JP2002273794A - Method for producing polymer plate conductive plate joined body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a polymer plate/conductive plate joined body in which the polymer plate and the conductive plate are joined together without using an adhesive. SOLUTION: The surfaces of the polymer plate and the conductive plate which are facing each other are subjected to activation treatment under an extremely low pressure and then joined together to obtain the polymer plate/ conductive plate joined body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a joined body of a polymer plate and a conductive plate in which a polymer plate and a conductive plate are bonded by a method without using an adhesive.

[0002]

2. Description of the Related Art Hitherto, many laminates have been proposed in which a conductive plate such as a metal thin film is laminated on a polymer plate such as a film. For example, a film in which a metal thin film is formed on a heat-resistant film represented by polyethylene terephthalate or polyimide has excellent mechanical, electrical, and thermal properties and is used for a flexible circuit board and the like.

[0003] As a method of laminating a metal foil on a film, other than a method of bonding the metal foil and the film using an adhesive,
Several methods for forming a metal thin film directly on a film have been proposed. For example, in Japanese Patent Application Laid-Open No. 11-207866, a metal thin film having a thickness of 1 μm or less is formed on a film by a thin film forming method such as ion plating and sputtering. The film thickness was increased by using the method described above.

[0004]

However, in the conventional laminating method as described above, when a relatively thick conductor such as a metal is required, a plurality of different manufacturing processes must be used together. And there are problems in terms of the time required for manufacturing and the manufacturing cost.

In view of the above technical background, the present invention provides a method for manufacturing a joined body of a polymer plate and a conductive plate in which a conductive plate having a required thickness is bonded to a polymer plate without using an adhesive. The task is to provide.

[0006]

[Means for Solving the Problems]

According to a first aspect of the present invention, there is provided a method of manufacturing an assembly of conductive plates of a polymer plate, wherein the surfaces of the polymer plate and the conductive plate facing each other are activated in a vacuum chamber, and then activated in the vacuum chamber. The polymer plate and the conductive plate were brought into contact with each other so that the treated surfaces were opposed to each other, and were superposed and cold pressed.
In this case, the activation treatment is performed by bringing the polymer plate and the conductive plate into contact with one electrode A, which is grounded, in an extremely low-pressure inert gas atmosphere of 10 to 1 × 10 ⁻³ Pa, and insulated and supported. A glow discharge is performed by applying an alternating current of 1 to 50 MHz between the electrode B and the polymer plate and the conductive plate exposed in the plasma generated by the glow discharge. It is preferable to perform the sputter etching treatment so as to reduce the thickness to 1/3 or less.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The manufacturing method of the present invention will be described below.

FIG. 1 is a schematic cross-sectional view showing one embodiment of a joined body of conductive plates of a polymer plate using the manufacturing method of the present invention.
An example in which a conductive plate 26 is laminated on one surface of a polymer plate 28 is shown. FIG. 2 is a schematic cross-sectional view showing another embodiment of the joined body of polymer plates using the manufacturing method of the present invention, and shows an example in which conductive plates 24 and 26 are laminated on both surfaces of a polymer plate 28. Is shown. FIG. 3 is a schematic sectional view of an apparatus for manufacturing a joined body of polymer plate and conductive plate used in the present invention.

In the joined body 20 of polymer plates shown in FIG. 1, a conductive plate 26 and a polymer plate 28 are laminated. Further, in the joined body of polymer plates 22 shown in FIG. 2, a conductive plate 26, a polymer plate 28 and a conductive plate 24 are laminated.

The material of the polymer plate 28 is not particularly limited as long as it can be used to manufacture a joined body of polymer plate conductive plates, and is appropriately selected depending on the use of the joined body of polymer plate conductive plates. be able to. For example, an organic polymer substance such as a plastic or a mixture of a plastic and a fiber can be used. In the case where the joined body of polymer and conductive plates is applied to a flexible printed circuit board or the like, an aromatic polyamide such as polyester such as polyimide, polyetherimide, or polyethylene terephthalate, or nylon can be used.

