JP2002110745A - Component recognition control method and component recognition control device - Google Patents

Abstract

[PROBLEMS] To provide a component recognition control method and apparatus capable of accurately determining whether or not a bump is present or not, and detecting the position of the bump with high accuracy. SOLUTION: While a camera is arranged at a lower position with respect to an electronic component having a substantially spherical bump formed on a lower surface, a first side which irradiates illumination light (side illumination light) from the side to the electronic component.
A light source and a second light source for irradiating illumination light (coaxial illumination light) upward from below via a half mirror to a bump formation surface are arranged. First, the presence or absence and the quality of bumps are determined based on the first image captured in a state where the side illumination light is applied to the bump formation surface (S1, S2, S3). Next, the center position of the bump is determined based on the second image captured in a state in which the coaxial illumination light is emitted only for the non-defective product, excluding the defective product (S4, S5, S6, S7, S8). The drive correction amount of the mounter head is determined from the determined bump position (S9).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component recognition control method and a component recognition control device used for recognizing an electronic component having a very small bump such as for a flip chip.

[0002]

2. Description of the Related Art As shown in FIG. 4, a large number of hemispherical bumps 7 are provided on one side of an electronic component body 71 as shown in FIG.
3 are formed. Such an electronic component 7 is mounted on a substrate to be mounted. At the time of mounting, the electronic component 7 is sucked and transferred by a mounter head provided with a suction nozzle from a component storage section to a substrate on a surface mounter. It has become so. At the time of this mounting, the quality of the electronic component that is currently sucked and scheduled to be mounted on the board is determined by taking an image of the electronic component sucked by the suction nozzle of the mounter head with a camera, It is performed based on image recognition. Also, in order to accurately mount the sucked electronic component to a predetermined mounting position on the board,
After mounting the component and before mounting, the electronic component picked up by the suction nozzle is imaged, and the amount of deviation between the center of the nozzle and the center of the electronic component is detected based on the image recognition. Is corrected.

[0003]

However, when an image is picked up by the above-described camera, an image picked up greatly differs depending on an incident direction of illumination light to a bump forming surface of an electronic component to be picked up, and image recognition becomes difficult. There is.
This is mainly due to the fact that the bump forming surface 72 of the electronic component 7 to be imaged is entirely a mirror surface, and the hemispherical bumps 73 protrude from the mirror surface.

That is, as shown in FIG.
The light source 20 disposed on the side of the bump forming surface 72 of the electronic component 7 attracted to the electronic component 7 and positioned at a predetermined position.
Some devices are configured to emit illumination light from the side (side illumination method). In this case, when the bump formation surface 72 is illuminated from the side with the camera 5 disposed below the bump formation surface 72 so as to face the bump formation surface 72, the irradiation light hitting the bump formation surface 72 itself is obtained. Is reflected to the side other than the camera position, while bump 7
Irradiation light hitting the lower hemisphere of the lower half 3 is reflected and captured by the camera 5. As a result, as shown in FIG. 6, the captured image appears in a state where the bump forming surface portion 72a is dark and the bump forming portion 73a is shining round, but the contrast between the bump forming portion 73a and the surroundings is unclear and both images are not clear. The boundaries are not clear. For this reason, the surface of the bump 73 itself can be clearly and clearly recognized, but it is difficult to recognize the outer edge position of the bump, and the accuracy of determining the center position of the bump is lacking.

On the other hand, as shown in FIG.
There is also known one configured to irradiate the light from 0 to the central axis direction of the suction nozzle 8 via the half mirror 41 (coaxial illumination system). In this case, light is irradiated upward from below to the bump formation surface 72,
Irradiation light hitting the hemispherical surface of each bump 73 is reflected to the side other than the camera position, while irradiation light hitting the mirror surface of the bump forming surface 72 is reflected and taken into the camera. As a result, in the captured image, as shown in FIG. 8, each of the bump forming portions 73a becomes black and the bump forming portions 73a become black.
The bump formation surface portion 72a other than a is clearly lit. In this case, the bump forming surface portion 72
a and the bump forming portion 73a are emphasized in contrast, so that the boundary position between the two can be clearly recognized. However, even if there is a defect in a part or all of the bump forming portion 73a, the normal bump forming portion 73a can be recognized. Since the image is dark, the accuracy of the quality determination of the bump forming portion 73a is lacking.

SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and an object of the present invention is to provide a component recognition control method capable of accurately detecting both the presence or absence of a bump and the quality of the bump and the position of the bump. And a component recognition control device.

[0007]

According to a first aspect of the present invention, there is provided an electronic component having a substantially spherical bump formed on one surface of an electronic component on a side opposed to the bump forming surface. The following bump determination processing is first performed for a component recognition control method for recognizing the electronic component based on an image of the bump formation surface captured by the imaging unit, and then, bump position determination is performed. It is configured to perform processing. That is, in the bump determination process, a first image of the bump forming surface is captured by the imaging unit in a state where light is irradiated from a direction orthogonal to a direction facing the bump forming surface.
The presence or absence of a bump is determined based on an image. Then, as a bump position indexing process, a second image of the bump forming surface is captured by the imaging means in a state where light is irradiated from a direction facing the bump forming surface, and the bump image is captured based on the second image. To determine the position of

According to the component recognition control method of the first aspect, in the bump determination process, the state in which light is applied to the bump formation surface from the side, that is, the first image on the bump formation surface is formed by the side illumination method. It is imaged. in this case,
In the first image, if the bump has a normal hemispherical surface, the bump is reflected and illuminated by the side illumination light, so that the presence or absence of a plurality of bumps can be reliably determined and recognized. In addition, if there is a defect on the surface of a part of the plurality of bumps, the part appears dimly and the existence of the defect can be reliably determined and recognized. Next, in the bump position determination process, a second image of the bump formation surface is captured in a state where light is irradiated in a direction opposite to the bump formation surface, that is, the coaxial illumination method. In this case, in the second image, the other bump forming surface except for the bump portion appears in a state of reflecting and shining the above-mentioned coaxial illumination light, while the outer edge portion of the bump portion particularly appears dark. It will be clearly recognizable. As a result, the center position of the bump is accurately determined based on the position of the outer edge of the bump. As post-processing, the correction amount of the component mounting position may be determined by comparing the original bump position (reference position) with respect to the nozzle center and the center position of the bump determined above.

It is preferable that the bump position determining process in the first aspect be performed only on the electronic component for which the predetermined bump is determined to be present by the bump determining process (claim 1). In this case, in the bump determination process, a defective product having no bump which should exist originally or a defective product having a defect in a part of the bump is removed, and the execution of the useless bump position finding process is avoided.

According to a third aspect of the present invention, there is provided an image pickup means provided on a side of an electronic component having a substantially spherical bump formed on one side thereof and positioned at an image pickup position, the side facing the bump forming surface; A first light source that irradiates light from a direction orthogonal to a direction facing the forming surface, and a second light source that irradiates light from a direction facing the bump forming surface; A component recognition control device for recognizing the electronic component based on an image of a formation surface is provided with the following processing units. That is, a first imaging processing unit that performs imaging by the imaging unit and obtains a first image while irradiating light from the first light source to the bump forming surface of the electronic component set at the imaging position, A bump determination processing unit that determines the presence or absence of a bump based on the first image acquired by the first imaging processing unit; In the state where light is emitted from the light source, an image is taken
It is provided with a second imaging processing unit for acquiring an image, and a bump position determination processing unit for determining a position of a bump based on the second image acquired by the second imaging processing unit.

According to the component recognition control device of the third aspect, for the electronic component on which the bump is formed, the judgment / recognition of the presence / absence of the bump and the quality of the bump and the position determination of the bump are automatically performed. Become. That is, a first image of the bump formation surface by the side illumination method described in claim 1 is acquired by the first imaging processing unit, and the presence or absence of a bump is determined by the bump determination processing unit based on the first image. Will be done. In this determination process, if the first image is subjected to, for example, a binarization process, the presence or absence of a bump and the presence of the above-mentioned defective portion can be easily recognized. By adding the gray processing, it is possible to more reliably recognize the presence of the above-described defective portion or surface abnormality of the bump. Then, the second image of the bump formation surface by the above-described coaxial illumination method is obtained by the second imaging processing unit, and the bump position is determined by the bump position determination processing unit based on the second image. This bump position is determined by the second
For example, the image may be binarized to determine the bump center position from a circumferential locus in which the boundary between the dark portion of the bump portion and the bright portion of the bump formation surface is continuous. If the bump center position is determined, the original bump position (reference position) with respect to the nozzle center is determined in the same manner as in claim 1.
Then, the correction amount calculation processing unit for calculating the correction amount of the component mounting position by comparing with the center position of the bump determined above may be executed.

