JP2002270859A - Photoelectric device package and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a package for a photoelectric element capable of forming a wiring pattern with high dimensional accuracy, low dust generation, and low cost when a photoelectric element such as an optical sensor is mounted, and a method of manufacturing the same. SOLUTION: A stamper master 19 serving as a prototype of a base 1 is provided.
Are subjected to nickel plating 27 to form stampers 17 and 37 for injection molding, and grooves 47, 48; 51 and 52 are formed in the element mounting surface 6 and the opposing surface 6a by injection molding.
After copper plating 56 is applied to the surface of the substrate 1 including the grooves 47, 48; 51, 52, the plated element mounting surface 6 and the opposing surface 6a are polished, and the conductive material in the grooves 47, 48; Is classified.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photoelectric device package for mounting a photoelectric device such as an optical sensor and a method of manufacturing the same.

[0002]

2. Description of the Related Art In a prior art, when a small optical sensor having a plane dimension of 10 mm square or less is mounted on a circuit board or the like, conventionally, a photolithography method based on a printed wiring board or a polyimide film material is used. A configuration is used in which a resin for fixing an optical system is attached to a flexible wiring board on which a circuit has been formed.

In another prior art, there is a configuration in which a metal circuit is sintered on a ceramic substrate to obtain a ceramic wiring board, but it is difficult to achieve optical dimensional accuracy at low cost.

[0004] In still another prior art, the literature (ECTC
98-097, P1109) describes a configuration in which a CMOS image sensor chip is mounted with a light receiving surface facing a glass substrate. This configuration is based on TOG (TAB On Gl
(Ass) Module, a lead wire is formed on the front surface, a TAB tape coated with an ultraviolet curing adhesive on the back surface is attached to a glass substrate, and the adhesive is cured by ultraviolet irradiation, and then the lead wire A configuration is employed in which the paste is cured by heating and pressing with an anisotropic conductive paste (ACP) interposed between the sensor chip and the sensor chip.

[0005]

In these prior art wiring boards, since wiring patterns are formed by photolithography, complicated processes such as resist coating, mask exposure, resist removal, etching, and resist removal are performed. In addition, waste liquid treatment also increases costs.

SUMMARY OF THE INVENTION An object of the present invention is to provide a photoelectric device package capable of forming a wiring pattern with high dimensional accuracy and low cost when a photoelectric device such as an optical sensor is mounted, and a method of manufacturing the same.

[0007]

SUMMARY OF THE INVENTION The present invention comprises a substrate having an element mounting surface on which a photoelectric element is mounted, an opposing surface facing the element mounting surface, and a light introducing through hole penetrating the element mounting surface from the opposing surface. A groove is formed in the element mounting surface and / or the opposing surface, and a wiring conductor is formed in the groove.

According to the present invention, a groove is formed on the element mounting surface or the opposing surface, and a wiring conductor is formed in the groove.
The fixing strength of the wiring conductor is improved. In addition, since the wiring conductor can be formed to a desired thickness in accordance with the depth of the groove, a wiring pattern having a higher aspect ratio than the conventional etching method can be formed, thereby reducing the electric resistance. It is planned.

Further, the present invention is characterized in that a through hole is formed in the base to connect the element mounting surface and the opposing surface, and a wiring conductor is formed in the through hole.

According to the present invention, by forming a through-hole connecting the element mounting surface and the opposing surface and forming a wiring conductor in the through-hole, external connection terminals can be arranged on the opposing surface. The degree of freedom in design increases.

Further, the present invention is characterized in that a half-divided through hole is formed on the side surface of the base to connect the element mounting surface and the opposing surface, and a wiring conductor is formed in the through hole.

According to the present invention, a half through hole is formed in the side surface of the base to connect the element mounting surface and the opposing surface,
By forming the wiring conductor in the through hole, the external connection terminals can be arranged on the opposing surface and the side surface, and the design flexibility of the connection land is increased.

The half-through hole is not limited to a semi-circular cross-sectional shape, but also includes a rectangular shape, a circular arc, a D-shape, and a shape lacking a part of the circumference.

Further, according to the present invention, a side surface groove is formed on the side surface of the base body so as to communicate with the groove of the element mounting surface.
A wiring conductor is formed.

According to the present invention, the external connection terminals can be arranged on the side surface of the base by forming the side groove communicating with the groove of the element mounting surface on the side surface of the base and forming the wiring conductor in the side groove. .

Further, the present invention is characterized in that the depth of the side groove is in a range of 2 to 10 times the depth of the groove on the element mounting surface.

According to the present invention, the wiring conductor on the side surface can be formed to a sufficient thickness by setting the depth of the side surface groove to a range of 2 to 10 times the depth of the groove on the element mounting surface. The strength of the external connection terminal is significantly improved. Therefore, the connection process with the wiring board is stabilized, and the connection strength is improved.

Further, the present invention is characterized in that the wiring conductor is formed by metal plating. According to the present invention, by forming a wiring conductor by metal plating, a wiring conductor having a sufficient thickness and requiring high dimensional accuracy can be reduced in line width variation (for example, tolerance ± 1 μm), with good yield, in a short time. It can be realized at low cost.

Further, the present invention is characterized in that the substrate is made of a thermosetting resin having low dust generation. Further, the present invention is characterized in that the base is made of a thermoplastic resin having low dust generation.

According to the present invention, the thermosetting or thermoplastic synthetic resin constituting the substrate has low dusting properties, whereby a fine wiring conductor can be reliably formed.

