JP2002110515A - Dust collection method for pattern drawing equipment - Google Patents

Abstract

(57) [Summary] An object of the present invention is to provide a dust collecting method in a pattern writing apparatus capable of cleaning the inside of a writing chamber without breaking vacuum. In a dust collecting method in a pattern writing apparatus including a writing chamber (10) and a stage (15) installed in the writing chamber (10), a conductive member (4) installed on a substrate (1) and a conductive member (4) The dummy substrate including the dielectric member 3 set in the above is transported into the drawing chamber and set on the stage 15. Next, by generating a potential on the conductive member 4,
A dust collection method in a pattern writing apparatus, wherein dust existing in the writing chamber (10) is adsorbed on the surface of the dielectric member (3).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dust collecting method in a pattern drawing and manufacturing apparatus.

[0002]

2. Description of the Related Art In recent years, with high integration and large capacity of LSI, circuit line width required for a semiconductor device has been increasingly miniaturized. Conventionally, these semiconductor devices have been used to transfer dozens of types of original patterns (called reticles or masks) to an exposure area on a semiconductor wafer with high precision in order to form a desired circuit pattern. Is created by This transfer device is called a stepper because the semiconductor wafer steps and repeats with respect to the optical system.

In such a semiconductor process, a method of forming an original image pattern uses a substrate on which a resist is uniformly coated on a glass substrate on which Cr is deposited on one surface, and irradiates the substrate with an electron beam. The beam spot is scanned according to the pattern design data. Then, by developing, using the resist in the portion irradiated with the electron beam as a mask, the lower layer of Cr is etched and the resist is removed to form a desired pattern.

Such a pattern drawing apparatus has a mechanism for transporting and fixing a glass substrate to a drawing stage, and this mechanism has a sliding portion. Therefore, when the conveyance is repeated, minute dust accumulates on the sliding portion. Since the drawing of charged particles is performed in a vacuum chamber, electric charges remain on the surface of the glass substrate after the drawing, and there is a problem that dust accumulated during the transfer of the substrate is attracted to the substrate surface by static electricity.

[0005] The fine dust which has not been a problem until now and adheres to such a glass substrate sometimes becomes a defect in pattern formation. Therefore, it is necessary to clean the inside of the drawing chamber in order to prevent dust from adhering to the glass substrate as much as possible.

In order to remove the accumulated dust, it is necessary to break the vacuum and clean the mechanism inside the chamber. However, in such a charged particle drawing apparatus, it takes a lot of time to bring the inside of the drawing chamber to a vacuum state, and it is necessary to adjust the electron optical system after cleaning. There is a problem that cleaning can be performed only once every six months.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above problem. It is intended to provide a dust method.

[0008]

To achieve the above object, the present invention provides a charged particle source, a drawing chamber into which a charged particle beam irradiated from the charged particle source is introduced, and a drawing chamber. In a pattern drawing apparatus for irradiating a substrate placed on the stage with the charged beam and drawing a pattern, a dust collecting method for collecting dust present in the drawing chamber, comprising: A step of transporting a dummy substrate including a conductive member and a dielectric member provided on the conductive member into the drawing chamber and setting the substrate on the stage; and generating a potential on the conductive member. With
A dust collecting method for a pattern drawing apparatus, comprising: adhering dust existing in the drawing chamber to a surface of the dielectric member by static electricity generated in the dielectric member in a step of generating a potential in the conductive member. I do.

In this case, it is preferable that the dummy substrate further includes a voltage generating means electrically connected to the conductive member, and the voltage generating means generates a potential at the conductive member.

It is preferable that a potential is generated in the conductive member by irradiating the charged particle beam of the drawing apparatus onto the dummy substrate.

Further, the dummy substrate is provided with voltage control means, and when the irradiation of the charged particle beam becomes excessive,
It is preferable that the voltage control means release electric charge from a wiring grounded to the voltage control means.

[0012] The dummy substrate further includes an external connection terminal electrically connected to the conductive member, and electrically connects a voltage generation unit provided outside the drawing chamber to the external connection terminal. Preferably, a potential is generated in the conductive member.

[0013] Further, the dummy substrate can be conveyed in a state where the pressure inside the pattern drawing apparatus is reduced.

