JP2002100528A - Capacitor and method of manufacturing the same - Google Patents

Abstract

(57) [Summary] In an organic thin film capacitor, a withstand voltage of a dielectric layer made of an organic thin film is secured, low impedance is realized, and solderability is improved.
An object is to manufacture a small and large-capacity capacitor. SOLUTION: A metal sprayed layer 16 is provided on electrode lead end faces on both sides of a capacitor element.
6, a conductive resin layer 17 formed by dispersing copper, nickel and silver particles in a phenol resin, and the surface of the conductive resin layer 17 is covered with solder 18.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small-sized, lightweight, low-cost, low-impedance organic thin-film capacitor used for electronic equipment and electric equipment requiring large capacity and high reliability.

[0002]

2. Description of the Related Art In recent years, portable electronic devices used outdoors or computer-related electronic devices have been growing rapidly, and small, highly reliable surface-mount electronic devices used in these electronic devices have been used. The demand for parts is extremely high. Capacitors are also much smaller and smaller than before.
Strict requirements are increasing for high performance such as large capacity, light weight, low price and low impedance. For example, a film capacitor having a size of 3.2 mm × 2.5 mm, having good characteristics of a conventional film capacitor, and having a capacitance about 10 times that of a conventional film capacitor is required.

Conventionally, so-called film capacitors have been used to meet demands for high-performance characteristics such as low impedance. A film capacitor is generally manufactured by casting a molten resin, depositing a metal on a plastic film obtained by stretching, and winding or laminating the film. However, in order to respond to the recent demand for significant miniaturization as described above, a technology for manufacturing a plastic film of at least 1 μm or less and a technology for manufacturing a metallized film capacitor by depositing the same are necessary. Although it can be manufactured and deposited in a laboratory, it has many insulation defects and a problem of high cost, and it has been almost impossible to mass-produce it at low cost.

In recent years, several organic thin film capacitors formed by forming a thin organic thin film have been proposed for the above-mentioned applications.

[0005] The following is a conventional known technique, Japanese Patent Publication No. Sho 44
The structure of the organic thin film capacitor disclosed in Japanese Patent Publication No. 25014 and Japanese Patent Publication No. 46-1945 will be described.

FIG. 6 is a sectional view of a conventional organic thin film capacitor described in Japanese Patent Publication No. 44-25014. In FIG. 6, an organic thin-film capacitor has a substrate 26 such as a polystyrene film also serving as a protective layer, and a metal-deposited aluminum electrode film 27 of aluminum as an element layer of the capacitor thereon.
a, 27b and the external electrodes 28a, 28b so as to prevent short-circuiting between the metal-deposited electrode films 27a, 27b when vacuum-depositing the metal-deposited electrode films 27a, 27b in a region where no metal-deposited electrode film is formed (hereinafter referred to as "margin") 29a, 29b
Are alternately arranged in front of the external electrodes 28a and 28b, and the metal-deposited electrode films 27a and 27b are insulated and opposed by organic polymer films 30a and 30b as dielectrics. The film 27a and the external electrode 28a are electrically connected to each other, and the metal deposition electrode film 27b and the external electrode 28b are electrically connected to each other. Further, the metal deposition electrode film 27a, the organic polymer film 30a, the metal vapor deposition electrode film 27b, and the organic polymer film 30b
Are laminated in this order. JP-B-44-25014 does not disclose a specific material for an organic polymer film, but discloses a glow discharge method or an electron impact method as a method for producing the same.

However, the formation of an organic polymer film by the glow discharge method or the electron impact method is extremely slow at a film formation rate of 1 to 100 angstroms per minute. However, the above-mentioned conventional methods have been hardly practically used because of the cost and time required.

FIG. 7 is a sectional view of a conventional organic thin film capacitor disclosed in Japanese Patent Publication No. 46-1945. FIG.
In the above, the organic thin film capacitor is provided with margin portions 34a, 34 on both sides of a resin film 31 as a base film.
b, 34c, 34d, a metal-deposited electrode film 32a, 32b, 33a, 33b of aluminum, a polymerizable epoxy resin and a cross-linking agent interposed therebetween are vacuum-deposited simultaneously from different evaporation sources. Then, a film having a multilayer structure in which resin thin films 35a and 35b serving as dielectric layers are formed is wound to form a capacitor.

