JP2002270465A - Terminal electrodes for multilayer electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal electrode in which a side surface polishing step after cutting in a conventional manufacturing process of a multilayer electronic component is omitted, and a disconnection is hardly generated, and further, a residual inductance of the terminal electrode is reduced to be GHz. The characteristics in the above high frequency band are improved. SOLUTION: In a laminated electronic component obtained by laminating and integrally firing insulating green sheets, a concave portion which is recessed from another layer is provided on a side surface portion of a green sheet contacting an inner layer electrode connected to a terminal electrode on the side surface. The layers are arranged and pressure-bonded to form a terminal electrode. In the via connecting the inner layer wiring electrode to the planar terminal, at least one via diameter is formed larger than the other inner layer via diameters in the upper and lower layers on which the plane terminal electrode is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic device obtained by laminating and pressing an insulating unsintered sheet on which circuit elements are formed, connecting the layers with internal vias, applying and connecting terminals on the side surfaces, and integrally firing. It relates to terminal electrodes of components.

[0002]

2. Description of the Related Art Due to demands for smaller and thinner electronic devices, passive components such as capacitors, inductors, or resistors and wiring for connecting them are connected as shown in the perspective view of FIG. 2 and the sectional view of FIG. Laminated electronic components, such as composite components, which are built in between layers and have individual components, such as semiconductors, mounted on the upper surface, are frequently used, and the terminal strength for surface mounting, solder erosion resistance, and the like are regarded as important.

Conventional multilayer electronic components are formed by arranging a number of components on an insulating green sheet, punching through holes for connecting vias at predetermined positions of each layer, and printing and laminating wiring electrodes corresponding to each layer. After crimping, a terminal electrode was applied to two sides cut into strips in either one of the vertical and horizontal directions, or to four sides of a piece cut in both directions, and connected to the end of the inner layer electrode. As for the terminal electrodes, as shown in the sectional view of the terminal portion in FIG. 4, the interlayer electrode 10 connected to the circuit element is exposed on the side surface of the component, the terminal electrode 11 is applied to the side surface of the component and connected, and then fired integrally to obtain a laminated electronic device. Parts were formed. As shown in the cross-sectional view of the terminal portion in FIG. 5, the terminal electrode formed on the plane is formed from the inner layer electrode 10 to the via hole 13 of the same diameter filled with the conductive paste in the through hole of each layer and formed from the plane to the side surface. Terminal electrode 11 to be connected.

However, a green sheet having a thickness of about 100 μm and a conductive paste having a thickness of about 10 μm are printed and formed. The cut surface of the inner wiring electrode to be cut is buried in the upper and lower insulating layers and easily becomes defective in a disconnected state that is not connected when forming the terminal electrode on the side surface, and the cut surface of the inner wiring electrode is polished by polishing the side surface. In some cases, the inner layer electrode shrinks inward when integrally fired at about 950 ° C., and breaks from the terminal electrode.

[0005] Also, when a terminal electrode is formed on a plane and connected to the inner layer electrode by a via in which a conductive paste is buried in a through hole, similarly to the case where the terminal electrode is formed on the side surface, the temperature is about 950 ° C. In some cases, the conductor paste filled in the through-holes forming the vias shrinks inward during the integral baking and disconnects from the terminal electrodes. Also, the vias connected to the flat terminal electrodes are desirably small in diameter because the circuit wiring is stretched in the inner layer, so that the via diameter connected to the flat terminals increases the residual inductance or the flat terminal electrodes. The cross-sectional area for connection was reduced.

[0006] In a laminated electronic component used for a cellular phone, a wireless device, or the like, when the lamination thickness is increased or the wiring length is increased, the residual inductance parasitic to the terminal cannot be neglected. The residual inductance is a cause of deteriorating characteristics in a high frequency band of GHz or more.

[0007]

SUMMARY OF THE INVENTION The present invention eliminates the need for a side polishing step after cutting in a conventional manufacturing process of a multilayer electronic component, and also prevents a disconnection between a side or flat terminal electrode and an inner layer electrode. And to improve the characteristics in a high frequency band of GHz or more by reducing the residual inductance of the terminal electrode.

[0008]

Means for Solving the Problems A laminated structure obtained by laminating insulating unsintered sheets on which circuit elements are formed, press-bonding them, connecting the layers with vias, and integrally firing the circuit elements and the insulating unsintered sheets. A terminal electrode of a multilayer electronic component, wherein at least one insulating layer adjacent to an inner wiring electrode connected to a terminal on a side surface is formed on a side surface of the multilayer body having a recess.

A green sheet having a thickness of about 100 μm is printed with a conductive paste having a thickness of about 10 μm.
On the cut surface, which is the side surface after cutting after laminating and pressing a plurality of sheets, the green sheet contacting the inner layer wiring electrode connected to the terminal has a concave portion 12 on the side surface as shown in the terminal section sectional view of FIG. Since the terminal electrode 11 is formed and connected to the concave portion by application, the conductor paste for forming the terminal electrode 11 is applied and buried in the concave portion, and the surface connection is made instead of the conventional only the cross-sectional connection of the terminal wiring 10. And the connection is secure.

