JP2002280508A - Cooling module and cooling system using the cooling module - Google Patents

Abstract

(57) Abstract: A cooling module capable of improving cooling efficiency by providing a structure in which a fluid passage is not provided on a heat transfer plate side. A flat heat transfer plate 16 having good heat conductivity in contact with the heat transfer plate, a fluid cover 18 joined to the heat transfer plate and having a fluid passage, and a partition plate 21 having good heat conductivity inside the fluid passage are provided. Cooling module. Heat transfer plate 16
Is a flat plate, so that it is possible to select a material that emphasizes only thermal conductivity and enhance the heat transfer effect, and to promote heat transfer with a fluid by the partition plate 21 having good heat conductivity. Since the heat effect can be enhanced, it has the effect of enhancing the cooling effect.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a cooling module for cooling an object to be cooled such as a semiconductor element mounted on a substrate with a fluid, and a cooling system using the cooling module.

[0002]

2. Description of the Related Art Conventionally, a cooling apparatus for liquid cooling an integrated circuit element mounted on a substrate has a configuration as shown in FIGS. That is, a plurality of fluid passage walls 4 arranged at regular intervals on a surface opposite to the flat surface are provided integrally (directly) on a heat transfer plate 3 having a flat surface in contact with the integrated circuit element 2 mounted on the printed circuit board 1. A large number of fluid passages 6 are formed by a cooling body cover 5 such as a bellows covering the heat transfer plate.

[0003] While the liquid flows from the inlet 7 through the fluid passage 6 to the outlet 8, the liquid collides with the fluid passage wall 4 and flows while being disturbed, and the integrated circuit element 2 transmitted to the heat transfer plate 3 in the fluid passage 6. The integrated circuit element 2 is cooled by exchanging heat with the heat of the integrated circuit element 2.

[0004]

In the above-mentioned conventional configuration,
Since the fluid passage wall 4 is provided integrally with the heat transfer plate 3, the degree of freedom in designing the material and structure of the heat transfer plate is limited, and the cooling efficiency is low. In other words, it is generally preferable that the heat transfer plate 3 be made of copper having good heat conductivity in view of the heat transfer performance. However, considering that the fluid passage wall 4 is efficiently provided by extruding the heat transfer plate 3, it is extremely difficult to extrude with copper, and the heat conductivity is inferior to copper. You have to use it.

[0005] Although the aluminum heat transfer plate is easy to extrude, the fluid passage wall is formed integrally with the fluid passage wall with various improvements in order to form the fluid passage with a view to increasing the cooling efficiency. However, there has been a limit in terms of processing efficiency, and it has been required to further increase the cooling efficiency.

SUMMARY OF THE INVENTION The present invention solves the problems of the prior art, and provides a cooling module capable of improving cooling efficiency by providing a structure in which a fluid passage is not provided on the heat transfer plate side, and a cooling system using the cooling module. provide.

[0007]

According to the first aspect of the present invention, there is provided a semiconductor device mounted on a substrate and cooled.
A flat heat transfer plate having good heat conductivity in contact with the plane of the semiconductor element, a fluid cover joined to the heat transfer plate and having a fluid passage, and a partition having good heat conductivity inside the fluid passage It is a cooling module provided with a plate.

According to the above means, since the heat transfer plate in contact with the plane of the semiconductor element is in a plate shape, it is possible to select a material in which only thermal conductivity is emphasized, so that the heat transfer effect can be enhanced.
In addition, the heat transfer function is enhanced by promoting heat transfer with the fluid by the partition plate with good heat conductivity, and the fluid cover is connected to the heat transfer plate and has a fluid passage on the side of the fluid cover. The flexibility in forming various fluid passages that emphasizes only the function and the ease of assembling the manufacturing process is increased, and the cooling effect of the semiconductor element mounted on the substrate is enhanced.

According to a second aspect of the present invention, the semiconductor element is
It is a central processing unit of a computer. According to the above means, the cooling effect of the central processing unit that generates a large amount of heat can be enhanced, and the reliability of the computer can be improved.

According to a third aspect of the present invention, in the cooling module according to the first or second aspect, the fluid cover is molded from a synthetic resin.

According to the above-described means, since the fluid cover is molded from a synthetic resin, it has an effect that it is relatively easy to form various fluid passages which emphasize heat exchange of flowing fluid.

According to a fourth aspect of the present invention, there is provided the cooling module according to any one of the first to third aspects, wherein the cross section of the partition plate is formed in a wavy shape.

[0013] According to the above means, the heat transfer area is increased to provide an efficient heat exchange.

According to a fifth aspect of the present invention, in the fourth aspect of the present invention, a flat portion is provided on the corrugated cross section of the partition plate.
This is a cooling module configured to contact a heat transfer plate with the flat portion.

[0015] According to the above means, there is an effect of performing efficient heat exchange by increasing the contact area with the heat transfer plate.

According to a sixth aspect of the present invention, there is provided a cooling module according to the fifth aspect of the present invention, wherein adjacent corrugated cross-sections of the partition plate are arranged in a substantially triangular shape alternately in the normal and reverse directions.

According to the above means, the heat exchange area with the fluid is further increased, and the contact area with the heat transfer plate is increased, thereby having the effect of performing more efficient heat exchange.

According to a seventh aspect of the present invention, there is provided a cooling module according to any one of the fourth to sixth aspects, wherein the wavy partition plate is divided and arranged in a plurality of rows.

According to the above-described means, in addition to increasing the heat transfer area, the heat transfer efficiency is improved by improving the heat transfer coefficient due to the leading edge effect of the divided portion.

An eighth aspect of the present invention is the cooling module according to any one of the fourth to sixth aspects, wherein the wavy partition plate is provided with a cut-and-raised portion.

According to the above-mentioned means, in addition to increasing the heat transfer area, the heat transfer coefficient is improved by improving the heat transfer coefficient by the leading edge effect of the cut-and-raised portion.

A ninth aspect of the present invention is the cooling module according to the seventh aspect of the present invention, wherein the period of the wavy partition plate is shifted.

According to the above-described means, in addition to increasing the heat transfer area, it has an effect of performing efficient heat exchange by promoting turbulence and improving the heat transfer coefficient by the effect of the leading edge of the fin.

According to a tenth aspect of the present invention, in the invention according to any one of the first to ninth aspects, a position fixing hole is provided in the partition plate, and the partition plate position fixing pin is provided in the fluid cover. It is a cooling module provided.

According to the above means, the partition plate does not move due to the assembling process or the flow of the fluid, and has an effect of securing a stable heat exchange performance.

An eleventh aspect of the present invention is the cooling module according to any one of the first to tenth aspects, wherein the fluid flowing through the fluid passage is a liquid.

According to the above means, since the fluid flowing through the fluid passage uses a liquid, the fluid has a function of performing a large heat exchange in the fluid passage.

According to a twelfth aspect of the present invention, there is provided a cooling module according to any one of the first to eleventh aspects,
A cooling system using a cooling module, comprising: a circulating pump that communicates with a fluid passage of the cooling module, releases heat returned from the fluid passage, and sends the fluid back to the fluid passage, and a radiator. is there.

According to the above means, the fluid whose temperature has risen due to the cooling action in the fluid passage of the cooling module is sucked by the circulating pump and returns to the radiator to radiate heat. It is sent out and repeats the cooling action, and always has a stable cooling action.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cooling module according to the present invention and a cooling system using the cooling module will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 shows a first embodiment of the present invention.
FIG. 2 is a perspective view showing a cooling module and a cooling system using the cooling module according to an embodiment corresponding to the invention described in claim 12. FIG. 2 shows a fluid cover and a partition plate in a fluid cover of the cooling module. FIG. 3 is a plan view showing a cooling fluid passage formed, and FIG.
FIG. 4 is a diagram illustrating a fluid passage in a cross section taken along line −A.

The cooling system comprises a cooling module 11, a fluid cover 18 in the cooling module 11, and a partition plate 1.
9 and communicates with the fluid passage 12 formed by the fluid passage 1.
A circulating pump 13 for radiating the fluid returned from 2 and sending it back to the fluid passage 12 and a radiator 14 composed of a fin-type heat exchanger are provided. The cooling module 11 is mounted on a printed circuit board (not shown) and the like, and is cooled by a semiconductor device 15 such as a central processing unit (CPU) of a computer such as a personal computer or a game machine, and a flat surface of the semiconductor device 15. A flat heat transfer plate 16 made of aluminum alloy, copper or the like and having good thermal conductivity;
And a fluid cover 18 tightly joined via an annular seal member 17 and having the fluid passage 12 therein. The flow path of the fluid in the fluid passage 12 is defined by the partition plate 21. The partition plate 21 is made of a material having good thermal conductivity, and is tightly joined to the heat transfer plate 16 by the force of the fluid cover 18.

The fluid cover 18 is provided with an internal fluid passage 1.
The radiator 14 communicates with the radiator 2 and has an inlet 19 and an outlet 20 for a fluid to flow into and out of the radiator. The radiator 14 is made of a relatively easy-to-mold material such as an aluminum alloy or a synthetic resin. Further, the fluid passage 12 provided in the fluid cover 18 is provided.
Is formed in a meandering shape by the fluid cover 18 and the partition plate 21. The liquid fluid flowing from the inlet 19 is meandering along the fluid passage 12 and flows out of the flow outlet 20.

In the above-described embodiment, the fluid flows in the fluid passage 12 shown in FIG. 2 in a meandering manner as indicated by the arrows, so that the flow velocity increases and the heat transfer coefficient improves due to the turbulent flow. Exchange can be enhanced. Further, since the partition plate 21 is in a state of being tightly joined to the heat transfer plate, heat of the heat transfer plate is easily transmitted by heat conduction, and high-efficiency heat exchange is realized.

In the above-described embodiment, only the case where the fluid passage of the fluid cover is formed in a meandering shape has been described. The shape is not limited to the above-mentioned shape as long as the effect of the invention can be achieved.

In the above embodiment, the circulation pump 13
Is operated, the liquid fluid returned from the cooling module 11 is regenerated by radiating heat in the radiator 14 and flows through the circulation path between the radiator 14 and the cooling module 11 to enter the inlet 1.
9 flows into the fluid passage 12 in the fluid cover 18 and the outlet 2
The circulation which flows out from 0 and returns to the radiator 14 is repeated. The fluid having such a flow is transferred from the semiconductor element 15 to the heat transfer plate 16 in the fluid passage 12 in the fluid cover 18.
The semiconductor device 15 is constantly and stably cooled by exchanging heat with the heat transmitted to the semiconductor device 15.

Particularly, in the present embodiment, the heat transfer plate 16 in contact with the plane of the semiconductor element 15 has a fluid passage 12 provided on the fluid cover 18 side and is simply a flat plate, so that only thermal conductivity is emphasized. Even if copper, which is a material, is selected, processing can be easily performed, and heat transfer can be positively performed.

(Embodiment 2) FIG. 4 shows a third embodiment of the present invention.
FIG. 5 is a plan view showing a fluid passage in a fluid cover of a cooling module according to an embodiment corresponding to the invention of claim 4. FIG. 5 shows the fluid passage in a cross section taken along line BB of FIG. 4. FIG. 6 is a diagram showing a fluid passage in a cross section taken along line CC of FIG. FIGS. 7, 8, 9 and 10 also show modifications of the partition plate in the fluid cover. The invention of this embodiment differs from the invention of the first embodiment only in the shape of the partition plate, and the other parts having the same configuration and operation and effect are denoted by the same reference numerals, and detailed description is omitted. The differences will be mainly described.

In FIG. 4, 38 is an aluminum alloy,
A fluid cover made of a material such as synthetic resin which is relatively easy to mold, and a fluid passage 3 communicating with an inlet 19 and an outlet 20 inside.
2, and a pulse-wave-shaped partition plate 41 is disposed in the fluid passage 32. As shown in FIG. 5, the partition plate 41 partitions the fluid passage 32 and forms several paths. Also, as shown in FIG.
Is made equal to or slightly higher than the upper surface of the fluid cover, so that when a heat transfer plate (not shown) is joined to the fluid cover, the partition plate 41 is also tightly joined to the heat transfer plate 16. It is supposed to be. In particular, FIGS. 5, 8, 9, and 1
In the case where a flat portion is provided in a wavy cross section as in 0, the joining area between the partition plate 41 and the heat transfer plate 16 increases.

In FIG. 7, reference numeral 48 denotes a fluid cover made of a relatively easy-to-mold material such as an aluminum alloy or a synthetic resin. The fluid cover 48 has a fluid passage 42 connected to the inlet 19 and the outlet 20 therein. A triangular-wave-shaped partition plate 51 is provided at 42 parts. The height of the partition plate 51 is made equal to or slightly higher than the upper surface of the fluid cover 48, so that when the heat transfer plate (not shown) is joined to the fluid cover 48, the partition plate 51 is also densely connected to the heat transfer plate. It is designed to be in a proper bonding state. Even if the height of the partition plate is higher than the upper surface of the fluid cover, the partition plate is easily deformed due to the triangular wave shape, and the repulsive force at the time of joining the heat transfer plate is suppressed. Does not lower the sealing performance of the device.

