JP2002190655A - Manufacturing method and exposure method of printed wiring board - Google Patents

Abstract

(57) [Summary] [Problem] The distance accuracy between holes in a printed wiring board hinders the quality of holes and the increase in wiring density. A hole (1) shifted from a designed hole position (11).
Exposure is performed by aligning each of the land portions 13a and 13b with respect to 2a and 12b. Further, the wiring part 14 is formed with the holes 12a,
And exposure. [Effect] Since the influence of the distance accuracy between holes can be neglected, high-density wiring of a printed wiring board can be realized by improving the hole quality and reducing the land diameter.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board used for electric / electronic equipment and the like and a method for exposing the same.

[0002]

2. Description of the Related Art An exposure apparatus is used to form a circuit or a solder resist on a conventional multilayer printed wiring board. This exposure apparatus includes an exposure apparatus that performs exposure in a lump or in units of regions using a mask film prepared from data on which wiring is designed in advance, and an exposure apparatus that directly draws with wiring data on which wiring is designed in advance. It should be noted that related devices of this type include, for example, JP-A-2000-122303.
No. Gazette.

[0003]

Generally, the position of the interlayer connection hole of the printed wiring board is displaced by the interlayer connection hole due to, for example, expansion and contraction of the printed wiring board and a hole forming process. In particular, in a printed wiring board including a non-through hole and a through hole, the relative position between the non-through hole and the through hole is shifted.

In such a case, conventionally, during the exposure operation in the circuit forming process, the alignment has been performed by uniformly distributing the interlayer connection hole deviation. In other words, the land diameter is enlarged as a measure against land formation failure or land formation failure, and a measure against the positional deviation is taken. However, in this case, since the land diameter is enlarged, there is a problem that the wiring density is reduced accordingly.

Further, when a dry film type etching film is used, the exposure amount of the land portion and the conductor portion other than the land portion (hereinafter referred to as wiring portion) are the same, so that the tenting characteristics required for the land portion and the wiring There is a problem that it is difficult to achieve the required adhesion of the part.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a high-density multilayer printed wiring board which can reduce land diameters and prevent land formation defects.

Another object of the present invention is to provide an exposure method in a method for manufacturing a multilayer printed circuit board, which has both tenting characteristics and adhesion.

[0008]

In order to achieve the above object, according to the present invention, each land or each pre-grouped land is aligned to expose the land, and further, the wiring is exposed. I do. When the connection between the wiring portion and the land portion is cut off, the land portion and the wiring portion to be connected are recognized in advance, and the extension, shortening, and detouring of the wiring portion are performed automatically to connect the land portion and the wiring portion. As a result, land formation failure and land diameter reduction can be achieved. Further, by exposing the land portion and the wiring portion with different exposure amounts, it is possible to achieve both the tenting characteristics of the land portion and the adhesion characteristics of the wiring portion.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment (Embodiment 1) of the present invention will be described below with reference to FIGS. Although the present embodiment will be described using the subtractive method, the same applies to the additive method. FIG. 1 shows an example of a cross section of a printed wiring board in which through holes and non-through holes are mixed. In such a drilling process of a printed wiring board, there are cases where the positioning of a through hole and a non-through hole differs. This is because the through hole 7 is drilled in consideration of the interlayer displacement between the conductor layers 1, 2, 3, 4, 5, and 6, whereas the non-through hole 8 is the second conductor layer 2, the non-through hole
Reference numeral 9 is for drilling considering only the third conductor layer 3. As a result, the positional relationship between the non-through hole and the through hole is displaced, which causes a land formation defect at the time of circuit formation. In the present invention, even if the positional relationship of the holes is different from the design value,
Good circuit formation is possible. This will be described with reference to FIG. In FIG. 2, first, holes 12a, 12b
From the hole position 11 on the design value to the outside as shown in the figure, for example.
The distance between the holes is widened by shifting by 0.05 mm. That is,
A printed wiring board 10a is prepared in which holes 12a and 12b having a hole diameter of 0.15 mm are shifted by 0.05 mm from the hole position 11 on the design value by 0.05 mm. This printed wiring board is shown in FIG. Also, a land portion 13a having a land diameter of 0.20 mm of the hole 12a.
A mask film (not shown) in which only a land portion 13b having a land diameter of 0.20 mm in the hole 12b is formed, and a wiring portion 14 having a width of 0.08 mm in the hole 12b.
A mask film (not shown) in which only the mask film is formed is individually prepared. Next, an etching resist is formed on the printed wiring board 10a (see FIG. 2A). Next, land part 13a
Hole 12a or hole 12a
The alignment is performed by using the alignment mark corresponding to and exposure is performed. Next, the mask film on which only the land portions 13b are formed is aligned by using the holes 12b or alignment marks corresponding to the holes 12b and exposed. Further, the mask film in which only the wiring portion 14 is formed is provided with the holes 12a and 12b or the holes 12a and 12b.
Expose evenly distributed alignment marks corresponding to
develop. This printed wiring board 10b is shown in FIG. Thereafter, the printed wiring board is etched. FIG. 2 shows the etched printed wiring board 10c.
There was no occurrence of land formation failure 17 as shown in FIG. This printed wiring board 10c is shown in FIG.

