JP2002280728A - Wiring board having solder balls and method of manufacturing the same - Google Patents
Wiring board having solder balls and method of manufacturing the sameInfo
- Publication number
- JP2002280728A JP2002280728A JP2001082976A JP2001082976A JP2002280728A JP 2002280728 A JP2002280728 A JP 2002280728A JP 2001082976 A JP2001082976 A JP 2001082976A JP 2001082976 A JP2001082976 A JP 2001082976A JP 2002280728 A JP2002280728 A JP 2002280728A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring board
- solder ball
- plating film
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】 （修正有）
【課題】熱処理後の接続信頼性に優れた、はんだボール
を有する配線板とその製造方法を提供すること。
【解決手段】電解ニッケル合金めっき皮膜、電解金めっ
き皮膜が、その順に形成された導体の端子上に、熱処理
によってせん断強度が１０％以上増加しない組成のはん
だボールを有する配線板と、はんだボールを搭載するは
んだボール接続用端子であって、電解ニッケル合金めっ
き皮膜、電解金めっき皮膜が、その順に形成された導体
の端子を有する基板に、熱処理によってせん断強度が１
０％以上増加しない組成のはんだペーストを塗布し、加
熱・溶融してはんだボールを形成する配線板の製造法。
[PROBLEMS] To provide a wiring board having solder balls, which has excellent connection reliability after heat treatment, and a method for manufacturing the same. A wiring board having a solder ball having a composition whose shear strength does not increase by 10% or more by heat treatment on a conductor terminal on which an electrolytic nickel alloy plating film and an electrolytic gold plating film are formed in this order, and a solder ball. A solder ball connection terminal to be mounted, wherein an electrolytic nickel alloy plating film and an electrolytic gold plating film have a shear strength of 1 on a substrate having conductor terminals formed in this order by heat treatment.
A method for manufacturing a wiring board in which a solder paste having a composition that does not increase by 0% or more is applied, and heated and melted to form a solder ball.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、はんだボールを有
する配線板とその製造方法に関する。The present invention relates to a wiring board having solder balls and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】電子部品を搭載するプリント配線板や半
導体を直接搭載する半導体搭載用基板は、近年高密度化
が進んでおり、実装方法も高密度化に対応してきてお
り、配線板のスルーホールに電子部品の端子ピンを挿入
して、はんだで固定する実装方法から、配線板の表面層
の端子にはんだで固定する表面実装方法に変わってきて
いる。2. Description of the Related Art In recent years, the density of printed wiring boards on which electronic components are mounted and semiconductor mounting substrates on which semiconductors are directly mounted have been increasing, and mounting methods have been adapted to higher densities. The mounting method in which the terminal pins of the electronic component are inserted into the holes and fixed with solder has been changed to the surface mounting method in which the terminal pins of the surface layer of the wiring board are fixed with solder.
【０００３】また、表面実装用の電子部品でも、はんだ
接続用のリード端子を平行した２列に形成したデュアル
インラインパッケージ（以下、ＤＩＰという。）や、正
方形のパッケージの４辺にリード端子を設けたクワッド
フラットパッケージ（以下、ＱＦＰという。）から、パ
ッケージの裏面に格子状に配列したはんだボールで接続
するボールグリッドアレイ（以下、ＢＧＡという。）に
なってきている。[0003] Also, in electronic parts for surface mounting, lead terminals are provided on four sides of a dual in-line package (hereinafter referred to as DIP) in which lead terminals for solder connection are formed in two rows in parallel, or a square package. In addition, a ball grid array (hereinafter, referred to as BGA) has been changed from a quad flat package (hereinafter, referred to as QFP), which is connected to the back surface of the package by solder balls arranged in a grid.
【０００４】このＢＧＡのはんだボールが接続した端子
構造は、導体端子上にはんだボールが接続されている。In the terminal structure of the BGA to which the solder balls are connected, the solder balls are connected to the conductor terminals.