In the present invention, by forming a dielectric member on the conductive member and applying a voltage to the conductive member, dust in the drawing chamber adheres to the dielectric member by electrostatic force. At this time, the dummy substrate does not break the vacuum of the pattern drawing apparatus, and can be carried in and out by a normal vacuum path. As a result, the number of times of cleaning of the pattern drawing apparatus can be increased, and the drawing chamber can be constantly maintained. It is possible to keep the inside cleanness high.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view of a dummy substrate used in a dust collecting method in a pattern drawing apparatus according to Embodiment 1 of the present invention.

Reference numeral 1 denotes a dummy substrate made of a glass substrate processed into substantially the same shape as a mask substrate actually created by drawing. On the surface of the dummy substrate 1, an insulator member 6 is formed. The conductive member 4 is formed on the insulator member 6, and the dielectric member 3 is formed on the surface of the conductor member 4. A voltage generating member 5 such as a battery is built in the dummy substrate 1, and is electrically connected so that a voltage can be applied to the conductive member 4. Reference numeral 7 denotes voltage generating means 4
Is a voltage control means for controlling so as to enable application and stop of a voltage at an arbitrary time.

The dummy substrate 1 configured as described above is transported into a pattern drawing apparatus through a normal vacuum path.
Installed on stage. At this time, the voltage application start time (t1 + α) and the voltage application time t2 are set in the voltage control means 7 before the conveyance. The time at which the dummy substrate 1 is set on the stage is t1, and the time at which voltage is applied is t.
Assuming that 2, after the dummy substrate 1 is installed, the voltage is generated by the voltage generator 5 when the time α elapses, causing the dielectric member 3 to generate a potential. As a result, dust existing in the drawing chamber is adsorbed on the surface of the dielectric member 3 by electrostatic force. Then, when the voltage application time t2 elapses, the voltage applied to the dielectric member 3 is cut off, but the dust is kept adsorbed on the surface of the dielectric member 3. Thereafter, the dummy substrate 1 is carried out to the atmosphere outside the pattern drawing apparatus by a vacuum path. By using in this manner, dust in the writing chamber can be removed without breaking the vacuum in the writing chamber.

The time α is a preliminary time set in order to avoid an accident in which the conductive member 4 of the dummy substrate 1 comes into contact with a part of the pattern drawing apparatus during the transportation and discharges.
If there is no problem, α = 0, that is, there may be no spare time.

Further, in the present embodiment, since the voltage control means 7 is provided inside the dummy substrate 1, when the dummy substrate 1 is carried in, dust can be collected at an arbitrary place in the vacuum path.

(Embodiment 2) FIG. 2 is a cross-sectional view showing a state where a dummy substrate used for a dust collecting method of a pattern drawing apparatus according to Embodiment 2 is set on a stage in a drawing chamber.

The difference from the dummy substrate described with reference to FIG. 1 is that the voltage control means 11 is provided outside the device, not inside the dummy substrate 1.

An insulating member 6 is provided on the surface of the dummy substrate 1.
Are formed. The dielectric member 3 is formed on the insulator member 6 with the conductive member 4 interposed therebetween. Voltage generating means 5 for applying a voltage to the conductive member 4 is provided inside the dummy substrate 1.

The dummy substrate 1 is conveyed into the pattern drawing apparatus through a normal vacuum path, and is set on the stage 15. At this time, the dummy substrate 1 is held by the holding means 2 provided on the stage 15, and the external connection terminals 8 formed on the surface of the dummy substrate 1 and the electric wiring 9 built in the holding means 2 are connected. . The electric wiring 9 is connected to a voltage control unit 11 provided outside the drawing chamber 10.
Is connected to

The voltage generator 5 built in the dummy substrate 1 is electrically connected to the external connection terminal 8 and can be controlled by the voltage controller 11.

After the dummy substrate 1 is fixed to the stage 15 as described above, the voltage control means 11 controls the voltage generation means 5.
To generate a potential in the dielectric member 3. As a result, dust around the dummy substrate 1 is attracted to the dielectric member 3 by electrostatic force. After an appropriate voltage application time, the voltage is turned off by the voltage control means 11, but the dust adsorbed on the dielectric member 3 is kept in a state of being attached to the surface of the dielectric member 3. Thereafter, as in the first embodiment, the dummy substrate 1 is carried out to the atmosphere by a normal vacuum path.

