JP2002121398A - Thermoplastic resin composition for hot plate welding - Google Patents
Thermoplastic resin composition for hot plate weldingInfo
- Publication number
- JP2002121398A JP2002121398A JP2000314748A JP2000314748A JP2002121398A JP 2002121398 A JP2002121398 A JP 2002121398A JP 2000314748 A JP2000314748 A JP 2000314748A JP 2000314748 A JP2000314748 A JP 2000314748A JP 2002121398 A JP2002121398 A JP 2002121398A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- hot plate
- plate welding
- resin composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 55
- 238000003466 welding Methods 0.000 title claims abstract description 49
- 239000011342 resin composition Substances 0.000 title claims abstract description 34
- 239000011256 inorganic filler Substances 0.000 claims abstract description 20
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims description 51
- 239000011347 resin Substances 0.000 claims description 51
- -1 polytetrafluoroethylene Polymers 0.000 claims description 18
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 16
- 229920001971 elastomer Polymers 0.000 claims description 16
- 239000005060 rubber Substances 0.000 claims description 15
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229920005668 polycarbonate resin Polymers 0.000 claims description 9
- 239000004431 polycarbonate resin Substances 0.000 claims description 9
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 8
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- 239000004480 active ingredient Substances 0.000 claims 1
- 230000003245 working effect Effects 0.000 abstract 1
- 239000000178 monomer Substances 0.000 description 44
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 20
- 229920002554 vinyl polymer Polymers 0.000 description 20
- 238000000034 method Methods 0.000 description 17
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 229920001577 copolymer Polymers 0.000 description 14
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000006116 polymerization reaction Methods 0.000 description 10
- 238000001125 extrusion Methods 0.000 description 9
- 238000004898 kneading Methods 0.000 description 8
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 5
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 229920000578 graft copolymer Polymers 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- 238000006358 imidation reaction Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000004816 latex Substances 0.000 description 3
- 229920000126 latex Polymers 0.000 description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- OYUNTGBISCIYPW-UHFFFAOYSA-N 2-chloroprop-2-enenitrile Chemical compound ClC(=C)C#N OYUNTGBISCIYPW-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010556 emulsion polymerization method Methods 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005453 pelletization Methods 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010558 suspension polymerization method Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- BAWHYOHVWHQWFQ-UHFFFAOYSA-N 1-naphthalen-1-ylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC2=CC=CC=C12 BAWHYOHVWHQWFQ-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- JCJIZBQZPSZIBI-UHFFFAOYSA-N 2-[2,6-di(propan-2-yl)phenyl]benzo[de]isoquinoline-1,3-dione Chemical compound CC(C)C1=CC=CC(C(C)C)=C1N(C1=O)C(=O)C2=C3C1=CC=CC3=CC=C2 JCJIZBQZPSZIBI-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical group N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004419 Panlite Substances 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- KFRFCPCUEHXWTN-UHFFFAOYSA-N [Na].[Na].[Na].[Na].NCCN Chemical compound [Na].[Na].[Na].[Na].NCCN KFRFCPCUEHXWTN-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229940091181 aconitic acid Drugs 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- BPOZNMOEPOHHSC-UHFFFAOYSA-N butyl prop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCOC(=O)C=C BPOZNMOEPOHHSC-UHFFFAOYSA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
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- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
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- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- KETWBQOXTBGBBN-UHFFFAOYSA-N hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1 KETWBQOXTBGBBN-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229940044600 maleic anhydride Drugs 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- DADSZOFTIIETSV-UHFFFAOYSA-N n,n-dichloroaniline Chemical compound ClN(Cl)C1=CC=CC=C1 DADSZOFTIIETSV-UHFFFAOYSA-N 0.000 description 1
- ILCQYORZHHFLNL-UHFFFAOYSA-N n-bromoaniline Chemical compound BrNC1=CC=CC=C1 ILCQYORZHHFLNL-UHFFFAOYSA-N 0.000 description 1
- KUDPGZONDFORKU-UHFFFAOYSA-N n-chloroaniline Chemical compound ClNC1=CC=CC=C1 KUDPGZONDFORKU-UHFFFAOYSA-N 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920000131 polyvinylidene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- XWGJFPHUCFXLBL-UHFFFAOYSA-M rongalite Chemical compound [Na+].OCS([O-])=O XWGJFPHUCFXLBL-UHFFFAOYSA-M 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 235000019731 tricalcium phosphate Nutrition 0.000 description 1
- XQQWBPOEMYKKBY-UHFFFAOYSA-H trimagnesium;dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[O-]C([O-])=O.[O-]C([O-])=O XQQWBPOEMYKKBY-UHFFFAOYSA-H 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、衝撃強度、耐熱
性、流動性の物性バランスに優れた熱可塑性樹脂組成物
で、特に熱可塑性樹脂組成物の成形品を加熱した熱板に
より接合部を溶融後、加圧溶着することにより接合させ
る、いわゆる熱板溶着に適した成形品の原料となる熱板
溶着用熱可塑性樹脂組成物、並びにその成形品と同一樹
脂又は他樹脂成形品とを熱板溶着で接合した成形品に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoplastic resin composition having an excellent balance of impact strength, heat resistance, and fluidity, and more particularly, to a joining portion formed by heating a molded product of the thermoplastic resin composition with a heated plate. After melting, they are joined by pressure welding to form a thermoplastic resin composition for hot plate welding, which is a raw material of a molded product suitable for so-called hot plate welding, and heat the molded product and the same resin or another resin molded product. It relates to a molded product joined by plate welding.
【0002】[0002]
【従来の技術】従来から、樹脂成形品の接合には、熱板
溶着が用いられてきた。熱板溶着とは、例えば車両用照
明器具である樹脂成形品のウィンカーのハウジングとレ
ンズを接合する場合に、それぞれの接合部を熱板により
別々に溶融した後、即座にこれらの接合部を合わせ、加
圧して溶着させることにより接合させるものである。し
かし、この熱板溶着では、樹脂成形品を熱板から引き離
すときに、樹脂が糸状に引き伸ばされるいわゆる糸曳き
現象を起こし、これが成形品の表面に残り、外観不良及
び作業性の著しい低下を招いてしまう。この糸曳き現象
を改善するために、少量のポリテトラフルオロエチレン
等のフッ素樹脂を添加することが考えられるが、この場
合、高価でかつ押出混練時にサージング等により押出性
が不安定になったり、成形品にシルバー等の成形不良現
象が起きるといった問題点があった(特開平09−12
902号)。2. Description of the Related Art Conventionally, hot plate welding has been used for joining resin molded products. Hot plate welding means, for example, when joining a housing and a lens of a winker made of a resin molded product, which is a lighting device for a vehicle, after melting each joint separately with a hot plate and immediately joining these joints. Are joined by pressing and welding. However, in this hot plate welding, when the resin molded product is separated from the hot plate, a so-called stringing phenomenon occurs in which the resin is stretched in a thread shape, which remains on the surface of the molded product, resulting in poor appearance and markedly reduced workability. I will. In order to improve the stringing phenomenon, it is conceivable to add a small amount of a fluororesin such as polytetrafluoroethylene, but in this case, the extrudability becomes unstable due to surging at the time of extrusion and kneading, There was a problem that a molding failure phenomenon such as silver occurred in the molded product (Japanese Patent Laid-Open No. 09-12 / 09).
No. 902).
【0003】[0003]
【発明が解決しようとする課題】本発明は、このような
熱板溶着時に起こる糸曳き現象を解決し、成形品の外観
不良及び作業性の低下を改良することを目的とした、す
なわち熱板溶着時の糸曳きが改良され、かつ衝撃強度、
耐熱性、流動性の良好な熱板溶着用熱可塑性樹脂組成物
及び外観の優れた成形品を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to solve such a stringing phenomenon that occurs during welding of a hot plate, and to improve poor appearance of a molded article and decrease in workability. Stringing during welding has been improved, and the impact strength and
An object of the present invention is to provide a thermoplastic resin composition for hot plate welding having good heat resistance and fluidity and a molded article having excellent appearance.
【0004】[0004]
【課題を解決する為の手段】本発明者らは、上記課題を
解決すべく鋭意検討した結果、熱板溶着に用いる樹脂組
成物に、特定量の無機充填材と特定微量のフッ素樹脂を
添加することにより、熱板溶着時の糸曳きが画期的に改
良され、かつ衝撃強度、耐熱性、流動性の良好な熱板溶
着用に適する熱可塑性樹脂組成物及び外観の優れた成形
品を見出した。本発明において、(A)熱可塑性樹脂は
ゴム含有樹脂を含むことが好ましく、更に好ましくは、
ゴム含有樹脂とマレイミド樹脂、あるいはゴム含有樹脂
とポリカーボネート樹脂との混合物である。また、
(B)無機充填材は炭酸カルシウムであることが好まし
く、その炭酸カルシウムの比表面積径は1.2μm以下
であることが更に好ましい。更に、(C)フッ素樹脂は
ポリテトラフルオロエチレンであることが好ましい。Means for Solving the Problems The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, added a specific amount of an inorganic filler and a specific trace amount of a fluororesin to a resin composition used for hot plate welding. By doing so, stringing during hot plate welding is dramatically improved, and impact strength, heat resistance, and a thermoplastic resin composition suitable for hot plate welding with good fluidity and a molded article with excellent appearance are provided. I found it. In the present invention, (A) the thermoplastic resin preferably contains a rubber-containing resin, more preferably,
It is a mixture of a rubber-containing resin and a maleimide resin, or a rubber-containing resin and a polycarbonate resin. Also,
(B) The inorganic filler is preferably calcium carbonate, and the specific surface area of the calcium carbonate is more preferably 1.2 μm or less. Further, (C) the fluororesin is preferably polytetrafluoroethylene.
【0005】本発明の熱板溶着用熱可塑性樹脂組成物中
の(A)熱可塑性樹脂は、特に限定されるものではな
く、ゴム含有樹脂、マレイミド樹脂、SAN樹脂、ポリ
カーボネート樹脂、ナイロン−6、ナイロン−66、ナ
イロン−610、ナイロン−612、ナイロン−11、
ナイロン−12、ナイロン46等のポリアミド樹脂、ポ
リブチレンテレフタレート、ポリエチレンテレフタレー
ト等の飽和ポリエステル樹脂、ポリアリレート等の全芳
香族ポリエステル樹脂、ポリフェニレンオキサイド樹
脂、ポリフェニレンサルファイド樹脂、ポリサルホン樹
脂、ポリエーテルサルホン樹脂、ポリエチレン、ポリプ
ロピレン等のポリオレフィン樹脂等が挙げられ、これら
を単独あるいは2種類以上を混合して用いることができ
る。[0005] The thermoplastic resin (A) in the thermoplastic resin composition for hot plate welding of the present invention is not particularly limited, and rubber-containing resin, maleimide resin, SAN resin, polycarbonate resin, nylon-6, Nylon-66, nylon-610, nylon-612, nylon-11,
Nylon-12, polyamide resin such as nylon 46, polybutylene terephthalate, saturated polyester resin such as polyethylene terephthalate, wholly aromatic polyester resin such as polyarylate, polyphenylene oxide resin, polyphenylene sulfide resin, polysulfone resin, polyether sulfone resin, Examples thereof include polyolefin resins such as polyethylene and polypropylene, and these can be used alone or in combination of two or more.
【0006】本発明の熱板溶着用熱可塑性樹脂組成物中
に、熱可塑性樹脂を2種類以上混合して用いる場合、そ
の比率に特に制限はなく、要求特性等に応じて適宜決定
されるが、熱可塑性樹脂として少なくとも1種類以上の
ゴム含有樹脂を用いる場合、熱板溶着用熱可塑性樹脂組
成物中のゴム含有樹脂は10〜90重量%、他の熱可塑
性樹脂は7〜86重量%であることが好ましい。ゴム含
有樹脂の割合が10重量%未満では衝撃強度が低く、9
0重量%を越えると、耐熱性が極端に低くなる。When two or more kinds of thermoplastic resins are mixed and used in the thermoplastic resin composition for hot plate welding of the present invention, the ratio is not particularly limited, and is appropriately determined according to required characteristics and the like. When at least one kind of rubber-containing resin is used as the thermoplastic resin, the content of the rubber-containing resin in the thermoplastic resin composition for hot plate welding is 10 to 90% by weight, and the content of the other thermoplastic resin is 7 to 86% by weight. Preferably, there is. If the ratio of the rubber-containing resin is less than 10% by weight, the impact strength is low,
If it exceeds 0% by weight, the heat resistance becomes extremely low.
【0007】ゴム含有樹脂とは、ゴム状重合体に、芳香
族ビニル単量体単独、又はこれらと共重合可能なビニル
単量体とをグラフト重合してなる共重合体である。更に
これらに上記の芳香族ビニル単量体単独、又はこれらと
共重合可能なビニル単量体との重合体を含むことができ
る。ゴム状重合体の具体例としては、ブタジエン重合
体、ブタジエンと共重合可能なビニル単量体との共重合
体、エチレン−プロピレン共重合体、エチレン−プロピ
レン−ジエン共重合体、ブタジエンと芳香族ビニルとの
ブロック共重合体、アクリル酸エステル重合体およびア
クリル酸エステルとこれと共重合可能なビニル単量体と
の共重合体等が用いられる。[0007] The rubber-containing resin is a copolymer obtained by graft-polymerizing an aromatic vinyl monomer alone or a vinyl monomer copolymerizable therewith with a rubber-like polymer. Further, these may contain a polymer of the above-mentioned aromatic vinyl monomer alone or a vinyl monomer copolymerizable therewith. Specific examples of the rubbery polymer include a butadiene polymer, a copolymer of a vinyl monomer copolymerizable with butadiene, an ethylene-propylene copolymer, an ethylene-propylene-diene copolymer, and a mixture of butadiene and an aromatic polymer. A block copolymer with vinyl, an acrylate polymer, a copolymer of an acrylate ester with a vinyl monomer copolymerizable therewith, and the like are used.
【0008】芳香族ビニル単量体としてはスチレン、α
−メチルスチレン、ビニルトルエン、t−ブチルスチレ
ン、クロロスチレン等のスチレン単量体及びその置換体
が挙げられ、これらの中でスチレンが特に好ましい。上
記の単量体と共重合可能なビニル単量体としては、アク
リロニトリル、メタクリロニトリル、α−クロロアクリ
ロニトリル等のシアン化ビニル単量体、メチルアクリル
酸エステル、エチルアクリル酸エステル、ブチルアクリ
ル酸エステル等のアクリル酸エステル単量体、メチルメ
タクリル酸エステル、エチルメタクリル酸エステル等の
メタクリル酸エステル単量体、アクリル酸、メタクリル
酸等のビニルカルボン酸単量体、アクリル酸アミド及び
メタクリル酸アミド等が挙げられる。[0008] Styrene, α
Styrene monomers such as -methylstyrene, vinyltoluene, t-butylstyrene, chlorostyrene and the like and substituted products thereof are exemplified, and among these, styrene is particularly preferred. Vinyl monomers copolymerizable with the above monomers include acrylonitrile, methacrylonitrile, vinyl cyanide monomers such as α-chloroacrylonitrile, methyl acrylate, ethyl acrylate, butyl acrylate Acrylate monomers such as methacrylate esters such as methyl methacrylate and ethyl methacrylate, acrylic acid, vinyl carboxylic acid monomers such as methacrylic acid, acrylamide and methacrylamide. No.