In addition, a printed wiring board manufactured by the prior art
Looking at 10d (, land formation failure 1 as shown in FIG.
7 has occurred. The land diameter where the land formation failure 17 does not occur in the conventional method is 0.30 mm, and in the present invention, the land diameter is 0.3 mm.
The land diameter can be reduced by 10 mm. Of course, if the alignment accuracy of the exposure apparatus itself is small, it is needless to say that the land diameter can be reduced to 0.10 mm or more. Further, it goes without saying that the effect of reducing the land diameter can be obtained even if the hole diameters are different. The same effect is obtained in the case of three or more holes or when three or more holes are grouped.

Hereinafter, another embodiment (Embodiment 2) of the present invention will be described with reference to FIGS. Although the present embodiment will be described using the subtractive method, the same applies to the additive method. FIG. 3 shows an apparatus flow and an outline of the apparatus according to the first embodiment of the present invention. In FIG. 3, first, the hole position of the printed wiring board 23 on which the etching resist is formed in step (a) is measured by the camera 22 (FIG. 3).
(See (a) and (g)). Next, in step (b), the wiring data in the design data storage unit 19 of the printed wiring board 23 is compared with the actually measured hole position in the arithmetic unit 18, and the position data of the land is printed on the stage 20. The position is changed to the actual hole position of the wiring board 23 (see FIGS. 3B and 3G). Next, according to the data changed in step (f), the light generated from the light source 21 is driven by the optical path control unit 24 to drive the mirror 25 to expose the wiring pattern on the printed wiring board 23 (FIG. 3 (f),
(G)). It is to be noted that reference numeral 18 denotes a calculation unit for performing various calculations related to the present invention, and 19 denotes a data storage unit for storing design data. FIG. 2 shows that even if the positional relationship between the holes is different from the design value, a good circuit can be formed by this apparatus flow.
This will be described below. A hole 12a with a hole diameter of 0.15 mm in which the distance between holes is previously shifted by 0.05 mm from the hole position 11 on the design value.
An etching resist is formed on the printed wiring board 10 obtained by processing the steps 12b and 12b. This printed wiring board 10a is shown in FIG.
Shown in The positions of the holes 12a and 12b are measured. The position data of the land portions 13a and 13b having a land diameter of 0.20 mm is changed to the measured positions of the holes 12a and 12b. Exposure and development are performed with the changed data. This printed wiring board 10
b is shown in FIG. Thereafter, no defective land formation 17 occurred on the etched printed wiring board 10c. This printed wiring board is shown in FIG. In the printed wiring board 10d manufactured by the conventional technique, a land formation defect 17 occurred. FIG. 2D shows the printed wiring board 10d. The land diameter at which the land formation failure 17 does not occur in the conventional method is 0.30 mm, and in the present invention, the land diameter can be reduced by 0.10 mm. Of course, if the alignment accuracy of the exposure apparatus itself is small, it is needless to say that the land diameter can be reduced to 0.10 mm or more. further,
It goes without saying that the effect of reducing the land diameter can be obtained even if the hole diameter is changed. The same effect is obtained in the case of three or more holes or when three or more holes are grouped.

Hereinafter, still another embodiment (third embodiment) of the present invention will be described with reference to FIGS.

