found that thermal expansion caused damage and dropping of the substrate.

The present invention has been completed by further study based on such findings. In order to prevent the substrate from being damaged or dropped due to the thermal expansion of the carrier, it is conceivable to set the distance between the robot arms to be wider by taking into account the thermal expansion. It is necessary to perform idle operation without mounting a substrate until the process is completed, and there is a problem in that a complicated process of requiring fine adjustment of the arm every time process conditions are changed is required.

In view of such a situation, the present invention suppresses the displacement between the arm position and the substrate holder position due to the heat treatment,
It is an object of the present invention to provide a substrate transfer device capable of simultaneously mounting a plurality of substrates by using two or more robot arms. Still another object of the present invention is to provide a substrate processing apparatus capable of stably performing high-throughput production.

[0014]

According to the present invention, there is provided a substrate transfer apparatus having a circular opening into which a disk-shaped substrate is inserted, and a plurality of spring members for gripping an outer peripheral end surface of the substrate are mounted around the opening. And a slider member for attaching the two substrate holders so that the holder surfaces are flush with each other, wherein a lower portion of the substrate holder can be inserted into the slider member. 2 grooves
The slider is formed at predetermined intervals, and a movable member is disposed at the center end of the slider member inside each groove and urges the movable member toward the end of the slider member. An elastic body is arranged, and a side end surface of the substrate holder is pressed against an end of the slider member to be fixed.

As described above, since the movable member and the elastic member are arranged so as to press the two substrate holders outward from the center side of the slider member, the slider member and the substrate holder are expanded by being heated by the heat treatment. Also, the direction of extension of the slider member due to thermal expansion is opposite to the direction of extension of the substrate holder due to thermal expansion, so that the center-to-center distance between the two substrate holders can be kept substantially the same as at room temperature. That is, since the deviation from the center distance between the arm axes of the robot at room temperature can be suppressed to a negligible level, a plurality of substrates can be simultaneously mounted. As a result,
The problem that the substrate is not damaged and the yield is improved, and the problem that the productivity is reduced due to the stoppage of the apparatus and the restoration of the apparatus due to the substrate falling accident can be solved. Therefore, stable production can be ensured, and a high-throughput manufacturing apparatus can be realized. Further, since the substrate can be reliably mounted on the substrate holder regardless of the heat treatment temperature, it is possible to cope with various types of disk production.

In the substrate transfer apparatus of the present invention, the slider member may hold three or more substrate holders. For example, when holding three substrate holders, the slider member may be provided outside the two grooves of the slider member. Third groove may be formed, and a third movable member and a third elastic body may be arranged in the third groove on the center side of the slider member. Also, although the mounting operation of the substrate holder becomes complicated, a third groove is formed between the two grooves in the slider member, and a movable member and an elastic body are provided on both inner ends of the third groove. It may be arranged.

The spring member is formed by bending a plate-shaped spring member into an L-shape, and forming a V-shaped groove at the bent end portion. The mounting direction of the L-shaped spring member is changed to an L-shape. Are preferably rotationally symmetric. By attaching the spring member in this manner, a force is applied in the direction in which the substrate rotates, so that the structural difference between the substrate center and the substrate holder center can be absorbed, and when thermal expansion occurs, The influence of the increased displacement can be eliminated.

In the substrate processing apparatus of the present invention, a plurality of unprocessed substrates are mounted on the substrate transfer apparatus of the present invention, and are moved to a processing chamber to perform predetermined processing. A substrate processing apparatus for repeatedly performing a process of mounting an unprocessed substrate, wherein the mounting of the substrate to the substrate transfer device is performed simultaneously on a plurality of substrates by a robot having a plurality of arms. The distance between the axes may be made equal to the distance between the centers of the substrate holders.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an example of a configuration of the substrate transfer device (carrier) of the present invention. 1A and 1B are a schematic front view and a side view showing the structure of a carrier. As shown in FIG. 1, the carrier 1 has two substrate holders 2.
0, a slider member 1 that holds it and moves on the transport path
0. Usually, lightweight Al (A5052) or the like is used for the slider member and the substrate holder.