【0009】このゴム含有樹脂の製造方法については特
に制限はなく、例えば芳香族ビニル単量体及びこれらと
共重合可能なビニル単量体からなる単量体混合物をゴム
状重合体にグラフト重合させることにより製造すること
ができる。具体的には、従来より知られている乳化重合
法、懸濁重合法、塊状重合法、溶液重合法等のいずれの
方法によって得られたものであっても良いし、またこれ
らの重合法を複合化した技術によるものでも良い。The method for producing the rubber-containing resin is not particularly limited. For example, a monomer mixture comprising an aromatic vinyl monomer and a vinyl monomer copolymerizable therewith is graft-polymerized to a rubber-like polymer. It can be manufactured by the following. Specifically, those obtained by any of the conventionally known emulsion polymerization method, suspension polymerization method, bulk polymerization method, solution polymerization method and the like may be used, or these polymerization methods may be used. Combination technology may be used.
【0010】本発明の熱板溶着用熱可塑性樹脂組成物中
の熱可塑性樹脂が、少なくとも1種類以上のゴム含有樹
脂とマレイミド樹脂との混合物である場合、熱板溶着用
熱可塑性樹脂組成物中のマレイミド樹脂は、5〜75重
量%の割合で用いることが好ましく、より好ましくは1
0〜60重量%であり、更に好ましくは10〜40重量
%である。マレイミド樹脂は、芳香族ビニル単量体25
〜70重量%、不飽和ジカルボン酸イミド誘導体25〜
75重量%、不飽和ジカルボン酸無水物単量体0〜25
重量%、及びこれら単量体と共重合可能なビニル単量体
0〜40重量%からなることが好ましい。またマレイミ
ド樹脂中の芳香族ビニル単量体としては、上述と同様の
スチレン、α−メチルスチレン、ビニルトルエン、t−
ブチルスチレン、クロロスチレン等のスチレン単量体及
びその置換体が挙げられ、これらの中でスチレンが特に
好ましい。[0010] When the thermoplastic resin in the thermoplastic resin composition for hot plate welding of the present invention is a mixture of at least one or more rubber-containing resins and a maleimide resin, the thermoplastic resin composition for hot plate welding is preferably used. Is preferably used in a proportion of 5 to 75% by weight, more preferably 1 to 75% by weight.
It is 0 to 60% by weight, more preferably 10 to 40% by weight. Maleimide resin is an aromatic vinyl monomer 25
~ 70 wt%, unsaturated dicarboxylic imide derivative 25 ~
75% by weight, unsaturated dicarboxylic anhydride monomer 0 to 25
%, And preferably 0 to 40% by weight of a vinyl monomer copolymerizable with these monomers. The aromatic vinyl monomer in the maleimide resin includes styrene, α-methylstyrene, vinyltoluene and t-
Examples thereof include styrene monomers such as butylstyrene and chlorostyrene and substituted products thereof, and among them, styrene is particularly preferred.
【0011】不飽和ジカルボン酸イミド誘導体として
は、マレイミド、N−メチルマレイミド、N−エチルマ
レイミド、N−シクロヘキシルマレイミド、N−フェニ
ルマレイミド、N−ナフチルマレイミド等のマレイミド
系単量体が挙げられ、これらの中でN−フェニルマレイ
ミドが特に好ましい。また、不飽和ジカルボン酸無水物
単量体としてはマレイン酸、イタコン酸、シトラコン
酸、アコニット酸等の無水物が挙げられ、マレイン酸無
水物が特に好ましい。上記の単量体と共重合可能なビニ
ル単量体としては、上述と同様のアクリロニトリル、メ
タクリロニトリル、α−クロロアクリロニトリル等のシ
アン化ビニル単量体、メチルアクリル酸エステル、エチ
ルアクリル酸エステル、ブチルアクリル酸エステル等の
アクリル酸エステル単量体、メチルメタクリル酸エステ
ル、エチルメタクリル酸エステル等のメタクリル酸エス
テル単量体、アクリル酸、メタクリル酸等のビニルカル
ボン酸単量体、アクリル酸アミド及びメタクリル酸アミ
ド等が挙げられる。Examples of the unsaturated dicarboxylic acid imide derivative include maleimide monomers such as maleimide, N-methylmaleimide, N-ethylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide and N-naphthylmaleimide. Among them, N-phenylmaleimide is particularly preferred. Examples of the unsaturated dicarboxylic acid anhydride monomer include anhydrides such as maleic acid, itaconic acid, citraconic acid, and aconitic acid, and maleic anhydride is particularly preferable. As the vinyl monomer copolymerizable with the above monomers, acrylonitrile, methacrylonitrile, vinyl cyanide monomers such as α-chloroacrylonitrile, methyl acrylate, ethyl acrylate, Acrylate monomers such as butyl acrylate, methacrylate monomers such as methyl methacrylate and ethyl methacrylate, vinyl carboxylic acid monomers such as acrylic acid and methacrylic acid, acrylamide and methacryl Acid amide and the like.
【0012】マレイミド樹脂の製造方法としては、芳香
族ビニル単量体、不飽和ジカルボン酸イミド誘導体、及
び必要に応じて用いる不飽和ジカルボン酸無水物単量
体、これら単量体と共重合可能なビニル単量体を公知の
方法で直接共重合してもよいし、不飽和ジカルボン酸無
水物単量体を芳香族ビニル単量体、及びこれら単量体と
共重合可能なビニル単量体と共重合させた後、アンモニ
ア及び/又は第1級アミンと反応させて不飽和ジカルボ
ン酸イミド誘導体にしてもよい。しかしながらこれら共
重合体を製造する方法としては後者、すなわち不飽和ジ
カルボン酸無水物単量体を芳香族ビニル単量体、及びこ
れら単量体と共重合可能なビニル単量体と共重合させた
後にイミド化する方法が、共重合性及び経済性の点でよ
り好ましい。なお、イミド化反応に用いる第1級アミン
としてはメチルアミン、エチルアミン、プロピルアミ
ン、ブチルアミン、ヘキシルアミン、シクロへキシルア
ミン、デシルアミン、アニリン、トルイジン、ナフチル
アミン、クロロフェニルアミン、ジクロロフェニルアミ
ン、ブロモフェニルアミン、ジブロモフェニルアミン等
が挙げられる。The method for producing the maleimide resin includes an aromatic vinyl monomer, an unsaturated dicarboxylic acid imide derivative, an unsaturated dicarboxylic anhydride monomer used as required, and a copolymerizable with these monomers. The vinyl monomer may be directly copolymerized by a known method, or an unsaturated dicarboxylic anhydride monomer may be an aromatic vinyl monomer, and a vinyl monomer copolymerizable with these monomers. After copolymerization, it may be reacted with ammonia and / or a primary amine to obtain an unsaturated dicarboxylic acid imide derivative. However, as a method for producing these copolymers, the latter, that is, an unsaturated dicarboxylic anhydride monomer was copolymerized with an aromatic vinyl monomer, and a vinyl monomer copolymerizable with these monomers The method of imidization later is more preferable in terms of copolymerizability and economy. The primary amine used in the imidation reaction is methylamine, ethylamine, propylamine, butylamine, hexylamine, cyclohexylamine, decylamine, aniline, toluidine, naphthylamine, chlorophenylamine, dichlorophenylamine, bromophenylamine, dibromophenyl. Amines and the like.
【0013】イミド化反応は、オートクレーブを用いて
溶液状態、塊状状態あるいは懸濁状態で反応を行うこと
ができる。また、スクリュー押出機等の溶融混練装置を
用いて、溶融状態で反応を行うことも可能である。イミ
ド化における溶液反応に用いられる溶媒は任意であり、
例えば、アセトン、メチルエチルケトン、メチルイソブ
チルケトン、シクロヘキサノン等のケトン類、テトラヒ
ドロフラン、1,4−ジオキサン等のエーテル類、トル
エン、キシレン等の芳香族炭化水素、ジメチルホルムア
ミド、ジメチルスルホキシド、N−メチル−2−ピロリ
ドン等が例示される。イミド化の反応温度は50〜35
0℃の範囲が好ましく、100〜300℃の範囲が特に
好ましい。イミド化反応は触媒の存在を必ずしも必要と
しないが、用いるならばトリメチルアミン、トリエチル
アミン、トリブチルアミン、N,N−ジメチルアニリ
ン、N,N−ジエチルアニリン等の第3級アミンが好適
である。このマレイミド樹脂は、従来より知られている
乳化重合法、懸濁重合法、塊状重合法、溶液重合法のい
ずれの方法によって得られたものであっても良いし、ま
たこれらの重合法の複合化した技術によるものでも良い
が、溶液重合法によるものが好ましい。また、回分法重
合、連続重合どちらの重合法によるものでもかまわな
い。[0013] The imidization reaction can be carried out in a solution state, bulk state or suspension state using an autoclave. It is also possible to carry out the reaction in a molten state using a melt kneading device such as a screw extruder. The solvent used for the solution reaction in imidation is arbitrary,
For example, ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, ethers such as tetrahydrofuran and 1,4-dioxane, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethyl sulfoxide, and N-methyl-2- Examples include pyrrolidone and the like. The reaction temperature for imidization is 50 to 35
A range of 0 ° C is preferred, and a range of 100 to 300 ° C is particularly preferred. The imidization reaction does not necessarily require the presence of a catalyst, but if used, tertiary amines such as trimethylamine, triethylamine, tributylamine, N, N-dimethylaniline, and N, N-diethylaniline are preferred. The maleimide resin may be obtained by any of the conventionally known emulsion polymerization method, suspension polymerization method, bulk polymerization method, solution polymerization method, or a combination of these polymerization methods. Although a technique based on a simplified technique may be used, a technique based on a solution polymerization method is preferable. Further, any of batch polymerization and continuous polymerization may be used.
【0014】本発明の熱板溶着用熱可塑性樹脂組成物中
の熱可塑性樹脂が、少なくとも1種類以上のゴム含有樹
脂とポリカーボネート樹脂との混合物である場合、熱板
溶着用熱可塑性樹脂組成物中のポリカーボネート樹脂
は、10〜85重量%の割合で用いることが好ましく、
より好ましくは20〜80重量%であり、更に好ましく
は30〜70重量%である。ポリカーボネート樹脂とし
ては、ホスゲン法・エステル交換法等によって得られる
芳香族、脂肪族、及び芳香族・脂肪族併用系の樹脂があ
る。また、カーボネート結合とエステル結合、ウレタン
結合もしくはシロキサン結合のような他の結合とを主鎖
中に有するヘテロ結合共重合体等の変性ポリカーボネー
ト樹脂もある。When the thermoplastic resin in the thermoplastic resin composition for hot plate welding of the present invention is a mixture of at least one kind of rubber-containing resin and a polycarbonate resin, the thermoplastic resin composition for hot plate welding is preferably used. The polycarbonate resin is preferably used in a ratio of 10 to 85% by weight,
It is more preferably 20 to 80% by weight, and further preferably 30 to 70% by weight. Examples of the polycarbonate resin include aromatic, aliphatic, and combined aromatic / aliphatic resins obtained by a phosgene method, a transesterification method, or the like. There is also a modified polycarbonate resin such as a hetero bond copolymer having a carbonate bond and another bond such as an ester bond, a urethane bond or a siloxane bond in the main chain.
【0015】本発明の熱板溶着用熱可塑性樹脂組成物に
用いる(B)無機充填材の含有量は、3〜18重量%で
ある。(B)無機充填材の含有量が3重量%未満の場
合、熱板溶着時の糸曳き改良効果が低くなり、18重量
%を越えると、流動性が低下し、成形性が悪くなる。本
発明の熱板溶着用熱可塑性樹脂組成物に用いる(B)無
機充填材としては、タルク、シリカ、クレー、マイカ、
炭酸カルシウム、酸化チタン、酸化マグネシウム、水酸
化マグネシウム、水酸化アルミニウム、チタン酸カリウ
ム、珪酸カルシウム、硫酸バリウム等が挙げられ、炭酸
カルシウムが特に好ましく、その比表面積径が1.2μ
m以下であることが更に好ましい。比表面積径は下記式
−1で表される粒子径である。 比表面積径=6/(比重×比表面積) 式−1 ここで比表面積の測定法は、以下に示す装置及び原理を
用いた。 装置:比表面積測定装置SS−100型(島津製作所
製) 原理:Kozeny−Carman式The content of the inorganic filler (B) used in the thermoplastic resin composition for hot plate welding of the present invention is 3 to 18% by weight. (B) When the content of the inorganic filler is less than 3% by weight, the effect of improving the stringing at the time of hot plate welding is reduced, and when it exceeds 18% by weight, the fluidity is reduced and the moldability is deteriorated. As the inorganic filler (B) used in the thermoplastic resin composition for hot plate welding of the present invention, talc, silica, clay, mica,
Examples include calcium carbonate, titanium oxide, magnesium oxide, magnesium hydroxide, aluminum hydroxide, potassium titanate, calcium silicate, barium sulfate, and the like. Calcium carbonate is particularly preferred, and the specific surface area diameter is 1.2 μm.
m is more preferable. The specific surface area diameter is a particle diameter represented by the following formula-1. Specific surface area diameter = 6 / (specific gravity × specific surface area) Formula-1 Here, the measuring method of the specific surface area used the apparatus and principle shown below. Apparatus: Specific surface area measuring apparatus SS-100 (manufactured by Shimadzu Corporation) Principle: Kozeny-Carman type
【数1】 Sw:物体の比表面積 cm2/g ε :試料充填層の空隙率 − ρ :粉体の密度 g/cm3 η :流体の粘性係数 g/cm・sec L :試料層の厚さ cm Q :試料層通過流体量 ml △P:試料層両端の圧力差 g/cm2 A :試料層の断面積 cm2 t :Qmlの流体の通過に要する時間 sec W :試料の重量 g(Equation 1) Sw: specific surface area of the object cm 2 / g ε: porosity of the sample packed layer −ρ: density of powder g / cm 3 η: viscosity coefficient of fluid g / cm · sec L: thickness of sample layer cm Q: Amount of fluid passing through the sample layer ml ΔP: pressure difference between both ends of the sample layer g / cm 2 A: cross-sectional area of the sample layer cm 2 t: time required for passage of Qml fluid secW: weight of sample
【0016】本発明の熱板溶着用熱可塑性樹脂組成物に
用いる(C)フッ素樹脂の含有量は、0.01〜0.4
重量%である。(C)フッ素樹脂の含有量が0.01重
量%未満の場合、添加した効果が得られず、0.4重量
%を越えると、押出混練時にサージング等により押出性
が不安定になったり、成形品にシルバー等の成形不良現
象が起きる。本発明の熱板溶着用熱可塑性樹脂組成物に
用いる(C)フッ素樹脂としては、ポリテトラフルオロ
エチレン、ポリクロロトリフルオロエチレン、テトラフ
ルオロエチレン、テトラフルオロエチレン・エチレン共
重合体、ポリビリニデンフルオライド、ポリビニルフル
オライド、テトラフルオロエチレン・ヘキサフルオロプ
ロピレン共重合体、テトラフルオロエチレン・パーフル
オロアルキルビニルエーテル共重合体等の分子中にフッ
素原子を含む樹脂が挙げられ、ポリテトラフルオロエチ
レン、テトラフルオロエチレン・パーフルオロアルキル
ビニルエーテル共重合体、テトラフルオロエチレン・ヘ
キサフルオロプロピレン共重合体が好ましく、ポリテト
ラフルオロエチレンが特に好ましい。The content of the fluorine resin (C) used in the thermoplastic resin composition for hot plate welding of the present invention is 0.01 to 0.4.