In the second embodiment, when the actual distance between the holes is significantly different from the design value, for example, when the holes 28a and 28b are displaced by 0.5 mm from the holes 27 on the design value, the printed wiring board 26a is removed. This is shown in FIG. The printed wiring board 26b exposed by the method of the second embodiment has a land diameter
20 mm land portions 29a and 29b and wiring width 0.08m
m cannot be connected to the wiring section 30. FIG. 4B shows the printed wiring board 26b in this state. In the present invention, if the positions of the land portions 29a and 29b connected to the end portion of the wiring portion 30 do not match in advance, the end portion of the wiring portion 30 and the land portion 29
A condition for adding a wire connecting the wires a and 29b is set, and the wire portion 31 having a correction distance of 0.5 mm for the land portions 29a and 29b is set.
Add. The printed wiring board 26c thus exposed.
Is shown in FIG. As a result of development and etching after exposure, the land portions 29a and 29b and the wiring portion 30 are
Better connected. This printed wiring board 26
d is shown in FIG. Of course, the land portions 29a, 2
Needless to say, even when the end of the wiring portion 30 penetrates through the portion 9b, the protruding portion can be deleted. FIG. 3 shows an apparatus flow that implements the second embodiment. In FIG. 3, first, in step (a), the hole position data of the printed wiring board is measured (see FIG. 3 (a)). Next, in step (b), the position data of the land portion is corrected to the actual hole position of the printed wiring board (see FIG. 3 (b)). Next, in step (c), data of addition or deletion of wiring is edited based on the positional relationship between the land and the wiring to be connected to the land (see FIG. 3C). Next, exposure is performed using the data edited in step (f) (see FIG. 3 (f)). With this apparatus flow, it was confirmed that a good circuit could be formed even if the positional relationship between the holes was significantly different from the design value.

An embodiment (Embodiment 4) of the present invention will be described below with reference to FIG.
FIG. The printed wiring board 32a in the case where the hole 35 is closer than the designed hole position 33 is shown in FIG.
(A). When the method of the third embodiment is applied, a short circuit between the wiring portion 38 and the land portions 37a and 37b or a case where a minimum conductor gap cannot be secured occurs. FIG. 5B shows the printed wiring board 32b in this state. In the present invention, the minimum conductor gap specification is input to the apparatus in advance, and the shape of the wiring portion 38 is automatically changed to the shape of the wiring portion 40 so as to maintain the minimum conductor gap, and exposure is performed. The printed wiring board 32c in this state is shown in FIG.
It is shown in (c). By developing and etching the printed wiring board 32c, a printed wiring board 32d having a short circuit of the conductor and a minimum conductor gap can be realized. FIG. 5D shows the state of the printed wiring board 32d. Further, wiring specifications other than the minimum conductor gap can be added to the system of the exposure apparatus.
FIG. 3 shows an apparatus flow that implements the fourth embodiment. FIG.
First, in step (a), hole position data of a printed wiring board is measured (see FIG. 3A). Next, in step (b), the position data of the land portion is corrected to the actual hole position of the printed wiring board (see FIG. 3 (b)).
Next, in step (c), data of addition or deletion of wiring is edited based on the positional relationship between the land and the wiring to be connected to the land (see FIG. 3C). Next, step (d)
Search for conductor gaps and violations of design specifications (Fig. 3 (d))
reference). Next, in step (e), the data of the violating part is corrected (see FIG. 3 (e)). Next, exposure is performed using the data edited in step (f) (see FIG. 3 (f)). It was confirmed that good circuit formation was possible by this apparatus flow.

Hereinafter, an embodiment (Embodiment 5) of the present invention will be described with reference to FIG.
This will be described below. A certain etching resist film 45
FIG. 6A shows the relationship between the amount of exposure and the defect. There is a relationship 43 between the adhesion of the wiring portion and the defect rate and a relationship 44 between the tenting property and the defect rate of the interlayer connection hole, and there is no compatible exposure amount condition.

FIG. 6B shows a printed wiring board after development of an etching resist film subjected to conventional exposure. The printed wiring board after the etching is shown in FIG. When the exposure amount increased, a tenting defect in which the etching dry film 49 on the interlayer connection hole portion 46 cracked occurred. When the amount of exposure was reduced, an adhesion failure in which the etching resist film 47 of the wiring portion 48 was peeled off occurred.

An example in which the exposure amount of the interlayer connection hole portion and the wiring portion is changed according to the present invention will be described. The exposure amount of the interlayer connection hole 46 is 80 mj / cm ² , and the wiring portion 48 is the exposure amount of 100 mj / cm ² .
Exposure at cm ² confirmed that no defects occurred.