In Japanese Patent Publication No. 46-1945, a polymerizable epoxy resin is formed by vacuum evaporation simultaneously from a crosslinking agent and another evaporation source to form an organic polymer film by the glow discharge method or the electron impact method. A higher deposition rate can be obtained.

However, in the technique described in Japanese Patent Publication No. 46-1945, a polymerizable epoxy resin is simultaneously vacuum-deposited from a cross-linking agent and another evaporation source, so that a polymerized resin film having both evaporation rates can be obtained. If not controlled accurately, the degree of polymerization of the polymerized resin film changes, and the basic characteristics of the capacitor, such as insulating properties, dielectric constant, and dielectric loss, change. For this reason, there has been a problem that the film forming rate cannot be improved to the extent that mass productivity sufficient for supplying to the market can be obtained. In addition, since a conventional resin film is used as the base film, miniaturization cannot be achieved unless the base film is thinned. However, as described above, the thickness of the film is limited, and the effect of miniaturization is reduced by half. was there.

With the advance of technology, a method of manufacturing an organic thin film capacitor shown in FIG. 8 has been proposed in order to meet the demand for miniaturization. First, as a protective layer, a liquid resin material curable by radiation such as ultraviolet rays is applied on the support 39 by an ultrasonic atomizer 37, and a plurality of organic thin films cured by polymerizing the resin by ultraviolet irradiation 36 are applied. Laminate twice. Next, as an element layer, a band-like oil film made of paraffin oil for forming a margin is formed on an organic thin film formed by the same method as the protective layer, supplied from an oil applicator 40, and aluminum is formed thereon. Is evaporated from the metal deposition source 43 to form a metal thin film having a margin. Similarly, an organic thin film is formed on the metal thin film by the ultrasonic atomizer 37 and the ultraviolet irradiation 36, and the position is shifted by a predetermined width in the same manner so that the capacitance of the capacitor is generated on the organic thin film. A metal thin film having a margin is formed. Hereinafter, the positions of the margins are alternately shifted in this manner,
The organic thin film and the metal thin film are stacked a predetermined number of times of 1500 or more to obtain a stacked body 38. Next, the electrode extraction end face of the laminate, that is, the end face in the direction in which the margin is shifted, is treated with oxygen plasma to selectively remove the organic thin film near the end face, and the organic thin film is removed from the electrode extraction end face of the laminate. The structure shall be protruded. Next, on the electrode extraction end face,
An external electrode intermediate layer made of brass having a thickness of 0.4 mm is formed by metal spraying, and an external electrode outermost layer made of an alloy containing 60% of tin and the balance of lead is formed on the external electrode intermediate layer with a thickness of 0.1 mm.
It is formed by hot-dip plating at 1 mm. After that, an exterior is provided as required to obtain an organic thin film capacitor.

[0012]

Means for reducing the size and capacity of an organic thin film capacitor include either reducing the thickness of the organic thin film or increasing the relative permittivity of the organic thin film. Means for increasing the relative permittivity generally cannot avoid an increase in dielectric loss tangent, and are difficult to use for high performance applications such as low impedance. Further, a material which can be used in the above-mentioned conventional example and which can be evaporated, is radiation-curable, and has a relative dielectric constant high enough to be effective for miniaturization has not yet been found.
In contrast, a method of reducing the thickness of the organic thin film is practically effective for miniaturization.

However, in the above-mentioned conventional method for manufacturing an organic thin film capacitor, there is a limit to thinning an organic thin film. That is, the organic thin film is 1.0 μm in the conventional manufacturing method.
m, the withstand voltage was 130 V, but 0.3 μ
When the film thickness is reduced to m, the voltage drops to 30 V, and there is a problem that a theoretical withstand voltage cannot be obtained. The reason for this is that, in the case of coating by ultrasonic spraying, the diameter of the particles of the atomized organic thin film material is several μm, so when trying to obtain a thin film of 1 μm or less, the atomized particles are discretely attached. However, it is difficult for the attached particles to spread uniformly and thinly, and even if the average particle size is 0.3 μm, there is an uneven portion having a size of only 0.2 μm or less.

Further, as shown in FIG. 9A, the thickness of the residual oil film 45 in the margin is larger than the thickness of the metal thin film 44a. When the thickness of the formed organic thin film 46a is smaller than that of the other portions and the number of layers is large, there is a problem that withstand voltage cannot be obtained.