As shown in FIG. 6B, the substrate holder 20 has a circular opening 20a at the center where the substrate is inserted, and the width thereof is reduced in two steps at the lower side. I have. L-shaped spring members 21, 22, 23 made of Inconel are attached at three places around the opening 20a, and the spring member (movable spring member) 23 is configured to be pushed downward. A V-shaped groove for gripping the outer peripheral end surface of the substrate is formed at the tip of the spring member, and protrudes into the opening 20a. Here, the mounting direction of the L-shaped spring member is different from that in FIG. The support claws of the two spring members 21 and 22 are arranged at positions symmetrical with respect to a vertical line passing through the center of the opening of the substrate holder, and the support claws of the movable spring member 23 are arranged on this vertical line. By arranging in this way, when the substrate is mounted on the carrier, even if the center of the opening of the substrate holder and the center of the mounted substrate are slightly shifted for some reason, a force is applied in the direction in which the substrate rotates. ,
The substrate can be more evenly held by the three support claws,
Further, it is possible to eliminate a shift that is increased when thermal expansion occurs. The intermediate portion 20b of the substrate holder has its side end face held by an insulating member 11 such as alumina mounted inside the slider member. Further, the tip portion 20c is a contact portion with a contact for applying a substrate bias.

As shown in FIG. 1 (b), the slider member 10 has a U-shaped cross section in which a recess 10b is formed in the center, and the upper thick portion 10a has a substrate holder. A slit-like groove for holding the intermediate portion 20b is formed so as to penetrate the concave portion 10b. A pair of insulating members 11 are arranged at both ends in the slit-shaped groove, an insulating member 11a at the end of the slider member is fixed in the groove, and an insulating member 11b at the center of the slider member is movable left and right. Are located. Further, a leaf spring 12 is attached so as to bias the movable insulating member 11b toward the end of the slider member. Thus, by inserting the substrate holder 20 into the groove of the slider member and tightening the screw 13, the substrate holder is pressed to the outside of the carrier and is firmly fixed.

As described above, a large number of magnets 14 are attached to the bottom of the slider member with the magnetization directions alternately reversed, and the slider member is connected to the rotating magnet 40 arranged along the transport path. Move by the interaction of. Note that a guide roller 41 for preventing the slider from coming off from the transport path and a roller 42 for preventing the slider from falling down are attached to the transport path at a predetermined interval.

Next, a procedure for mounting a substrate on the carrier 1 will be described. FIG. 5 shows that the processed substrate is in the unload chamber 10.
4 shows a state where the empty carrier 1 has been removed and transferred to the load chamber 101. The carrier is in a high temperature state by thermal treatment in a heating chamber or a film formation chamber. When an empty carrier is conveyed, a cylinder driving positioning pin attached to the conveyance path is fitted into a groove formed in the center of the slider member, and the center of the carrier coincides with the center of the two arms 44 of the robot. Stop at the position.

At this point, the movable spring member 23 is pushed down by an opening / closing mechanism (not shown), and at the same time, the substrate is held.
The two arms 44 are advanced, the substrate is inserted into the substrate holder and then raised, and the outer peripheral end surface of the substrate is brought into contact with the support claws of the spring members 21 and 22 and stopped. The distance L between the center axes of the two arms of the robot is set so as to be the same as the distance between the center of the opening of the holder at room temperature. Is hardly changed.
The two spring member support claws 21 and 22 are evenly contacted. Subsequently, when the movable spring member 23 is returned, the two substrates are securely held at the center of the opening of the holder by the uniform force of the three spring member supporting claws 21, 22, 23, respectively, so that the outer periphery of the substrate The surface is not scratched and the substrate does not fall.

As described above, by using the carrier having the structure shown in FIG. 1, the center distance between the holders hardly changes even though the carrier is heated to a high temperature. With two holder openings 2
The board can be inserted into the center of Oa, and as a result, a reliable mounting operation can be performed. The reason will be described below, including calculation. When the carrier is heated, each component expands according to its temperature, and the distance between any two points changes, but as shown in FIG. 1, it is arranged inside the groove of the slider member. Since the leaf spring is arranged on the center side of the slider member and the substrate holder is biased toward the end side of the slider member, the thermal expansion of each member offsets the change in the distance between the opening centers of the substrate holder. In effect, a substantial change in the distance between the substrate holder centers is negligible.