The plastic used as the polymer plate 28 includes, for example, acrylic resin, amino resin (melamine resin, urea resin, benzoguanamine resin, etc.), allyl resin, alkyd resin, urethane resin, liquid crystal polymer,
EEA resin (random copolymer resin of ethylene and ethyl acrylate), AAS resin, ABS resin (resin combining acrylonitrile, butadiene and styrene), A
CS resin, AS resin (styrene-acrylonitrile copolymer resin), ionomer resin, ethylene polytetrafluoroethylene copolymer, epoxy resin, silicon resin, styrene butadiene resin, phenol resin, ethylene propylene fluoride, fluorine resin, polyacetal, Polyarylate, polyamide (6 nylon, 11 nylon, 12 nylon, 66 nylon, 610 nylon, 612 nylon, etc.), polyamide imide, polyimide, polyether imide, polyether ether ketone, polyether sulfone, polyester (polyethylene terephthalate,
Polybutylene terephthalate, polyethylene naphthalate, polycyclohexynedimer terephthalate, polytrimethylene terephthalate, polytrimethylene naphthalate, etc., polyolefin (polyethylene, polypropylene, etc.), polycarbonate, polychlorotrifluoroethylene, polysulfone, polystyrene, polyphenylene sulfide, Polybutadiene, polybutene, polymethylpentene and the like can be applied.

Also, the thickness of the polymer plate 28 can be appropriately selected and used depending on the use of the conductive plate assembly.
For example, it is 1 to 1000 μm. If it is less than 1 μm, it will be difficult to produce a polymer plate, and if it exceeds 1000 μm, it will be difficult to produce a bonded body. If the use of the polymer-plate-conductive-plate assembly is a flexible printed circuit board, for example, those having a range of 3 to 300 μm can be applied.
If the thickness is less than 3 μm, the mechanical strength is poor, and
If it exceeds, the flexibility becomes poor. Preferably, 10-1
50 μm. More preferably, it is 20 to 75 μm.

The material of the conductive plate 26 is not particularly limited as long as it is a material that can be used to manufacture a joined body of polymer plate, and may be appropriately selected and used depending on the use of the joined body of polymer plate. Can be. For example, metals that are solid at room temperature (eg, Al, Ni, Cu, Ag, Pt, Au, etc.)
Or an alloy containing at least one of these metals (for example, an alloy specified in JIS) or a laminate having at least one layer of such a metal or alloy (for example, a clad material, a plating material, a deposited film material, etc.) Etc. can be applied. If the application of the polymer plate conductive plate assembly is a flexible printed circuit board, Cu, Al, N
i, Ag, or an alloy containing at least one of these metals, or a laminate having at least one layer of these metals or alloys can be used.

As an alloy specified in JIS, for example, C
For u-based alloys, oxygen-free copper, tough pitch copper, phosphorous deoxidized copper, and the like shown in JIS H 3100, JIS H 3110, JIS H 3130, etc.
Steel, brass, free-cutting brass, brass with tin, Admiralty brass, Naval brass, aluminum bronze, white bronze, etc.
For l-based alloys, the alloy numbers indicated in JIS H 4000 or JIS H 4160 are 1000 series, 2000 series, 3
Plates or foils of 000 series, 5000 series, 6000 series, 7000 series, etc. can be applied. Ni-based alloys include ordinary carbon nickel, low carbon nickel, nickel-copper alloy, nickel-copper-aluminum-titanium alloy, nickel-molybdenum alloy, nickel-molybdenum-chromium alloy, nickel-chromium-iron-molybdenum-copper alloy, A nickel-chromium-molybdenum-iron alloy or the like can be used.

Also, the thickness of the conductive plate 26 can be appropriately selected and used depending on the use of the polymer plate / conductive plate assembly. For example, it is 1 to 1000 μm. If it is less than 1 μm, it will be difficult to produce a conductive plate, and if it exceeds 1000 μm, it will be difficult to produce a joined body. If the application of the polymer plate / conductive plate assembly is a flexible printed circuit board, a relatively thin one can be used. For example, it is 1 to 150 μm. If it is less than 1 μm, the conductivity becomes poor, and
If it exceeds 0 μm, the flexibility becomes poor. Preferably, 3
１００100 μm. More preferably, 10 to 35 μm
It is. If the application of the polymer plate conductive plate assembly is a heat sink or a chassis, a thicker one can be used. For example, it is 30 to 1000 μm. If it is less than 30 μm, the mechanical strength becomes poor, and if it exceeds 1000 μm, it becomes too heavy. Preferably, it is 50 to 500 μm.

