JP2002288614A - IC module and manufacturing method thereof - Google Patents

Abstract

[PROBLEMS] To provide an IC module having a simple structure, high reliability, and a simple manufacturing process, and a method for manufacturing the same. SOLUTION: An IC module 10 is disposed on an insulating substrate 11 and a lower surface of the substrate 11 and has a connection terminal portion 13.
a and / or non-contact IC chip 13 having a
And an external contact terminal 12b and a non-contact communication antenna 12 arranged on the upper surface of the substrate 11 and having a connection terminal portion 12a.
c, and a buried conductive member 14 which is embedded in the substrate 11 and has conductivity to make the connection terminal portion 12a and the connection terminal portion 13a conductive.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card, an SI
The present invention relates to a contact / non-contact type IC module used for M, IC tags and the like, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A contact / non-contact type IC card has a contact type function of transmitting and receiving data by contacting an external terminal of the card with a terminal of an external processing device, and an antenna for transmitting and receiving data by electromagnetic waves. I for coil and data processing
A card that has a built-in C circuit, performs reading and writing with an external processing device by a so-called wireless system, and is supplied with driving power of an IC circuit by electromagnetic induction and has a non-contact system function that does not include a battery. It is what we have.

[0003] Regarding simplification of the structure of an IC module, Japanese Patent Laid-Open No. 11-184997 discloses a non-contact IC.
A chip, an antenna coil formed on the IC chip,
Disclosed is a non-contact IC module including a connection portion that connects a terminal of an IC chip and a terminal of an antenna coil, and a sealing resin that seals the IC chip, the antenna coil, and the connection portion.

[0004]

However, the above-mentioned conventional IC module has succeeded in reducing the number of parts and simplifying the manufacturing process. Is required. For example, in the above-mentioned IC module, wire bonding is used as a connection portion, and therefore, a structure and a step of sealing with a sealing resin are required, and reliability and simplification are insufficient.

An object of the present invention is to provide an IC module having a simple structure, high reliability, and a simple manufacturing process, and a method for manufacturing the same.

[0006]

According to a first aspect of the present invention, there is provided a semiconductor device comprising: a base layer having an insulating property; and a first connection terminal portion disposed on one surface of the base layer. A contact and / or non-contact IC chip, and communication means including an external contact terminal and / or a non-contact communication antenna disposed on the other surface of the base layer and having a second connection terminal portion. An IC module comprising: a first connection terminal portion embedded in the base layer;
And a conductive embedded conductive member for electrically connecting to the connection terminal portion.

According to a second aspect of the present invention, there is provided an IC according to the first aspect.
A method for manufacturing an IC module for manufacturing a module, comprising: a step of forming an embedded conductive member in a first connection terminal portion of the IC chip; and forming a conductive layer on one surface of the base layer. A conductive layer forming step, and heating and pressurizing the base layer to embed the embedded conductive member in the base layer,
And a conducting step of conducting between the connection terminal portion and the second connection terminal portion.

According to a third aspect of the present invention, there is provided an IC according to the first aspect.
A method of manufacturing an IC module for manufacturing a module, comprising: a step of forming an embedded conductive member in a conductive layer; and forming the base layer on a surface of the IC chip where the first connection terminal portion is located. By forming a base layer and heating and pressurizing the base layer,
A step of burying the buried conducting member in the base layer to conduct the first connection terminal portion and the second connection terminal portion.

The invention of claim 4 is the invention of claim 2 or claim 3.
3. The method for manufacturing an IC module according to claim 1, further comprising a communication unit manufacturing step of manufacturing the communication unit by processing the conductive layer.

[0010]

Embodiments of the present invention will be described below in more detail with reference to the drawings. (First Embodiment) FIGS. 1 and 2 are views showing a first embodiment of an IC module and a method of manufacturing the same according to the present invention.
FIG. 2 shows an IC module 10 according to the first embodiment.
As shown in (f) and (g), an insulative substrate (base layer) 11 and a contact and / or non-contact IC chip 1 disposed on the lower surface of the substrate 11 and having a connection terminal portion 13a.
3, an external contact terminal 12b disposed on the upper surface of the substrate 11 and having a connection terminal portion 12a, and the non-contact communication antenna 1
2c and a buried conductive member 14 that is embedded in the substrate 11 and has conductivity to connect the connection terminal portion 12a and the connection terminal portion 13a.