According to the present invention, there is provided a package for a photoelectric element, comprising: a base having an element mounting surface on which the photoelectric element is mounted, an opposing surface facing the element mounting surface, and a light introducing through hole penetrating the element mounting surface from the opposing surface. In a manufacturing method, a mold having a stamper having a first convex portion corresponding to a wiring pattern on an element mounting surface and / or a facing surface and a second convex portion for forming a light introduction through hole is attached to a mold. Forming a substrate having a groove corresponding to the wiring pattern and a recess corresponding to the light introducing through-hole by injecting and injecting a resin, and plating a conductive material on an element mounting surface and / or a facing surface of the substrate. Applying, polishing the plated element mounting surface and / or the opposing surface to separate the conductive material in the groove, and punching out the bottom of the recess corresponding to the light introducing through hole to form the light introducing through hole. Forming process It is a manufacturing method of a photoelectric element package, which comprises a.

Further, the present invention includes a base having an element mounting surface on which the photoelectric element is mounted, an opposing surface facing the element mounting surface, and a light introduction through hole penetrating the element mounting surface from the opposing surface.
A wiring conductor is formed in the groove.

According to the present invention, a substrate made of a material such as an electrically insulating synthetic resin is provided with a fine groove corresponding to a wiring pattern and a light introducing through hole having a different dimension and shape such as depth from the groove. The recess to be formed can be manufactured by injection molding using the same stamper and the first and second projections formed on the stamper.
The above-mentioned fine grooves are, for example, 10 μm in width and 25 μm in depth.
It may be.

According to the present invention, a groove is formed on at least one of the element mounting surface and the opposing surface of the substrate, and after the conductive material is plated, the plated surface is polished and the conductive material in the groove is polished. The wiring pattern can be formed with high dimensional accuracy, low dust generation, and low cost.

Further, by forming the wiring conductor in the groove, the fixing strength of the wiring conductor is improved. Further, since the wiring conductor can be formed to a desired thickness in accordance with the depth of the groove, a wiring pattern having a larger thickness than the conventional etching method can be formed, thereby reducing the electric resistance and improving the reliability. Is achieved.

Here, the photoelectric element is a photodiode, CC
A light-receiving element having a one-dimensional or two-dimensional light-receiving surface, such as a D (charge-coupled element) element or a CMOS image sensor, or a light-emitting element such as a semiconductor laser element, an EL (electric field luminescence) element, or a light-emitting diode.

This package can also be used for mounting components such as a SAW (surface acoustic wave) filter.

[0028] The present invention also provides a step of forming a photoresist layer having a hole corresponding to the first convex portion on a substrate by photolithography, a photoresist layer, and a substrate exposed from the hole. Forming a metal plating layer having a thickness that closes the through-hole with the plating metal by applying metal plating on the metal plating layer, a step of peeling the formed metal plating layer from the substrate, and a step of peeling the metal plating layer. Deep-drawing the metal plating layer corresponding to the second convex portion to manufacture the stamper for injection molding.

Further, the present invention is characterized in that the second convex portion of the stamper is formed to be inclined so as to taper toward an injection molding space into which the resin is injected.

According to the present invention, the first projection of the stamper is
It functions to form fine grooves in the base corresponding to the wiring pattern. Such fine first projections can be formed by photolithography. Thereafter, the stamper is subjected to deep drawing by a mechanical method such as pressing, whereby a second convex portion having a size and shape larger than the first convex portion corresponding to the light introduction through hole can be formed on the stamper. Therefore, it is easy to form the second convex portion for forming the concave portion corresponding to the light introducing through hole having a larger size and shape than the fine groove on the stamper made of the metal plating layer by deep drawing. In a configuration in which the stamper having the second convex portion is disposed on the facing surface of the base to be injection-molded, the light introducing through-hole is formed narrower from the facing surface toward the element mounting surface. In another embodiment of the present invention, the base may be injection-molded using a stamper on the element mounting surface of the base. In this configuration, the second convex portion, and thus the light introduction through hole, is opposed to the element mounting surface. It is formed thinner toward the surface. The angle of the tapered portion of such a light introducing through-hole may be in a range of 10 ° to 80 ° based on the element mounting surface. In another embodiment of the present invention, the light introduction through-hole may be perpendicular to the element mounting surface. The element mounting surface and the opposing surface of the base may be formed in parallel. The axis of the light introducing through hole having this tapered portion is perpendicular to the element mounting surface and the opposing surface.

In another embodiment of the present invention, a fine groove corresponding to the wiring pattern may be formed in the tapered portion of the light introducing through hole. In this configuration, the light introduction through-hole has a truncated conical shape, thereby facilitating the polishing operation for separating the conductive material in the fine groove.

Using the second convex portion of the stamper, a relatively large recess corresponding to the light introducing through-hole is formed in the base, and thereafter, a punching or laser cutting work process for forming the light introducing through-hole is facilitated. Can be done.

According to the present invention, manufacturing a stamper requires a plurality of steps as described above. After manufacturing the stamper, injection molding is performed using a mold having the stamper. This makes it easy to mass-produce the substrate, and makes it possible to produce a substrate with excellent mass productivity.

Further, according to the present invention, a through hole or a side surface groove is formed on the substrate facing the element mounting surface or the opposing surface, and the stamper has a third convex portion corresponding to the through hole or the side surface groove. Features.

According to the present invention, a through-hole which is a through hole connecting the element mounting surface of the base and the opposing surface, and a half through hole formed in the side surface of the base and connecting the element mounting surface and the opposing surface. Alternatively, a stamper having a third protrusion corresponding to a side groove formed on the side surface of the base and communicating with the groove of the element mounting surface is formed, and the base is injection-molded using this stamper. The recess corresponding to the through hole or the side groove thus formed in the base body is perforated by punching or using a small drill or a laser drill, or a bottomed hole is formed.

[0036]

FIG. 1 is a cross-sectional view of an unfinished package 14 during a manufacturing process according to an embodiment of the present invention. FIG. 2 illustrates the package 15 of the present invention.
FIG. FIG. 3 shows the package 1 shown in FIG.
FIG. 5 is a cross-sectional view showing a mounting state of No. 5; On the element mounting surface 6 of the package 15, the light receiving element 11 is made of an anisotropic conductive paste (for example, XAP series manufactured by Toshiba Chemical Co., Ltd.) or an anisotropic conductive film (for example, FP232 manufactured by Sony Chemical Co., Ltd.)
2D).

FIG. 4 is a perspective view of the package 15 according to one embodiment of the present invention as viewed from above in FIG. 2, and FIG. 5 is a perspective view of the package 15 as viewed from below in FIG. A method of manufacturing the package 15 shown in FIGS. 2 to 5 will be described with reference to FIGS. 6 to 19 and FIG. One stamper 17 used for manufacturing the package 15 of the present invention is manufactured by the photolithography method shown in FIGS. First, referring to FIG. 6, a photoresist layer 19 having a thickness of, for example, 25 μm is uniformly applied on a flat surface of glass substrate 18. Next, as shown in FIG. 7, using a photomask 20, light 23 from an exposure light source is irradiated through through-hole regions 21 and 22 formed in the photomask 20, and the photoresist layer 19 is selected. Exposure. Next, as shown in FIG. 8, the through-hole regions 21 and 22 of the photoresist layer 19 are formed.
Are exposed and removed to form through holes 24 and 25. Further, a complicated shape can be obtained by repeating the resist process.

Next, as shown in FIG. 9, in order to apply metal plating on the developed photoresist layer 19, the conductive film 2 is formed.
6 are formed. This conductive film 26 is formed of, for example, a Ni sputter film (indicated by + in FIG. 9), and its thickness may be, for example, 600 to 2000 °. Next, as shown in FIG.
And the substrate 18 exposed from the through holes 24 and 25 are plated with metal such as Ni through a conductive film 26.
A metal plating layer 27 is formed. The metal plating layer 27 has a thickness d1 for closing the through holes 24 and 25 with the plating metal Ni. This thickness d1 is, for example, 0.1 to 0.3 mm.
It may be. In addition, a polishing step for obtaining surface smoothness is also used.

The metal plating layer 27 thus obtained is peeled from the glass substrate 18 as shown in FIG. A part of the photoresist layer 19 remaining on the metal plating layer 27 is removed. After that, a step of removing the Ni sputtered film may be inserted. In this manner, the metal plating layer 27 in which the part 19a of the photoresist layer 19 has been removed and thus cleaned is obtained as shown in FIG. The metal plating layer 27 has first convex portions 28 and 29 corresponding to the above-described through-hole regions 21 and 22. Thereafter, it is preferable to remove the Ni sputtered film in order to prevent cracking and peeling.

The metal plating layer 27 obtained as shown in FIG. 12 is subjected to deep drawing as shown in FIG. The second convex portion 31 has a flat top 3
2 and the periphery of the top portion 32, and the first convex portions 28, 2
9 has an inclined portion 34 connected to a flat support portion 33 on which is formed. Thus, the metal plating layer 27 shown in FIG.
The one stamper 17 is manufactured by the forging plastic working of.

FIG. 14 is a sectional view showing the other stamper 37. The stamper 37 can be manufactured by a photolithography method or a plating method in the same manner as the stamper 17 described above. The first protrusion 3 is also provided on the stamper 37.
8, 39 are formed. In another embodiment of the present invention,
The stamper 37 may be formed with a larger convex portion by forging plastic working such as deep drawing.

One stamper 17 shown in FIG.
Injection molding is performed using the other stamper 37 shown in FIG.

FIG. 15 is a sectional view of a mold apparatus 41 for performing injection molding using a pair of stampers 17 and 37. One stamper 17 is supported by one mold body 42, the other stamper 37 is supported by the other mold body 43,
Injection molding space 44 is provided between these mold bodies 42 and 43.
Another mold body 45 is formed. The second convex portion 31 formed on the stamper 17 is inclined so as to be tapered toward the injection molding space 44 into which the molten resin is injected, that is, downwardly in FIG. Formed. The resin used for injection molding is
For example, thermosetting resins and thermoplastic resins, epoxy resin, polyimide resin, A
Examples include BS resin and polymethylpentene. As the resin, a resin having high adhesion of Cu plating is preferable.

Thus, as shown in FIG. 16, an injection molded base 1 is obtained. The base 1 has fine grooves 47 and 48 formed corresponding to the first protrusions 28 and 29 formed on the one stamper 17, and has a relatively large dimensional shape corresponding to the second protrusion 31. It has a recess 49. The base 1 also includes the first convex portion 3 of the other stamper 37.
It has fine grooves 51 and 52 corresponding to 8,39.

In the base 1 shown in FIG. 16, through holes 53 and 54 are formed by using a laser beam or a small drill as shown in FIG. The through holes 53 and 54 connect the element mounting surface 6 and the opposing surface 6a.

In summary, for example, a photoresist 19 is applied to a glass substrate 18, and then a Ni plating 27 is applied to a stamper master formed by using a photolithography method, and Ni is peeled off to form a stamper 17 for injection molding. I do. The stamper 17 is attached to a mold, heated resin is injected and cooled, whereby fine concave grooves 47, 48; 51, 52 are formed on the surface of the base 1 and a concave portion 49 having a taper is formed. . By using such an injection molding method, it is possible to finish the resin surface smoothly, and it is easy to suppress dust generation from the resin surface.

As the resin, thermal expansion coefficient α = 10 to 20 p
By using a thermosetting resin having a low thermal expansion coefficient of about pm, a substrate requiring high dimensional accuracy, such as for an optical sensor, can be formed.

As shown in FIG. 18, the base 1 shown in FIG. 17 is plated with metal as a conductive material over the element mounting surface 6 and the opposing surface 6a to form a plating layer 56. In order to prevent the plating layer 56 from being formed in the recess 49, a resist layer 57 made of a synthetic resin is provided before plating. The plating layer 56 fills the fine grooves 47 and 48; 51 and 52 and the through holes 53 and 54. The base 1 shown in FIG. 18 is formed by injection molding in the same manner as in FIG. 15 described above, in which a plurality of bases 1 are arranged adjacent to each other in a matrix, and then, as shown in FIGS. The so-called multi-piece substrate is obtained in which the layer 56 is formed and then divided into individual single substrates.

Next, as shown in FIG. 19, the plating layer 56 on the opposing surface 6a is polished flat so that the plating metal in the grooves 47 and 48 is exposed, and the opposing surface 6a separates the grooves 47 and 48 into respective grooves. Polishing work is performed to separate them. The plating layer 56 is removed so that the side surface 59 of the base 1 becomes a flat surface. From the recess 49, the resist layer 57 shown in FIG.
Is removed.

Thereafter, the opposing surface 6 is polished so that the plating metal filled in the grooves 51 and 52 on the element mounting surface 6 of the base 1 is exposed and separated from the element mounting surface and is separated. The illustrated plating layer 56 is removed. Thus, the unfinished package 14 shown in FIG. 1 is obtained. Metals are plated on the inner walls of the through holes indicated by reference numerals 53 and 54 in FIGS. 17 to 19 and are indicated by reference numeral 3 in FIG. The plating metal buried in the grooves 47 and 48 in the facing surface 6a shown in FIGS. 16 to 19 is indicated by the connection pad 4 in FIG. Further, FIG.
Grooves 51, 5 formed in element mounting surface 6 shown in FIG.
2 are metal wirings 2 shown in FIG.
Indicated by

In summary, following FIG. 17, metal (for example, gold, silver, copper, nickel, etc.) and metal (for example, gold, silver, copper, nickel, etc.) are formed so that the concave grooves 47, 48; Perform alloy plating. Further, the surface of the substrate 1 is polished to remove the metal on the surface of the substrate other than the groove, whereby the metal in the groove is individually divided, and a wiring pattern having a desired thickness and width can be obtained. In the case of multi-face individual production, after forming four sides using a mold, electrolytic Ni / Au plating is performed. After chip mounting, individualization results in a configuration excellent in handling. With such a method, it is not necessary to use a conventional exposure method, so that the process can be simplified, the manufacturing time (tact time) can be reduced,
The cost can be significantly reduced.

Further, since the front and back surfaces of the base 1 can be polished almost in parallel, when the chip such as the light receiving element 11 is adhered to one side and the cover glass 8 is adhered and fixed to the opposite side, the chip 11 and the cover It is easy to keep the parallelism with the glass 8 sufficiently.

Further, through holes 53 and 54 connecting the front and back surfaces of the base 1 are formed.
By forming the wiring conductor on the inner surface of the wiring 54, the degree of freedom in designing the arrangement of the external connection terminals is increased. Also 5 through holes
3, 54 may be formed at the time of injection molding, or may be additionally processed with a drill or the like after injection molding.

As a method for connecting the chip such as the light receiving element 11 to the base, a flip chip connection method can be used.

When a wiring pattern is formed on the surface or inside of the base 1 as described above, a package 15 having a desired shape can be obtained only by simple steps such as precision injection molding, plating, polishing, drilling, and die processing. Can be Further, since a plurality of bases 1 are simultaneously manufactured by one-step injection molding, and batch processing by so-called multi-cavity, which is a manufacturing method in which each base 1 is individually punched, is easy, mass productivity is excellent.
A package for a photoelectric device can be manufactured with high dimensional accuracy, low dust generation, and low cost.

The manufacturing process of the package 15 is further described as follows. First, the stamper master 19 manufactured by using the photolithography method is plated with nickel to form the stampers 17 and 37 for injection molding. The stampers 17 and 37 are attached to a mold, and heated resin is injected and cooled, so that a pitch of 10 μm
A fine concave processing of about 1 mm is performed.

A recess 4 is provided around the device.
9 forms a light introducing through-hole 61 having a taper angle θ1 of 10 ° to 80 ° with respect to the element mounting surface 6. Irregular reflection of light is reduced on the inner surface of the light introducing through hole 61 having such a tapered shape, which contributes to reduction of stray light especially when a light receiving element is mounted.

As the resin constituting the base 1, α = 10
By using a thermosetting resin having a low coefficient of thermal expansion of about 20 ppm and a low dusting property (for example, an epoxy resin (plating grade) manufactured by Mitsui Chemicals, Inc.), a substrate for optical use having high dimensional accuracy can be formed. . 3μ with low dust generation
It means that the amount of dust of about φ is 10 particles / cm ² or less. Also, polyether sulfone (PES),
A thermoplastic resin having a high glass transition temperature, such as a thermoplastic polyimide resin or an ABS resin, can also be used as the material of the heat-resistant base 1.

The thickness of the substrate 1 is not particularly limited, but the present invention can be applied to a substrate as thin as 1 mm or less.

The cross-sectional shapes of the concave grooves 47, 48; 51, 52 can be formed into, for example, rectangles, semicircles, etc., and the dimensional tolerance of the groove processing can be realized with a high precision of 1 μm.