% By weight. (C) When the content of the fluororesin is less than 0.01% by weight, the effect of the addition cannot be obtained, and when it exceeds 0.4% by weight, the extrudability becomes unstable due to surging at the time of extrusion kneading, A molding failure phenomenon such as silver occurs in the molded product. The (C) fluororesin used in the thermoplastic resin composition for hot plate welding of the present invention includes polytetrafluoroethylene, polychlorotrifluoroethylene, tetrafluoroethylene, tetrafluoroethylene / ethylene copolymer, and polyvinylidene. Resins containing a fluorine atom in the molecule such as fluoride, polyvinyl fluoride, tetrafluoroethylene / hexafluoropropylene copolymer, tetrafluoroethylene / perfluoroalkylvinyl ether copolymer, and the like, and polytetrafluoroethylene, tetrafluoro Ethylene / perfluoroalkyl vinyl ether copolymer and tetrafluoroethylene / hexafluoropropylene copolymer are preferred, and polytetrafluoroethylene is particularly preferred.
【0017】本発明の(A)成分、熱可塑性樹脂のみで
あると、熱板溶着の際、樹脂成形品を熱板から引き離す
ときに、樹脂が糸状に引き伸ばされるいわゆる糸曳き現
象を起こし、これが成形品の表面に残り、外観不良及び
作業性の著しい低下を招いてしまう。しかし、(B)成
分、無機充填材及び(C)成分、フッ素樹脂を特定の割
合で添加することにより、この糸曳き現象が飛躍的に改
善され、成形品の外観不良及び作業性の低下を改良する
ことができ、なおかつ成形性の良好な熱板溶着用熱可塑
性樹脂組成物を得ることができる。例えば、(B)成
分、無機充填材を単独で添加することにより、糸曳き現
象を改善することはできるが、流動性が低下し成形性が
悪くなってしまう。また、(C)成分、フッ素樹脂を単
独で添加しても、糸曳き現象を改善することはできる
が、押出混練時にサージング等により押出性が不安定に
なったり、成形品にシルバー等の成形不良現象が起きた
りしてしまう。If only the component (A) of the present invention is a thermoplastic resin, a so-called stringing phenomenon occurs in which the resin is stretched into a thread when the resin molded product is separated from the hot plate during hot plate welding. It remains on the surface of the molded article, causing poor appearance and remarkable reduction in workability. However, by adding the component (B), the inorganic filler, the component (C), and the fluororesin in specific ratios, this stringing phenomenon is remarkably improved, and poor appearance of the molded product and reduction in workability are obtained. It is possible to obtain a thermoplastic resin composition for hot plate welding which can be improved and has good moldability. For example, by adding the component (B) and the inorganic filler alone, the stringing phenomenon can be improved, but the fluidity decreases and the moldability deteriorates. Although the stringing phenomenon can be improved by adding the component (C) or the fluororesin alone, the extrudability becomes unstable due to surging at the time of extrusion kneading or molding of silver or the like into a molded product. Failure phenomena occur.
【0018】本発明における(A)熱可塑性樹脂と
(B)無機充填材と(C)フッ素樹脂の混合は、通常の
溶融混練装置を用いて行うことができるが、好適に使用
できる溶融混練装置としては、スクリュー押出機、バン
バリーミキサー、コニーダー、混合ロール等がある。本
発明の熱板溶着用熱可塑性樹脂組成物は、用途に応じて
他の添加剤あるいは改質剤を加えて組成物とすることが
可能である。具体的には、安定剤、難燃剤、可塑剤、滑
剤、紫外線吸収剤、着色剤等を用いることができる。本
発明の熱板溶着用熱可塑性樹脂組成物の成形品は、例え
ばウィンカー、リヤコンビネーションランプ、あるいは
ヘッドランプ等の車両用照明器具に好適に用いることが
できるが、これに限定されるものではない。In the present invention, the mixing of the thermoplastic resin (A), the inorganic filler (B) and the fluorocarbon resin (C) can be carried out by using a usual melt kneading apparatus. Examples thereof include a screw extruder, a Banbury mixer, a kneader, and a mixing roll. The thermoplastic resin composition for hot plate welding of the present invention can be made into a composition by adding other additives or modifiers depending on the application. Specifically, stabilizers, flame retardants, plasticizers, lubricants, ultraviolet absorbers, colorants, and the like can be used. The molded article of the thermoplastic resin composition for hot plate welding of the present invention can be suitably used for a vehicle lighting device such as a blinker, a rear combination lamp, or a headlamp, but is not limited thereto. .
【0019】以下に実施例を挙げて本発明を更に詳細に
説明する。実施例及び比較例で用いた%はすべて重量基
準である。また、これらはいずれも例示的なものであっ
て、本発明の内容を限定するものではない。 1.原料樹脂について (A)熱可塑性樹脂Hereinafter, the present invention will be described in more detail with reference to examples. All percentages used in Examples and Comparative Examples are based on weight. These are all examples and do not limit the content of the present invention. 1. Raw material resin (A) Thermoplastic resin
【参考例1】ゴム含有樹脂の成分(a−1〜a−3) (a−1及びa−2)グラフト共重合体 ポリブタジエンラテックス8.12kg(固形分50重
量%、平均粒径0.35μm)、ステアリン酸ソーダ1
00g、ソジウムホルムアルデヒドスルホキシレート1
0g、テトラソジウムエチレンジアミンテトラアセチッ
クアシッド3g、硫酸第一鉄0.3g及び水20kgを
65℃に加熱し、これにスチレン69.4重量%、アク
リロニトリル30.6重量%からなる単量体混合物5.
94kg、t−ドデシルメルカプタン30g、キュメン
ハイドロパーオキサイド20gを4時間で連続添加し、
更に添加終了後65℃で2時間重合した(重合率96
%)。得られたラテックスに酸化防止剤を添加した後、
塩化カルシウムで凝固し水洗、乾燥後白色粉末状のグラ
フト共重合体(a−1)を得た。ポリブタジエンラテッ
クス11.96kg、スチレン70.2重量%とアクリ
ロニトリル29.8重量%からなる単量体混合物4.0
2kgを用いた以外はa−1の場合と同様にグラフト重
合させ、グラフト共重合体(a−2)を得た。上記グラ
フト共重合体のそれぞれの仕込み組成及び最終組成を表
1に示す。Reference Example 1 Components of rubber-containing resin (a-1 to a-3) (a-1 and a-2) Graft copolymer Polybutadiene latex 8.12 kg (solid content 50% by weight, average particle size 0.35 μm) ), Sodium stearate 1
00g, sodium formaldehyde sulfoxylate 1
0 g, 3 g of tetrasodium ethylenediamine tetraacetylic acid, 0.3 g of ferrous sulfate and 20 kg of water were heated to 65 ° C., and a monomer mixture comprising 69.4% by weight of styrene and 30.6% by weight of acrylonitrile was added thereto. 5.