For the same reason, the metal thin film formed on the organic thin film on the margin where the thick residual oil film remains has a small thickness, so that the electrical resistance value of the metal thin film increases.
There is a problem that the impedance of the capacitor increases.

For the same reason, as shown in FIG. 9 (b), the margin of the capacitor has a raised shape compared to other portions. Therefore, in a chip type capacitor having no lead wire, the external electrodes are printed. There is also a problem that the solderability is hindered because the substrate may be separated from the substrate.

On the other hand, by reducing the thickness of the organic thin film, a difference in heat shrinkage occurs between the element layer in which the metal thin film and the organic thin film are alternately stacked and the protective layer in which only the organic thin film is stacked, There was a problem that the protective layer was peeled off. In particular, it was found that when the degree of hardening of the double bond in the organic thin film material was set to 90% or more for stabilizing the capacitor characteristics and 95% or more for further stabilization, it was remarkable.

Further, when the organic thin film is made thinner, if the ratio of the element layer to the total number of laminated layers is set to 50% or less, the protective layer and the layer made of the sprayed brass, which is the intermediate layer between the external electrodes, can be mechanically combined. Due to the weak adhesive force, the electrical connection between the external electrode and the metal thin film becomes unstable, and the impedance characteristics deteriorate.

Further, it has been found that when the organic thin film is made thinner, the electrical connection resistance between the metal thin film and the external electrode layer becomes higher, and the impedance characteristic becomes higher. The cause is that when the thickness of the organic thin film is reduced, the gap between the protruding portions becomes narrower, and because the particles of the sprayed metal constituting the external electrode are large, it is difficult to penetrate into the gap. This is because the adhesive force is reduced, and at the same time, a portion where the electrical connection between the metal thin film and the external electrode is broken occurs to increase the electrical connection resistance value.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a small-sized, large-capacity, low-impedance capacitor and a manufacturing method for obtaining such a capacitor.

[0021]

In order to solve these problems, in the capacitor of the present invention, a metal sprayed layer is applied to the electrode lead end faces on both sides of the capacitor element, and phenol is formed on the metal sprayed layer. A conductive resin layer in which particles of copper, nickel and silver are dispersed in a resin is formed, and the surface of the conductive resin layer is covered with solder.

The weight ratio of copper, nickel and silver is from 100 to 30 to 55 to 1.5 to 4, and at least the copper, nickel and silver particles have a distribution in the range of 1 to 50 μm. Is preferred.

In such a capacitor, a metal is sprayed on the electrode lead end faces on both sides of the capacitor element to form a metal sprayed layer, and then, on this metal sprayed layer, particles of copper, nickel and silver are contained in a phenol resin. A dispersed liquid resin is applied and cured to form a conductive resin layer, and then the conductive resin layers 17a and 17b are subjected to hot-dip solder plating.
It can be manufactured by coating the surface of the conductive resin layer with the solders 18a and 18b.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the capacitor according to the present invention will be described below.

As the organic material used in the present invention, an organic material having at least two vinyl groups, curable by radiation, and liquid at normal temperature and atmospheric pressure is used. As such a material, for example, an acrylate ester having an acryloyl group at a terminal as a functional group (an acrylate ester is referred to as an “acrylate”; hereinafter, referred to as an “acrylate”) or a methacryl having a methacryloyl group at a terminal as a functional group Among them, acid esters (methacrylic acid esters are referred to as “methacrylates”; hereinafter, referred to as “methacrylates”), and the like are representative of polyfunctional acrylates and polyfunctional methacrylates having two or more functional groups. The number of functional groups is generally about 2 to 6, but generally, the larger the number of functional groups, the higher the viscosity, the higher the boiling point, and the lower the vapor pressure tends to be. The viscosity, boiling point, and vapor pressure are selected in consideration. be able to. In the molecular structure of acrylates and methacrylates, polyester acrylates having a polyester structure, epoxy acrylates having an epoxy structure, urethane acrylates having a urethane structure, polyether acrylates having a polyether structure, melamine structures And alkyd acrylates having an alkyd structure, silicone acrylates having a silicone structure, and acrylates obtained by subjecting bisphenol A to acrylate, and the like can also be selected. The polyester acrylates;
Epoxy acrylates, urethane acrylates, polyether acrylates, melamine acrylates,
Alkyd acrylates, silicone acrylates,
When the viscosity of an acrylate obtained by converting bisphenol A into an acrylate is high, it can be used in combination with a low-viscosity acrylate or methacrylate, or a low-viscosity monofunctional monoacrylate or monomethacrylate.