Further, using laser processing and drill processing,
By forming through holes 53 and 54 in the base 1 and providing wiring conductors on the inner surfaces thereof, electrical connection between the front and back of the base 1 becomes possible. Therefore, the degree of freedom in arranging the wiring patterns and the external connection terminals increases, which contributes to the degree of freedom in designing a device such as a digital camera.

For example, through holes 53 and 54 for conducting both surfaces of the substrate are formed by using a 0.3 mm diameter drill, and then concave grooves 47 and 48; 51 and 52 on the surface of the substrate.
Then, a copper pattern having a predetermined width and thickness can be obtained by removing the metal other than the concave grooves by performing copper plating with a thickness of 10 to 100 μm so as to fill the gap and polishing the surface of the substrate 1.

Further, by performing a punching process using a mold, a diameter of 0.3 to 3 mm is provided as an optical system mounting guide.
A rectangular window 62 having a side of about 3 to 15 mm can be formed as a hole or a light receiving element mounting portion. At this time, in-plane positional deviation of the punching process can achieve high accuracy within 50 μm.

After that, the excess metal 56 formed in portions other than the grooves 47, 48; 51, 52 is removed by a bad rotary polishing method using a slurry containing a copper etching solution and abrasive powder. The metal is divided and the flat surface 6 of the base 1
For example, the wiring patterns 2 and 4 having a width of 5 to 500 μm, a width tolerance of 1 μm, and a thickness of about 5 to 95 μm can be obtained in 6a.

The metal plating formed on the inner surface of the light introducing through-hole 61 without using the resist layer 57 shown in FIG. 18 may be left as it is if the performance of the element is not adversely affected. By leaving the electrical connection, it is also possible to form a layer of gold or nickel on the metal plating. If a fine groove is formed in the tapered portion of the light introduction through hole, the wiring conductor can be formed by metal plating. By polishing and removing the plating layer other than the groove, a wiring pattern is formed in the same manner.

As an advantage of using the stampers 17 and 37, the cross-sectional structure of a portion to be a circuit by the stampers 17 and 37 is designed to be rectangular, and the grooves 47, 48;
By using copper plating for the metal plating embedded in the first and the second wiring 52, a low-resistance wiring pattern having a substantially rectangular cross section can be formed. Further, it is easy to set the processing tolerance of the copper wiring width to about 1 μm by the stamper method. As a result, it is possible to obtain a copper wiring having a high density wiring and a small characteristic impedance tolerance.

Instead of the metal plating embedded in the concave groove, it is also possible to embed a resin made of a paste or a sol-gel material or an optically transparent resin. High density, etc.
It is also applicable as a high integration method.

Since the front and back surfaces 6, 6a of the base 1 in which the metal is embedded in the concave grooves can be polished almost in parallel, a chip such as the light receiving element 11 is provided on one surface 6 and a cover glass is provided on the opposite surface. When fixed by bonding, it is easy to keep the parallelism between the chip 11 and the cover glass 8 sufficiently high.

When the light receiving element 11 is provided on the element mounting surface 6, if dust is generated from the base 1, it may adhere to the light receiving surface 12 and generate a dark spot. As a countermeasure, select a resin that does not easily generate burrs or flakes due to physical processing, etc., or select a resin that can be easily removed by desmear treatment such as potassium permanganate even if burrs or flakes are generated It is important to. In this regard, an epoxy resin is preferable. When a filler is mixed into the resin, the degree of adhesion and the like are taken into consideration so that dust is not easily generated.

As a method for mounting a chip such as the light receiving element 11 on the base 1, a wire bonding method or a flip chip connection method can be applied. In the flip chip connection method, bump bonding is used. As a type of the bump bonding, an Sn-Pb-based solder bonding or an Au-Sn bonding is preferable, and particularly when high reliability is required, an Au-Au bonding is preferable.

In order to increase the bonding strength of the chip 11, the reliability of the element is improved by impregnating the bonding portion with an underfill such as an epoxy resin or by performing a resin coating to provide moisture resistance.

When the base 1 is mounted on the circuit board of the apparatus main body, a solder connection or a bump connection method can be used.

As described above, when forming a wiring pattern on the surface or inside of the base 1, a package 15 having a desired shape can be obtained only by simple steps such as precision injection molding, plating, polishing, drilling, and die processing. Can be In addition, since batch processing by multi-cavity is easy, it is possible to manufacture a photoelectric element package with excellent mass productivity, high dimensional accuracy, low dust generation, and low cost.

(Embodiment 1 of FIGS. 1 to 19) A stamper master 19 serving as a prototype of the base 1 was prepared by applying a photoresist to a glass substrate, for example, and then using photolithography.

A nickel plating 27 is formed on the stamper mask.
To form stampers 17 and 37 for injection molding.

This stamper is mounted on the dies 42, 43, 45. As shown in FIG. 1, the mold includes an element mounting surface 6 of the base 1, an opposing surface 6 a facing the element mounting surface 6, a tapered portion 7 tapering from the opposing surface 6 a toward the element mounting surface 6, and an element mounting surface. The projections 28, 29; 38, 39:31, etc. corresponding to the wiring patterns on the surface 6 and the opposing surface 6a are shaped. A portion 5 of the element mounting surface 6 corresponding to the bottom of the tapered portion 7 is left at the time of injection molding, and is formed into an opening 62 of the light receiving element by press punching or laser processing in a later step. A stamper 37 is installed at a position of a mold corresponding to the element mounting surface 6. The resin heated to 80 ° C. in the cylinder was injected into a stamper heated to 180 ° C. The curing time was 3 minutes. The resin has a linear expansion α ~ 2
0 ppm of EPOX (plating grade) manufactured by Mitsui Chemicals, Inc. was used.

By the injection molding, fine concave grooves 47 and 4 having a groove width of about 0.1 mm and a pitch of about 0.5 mm are formed on the surface of the base 1.
8; 51, 52 were formed. Grooves 47, 48; 51, 5
2 has a substantially rectangular cross section, and grooves 47, 48;
52 had a depth of 0.03 mm. The thickness of the substrate is about 1
mm.

The taper angle θ1 of the tapered portion 7 is preferably in the range of 10 ° to 80 ° with reference to the element mounting surface, and more preferably 10 ° <θ <50 °. In the figure, it is formed at 45 °, for example.

Further, the substrate 1 was drilled to form a through-hole having a diameter of 0.3 mm along the thickness direction of the substrate 1, and the element mounting surface 6 and the opposing surface 6a were connected.
Subsequently, copper plating having a thickness of 0.075 mm is performed so as to fill the concave grooves 47, 48; 51, 52 on the surface of the base 1, and the concave grooves 47, 48; 51, 52 and the through holes 53, 5 are formed.
The conductor 56 was formed on the entire surface of the substrate 1 including the substrate 4.

Next, the element mounting surface 6 is brought into contact with a grindstone,
The grooves 47, 48; 51,
The plating existing on the element mounting surface 6 other than 52 was removed.
Then, the conductors in the concave grooves 47 and 48; 51 and 52 were individually divided, and the wiring pattern 2 corresponding to the groove plane shape was obtained. Similarly, the opposing surface 6a and the side surface of the base 1 were also removed by the slurry polishing method. Then, the concave grooves 47, 48;
1, 52, the conductors are individually segmented into grooves 47, 48;
Wiring patterns corresponding to the 51 and 52 plane shapes were obtained. Subsequently, in order to prevent corrosion of copper plating, nickel having a thickness of about 5 μm was formed on the entire exposed surface of the substrate 1 by electrolytic plating, and gold having a thickness of about 0.5 μm was formed by electrolytic plating.

Thus, as shown in FIG.
The metal wiring 2 was formed in the groove, the connection pad 4 was formed in the groove on the facing surface 6a, and the conductor was formed on the inner surface of the through hole 3.

Next, the portion 5 corresponding to the bottom of the tapered portion 7
Then, an opening 62 of the light receiving element 11 is formed as shown in FIG. Thus, the photoelectric device package 15 is completed.

Referring to FIG. 3 showing the mounting state of package 15 in FIG. 2, light receiving element 11 includes light receiving section 12 for receiving light from the outside, metal connection pad 10 provided around light receiving section 12, and the like. And mounted on the element mounting surface 6 of the base 1. After the anisotropic conductive paste 9 is interposed between the metal connection pad 10 and the metal wiring 2 and pressed, the electrical connection between them is fixed by a thermosetting treatment.

A glass plate 8 is fixed to the facing surface 6a of the base 1 with an adhesive or the like so as to cover the opening of the tapered portion 7. Anisotropic conductive paste 9 is applied to connection pads 4 formed on opposing surface 6a, and electrical connection with conductor 65 of wiring board 64 is performed.

Light from the outside is transmitted through the glass plate 8 and the tapered portion 7.
And reaches the light receiving section 12. At this time, by setting the taper angle θ1 of the tapered portion 7 in the range of 10 ° to 80 °, irregular reflection of light on the inner surface of the light introduction through hole 61 is reduced, and stray light can be reduced.

FIG. 20 is a sectional view of a package 15a according to another embodiment of the present invention, and FIG. 21 is a sectional view showing a mounted state of the package 15a shown in FIG. FIG.
The package 15 shown in FIGS. 0 and 21 is similar to the embodiment described above with reference to FIGS. 1 to 19, and the corresponding parts are denoted by the same reference numerals. In this embodiment, the light introduction through-hole 61 has a tapered portion 7a that is opposite to the tapered portion 7 of the above-described embodiment. Such a tapered portion 7a can also prevent light that is undesirably incident on the light receiving portion 20.

As shown in FIG. 21, the metal wiring 2 has
The conductor 69 formed on the electrically insulating synthetic resin base material 68 of the flexible wiring board 67
1 connected. Further, the metal heat radiating member 73 is fixed to the light receiving element 11 by the adhesive 72.

FIG. 22 is a sectional view of a package 15b according to still another embodiment of the present invention, and FIG. 23 is a plan view of a part of the package 15b shown in FIG. The package 15b is similar to the embodiment of FIGS. 1 to 19 described above, and corresponding parts are denoted by the same reference numerals. In the above-described embodiment, the through hole 3 is formed so as to penetrate the inside of the base 1, but the through hole 3 b is formed in a half-split shape along the side surface 59 of the base 1.

FIG. 24 is a partially simplified plan view for describing a manufacturing process of the package 15b shown in FIGS. 22 and 23. The substrates 1b1 and 1b2 obtained by the above-described injection molding have grooves 47b1 and 47b2, and form a through-hole 74 having a circular cross section by a laser beam or a drill. Thereafter, the bases 1b1 and 1b2 are cut at the cutting section 75, and the bases 1b1 and 1b2 are cut and manufactured. The through hole 74 has a semicircular cross section,
7b1 and 47b2. In the same manner as in the steps shown in FIGS.
7b2 and the half-groove groove of the through hole 74 are plated with Cu or the like, and the respective metal wirings 2 are formed by the above-mentioned polishing, and the plating metal is formed in the half-through hole 3b and divided by polishing. I do.

FIG. 25 is a cross-sectional view showing a mounted state of package 15b shown in FIGS. The conductor 77 of the wiring board 76 is connected to the through hole 3b by, for example, solder 78 or the like.