8 and 9, reference numerals 58 and 68 denote fluid covers made of a material which is relatively easy to mold such as an aluminum alloy or a synthetic resin. Fluid passages 52 and 62 communicate with the inlet 19 and the outlet 20 inside. And the fluid passage 52,
Pulse wave-shaped partition plates 61 and 71 are provided in 62 parts. A bent portion or a curved portion is provided on a surface in the vertical direction of each of the partition plates 61 and 71. The height of the partition plates 61, 71 is the same as or slightly higher than the upper surfaces of the fluid covers 58, 68, so that the heat transfer plate (not shown)
When joining to the heat transfer plates 8, 68, the partition plates 61, 71 are also tightly joined to the heat transfer plate. In addition, even if the height of the partition plate is higher than the upper surface of the fluid cover, the partition plate has a bent or curved portion on the vertical surface, so it is easily deformed, and the repulsive force when joining the heat transfer plate is suppressed. Therefore, the sealing performance between the heat transfer plate and the fluid cover is not reduced.

In FIG. 10, reference numeral 208 denotes a fluid cover formed of a relatively easy-to-mold material such as an aluminum alloy or a synthetic resin, and has a fluid passage 202 which communicates with the inlet 19 and the outlet 20 inside. Inside the fluid passage 202, there is provided a pulse-wave-shaped partition plate 201 in which adjacent substantially triangular cross sections are alternately arranged in the forward and reverse directions. The height of the partition plate 201 is made equal to or slightly higher than the upper surface of the fluid cover 208 so that when a heat transfer plate (not shown) is joined to the fluid cover 208, the substantially triangular bottom surface of the partition plate 201 is formed. Are tightly joined to the heat transfer plate. Also, even if the height of the partition plate is higher than the upper surface of the fluid cover, the partition plate has a substantially triangular hypotenuse, so it is easily deformed, and the repulsive force at the time of joining the heat transfer plate is suppressed, and the heat transfer is suppressed. The seal between the plate and the fluid cover is not reduced.

In the above embodiment, the fluid cover 3
Fluid passages 32,4,8,48,58,68,208
2, 52, 62, and 202, heat exchange with heat transmitted from the semiconductor element 15 to the heat transfer plate 16 causes the semiconductor element 1
5 is always stably cooled. Fluid passage 32,
42, 52, 62, 202, partition plates 41, 5
1, 61, 71, and 201 are in a state of being tightly joined to the heat transfer plate, so that heat of the heat transfer plate is easily transmitted by heat conduction and has an effect of increasing the amount of heat exchange. In particular, the partition plates 41, 61,
The heat transfer plates 71 and 201 are in contact with the heat transfer plate via the flat portion, thereby further increasing the heat transfer area and realizing highly efficient heat exchange.

Further, since the partition plate 201 has a pulse wave shape in which adjacent triangular cross-sections are alternately arranged in the normal and reverse directions, the development area of the partition plate, that is, the heat exchange area with the fluid can be large, and the fluid side And the amount of heat exchange can be increased to realize more efficient heat exchange.

In the above embodiment, only the case where the fluid passage of the fluid cover is formed into a pulse wave shape or a triangular wave shape has been described. It is not limited to each of the above shapes.

(Embodiment 3) FIG. 11 is a plan view showing a fluid passage in a fluid cover of a cooling module according to an embodiment corresponding to the fifth aspect of the present invention. FIG. 12 is a diagram showing a fluid passage in a cross section taken along line DD of FIG. 11. In the invention of this embodiment, only the shape of the partition plate is different from the invention of the second embodiment, and other parts having the same configuration and operation and effect are denoted by the same reference numerals and detailed description thereof is omitted. The differences will be mainly described.