As the organic material used in the present invention, besides acrylates and methacrylates, divinyl ethers having two vinyl groups as functional groups or dipropenyl ethers having two propenyl groups can be used. As other functional groups, those having an acrylamide group, those having a maleic acid diester,
Those having an allyl group, those having a vinyl ether group, those having a vinyl thioether group, those having a vinylamino group, those having a glycidyl group, those having an acetylenically unsaturated group, and the like are also used as the organic material of the present invention. be able to.

The relative permittivity of the dielectric layer made of an organic thin film can be selected by selecting the organic material.

As an embodiment of the present invention, for example, an organic material having at least two or more vinyl groups can dimerize cyclopentadiene, and then form carbon monoxide and hydrogen on two carbon-carbon double bonds. Was added to formylate, and further hydrogen was added to form a dihydroxy compound, followed by esterification by reacting with acrylic acid, washing and removing unreacted components, and then drying the water to 100 ppm or less. Is used.

[0029]

[Formula 1]

The structure of one isomer of the above monomer is shown.

In the step of introducing the organic material into the vacuum vessel in a liquid state, the organic material is a liquid, and therefore, for example, it is appropriate that the organic material is pressurized by a pressurized gas such as pressurized air or conveyed by a pump. It can be appropriately selected according to the viscosity of the material. The vacuum vessel is a rotating support described below, an evaporator of an organic material, an evaporator for evaporating a metal to be a deposition electrode, a device for forming an oil margin, a device for irradiating radiation, and the like. In addition, a vacuum vessel in which necessary devices are arranged in a vessel, and an exhaust device suitable for achieving a degree of vacuum required for vapor deposition of metal as the vapor deposition electrode, for example, an oil rotary vacuum pump, oil In addition to a diffusion vacuum pump, a mechanical booster pump, and the like, a vacuum exhaust device used for a normal vacuum device is used alone or in combination, and an additional device required for the vacuum exhaust device is provided.

The manufacturing method of the present invention is, as shown in FIG.
The organic material is transported as it is into the vacuum vessel 1 and introduced into the organic material evaporator 5. The organic material is heated in the evaporator 5 at a temperature equal to or lower than the boiling point of the organic material to evaporate.
The evaporator for the organic material is provided with a temperature controller (not shown) so that the heating temperature at this time can be adjusted in an appropriate temperature range not higher than the boiling point of the organic material.

The vapor 9 of the organic material vaporized in the evaporator 5 is deposited on the surface of the rotating cooled support 2 or on the organic material already formed and cured and activated on the support 2. To form an organic thin film having a very uniform thickness.

The rotating cooled support 2 is generally cylindrical, and is driven by a motor or the like so as to rotate at a constant speed about the axis of symmetry of the cylinder, and circulates the refrigerant in the cylinder. For example, a cooling can can be used. The steps of the manufacturing method of the present invention are mainly performed by forming an organic material, a metal, and the like by vapor deposition on the curved side surface of the rotating cylindrical support, and stacking and forming an organic thin film capacitor.

The organic material is vapor-deposited on the cooled surface of the support 2 or on the radiation-cured organic thin film previously formed on the support 2 and simultaneously activated by irradiation with radiation. Crosslinks and cures. As the radiation, for example, an electron beam or an ultraviolet ray is used. As the electron beam, scattered electrons 7 emitted from an electron beam source 11 used for vapor deposition of a metal thin film can be used, but a dedicated radiation source may be separately provided.

Subsequently, the support 2 rotates and is arranged in parallel on the organic thin film along the moving direction of the support, and the position in the width direction is switched every arbitrary rotation of the support. A plurality of strip-shaped perfluoroalkyl ether films are formed. Examples of the perfluoroalkyl ether include "Fomblin" (trade name, manufactured by Ausimont, Italy). The above-mentioned perfluoroalkyl ether is suitably formed on the organic thin film by, for example, an oil applicator 4 which is heated and vapor-deposited as vapor from a small hole of a heater. The perfluoroalkyl ether film is formed in a position and a shape corresponding to the position and the shape of the non-metallized portion of the metal thin film.
The position in the width direction is switched at each arbitrary round of the above, so that the vapor deposition electrodes made of the metal thin film are formed to face each other with the dielectric layer made of the organic thin film interposed therebetween. As a result, a portion that contributes to the capacitance constituted by the dielectric layer and the vapor deposition electrode layer opposed to the dielectric layer is formed.