【０００５】また、ここで使用されているはんだボール
は錫と鉛の割合が６：４である共晶はんだボールであ
る。近年、地球環境の問題から鉛を使用しないはんだが
数十種類以上提案されているが、共晶はんだボールの代
替にはなっていない。[0005] The solder balls used here are eutectic solder balls in which the ratio of tin to lead is 6: 4. In recent years, dozens or more types of solders that do not use lead have been proposed due to the problem of the global environment, but they have not been substituted for eutectic solder balls.
【０００６】[0006]
【発明が解決しようとする課題】ところで、従来の共晶
はんだボールが接続した端子構造では、はんだボールの
接続後の熱処理によって接続信頼性が著しく低下するこ
とがあるという課題がある。このはんだボールの接続不
良には、はんだボールそのものが破壊する場合と、はん
だボールとはんだボール接続用端子の界面が剥離する場
合とがあり、はんだボールそのものが破壊する場合は、
かなり大きい外力が加わらなければ起こらず、通常の使
用状態での接続不良は、ほとんどが、はんだボールとは
んだボール接続用端子の界面が剥離することによって起
こっているという課題があった。However, in the conventional terminal structure in which eutectic solder balls are connected, there is a problem that the heat treatment after the connection of the solder balls may significantly reduce the connection reliability. In the connection failure of the solder ball, there are a case where the solder ball itself is broken and a case where the interface between the solder ball and the solder ball connection terminal is peeled off.
There is a problem that the connection failure in a normal use state is almost caused by the peeling of the interface between the solder ball and the solder ball connection terminal unless a considerably large external force is applied.
【０００７】本発明は、熱処理後の接続信頼性に優れ
た、はんだボールを有する配線板とその製造方法を提供
することを目的とする。An object of the present invention is to provide a wiring board having solder balls, which has excellent connection reliability after heat treatment, and a method of manufacturing the same.
【０００８】[0008]
【課題を解決するための手段】本発明は、以下のことを
特徴とする。 （１）電解ニッケル合金めっき皮膜、電解金めっき皮膜
が、その順に形成された導体の端子上に、熱処理によっ
てせん断強度が１０％以上増加しない組成のはんだボー
ルを有する配線板。 （２）熱処理が、０℃以上で１７０℃以下の放置処理、
または−１００℃以上で１７０℃以下の範囲内で交互に
温度を変化させる冷熱サイクル処理のいずれかの処理で
ある（１）に記載のはんだボールを有する配線板。 （３）はんだボールを搭載するはんだボール接続用端子
であって、電解ニッケル合金めっき皮膜、電解金めっき
皮膜が、その順に形成された導体の端子を有する基板
に、熱処理によってせん断強度が１０％以上増加しない
組成のはんだペーストを塗布し、加熱・溶融してはんだ
ボールを形成する配線板の製造法。 （４）はんだボールを搭載するはんだボール接続用端子
であって、電解ニッケル合金めっき皮膜、電解金めっき
皮膜が、その順に形成された導体の端子を有する基板
に、熱処理によってせん断強度が１０％以上増加しない
組成のはんだめっきを行い、加熱・溶融してはんだボー
ルを形成する配線板の製造法。 （５）熱処理が、０℃以上で１７０℃以下の放置処理、
または−１００℃以上で１７０℃以下の範囲内で交互に
温度を変化させる冷熱サイクル処理のいずれかの処理で
ある（３）または（４）に記載の配線板の製造法。The present invention is characterized by the following. (1) A wiring board having a solder ball having a composition whose shear strength does not increase by 10% or more by heat treatment on a terminal of a conductor on which an electrolytic nickel alloy plating film and an electrolytic gold plating film are sequentially formed. (2) heat treatment, leaving treatment at 0 ° C. or more and 170 ° C. or less,
Alternatively, the wiring board having the solder balls according to (1), which is any one of cooling and heating cycling treatments in which the temperature is alternately changed within a range of -100 ° C or more and 170 ° C or less. (3) A solder ball connecting terminal on which a solder ball is to be mounted, wherein an electrolytic nickel alloy plating film and an electrolytic gold plating film are provided on a substrate having conductor terminals formed in this order, and the shear strength is 10% or more by heat treatment. A method of manufacturing a wiring board in which solder paste with a composition that does not increase is applied, heated and melted to form solder balls. (4) A solder ball connection terminal for mounting a solder ball, wherein the electrolytic nickel alloy plating film and the electrolytic gold plating film have a conductor terminal formed in this order on a substrate having a conductor terminal, and the heat treatment has a shear strength of 10% or more. A method of manufacturing a wiring board that performs solder plating with a composition that does not increase and heats and melts to form solder balls. (5) heat treatment, leaving treatment at 0 ° C. or more and 170 ° C. or less,
Or the method of manufacturing a wiring board according to (3) or (4), which is one of cooling and heating cycle treatments in which the temperature is alternately changed within a range of −100 ° C. or more and 170 ° C. or less.