94 kg, t-dodecyl mercaptan 30 g, cumene hydroperoxide 20 g were continuously added in 4 hours,
After the addition was completed, the mixture was polymerized at 65 ° C. for 2 hours (polymerization ratio: 96
%). After adding an antioxidant to the obtained latex,
After coagulation with calcium chloride, washing with water and drying, a white powdery graft copolymer (a-1) was obtained. 11.96 kg of polybutadiene latex, a monomer mixture 4.0 containing 70.2% by weight of styrene and 29.8% by weight of acrylonitrile
Graft polymerization was performed in the same manner as in the case of a-1 except that 2 kg was used, to obtain a graft copolymer (a-2). Table 1 shows the charged composition and final composition of each of the above graft copolymers.
【0020】[0020]
【参考例2】(a−3)共重合体 スチレン7.02kg、アクリロニトリル2.98k
g、第三リン酸カルシウム250g、t−ドデシルメル
カプタン50g、ベンゾイルパーオキサイド20g及び
水25kgを70℃に加熱し重合を開始した。重合開始
から7時間後に、温度を75℃に昇温して3時間保ち重
合を完結させた(重合率97%)。得られた反応液を塩
酸にて中和し、脱水、乾燥後白色ビーズ状の共重合体
(a−3)を得た。上記共重合体のそれぞれの仕込み組
成及び最終組成を表1に示す。Reference Example 2 (a-3) Copolymer Styrene 7.02 kg, acrylonitrile 2.98 k
g, 250 g of tribasic calcium phosphate, 50 g of t-dodecyl mercaptan, 20 g of benzoyl peroxide and 25 kg of water were heated to 70 ° C. to initiate polymerization. Seven hours after the start of the polymerization, the temperature was raised to 75 ° C. and maintained for 3 hours to complete the polymerization (polymerization rate: 97%). The obtained reaction solution was neutralized with hydrochloric acid, and after dehydration and drying, a white bead-like copolymer (a-3) was obtained. Table 1 shows the charged composition and final composition of each of the above copolymers.
【0021】[0021]
【参考例3】(a−4及びa−5)マレイミド樹脂 撹拌機付きオートクレーブ中にメチルエチルケトン9.
0kg、スチレン6.25kg、α−メチルスチレンダ
イマー10gを仕込み、系内を窒素ガスで置換した後温
度80℃に加熱した。これに、無水マレイン酸3.75
kg、ベンゾイルパーオキサイド30gをメチルエチル
ケトン6.0kgに溶解した溶液を10時間で添加し
た。添加後更に2時間、温度80℃に保った。反応液の
一部をサンプリングしてガスクロマトグラフィーにより
未反応の単量体の定量を行い、重合率及び重合体中の無
水マレイン酸の含有率を算出した。結果を表1に示す。
残りの反応液にメチルエチルケトン15.0kgを加え
室温まで冷却した。これを激しく撹拌しながらメタノー
ル80.0kgに注ぎ、濾別後乾燥し白色粉末状の重合
体を得た。この重合体3.0kg、トリエチルアミン3
0gをオートクレーブ中でメチルエチルケトン7.0k
gに溶解し、これにアニリン1.20kgを加え130
℃で7時間イミド化反応を行った。反応溶液を室温まで
冷却し、激しく撹拌したメタノール30.0kgに注
ぎ、濾別後乾燥しマレイミド樹脂(a−4)を得た。他
のマレイミド樹脂(a−5)も表2に示す仕込み組成
で、ほぼ同様の条件により作成した。13C−NMR
(核磁気共鳴)法により無水マレイン酸基のNPMI
(N−フェニルマレイミド)基への転化率を求めた。こ
れらより最終組成比を算出しあわせて表2に示した。Reference Example 3 (a-4 and a-5) Maleimide resin Methyl ethyl ketone in an autoclave equipped with a stirrer 9.
0 kg, 6.25 kg of styrene, and 10 g of α-methylstyrene dimer were charged, and the inside of the system was replaced with nitrogen gas, and then heated to a temperature of 80 ° C. In addition, 3.75 maleic anhydride
A solution of 30 g of benzoyl peroxide in 6.0 kg of methyl ethyl ketone was added over 10 hours. The temperature was kept at 80 ° C. for a further 2 hours after the addition. A part of the reaction solution was sampled, and the amount of unreacted monomer was quantified by gas chromatography, and the polymerization rate and the content of maleic anhydride in the polymer were calculated. Table 1 shows the results.
15.0 kg of methyl ethyl ketone was added to the remaining reaction solution, and the mixture was cooled to room temperature. This was poured into 80.0 kg of methanol with vigorous stirring, filtered and dried to obtain a white powdery polymer. 3.0 kg of this polymer, triethylamine 3
0 g of methyl ethyl ketone 7.0 k in an autoclave.
g, and aniline (1.20 kg) was added thereto.
The imidation reaction was performed at 7 ° C. for 7 hours. The reaction solution was cooled to room temperature, poured into 30.0 kg of vigorously stirred methanol, filtered and dried to obtain a maleimide resin (a-4). Other maleimide resins (a-5) were also prepared with the charge compositions shown in Table 2 under substantially the same conditions. 13C-NMR
NPMI of maleic anhydride group by (nuclear magnetic resonance) method
The conversion to the (N-phenylmaleimide) group was determined. The final composition ratio was calculated from these and is shown in Table 2.
【0022】(a−6)ポリカーボネート樹脂 a−6: 一般に市販されているポリカーボネート樹
脂、パンライトL−1250(帝人化成)を用いた。(A-6) Polycarbonate resin a-6: A commercially available polycarbonate resin, Panlite L-1250 (Teijin Kasei) was used.
【0023】(B)無機充填材 b−1: 一般に市販されている炭酸カルシウム、NS
#2500(日東粉化工業、比表面積径0.89μm)
を用いた。 b−2: 一般に市販されている炭酸カルシウム、NS
#400(日東粉化工業、比表面積径1.71μm)を
用いた。 b−3:一般に市販されている珪酸カルシウム、FPW
#5000(金生興業)を用いた。 b−4:一般に市販されている水酸化マグネシウム、キ
スマ5B(協和化学工業)を用いた。(B) Inorganic filler b-1: generally commercially available calcium carbonate, NS
# 2500 (Nitto Powder Chemical Industry, specific surface area 0.89μm)
Was used. b-2: Calcium carbonate, NS which is generally commercially available
# 400 (Nitto Powder Chemical Industry, specific surface area diameter 1.71 μm) was used. b-3: generally commercially available calcium silicate, FPW
# 5000 (Kinsei Kogyo) was used. b-4: A commercially available magnesium hydroxide, Kisuma 5B (Kyowa Chemical Industry) was used.
【0024】(C)フッ素樹脂 c−1: 一般に市販されているテトラフロロエチレン
樹脂、テフロン6CJ(三井・デュポン フロロケミカ
ル)を用いた。(C) Fluororesin c-1: A commercially available tetrafluoroethylene resin, Teflon 6CJ (Dupont Mitsui Fluorochemicals) was used.