In FIG. 11, reference numeral 78 denotes a fluid cover made of a relatively easy-to-mold material such as an aluminum alloy or a synthetic resin. The fluid cover 78 has a fluid passage 52 communicating with the inlet 19 and the outlet 20 therein. Two rows of pulse-wave-shaped partition plates 81 are arranged in the section. As shown in FIG. 11, the partition plate 81 partitions the fluid passage 72 and forms several paths. The first and second rows of partition plates are shifted by 1/2 pitch. The height of the partition plate is the same as or slightly higher than the upper surface of the fluid cover, so that when a heat transfer plate (not shown) is joined to the fluid cover 78, the partition plate 81 is also close to the heat transfer plate. It is designed to be in a proper bonding state.

In the above embodiment, the fluid cover 78
In the internal fluid passage 72, the semiconductor device 15 is constantly and stably cooled by exchanging heat with heat transmitted from the semiconductor device 15 to the heat transfer plate 16. Since the partition plate 81 disposed in the fluid passage 72 is in a state of being tightly joined to the heat transfer plate, there is an effect that heat of the heat transfer plate is easily transmitted by heat conduction and an effect of increasing a heat transfer area is achieved. Has been realized. In addition, by dividing into two rows, at the leading edge of the partition plate in the second row, the heat transfer coefficient is improved by the boundary layer leading edge effect, and more efficient heat exchange is realized.

In the above embodiment, only the case where the pitch of the partition plate is shifted has been described, but the same effect can be obtained by shifting the period of the wave shape.

(Embodiment 4) FIGS. 13 to 15 show a cooling module according to an embodiment corresponding to the invention described in claim 6 of the present invention. In the invention of this embodiment, only the shape of the partition plate is different from the invention of the second embodiment, and other parts having the same configuration and operation and effect are denoted by the same reference numerals and detailed description thereof is omitted. The differences will be mainly described.

FIG. 13 is a plan view showing a fluid passage in the fluid cover of the cooling module. In FIG.
Reference numeral 88 denotes a fluid cover formed of a material which is relatively easy to mold such as an aluminum alloy or a synthetic resin, and has a fluid passage 82 communicating with the inlet 19 and the outlet 20 therein.
A partitioning plate 91 in the form of a pulse wave is disposed at the portion. A cut-and-raised portion 93 is provided on the vertical surface of the pulse-wave-shaped partition plate.

FIG. 14 is a sectional view showing a fluid passage. In FIG. 14, reference numeral 98 denotes a fluid cover formed of a relatively easy-to-mold material such as an aluminum alloy or a synthetic resin. The fluid cover 98 has a fluid passage 92 communicating with an inlet and an outlet therein. A partition plate 101 is provided. Fluid cover 9 of pulse-wave-shaped partition plate 101
A cut-and-raised portion 103 is provided on a plane portion that comes into contact with 8.

FIG. 15 is a sectional view showing a fluid passage. In FIG. 15, reference numeral 108 denotes a fluid cover formed of a material which is relatively easy to mold, such as an aluminum alloy or a synthetic resin, and has a fluid passage 10 which communicates with an inlet 19 and an outlet 20 inside.
2 and a triangular wave-shaped partition plate 111 is disposed in the fluid passage 102. A cut-and-raised portion 113 is provided on a triangular wave-shaped plane portion.

In the above embodiment, the fluid cover 8
In the fluid passages 82, 92, and 102 in 8, 98, and 108, heat is exchanged with heat transmitted from the semiconductor element 15 to the heat transfer plate 16 to constantly and stably cool the semiconductor element 15. Since the partition plates 91, 101, and 111 disposed in the fluid passages 82, 92, and 102 are in a state of being tightly joined to the heat transfer plate, heat of the heat transfer plate is easily transmitted by heat conduction, and the effect of increasing the heat transfer area is obtained. And realizes highly efficient heat exchange. Further, the partition plates 93, 103, 1
13, the heat transfer coefficient is improved by the boundary layer leading edge effect and the turbulent flow effect, and more efficient heat exchange is realized.

(Embodiment 5) FIG. 16 is a plan view showing a fluid passage in a fluid cover of a cooling module according to an embodiment corresponding to the eighth aspect of the present invention. FIG. 17 is a view showing a fluid passage in a cross section taken along line EE of FIG. 16. The invention of this embodiment is different from the invention of the second embodiment only in the shape of the fluid cover and the partition plate.
The other parts having the same configuration and operation and effect are denoted by the same reference numerals, detailed description thereof will be omitted, and different points will be mainly described.