【０００９】[0009]
【発明の実施の形態】本発明の配線板は、はんだボール
を搭載するはんだボール接続用端子を有するものであっ
て、セラミック基板や有機基板など基板材質に限定され
ることなく用いることができる。セラミック基板として
は、アルミナ基板、窒化アルミ基板などを用いることが
できる。有機基板としては、ガラスクロスにエポキシ樹
脂を含浸させたＦＲ−４基板、ビスマレイミド−トリア
ジン樹脂を含浸させたＢＴ基板、さらにはポリイミドフ
ィルムを基材として用いたポリイミドフィルム基板など
を用いることができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The wiring board of the present invention has a solder ball connection terminal for mounting a solder ball, and can be used without being limited to a substrate material such as a ceramic substrate or an organic substrate. As the ceramic substrate, an alumina substrate, an aluminum nitride substrate, or the like can be used. As the organic substrate, an FR-4 substrate in which a glass cloth is impregnated with an epoxy resin, a BT substrate in which a bismaleimide-triazine resin is impregnated, and a polyimide film substrate using a polyimide film as a base material can be used. .
【００１０】配線の構造には、片面配線、両面配線、多
層配線いずれの構造でもよく必要に応じて用いることが
できる。特に多層配線の中でも高密度に対応できる非貫
通孔を設けた配線板を用いれば、部品実装の面積割合が
多いため信頼性確保が難しいが、上記の導電性粒子を含
む接着剤を介して接着した金属箔を導体パターンに用い
て、接続信頼性を向上することが可能となる。非貫通孔
を設けた配線板には、セラミック基板ではグリーンシー
トと導電性ペーストによる導体パターンとグリーンシー
トに設けたバイアホールに導電性ペーストを充填した多
層化材料を積層して焼結・作製した基板を用いることが
できる。有機基板には、内層回路板の表面に絶縁層を形
成し、その絶縁層にレーザ法やフォト法で非貫通孔を設
け、内層回路と接続した導体回路を形成し、これを順次
繰り返して作製するビルドアップ法で作製した基板を用
いることができる。The wiring structure may be any of single-sided wiring, double-sided wiring, and multilayer wiring, and may be used as required. In particular, when using a wiring board provided with non-through holes that can respond to high density even among multilayer wiring, it is difficult to ensure reliability because the area ratio of component mounting is large, but it is bonded through an adhesive containing the above conductive particles. By using the metal foil thus obtained for the conductor pattern, it is possible to improve the connection reliability. On the wiring board provided with non-through holes, a ceramic substrate was formed by sintering and laminating a conductive pattern of a green sheet and a conductive paste and a multilayer material filled with a conductive paste in via holes provided in the green sheet. A substrate can be used. On the organic substrate, an insulating layer is formed on the surface of the inner layer circuit board, a non-through hole is provided in the insulating layer by a laser method or a photo method, and a conductor circuit connected to the inner layer circuit is formed, and this is sequentially repeated and manufactured. A substrate manufactured by a build-up method can be used.
【００１１】また、さらに、はんだボールを搭載できる
ような基板であれば、現在使用されているような、テー
プオートメイテッドボンディング（以下、ＴＡＢとい
う。）、リードフレーム、ボールグリッドアレイ（以
下、ＢＧＡという。），チップサイズパッケージ（以
下、ＣＳＰという。），マルチチップモジュール（以
下、ＭＣＭという。）などの基板にも用いることができ
る。Further, if the substrate is capable of mounting solder balls, it is a tape automated bonding (hereinafter, referred to as TAB), a lead frame, and a ball grid array (hereinafter, referred to as BGA) as currently used. ), A chip size package (hereinafter, referred to as CSP), a multi-chip module (hereinafter, referred to as MCM), and the like.