【0025】[0025]
【表1】 [Table 1]
【0026】[0026]
【表2】 [Table 2]
【0027】2.評価方法 (1)糸曳き性の評価:射出成形機(川口鉄工、K−1
25−I)により、幅100mm、長さ355mm、厚
さ2mmの角板を成形温度260℃で成形し、これを1
00×60×2mmの大きさに切り出した。糸曳きは、
上記の試験片の60×2mmの面を温度300℃に加熱
した鉄板に押し付け、試験片の1.5mmを沈み代とし
て鉄板上に溶融させ、20秒後に500mm/秒の速度
で、この試験片を引き上げ、糸曳きの状態を目視で調
べ、以下のように評価した。 ○:糸曳きが全く見られないか、あるいは多少糸曳きは
見られるが、外観を損なう程ではなく、糸曳きの最長値
が10mm以下。 ×:はっきりとした糸曳きが見られ、外観を損ない、糸
曳きの最長値が10mmを越える。2. Evaluation method (1) Evaluation of stringiness: injection molding machine (Kawaguchi Iron Works, K-1
According to 25-I), a square plate having a width of 100 mm, a length of 355 mm, and a thickness of 2 mm was formed at a forming temperature of 260 ° C.
It was cut into a size of 00 × 60 × 2 mm. Stringing is
A 60 × 2 mm surface of the test piece was pressed against an iron plate heated to a temperature of 300 ° C., and 1.5 mm of the test piece was melted on the iron plate as a sinking margin. After 20 seconds, the test piece was heated at a speed of 500 mm / sec. Was pulled up, the state of stringing was visually inspected, and evaluated as follows. :: No stringing was observed at all, or some stringing was observed, but the appearance was not impaired, and the maximum value of stringing was 10 mm or less. X: Clear stringing was observed, the appearance was impaired, and the maximum stringing value exceeded 10 mm.
【0028】(2)流動性:射出成形機(東芝機械、I
S−30EPN)を用い、スパイラルフロー(2mm
厚)を成形温度260℃、金型温度60℃、絶対射出圧
力69MPaで測定した。(2) Fluidity: Injection molding machine (Toshiba Machine, I
S-30EPN) and a spiral flow (2 mm
Was measured at a molding temperature of 260 ° C., a mold temperature of 60 ° C., and an absolute injection pressure of 69 MPa.
【0029】(3)衝撃強度:ASTM D−256に
従い、成形温度250℃で成形した厚さ6.4mmの射
出成形品によりノッチ付きアイゾット衝撃強度を測定し
た。雰囲気温度は23℃。(3) Impact strength: According to ASTM D-256, a notched Izod impact strength of a 6.4 mm thick injection molded article molded at a molding temperature of 250 ° C. was measured. The ambient temperature is 23 ° C.
【0030】(4)耐熱性:JIS K−7206に従
い、成形温度250℃で成形した厚さ3.2mmの射出
成形品によりビカット軟化点(49N荷重)を測定し
た。(4) Heat resistance: According to JIS K-7206, a Vicat softening point (49N load) was measured using a 3.2 mm thick injection molded product molded at a molding temperature of 250 ° C.
【0031】(5)押出安定性の評価:押出混練時の安
定性を、後記するTEM35B押出機で押出しペレット
化する過程において、以下のように評価した。 ○:サージングがほとんど無く、押出性が良好である。 ×:サージングがひどく、押出が困難である。(5) Evaluation of extrusion stability: The stability during extrusion kneading was evaluated as follows in the process of extruding and pelletizing with a TEM35B extruder described below. :: There is almost no surging and the extrudability is good. ×: Surging is severe and extrusion is difficult.
【0032】[0032]
【実施例−1〜9】表3に示した配合割合(重量%)で
全量8kgになるように、(A)熱可塑性樹脂、(B)
無機充填材及び(C)フッ素樹脂を、20リットルヘン
シェルに投入しブレンド後、TEM35B押出機(東
芝、2軸同方向)にて、280℃で押出しペレット化し
た。このペレットを使用し、射出成形機により試験片を
作成し、衝撃強度、熱変形温度を測定するとともに、糸
曳きを評価した。また、流動性も測定した。結果は表3
に示す。Examples 1 to 9 (A) thermoplastic resin, (B) so that the total amount is 8 kg at the mixing ratio (% by weight) shown in Table 3.
The inorganic filler and the fluorocarbon resin (C) were charged into a 20-liter Henschel, blended, and extruded at 280 ° C. into a pellet using a TEM35B extruder (Toshiba, same direction in two axes). Using the pellets, test pieces were prepared by an injection molding machine, and the impact strength and heat deformation temperature were measured, and stringing was evaluated. The fluidity was also measured. Table 3 shows the results
Shown in
【0033】[0033]
【比較例−1〜6】表4に示した配合割合(重量%)で
全量8kgになるように、(A)熱可塑性樹脂及び
(B)無機充填材、あるいは(A)熱可塑性樹脂及び
(C)フッ素樹脂を、20リットルヘンシェルに投入し
ブレンド後、TEM35B押出機(東芝、2軸同方向)
にて、280℃で押出しペレット化した。このペレット
を使用し、射出成形機により試験片を作成し、衝撃強
度、熱変形温度を測定するとともに、糸曳きを評価し
た。また、流動性も測定した。結果は表4に示す。Comparative Examples 1 to 6 (A) thermoplastic resin and (B) inorganic filler, or (A) thermoplastic resin and (A) so that the total amount is 8 kg at the blending ratio (% by weight) shown in Table 4. C) Fluorine resin is charged into a 20-liter Henschel and blended, and then a TEM35B extruder (Toshiba, two-axis same direction)
At 280 ° C. for pelletization. Using the pellets, test pieces were prepared by an injection molding machine, and the impact strength and heat deformation temperature were measured, and stringing was evaluated. The fluidity was also measured. The results are shown in Table 4.
【0034】[0034]
【表3】 [Table 3]
【0035】[0035]
【表4】 [Table 4]
【0036】比較例−1〜6は、いずれも(A)熱可塑
性樹脂及、(B)無機充填材及び(C)フッ素樹脂の含
有量が範囲外。実施例及び比較例の結果から、(A)熱
可塑性樹脂の含有量が82重量%未満、あるいは(B)
無機充填材の含有量が18重量%を越えると、流動性が
低くなり、成形性が悪くなる。また、(A)熱可塑性樹
脂の含有量が96.9重量%を越えるか、(B)無機充
填材の含有量が3重量%未満であるか、(C)フッ素樹
脂の含有量が0.01重量%未満の場合、熱板溶着時の
糸曳き改良効果が低くなる。更に、(C)フッ素樹脂の
含有量が0.4重量%を越えると、押出安定性が低く、
成形品の外観も悪くなる。In each of Comparative Examples 1 to 6, the contents of (A) a thermoplastic resin, (B) an inorganic filler, and (C) a fluorine resin are out of ranges. From the results of the examples and the comparative examples, it is found that the content of the thermoplastic resin (A) is less than 82% by weight,
If the content of the inorganic filler exceeds 18% by weight, the fluidity will be low and the moldability will be poor. Further, (A) the content of the thermoplastic resin exceeds 96.9% by weight, (B) the content of the inorganic filler is less than 3% by weight, or (C) the content of the fluororesin is 0.1% by weight. If it is less than 01% by weight, the effect of improving stringing at the time of hot plate welding is low. Further, when the content of (C) the fluororesin exceeds 0.4% by weight, the extrusion stability is low,
The appearance of the molded article also deteriorates.