The method for manufacturing an IC module according to the first embodiment includes a conductive layer forming step # 101, a buried conductive member forming step # 102, a conductive step # 103, a communication means manufacturing step # 104, and the like. ing. In each figure, only one IC module is shown.
In the case of actual production, a plurality of components are provided and a plurality of components are produced simultaneously.

First, as shown in FIG.
A conductive layer 12 of a copper layer or the like having a thickness of about 18 or 36 μm is formed on a substrate (base layer) 11 made of a prepreg such as an epoxy resin having a thickness of μm (conductive layer forming step # 10).
1).

The prepreg is a molding material of a reinforced plastic in which a reinforcing material such as glass fiber is impregnated with a thermosetting resin. Since the prepreg has a fiber, the embedded conductive member 14 is easily pushed away and a hole is easily formed. Further, the prepreg has a property of being softened once when the temperature is increased and of being thermally cured. Therefore, it is easy to pierce while the temperature is being increased, and thereafter, it is cured by heat and can be securely fixed. When the embedded conductive member 14 is formed by coating with a polyimide resin, an epoxy resin, or the like, by controlling the drying process, similar to the properties of the prepreg,
After the embedded conductive member 14 has penetrated, it may be cured.

On the other hand, as shown in FIG. 1B, a contact / non-contact IC chip 13 having a connection terminal portion 13a is prepared, and as shown in FIG. The embedded conductive member 14 is formed in the terminal portion 13a to have a thickness (here, 50 μm or more) equal to or larger than the thickness of the substrate 11 by printing or plating (embedded conductive member forming step # 102). Here, the embedded conductive member 14 is printed with a conductor such as silver paste or the like.
As shown in (a), the tip has a hemispherical cylindrical shape. Further, as shown in FIG. 5B, the embedded conductive member 14B is a protruding member having a sharp end such as a parabolic cross section at its tip.

Next, as shown in FIG.
By aligning the IC chip 13 with the IC chip 13 and heating and pressing the substrate 11 as shown in FIG. 11 and embedded in the connection terminal portion 13a.
And the connection terminal portion 12a of the conductive layer 12 is made conductive (conductive step # 103).

As described above, by applying heat and pressure to the substrate 11, the protrusion-shaped embedded conductive member 14 sinks into the substrate 11 through the resin layer of the substrate 11. Then, when the substrate 11 and the IC chip 13 are bonded together, the embedded conductive member 14 contacts the connection terminal portion 12 a of the conductive layer 12 with the prepreg layer of the substrate 11 being avoided. The buried conductive member 14 and the conductive layer 12 are both metal, but if heat is applied directly, the resin layer of the substrate 11 solidifies around the contact portion, so that good conduction can be obtained.

It should be noted that the embedded conductive member 14 is 50 to 50 in the present embodiment in order to secure the reliability of conduction.
It is desirable that the diameter be about 100 μm. Heating may be performed on the substrate 11 side or the IC chip 13 side, but in the present embodiment, heating and pressing plates are arranged above and below to control the respective temperatures and pressures.

Finally, as shown in FIG. 2F, the conductive layer 12 is processed to form the external contact terminals 12b and the non-contact communication antenna 12c (communication means manufacturing step # 10).
4). That is, the external contact terminals 12
The conductive pattern b and the conductive pattern of the non-contact communication antenna 12c are formed by etching as follows, although not shown.

First, a photosensitive dry film resist is laminated on the conductive layer 12, exposed, and developed to form an etching pattern. Then, etching is performed using this etching pattern as a mask. Then, the photosensitive dry film resist is removed, and the external contact terminals 12b are removed.
And a conductive pattern of the non-contact communication antenna 12c.

As described above, in the IC module according to the first embodiment, since the embedded conductive member 14 is physically embedded in the substrate 11, it is possible to reliably establish electrical conduction with a strong structure. And the IC chip 13 does not peel off. Furthermore, since the embedded conductive member 14 is not made by plating, there is no possibility of short-circuit due to an inadvertent hole or the like.