[0012] The second image pickup processing section according to the third aspect may be configured to execute processing only on an electronic component determined by the first determination processing section to have a predetermined bump (claim 4). . In this case, as in the case of the second aspect, execution of useless processing on defective products is avoided.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a component recognition apparatus to which an embodiment of the present invention is applied, 2 is an upper light source as a first light source of the present invention, 3 is an intermediate light source, and 4 is a second light source of the present invention. The lower light source 5 is a camera composed of a CCD as an image pickup means. The light source 2-4, the camera 5 and the housings 11-13, which will be described later, for accommodating them, etc.
Is configured. Reference numeral 6 denotes a controller constituting the component recognition control device. Reference numeral 7 denotes an electronic component as a component recognition target, and reference numeral 8 denotes a suction nozzle mounted on a mounter head for sucking and transferring the electronic component 7 and performing mounting on a substrate (not shown). The mount head equipped with the suction nozzle 8 is movable across the component supply section of the mounting machine (not shown), the location where the imaging unit 1 is arranged, and the location where the substrate is installed.

First, the electronic component 7 will be described. This electronic component (for example, flip lip) 7 has a large number of substantially spherical very small bumps (balls) on one surface (bump forming surface) 72 of an electronic component body 71 (see FIG. 4). Bumps) 73 are formed in a predetermined arrangement. FIG. 4 shows 4 × in plan view.
4 shows an example in which sixteen bumps 73 are formed.
Then, the electronic component 7 is sucked by the suction nozzle 8 of the mounter head with the bump forming surface facing down,
It has been transferred to the component recognition position (the position of the electronic component 7 in FIG. 1). The component recognition position is a position where the central axis of the suction nozzle 8 and the optical axis of the camera 5 are coaxially positioned, and corresponds to the central positions of the upper light source 2, the intermediate light source 3, and the lower light source 4. Position.

Next, the intermediate light source 3 and the lower light source 4 are respectively disposed in an upper housing 11, and the camera 5 is disposed in a lower housing 12 which is connected to the lower side of the upper housing 11. I have. The lower housing 12 is attached to and supported by a surface mounter (not shown). An elevating housing 13 is mounted on the upper housing 11 so as to be able to move up and down with respect to the upper housing 11, and the upper light source 2 is arranged on the elevating housing 13. Then, a driving means 14 for raising and lowering the elevating housing 13 is provided.

The upper light source 2 is disposed so as to form each side of a polygon such as an octagon in plan view, and each of the upper light sources 2 is slanted by a very small angle so as to be directed toward the center of the polygon. The illumination light can be emitted upward. Thus, when the upper light source 2 is turned on, side illumination is performed in which illumination light is applied from the side to the bumps 73 and the bump formation surface 72 of the electronic component 7 at the component recognition position. ing. In performing such side illumination, the elevation housing 13 is adjusted up and down according to the electronic component 7 to be illuminated.

The intermediate light source 3 is arranged, for example, so as to form each side of the polygon in the same manner as described above, and when turned on, the intermediate light source 3 is attached to the bumps 73 and the bump forming surface 72 at an elevation angle of approximately 45 degrees. On the other hand, illumination light is directed from an obliquely lower position to an obliquely upward direction.

When illuminated, the lower light source 4 converts the illuminating light illuminated laterally into upward illuminating light by the half mirror 41 and illuminates the illuminating light upward with respect to the bumps 73 and the bump forming surface 72. Is provided to perform coaxial illumination.

The above three types of light sources, that is, the upper light source 2, the intermediate light source 3, and the lower light source 4 are each controlled by a controller 6 such as turning on and off, and one of them is controlled according to the type of imaging processing. The lighting operation is selectively performed in two or more combinations.

Next, each of the light sources 2, 3, 4 and the camera 5
A description will be given of the control of the component recognition using the correction and the correction based on the component recognition.

As shown in FIG. 2, the controller 6 includes a first imaging processing section 61, a bump determination processing section 62, and a second
An imaging processing unit 63, a bump position determination processing unit 64,
A position correction amount calculation processing unit 65 and a head drive control unit 66 are provided.