Subsequently, the support 2 is rotated to form a metal thin film as an electrode for vapor deposition on the organic thin film on which the plurality of strip-shaped perfluoroalkyl ether films are formed by electron beam evaporation. A metal thin film having a plurality of strip-shaped non-metallized portions. According to the thickness of the metal thin film, for example, when the thickness of the metal thin film is small, it is necessary to reduce the thickness of the perfluoroalkyl ether film so that the non-metallized portion can be formed with good insulation. .

Subsequently, the perfluoroalkyl ether film remaining on the plurality of strip-shaped non-metallized portions is removed by a glow discharge 10 of a gas containing at least oxygen.

Subsequently, the support 2 is rotated to repeat the above-described step of forming the dielectric layer composed of the organic thin film, and to deposit an organic material and metal on the curved side surface of the cylindrical support by vapor deposition. Then, a laminated body 3a is formed by laminating to form an organic thin film capacitor.

If necessary, in the first half and the second half of the step of forming the laminated body 3a, the upper and lower portions of the part that contributes to the capacitance of the laminated body are formed without forming the metal thin film. A protective layer can be formed on the substrate.

After the step of forming the laminate 3a is completed, the laminate 3a is separated from the support 2 in the vacuum vessel 1 and taken out.

Subsequently, as shown in FIG.
Is processed into a substantially flat plate shape by, for example, a press or a hot press.

Subsequently, the laminated body 3b, which has been processed into a substantially flat plate shape, is divided at positions corresponding to the positions where the external electrodes of the respective capacitor elements are taken out, to form the strips 20 of the respective capacitor elements.
For the division, for example, a method using a razor blade, a milling blade, or a rotary grindstone blade is appropriate.

The strip 20 of the capacitor element formed by the dividing step is placed on a metal frame 21 shown in FIG.
And the frame 21 is put into a decompression container 23 shown in FIG. 5 together with the frame 21. Oxygen is injected into the decompression container 23 to maintain a constant partial pressure, exhausted, and high-frequency power 25 Oxygen plasma is generated by performing glow discharge in, and the oxygen plasma is brought into contact with external electrode extraction end faces on both sides of the capacitor element of the strip, and at least a part of the electrode extraction end face side portion of the dielectric is chemically selected. Then, the portions of the dielectric layers near the tips of the electrode leading ends are made substantially thinner than the portions contributing to the capacitance. For example, if SF6 is added to oxygen at about 5%, there is an effect that the selective removal can be performed at a high speed and in a stable discharge state.

Subsequently, the strip 20 and the frame 21 are taken out of the decompression container 23, and metal sprayed layers 16a, 16b of, for example, brass, tin, etc. are applied to the electrode lead end faces on both sides of the capacitor element of the strip 20, respectively. Are connected.

Subsequently, the metal sprayed layers 16a, 1
6b, the phenolic resin contains copper, nickel and silver particles in a weight ratio of 100 to 30 to 55 to 1.5 to 4 and at least a particle size of the copper, nickel and silver particles of 1 to 5
A liquid resin in which particles having a distribution of 0 μm are dispersed is applied and cured to form conductive resin layers 17a and 17b, and a part of the particles in the conductive resin layers 17a and 17b is removed. The conductive resin layer 17 is contacted continuously.
The resistance values of a and 17b are set to 20 mΩ or less, and the conductive resin layers 17a and 17b are formed so as to protrude from both upper and lower surfaces near the electrode lead end surface of the capacitor element. The protruding shape is indicated by A in FIG.

Subsequently, the strip 20 on which the conductive resin layers 17a and 17b are formed is subjected to hot-dip solder plating, and the surface of the conductive resin layer is covered with solders 18a and 18b.

Subsequently, the strip 20 subjected to the hot-dip solder plating is cut into individual capacitors. For the cutting, for example, a method using a milling blade or a rotary grindstone blade is suitable.

