JP2002245858A - Transparent conductive laminated body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transparent conductive laminated body using a film base material with improved abrasion resistant property and point tapping property, high production efficiency, and excellent uniformity of resistance. SOLUTION: For the transparent conductive laminated body, a transparent film base body with a thickness of 2-300 μm is stuck on one surface of a transparent base body with a thickness of 2-300 μm, interposing a transparent adhesive layer with a thickness of 1 μm, and after making the total thickness 40-300 μm, a transparent conductive thin film with a thickness of 50 Å is formed on either one film surface of the outer surfaces.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial applications]

The present invention relates to a transparent conductive laminate in which a transparent conductive thin film is provided on a film substrate. More specifically, after bonding a specific transparent film and a transparent film substrate to a total thickness of 40 to 300 μm, a transparent conductive thin film of a specific thickness is provided on the outer surface of any of the films. It relates to a laminate.

[Prior art]

[0002] Thin films that are transparent in the visible light region and have conductivity include transparent electrodes in displays such as liquid crystal displays, electroluminescent displays, plasma displays, and touch panels, as well as antistatic and electromagnetic wave shielding of transparent devices. Used for purposes. Conventionally, as such a transparent conductive thin film, one in which an indium oxide-based thin film is formed on glass is known, but since the base material is glass, it is inferior in easiness, workability and heavy. It was not preferable because it was easily broken. For this reason, in recent years, in addition to viscosity, workability, and the advantages of excellent impact resistance and light weight, transparent conductive materials based on various plastic films such as polyethylene terephthalate, polyether sulfone, polycarbonate, norbornene-based resin, etc. Thin films have come to be used.

[Problems to be solved by the invention]

A conventional transparent conductive thin film using such a film substrate has a problem in that it has poor friction resistance, is damaged during use, increases electric resistance, and causes disconnection. In particular, in the case of a conductive thin film for a touch panel, a pair of thin films opposed to each other via a spacer come into strong contact at a pressing point from one of the bases, and thus have good durability characteristics that can withstand this. In other words, it is desired to have hitting characteristics, but the conventional transparent conductive thin film is inferior in such characteristics and has a problem that the life of the touch panel is shortened.

In order to solve this problem, Japanese Patent Publication No. 266768
As seen in No. 0, after a conductive thin film is previously formed on one surface of a transparent film substrate having a specific thickness by sputtering or the like, the transparent substrate is formed on the other surface via a transparent adhesive having specific characteristics. A bonded transparent conductive laminate has been proposed. In this method, the pressure-sensitive adhesive acts as a cushion, and the abrasion resistance of the transparent conductive thin film can be significantly improved. However, while winding the film with a roll, the transparent conductive thin film is continuously formed on the film by sputtering or the like. So there was a big problem. That is, in order to develop abrasion resistance, the thickness of the transparent film on which the transparent conductive thin film is to be provided in advance needs to be 2 to 120 μm, and it is necessary to use such a thin film in a roll shape. When attached to a sputtering device and forming a transparent conductive thin film while winding continuously, the film is bent or wrinkled because the film is thin,
It is difficult to obtain a uniform conductive thin film,
Because of insufficient mechanical strength, there was a case where a break occurred in the apparatus and continuous production was interrupted. Also, the thickness of the conductive thin film,
When it is necessary to make the film thicker, it is necessary to reduce the film supply rate in sputtering, heat accumulates when the sputtered particles adhere to the film, and when the film is thin, the so-called heat loss phenomenon in which the film is deformed. There was a problem that occurred. Furthermore, even if a special control device is applied to the film winding device to solve the problem of bending and wrinkling, if the problem of increasing the cost of equipment occurs and slight movement of the condition occurs, the film will bend. It may be difficult to form a uniform conductive thin film because of wrinkles, or breakage of the film may occur,
There was a major issue in serial production. In recent years, the analog system has been expanding in touch panels. In this analog system, in addition to scratch resistance and hitting point characteristics, uniformity of the resistance value on the surface has become extremely important, so one thin film In the method of forming a conductive thin film, there is a problem that a film having substantially uniform resistance value cannot be obtained.

