JP2002110460A - Chip capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the integrality of a capacitor body and an insulating board in the case of transport and conveyance, and to reduce mechanical stress on a lead wire after mounting a printed board. SOLUTION: The detaching of the insulating board 2 from the capacitor body 1 can be prevented surely while mechanical stress to the lead wires 3 can be reduced by engaging members 6 by pinching the insulating board by the capacitor body 1 and the engaging member 6 by penetrating through-holes formed to the insulating board 2 and bending the engaging member 6 fixed onto a mouth sealing member 4 along the underside of the insulating board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type capacitor surface-mounted on a printed circuit board, and more particularly to a vertical chip-type capacitor having an insulating plate.

[0002]

2. Description of the Related Art As shown in FIG. 5, a conventional vertical chip type capacitor having an insulating plate has an insulating member in which a lead wire 3 led out of a capacitor body 1 is in contact with a lead wire leading side of an outer case. It is known that it is used as a connection electrode by penetrating through the plate 2 and bending and storing it along the storage groove 5 provided on the lower surface of the insulating plate 2 (Japanese Patent Application Laid-Open No. S59-5959). 211214). As described above, the vertical chip type capacitor can be made independent by attaching the insulating plate 2 to the capacitor body 1 and can be surface-mounted.

[0003]

However, in the conventional vertical chip type capacitor as shown in FIG. 5, a lead wire led out of the capacitor body 1 to integrally support the capacitor body 1 and the insulating plate 2 is provided. 3 only bends along the lower surface of the insulating plate 2 or bends along the storage groove 5 provided on the lower surface of the insulating plate 2 for storage. When the chip-type capacitor receives mechanical stress such as contact between the chip-type capacitor and other electronic components or a packaging case, the capacitor body 1
Between the capacitor and the insulating plate 2 or the capacitor body 1
And the insulating plate 2 comes off from the substrate.

[0004] Further, the conventional vertical chip-type capacitor is not less than a predetermined value after mounting on a printed circuit board, that is, when the lead wires are connected to the pattern of the printed circuit board and the chip-type capacitor is fixed to the printed circuit board. When an external mechanical stress such as vibration or rotational force is applied, the substantially integral support of the capacitor body 1 and the insulating plate 2 is substantially equal to the insulating plate 2 of the lead wire 3 led out from the capacitor body 1. Because it relies on folding along the underside of
All the stresses applied to the capacitor body 1 and the insulating plate 2 are extremely concentrated on the lead wire 3, especially on the bent portion. As a result, excessive mechanical stress is generated in the bent portion, and the lead wire 3 may be damaged to deteriorate the electrical characteristics of the chip type capacitor, or the lead wire 3 may be broken and become inoperable. There is.

The present invention has been made in view of these problems, and has been made to improve the integration between the capacitor body and the insulating plate at the time of transportation, and to provide a mechanical stress to the lead wires after the printed circuit board is mounted. It is an object of the present invention to provide a chip-type capacitor for vertical placement that can reduce the number of chips.

[0006]

In order to solve the above-mentioned problems, in a chip-type capacitor according to the present invention, a capacitor element is housed in a bottomed cylindrical outer case, and an opening of the outer case is sealed by a sealing member. Sealing, a capacitor body in which a lead wire led out from the capacitor element penetrates the sealing member, and an insulating plate abutted on the lead wire leading side of the capacitor body, wherein the lead wire is an insulating plate. In a chip-type capacitor that penetrates and is bent along the lower surface of the insulating plate, at least one or more locking members having one end fixed to the sealing member and the other end led out in the same direction as the lead wire are provided. It is characterized by being fitted into the insulating plate. According to this configuration, since the one or more locking members fixed to the sealing member are fitted into the insulating plate, the capacitor body and the insulating plate are protected from mechanical stress such as contact occurring during transportation. It is possible to reliably prevent the gap between them and the separation of the insulating plate from the capacitor main body, and improve the integration between the capacitor main body and the insulating plate. In addition, since mechanical stress such as vibration or rotational force that has been applied more than a predetermined amount after mounting on the printed circuit board can be dispersed to the locking member, damage or breakage of the lead wire is eliminated, and the electrical characteristics of the chip type capacitor are eliminated. Degradation can be prevented.

[0007] Further, the invention is characterized in that the locking member fits into the insulating plate and penetrates and is bent along the lower surface of the insulating plate. As described above, in addition to bending the lead wire led out from the capacitor body along the lower surface of the insulating plate, the insulating plate is sandwiched between the capacitor body by the locking member, so that the capacitor body and the insulating plate are further secured. Can be fixed to Therefore, it is possible to improve the integration between the capacitor body and the insulating plate, and to reduce the mechanical stress on the lead wires after the chip-type capacitor is mounted on the printed circuit board.