Subsequently, the capacitor is provided with an extremely thin exterior film which does not hinder the solderability of the external electrodes on all surfaces including the external electrodes of the individual capacitors. For example, the exterior film is a film cured by immersing the capacitor in a low-viscosity silane coupling agent such as trimethylmethoxysilane does not inhibit soldering mountability, and improves the moisture resistance reliability of the capacitor. is there.

Although one embodiment of the present invention has been described above, the material of the present invention is not limited to the above-described embodiment.
The scope of the claims of the present invention is suitable for the purpose of the present invention.

[0051]

As described above, according to the present invention, according to the capacitor of the present invention and the method for manufacturing the same, a small-sized, large-capacity, low-impedance, and highly reliable organic thin-film capacitor having good solderability is provided. , At a low cost and with good yield.

[Brief description of the drawings]

FIG. 1 is a view showing an apparatus for manufacturing a laminate according to an embodiment of the present invention;

FIG. 2 is a sectional view of an organic thin film capacitor according to an embodiment of the present invention.

FIG. 3 is a diagram showing a step of pressing a laminate according to one embodiment of the present invention.

FIG. 4 is a view showing a step of incorporating a strip into a metal frame according to an embodiment of the present invention.

FIG. 5 is a view showing a step of chemically and selectively removing a dielectric substance from an external electrode extraction end face according to an embodiment of the present invention;

FIG. 6 is a sectional view of a conventional organic thin film capacitor described in Japanese Patent Publication No. 44-25014.

FIG. 7 is a cross-sectional view of a conventional organic thin film capacitor described in Japanese Patent Publication No. 46-1945.

FIG. 8 is a diagram showing an example of a manufacturing process of a conventional organic thin film capacitor.

FIG. 9 is an external view of a conventional capacitor and an enlarged sectional view of a margin portion thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Vacuum container 2 Rotating support body 3a, 3b laminated body 4 Oil applicator 5 Organic material evaporator 6 Metal evaporation source 7 Scattered electron 8 Metal vapor 9 Organic material vapor 10 Oxygen glow 11 Electron beam 12 Organic material thin film 13 Evaporation electrode 14a , 14b Margin 15a, 15b Dielectric layer 16a, 16b Metal sprayed layer 17a, 17b Conductive resin layer 18a, 18b Solder plating layer 19a, 19b Press plate 20 Capacitor strip 21 Metal frame 22 Spacer 23 Pressure reducing vessel 24a, 24b High frequency discharge electrode 25 High-frequency power supply 26 Substrate 27a, 27b Metal-deposited electrode film 28a, 28b External electrode 29a, 29b Margin 30a, 30b Organic polymer film 31 Base film 32a, 32b, 33a, 33b Metal thin film 34a, 34b, 34c, 34d Margin 35a, 35b Invitation Electric thin film 36 Ultraviolet light source 37 Ultrasonic atomizer 38 Laminated body 39 Support body 40 Oil applicator 41 Vacuum container 42 Metal vapor 43 Metal evaporation source 44a, 44b Metal thin film 45 Residual oil 46a, 46b Organic thin film

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shigeki Hatanaka 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Takashi Imanaka 1006 Kadoma Kadoma, Kadoma City Osaka Pref. (72) Inventor Kazuo Iwaoka 1006 Kadoma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. 5E082 AB03 EE07 FF05 FG06

Claims (3)

[Claims] 1. A metal sprayed layer is applied to both electrode lead end faces on both sides of a capacitor element.
A capacitor, wherein a conductive resin layer formed by dispersing copper, nickel, and silver particles in a phenol resin is formed, and the surface of the conductive resin layer is covered with solder. 2. The weight ratio of copper, nickel and silver is 100
2. The capacitor according to claim 1, wherein the ratio is 30 to 55 vs. 1.5 to 4, and at least the copper, nickel, and silver particles have a distribution in the range of 1 to 50 μm. 3. A metal sprayed layer is formed by spraying a metal on the electrode lead end faces on both sides of the capacitor element, and then copper, nickel and silver particles are dispersed in a phenol resin on the metal sprayed layer. A method for manufacturing a capacitor, comprising applying and curing a liquid resin to form a conductive resin layer, subsequently subjecting the conductive resin layer to hot-dip solder plating, and coating the surface of the conductive resin layer with solder.