JP2002270654A - Probe pin for probe card - Google Patents
Probe pin for probe cardInfo
- Publication number
- JP2002270654A JP2002270654A JP2001069624A JP2001069624A JP2002270654A JP 2002270654 A JP2002270654 A JP 2002270654A JP 2001069624 A JP2001069624 A JP 2001069624A JP 2001069624 A JP2001069624 A JP 2001069624A JP 2002270654 A JP2002270654 A JP 2002270654A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- probe pin
- pin
- conductivity
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 44
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052737 gold Inorganic materials 0.000 claims abstract description 15
- 239000010931 gold Substances 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 12
- 239000004332 silver Substances 0.000 claims abstract description 12
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 238000005452 bending Methods 0.000 abstract description 13
- 238000005260 corrosion Methods 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 11
- 238000005299 abrasion Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- DECCZIUVGMLHKQ-UHFFFAOYSA-N rhenium tungsten Chemical compound [W].[Re] DECCZIUVGMLHKQ-UHFFFAOYSA-N 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体ウエハー上
に構成された集積回路の電気的特性を検査するためのプ
ローブカードに組み込まれる、比較的低い電圧電流で用
いるプローブカード用プローブピン（以下「プローブピ
ン」または「ピン」という）に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe pin for a probe card used at a relatively low voltage and current, which is incorporated in a probe card for inspecting electrical characteristics of an integrated circuit formed on a semiconductor wafer (hereinafter referred to as "probe pin"). Probe pin "or" pin ").
【０００２】[0002]
【従来の技術】プローブカードは、プリント配線基板に
数十本から数百本のプローブピンを配設したものであ
る。このプローブカードをプローバ（検査機）に搭載
し、半導体ウエハ上の集積回路チップの各電極パッドに
プローブピンを当接させ、通電検査のための測定を行
う。2. Description of the Related Art A probe card has a printed wiring board on which tens to hundreds of probe pins are provided. The probe card is mounted on a prober (inspection machine), and a probe pin is brought into contact with each electrode pad of an integrated circuit chip on a semiconductor wafer to perform measurement for an electric current test.
【０００３】プローブピン１の形状は、例えば図１
（ａ）に示すように、ストレート部２とテーパ部３とか
らなるものを、図１（ｂ）のようにテーパ部３の先端部
を折り曲げて屈曲部４としたものが一般的である。ピン
の標準的な寸法は、ストレート部の直径が０．０５〜
０．２０mm程度で、ピンの全長は２０〜１００mm程度で
ある。The shape of the probe pin 1 is, for example, as shown in FIG.
As shown in FIG. 1A, a straight portion 2 and a tapered portion 3 are generally formed into a bent portion 4 by bending the tip of the tapered portion 3 as shown in FIG. 1B. The standard size of the pin is 0.05 ~
The length is about 0.20 mm and the total length of the pin is about 20 to 100 mm.
【０００４】このようなプローブピンには、導電性が高
く、耐腐食性に優れていることはもちろんのこと、電極
パッドへの適当な当接力を有し、また繰り返し接触によ
り摩耗あるいは変形したりしない、いわゆる耐摩耗性や
バネ性に優れていることが要求される。そして、導電性
は電気比抵抗、耐摩耗性は引張強度又は硬度、バネ性は
ヤング率が代用特性として用いられている。また、プロ
ーブピンの製造における曲げ加工時に屈曲部の折れや割
れが発生しないよう、曲げ加工性に優れていることも必
要であるが、これは材料の展延性が影響する。[0004] Such a probe pin has not only high conductivity and excellent corrosion resistance, but also has an appropriate contact force with an electrode pad, and is worn or deformed by repeated contact. No, it is required to have excellent so-called wear resistance and spring properties. The electrical conductivity is used as electrical specific resistance, the wear resistance is used as tensile strength or hardness, and the spring property is used as Young's modulus as substitute properties. In addition, it is necessary to have excellent bending workability so as not to cause breakage or cracking of the bent portion during bending in the manufacture of the probe pin, but this is affected by the extensibility of the material.
【０００５】ところで、従来用いられている一般的なプ
ローブピンの材料としては、タングステン（Ｗ）、レニ
ウムタングステン（Ｒｅ−Ｗ）、パラジウム（Ｐｄ）合
金、ベリリウム銅（Cu−Ｂｅ）などがあり、電極パッド
の種類に応じて使い分けされている。電極パッドとして
は、主にアルミパッドと金パッドの２種類があり、アル
ミパッドに対しては、電極パッド表面の酸化被膜を突き
破る必要があるため、硬度の高いタングステンやレニウ
ムタングステンのプローブピンが主に用いられている。
しかし、金パッドは酸化しないので、アルミパッドのよ
うに酸化被膜を突き破る必要がなく、しかも柔らかいた
め、逆に電極表面にキズをつけないようにプローブピン
の材質も比較的柔らかいベリリウム銅が多用されてい
る。[0005] By the way, as a material of a general probe pin conventionally used, there are tungsten (W), rhenium tungsten (Re-W), palladium (Pd) alloy, beryllium copper (Cu-Be) and the like. They are properly used depending on the type of the electrode pad. There are mainly two types of electrode pads: aluminum pads and gold pads. For aluminum pads, it is necessary to break through the oxide film on the surface of the electrode pads. It is used for
However, since the gold pad does not oxidize, there is no need to break through the oxide film like an aluminum pad, and since it is soft, the material of the probe pin is relatively soft, so that beryllium copper is often used to avoid scratching the electrode surface. ing.
【０００６】[0006]
【発明が解決しようとする課題】しかし、上記ベリリウ
ム銅は電気比抵抗が比較的大きいため、プローブカード
のように低い電圧電流で用いられている場合でも、ジュ
ール熱による発熱が大きい。従って、高温悪条件下での
導通テストになってしまい、導通テストの信頼性が低下
する問題がある。また、熱影響による疲労進行度が速い
ため、ピンの長寿命化が期待できない。However, since the beryllium copper has a relatively large electric resistivity, even if it is used at a low voltage and current like a probe card, it generates a large amount of heat due to Joule heat. Therefore, a continuity test is performed under adverse conditions of high temperature, and there is a problem that the reliability of the continuity test is reduced. In addition, since the degree of progress of fatigue due to thermal effects is high, a longer life of the pin cannot be expected.
【０００７】さらに、ベリリウム銅は展延性が低く、曲
げ加工性に劣るため、ピンの曲げ加工時に図１の屈曲部
４において割れや折れが発生することが多く、歩留まり
が低くなり製造コストに悪影響を与えてきた。Further, beryllium copper has low ductility and poor bending workability, so that cracks and breaks often occur at the bent portion 4 in FIG. 1 during bending of the pin, which lowers the yield and adversely affects the manufacturing cost. Has been given.
【０００８】また、ベリリウム銅は耐腐食性が低いた
め、ニッケルと金の２層メッキ等の表面処理が通常行わ
れていた。Further, since beryllium copper has low corrosion resistance, surface treatment such as two-layer plating of nickel and gold has been usually performed.
【０００９】本発明は、上述した従来のプローブピンの
問題点を解決し、導電性、耐腐食性、耐摩耗性およびバ
ネ性に優れ、かつ展延性にも優れて曲げ加工時の割れや
折れを防止できるプローブピンを提供することを課題と
する。The present invention solves the above-mentioned problems of the conventional probe pins, and is excellent in conductivity, corrosion resistance, wear resistance, and spring properties, and also excellent in extensibility and cracks and breaks during bending. It is an object of the present invention to provide a probe pin capable of preventing the above.
【００１０】[0010]
【課題を解決するための手段】上記課題を達成するため
に、本発明のプローブピンは、白金１〜１０重量％、銀
５〜１５重量％、銅および／又はニッケル１０〜２０重
量％を含有し、残部が金および不可避的不純物からなる
ことを特徴とする。In order to achieve the above object, a probe pin of the present invention contains 1 to 10% by weight of platinum, 5 to 15% by weight of silver, and 10 to 20% by weight of copper and / or nickel. The balance is made of gold and unavoidable impurities.
【００１１】上記構成における数値限定は以下の理由に
よる。すなわち、金自体は展延性に優れ、しかも耐腐食
性が高く、電気比抵抗が小さく導電性が高いという非常
に優れた特長を有している。しかし柔らかいため白金、
銀、銅、ニッケルなどと合金として用いられるのが一般
的である。ただ白金以外の合金元素は耐腐食性が金に比
べ劣るため、その含有量が多くなるにつれて耐腐食性は
低下し、また銅、ニッケルは金よりも導電性が劣るた
め、含有量の増加に伴い導電性が低下する。よって、上
記白金、銀、銅および／又はニッケルの含有量を上記特
定範囲内としたのは、特定範囲未満では合金の強度を向
上させることができず、プローブピンに要求される耐摩
耗性、バネ性が得られないためであり、特定範囲を超え
ると導電性および耐腐食性が低下するためである。さら
に銀は導電性が金よりも優れておりプローブピンの導電
性をさらに向上することができ、また、銀、銅およびニ
ッケルは金よりも価格が安く、材料コストの増加を抑え
る効果もある。The numerical limitation in the above configuration is based on the following reasons. That is, gold itself has very excellent features of excellent spreadability, high corrosion resistance, low electric resistivity and high conductivity. However, because of its softness, platinum,
It is generally used as an alloy with silver, copper, nickel and the like. However, alloying elements other than platinum are inferior in corrosion resistance to gold, so their corrosion resistance is reduced as their content increases, and copper and nickel are inferior in conductivity to gold. As a result, conductivity decreases. Therefore, the content of the platinum, silver, copper and / or nickel is set to be within the specific range. If the content is less than the specific range, the strength of the alloy cannot be improved, and the wear resistance required for the probe pin, This is because a spring property cannot be obtained, and if it exceeds a specific range, conductivity and corrosion resistance are reduced. Further, silver has higher conductivity than gold and can further improve the conductivity of the probe pin. Silver, copper and nickel are less expensive than gold and have an effect of suppressing an increase in material cost.
【００１２】上記の理由から、白金１〜１０重量％、銀
５〜１５重量％、銅および／又はニッケル１０〜２０重
量％がプローブピンにとって最も好ましい含有量であ
る。銅とニッケルは、両者を含有させてもよいし、銅だ
けあるいはニッケルだけでも効果を発揮する。For the above reasons, 1 to 10% by weight of platinum, 5 to 15% by weight of silver, and 10 to 20% by weight of copper and / or nickel are the most preferable contents for the probe pin. Copper and nickel may contain both, and only copper or nickel alone is effective.
【００１３】上記構成のプローブピンは、金、白金、銀
といった導電性が非常に高い金属元素で構成されている
ので高い導電性を有し、よってジュール熱による発熱を
可及的に抑えることができる。また白金、銀、銅、ニッ
ケルとの合金であるので合金の強度が高く、耐摩耗性、
バネ性に優れる。さらに金が主元素であるので耐腐食
性、展延性に優れ、防錆を目的とした表面処理が省略で
きるとともに、曲げ加工を施しても割れや折れの発生を
防止することができる。また、被検査体電極である金パ
ッドを傷つけることもない。[0013] The probe pin having the above-mentioned structure is made of a very conductive metal element such as gold, platinum and silver, so that it has high conductivity, so that heat generated by Joule heat can be suppressed as much as possible. it can. In addition, since it is an alloy with platinum, silver, copper and nickel, the strength of the alloy is high, abrasion resistance,
Excellent spring properties. Furthermore, since gold is the main element, it is excellent in corrosion resistance and spreadability, so that surface treatment for the purpose of rust prevention can be omitted, and cracks and breaks can be prevented even when subjected to bending. Further, the gold pad, which is the electrode to be inspected, is not damaged.
【００１４】上記構成において、電気比抵抗は１３〜１
４μΩ−cmとするのが好ましい。その理由は、１３μΩ
−cm未満は強度を上げるべく合金化したため、これより
小さくすることは不可能であるためで、１４μΩ−cmを
越えると抵抗値が大きくなりすぎジュール熱による発熱
が大きくなるからである。In the above configuration, the electric resistivity is 13 to 1
It is preferably 4 μΩ-cm. The reason is 13μΩ
If it is less than −cm, it is impossible to make it smaller because it was alloyed to increase the strength. If it exceeds 14 μΩ-cm, the resistance value becomes too large and the heat generated by Joule heat increases.