Therefore, a side surface polishing step, which is a conventional pretreatment step for forming a terminal electrode, can be omitted. Furthermore, even if the inner layer electrode shrinks inward during integral firing after the application of the terminal electrode, the conductive paste is replenished from the recess, so that
There is no disconnection between the inner layer electrode and the terminal electrode, and the shape of the concave portion may be rectangular or semicircular, regardless of the shape.

[0011] The present invention also provides a laminated structure obtained by laminating and pressing an insulating unsintered sheet on which circuit elements are formed, connecting the layers with vias, and integrally firing the circuit element and the insulating unsintered sheet. In the via connecting the inner layer wiring electrode of the electronic component to the terminal of the plane, at least one or more vias at the bottom portion are:
A terminal electrode of a multilayer electronic component, wherein the terminal electrode is formed on a via larger than an upper inner layer.

As shown in the sectional view of the terminal portion in FIG. 6, in the through holes connected to the flat terminals, at least one or more through holes 14 at the bottom are made larger than through holes 13 in the upper inner layer. The connection cross-sectional area with the plane terminal electrode 11 can be increased while the via diameter of the inner layer is kept as it is, to ensure the connection. The shape of the via may be a cylinder or a prism, or may be a combination of vias such as a cylinder or a prism.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS At the time of laminating an insulating unsintered sheet on which a circuit element is formed, a layer having a recess at an end of at least one insulating layer adjacent to an inner wiring electrode connected to a terminal on a side surface. Are arranged and pressure-bonded to form a terminal electrode on the side surface including the concave portion.

In laminating the insulating unsintered sheet on which the circuit elements are formed, at least one of the vias connecting the interlayers with the vias and connecting the inner layer wiring electrodes to the terminals on the bottom plane is provided.
A layer having a via diameter larger than the layer and larger than the via diameter of the other layer is arranged and pressure-bonded to form a terminal electrode on the bottom plane including the via.

[0015]

Embodiment 1 An inner via is formed in a 100 μm thick glass or ceramic green sheet in an inner wiring electrode layer exposed on the side surface of the cross-sectional view of FIG. At the same time as the punching of FIG. 7, a through hole 10 having the same diameter as the other inner layer vias was punched on the line to be cut into individual pieces as shown in FIG. Next, the terminal connection portion 13 is printed together with the inner-layer wiring electrode 10, laminated and pressed, cut into strips in the Y-axis direction, and then a plurality of terminal electrodes are applied to both side surfaces. It was baked at ℃ to form a laminated electronic component.

[0016]

Second Embodiment In order to form a multilayer electronic component having input / output terminals 1 and 2 and a ground terminal 3 shown in FIG. And a layer having two inner layer ground terminal portions 5 were laminated.

[0017]

Third Embodiment As in the first embodiment, the inner layer via having a diameter of Φ: 0.2 mm, a layer having a via having a diameter of Φ: 0.4 mm formed in upper and lower layers, and a layer connected to a terminal on a side surface are shown in FIG. To form terminal electrodes having a U-shaped cross section.

[0018]

According to the terminal electrode of the present invention, the necessity of the side polishing step after cutting in the conventional manufacturing process of the multilayer electronic component is eliminated, and the occurrence of disconnection between the side or flat terminal electrode and the inner layer electrode is eliminated. Further, the residual inductance of the terminal electrode can be reduced, and characteristics in a high frequency band of GHz or more can be improved.

[Brief description of the drawings]

FIG. 1 shows a cross-sectional view of connection of a side surface of the present invention to a terminal electrode.

FIG. 2 shows an example of a laminated electronic component.

FIG. 3 shows an example of a cross-sectional view of a laminated electronic component.

FIG. 4 shows an example of a cross-sectional view of a conventional multilayer electronic component and a terminal portion for side connection.

FIG. 5 shows an example of a cross-sectional view of a conventional multilayer electronic component and a flat terminal portion.

FIG. 6 shows an example of a sectional view of a flat terminal portion of the present invention.

FIG. 7 is an explanatory diagram of an inner-layer terminal electrode according to the first embodiment.

FIG. 8 is an explanatory diagram of an inner-layer terminal electrode of Example 2.

FIG. 9 shows a cross-sectional view of the third embodiment.

[Explanation of symbols]

1, 2, 3 Side terminal electrodes in Embodiment 2, 4, 5, 6 Side terminal electrodes 1 in Embodiment 2,
Inner layer terminal electrodes connected to 2 and 3, respectively 10 Inner layer wiring electrode 11 Terminal electrode 12 Concave part connected to side terminal electrode 13 Inner layer via 14 Via of connection part to flat terminal

Claims (2)

[Claims] 1. A laminated electronic component comprising: an insulating unsintered sheet on which a circuit element is formed, laminated and press-bonded, a layer connected between the layers by a via, and the circuit element and the insulating unsintered sheet integrally fired. A terminal electrode for a laminated electronic component, wherein at least one insulating layer adjacent to an inner wiring electrode connected to a terminal on a side surface is formed on a side surface of a laminate having a recess. 2. An inner layer of a laminated electronic component in which an insulating unsintered sheet on which a circuit element is formed is laminated and pressed, a layer is connected by a via, and the circuit element and the insulating unsintered sheet are integrally sintered. A terminal electrode for a laminated electronic component, wherein at least one bottom via is formed on a via larger than an upper inner layer in a via connecting a wiring electrode to a planar terminal.