FIG. 26 is a sectional view showing another example of the package 14c according to the present invention, and FIG. 27 is a side view thereof. Here, to be in contact with the groove 2 of the element mounting surface 6,
A groove 79 is formed in the side surface 59 of the base 1 and a conductor is formed in both grooves 79 by metal plating or the like, so that the metal wiring 2 is formed in the groove of the element mounting surface 6 and a connection pad is formed in the groove on the side of the base. 4 are formed.

By arranging the connection pads 4 on the side of the base, the degree of freedom in designing the wiring board is increased.

Further, by setting the depth of the side groove 79 to a range of 2 to 10 times the depth of the groove 2 of the element mounting surface 6, the wiring conductor 2 on the side surface 79 can be formed to a sufficient thickness. In addition, the strength of external connection by solder or the like can be remarkably improved.
Therefore, the connection process with the wiring board is stabilized, and the connection strength is improved.

FIG. 28 is a partial perspective view for explaining a manufacturing process of the unfinished package 14c shown in FIGS. 26 and 27. Grooves 47 are formed in the bases 1c1 and 1c2.
b1 and 47b2 are formed by injection molding, and a bottomed groove 79 having a circular cross section is formed by a laser beam or a drill. Thereafter, as shown in FIGS. 18 and 19 and the like, a Cu plating layer is formed on the side surfaces of each of the grooves 47b1 and 47b2 and the half-shaped bottomed groove 79, and is separated by polishing. Then, in the cutting part 75, each base 1c1, 1
c2 is split. Other configurations and manufacturing steps in the embodiment of FIGS. 26 to 28 are the same as those of the above-described embodiment.

FIG. 29 is a sectional view showing a stamper 17d according to still another embodiment of the present invention. This embodiment is similar to the above-described embodiment, and corresponding portions are denoted by the same reference numerals. In particular, in this embodiment, the first protrusion 2
9 and the second convex portion 31, and through holes 53, 5
Third projections 81 having different depth shapes are formed corresponding to the fourth or bottomed grooves 79. Thereby, the through hole 53,
The processing of the groove 54 and the bottomed groove 79 with a laser beam or a drill becomes easy.

FIG. 30 is a sectional view showing a mounted state of the package 14c shown in FIGS. The light receiving element 11 is connected to the package 14c.
This is the same as the above-described embodiment. Conductor 7 of wiring board 76
7 is connected to the connection pad 4 by solder 82.

FIG. 31 is a sectional view showing a mounting state of another embodiment of the present invention. Metal wiring 2 of package 14
Alternatively, a flexible wiring board 76 is connected to the connection pad 4. The conductor 84 of the wiring board 83 is also connected to the wiring board 76. An electronic circuit device 86 such as a computer or a memory is connected to the conductor 84 by an anisotropic conductive paste 85. It is also a useful application to integrate the wiring board 83 and the package 14 and omit the wiring board 76.

Light receiving element 1 formed on package 14c
Reference numeral 1 denotes a light receiving element 11 arranged in a mounting hole 87 formed in a wiring board 76.
4c is fixed.

[0099]

As described in detail above, according to the present invention, when forming a wiring pattern on the surface or inside of a substrate, only simple steps such as precision injection molding, plating, polishing, drilling, and die processing are performed. A package having a desired shape is obtained. In addition, since batch processing by multi-cavity is easy,
It is excellent in mass productivity, and can manufacture a package for a photoelectric device with high dimensional accuracy and low cost. In particular, according to the present invention, a fine groove corresponding to a wiring pattern and a light introducing through hole having a different dimension and shape such as depth from the groove are formed in a base made of a material such as an electrically insulating synthetic resin. Can be manufactured by injection molding using the same stamper and the first and second projections formed on the stamper.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of an unfinished package 14 according to the present invention.

FIG. 2 is a cross-sectional view showing the shape of a completed package 15 after press-cutting the package shown in FIG.

FIG. 3 is a cross-sectional view showing a mounting state of the package 15 shown in FIG.

FIG. 4 shows a package 15 according to an embodiment of the present invention.
FIG. 3 is a perspective view as viewed from above.

FIG. 5 is a perspective view of the package 15 viewed from below in FIG. 2;

FIG. 6 is a cross-sectional view for explaining a step for manufacturing the stamper 17 according to one embodiment of the present invention.

FIG. 7 is a cross-sectional view for explaining a step for manufacturing the stamper 17 according to one embodiment of the present invention.

FIG. 8 is a cross-sectional view for explaining a step for manufacturing the stamper 17 according to one embodiment of the present invention.

FIG. 9 is a cross-sectional view for explaining a step for manufacturing the stamper 17 according to one embodiment of the present invention.

FIG. 10 is a cross-sectional view for explaining a step for manufacturing the stamper 17 according to one embodiment of the present invention.

FIG. 11 is a cross-sectional view for explaining a step for manufacturing the stamper 17 according to one embodiment of the present invention.

FIG. 12 is a cross-sectional view for explaining a step for manufacturing the stamper 17 according to one embodiment of the present invention.

FIG. 13 is a cross-sectional view for explaining a step for manufacturing the stamper 17 according to one embodiment of the present invention.

FIG. 14 shows a stamper 37 according to an embodiment of the present invention.
FIG.

FIG. 15 is a cross-sectional view for explaining a step for injection-molding the base 1.

FIG. 16 is a cross-sectional view of the base 1.

FIG. 17 is a cross-sectional view showing a state in which through holes 53 and 54 are formed in the base 1;

FIG. 18 is a cross-sectional view for explaining a step of forming a plating layer 56 on the base 1 in the case of multiple-piece production.

FIG. 19 is a cross-sectional view for explaining a step of polishing the plating layer 56 of the base 1.