【0037】以上のように、熱可塑性樹脂組成物中に
(A)熱可塑性樹脂82〜96.9重量%、(B)無機
充填材3〜18重量%、(C)フッ素樹脂0.01〜
0.4重量%を含有するときにのみ、糸曳きが改良さ
れ、良好な熱板溶着が行え、成形品の外観性が高く、衝
撃強度が良好で、耐熱性が優れ、成形性が良好で、押出
混練時の安定性が高くなることがわかる。As described above, the thermoplastic resin composition contains (A) 82 to 96.9% by weight of the thermoplastic resin, (B) 3 to 18% by weight of the inorganic filler, and (C) 0.01 to 18% by weight of the fluororesin.
Only when the content is 0.4% by weight, stringing is improved, good hot plate welding can be performed, the appearance of molded products is high, impact strength is good, heat resistance is excellent, moldability is good. It can be seen that the stability during extrusion kneading is increased.
【0038】[0038]
【発明の効果】本発明の熱板溶着用熱可塑性樹脂組成物
は、従来の樹脂と比較して、糸曳きが極めて改良された
ものであり、かつ成形品の外観性が高く、衝撃強度が良
好で、耐熱性が優れ、成形性が良好で、押出混練時の安
定性が高く、熱板溶着用として有用である。The thermoplastic resin composition for hot plate welding according to the present invention has extremely improved stringing as compared with conventional resins, and has high appearance and impact strength of molded articles. Good, excellent in heat resistance, good in moldability, high in stability during extrusion kneading, and useful as hot plate welding.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C08L 69/00 C08L 69/00 79/04 79/04 Z //(C08L 101/00 (C08L 101/00 27:12) 27:12) B29L 11:00 B29L 11:00 Fターム(参考) 4F211 AA16 AB11 AB16 AD05 AH73 TA01 TC08 TC14 TD07 TN07 TQ01 4J002 AA011 AC031 AC081 BB031 BB121 BB151 BD122 BD142 BD152 BD162 BG041 BP011 CF061 CF071 CF161 CG001 CH071 CL011 CL031 CM021 CN031 DE076 DE136 DE146 DE186 DE236 DG046 DJ006 DJ016 DJ036 DJ046 DJ056 FD016 GN00 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C08L 69/00 C08L 69/00 79/04 79/04 Z // (C08L 101/00 (C08L 101/00) 27:12) 27:12) B29L 11:00 B29L 11:00 F term (reference) 4F211 AA16 AB11 AB16 AD05 AH73 TA01 TC08 TC14 TD07 TN07 TQ01 4J002 AA011 AC031 AC081 BB031 BB121 BB151 BD122 BD142 BD152 BD162 BG041 BP01 CF011 CH071 CL011 CL031 CM021 CN031 DE076 DE136 DE146 DE186 DE236 DG046 DJ006 DJ016 DJ036 DJ046 DJ056 FD016 GN00
Claims (9)
%、(B)無機充填材3〜18重量%、(C)フッ素樹
脂0.01〜0.4重量%を有効成分とし、これを成形
した試験片を温度300℃に加熱した鉄板に押し付け、
試験片の1.5mmを沈み代として鉄板上に溶融させ、
20秒後に500mm/秒の速度で、この試験片を引き
上げたときの糸曳きの最長値が10mm以下であること
を特徴とする熱板溶着用熱可塑性樹脂組成物。1. An active ingredient comprising (A) 82 to 96.9% by weight of a thermoplastic resin, (B) 3 to 18% by weight of an inorganic filler, and (C) 0.01 to 0.4% by weight of a fluororesin. The test piece molded from this was pressed against an iron plate heated to a temperature of 300 ° C.
1.5mm of the test piece was melted on the iron plate as sinking allowance,
A thermoplastic resin composition for hot plate welding, wherein a maximum length of stringing when the test piece is pulled up at a speed of 500 mm / sec after 20 seconds is 10 mm or less.
むことを特徴とする請求項1記載の熱板溶着用熱可塑性
樹脂組成物。2. The thermoplastic resin composition for hot plate welding according to claim 1, wherein the thermoplastic resin (A) contains a rubber-containing resin.
レイミド樹脂との混合物であることを特徴とする請求項
1記載の熱板溶着用熱可塑性樹脂組成物。3. The thermoplastic resin composition for hot plate welding according to claim 1, wherein the thermoplastic resin (A) is a mixture of a rubber-containing resin and a maleimide resin.
リカーボネート樹脂との混合物であることを特徴とする
請求項1記載の熱板溶着用熱可塑性樹脂組成物。4. The thermoplastic resin composition for hot plate welding according to claim 1, wherein the thermoplastic resin (A) is a mixture of a rubber-containing resin and a polycarbonate resin.
m以下であることを特徴とする請求項1〜4記載の熱板
溶着用熱可塑性樹脂組成物。5. The inorganic filler has a specific surface area diameter of 1.2 μm.
m or less, and the thermoplastic resin composition for hot plate welding according to any one of claims 1 to 4.
ことを特徴とする請求項1〜4記載の熱板溶着用熱可塑
性樹脂組成物。6. The thermoplastic resin composition for hot plate welding according to claim 1, wherein the inorganic filler (B) is calcium carbonate.
m以下の炭酸カルシウムであることを特徴とする請求項
1〜4記載の熱板溶着用熱可塑性樹脂組成物。7. The inorganic filler has a specific surface area diameter of 1.2 μm.
5. The thermoplastic resin composition for hot plate welding according to claim 1, wherein the composition is calcium carbonate of m or less.
チレンであることを特徴とする請求項1〜7記載の熱板
溶着用熱可塑性樹脂組成物。8. The thermoplastic resin composition for hot plate welding according to claim 1, wherein the fluorocarbon resin (C) is polytetrafluoroethylene.
脂組成物からなる成形品と樹脂成形品を熱板溶着で接合
したことを特徴とする成形品。9. A molded article comprising a molded article made of the thermoplastic resin composition for hot plate welding according to claim 1 and a resin molded article joined by hot plate welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000314748A JP2002121398A (en) | 2000-10-16 | 2000-10-16 | Thermoplastic resin composition for hot plate welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000314748A JP2002121398A (en) | 2000-10-16 | 2000-10-16 | Thermoplastic resin composition for hot plate welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002121398A true JP2002121398A (en) | 2002-04-23 |
Family
ID=18793948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000314748A Pending JP2002121398A (en) | 2000-10-16 | 2000-10-16 | Thermoplastic resin composition for hot plate welding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002121398A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005538199A (en) * | 2002-09-06 | 2005-12-15 | エーエムエス−ヒェミー・アクチェンゲゼルシャフト | Polyamide molding compound containing ultrafine filler and light reflecting component that can be manufactured from the molding compound |
| JP2017113656A (en) * | 2015-12-21 | 2017-06-29 | Dic株式会社 | Manufacturing method of laminate |
| US12351661B2 (en) | 2020-08-31 | 2025-07-08 | Denka Company Limited | Maleimide-based copolymer and resin composition |
-
2000
- 2000-10-16 JP JP2000314748A patent/JP2002121398A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005538199A (en) * | 2002-09-06 | 2005-12-15 | エーエムエス−ヒェミー・アクチェンゲゼルシャフト | Polyamide molding compound containing ultrafine filler and light reflecting component that can be manufactured from the molding compound |
| JP2017113656A (en) * | 2015-12-21 | 2017-06-29 | Dic株式会社 | Manufacturing method of laminate |
| US12351661B2 (en) | 2020-08-31 | 2025-07-08 | Denka Company Limited | Maleimide-based copolymer and resin composition |
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