On the transparent conductive laminate, a hard coat for preventing scratches, an anti-glare treatment coat for preventing image glare, an anti-reflection coat for preventing light reflection, water repellency and dirt are provided. In some cases, a treatment such as a water-repellent / stain-prevention coat for preventing the occurrence of water is required, and a method capable of performing these treatments continuously is also required.

The present invention has been made in view of the above-mentioned problems, and has improved scratch resistance and hitting point characteristics of a transparent conductive thin film using a film substrate, and has extremely excellent resistance value uniformity. It is an object of the present invention to provide a transparent conductive laminate having excellent productivity.

[Means for Solving the Problems]

As a result of intensive studies to achieve the above object, the present inventor has found that the following invention can be solved, and has completed the present invention.

That is, according to the present invention, the thickness is 2 to 300 μm.
The transparent film substrate having a thickness of 2 to 300 μm is attached to a transparent film substrate having a thickness of 1 μm or more via a transparent pressure-sensitive adhesive layer having a thickness of 1 μm or more, so that the total thickness falls within 40 to 300 μm. A transparent conductive laminate, wherein a transparent conductive thin film having a thickness of 50 ° or more is provided on any outer surface of the film substrate.

BEST MODE FOR CARRYING OUT THE INVENTION

As the film substrate used in the present invention, various plastic films having transparency can be used. Specifically, polyethylene terephthalate, polyimide, polyethersulfone, polyetheretherketone, polycarbonate, polypropylene, polyamide, polyacryl, acetylcellulose,
Examples include polyarylate, polysulfone, norbornene-based polymers, and the like. The norbornene-based polymer includes a polymer obtained by ring-opening polymerization or addition polymerization of a monomer having a norbornene structure and another polymerizable monomer added as necessary, and is manufactured by Nippon Zeon Co., Ltd. Zeonex and Zeonor, trade names of non-polar norbornene polymers, Arton, a trade name of polar norbornene polymers from JSR Corporation, Trade name Apel, a norbornene polymer from Mitsui Chemicals, Inc. Topel, a trade name developed by Hoechst Examples thereof include, but are not limited to, polymers containing a norbornene-based structure. When used for transparent electrodes of displays such as liquid crystal displays and touch panels, film base materials are used from various viewpoints such as optical properties such as transparency and non-rotational properties, physical properties such as low water absorption, heat resistance, mechanical strength, and price. Is chosen, each film substrate has advantages and disadvantages, but from a comprehensive perspective,
Polyethylene terephthalate, polycarbonate, polyethersulfone, norbornene-based polymers are preferable, and in recent years, the quality of image quality and dimensional stability at high temperature and high humidity have been regarded as important. From this viewpoint, transparency and light dispersion are considered. A norbornene-based polymer is particularly preferable because of its optical properties such as properties (wavelength dependence of refractive index and birefringence) and non-optical activity, heat resistance, and low water absorption, which are far superior to other polymers. Also, in the film, if necessary, an antioxidant,
Additives, such as a release agent, an ultraviolet absorber, a lubricant, and a colorant, which are commonly used in a film, can be added for various purposes. The method for producing the film is not particularly limited, and may be a known melt extrusion method, a solution casting method, a method such as a coating method, but from the viewpoint of the surface smoothness of the film, the solution casting method and the like. Films produced by a coating method are preferred.

In the present invention, two kinds of films are laminated, and the combination of the two kinds of films may be the same or different in the thickness and the kind of polymer. Optical and physical properties, mechanical strength, price,
The combination can be appropriately selected depending on the productivity and the like. The thickness of the film needs to be in the range of 2 to 300 μm. When the thickness is less than 2 μm, the mechanical strength of the base material itself is insufficient, and the base material is rolled and an adhesive layer is applied.
Not only is it difficult to perform a continuous operation such as a hard coating process described later, but also wrinkles and the like may occur in bonding. From such a viewpoint, the thickness is preferably 10 μm or more, and particularly preferably 20 μm or more.
When the thickness is 300 μm or more, a roll shape causes a curl, which makes continuous work difficult, and the curl remains, making it unusable. From such a viewpoint, the preferable thickness is 250 μm or less, and particularly preferably 23 μm.
0 μm or less. In addition, the film on the side on which the conductive thin film is formed is required to improve the abrasion resistance and hitting characteristics of the conductive thin film based on the cushioning effect of the pressure-sensitive adhesive layer described later.
μm or less, particularly preferably 100 μm or less.

The surface of the film substrate is subjected to an etching treatment or undercoat treatment such as sputtering, corona discharge, flame, ultraviolet irradiation, electron beam irradiation, chemical conversion, or oxidation on the surface thereof in advance, and a conductive thin film or an adhesive film provided thereon is provided. It is also possible to enhance the adhesiveness of various coating agents or thin films formed on the film surface in order to function or, if necessary, function.
Before providing the conductive thin film or the like, dust removal and cleaning can be performed by washing with a solvent, water, an acid, an alkali, or the like, or ultrasonic washing, if necessary.

In the present invention, after two films are bonded via an adhesive layer, a transparent conductive thin film is formed on one surface thereof. The total thickness of the laminated film is 40 ~
It needs to be 300 μm. By bonding two films, the mechanical strength and flatness are much better than one film of the same thickness.
Even if sputtering or the like is performed in a roll shape even if the total thickness is small, a uniform transparent conductive thin film can be obtained, and it is difficult to lose heat. However, when the laminate itself is used as an electrode, if it is thinner than 40 μm, there is a problem that the mechanical strength and hardness are insufficient, and there is a problem that it is difficult to assemble and process. From such a viewpoint, a preferable thickness is 70 μm or more.
More preferably, it is 100 μm. Further, when the thickness is 300 μm or more, when performing sputtering in a roll form, not only is the film curled and a flat laminate cannot be obtained, but also when used as an electrode of a liquid crystal display or a touch panel, the thickness of the device itself is large. Is not preferred. From such a viewpoint, the thickness is preferably 250 μm or less.

In this manner, the two selected films are bonded together via the adhesive. In this bonding, an adhesive layer is provided on one of the transparent film substrates,
This can be carried out by bonding the other film base to this. This bonding can be carried out by appropriately selecting a known method, but it is advantageous from the viewpoint of productivity that the film is continuously formed in a roll shape. The pressure-sensitive adhesive layer is not particularly limited as long as it has transparency, and can be selected from an acrylic pressure-sensitive adhesive, a silicon-based pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, and the like. This pressure-sensitive adhesive layer has a function of improving the abrasion resistance and hitting characteristics of the conductive film provided on the film substrate by the cushion effect after bonding, and has an elastic coefficient of 10 from the viewpoint of this function.
5 to 10 7 dyn / cm 2, thickness 1 μm
m, preferably in the range of 5 to 100 μm. The elastic modulus is 10 to the power of 5 dyn / cm
When it is less than 2, the pressure-sensitive adhesive layer becomes inelastic, so that it is easily deformed by pressurization to cause irregularities in the film base material or the conductive thin film, and the pressure-sensitive adhesive is likely to protrude from the processed cut surface. The effect of improving the scratch resistance and the hitting point characteristics is reduced. On the other hand, when the elastic coefficient exceeds 10 7 dyn / cm 2, the pressure-sensitive adhesive layer becomes hard and the cushion effect is not recognized. When the thickness of the pressure-sensitive adhesive layer is less than 1 μm,
Cushion effect is not recognized, and if the thickness is too large, transparency is impaired and workability and cost are disadvantageous. In order to form a transparent conductive thin film after laminating two films with an adhesive, it is necessary to carry out sputtering or the like under vacuum. It is preferable to use less,
Desirably, the volatile content is less than 5%. If necessary, before performing sputtering, it can be dried under high-temperature vacuum.
Rather, it is preferable to dry in advance.

After bonding the two film substrates in this manner, a transparent conductive thin film is formed on one outer surface of the film. As a method for forming the conductive thin film, any of conventionally known techniques such as a vacuum evaporation method, a sputtering method, and an ion plating method can be used, but from the viewpoint of uniformity of the film and adhesion of the thin film to the transparent substrate. It is preferable to form a thin film by a sputtering method. Further, the thin film material to be used is not particularly limited, for example, indium oxide containing tin oxide, metal oxides such as tin oxide containing antimony, gold, silver, platinum, palladium,
Copper, aluminum, nickel, chromium, titanium, cobalt, tin or alloys thereof are preferably used.
The thickness of this conductive thin film needs to be 50 ° or more, and if it is thinner than this, it is difficult to form a continuous film having good conductivity with a surface resistance of 1000Ω / port or less. on the other hand,
If the thickness is too large, the transparency is lowered, so the preferred thickness is about 100 to 2000 °.

When a transparent dielectric thin film is formed on the conductive thin film, the transparency, scratch resistance and hitting point characteristics are further improved, and a more preferable transparent conductive laminate is obtained. The dielectric thin film preferably has a refractive index smaller than the refractive index of the conductive thin film, usually 1.3 to 2.0, preferably 1.3 to 1.6. For example, CaF2, MgF2, Na
AlF6, Al2O3, SiOx (x = 1 to 2), Th
F4 and the like are preferable, and among them, SiOx is most preferable. These materials may be used in combination of two or more according to the purpose. The thickness of the dielectric is preferably 100 ° or more, usually 100 to 3000 °, preferably 20 °.
0 to 1500 ° is good. If it is thin, it is difficult to obtain a continuous film, and the effect of improving transparency and abrasion resistance is small. If it is thick, conductivity and transparency are deteriorated, and cracks are easily generated. The dielectric can be formed by a known method such as a vacuum deposition method, a sputtering method, an ion plating method, and a coating method.

Next, there are cases where various functions are imparted to the transparent conductive laminate depending on the purpose. Rather, these are often more preferable embodiments. This will be described below.

The film substrate is apt to be scratched during the formation of the transparent conductive thin film, subsequent processing, or assembling of the apparatus, and the surface of the laminate opposite to the surface on which the conductive thin film is formed is bare. In addition, there is a problem that surface scratches are liable to occur during use and the visibility of the whole thin film product is reduced due to this. To avoid this, it is preferable to use a film substrate which has been subjected to a hard coat treatment. The hard coat treatment can be performed on both surfaces or one surface of the film before bonding via an adhesive, or can be performed on both or one surface of the outer surface after bonding. The most important thing when performing a hard coat is what was performed on the outer surface of the laminated body opposite to the conductive thin film. As the hard coat treatment layer, a cured film made of a curable resin such as a melanin resin, a urethane resin, an alkyd resin, an acrylic resin, and a silicon resin is preferably used. Among the hard coat treatment layers, an acrylic resin is most preferably used because it may enhance the adhesion of the conductive thin film and also has an effect as a base material before forming the conductive film. In forming the cured film, a composition obtained by adding various additives such as an antistatic agent and a polymerization initiator to the above-described curable resin as necessary is usually diluted with a solvent to have a solid content of 20 to It is adjusted to 80% by weight, and this is coated on one surface of a transparent film substrate by a general solution coating means such as a gravure coater, a reverse coater, a spray coater, and the like.
After application by a means such as a slot orifice coater or screen printing so that the thickness after drying and curing is about 1 to 15 μm, the composition can be cured by heating, drying, ultraviolet irradiation, electron beam irradiation, or heating. Prior to the formation of this hard coat treatment layer, the adherence between the transparent film and the hard coat treatment layer is performed by subjecting the adherend surface to easy adhesion treatment such as corona discharge, ultraviolet irradiation, plasma treatment, sputter etching treatment, and primer treatment. Can be increased.

In addition, since the surface of the transparent conductive laminate opposite to the surface on which the transparent conductive film is formed is bare, glare and scratches on the surface cause these problems. Products using a transparent conductive thin film have a problem of poor visibility. In order to solve this problem, an antiglare agent coated on the outer surface of the film is preferably used. The anti-glare treatment agent is preferably a cured film obtained by dispersing and binding silica particles to the above-mentioned hard coat agent. The silica particles used here are amorphous and porous, and a typical example thereof is silica gel. The average particle diameter is usually 30 μm or less, preferably about 2 to 15 μm, and the mixing ratio is preferably such that silica particles are 0.1 to 10 parts by weight with respect to 100 parts by weight of the resin. When the amount is small, the antiglare effect is inferior, and when the amount is large, the light transmittance and the film strength are reduced. The anti-glare treatment agent can be applied to the film and cured in exactly the same manner as in the hard coat treatment described above. The anti-glare treatment agent also serves as a hard coat treatment and provides not only an anti-glare effect but also an anti-scratch effect.

Next, a transparent conductive laminate provided with an antireflection layer will be described. The transparent conductive thin film is used for a display device, and when light is reflected on the surface, an image becomes unclear and, in some cases, the image becomes difficult to see. Those having high light transmittance, excellent scratch resistance on the substrate surface, and also having an antireflection function capable of preventing light reflection on the substrate surface are practically more preferable transparent conductive laminates. . The anti-reflection layer is formed and bonded to the film substrate before bonding with an adhesive, as described in the above hard coat, or after bonding the film or after forming the conductive thin film to be performed thereafter. Is formed on the outer surface where the conductive thin film is not formed. The antireflection layer includes a single-layer structure having a refractive index different from that of the film substrate or a multilayer structure of two or more layers. In a single-layer structure, a material having a smaller refractive index than the film substrate is selected. In order to make the antireflection effect more excellent, in the case of a multilayer structure, a material layer having a larger refractive index than a film substrate is provided, and a material layer having a smaller refractive index is provided thereon. As described above, the material configuration is such that the refractive index differs between adjacent layers. More preferably, a material having a multilayer structure of three or more layers in which the refractive index of the outermost layer is smaller than the refractive index of the lower layer adjacent thereto. The configuration is good. Examples of a material for forming such an antireflection layer include CaF2, MgF2, and NaA.
IF4, Al2O3, SiOx (x = 1 to 2), ThF
4, ZrO2, Sh2O3, Nd2O3, SnO2, T
Derivatives such as iO2 and In2O3 are exemplified. The refractive index is appropriately selected so as to satisfy the above relationship. This antireflection layer can be formed by a thin film forming technique similar to that of the conductive layer. The thickness is selected within a range where the total thickness of the antireflection layer is generally about 500 to 5000 °. Since this layer also increases the hardness of the surface, the scratch resistance is also improved.

Further, since this transparent conductive laminate is used for a display device, fingerprints and stains are generated on the surface thereof during processing and use, and there is a problem in the visibility of the whole thin film product such as feeling of glare. May have occurred. In order to solve this problem, a laminate having a water-repellent and stain-proofing treatment layer on the outer surface of the laminate is a more preferable transparent conductive laminate depending on the use. The water-repellent and stain-prevention treatment layer can be formed on the outer surface of the film in exactly the same manner as the formation of the hard coat. As a material for forming such a water-repellent and stain-prevention treatment layer, for example, a silicon-containing compound composed of a combination of dimethylpolysiloxane and methylhydrogenpolysiloxane containing a hydroxyl group or a vinyl group, polytetrafluoroethylene,
In addition to fluorine-based resins such as polychlorotrifluoroethylene, molybdenum sulfide or the like is used alone or as a compound. In order to improve the adhesion and hardness of the treatment layer, the treatment layer may be dispersed and bound to a curable resin such as a hard coat agent as described above, and may be provided as a cured film layer on the substrate surface. Further, for the purpose of enhancing the antiglare effect and the scratch resistance, the silica particles can be dispersed. The formation of the water repellent and stain preventing layer is not particularly limited, and a coating method, a spray method, a vacuum evaporation method, a sputtering method, an ion plating method, a baking method, or the like can be used depending on a material to be used. Although the thickness of the treatment layer is not particularly limited, it is usually 100 to 50 μm.
Good degree. If it is thin, it is difficult to obtain a continuous film, and the water-repellent effect is poor. If it is thick, cracks tend to occur.

The above-mentioned functionalization treatment can be carried out in combination of two or more kinds. In particular, it is efficient to use a combination of a hard coat agent, an anti-glare treatment, and a water repellent or stain preventive treatment. .

【The invention's effect】

As described above, in the present invention, in order to form a conductive thin film after bonding two films having a specific thickness with an adhesive, the film strength is increased by bonding, and the film is continuously rolled. When forming a conductive thin film on the film, undulation and sagging of the film hardly occurs, heat loss and film cutting do not occur, as a result a uniform conductive thin film is obtained,
Another object of the present invention is to provide a transparent conductive laminate having improved abrasion resistance and hitting characteristics due to a cushion effect of an adhesive.

【Example】

Hereinafter, the present invention will be described more specifically with reference to examples. Example 1 As a film A, a polyethylene terephthalate (PET) film having a thickness of 25 μm was used, and as a film B, a PET film having a thickness of 100 μm was used. dyn / c
m2, an acrylic transparent pressure-sensitive adhesive layer (butyl acrylate, acrylic acid, and vinyl acetate having a polymerization ratio of 100:
100 parts by weight of a 2: 5 copolymer and 1 part by weight of an isocyanate-based crosslinking agent) were formed to a thickness of about 20 μm, and a film B was laminated thereon. The laminated film is wound into a roll having a width of 750 mm,
It is set in a continuous sputtering apparatus having an effective width of 700 mm, and is composed of 80% of argon gas and 20% of oxygen.
In an atmosphere of 4 Torr, a transparent conductive thin film made of a composite oxide of indium oxide and tin oxide was formed to a thickness of 410 ° by a reactive sputtering method using an indium-tin alloy. The average resistance value of the conductive thin film, the resistance value ratio between the central portion and the end portion of the film, the transmittance, the scratch resistance, and the hitting point characteristics were measured and are shown in Table-2. Examples 2 to 6 and Comparative Examples 1 and 2 Except for using those shown in Table 1 as films A and B, a transparent conductive laminate was produced in the same manner as in Example 1,
The properties were measured. Comparative Example 3 A conductive thin film was formed on a film A under the same conditions as in Example 1, and a film B was adhered to the film.
A transparent conductive laminate was produced under the same conditions as in Example 1 and the characteristics were measured. The results are shown in Table-2. Comparative Example 4 A conductive thin film was formed on a 125 μm PET film under the same conditions as in Example 1, and the characteristics were measured. The results are shown in Table-2.

The method for measuring the characteristics of the produced film is as follows.・ Average resistance value ・ ・ Using the four terminal method, width 700mm, length 1
m were measured at equal intervals at 50 points, and the average value was calculated. -Variation in resistance value-Calculated and calculated as the ratio of the average value of the resistance values at the ends to the average value of the resistance values at the center. -Transmittance-The transmittance of light having a wavelength of 550 nm was determined using a spectral transmittance meter.・ Scratch resistance ・ ・ Using a Haydon surface property measuring instrument, load 10
After the surface of the thin film was rubbed with a gauze of 0 g / cm2 under the conditions of a scratching speed of 30 cm / min and a number of scratches of 100, the resistance value (Rs) was measured, and the rate of change from the initial value (Ro) was determined.・ Rotation point characteristics ・ ・ Two sheets of transparent conductive laminated film with thickness of 1
The conductive thin films are disposed so as to face each other via a spacer of 00 μm, and a rod (key tip 7R) made of urethane rubber having a hardness of 40 degrees is used to load the conductive thin films at a load of 100 g.
After the center was hit ten thousand times, the resistance value (Rd) was measured, and the rate of change with respect to the initial resistance value (Ro) was determined.・ 60 ° gloss, visibility ・ ・ Measure the 60 ° gloss on the surface opposite to the surface of the conductive thin film using a goniophotometer manufactured by Suga Test Instruments Co., Ltd. A scratch test was performed by rubbing with wool # 0000, and the surface state was visually observed. A was evaluated on a three-point scale, in which A was not damaged even when rubbed strongly, B was damaged when rubbed strongly, and C was damaged when rubbed lightly.

As is clear from the above results, the transparent conductive laminate of the present invention forms a conductive thin film by laminating two films, so that the strength of the film increases when the conductive thin film is formed by sputtering. As a result, there is obtained a transparent conductive laminate having no looseness or the like, a small variation in resistance value over the entire surface of the film, and an excellent abrasion resistance and hitting point characteristics because the cushioning effect of the adhesive is utilized. No breakage of the film occurred during continuous sputtering. Comparative Examples 1-2 have a total thickness of 300 μm
And the roll habit remained in the continuous sputtering, and the measurement of the properties was barely performed. However, in view of industrial production, substantial production was difficult. Comparative Example 3 was 25 μm
In order to form a conductive thin film on a thin film by sputtering, the sag of the film occurs, so that the resistance value difference between the center portion and the end portion of the film was large. At the time of setting the film speed, the film was broken twice. Comparative Example 4
Has no problem of uniformity of the resistance value because of no bonding, but has extremely poor scratch resistance and hitting point characteristics.

Example 7 On one surface of the film B having a thickness of 100 μm in Example 1,
To 100 parts by weight of an acrylic urethane resin made by Dainippon Ink, 5 parts by weight of Irgacure 184 made by Ciba-Geigy was added as a photopolymerization initiator, and a 50% by weight toluene solution was applied. Irradiation,
Example 1 except that a hard coat treatment with a thickness of 8 μm was performed.
A transparent conductive laminate was produced in exactly the same manner as described above.
Table 3 shows the evaluation results. Comparative Example 5 Except that the same hard coat treatment as in Example 7 was performed on the film B, exactly as in Comparative Example 3,
A transparent conductive laminate was produced. Table 3 shows the evaluation results. Example 1 Example 1 in which a transparent conductive laminate was produced in exactly the same manner as in Example 7 except that the hard coat treatment was not performed.
Was further evaluated for visibility. Table 3 shows the evaluation results. As is clear from these results, it is found that the transparent conductive laminate of the present invention which has been subjected to the hard coating has a small variation in resistance value, is excellent in hitting point characteristics, and has excellent visibility.
Comparative Example 5 has a large variation in the resistance value.
Poor visibility.

Example 8 One side of the film B in Example 1 was coated with a solution obtained by adding 5 parts by weight of a photopolymerization initiator to 3% by weight of silica particles having a particle diameter of 10 μm dispersed in an acrylic resin. , 1
After drying at 00 ° C, it is cured by irradiating ultraviolet rays.
A transparent conductive laminate was produced in exactly the same manner as in Example 1 except that a cured film of 7 μm was formed and an antiglare treatment was performed.
Table 4 shows the evaluation results. Comparative Example 6 A transparent conductive laminate was produced and evaluated in exactly the same manner as in Comparative Example 3, except that the film B was subjected to an anti-glare treatment in the same manner as in Example 8. The results are shown in Table-4. Example 1 A transparent conductive laminate was prepared in exactly the same manner as in Example 8 except that the antiglare treatment was not performed, and the evaluation of the antiglare effect was additionally performed on Example 1 in which a transparent conductive laminate was produced. Table 4 shows the evaluation results. As is clear from the above results, the conductive laminate of the present invention subjected to the anti-glare treatment has a small variation in resistance value, has excellent hitting characteristics, exhibits excellent anti-glare properties, and has excellent visibility. I understand. Comparative Example 7 has a large variation in resistance value, and Comparative Example 8 has inferior antiglare properties.

Claims (1)

[Claims] 1. A transparent film substrate having a thickness of 2 to 300 μm is bonded to one surface of a transparent film substrate having a thickness of 2 to 300 μm via a transparent pressure-sensitive adhesive layer having a thickness of 1 μm or more. And a transparent conductive thin film having a thickness of 50 ° or more is formed on the outer surface of any one of the film bases after the total thickness is 40 to 300 μm.