The results of calculating the change in the distance L between the center of the substrate holder and the center of the carrier due to heating for the carrier shown in FIG. 4 and the carrier of the present embodiment are shown below. FIGS. 2A and 2B correspond to FIGS. 1 and 4 respectively.
FIG. 2 is a view taken along the line AA in FIG. In FIG. 2, L ₁
The distance to the end from the center of the substrate holder intermediate portion 20b at room temperature, L ₂ represents the distance from the center of the slider member to the fixed insulating member end, L ₃ is an insulating member length.

The temperature of each part of the carrier by the heat treatment is as follows. The temperature TA of the substrate holder intermediate portion 20b is 280 ° C., the insulating member temperature TB is 150 ° C., the central temperature TC of the slider member thick portion 10a is 100 ° C. The temperature TD of the slider member concave portion 10b is 93 ° C. Here, Al and The coefficient of thermal expansion of the alumina was 2.
3 × 10 ⁻⁵ (/ ° C.) and 5 × 10 ⁻⁶ (/ ° C.)
The distance L between the center of the substrate holder and the center of the carrier in a state where the carrier is heated to the above temperature is calculated as follows.

In the case of the conventional carrier shown in FIG. 2B, the expansion amount of each member is dL ₁ = L ₁ × 2.3 × 10 ⁻⁵ x (TA−20) = 0.
26 mm dL ₂ = L ₂ x2.3 × 10 ⁻⁵ x (TC−20) =
^{_{0.12mm dL 3 = L 3 x5x10 -6}} x (TB-20) = 8.4
It becomes 5 × 10 ⁻³ mm. Here, since the fixed insulating member is disposed on the center side of the slider member, the expansion of the slider member, the substrate holder, and the insulating member all contribute to increasing the distance L between the slider member center and the substrate holder center, The increase amount dL is dL = dL ₁ + dL ₂ + dL ₃ = 0.39 mm.

On the other hand, in the case of the carrier of this embodiment shown in FIG. 2A, the expansion amount of each member is dL ₁ = L ₁ × 2.3 × 10 ⁻⁵ x (TA−20) = 0.
^{_{26mm dL 2 = L 2 x2.3x10 -5}} x (TD-20) =
^{_{0.33mm dL 3 = L 3 x5x10 -6}} x (TB-20) = 8.4
5 × 10 ⁻³ mm. Since the fixed insulating member is disposed on the end side of the slider member and the movable insulating member is disposed on the center side, the center of the substrate holder is located at the center of the slider member due to thermal expansion of the substrate holder and the insulating member. Will move. That is, while the thermal expansion of the slider member acts to increase L, the thermal expansion of the substrate holder and the insulating member acts to decrease L. Therefore, the increase dL of the distance L between the center of the slider member and the center of the substrate holder is dL = dL.
₂₋ (dL ₁ + dL ₃ ) = 0.06 mm, indicating that there is almost no change compared to the case of the conventional carrier (0.39 mm).

As described above, unlike the conventional carrier, the carrier of the present embodiment keeps the distance between the centers of the substrate holders substantially constant even when heated, thereby avoiding damage to the substrate and accidents such as dropping. be able to. That is, it is possible to design at the substrate transfer position at room temperature, and it is not necessary to design for each process.

In the above embodiment, the carrier holding two substrate holders has been described. However, the carrier holding three or more substrate holders can be extended.
That is, for example, when an even number of substrate holders are mounted, the movable insulating member and the leaf spring may be arranged so as to be symmetrical about the carrier center with the movable insulating member and the leaf spring being on the center side. In the case of an odd number, the movable insulating member and the leaf spring may be arranged on the carrier center side outside the even number of substrate holders.
Further, a configuration may be adopted in which substrate holders other than the substrate holders at both ends are fixed from both sides by two sets of movable insulating members and leaf springs. Further, a plurality of openings and spring members may be provided in the substrate holder itself so that one substrate holder holds a plurality of substrates. The substrate holder of the present invention is shown in FIG.
The shape is not limited to the shape in which the lower part is narrow as shown in (1), but may be any shape, for example, a simple square shape.