The locking member fits into the insulating plate and penetrates to the lower surface of the insulating plate.
It is preferable that at least a portion led out to the lower surface of the insulating plate is made of a solderable material. Thus, the lead-out portion of the locking member is made of a solderable material, and when mounted on a printed circuit board, the lead-out portion is soldered to a pattern having no electrical connection with a circuit on the printed circuit board. As a result, mechanical stress such as vibration or rotational force exceeding a predetermined level received after mounting on the printed circuit board can be reduced, and the chip type capacitor with the capacitor body and insulating plate integrated is securely fixed to the printed circuit board can do.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an external perspective view showing a chip type capacitor according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along a cross section AA of the chip-type capacitor of the first embodiment. FIG. 3 is an external perspective view showing the mounting state of the insulating plate in the chip-type capacitor of the first embodiment. FIG.
FIG. 9 is an external perspective view illustrating a mounting state of an insulating plate in the chip-type capacitor according to the second embodiment.

(Embodiment 1) As shown in FIG. 1, a chip-type capacitor according to Embodiment 1 has a capacitor element 12 housed inside an aluminum outer case 13 and an opening of the outer case is sealed with a sealing member 4. And a capacitor body 1 in which a lead wire 3 is led out from a through-hole provided in the sealing member 4 through the opening, and the outer case 1
3 mainly includes an insulating plate 2 in contact with the lead wire lead-out side and a locking member 6 fixed to the sealing member 4 and fitted into the insulating plate 2.

The capacitor element 12 used in the first embodiment is formed by winding an anode foil and a cathode foil made of a valve metal such as aluminum with a separator interposed therebetween, and impregnated with an electrolytic solution. A capacitor element, a solid electrolytic capacitor element using a conductive polymer layer such as polythiophene instead of the electrolytic solution, and the like are used.

In the chip type capacitor used in the first embodiment, as shown in FIG. 2, a sealing member 4 provided with a through hole through which a lead wire passes is attached to the capacitor element 12, and the capacitor element 12 is provided. The capacitor body 1 is housed in an aluminum outer case 13 having a bottom cylindrical shape, and the side surface portion 8 and the upper end portion of the outer case 13 are crimped to form the capacitor body 1 in a sealed state.

The sealing member 4 is made of an elastic material such as rubber, and has a through-hole penetrating the lead wire 3 led out from the capacitor element 12. The sealing member 4 has one end 1
4 has at least one or more locking members 6 fixed to the sealing member 4 and having the other end led out in the same direction as the lead wire 3. As a method of fixing the locking member 6 to the sealing member 4, one end 14 of the locking member 6 is embedded at the same time as the molding of the sealing member 4 made of an elastic member such as rubber, or the molding of the sealing member 4 is performed. A method of inserting the one end 14 of the locking member 6 later may be used. By these methods,
The locking member 6 can be simply formed on the sealing member 4, and the strength of fixing between the locking member 6 and the sealing member 4 can be increased. In order to further increase the fixing strength of the locking member 6, one end 14 of the locking member 6 embedded in the sealing member 4 is processed to have a diameter larger than the diameter of the locking member 6, or It is also possible to work to a width larger than the width, or to provide a hook portion or a locking projection 17 on a part of the embedded portion of the locking member 6.

As shown in FIG. 3, the insulating plate 2 is substantially rectangular, has a predetermined thickness, and is made of an electrically insulating resin. The insulating plate 2 is provided with a through hole 10 penetrating the lead wire 3 derived from the capacitor body 1 and a storage groove 5 for bending and storing the lead wire 3 and is fixed to the sealing member 4. A through hole 9 penetrating the locking member 6 and a storage groove 7 for bending and storing the locking member 6 are provided. The lead wire 3 derived from the capacitor body 1 and the locking member 6 fixed to the sealing member 4 are respectively provided with through holes 10 provided in the insulating plate 2, respectively.
9, and further bent and stored along the corresponding storage grooves 5 and 7. Therefore, it is desirable that the locking member 6 in the first embodiment is made of a bendable material such as metal. In addition to bending the insulating plate 2 along the lower surface of the capacitor body 1 and the insulating plate 2 of the lead wire 3, the locking member 6 penetrates the insulating plate 2 and is provided on the insulating plate 2. By bending and storing the insulating plate 2 in the storage groove 7, that is, by sandwiching the insulating plate 2 between the capacitor body 1 and the locking member 6, the capacitor body 1 can be more reliably formed.
And the insulating plate 2 can be fixed.

