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Publication number
JP2002105169A5
JP2002105169A5 JP2000294106A JP2000294106A JP2002105169A5 JP 2002105169 A5 JP2002105169 A5 JP 2002105169A5 JP 2000294106 A JP2000294106 A JP 2000294106A JP 2000294106 A JP2000294106 A JP 2000294106A JP 2002105169 A5 JP2002105169 A5 JP 2002105169A5
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Japan
Prior art keywords
epoxy resin
formula
represented
tertiary octyl
following general
Prior art date
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Application number
JP2000294106A
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Japanese (ja)
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JP4605420B2 (en
JP2002105169A (en
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Priority to JP2000294106A priority Critical patent/JP4605420B2/en
Priority claimed from JP2000294106A external-priority patent/JP4605420B2/en
Publication of JP2002105169A publication Critical patent/JP2002105169A/en
Publication of JP2002105169A5 publication Critical patent/JP2002105169A5/ja
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Publication of JP4605420B2 publication Critical patent/JP4605420B2/en
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Expired - Fee Related legal-status Critical Current

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Description

【請求項１】 下記一般式（１）
【化１】

Figure 2002105169
（式中、Ｒ1はターシャリーオクチル基、Ｒ2は水素原子或いはメチル基、ｎは０〜１０の整数で繰り返し単位数を表す。）
で表されるエポキシ樹脂（Ａ）と硬化剤（Ｂ）とを必須成分とするエポキシ樹脂組成物。 1. The following general formula (1)
Embedded image
Figure 2002105169
(In the formula, R1 is a tertiary octyl group, R2 is a hydrogen atom or a methyl group, and n is an integer of 0 to 10 and represents the number of repeating units.)
An epoxy resin composition comprising, as essential components, an epoxy resin (A) and a curing agent (B).

すなわち、本発明は、
１．下記一般式（１）

Figure 2002105169
（式中、Ｒ1はターシャリーオクチル基、Ｒ2は水素原子或いはメチル基、ｎは０〜１０の整数で繰り返し単位数を表す。）
で表されるエポキシ樹脂（Ａ）と硬化剤（Ｂ）とを必須成分とするエポキシ樹脂組成物、
２．エポキシ樹脂（Ａ）が下記一般式（２）で表されるエポキシ樹脂である前記１記載の組成物、
Figure 2002105169
 （式中、ｎは０〜１０の整数の繰り返し単位数を表す。）
３．前記１または２記載のエポキシ樹脂組成物を硬化してなる硬化物、
を提供する。 That is, the present invention
1. The following general formula (1)
Figure 2002105169
 (In the formula, R1 is a tertiary octyl group, R2 is a hydrogen atom or a methyl group, and n is an integer of 0 to 10 and represents the number of repeating units.)
An epoxy resin composition comprising an epoxy resin (A) and a curing agent (B) represented by the following as essential components:
2. The composition according to the above 1, wherein the epoxy resin (A) is an epoxy resin represented by the following general formula (2),
Figure 2002105169
 (In the formula, n represents an integer of 0 to 10 repeating units.)
3. A cured product obtained by curing the epoxy resin composition according to the above 1 or 2,
I will provide a.

【０００６】
【発明の実施の形態】
式（１）で表されるエポキシ樹脂は、例えば、下記一般式（３）
【化５】

Figure 2002105169
（式中、Ｒ1はターシャリーオクチル基を表す。）
で表されるジアルキル基置換ジヒドロキシベンゼン類とエピハロヒドリンとを反応させて得ることができる。 [0006]
BEST MODE FOR CARRYING OUT THE INVENTION
The epoxy resin represented by the formula (1) is, for example, the following general formula (3)
Embedded image
Figure 2002105169
(In the formula, R1 represents a tertiary octyl group.)
By reacting a dialkyl group-substituted dihydroxybenzene represented by the following formula with epihalohydrin.

本発明に用いるエポキシ樹脂（Ａ）は、ターシャリーオクチル基を２個結合されたジヒドロキシベンゼン類にエピハロヒドリンを反応させることによって得られる。ターシャリーオクチル基は、具体的には、下記構造式（４）

Figure 2002105169
で表されるものである。またベースのジヒドロキシベンゼン類としては、ハイドロキノン、レゾルシン、カテコール類があるが、反応性が良いことからハイドロキノンが特に好ましい。つまりは本発明のエポキシ樹脂の原料としては下記構造式（５）
Figure 2002105169
 で表される２，５−ジターシャリーオクチルハイドロキノンが特に好ましい。
The epoxy resin (A) used in the present invention is obtained by reacting a dihydroxybenzene having two tertiary octyl groups bonded with epihalohydrin. The tertiary octyl group is specifically represented by the following structural formula (4)
Figure 2002105169
 It is represented by The base dihydroxybenzenes include hydroquinone, resorcinol, and catechols, but hydroquinone is particularly preferable because of its high reactivity. That is, as a raw material of the epoxy resin of the present invention, the following structural formula (5)
Figure 2002105169
 2,5-ditert-octylhydroquinone represented by

JP2000294106A 2000-09-27 2000-09-27 Epoxy resin composition and cured product thereof Expired - Fee Related JP4605420B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000294106A JP4605420B2 (en) 2000-09-27 2000-09-27 Epoxy resin composition and cured product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000294106A JP4605420B2 (en) 2000-09-27 2000-09-27 Epoxy resin composition and cured product thereof

Publications (3)

Publication Number Publication Date
JP2002105169A JP2002105169A (en) 2002-04-10
JP2002105169A5 true JP2002105169A5 (en) 2007-11-15
JP4605420B2 JP4605420B2 (en) 2011-01-05

Family

ID=18776778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000294106A Expired - Fee Related JP4605420B2 (en) 2000-09-27 2000-09-27 Epoxy resin composition and cured product thereof

Country Status (1)

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JP (1) JP4605420B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4208068B2 (en) * 2003-02-14 2009-01-14 日本化薬株式会社 Liquid crystal sealant and liquid crystal display cell using the same
JP6809206B2 (en) * 2016-12-21 2021-01-06 Dic株式会社 Epoxy resin, curable resin composition and its cured product

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10158362A (en) * 1996-11-28 1998-06-16 Nippon Kayaku Co Ltd Epoxy resin composition, cured material and semiconductor device
JP3998163B2 (en) * 1998-03-13 2007-10-24 日本化薬株式会社 Epoxy resin, epoxy resin composition and cured product thereof
JP4678456B2 (en) * 2000-06-28 2011-04-27 Ｄｉｃ株式会社 Epoxy resin composition
JP2002069154A (en) * 2000-08-30 2002-03-08 Dainippon Ink & Chem Inc Epoxy resin composition

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