The material of the conductive plate 24 is not particularly limited as long as it can be applied to the conductive plate 26, and may be the same material as the conductive plate 26 or a different material. The thickness of the conductive plate 24 may be the same as or different from that of the conductive plate 26.

A method of manufacturing the joined body of conductive plates shown in FIG. 1 will be described. As shown in FIG. 3, the polymer plate 2 set on the rewind reel 62 in the vacuum chamber 52
8 is activated by an activation processing device 70. Similarly, the activation processing device 80 activates the conductive plate 26 installed on the rewind reel 64.

The activation process is performed as follows. That is, the polymer plate 2 loaded in the vacuum chamber 52
8. The conductive plate 26 is brought into contact with one of the electrodes A grounded to ground, and 10
An electrode A exposed to plasma generated by the glow discharge by applying an alternating current of 1 to 50 MHz in an ultra-low pressure inert gas atmosphere of preferably ~ 1 x ^10-3 Pa, preferably argon gas, to cause glow discharge. The area of each of the polymer plate 28 and the conductive plate 26 in contact with the electrode B is equal to or less than 1/3 of the area of the electrode B, and is subjected to sputter etching. If the inert gas pressure is less than 1 × 10 ⁻³ Pa, stable glow discharge is difficult to perform, and high-speed etching is difficult. If the inert gas pressure exceeds 10 Pa, the activation treatment efficiency decreases. When the applied alternating current is less than 1 MHz, it is difficult to maintain a stable glow discharge and continuous etching is difficult. When the applied alternating current exceeds 50 MHz, oscillation is liable to occur and the power supply system is complicated, which is not preferable. In addition, in order to perform etching efficiently, the area of the electrode A needs to be smaller than the area of the electrode B. When the area is set to 1/3 or less, etching can be performed with sufficient efficiency.

After that, the activated polymer plate 28 and the conductive plate 26 are brought into contact with each other such that the surfaces subjected to the activation treatment are opposed to each other so as to be overlapped with each other.
And cold welding. Bonding at this time is possible at a low temperature and a low rolling reduction, and it is possible to reduce or eliminate adverse effects such as a structural change and breakage on the polymer plate, the conductive plate and the bond. Using the method of the present invention, T
Is the temperature (° C.) of the polymer plate and the conductive plate, and R is the rolling ratio (%), a good pressure contact state is obtained when 0 <T ≦ 300 and 0.1 ≦ R ≦ 30. If the temperature is lower than 0 ° C., a special refrigerating device is required. If the rolling reduction is less than 0.1%, sufficient bonding strength cannot be obtained, and if it exceeds 30%, adverse effects such as breakage occur. Preferably, 0.5 ≦ R ≦ 10.

By joining as described above, the joined body of polymer plate and conductive plate 20 can be formed, and wound up by the winding roll 66. In this manner, the joined body of polymer plate and conductive plate 20 shown in FIG. 1 can be manufactured.

Next, the joined body of polymer plate and conductive plate shown in FIG.
In the above description, it is possible to similarly manufacture the polymer plate conductive plate assembly 20 having a conductive plate on one surface instead of the polymer plate 28 by using the conductive plate 24 instead of the conductive plate 26.

The thus-prepared joined body of polymer plates and conductive plates may be subjected to a heat treatment, if necessary, for removing or reducing residual stress of the conductive plate. For example, when the conductive plate is made of copper, the residual stress can be sufficiently reduced at about 250 to 300 ° C. × 1 hour. During this heat treatment, a harmful gas (for example, oxygen) which may cause a decrease in bonding strength may permeate the polymer plate. Therefore, the heat treatment is preferably performed in a vacuum or in a reduced pressure or in a reducing atmosphere. preferable.