The penetration of the locking member 6 into the insulating plate 2 in the first embodiment is an embodiment in which the locking member 6 is penetrated as a result of the fitting of the locking member 6 into the insulating plate 2. The term “fitting” according to the present invention refers to a state in which the fitting portion of the locking member 6 having substantially the same inner diameter or a larger outer diameter as the fitting hole provided in the insulating plate 2 is inserted into the fitting hole. Say that.

As shown in FIG. 2, the locking member 6 has one end 14 fixed to the sealing member 4 and one end 14 of the capacitor body 1.
Is preferably fixed to the capacitor element side from the side surface portion 8 of the outer case 13 that has been crimped for sealing, and further crimped and fixed by crimping the side surface portion of the outer case 13. Thereby, the locking member 6 can be more firmly fixed to the sealing member 4.

The number of positions where the locking members 6 are fitted into the insulating plate 2 can be set at any positions not in contact with the lead wires 3 derived from the capacitor body 1. At the position shown in FIG. 3, near the four corners of the substantially rectangular insulating plate 2, or at the center of the insulating plate 2, that is, between the two lead wires, the locking member 6 is provided.
Can be arranged.

It is preferable that at least a portion 16 of the locking member 6 extended to the lower surface of the insulating plate 2 is made of a solderable material. By soldering the lead-out portion 16 of the locking member 6 to a pattern having no electrical connection with the circuit of the printed circuit board, the chip-type capacitor in which the capacitor body 1 and the insulating plate 2 are integrated can be printed. Can be fixed more reliably. Further, in order to increase the soldering area, the lead-out portion 16 can be processed into a flat shape. Further, the configuration of the locking member 6 may be such that the entire locking member 6 is made of a solderable material regardless of the lead-out portion 16 of the locking member 6. Therefore, the locking member 6 of the first embodiment
Is made by plating a wire such as iron or aluminum with copper and further plating the surface with solder.

As described above, according to the first embodiment, one or more locking members 6 fixed to the sealing member 4 penetrate through the through holes 9 provided in the insulating plate 2 and are provided on the lower surface of the insulating plate 2. By folding and storing along the provided storage groove 7, the integrity and fixing strength of the capacitor body 1 and the insulating plate 2 are improved. Separation of the insulating plate 2 from the capacitor body 1 can be reliably prevented. In addition, even after mounting on a printed circuit board, the lead wire 3
Since the mechanical stress on the lead wire 3 can be reduced by the locking member 6, damage or breakage of the lead wire 3 can be prevented. Furthermore, the lead-out part 16 of the locking member 6 to the lower surface of the insulating plate 2 can be soldered, so that the lead-out part 16 is soldered to a pattern having no electrical connection with the circuit of the printed circuit board. In addition, the chip type capacitor in which the capacitor body 1 and the insulating plate 2 are integrated can be securely fixed to the printed circuit board.

(Embodiment 2) As shown in FIG. 4, the chip type capacitor according to Embodiment 2 has a lead wire 3 led out of a capacitor body 1 provided on an insulating plate 2 abutted on the lead wire lead-out side. It is bent and stored along the storage groove 5 penetrating through the through hole 10 and provided on the lower surface of the insulating plate 2, and one end 14 is fixed to the sealing member 4, and the other end is the same as the lead wire 3. One or more locking members 6 drawn out in the direction are fitted into fitting portions 11 provided on the insulating plate 2. By fitting the locking member 6 into the fitting portion 11 provided on the insulating plate 2, the integration between the capacitor body 1 and the insulating plate 2 can be reliably improved, and after mounting on the printed circuit board. Excessive mechanical stress applied to the bent portion of the lead wire 3 derived from the capacitor main body 1 on the lower surface of the insulating plate 2 is applied to the locking member 6.
And damage or breakage of the lead wire 3 can be prevented.

When the locking member 6 is fitted into the fitting portion 11 provided on the insulating plate 2, an adhesive may be applied to a fitting portion of the locking member 6 to be fitted. Thereby, the capacitor body 1 in which the locking member 6 is integrally fixed to the sealing member 4 can be firmly fixed by the insulating plate 2. Further, in the second embodiment, any number of positions where the locking members 6 are fitted into the insulating plate 2 may be provided at any positions not in contact with the lead wires 3 derived from the capacitor body 1. It is also possible to provide the fitting portion 11 at the position shown in FIG. 4, near the four corners of the substantially rectangular insulating plate 2 or at the center of the insulating plate, that is, between the two lead wires, and fit the locking member 6.