As shown in FIG. 5, the embedded conductive member 14 has a pointed tip, and is crushed when it reaches the conductive layer 12. Embedded conductive member 14
Is crushed and entangled,
Conductivity is ensured. As a result, the conductive layer 12
As shown in FIG. 5 (c), the hit portion (contact grudge) 12
d is excited. Since the contact grudge 12d can be visually observed from the outside, the conduction can be confirmed without conducting electricity.

On the other hand, according to the manufacturing method of the first embodiment,
Since only the physical connection by the embedded conductive member 14 is required, the wiring structure can be formed by a simple process.

(Second Embodiment) FIGS. 3 and 4 are views showing a second embodiment of an IC module and a method of manufacturing the same according to the present invention. In the embodiments described below, parts performing the same functions as in the above-described first embodiment are denoted by the same reference numerals, and overlapping drawings and descriptions will be omitted as appropriate.

In the first embodiment, on the IC chip 13 side,
Although the buried conductive member 14 is formed, in the second embodiment, as shown in FIG. 3A, a conductive layer 12 such as a copper layer is prepared, and as shown in FIG. Then, the projecting conductive member 14 is formed by printing or plating (embedded conductive member forming step # 201).

Next, as shown in FIG. 3C, an insulating substrate (base layer) 11 is placed on the IC chip 13.
It is formed by laminating a prepreg, applying an epoxy resin or a polyimide resin (base layer forming step # 202).

Then, as shown in FIG.
1 by heating and pressurizing, the embedded conductive member 14 provided in the connection terminal portion 12a of the conductive layer 12 is
1 to make the connection terminal 12a and the connection terminal 13a of the IC chip 13 conductive (conductive step # 20).
3).

Finally, the surface of the conductive layer 12 is etched to form the external contact terminals 12b,
c is prepared (communication means preparing step # 204).

In each of the above embodiments, FIG.
(G), As shown in FIG.
Is the area B inside the antenna of the non-contact communication antenna 12c.
In contrast, the antenna effective area C that does not interfere with the external contact terminal 12b is secured by being shifted to the left. Therefore, the antenna effective area C with less interference can be secured, and the connection terminal of the non-contact communication antenna 12c can be easily connected to the connection terminal of the IC chip.

In the non-contact IC module, in order to stably secure a large communication distance, the larger the area of the non-contact antenna (hereinafter, coil antenna) 12c, the better. However, if the coil antenna 12c is large, the manufacturing cost, including the material cost, increases in proportion to the area, so that the minimum size required for communication is sufficient. As a result of studying coil area and communication characteristics, assuming ISO14443 Type A and Type B methods,
Although the minimum required coil size differs depending on the shape and pitch of the coil, it was found that the minimum required area was approximately 10 mm ² or more, and 400 mm ² was sufficient.

Further, the size of the card or module,
When the size is determined by the standard, especially when the size of a small module is limited to about 2 cm square or less due to the restriction of equipment, the coil antenna 1 is naturally used.
The size of 2c is required to be used for the entire surface of the IC module 10, and the coil antenna 12c is required to be formed on the entire outer periphery of the IC module 10.
From this restriction, as a design rule of the coil antenna 12c, the outer circumference is as large as possible, and it is better to arrange the coil antenna 12c with a narrow pitch. The pitch is 100 μm or less, most preferably 50 μm or less. Also, if the pitch is 2
When the thickness is 0 μm or less, it is difficult to stably manufacture the semiconductor device. In addition, when face-down type flip-chip mounting is performed, the thickness of the IC module 10 can be reduced, which is desirable. In the present embodiment, it is necessary to provide the coil wiring between the connection terminal portions of the external contact terminals 12b so that the pitch is also 100 μm or less, most preferably 5 μm or less.
When the thickness is 0 μm or less, the degree of freedom in design can be ensured, and the area inside the coil antenna 12c can be increased.

The thickness of the coil antenna 12c is desirably 5 μm or more, and most desirably 10 μm, since the resistance increases as the design rule decreases.
m or more. If the thickness of the coil antenna 12c is increased, it is difficult to stably manufacture the coil antenna 12c.
m or less. In order to satisfy these design rules, the coil antenna 12c is manufactured by either the etching method or the semi-additive method by plating. Limited to

In the contact / non-contact IC module 10, the external contact terminal 12b and the non-contact antenna 12c must be formed in the same module.
In general, a metal part placed inside the non-contact antenna 12c has an electromagnetic wave shielding effect, and hinders communication.
Therefore, in the design of the IC card, it is necessary to displace the center of the coil antenna 12c from the terminal 12b in order to avoid the electromagnetic wave shielding effect of the metal external contact terminal 12b. In this case, the antenna effective area C is 0.5 A to 0.
The new fact that 9A is desirable has been obtained.

(Modifications) Various modifications and changes are possible without being limited to the above-described embodiment, and these are also within the equivalent scope of the present invention. (1) The IC module of the present embodiment may be a SIM used for a mobile phone, a normal IC card, an IC tag whose base material shape is not specified, or the like. (2) If the required communication distance cannot be secured with a small IC module alone, a booster coil can be separately manufactured outside and a resonance circuit can be formed in close proximity to the IC module to secure the communication distance. . This booster coil may be installed and used in a case for accommodating an IC module, for example, a regular case.

(3) In the system of the present invention, the contact terminal and the non-contact antenna are provided. In some cases, only the contact terminal and the connection terminal portion of the non-contact antenna are provided in the IC module. Alternatively, the antenna coil may be separately manufactured. This antenna coil is installed in a case for accommodating an IC module,
It may work by inserting a module.

[0035]

As described above in detail, according to the present invention, since the buried conductive member is physically buried in the base layer, the buried conductive member has a strong structure, and secure conduction can be obtained. Further, since only the physical connection by the embedded conductive member is required, the wiring structure can be formed by a simple process.

[Brief description of the drawings]

FIG. 1 is a diagram (part 1) illustrating a first embodiment of an IC module and a method for manufacturing the same according to the present invention.

FIG. 2 is a diagram (part 2) illustrating the first embodiment of the IC module and the method for manufacturing the same according to the present invention;

FIG. 3 is a diagram (part 1) illustrating a second embodiment of the IC module and the method for manufacturing the same according to the present invention.

FIG. 4 is a diagram (part 2) illustrating a second embodiment of the IC module and the method of manufacturing the same according to the present invention.

FIG. 5 is a view showing an embedded conductive member of the IC module according to the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 IC module 11 Substrate (base layer) 12 Conductive layer 12a Connection terminal part 12b External contact terminal 12c Non-contact communication antenna 13 IC chip 13a Connection terminal part 14 Embedded conductive member

Claims (4)

[Claims] An insulative base layer; a contact and / or non-contact IC chip disposed on one surface of the base layer and having a first connection terminal portion; and the other of the base layer An external contact terminal having a second connection terminal portion, and / or a communication unit including a non-contact communication antenna, wherein the first connection is embedded in the base layer. An IC module, comprising: an embedded conductive member having conductivity for electrically connecting a terminal portion and the second connection terminal portion. 2. A method for manufacturing an IC module according to claim 1, wherein the embedded conductive member is formed in a first connection terminal of the IC chip. A conductive layer forming step of forming a conductive layer on one surface of the base layer; and heating and pressurizing the base layer to embed the embedded conductive member in the base layer, thereby forming the first connection terminal portion and A method for producing an IC module, comprising: a conduction step of conducting the second connection terminal section. 3. A method of manufacturing an IC module according to claim 1, wherein the step of forming the embedded conductive member in a conductive layer includes the step of forming the embedded conductive member; A base layer forming step of forming the base layer on a surface having a connection terminal; heating and pressurizing the base layer to embed the embedded conductive member in the base layer; And a conduction step of conducting between the second connection terminal portion and the second connection terminal portion. 4. The method for manufacturing an IC module according to claim 2, further comprising a communication unit manufacturing step of manufacturing the communication unit by processing the conductive layer. Production method.