The first image pickup processing section 61 includes the upper light source 2
The first image is captured in the side illumination state according to the above, and the bump determination processing unit 62 performs the determination processing based on the first image. In the bump determination processing unit 62, the quality of the bump 73 based on the first image, that is, the plurality of bumps 73
The presence or absence of some of the bumps and individual bumps 73
It is determined whether or not the bump itself is normal, such as whether or not the bump itself is formed normally.

The second image pickup processing unit 63 includes the lower light source 4
The second image is captured in the coaxial illumination state by the above, and the processing by the bump position determination processing unit 64 is performed based on the second image. The correction amount of the component mounting position is calculated by the position correction amount calculation processing unit 65 based on the bump position calculated by the bump position calculation processing unit 64, and the calculated correction amount is output to the head drive control unit 66. It is supposed to be. As the correction amount, the amount of deviation in the X-axis direction (ΔX) and the amount of deviation in the Y-axis direction (Δ
Y) and the amount of deviation (Δθ) in the rotational direction with respect to the reference axis.

The head drive control section 66 sets a target mounting position in consideration of the correction amount with respect to a reference mounting position of the electronic component 7 on a substrate (not shown), and moves the mounter head to the target mounting position. As described above, for example, drive control is performed on various mounter head drive units 80 such as a planar X-axis drive motor and a Y-axis drive motor. Reference numeral 60 denotes a display connected to the controller 6.

The processing of each of the processing units 61 to 66 will be described below with reference to the flowchart of FIG.

First, it is confirmed that the electronic component 7 sucked by the suction nozzle 8 of the mounter head is positioned at the component recognition position (step S1).
The upper light source 2 is turned on to perform side illumination on the electronic component 7 (step S2). In this side illumination state, the camera 5 captures and captures a first image of the bump forming surface 72 and each of the bumps 73 (step S3). The above steps S2 and S3 are performed by the first image processing unit 61. Then, the quality of the bump 73 is determined by the bump determination processing unit 62 based on the first image (step S4).

This determination of good or bad may be made as follows. That is, in the first image P1 (see FIG. 6), if the bump 73 exists, at least the bump portion 73a
However, the bump forming surface portion 72a is dark and shaded. Therefore, if the first image P1 is subjected to, for example, a binarization process, the existence itself of the bump formation portion 73a becomes apparent. Thereby, a large number of bumps 73, 7
Whether or not all of the numbers 3, 3,... If there is a defect or the like in a part of each bump 73, that part becomes a shadow, so that it is possible to recognize the existence of the partial defect even by the above-described binarization processing. The quality of the bumps 73, 73,... May be determined visually by a determination worker based on the first image P1 displayed on the display 60.

In step S4, if it is determined that the electronic component 7 to be recognized this time is a defective product having some of the bumps 73 itself missing or some of the individual bumps 73 missing, the electronic component is recognized. 7 is excluded from the mounting line (“NO” in step S4, S5), while the electronic component 7 is removed.
If is not a defective product, the upper light source 2 is turned off, the lower light source 4 is turned on, and the process proceeds to the second stage ("YES" in step S4, S6).

That is, while the electronic component 7 is being coaxially illuminated by turning on the lower light source 4, the camera 5 again captures an image and captures a second image (step S7). These steps S6 and S7 constitute the second imaging processing unit 63. Then, the bump position is determined by the bump position determination processing section 64 based on the second image (step S8).

The determination of the bump position may be performed as follows. That is, the second image P2 (see FIG. 8) includes the bump forming surface portion 7 other than the bump forming portion 73a.
An image is formed by the reflected light from 2a, and in particular, the boundary between each bump forming portion 73a and the surrounding bump forming surface portion 72a appears with strong contrast between light and dark. Therefore, for example, by binarizing the second image P2, a boundary circle locus of each bump forming portion 73a is clearly obtained, and each bump forming portion 73a is calculated from each XY coordinate position of the boundary circle locus.
Of the XY coordinate value (bump position) of the center position can be determined.

The position correction amount calculation processing section 65 compares each of the determined bump positions with reference bump positions with respect to the center axis position of the suction nozzle 8, and finds that the electronic component actually picked up this time. 7 in the X-axis direction (Δ
X), the Y-axis direction correction amount (ΔY), and the rotation direction correction amount (Δ
θ) is calculated by calculation (step S9).