【００１５】さらに、引張強さが１０００〜１４００Ｎ
／mm2、又は硬度がＨｖ３００〜４００であることが好
ましい。というのは、引張強さが１０００Ｎ／mm2未
満、又は硬度がＨｖ３００未満ではプローブピンの強度
が低く耐摩耗性が不足するためで、引張強さが１４００
Ｎ／ｍｍ2、又は硬度がＨｖ４００を越えると逆に硬く
成りすぎ電極パッド表面をキズつけてしまうとともに、
伸線加工性が低下するためである。Further, when the tensile strength is 1000-1400N
/ Mm 2 , or a hardness of Hv 300 to 400. This is because if the tensile strength is less than 1000 N / mm 2 or the hardness is less than Hv300, the strength of the probe pin is low and the wear resistance is insufficient.
When the hardness exceeds N / mm 2 or Hv400, the electrode pad becomes too hard and scratches the electrode pad surface.
This is because drawability is reduced.
【００１６】また、ヤング率は１１０〜１１５ＧＰａで
あることが好ましい。これは１１０ＧＰａ未満ではバネ
性が低く、電極パッドへの当接力が不足したり、繰り返
しの使用によって曲げ形状が変形して当接力が低下し、
導通テストの信頼性が低下するためである。また１１５
ＧＰａを越えると伸線加工性が悪くなるためである。Further, the Young's modulus is preferably 110 to 115 GPa. This is because when the pressure is less than 110 GPa, the spring property is low, the contact force to the electrode pad is insufficient, or the bent shape is deformed by repeated use, and the contact force is reduced.
This is because the reliability of the continuity test decreases. Also 115
If it exceeds GPa, the wire drawing workability will be poor.
【００１７】[0017]
【発明の実施の形態】本発明のプローブピンは、連続鋳
造−細径加工−熱処理を施した金合金線を使用し、さら
に冷間伸線加工により所望の線径に仕上げた後、真直矯
正加工−切断−ピン先端の尖頭加工（機械加工）−ピン
先端の曲げ加工を行うことによりプローブカードピンを
製造することができる。BEST MODE FOR CARRYING OUT THE INVENTION The probe pin of the present invention uses a gold alloy wire that has been subjected to continuous casting, small diameter processing, and heat treatment, and after finishing to a desired wire diameter by cold drawing, straightening is performed. A probe card pin can be manufactured by performing processing-cutting-tip processing of a pin tip (mechanical processing) -bending processing of a pin tip.
【００１８】電気比抵抗は、合金元素の含有量で調整す
ることができ、引張強度や硬度あるいはヤング率は熱処
理の条件（温度、保持時間）を変えることにより調整す
ることができる。熱処理条件としては、３００〜４００
℃で５〜１０分保持が適当である。The electrical resistivity can be adjusted by the content of the alloy element, and the tensile strength, hardness or Young's modulus can be adjusted by changing the conditions of the heat treatment (temperature, holding time). The heat treatment conditions are 300 to 400
Hold at 5 ° C. for 5 to 10 minutes is appropriate.
【００１９】本発明は、先端を曲げ加工しないプローブ
ピンに対しても同様に適用でき、また先端を尖頭加工し
ないプローブピンや断面形状が円だけでなく四角や偏平
状等の異形のものにも同様に適用できる。The present invention can be similarly applied to a probe pin whose tip is not bent, and can be applied to a probe pin whose tip is not sharpened or to a probe having a cross-sectional shape other than a circle, such as a square or a flat shape. Can be similarly applied.
【００２０】[0020]
【発明の効果】本発明のプローブピンは、金、白金、銀
といった導電性が非常に高い金属元素で構成されている
ので、従来のベリリウム銅より格段に優れた高い導電性
を有し、ピンに高電流を流すことが可能であり、ジュー
ル熱による発熱も小さくできる。したがって、安定確実
な導電テストが可能になると共に、ピンの寿命を可及的
に延長できる。また、白金、銀、銅、ニッケルとの合金
とすることにより合金の強度が増加し、耐摩耗性を向上
することができるとともに、優れたバネ性も有し、価格
も低く抑えることができるさらに展延性、耐腐食性に優
れるので、ピン先端曲げ加工時に割れや折れの発生がほ
とんど皆無となり、防錆を目的とした表面処理が省略で
きる。従って、材料歩留まりが大幅に向上すると共に加
工コストを大幅に低減できる。The probe pin of the present invention is made of a metal element having very high conductivity, such as gold, platinum, and silver. A high current can flow through the device, and the heat generated by Joule heat can be reduced. Accordingly, a stable and reliable conduction test can be performed, and the life of the pin can be extended as much as possible. Further, by forming an alloy with platinum, silver, copper, and nickel, the strength of the alloy is increased, wear resistance can be improved, and excellent spring properties can be obtained, and the price can be kept low. Since it has excellent spreadability and corrosion resistance, there is almost no occurrence of cracks and breaks during bending of the pin tip, and surface treatment for rust prevention can be omitted. Therefore, the material yield can be greatly improved and the processing cost can be significantly reduced.