【００１２】このような配線板は、通常は、半導体チッ
プなどの電子部品を搭載し、マザーボードとの間の接続
をはんだボールで行うものが多いが、半導体チップなど
の電子部品を搭載する箇所にはんだボールを搭載するも
のであってもよい。また、半導体チップのみならず、チ
ップコンデンサやチップ抵抗などを搭載するものであっ
てもよい。Usually, such wiring boards mount electronic components such as semiconductor chips and connect them to a motherboard by solder balls in many cases. What mounts a solder ball may be used. Further, not only a semiconductor chip but also a chip capacitor and a chip resistor may be mounted.
【００１３】はんだボール接続用端子の素材には、銅、
タングステン、モリブデン等の金属が使用できる。本発
明の導体の表面処理は、電解ニッケル合金めっきであ
り、外部直流電源を使用してめっき液中のニッケルイオ
ンを銅、タングステン、モリブデン等の導体の端子表面
にニッケル金属として析出させたものであり、電解ニッ
ケルめっき皮膜の組成は、純ニッケルまたはめっき液組
成に起因する元素（炭素、窒素、イオウ等）を含有して
ニッケルとの合金になる場合もあるが、特に限定するも
のではない。この電解ニッケル合金めっき皮膜は、８０
重量％以上の純度のニッケルであることが好ましく、８
０重量％未満であれば、接続の信頼性が低下する場合も
ある。また、９０重量％以上の純度であればより好まし
い。電解ニッケル合金めっき皮膜の膜厚は、０．１μｍ
〜２０μｍであることが好ましく、０．１μｍ未満で
は、めっきの効果がなく接続の信頼性が向上せず、２０
μｍを越えると、効果がそれ以上に向上せず、経済的で
ないので好ましくない。さらには、この電解ニッケル合
金めっきの厚さは、０．５〜１０μｍの範囲であること
がより好ましい。[0013] The material of the solder ball connection terminal is copper,
Metals such as tungsten and molybdenum can be used. The surface treatment of the conductor of the present invention is electrolytic nickel alloy plating, in which nickel ions in a plating solution are precipitated as nickel metal on a terminal surface of a conductor such as copper, tungsten and molybdenum using an external DC power supply. In some cases, the composition of the electrolytic nickel plating film may be pure nickel or an alloy with nickel containing elements (carbon, nitrogen, sulfur, etc.) derived from the composition of the plating solution, but is not particularly limited. This electrolytic nickel alloy plating film is 80
It is preferably nickel having a purity of at least
If the amount is less than 0% by weight, the reliability of the connection may decrease. Further, it is more preferable that the purity is 90% by weight or more. The thickness of the electrolytic nickel alloy plating film is 0.1 μm
When the thickness is less than 0.1 μm, there is no effect of plating and the reliability of connection is not improved.
If it exceeds μm, the effect is not further improved and it is not economical. Further, the thickness of the electrolytic nickel alloy plating is more preferably in the range of 0.5 to 10 μm.
【００１４】電解金めっきは、外部直流電源を使用して
めっき液中の金イオンを銅、タングステン、モリブデン
等の導体の端子表面に金の金属として析出させたもので
ある。この電解金めっき皮膜は、９９重量％以上の純度
の金であることが好ましく、９９重量％未満であれば、
接続の信頼性が低下する場合もある。さらに、この電解
金めっき皮膜の純度は、９９．５重量％以上であること
がより好ましい。電解金めっき皮膜の膜厚は、０．００
５μｍ〜３μｍであることが好ましく、０．００５μｍ
未満では、めっきの効果がなく接続の信頼性が向上せ
ず、３μｍを越えると、効果がそれ以上に向上せず、経
済的でないので好ましくない。さらには、この電解金め
っき皮膜の厚さは、０．００５〜０．５μｍの範囲であ
ることがより好ましい。In the electrolytic gold plating, gold ions in a plating solution are deposited as gold metal on a terminal surface of a conductor such as copper, tungsten or molybdenum using an external DC power supply. This electrolytic gold plating film is preferably gold having a purity of 99% by weight or more, and if it is less than 99% by weight,
The reliability of the connection may be reduced. Further, the purity of the electrolytic gold plating film is more preferably 99.5% by weight or more. The thickness of the electrolytic gold plating film is 0.00
5 μm to 3 μm, preferably 0.005 μm
If it is less than 3 μm, the effect of plating will not be obtained, and the reliability of the connection will not be improved. Further, the thickness of the electrolytic gold plating film is more preferably in the range of 0.005 to 0.5 μm.
【００１５】また、本発明は、そのはんだボール接続用
端子である導体の端子上に、熱処理によってせん断強度
が１０％以上増加しない組成のはんだボールを用いるこ
とを特徴とするものである。Further, the present invention is characterized in that a solder ball having a composition whose shear strength does not increase by 10% or more by heat treatment is used on a terminal of a conductor which is a terminal for connecting the solder ball.
【００１６】この熱処理によってせん断強度が１０％以
上に増加しないことは、そのせん断強度を、熱処理する
前に、図１に示すように、球状のはんだボールまたは円
筒状のはんだ線を固定台に接着して、せん断ツール兼強
度センサーを水平方向に毎秒０．３ｍｍの速度で移動さ
せて、その際に強度センサーにかかる最大負荷重量を測
定しておき、０℃以上で１７０℃以下の放置処理、また
は−１００℃以上で１７０℃以下の範囲内で交互に温度
を変化させる冷熱サイクル処理を行って、そのせん断強
度を、同じ方法で測定することにより確認できる。The fact that the shear strength does not increase to 10% or more by this heat treatment means that, before the heat treatment, the spherical solder ball or the cylindrical solder wire is bonded to the fixing table as shown in FIG. Then, the shearing tool / strength sensor is moved in the horizontal direction at a speed of 0.3 mm per second, and the maximum load weight applied to the strength sensor is measured at that time, and a leaving treatment at 0 ° C or higher and 170 ° C or lower is performed. Alternatively, it can be confirmed by performing a thermal cycling treatment in which the temperature is alternately changed within a range of -100 ° C or more and 170 ° C or less, and measuring the shear strength by the same method.
【００１７】また、せん断強度の増加は５％以上に増加
しないものであればより好ましい。このようなはんだの
組成は、鉛と錫の合金である共晶はんだでも良く、また
鉛と錫の合金にさらにこれらの金属以外の銀、アンチモ
ン、銅、ニッケルの１種類以上の金属を含んでも良い。
また、鉛を含まない錫合金で錫以外の金属として銀、
銅、亜鉛、ニッケル、ビスマス、インジウム、ニッケル
の１種類以上を含むことを特徴とする錫合金でも良く、
上記のような方法で調査してせん断強度が１０％以上に
ならないものであればどのようなものでも使用できる。It is more preferable that the increase in shear strength does not increase to 5% or more. Such a composition of the solder may be a eutectic solder which is an alloy of lead and tin, or may further contain one or more metals of silver, antimony, copper and nickel other than these metals in the alloy of lead and tin. good.
In addition, silver as a metal other than tin in a tin alloy containing no lead,
Copper, zinc, nickel, bismuth, indium, a tin alloy containing at least one kind of nickel may be used,
Any material can be used as long as it does not exhibit a shear strength of 10% or more as determined by the method described above.
【００１８】このような配線板を製造するには、はんだ
ボールを搭載するはんだボール接続用端子を有する基板
に、熱処理によってせん断強度が１０％以上増加しない
組成のはんだペーストを塗布し、加熱・溶融してはんだ
ボールを形成することにより可能である。このはんだペ
ーストに代えて、はんだめっきを行うこともできる。In order to manufacture such a wiring board, a solder paste having a composition whose shear strength does not increase by 10% or more by heat treatment is applied to a substrate having solder ball connection terminals on which solder balls are mounted, and heated and melted. This is possible by forming solder balls. Instead of this solder paste, solder plating can be performed.