If the thickness or hardness of the polymer plate or the conductor is not suitable for the production using a roll, a batch treatment can be used. In a vacuum chamber, a plurality of polymer plates or conductive plates cut in advance to a predetermined size were loaded, transported to the activation processing unit, and the surfaces to be processed at appropriate positions such as vertical or horizontal were opposed or juxtaposed. If the device that holds or holds the polymer plate or conductive plate also serves as a press-contact device, it is placed or grasped and fixed in the state, etc., and performs the activation process. When the device for holding the molecular plate or the conductive plate does not double as the pressure contact device, it can be achieved by carrying the pressure plate to a pressure contact device such as a press device.

Further, the joined body of polymer plate is cut out to an appropriate size as necessary, and the conductive plate of the joined body of polymer plate is subjected to etching or the like to form a circuit pattern to obtain a circuit board. Can be. Therefore, it can be applied to printed wiring boards (rigid printed wiring boards, flexible printed wiring boards, etc.), IC cards, CSP
(A chip size package or a chip scale package) or an IC package such as a BGA (ball grid array). In particular, in the case of a joined body of a polymer plate and a conductive plate having conductive plates on both sides, a more complicated circuit is formed by performing processing such as a through hole and securing conduction on both sides using an appropriate method such as plating. be able to.

In the case of a polymer-plate conductive plate assembly having conductive plates on both surfaces, circuit wiring is provided on one surface, and the other surface is used as a shield plate for use as an electrostatic shield, used as a chassis, or used as a heat sink or ground. can do. Further, the polymer plate conductive plate assembly itself having a conductive plate on one side can be used as a shield plate for an electrostatic shield or the like, used as a chassis, or used as a heat sink or a ground. Further, if necessary, a mechanical processing such as a bending processing may be performed on the joined body of polymer and conductive plates.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments will be described below with reference to the drawings.
Example 1 A 45 μm-thick polyimide film was used as the polymer plate 28, and a 39 μm-thick copper foil was used as the conductive plate 26. The polyimide film and the copper foil are set in the apparatus for manufacturing a joined body of polymer plate and conductive sheet, and the polyimide film rewound from the rewind reel 62 and the copper foil rewound from the rewind reel 64 are cooled with water in the vacuum device 52. They were wound around the electrode rolls 72 and 82, respectively, and activated in the activation units 70 and 80 by sputter etching. Next, the activated polyimide film and the copper foil are brought into contact with each other with the activated surfaces contacted by the pressing unit 60 and overlapped, cold pressed at a rolling rate of 0.5%, and taken up by the take-up roll 66. A polymer conductive plate joined body 20 was manufactured.

(Embodiment 2) The polymer plate 28 has a thickness of 60
A 40 μm thick copper foil (JIS H 3100 alloy number: C1020,
Oxygen-free copper) was used. The liquid crystal polymer film and the copper foil are set in the apparatus for manufacturing a conductive plate assembly of a polymer plate, and the liquid crystal polymer film unwound from the rewind reel 62 and the copper foil unwound from the rewind reel 64 are vacuum-mounted.
2 are wound around the water-cooled electrode rolls 72 and 82, respectively.
Activation processing was performed in the activation processing units 70 and 80 by sputter etching. Next, the activated liquid crystal polymer film and the copper foil are connected to the pressure welding unit 6.
At 0, the activated surfaces were brought into contact with each other and overlapped with each other, cold-pressed at a rolling rate of 3%, and wound up with the winding roll 66 to produce the joined body of polymer conductive plates 20.

(Embodiment 3) The polymer plate 28 has a thickness of 25.
μm polyester film, conductive plate 2
6 is a copper foil of 40 μm thickness (JIS H 3100 alloy number:
C1020, oxygen-free copper). The polyester film and the copper foil are set in the polymer plate conductive plate assembly manufacturing apparatus, and the polyester film unwound from the rewind reel 62 and the copper foil unwound from the rewind reel 64 are
They were wound around water-cooled electrode rolls 72 and 82 in the vacuum device 52, respectively, and were activated in the activation units 70 and 80 by sputter etching. Next, the activated polyester film and the copper foil are brought into contact with each other with the activated surfaces contacted by the pressing unit 60 and superposed, cold pressed at a rolling rate of 1%, and taken up by the take-up roll 66. The conductive plate joined body 20 was manufactured.