In the present invention, the end face of the substrate is fitted to the insulating member. However, when it is not necessary to apply a substrate bias, it is not necessary to use an insulating member. Good. Also, instead of a leaf spring,
An elastic body such as rubber can be used depending on the coil spring and processing conditions. Further, it goes without saying that the substrate holder and the slider member may be made of a material other than Al. Further, as described above, the present invention can be suitably applied to a case where a plurality of substrates are mounted at the same time. Is performed at the center position of the carrier, the deviation between the arm position and the center position of the opening of the substrate holder is suppressed even if the carrier is heated, and more stable mounting can be performed as compared with the conventional carrier.

[0033]

As is apparent from the above description, according to the present invention, it is possible to eliminate the influence of thermal expansion during substrate heating with almost only conventional components. Stable simultaneous mounting can be performed. That is, it is possible to realize a high-productivity and high-reliability substrate transfer device that can cope with various processes. As a result, a high-throughput disk production apparatus can be realized.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of a substrate transfer device according to the present invention.

FIG. 2 is a schematic diagram showing a specific example of the shape of each part of the substrate transfer device.

FIG. 3 is a schematic plan view of an in-line type magnetic disk manufacturing apparatus to which the substrate transfer device of the present invention is applied.

FIG. 4 is a schematic view showing a substrate transfer device in which the conventional structure of FIG. 6 is improved.

FIG. 5 is a schematic plan view showing a load chamber for simultaneously mounting a plurality of substrates.

FIG. 6 is a schematic view showing a conventional substrate transfer device.

[Explanation of symbols]

 Reference Signs List 1 substrate transfer device (carrier), 10 slider member, 11 insulating member, 12 elastic body (leaf spring), 13 screw, 14 magnet, 20 substrate holder, 21, 22, 23 spring member (supporting claw), 40 rotating magnet, 101 load chamber, 101a, 104a auxiliary chamber, 102 heating chamber, 103 film formation chamber, 104 unload chamber, 105 carrier redirection chamber, 106 gate valve.

Of the front page Continued (51) Int.Cl. ⁷ identification mark FI theme Court Bu (Reference) C23C 16/44 C23C 16/44 F 16/458 16/458 G11B 5/85 G11B 5/85 Z 5/851 5/851 // H01L 21/68 H01L 21/68 A (72) Inventor Seiki Miyashita 5-8-1, Yotsuya, Fuchu-shi, Tokyo Anelva Corporation F-term (reference) 4K029 AA02 AA24 BB02 BC06 BD11 CA05 JA01 JA06 KA02 4K030 CA02 CA17 GA02 GA12 HA01 KA45 LA20 5D112 AA24 FA04 FA10 FB25 5D121 AA02 JJ01 JJ03 JJ04 JJ09 5F031 CA01 FA02 FA09 GA10 GA13 GA14 GA15 GA50 MA28

Claims (4)

[Claims] 1. A plate-shaped substrate holder having a circular opening into which a disk-shaped substrate is inserted, and a plurality of spring members for holding an outer peripheral end surface of the substrate mounted around the opening;
A slider member for mounting the two substrate holders so that the holder surfaces are flush with each other, wherein the slider member is provided with two grooves into which the lower part of the substrate holder can be inserted at a predetermined interval. A movable member is arranged at the center end of the slider member inside each groove and an elastic body for urging the movable member toward the end of the slider member is arranged. A side end surface of the substrate holder is pressed against and fixed to an end portion of the slider member. 2. A third groove is formed outside the two grooves of the slider member, and a third movable member and a third elastic body are provided in the third groove on the center side of the slider member. The substrate transfer device according to claim 1, wherein the substrate transfer device is arranged. 3. The spring member according to claim 1, wherein the plate-shaped spring member is bent into an L-shape, and a V-shaped groove is formed at the bent end portion. The substrate transfer device according to claim 1, wherein the substrate transfer device is mounted in a rotationally symmetric direction. 4. A plurality of unprocessed substrates are mounted on the substrate transfer device according to any one of claims 1 to 3, which are moved to a processing chamber to perform predetermined processing, and the processed substrates are processed. A substrate processing apparatus that removes and repeats a process of mounting an unprocessed substrate again, wherein the mounting of the substrate to the substrate transfer device is performed simultaneously on a plurality of substrates by a robot having a plurality of arms, and at room temperature. The distance between the center axes of the two arms is made equal to the distance between the centers of the substrate holders.