【００１９】[0019]
【実施例】実施例 厚さ１８μｍの銅箔を両面に貼り合わせた、厚さ０．５
ｍｍの銅張りエポキシ積層板であるＭＣＬ−Ｅ−６７９
（日立化成工業株式会社製、商品名）の銅箔の不要な箇
所をエッチング除去し、エッチングレジストを剥離し、
半田レジストを形成した、導体パターンの露出した銅の
はんだボール接続用端子を有する半導体搭載用基板を作
製した。その半導体搭載用基板を、脱脂液であるＺ−２
００（株式会社ワールドメタル製、商品名）に、液温５
０℃で１分間浸漬し、室温で２分間水洗し、１００ｇ／
リットルの過硫酸アンモニウム液に室温で１分間浸漬し
て、ソフトエッチングし、室温で２分間水洗し、１０重
量％の硫酸に、室温で１分間浸漬して、酸洗し、室温で
２分間水洗し、電解ニッケルめっき液であるワット浴
に、２A/dm2、液温８５℃で２０分間浸漬して、Ｎｉめ
っき皮膜を形成し、室温で２分間水洗し、非シアン系の
電解ストライク金めっき液であるニュートロネクス・ス
トライク（日本エレクトロプレーティング・エンジニヤ
ーズ株式会社、商品名）に、0.5A/dm2、室温で１分間浸
漬し、室温で２分間水洗し、非シアン系の電解金めっき
液であるニュートロネクス・309（日本エレクトロプレ
ーティング・エンジニヤーズ株式会社製、商品名）に、
２A/dm2、室温で２分間浸漬して、純金（純度９９．９
重量％））の皮膜を形成した。上記方法で作成した半導
体搭載用基板のはんだボール接続用端子に、９７．２５
重量％錫と３．５重量％銀と０．７５重量％銅の錫合金
である１５０℃で１００時間高温放置してせん断強度の
変化が１０％の減少であるはんだボールをリフロー炉で
接続させた。EXAMPLE A copper foil having a thickness of 18 μm was attached to both sides, and a thickness of 0.5
MCL-E-679 mm copper-clad epoxy laminate
Unnecessary portions of copper foil (made by Hitachi Chemical Co., Ltd.) are removed by etching, the etching resist is removed,
A semiconductor mounting substrate having a solder resist-formed copper solder ball connecting terminal with an exposed conductor pattern was prepared. The substrate for mounting a semiconductor was replaced with a degreasing liquid Z-2.
00 (made by World Metal Co., Ltd., trade name)
Immersed at 0 ° C for 1 minute, washed with water at room temperature for 2 minutes, 100 g /
Immersion in 1 liter of ammonium persulfate solution for 1 minute at room temperature, soft etching, washing with water for 2 minutes at room temperature, immersion in 10% by weight sulfuric acid for 1 minute at room temperature, pickling, washing with water for 2 minutes at room temperature Immersed in a watt bath, an electrolytic nickel plating solution, at 2 A / dm 2 at a liquid temperature of 85 ° C. for 20 minutes to form a Ni plating film, washed with water at room temperature for 2 minutes, and a non-cyanide electrolytic strike gold plating solution Immersion at 0.5 A / dm 2 at room temperature for 1 minute, washed with water at room temperature for 2 minutes, and a non-cyanide-based electrolytic gold plating solution (Neutronex Strike, Japan Electroplating Engineers Co., Ltd., trade name) Neutronex 309 (Japan Electroplating Engineers Co., Ltd., trade name)
2 A / dm 2 at room temperature for 2 minutes to obtain pure gold (purity 99.9).
% By weight)). 97.25 is added to the solder ball connection terminal of the semiconductor mounting substrate prepared by the above method.
A tin ball of 3.5% by weight of tin, 3.5% by weight of silver and 0.75% by weight of copper was left at a high temperature of 150 ° C. for 100 hours, and solder balls whose shear strength was reduced by 10% were connected in a reflow furnace. Was.
【００２０】比較例 実施例と同様にして半導体搭載用基板を作製した。上記
方法で作成した半導体搭載用基板のはんだボール接続用
端子に、６０重量％錫と４０重量％の共晶はんだであり
１５０℃で１００時間高温放置してせん断強度の変化が
４０％の増加であるはんだボールをリフロー炉で接続さ
せた。Comparative Example A semiconductor mounting substrate was manufactured in the same manner as in the example. The solder ball connection terminal of the semiconductor mounting substrate prepared by the above method is a eutectic solder of 60% by weight of tin and 40% by weight. A solder ball was connected in a reflow furnace.