The locking member 6 in the second embodiment is made of a material having a predetermined strength, such as hard rubber, resin, or metal. The method of fixing the locking member 6 to the sealing member 4 is the same as the method used in the first embodiment.
A method of embedding the one end 14 of the locking member 6 simultaneously with the molding of the sealing member 4 made of an elastic member such as rubber, or fitting the one end 14 of the locking member 6 after the molding of the sealing member 4 is exemplified. Can be Thereby, the locking member 6 can be simply formed on the sealing member 4, and the strength of fixing between the locking member 6 and the sealing member 4 can be increased.

[0024]

As described above, according to the present invention,
The capacitor element is housed in a bottomed cylindrical outer case, the opening of the outer case is sealed with a sealing member, and a lead wire derived from the capacitor element penetrates the sealing member; and A chip type capacitor comprising an insulating plate in contact with a lead wire lead-out side of a capacitor body, wherein the lead wire penetrates the insulating plate and is bent along a lower surface of the insulating plate. The capacitor body and the insulating plate can be fixed more integrally by fitting at least one or more locking members whose other ends are drawn out in the same direction as the lead wire and are fixed to the insulating plate. In addition, it is possible to reliably prevent the displacement between the capacitor body and the insulating plate which occurs during transportation and the detachment of the insulating plate from the capacitor body. In addition, a predetermined or more mechanical stress on the lead wire led out of the capacitor main body after mounting on the printed circuit board can be reduced by the locking member, and damage or breakage of the lead wire can be prevented. This makes it possible to provide a highly reliable chip-type capacitor capable of improving the integration between the capacitor body and the insulating plate.

[0025] Further, the locking member fits into the insulating plate and penetrates along the lower surface of the insulating plate to bend the lead wire derived from the capacitor body to the lower surface of the insulating plate. In addition, by sandwiching the insulating plate with the capacitor body by the locking member, the capacitor body and the insulating plate can be more securely fixed. Therefore, it is possible to improve the integration between the capacitor body and the insulating plate, and to reduce the mechanical stress on the lead wires after the chip-type capacitor is mounted on the printed circuit board.

The locking member is inserted into the insulating plate and penetrates to the lower surface of the insulating plate, and at least a portion of the locking member that extends to the lower surface of the insulating plate is made of a solderable material. By soldering the lead-out portion to a pattern having no electrical connection with the circuit of the printed circuit board, mechanical stress concentrated on the bent portion of the lead wire due to vibration or rotational force exceeding a predetermined level received after mounting on the printed circuit board And the chip type capacitor in which the capacitor body and the insulating plate are integrated can be securely fixed to the printed circuit board.

[Brief description of the drawings]

FIG. 1 is an external perspective view illustrating a chip-type capacitor according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the chip-type capacitor according to the first embodiment of the present invention in cross section A.

FIG. 3 is an exploded perspective view showing a mounting state of an insulating plate in the chip-type capacitor according to the first embodiment of the present invention.

FIG. 4 is an exploded perspective view showing a chip-type capacitor according to a second embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional chip-type capacitor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Capacitor main body 2 Insulating plate 3 Lead wire 4 Sealing member 5 Storage groove 6 Locking member 7 Storage groove 8 Side surface part 9 Through hole 10 Through hole 11 Fitting part 12 Capacitor element 13 Exterior case 14 One end 15 Round bar part 16 Leading part 17 protrusion

Claims (3)

[Claims] 1. A capacitor element is housed in a bottomed cylindrical outer case, an opening of the outer case is sealed by a sealing member, and a lead wire led out from the capacitor element penetrates the sealing member. In a chip type capacitor comprising a capacitor body and an insulating plate abutted on a lead wire lead-out side of the capacitor body, wherein the lead wire penetrates the insulating plate and is bent along a lower surface of the insulating plate.
A chip-type capacitor, wherein one end is fixed to the sealing member, and the other end is fitted in the insulating plate with at least one or more locking members led out in the same direction as the lead wire. 2. The chip-type capacitor according to claim 1, wherein said locking member is fitted into said insulating plate and penetrated and bent along the lower surface of said insulating plate. 3. The locking member fits into the insulating plate and penetrates and extends to the lower surface of the insulating plate, and at least a portion extending to the lower surface of the insulating plate is made of a solderable material. 3. The chip-type capacitor according to claim 1, wherein: