JP2002134860A - Flexible printed wiring board - Google Patents
Flexible printed wiring boardInfo
- Publication number
- JP2002134860A JP2002134860A JP2000322045A JP2000322045A JP2002134860A JP 2002134860 A JP2002134860 A JP 2002134860A JP 2000322045 A JP2000322045 A JP 2000322045A JP 2000322045 A JP2000322045 A JP 2000322045A JP 2002134860 A JP2002134860 A JP 2002134860A
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- wiring board
- printed wiring
- reinforcing
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】
【課題】 プリント基板に対する電気的接続を強固に行
えるフレキシブルプリント配線板を提供する。
【解決手段】 プリント基板１に対して接合される補強
ランド９の近傍に応力分散用の切り欠き部１０を形成す
る。プリント基板１からフレキシブルプリント配線板４
を引き剥がすように働く引き剥がし応力Ｆ１を切り欠き
部１０によって分散できるので、補強ランド９にかかる
引き剥がし応力Ｆ２を低減することができ、この補強ラ
ンド９の補強対象である接点パターン８における接続を
確実にできる。
(57) [Problem] To provide a flexible printed wiring board capable of firmly making an electrical connection to a printed circuit board. SOLUTION: A notch 10 for dispersing stress is formed in the vicinity of a reinforcing land 9 joined to a printed board 1. From printed circuit board 1 to flexible printed wiring board 4
Since the peeling stress F1 acting to peel off the reinforcing land 9 can be dispersed by the notch portion 10, the peeling stress F2 applied to the reinforcing land 9 can be reduced, and the connection of the reinforcing land 9 in the contact pattern 8 to be reinforced is performed. Can be assured.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板に接
続されるフレキシブルプリント配線板に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board connected to a printed circuit board.
【０００２】[0002]
【従来の技術】プリント基板に対するフレキシブルプリ
ント配線板の接続構造は、特開平５−９０７２５公報な
どに開示されている。この種の接続構造では、図３に示
すように、フレキシブルプリント配線板１１の端部に形
成した接点パターン１２をプリント基板１３上の接点パ
ターン１４に重ねあわせ、各接点パターン１２，１４の
表面に予め付着させた半田を溶融させることにより電気
的接続を与えている。また、フレキシブルプリント配線
板１１の引き剥がしに抗する補強を、プリント基板１３
の端部とフレキシブルプリント配線板１１の対向位置と
に設けた補強ランド１５，１６どうしを半田付けするこ
とにより与えている。2. Description of the Related Art A connection structure of a flexible printed wiring board to a printed circuit board is disclosed in Japanese Patent Application Laid-Open No. Hei 5-90725. In this type of connection structure, as shown in FIG. 3, a contact pattern 12 formed on an end of a flexible printed wiring board 11 is superimposed on a contact pattern 14 on a printed circuit board 13, and the surface of each contact pattern 12, The electrical connection is provided by melting the solder previously deposited. Further, the reinforcement against the peeling of the flexible printed wiring board 11 is provided on the printed circuit board 13.
The reinforcing lands 15 and 16 provided at the end of the flexible printed wiring board 11 and the opposite end of the flexible printed wiring board 11 are provided by soldering.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上記し
たような従来の接続構造において接続保持力を増加する
には、補強ランド１５，１６の面積を拡大したり、ある
いは補強ランド１５，１６をスルーホール構造にしその
内部まで半田を浸透させて補強する、などの接着強度を
増す方法をとらねばならず、フレキシブルプリント配線
板の両面化が必要になりコストアップしたり、また補強
ランドの面積拡大が商品の小型化の妨げになっていた。However, in order to increase the connection holding force in the above-described conventional connection structure, the area of the reinforcing lands 15 and 16 must be increased, or the reinforcing lands 15 and 16 must be formed through holes. It is necessary to adopt a method to increase the bonding strength, such as strengthening the structure by infiltrating solder to the inside, so that it is necessary to use a flexible printed wiring board on both sides, increasing costs and increasing the area of the reinforcing land Hindered the miniaturization of
【０００４】本発明は上記問題を解決するもので、プリ
ント基板に対する電気的接続を強固にかつ容易に行える
フレキシブルプリント配線板を提供することを目的とす
る。An object of the present invention is to provide a flexible printed wiring board which can firmly and easily make an electrical connection to a printed circuit board.
【０００５】[0005]
【課題を解決する為の手段】上記課題を解決するために
本発明は、プリント基板の接点パターンに対して半田付
けにより電気的に接続される接点パターンが前記プリン
ト基板に対向配置される対向面の一端部に形成され、こ
の対向面内における前記一端部に背反する他端部寄りの
位置に前記プリント基板に対して接合される補強ランド
が形成されたフレキシブルプリント配線板において、前
記接点パターンに背反する前記補強ランドの近傍位置に
応力分散用の切り欠き部を形成したことを特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to an opposing surface on which a contact pattern electrically connected to a contact pattern of a printed board by soldering is arranged facing the printed board. The flexible printed wiring board is formed at one end of the flexible printed circuit board and has a reinforcing land bonded to the printed board at a position near the other end opposite to the one end in the facing surface. A notch portion for dispersing stress is formed at a position near the opposite reinforcing land.
【０００６】この構成によれば、フレキシブルプリント
配線板をプリント基板から引き剥がす力が発生しても切
り欠き部によって分散されるので、補強ランドへの負荷
が低減され、補強ランドの接合力は増大される。According to this structure, even if a force for peeling off the flexible printed wiring board from the printed circuit board is generated, the flexible printed wiring board is dispersed by the notch portion, so that the load on the reinforcing land is reduced and the bonding force of the reinforcing land is increased. Is done.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を用いて説明する。図１は、本発明の一実施形態
におけるフレキシブルプリント配線板をプリント基板に
接続した状態を示す。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a state in which a flexible printed wiring board according to an embodiment of the present invention is connected to a printed circuit board.
【０００８】プリント基板１には、接点パターン２が一
定のピッチで平行に形成されており、この接点パターン
２よりも基板端寄りの位置に、接点パターン２の接続を
補強するための補強ランド３が接点パターン２の両側に
位置するように１対形成されている。接点パターン２、
補強ランド３の表面には予備半田が施されている。Contact patterns 2 are formed in parallel on the printed circuit board 1 at a constant pitch. Reinforcement lands 3 for reinforcing the connection of the contact patterns 2 are provided at positions closer to the end of the board than the contact patterns 2. Are formed on both sides of the contact pattern 2. Contact pattern 2,
Preliminary solder is applied to the surface of the reinforcing land 3.
【０００９】フレキシブルプリント配線板４は、銅箔パ
ターン５を、耐熱性、曲げ、破れ等に強いポリイミドな
どからなる被覆層６、７で被って形成されたものであ
り、その一端部では、プリント基板１の接点パターン２
に対向配置される被覆層６が部分的に除去され、銅箔パ
ターン５の一部を構成する接点パターン８が露出されて
いる。また、一端部に背反する他端部寄りの位置には、
被覆層６の除去によって、プリント基板１の補強ランド
３に対して接合される補強ランド９が形成されている。
補強ランド９の中央部の孔は半田付けの際のガス抜き用
である。これらの接点パターン８、補強ランド９は、プ
リント基板１の接点パターン２，補強ランド３とほぼ同
形状に形成されており、表面に半田メッキ処理が施され
ている。The flexible printed wiring board 4 is formed by covering a copper foil pattern 5 with coating layers 6 and 7 made of polyimide or the like which is resistant to heat resistance, bending, tearing, and the like. Contact pattern 2 of substrate 1
Is partially removed, and the contact pattern 8 constituting a part of the copper foil pattern 5 is exposed. Also, at a position near the other end opposite to one end,
The removal of the coating layer 6 forms the reinforcing lands 9 joined to the reinforcing lands 3 of the printed circuit board 1.
The hole at the center of the reinforcing land 9 is for venting gas at the time of soldering. The contact patterns 8 and the reinforcing lands 9 are formed in substantially the same shape as the contact patterns 2 and the reinforcing lands 3 of the printed circuit board 1, and the surfaces thereof are subjected to solder plating.
【００１０】さらにこのフレキシブルプリント配線板４
には、補強ランド９よりも他端部寄りかつ補強ランド９
の近傍であって、長手方向に沿った両縁部に、奥部がＲ
形状をなす応力分散用の切り欠き部１０が、幅方向に沿
って補強ランド９よりも中央側まで形成されている。こ
こで長手方向とは、接点パターン８の配列方向と交わる
方向であり、幅方向とは、接点パターン８の配列方向に
沿う方向である。Further, the flexible printed wiring board 4
Is located closer to the other end than the reinforcing land 9 and the reinforcing land 9
Near both edges along the longitudinal direction,
A notched portion 10 for stress dispersion, which forms a shape, is formed along the width direction to the center side of the reinforcing land 9. Here, the longitudinal direction is a direction crossing the arrangement direction of the contact patterns 8, and the width direction is a direction along the arrangement direction of the contact patterns 8.
【００１１】このようなフレキシブルプリント配線板４
をプリント基板１に対して接続する際には、位置決め冶
具等の方法で位置合わせを行って、接点パターン８，２
および補強ランド９，３を互いに密着させ、半田ごて、
治具、あるいはレーザーなどの加熱手段で加熱すること
により、接点パターン８，２および補強ランド９，３の
上の半田を溶融させ、固着させる。Such a flexible printed wiring board 4
When connecting the contact patterns 8 and 2 to the printed circuit board 1, the contact patterns 8 and 2 are aligned by using a positioning jig or the like.
And the reinforcing lands 9 and 3 are brought into close contact with each other,
By heating with a jig or a heating means such as a laser, the solder on the contact patterns 8, 2 and the reinforcing lands 9, 3 is melted and fixed.
【００１２】このようにすることにより、図２に示すよ
うに、フレキシブルプリント配線板４をプリント基板１
から引き剥がす力（こじり応力）が働いた時に、この引
き剥がし応力Ｆ１が切り欠き部１０と被覆層６，７の存
在によって分散されることになり、補強ランド９にかか
る引き剥がし応力Ｆ２は引き剥がし力Ｆ１よりも低減さ
れ、補強ランド９，３の接続は保持される結果、接点パ
ターン８，２の接続は強固に保持される。In this way, as shown in FIG. 2, the flexible printed wiring board 4 is
When a peeling force (torsion stress) acts on the reinforcing land 9, the peeling stress F1 is dispersed by the presence of the notch 10 and the coating layers 6, 7, and the peeling stress F2 applied to the reinforcing land 9 is reduced. As a result, the connection between the reinforcing lands 9 and 3 is maintained, so that the connection between the contact patterns 8 and 2 is firmly maintained.
【００１３】したがって、切り欠き部１０がない従来構
造よりも接続保持力を増大することができ、逆に言う
と、補強ランド９，３を小さくしても従来と同等の強固
な接続が得られる。接点パターン２，補強ランド９を同
時に形成し、切り欠き部１０を形成するだけなので、コ
ストアップすることもない。Therefore, the connection holding force can be increased as compared with the conventional structure having no notch 10, and conversely, even if the reinforcing lands 9 and 3 are reduced, the same strong connection as before can be obtained. . Since only the contact pattern 2 and the reinforcing land 9 are formed at the same time and the notch 10 is formed, the cost does not increase.
【００１４】なお、引き剥がし応力Ｆ１が一方の補強ラ
ンド９にのみ働き易い場合は、その補強ランド９の近傍
にのみ、つまり片方の縁部にのみ、切り欠き部１０を形
成すればよい。When the peeling stress F1 easily acts on only one of the reinforcement lands 9, the cutout portion 10 may be formed only in the vicinity of the reinforcement land 9, that is, only on one edge.
【００１５】[0015]
【発明の効果】以上のように、本発明のフレキシブルプ
リント配線板によれば、接点パターンの接続を補強する
ための補強ランドの近傍に切り欠き部を形成するという
簡単な構成により、補強ランドにかかる引き剥がし応力
を分散させ補強力を増大させることが可能になり、プリ
ント基板に対する接続保持強度を増大できる。As described above, according to the flexible printed wiring board of the present invention, the reinforcing land has a simple configuration in which the notch is formed near the reinforcing land for reinforcing the connection of the contact pattern. It is possible to increase the reinforcing force by dispersing the peeling stress, and to increase the connection holding strength to the printed circuit board.
【図１】本発明の一実施形態におけるフレキシブルプリ
ント配線板をプリント基板に接続した状態を示す説明図FIG. 1 is an explanatory view showing a state in which a flexible printed wiring board according to an embodiment of the present invention is connected to a printed circuit board.
【図２】図１のフレキシブルプリント配線板に引き剥が
し力が働いた時の状態を示す説明図FIG. 2 is an explanatory view showing a state when a peeling force is applied to the flexible printed wiring board of FIG. 1;
【図３】従来のフレキシブルプリント配線板をプリント
基板に接続した状態を示す説明図FIG. 3 is an explanatory view showing a state in which a conventional flexible printed wiring board is connected to a printed circuit board.
１ プリント基板 ２ 接点パターン ３ 補強ランド ４ フレキシブルプリント配線板 ６，７ 被覆層 ８ 接点パターン ９ 補強ランド 10 切り欠き部 F1，F2 引き剥がし応力 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Contact pattern 3 Reinforcement land 4 Flexible printed wiring board 6, 7 Coating layer 8 Contact pattern 9 Reinforcement land 10 Notch F1, F2 Peeling stress
Claims (1)
田付けにより電気的に接続される接点パターンが前記プ
リント基板に対向配置される対向面の一端部に形成さ
れ、この対向面内における前記一端部に背反する他端部
寄りの位置に前記プリント基板に対して接合される補強
ランドが形成されたフレキシブルプリント配線板におい
て、 前記接点パターンに背反する前記補強ランドの近傍位置
に応力分散用の切り欠き部が形成されたことを特徴とす
るフレキシブルプリント配線板。1. A contact pattern which is electrically connected to a contact pattern of a printed circuit board by soldering is formed at one end of a facing surface arranged to face the printed circuit board, and the one end in the facing surface is formed. In a flexible printed wiring board in which a reinforcing land joined to the printed circuit board is formed at a position near the other end opposite to the above, a notch for dispersing stress is provided at a position near the reinforcing land which is contrary to the contact pattern. A flexible printed wiring board having a portion formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000322045A JP2002134860A (en) | 2000-10-23 | 2000-10-23 | Flexible printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000322045A JP2002134860A (en) | 2000-10-23 | 2000-10-23 | Flexible printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002134860A true JP2002134860A (en) | 2002-05-10 |
Family
ID=18799988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000322045A Pending JP2002134860A (en) | 2000-10-23 | 2000-10-23 | Flexible printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002134860A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005039257A1 (en) * | 2003-10-21 | 2005-04-28 | Rohm Co., Ltd. | Circuit board |
| JP2007281012A (en) * | 2006-04-03 | 2007-10-25 | Nec Electronics Corp | Flexible board and mounting device with the same mounted thereon |
| JP2008263122A (en) * | 2007-04-13 | 2008-10-30 | Oki Electric Ind Co Ltd | Optical module apparatus |
| US7719650B2 (en) * | 2005-07-08 | 2010-05-18 | Hitachi Displays, Ltd. | Display panel and display device |
| CN102650534A (en) * | 2011-02-22 | 2012-08-29 | 日本电产三协株式会社 | Sensor unit and composite substrate thereof |
| JP2015073064A (en) * | 2013-09-05 | 2015-04-16 | 株式会社フジクラ | Printed wiring board and connector connecting wiring board |
| JP2015073063A (en) * | 2013-09-05 | 2015-04-16 | 株式会社フジクラ | Printed wiring board and connector for connecting the wiring board |
| WO2016013431A1 (en) * | 2014-07-22 | 2016-01-28 | 株式会社フジクラ | Printed wiring board |
| JPWO2014171334A1 (en) * | 2013-04-19 | 2017-02-23 | 株式会社村田製作所 | Flexible substrate |
| JP2017173745A (en) * | 2016-03-25 | 2017-09-28 | 住友大阪セメント株式会社 | Optical modulator with fpc, and optical transmission device using same |
| WO2017168790A1 (en) * | 2016-03-30 | 2017-10-05 | 住友大阪セメント株式会社 | Optical modulator with fpc and optical transmission device using same |
| US11317027B2 (en) | 2019-05-22 | 2022-04-26 | Canon Kabushiki Kaisha | Imaging unit and imaging apparatus |
-
2000
- 2000-10-23 JP JP2000322045A patent/JP2002134860A/en active Pending
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005039257A1 (en) * | 2003-10-21 | 2005-04-28 | Rohm Co., Ltd. | Circuit board |
| US7719650B2 (en) * | 2005-07-08 | 2010-05-18 | Hitachi Displays, Ltd. | Display panel and display device |
| JP2007281012A (en) * | 2006-04-03 | 2007-10-25 | Nec Electronics Corp | Flexible board and mounting device with the same mounted thereon |
| JP2008263122A (en) * | 2007-04-13 | 2008-10-30 | Oki Electric Ind Co Ltd | Optical module apparatus |
| CN102650534A (en) * | 2011-02-22 | 2012-08-29 | 日本电产三协株式会社 | Sensor unit and composite substrate thereof |
| JP2012173179A (en) * | 2011-02-22 | 2012-09-10 | Nidec Sankyo Corp | Sensor unit and composite substrate |
| JPWO2014171334A1 (en) * | 2013-04-19 | 2017-02-23 | 株式会社村田製作所 | Flexible substrate |
| JP2015073064A (en) * | 2013-09-05 | 2015-04-16 | 株式会社フジクラ | Printed wiring board and connector connecting wiring board |
| JP2015073063A (en) * | 2013-09-05 | 2015-04-16 | 株式会社フジクラ | Printed wiring board and connector for connecting the wiring board |
| KR102098885B1 (en) | 2013-09-05 | 2020-04-08 | 가부시키가이샤후지쿠라 | Printed wiring board and connector connecting said wiring board |
| KR20180028526A (en) * | 2013-09-05 | 2018-03-16 | 가부시키가이샤후지쿠라 | Printed wiring board and connector connecting said wiring board |
| WO2016013431A1 (en) * | 2014-07-22 | 2016-01-28 | 株式会社フジクラ | Printed wiring board |
| JP2016025232A (en) * | 2014-07-22 | 2016-02-08 | 株式会社フジクラ | Printed wiring board |
| US9788426B2 (en) | 2014-07-22 | 2017-10-10 | Fujikura Ltd. | Printed wiring board |
| KR101877321B1 (en) * | 2014-07-22 | 2018-07-11 | 가부시키가이샤후지쿠라 | Printed wiring board |
| WO2017163459A1 (en) * | 2016-03-25 | 2017-09-28 | 住友大阪セメント株式会社 | Optical modulator with fpc, and optical transmission device using same |
| US10595398B2 (en) | 2016-03-25 | 2020-03-17 | Sumitomo Osaka Cement Co., Ltd | Optical modulator with FPC, and optical transmission apparatus using same |
| JP2017173745A (en) * | 2016-03-25 | 2017-09-28 | 住友大阪セメント株式会社 | Optical modulator with fpc, and optical transmission device using same |
| JP2017181768A (en) * | 2016-03-30 | 2017-10-05 | 住友大阪セメント株式会社 | Optical modulator with fpc, and optical transmission device using the same |
| WO2017168790A1 (en) * | 2016-03-30 | 2017-10-05 | 住友大阪セメント株式会社 | Optical modulator with fpc and optical transmission device using same |
| CN108700759A (en) * | 2016-03-30 | 2018-10-23 | 住友大阪水泥股份有限公司 | Optical modulator with FPC and the light sending device for having used the optical modulator |
| US10477677B2 (en) | 2016-03-30 | 2019-11-12 | Sumitomo Osaka Cement Co., Ltd. | Optical modulator with FPC and optical transmission device using same |
| CN108700759B (en) * | 2016-03-30 | 2022-06-24 | 住友大阪水泥股份有限公司 | Optical modulator with FPC and optical transmitter using the same |
| US11317027B2 (en) | 2019-05-22 | 2022-04-26 | Canon Kabushiki Kaisha | Imaging unit and imaging apparatus |
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