FIG. 20 shows a package 15a according to another embodiment of the present invention.
FIG.

21 is a cross-sectional view showing a mounting state of the package 15a shown in FIG.

FIG. 22 is a sectional view of a package 15b according to still another embodiment of the present invention.

FIG. 23 is a plan view of a part of the package 15b shown in FIG.

FIG. 24 is a package 1 shown in FIGS. 22 and 23.
FIG. 5B is a partial simplified plan view for explaining the manufacturing process of FIG. 5B.

FIG. 25 is a package 15b shown in FIGS. 22 to 24;
FIG. 3 is a cross-sectional view showing a mounting state of the device.

FIG. 26 is a sectional view showing an unfinished package 14c according to the present invention.

FIG. 27 is a side view showing the package 14c of FIG. 26 according to the present invention.

FIG. 28 is a partial perspective view for illustrating a manufacturing step of the unfinished package 14c shown in FIGS. 26 and 27.

FIG. 29 is a stamper 1 according to still another embodiment of the present invention.
It is sectional drawing which shows 7d.

FIG. 30 is a package 14c shown in FIGS. 26 to 28;
FIG. 3 is a cross-sectional view showing a mounting state of the device.

FIG. 31 is a cross-sectional view showing a mounting state according to another embodiment of the present invention.

DESCRIPTION OF SYMBOLS 1 Base 2 Metal wiring 3 Through hole 4 Substrate connection pad 5 Press-out portion 6 Element mounting surface 7 Tapered portion 8 Glass 9 Anisotropic conductive paste 10 Metal connection pad 11 Light receiving element 12 Light receiving section 15 Package 17, 37 Stamper 19 Photoresist layer 27 Metal plating layer 28, 29; 38, 39 First convex portion 31 Second convex portion 34 Inclined portion 41 Mold device 42, 43, 45 Mold body 44 Injection molding space 47, 48; 51 , 52 groove 49 recess 53, 54 through hole 56 plating layer 61 light introduction through hole 62 window 79 groove 81 third convex portion

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4M118 AA10 AB01 BA10 BA14 FA06 FA08 HA24 HA26 HA31 HA32 HA33 5F041 AA37 AA42 DA02 DA04 DA09 DA19 DA34 DA35 DA39 5F088 AA01 BA20 JA06 JA10 JA20

Claims (13)

[Claims] An element mounting surface on which a photoelectric element is mounted, a base having an opposing surface facing the element mounting surface, and a light introducing through hole penetrating the element mounting surface from the opposing surface, the element mounting surface and / or the opposing surface. A package for a photoelectric element, wherein a groove is formed in the surface, and a wiring conductor is formed in the groove. 2. The photoelectric device package according to claim 1, wherein a through hole is formed in the base to connect the element mounting surface to the opposing surface, and a wiring conductor is formed in the through hole. . 3. The device according to claim 1, wherein a half-divided through hole is formed on a side surface of the base to connect the element mounting surface and the opposing surface, and a wiring conductor is formed in the through hole. Package for photoelectric devices. 4. The photoelectric device according to claim 1, wherein a side groove communicating with the groove of the element mounting surface is formed on a side surface of the base, and a wiring conductor is formed in the side groove. For package. 5. The package according to claim 4, wherein the depth of the side groove is in a range of 2 to 10 times the depth of the groove of the element mounting surface. 6. The package for an optoelectronic device according to claim 1, wherein the wiring conductor is formed by metal plating. 7. The package for an optoelectronic device according to claim 1, wherein the substrate is made of a thermosetting resin having low dust generation. 8. The package according to claim 1, wherein the base is made of a low-dusting thermoplastic resin. 9. A method for manufacturing a package for a photoelectric element, comprising: a substrate having an element mounting surface on which the photoelectric element is mounted, an opposing surface facing the element mounting surface, and a light introducing through hole penetrating the element mounting surface from the opposing surface. A molten resin is injected into a mold provided with a stamper having a first protrusion corresponding to a wiring pattern on an element mounting surface and / or a facing surface and a second protrusion for forming a light introduction through-hole. Forming a substrate having a groove corresponding to the wiring pattern and a concave portion corresponding to the light introducing through hole, and plating an element mounting surface and / or a facing surface of the substrate with a conductive material. Polishing the plated element mounting surface and / or the opposing surface to separate the conductive material in the groove; and punching out the bottom of the recess corresponding to the light introducing through hole to form the light introducing through hole. Including Manufacturing method of a photoelectric element package according to claim. 10. A base having an element mounting surface on which a photoelectric element is mounted, an opposing surface facing the element mounting surface, and a light introducing through hole penetrating from the opposing surface to the element mounting surface. 10. A package for a photoelectric element obtained by the manufacturing method according to claim 9, wherein a conductor is formed. 11. A step of forming a photoresist layer having a hole corresponding to the first convex portion on the substrate by a photolithography method, and forming a photoresist layer and the substrate exposed from the hole on the substrate. Forming a metal plating layer having a thickness that closes the through hole with a plating metal by applying metal plating to the metal plating layer; and removing the formed metal plating layer from a substrate. 10. The method for manufacturing a package for an optoelectronic device according to claim 9, further comprising the step of: deep-drawing the layer corresponding to the second convex portion to manufacture the stamper for injection molding. 12. The photoelectric device according to claim 11, wherein the second convex portion of the stamper is formed to be inclined so as to be tapered toward an injection molding space into which the resin is injected. Package manufacturing method. 13. The base body has a through hole or a side surface groove facing the element mounting surface or the opposing surface, and the stamper has a third hole corresponding to the through hole or the side surface groove.
The method according to claim 11, further comprising a convex portion.