In this embodiment, the voltage generating means 5 is used while being built in the dummy substrate 1, but the voltage generating means 5 is provided outside the drawing chamber similarly to the voltage control means 11.
A potential may be generated in the conductive member 4 via the electric wiring 9.

(Embodiment 3) FIG. 3 is a sectional view showing a state in which a dummy substrate used for a dust collecting method of a pattern writing apparatus according to Embodiment 3 is set on a stage in a writing chamber.

The difference from the dummy substrate described with reference to FIG. 1 is that the voltage generating means and the voltage control means are not provided inside the dummy substrate 1 and the dielectric member 3 is charged by the charged beam of the pattern drawing apparatus.
Has just generated a potential.

An insulating member 6 is provided on the surface of the dummy substrate 1.
Are formed. The dielectric member 3 is formed on the insulator member 6 with the conductive member 4 interposed therebetween. The conductive members 4 provided on the front surface and the back surface are connected by electric wiring provided inside the dummy substrate.

The dummy substrate 1 is conveyed into the pattern drawing apparatus through a normal vacuum path, and is set on the stage 15. At this time, the dummy substrate 1 is held by the holding means 2 provided on the stage 15. In this case, the holding means 2 and the dummy substrate 1 are electrically insulated.

After the dummy substrate 1 is fixed to the stage 15 as described above, a charged particle beam is irradiated onto the dummy substrate 1 from a charged particle generation source 16 provided in the charged particle beam column 12. Since the conductive member 4 and the dielectric member 3 are insulated at the contact portion between the dummy substrate 1 and the holding means 2,
An electric potential can be generated in the dielectric member 3. As a result, dust around the dummy substrate 1 is attracted to the dielectric member 3 by electrostatic force. After an appropriate time, the irradiation of the charged particle beam is stopped. However, since the potential is held on the surface of the dielectric member 3, dust is kept adsorbed on the surface of the dielectric member 3 by electrostatic force. Thereafter, as in the first embodiment, the dummy substrate 1 is carried out to the atmosphere by a normal vacuum path.

(Embodiment 4) FIG. 4 is a sectional view showing a state in which a dummy substrate used for a dust collecting method of a pattern writing apparatus according to Embodiment 4 is set on a stage in a writing chamber.

The difference from the dummy substrate described with reference to FIG. 3 is that the voltage control means 13 is provided inside the dummy substrate 1 and the potential of the dielectric member 3 is controlled.

An insulating member 6 is provided on the surface of the dummy substrate 1.
Are formed. The dielectric member 3 is formed on the insulator member 6 with the conductive member 4 interposed therebetween. The conductive members 4 provided on the front and back surfaces are connected to voltage generating means 13 built in the dummy substrate 1 so that the potential can be controlled.

The dummy substrate 1 is conveyed into the pattern drawing apparatus through a normal vacuum path, and is set on the stage 15. At this time, the dummy substrate 1 is held by the holding means 2 provided on the stage 15. In this case, the holding means 2 and the dummy substrate 1 are electrically insulated.

After the dummy substrate 1 is fixed to the stage 15 as described above, a charged particle beam is irradiated onto the dummy substrate 1 from a charged particle generation source 16 provided in the charged particle beam column 12. Since the conductive member 4 and the dielectric member 3 are insulated at the contact portion between the dummy substrate 1 and the holding means 2,
An electric potential can be generated in the dielectric member 3. As a result, dust around the dummy substrate 1 is adsorbed on the dielectric member 3.
After an appropriate time, the irradiation of the charged particle beam is stopped. However, since the potential is maintained on the surface of the dielectric member 3, dust is kept adsorbed on the surface of the dielectric member 3. Thereafter, as in the first embodiment, the dummy substrate 1 is carried out to the atmosphere by a normal vacuum path.

In this embodiment, when the irradiation of the charged particle beam becomes excessive, the potential is measured by the voltage control means 13, and
Excessive potential can be prevented from being generated by releasing the charge from the wiring grounded to the voltage control means 13.