With the above, the component recognition for the electronic component 7 this time is completed, and by returning, the component recognition for the next electronic component is sequentially performed.

The present invention is not limited to the above embodiment, but includes various other embodiments. That is, in the above embodiment, the first imaging processing unit 6
1, only the side illumination by the upper light source 2 is activated, and only the coaxial illumination by the lower light source 4 is activated by the second imaging processing unit 63. However, the present invention is not limited to this. You may make it use together.

As the camera 5, in addition to an area sensor camera in which the entire bump forming surface 72 of the electronic component 7 falls within the same angle of view, a line sensor camera that scans the bump forming surface 72 in one direction is used. May be used.

[0036]

As described above, according to the component recognition control method according to the first or second aspect, first, light is irradiated from the direction orthogonal to the direction facing the bump forming surface of the electronic component. A process for determining the presence or absence of a bump is performed based on the first image captured in the state, and then the position of the bump is determined based on the second image captured in a state where light is irradiated from a direction facing the bump forming surface. To determine the presence or absence of bumps,
The position of the bump can be detected with high accuracy.

In particular, if the bump position determining process is performed only on the electronic component for which the predetermined bump is determined to be present by the bump determining process, the bump determination in the first stage is performed. Defective products having missing or missing bumps during processing can be excluded from the subsequent processing to improve the efficiency of component recognition.

Further, according to the component recognition control device according to the third or fourth aspect, the above-described component recognition control method can be reliably realized by automatic control. Can be realized.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an embodiment of the present invention.

FIG. 2 is a block diagram showing the controller of FIG. 1;

FIG. 3 is a flowchart illustrating each process of component recognition of a controller.

FIG. 4 is a diagram of an electronic component to be recognized as viewed from below.

FIG. 5 is an explanatory diagram of a side lighting system.

FIG. 6 is an example of an image obtained by a side illumination method.

FIG. 7 is an explanatory diagram of a coaxial illumination system.

FIG. 8 is an example of an image obtained by a coaxial illumination method.

[Explanation of symbols]

 Reference Signs List 2 upper light source (first light source) 4 lower light source (second light source) 5 camera (imaging unit) 7 electronic component 61 first imaging processing unit 62 bump determination processing unit 63 second imaging processing unit 64 bump position determination processing unit 72 bump Forming surface 73 Bump P1 First image P2 Second image

Claims (4)

[Claims] An electronic component having a substantially spherical bump formed on one surface thereof is provided with an image pickup means on a side opposed to the bump formation surface, and based on an image of the bump formation surface taken by the image pickup means. A component recognition control method for recognizing the electronic component, comprising: first irradiating a light from a direction orthogonal to a direction facing the bump forming surface with a first image of the bump forming surface by the imaging unit; And a bump determination process for determining the presence or absence of a bump based on the first image is performed. Next, the light is emitted from a direction facing the bump formation surface, and the bump formation surface is irradiated by the imaging unit. Wherein a second image is captured and a bump position determination process for determining the position of the bump is performed based on the second image. Law. 2. The component recognition control method according to claim 1, wherein the bump position determining process is performed only on the electronic component for which the predetermined bump is determined to be present by the bump determining process. 3. An electronic component having a substantially spherical bump formed on one surface thereof and positioned on an image pickup position and having an image pickup means disposed on a side opposite to the bump formation surface, and facing the bump formation surface. Using a first light source that irradiates light from a direction orthogonal to the direction and a second light source that irradiates light from a direction facing the bump formation surface, an image of the bump formation surface captured by the imaging unit is formed. A component recognition control device for recognizing the electronic component based on the electronic component, wherein an image is captured by the imaging unit in a state where light is emitted from the first light source to a bump formation surface of the electronic component set at the imaging position. A first imaging processing unit that performs the first image processing to obtain a first image; a bump determination processing unit that determines the presence or absence of a bump based on the first image obtained by the first imaging processing unit; A second imaging processing unit that captures a second image by performing imaging by the imaging unit while irradiating the bump forming surface of the same electronic component with light from the second light source; A component recognition control device comprising: a bump position determination processing unit that determines a position of a bump based on the acquired second image. 4. The apparatus according to claim 1, wherein the second image pickup processing unit is configured to execute the process only on the electronic component determined to have the predetermined bump by the first judgment processing unit. Item 3. The component recognition control device according to Item 3.