In FIG. 16, reference numeral 118 denotes a fluid cover made of a relatively easy-to-mold material such as an aluminum alloy or a synthetic resin. The fluid cover has a fluid passage 112 connected to an inlet 19 and an outlet 20 therein. A pulse-wave-shaped partition plate 121 is provided in the portion. The fluid cover 118 is provided with a partition plate position fixing pin 123. As shown in FIG. 17, the partition plate 121 partitions the fluid passage 112 and forms several paths. The partition plate 121 is provided with a position fixing hole 124. The partition plate 121 is inserted into the position fixing pin 123 of the fluid cover 118 by inserting the position fixing hole 124 into the fluid passage 11.
The position in 2 is fixed. The height of the partition plate 121 is the same as or slightly higher than the upper surface of the fluid cover 118, so that when the heat transfer plate (not shown) is joined to the fluid cover, the partition plate 121 is also connected to the heat transfer plate. It is designed to be in a tightly joined state.

In the above embodiment, the fluid cover 11
In the fluid passage 112 in the semiconductor element 15, heat exchange occurs with heat transmitted from the semiconductor element 15 to the heat transfer plate 16, and the semiconductor element 15
Is always stably cooled. Since the partition plate arranged in the fluid passage 112 is in a state of being tightly joined to the heat transfer plate,
Heat from the heat transfer plate is easily transmitted by heat conduction, which has the effect of increasing the heat transfer area, and realizes highly efficient heat exchange. Further, since the partition plate 121 is fixed by inserting the position fixing hole 124 into the position fixing pin 123 of the fluid cover 118, solid dispersion in manufacturing is small and stable performance can be secured.

[0058]

As described above, according to the first aspect of the present invention, there is provided a semiconductor device mounted on a substrate and cooled, and a flat plate having good thermal conductivity in contact with a plane of the semiconductor device. A cooling module comprising a heat transfer plate, a fluid cover joined to the heat transfer plate and having a fluid passage, and a partition plate having good heat conductivity inside the fluid passage, wherein the heat transfer plate has a fluid passage. Since there is no flat plate shape, it is possible to select a material that emphasizes only thermal conductivity and enhance the heat transfer function, and since there is a fluid passage on the fluid cover side, various fluid passages that emphasize only the heat exchange function of fluid Can be formed, the heat transfer effect can be enhanced by the partition plate, and the cooling effect can be enhanced.

According to the second aspect of the present invention, since the semiconductor device is a central processing unit of the computer, the central processing unit which generates a large amount of heat can be sufficiently cooled, and the reliability of the computer can be improved.

The third aspect of the present invention is a cooling module in which a fluid cover is molded from a synthetic resin, and it is easy to form various fluid passages focusing only on the heat exchange action of fluid, thereby enhancing a cooling effect. be able to.

The fourth aspect of the present invention is a cooling module having a partition plate having a corrugated cross section. The heat exchange can be efficiently performed by increasing the heat transfer area.

According to a fifth aspect of the present invention, there is provided a cooling module in which a flat portion is provided in a corrugated cross section of a partition plate and a heat transfer plate is brought into contact with the flat portion, and the contact area with the heat transfer plate is increased. And efficient heat exchange can be performed.

According to a sixth aspect of the present invention, there is provided a cooling module having a substantially triangular shape in which adjacent corrugated sections of a partition plate are alternately arranged in the forward and reverse directions.
The substantially triangular bottom surface of the partition plate is in a tightly joined state with the heat transfer plate, and the heat transfer area with the heat transfer plate increases, so that heat can be exchanged more efficiently.

According to the seventh aspect of the present invention, a cooling module in which a partition plate is divided and arranged in a plurality of rows can improve a heat transfer coefficient and positively perform heat exchange.

According to the eighth aspect of the present invention, a cooling module provided with cut-and-raised portions on a partition plate can improve heat transfer coefficient and positively exchange heat.

According to the ninth aspect of the present invention, with respect to a plurality of rows of partition plates, a cooling module having a shifted cycle can improve a heat transfer coefficient and positively perform heat exchange.

According to the tenth aspect of the present invention, the cooling module having the partition plate provided with the position fixing holes and the fluid cover provided with the partition plate position fixing pins can ensure stable cooling performance.

According to the eleventh aspect of the present invention, since a liquid is used, heat exchange can be positively performed in the fluid passage.