【００２１】（せん断試験方法）はんだのせん断試験方
法は万能ボンドテスタを使用して行う。図に示すように
球状のはんだボールまたは円筒状のはんだ線を固定台に
接着して、せん断ツール兼強度センサーを水平方向に毎
秒０．３ｍｍの速度で移動させて、その際に強度センサ
ーにかかる最大負荷重量からせん断強度を測定する。
（４０００型、デイジ社製）(Shear Test Method) The shear test method for solder is performed using a universal bond tester. As shown in the figure, a spherical solder ball or a cylindrical solder wire is adhered to the fixed base, and the shearing tool / strength sensor is moved horizontally at a speed of 0.3 mm / sec. Measure the shear strength from the maximum load weight.
(Type 4000, manufactured by Daige)
【００２２】実施例と比較例で作製した、はんだボール
が接続したＢＧＡを１５０℃、１００時間の熱処理を行
った後、はんだボールのシェア（剪断）試験を行った結
果、実施例のサンプルでは、全てのはんだボールが、ボ
ール内での剪断による破壊まで耐えることができたが、
比較例のはんだボールは、約９０％の端子において、銅
とはんだボールの界面で破壊が発生し、熱処理後の接続
信頼性が不良であった。After performing the heat treatment at 150 ° C. for 100 hours on the BGA to which the solder balls were connected, which were produced in the example and the comparative example, the shear (shear) test of the solder balls was performed. All solder balls were able to withstand the destruction due to shear in the ball,
In the solder ball of the comparative example, about 90% of the terminals were broken at the interface between the copper and the solder ball, and the connection reliability after the heat treatment was poor.
【００２３】[0023]
【発明の効果】以上に説明したとおり、本発明によっ
て、接続信頼性に優れたはんだボールを有する配線板と
その製造方法を提供することができる。As described above, according to the present invention, it is possible to provide a wiring board having solder balls having excellent connection reliability and a method for manufacturing the same.
【図１】本発明の測定方法を説明するための概略側面図
である。FIG. 1 is a schematic side view for explaining a measuring method of the present invention.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｂ２３Ｋ 3/06 Ｂ２３Ｋ 3/06 Ｈ Ｈ０１Ｌ 23/12 ５０１ Ｈ０１Ｌ 23/12 ５０１Ｚ Ｈ０５Ｋ 3/24 Ｈ０５Ｋ 3/24 Ａ // Ｂ２３Ｋ 101:42 Ｂ２３Ｋ 101:42 Ｆターム(参考） 5E319 AC01 BB04 BB05 5E343 AA07 AA15 AA16 AA17 AA18 AA23 BB23 BB24 BB44 BB54 BB55 BB67 CC33 CC46 CC67 DD43 DD76 EE02 ER11 ER33 ER39 GG13 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) B23K 3/06 B23K 3/06 H H01L 23/12 501 H01L 23/12 501Z H05K 3/24 H05K 3/24 A // B23K 101: 42 B23K 101: 42 F term (reference) 5E319 AC01 BB04 BB05 5E343 AA07 AA15 AA16 AA17 AA18 AA23 BB23 BB24 BB44 BB54 BB55 BB67 CC33 CC46 CC67 DD43 DD76 EE02 ER11 ER13 ER39 GG
Claims (5)
き皮膜が、その順に形成された導体の端子上に、熱処理
によってせん断強度が１０％以上増加しない組成のはん
だボールを有する配線板。1. A wiring board having solder balls having a composition whose shear strength does not increase by 10% or more by heat treatment on a terminal of a conductor on which an electrolytic nickel alloy plating film and an electrolytic gold plating film are formed in this order.