[0039]

According to the present invention, since a potential is generated in the dielectric member formed on the surface of the dummy substrate to collect dust in the chamber, cleaning can be performed without breaking the vacuum in the pattern drawing apparatus. Since the number of normal times can be increased, fine dust can be removed.

Therefore, the degree of cleanness in the writing chamber can always be kept high, so that extremely fine patterns can be formed with good yield.

[Brief description of the drawings]

FIG. 1 is a sectional view of a dummy substrate used in a dust collecting method in a pattern drawing apparatus according to a first embodiment of the present invention.

FIG. 2 is an exemplary cross-sectional view illustrating a state where a dummy substrate used in a dust collecting method of the pattern writing apparatus according to the second embodiment is set on a stage in a writing chamber;

FIG. 3 is an exemplary cross-sectional view illustrating a state where a dummy substrate used in a dust collecting method of a pattern writing apparatus according to a third embodiment is set on a stage in a writing chamber;

FIG. 4 is a cross-sectional view illustrating a state where a dummy substrate used for a dust collection method of a pattern writing apparatus according to a fourth embodiment is set on a stage in a writing chamber.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Dummy board 2 ... Substrate holding means 3 ... Dielectric member 4 ... Conductive member 5 ... Voltage generation means 6 ... Insulator member 7 ... Voltage control means 8 ...・ External connection terminal 9 ・ ・ ・ Electrical wiring 10 ・ ・ ・ Drawing chamber 11 ・ ・ ・ Voltage control means 12 ・ ・ ・ Electronic optical column 13 ・ ・ ・ Voltage control means 15 ・ ・ ・ Stage 16 ・ ・ ・ Charged particle generation source

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shusuke Yoshitake 1st Toshiba Research & Development Center, Komukai-ku, Kawasaki City, Kanagawa Prefecture No. 1 in the Toshiba R & D Center (72) Inventor Toru Tojo 1 in Komukai Toshiba-cho in Koyuki-ku, Kawasaki-shi, Kanagawa Prefecture In-Toshiba R & D Center (72) Inventor Shuichiro Fukudome 4-2-1-11 Toshiba Machine Co., Ltd. (72) Inventor Teruaki Yamamoto 4-2-1-11 Ginza, Chuo-ku, Tokyo Tokyo-72 Machinery Co., Ltd. 2nd-11th Toshiba Machine Co., Ltd. F-term (reference) 2H097 BA10 CA16 LA10 5C034 BB06 BB10 5F056 DA25 DA30 EA12

Claims (6)

[Claims] 1. A charged particle generation source, a drawing chamber into which a charged particle beam emitted from the charged particle generation source is introduced, and a stage installed in the drawing chamber, wherein the stage is installed on the stage. In a pattern drawing apparatus that draws a pattern by irradiating the substrate to be charged with the charged beam, in a dust collection method of collecting dust present in the drawing chamber, a conductive member, and a dielectric member disposed on the conductive member Transferring a dummy substrate comprising: a substrate to the drawing chamber; setting the substrate on the stage; and generating a potential on the conductive member. Pattern drawing, wherein dust existing in the drawing chamber is adsorbed on the surface of the dielectric member by static electricity generated in the member. The dust-collecting method of the device. 2. The semiconductor device according to claim 1, further comprising: a voltage generator electrically connected to said conductive member in said dummy substrate, wherein said voltage generator generates a potential in said conductive member. Dust collection method for pattern drawing equipment. 3. A method according to claim 1, wherein a potential is generated in said conductive member by irradiating said dummy substrate with a charged particle beam of said drawing apparatus. 4. The voltage control means is provided on the dummy substrate, and when the irradiation of the charged particle beam becomes excessive, the charge is released from the wiring grounded to the voltage control means by the voltage control means. The dust collecting method for a pattern drawing apparatus according to claim 3. 5. The dummy substrate further includes an external connection terminal electrically connected to the conductive member, and electrically connects a voltage generation unit provided outside the drawing chamber and the external connection terminal. The method according to claim 1, wherein a potential is generated in the conductive member. 6. The method for collecting dust in a pattern writing apparatus according to claim 1, wherein the dummy substrate is conveyed in a state where the inside of the pattern writing apparatus is decompressed. .