(Embodiment 4) The polymer plate 28 has a thickness of 60
A 40 μm-thick aluminum foil (JIS H 4160 alloy number: 1085) was used as the conductive plate 26 using a liquid crystal polymer film of μm. The liquid crystal polymer film and the copper foil are set in the apparatus for manufacturing a joined body of polymer plate and conductive plate, and the liquid crystal polymer film unwound from the rewind reel 62 and the copper foil unwound from the rewind reel 64 are evacuated.
2 are wound around the water-cooled electrode rolls 72 and 82, respectively.
Activation processing was performed in the activation processing units 70 and 80 by sputter etching. Next, the activated liquid crystal polymer film and the copper foil are connected to the pressure welding unit 6.
At 0, the activated surfaces were brought into contact with each other and overlapped with each other, cold-pressed at a rolling rate of 2%, and wound up by the winding roll 66 to produce the joined body of polymer conductive plates 20.

[0031]

As described above, according to the method of manufacturing a joined body of polymer plates and conductive plates of the present invention, the surfaces of the polymer plate and the conductive plate facing each other are activated, and then the activated surfaces are opposed to each other. It is formed by cold contacting at a low rolling rate by abutting and overlapping. For this reason, an adhesive is not used, and further reduction in weight and thickness can be achieved, and application to an IC package, a heat sink, or the like is also suitable. In addition, since a conductive plate having a required thickness can be used, the process is simplified, and manufacturing costs can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing one embodiment of a joined body of conductive plates using a production method of the present invention.

FIG. 2 is a schematic cross-sectional view showing another embodiment of the joined body of conductive plates using a production method of the present invention.

FIG. 3 is a schematic view of an apparatus for manufacturing a joined body of polymer plate and conductive plate used in the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 20 polymer plate conductive plate joined body 22 polymer plate conductive plate joined body 24 conductive plate 26 conductive plate 28 polymer plate 52 vacuum tank 60 pressure contact unit 62 rewind reel 64 rewind reel 66 take-up roll 70 activation processing device 72 Electrode roll 74 Electrode 80 Activation device 82 Electrode roll 84 Electrode A Electrode AB Electrode B

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shinji Osawa 1296-1, Higashi-Toyoi, Kudamatsu City, Yamaguchi Prefecture Toyo Kohan Co., Ltd. F-term (reference) 4F100 AB17B AB17C AB33B AB33C AK01A AK49A AR00B AR00C BA02 BA03 BA06 BA10A BA10B BA10C EJ15B EJ15C EJ151 EJ202 EJ591 EJ60A EJ60B EJ60C EJ601 EJ61A EJ61B EJ61C EJ611 GB41 GB43 GB43 JG01B JG01C JL02 JL03 4F211 AD03 AD05 AD08 A32 AH33 AH36 AM27 T02A03 TH02 A03 TH02 A03 CA63 CA65 DA02 DA12 DA18 EA06 EB41 EC21 ED09 EE21 FA12 FB02 FB12 FC11

Claims (2)

[Claims] 1. A polymer plate and a conductive plate which are opposed to each other in a vacuum chamber are subjected to an activation treatment. Then, the polymer plate and the conductive plate are contacted with each other so that the activated surfaces in the vacuum tank face each other. A method of manufacturing a joined body of polymer plates, comprising joining a polymer plate and a conductive plate, wherein the conductive plates are brought into contact with each other, overlapped, and cold-pressed. 2. The method according to claim 1, wherein the activation treatment is performed at 10 to 1 × 10 ⁻³ Pa.
In an extremely low-pressure inert gas atmosphere, the polymer plate and the conductive plate are brought into contact with one electrode A grounded, and an alternating current of 1 to 50 MHz is applied between the electrode A and the other electrode B that is insulated and supported. Performing a glow discharge, and performing a sputter etching process so that the area of each of the polymer plate and the conductive plate exposed in the plasma generated by the glow discharge is 1/3 or less of the area of the electrode B. Claim 1.
3. The method for producing a polymer plate / conductive plate joined body according to item 1.