According to a twelfth aspect of the present invention, there is provided a cooling module according to any one of the first to eleventh aspects,
A cooling system that communicates with the fluid passage of the cooling module, radiates the fluid returned from the fluid passage and sends it back to the fluid passage, and a radiator. It can be regenerated with a vessel and can always exhibit a stable cooling effect.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a cooling module according to a first embodiment of the present invention and a cooling system using the cooling module.

FIG. 2 is a plan view showing the inside of a fluid cover of the cooling module.

FIG. 3 shows the cooling module in FIG.
Sectional view taken along line AA of FIG.

FIG. 4 is a plan view showing a second embodiment of a fluid passage in a fluid cover of the cooling module.

FIG. 5 is a view in the fluid cover of the cooling module in FIG. 4;
BB line sectional view

FIG. 6 shows the cooling module in FIG. 4 in the fluid cover;
C-C section view of

FIG. 7 is a sectional view showing Embodiment 2 of a fluid passage in a fluid cover of the cooling module.

FIG. 8 is a sectional view showing Embodiment 2 of a fluid passage in a fluid cover of the cooling module.

FIG. 9 is a sectional view showing Embodiment 2 of the fluid passage in the fluid cover of the cooling module.

FIG. 10 is a sectional view showing Embodiment 2 of the fluid passage in the fluid cover of the cooling module.

FIG. 11 is a plan view showing Embodiment 3 of a fluid passage in a fluid cover of the cooling module.

FIG. 12 is a sectional view taken along line DD of FIG. 11 in the fluid cover of the cooling module.

FIG. 13 is a plan view showing a fourth embodiment of the fluid passage in the fluid cover of the cooling module.

FIG. 14 is a sectional view showing Embodiment 4 of the fluid passage in the fluid cover of the cooling module.

FIG. 15 is a sectional view showing Embodiment 4 of a fluid passage in a fluid cover of the cooling module.

FIG. 16 is a plan view showing a fifth embodiment of the fluid passage in the fluid cover of the cooling module.

FIG. 17 is a sectional view taken along line EE of FIG. 16 in the fluid cover of the cooling module.

FIG. 18 is a sectional view of a main part of a cooling device in a conventional integrated circuit element.

FIG. 19 is a perspective view of a main part of a cooling device in a conventional integrated circuit element.

[Explanation of symbols]

11 cooling module 12, 32, 42, 52, 62, 72, 82, 92, 1
02, 112, 202 Fluid passage 13 Circulation pump 14 Radiator 15 Semiconductor element 16 Heat transfer plate 18, 38, 48, 58, 68, 78, 88, 98, 1
08, 118, 208 Fluid cover 21, 41, 51, 61, 71, 81, 91, 101,
111, 121, 201 Partition plate 93, 103, 113 Cut and raised 123 Position fixing pin 124 Position fixing hole

Claims (12)

[Claims] 1. A semiconductor element mounted on a substrate and cooled, a flat heat transfer plate having good thermal conductivity in contact with a plane of the semiconductor element, and joined to the heat transfer plate, and a fluid passage is formed. A cooling module provided with a fluid cover and a partition plate having good thermal conductivity inside the fluid passage. 2. The cooling module according to claim 1, wherein the semiconductor device is a central processing unit of a computer. 3. The cooling module according to claim 1, wherein the fluid cover is formed of a synthetic resin. 4. The cooling module according to claim 1, wherein a cross section of the partition plate is wavy. 5. The cooling module according to claim 4, wherein a flat portion is provided on the corrugated cross section of the partition plate, and the heat transfer plate is brought into contact with the flat portion. 6. The cooling module according to claim 5, wherein adjacent corrugated sections of the partition plate are formed in a substantially triangular shape in which the partition plates are alternately arranged in the forward and reverse directions. 7. The cooling module according to claim 4, wherein the partition plate is divided and arranged in a plurality of rows. 8. The cooling module according to claim 4, wherein a cut-and-raised portion is provided on the partition plate. 9. The cooling module according to claim 7, wherein the cycles of the plurality of rows of partition plates are shifted. 10. The cooling module according to claim 1, wherein a position fixing hole is provided in the partition plate, and a partition plate position fixing pin is provided in the fluid cover. 11. The cooling module according to claim 1, wherein the fluid flowing through the fluid passage is a liquid. 12. The cooling module according to claim 1, which communicates with a fluid passage of the cooling module, radiates the fluid returned from the fluid passage, and returns to the fluid passage. A cooling system using a cooling module, comprising a circulating pump for sending out and a radiator.