【図１】プローブピンの概略側面図であり、（ａ）は先
端曲げ加工前、（ｂ）は先端曲げ加工後の説明図であ
る。FIG. 1 is a schematic side view of a probe pin, in which (a) is an explanatory view before a tip bending and (b) is an explanatory view after a tip bending.
１ プローブピン ２ ストレート部 ３ テーパ部 ４ 屈曲部 1 probe pin 2 straight part 3 taper part 4 bent part
Claims (4)
％、銅および／又はニッケル１０〜２０重量％を含有
し、残部が金および不可避的不純物からなることを特徴
とするプローブカード用プローブピン。1. A probe card comprising 1 to 10% by weight of platinum, 5 to 15% by weight of silver, 10 to 20% by weight of copper and / or nickel, with the balance being gold and unavoidable impurities. Probe pin.
請求項１に記載のプローブカード用プローブピン。2. The probe pin for a probe card according to claim 1, wherein the electrical resistivity is 13 to 14 μΩ-cm.
m2、又は硬度がＨｖ３００〜４００である請求項１又は
２に記載のプローブカード用プローブピン。3. A tensile strength of 1,000 to 1,400 N / m
The probe pin for a probe card according to claim 1, wherein m 2 or hardness is Hv300 to 400. 4.
請求項１、２又は３に記載のプローブカード用プローブ
ピン。4. The probe pin for a probe card according to claim 1, wherein the Young's modulus is 110 to 115 GPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001069624A JP2002270654A (en) | 2001-03-13 | 2001-03-13 | Probe pin for probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001069624A JP2002270654A (en) | 2001-03-13 | 2001-03-13 | Probe pin for probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002270654A true JP2002270654A (en) | 2002-09-20 |
Family
ID=18927638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001069624A Pending JP2002270654A (en) | 2001-03-13 | 2001-03-13 | Probe pin for probe card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002270654A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007003525A (en) * | 2005-06-23 | 2007-01-11 | Feinmetall Gmbh | Contact device |
| WO2007052508A1 (en) * | 2005-10-31 | 2007-05-10 | Tokusen Kogyo Co., Ltd. | Probe needle for probe card |
| CN111913019A (en) * | 2017-09-15 | 2020-11-10 | 中华精测科技股份有限公司 | Circular probe of probe card device |
| CN115109962A (en) * | 2022-06-24 | 2022-09-27 | 有研工程技术研究院有限公司 | Wear-resistant high-hardness gold-based alloy material for collector ring and preparation method thereof |
| WO2024053552A1 (en) * | 2022-09-07 | 2024-03-14 | 石福金属興業株式会社 | Alloy material for probe pins |
| WO2024053549A1 (en) * | 2022-09-07 | 2024-03-14 | 株式会社ヨコオ | Probe |
-
2001
- 2001-03-13 JP JP2001069624A patent/JP2002270654A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007003525A (en) * | 2005-06-23 | 2007-01-11 | Feinmetall Gmbh | Contact device |
| WO2007052508A1 (en) * | 2005-10-31 | 2007-05-10 | Tokusen Kogyo Co., Ltd. | Probe needle for probe card |
| CN111913019A (en) * | 2017-09-15 | 2020-11-10 | 中华精测科技股份有限公司 | Circular probe of probe card device |
| CN115109962A (en) * | 2022-06-24 | 2022-09-27 | 有研工程技术研究院有限公司 | Wear-resistant high-hardness gold-based alloy material for collector ring and preparation method thereof |
| CN115109962B (en) * | 2022-06-24 | 2023-10-13 | 有研工程技术研究院有限公司 | Wear-resistant high-hardness gold-based alloy material for bus ring and preparation method thereof |
| WO2024053552A1 (en) * | 2022-09-07 | 2024-03-14 | 石福金属興業株式会社 | Alloy material for probe pins |
| WO2024053549A1 (en) * | 2022-09-07 | 2024-03-14 | 株式会社ヨコオ | Probe |
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