処理、または−１００℃以上で１７０℃以下の範囲内で
交互に温度を変化させる冷熱サイクル処理のいずれかの
処理である請求項１に記載のはんだボールを有する配線
板。2. The heat treatment is one of a leaving treatment at a temperature of 0 ° C. or more and 170 ° C. or less, or a cooling / heating cycle treatment of alternately changing the temperature within a range of −100 ° C. or more and 170 ° C. or less. A wiring board having the solder ball according to 1.
用端子であって、電解ニッケル合金めっき皮膜、電解金
めっき皮膜が、その順に形成された導体の端子を有する
基板に、熱処理によってせん断強度が１０％以上増加し
ない組成のはんだペーストを塗布し、加熱・溶融しては
んだボールを形成する配線板の製造法。3. A solder ball connection terminal for mounting a solder ball, wherein an electrolytic nickel alloy plating film and an electrolytic gold plating film have a shear strength of 10% by heat treatment on a substrate having conductor terminals formed in this order. A method of manufacturing a wiring board in which a solder paste having a composition that does not increase by more than 10% is applied and heated and melted to form a solder ball.
用端子であって、電解ニッケル合金めっき皮膜、電解金
めっき皮膜が、その順に形成された導体の端子を有する
基板に、熱処理によってせん断強度が１０％以上増加し
ない組成のはんだめっきを行い、加熱・溶融してはんだ
ボールを形成する配線板の製造法。4. A solder ball connecting terminal for mounting a solder ball, wherein an electrolytic nickel alloy plating film and an electrolytic gold plating film have a shear strength of 10% by heat treatment on a substrate having conductor terminals formed in this order. A method of manufacturing a wiring board that performs solder plating with a composition that does not increase by more than% and heats and melts to form solder balls.
処理、または−１００℃以上で１７０℃以下の範囲内で
交互に温度を変化させる冷熱サイクル処理のいずれかの
処理である請求項３または４に記載の配線板の製造法。5. The method according to claim 1, wherein the heat treatment is any one of a leaving treatment at a temperature of 0 ° C. or more and 170 ° C. or less, and a cooling / heating cycle treatment of alternately changing the temperature within a range of −100 ° C. or more and 170 ° C. 5. The method for producing a wiring board according to 3 or 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001082976A JP2002280728A (en) | 2001-03-22 | 2001-03-22 | Wiring board having solder balls and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001082976A JP2002280728A (en) | 2001-03-22 | 2001-03-22 | Wiring board having solder balls and method of manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002280728A true JP2002280728A (en) | 2002-09-27 |
Family
ID=18938857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001082976A Pending JP2002280728A (en) | 2001-03-22 | 2001-03-22 | Wiring board having solder balls and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002280728A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005123598A (en) * | 2003-09-24 | 2005-05-12 | Toppan Printing Co Ltd | Wiring board |
| CN101879642A (en) * | 2009-04-23 | 2010-11-10 | 株式会社日立工业设备技术 | Solder ball printing device and solder ball printing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10166178A (en) * | 1996-10-09 | 1998-06-23 | Hitachi Ltd | Pb-free solder material and electronic equipment using the same |
| JP2000299550A (en) * | 1999-04-16 | 2000-10-24 | Denso Corp | Wiring board and manufacture thereof |
| JP2001024322A (en) * | 1999-07-05 | 2001-01-26 | Ibiden Co Ltd | Printed wiring board and manufacture thereof |
-
2001
- 2001-03-22 JP JP2001082976A patent/JP2002280728A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10166178A (en) * | 1996-10-09 | 1998-06-23 | Hitachi Ltd | Pb-free solder material and electronic equipment using the same |
| JP2000299550A (en) * | 1999-04-16 | 2000-10-24 | Denso Corp | Wiring board and manufacture thereof |
| JP2001024322A (en) * | 1999-07-05 | 2001-01-26 | Ibiden Co Ltd | Printed wiring board and manufacture thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005123598A (en) * | 2003-09-24 | 2005-05-12 | Toppan Printing Co Ltd | Wiring board |
| CN101879642A (en) * | 2009-04-23 | 2010-11-10 | 株式会社日立工业设备技术 | Solder ball printing device and solder ball printing method |
| CN101879642B (en) * | 2009-04-23 | 2013-08-14 | 株式会社日立工业设备技术 | Solder ball printing apparatus and solder ball printing method |
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