[0018]

According to the present invention, it is possible to read out the hole position information of the printed wiring board after the hole processing and to perform appropriate wiring design while comparing it with the wiring design specification. Reduction (land diameter of conventional technology = hole diameter +
The alignment accuracy of the exposure apparatus + the hole processing position accuracy + the amount of expansion / contraction of the printed wiring board or the amount of interlayer displacement, the land diameter according to the present invention = hole hole + the alignment accuracy of the exposure apparatus ) Is possible, and high-density wiring of the printed wiring board can be realized. In addition, since the land portion and the wiring portion can be exposed at different exposure amounts, it is possible to eliminate poor tenting and poor adhesion.

[Brief description of the drawings]

FIG. 1 is a sectional view of a printed wiring board.

FIG. 2 is a top view of a printed wiring board.

FIG. 3 is a flow chart of an exposure apparatus and an outline of the apparatus.

FIG. 4 is a top view of a printed wiring board.

FIG. 5 is a top view of a printed wiring board.

FIG. 6 is a diagram illustrating a relationship between an exposure amount and a defect rate and a cross-sectional view of a printed wiring board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... 1st conductor layer 2 ... 2nd conductor layer 3 ... 3rd conductor layer 4 ... 4th conductor layer 5 ... 5th conductor layer 6 ... 6th conductor layer 7 ... Through-hole 8 ... Non-through-hole 9 ... Non-through-hole 10a ... Printed wiring board 10b ... Printed wiring board 10c ... Printed wiring board 10d ... Printed wiring board 11 ... Designed hole position 12a ... Hole 12b ... Hole 13a ... Land part 13a ... Land part 14 ... Wiring part 15 ... Land part 16 ... Wiring part 17 ... Land formation failure 18 ... Calculation part 19 ... Design data storage part 20 ... Stage 21 ... Light source 22 ... Camera 23 ... Printed wiring board 24 ... Optical path control part 25 ... Mirror 26a ... Printed wiring board 26b ... Printed wiring board 26c ... Printed wiring board 26d ... Printed wiring board 27 ... Designed hole position 28a ... Hole 28b ... Hole 29a ... Land part 29b ... Land part 30 ... Wiring part 31 ... Wiring part 32a ... Printed wiring board 32b ... Printed wiring board 32c ... Printed wiring board 32d ... Printed wiring board 33 ... Designed hole position 34 ... Wiring 35 ... Hole position 36 ... Wiring part 37a ... Land part 37b ... Land part 38 ... Wiring part 39 ... Wiring part 40 ... Wiring part 41 ... Wiring part 42 ... Land part 43 ... Relationship between adhesion of wiring part and defective rate 44 ... Relationship between the tenting property of the interlayer connection hole and the defect rate 45 ... Etching resist film 46 ... Interlayer connection hole 47 ... Etching resist film 48 ... Wiring part 49 ... Etching resist film

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Naoki Nishimura 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Hitachi, Ltd.Communications Division (72) Inventor Yoshinori Muramatsu 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Hitachi, Ltd. Communications Division (72) Inventor Junichi Kawasaki 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture F-term (Reference) 2H097 AA12 LA09 5E346 AA05 AA06 AA12 AA15 AA22 AA32 AA42 AA43 AA51 DD32 DD33 EE15 EE18 FF01 GG15 GG18 GG28 HH11 HH26

Claims (6)

[Claims] In a manufacturing method of a printed wiring board, in an exposure step of forming a conductor portion and a land portion of a printed circuit board, individually or grouped lands and conductor portions other than the lands are individually aligned. A method of manufacturing a printed circuit board, comprising forming a conductor portion and a land portion by performing exposure in a row. 2. An exposure method, wherein in an exposure operation of a printed wiring board, individual or grouped lands and position data of conductors other than the lands are individually corrected and exposed. 3. An exposure method according to claim 2, wherein the exposure amount of the land portion and the conductor portion other than the land portion is changed. 4. A wiring according to claim 2, wherein when a predetermined land portion to be connected and a conductor portion other than the land portion are separated, a wiring connecting the separated portions is designed and exposed. Exposure method. 5. An exposure method according to claim 2, wherein the exposure is corrected so as to maintain a predetermined minimum conductor gap. 6. An exposure method for reading wiring specifications of a printed wiring board and hole positions of the printed wiring board before exposure, and automatically performing an optimum wiring design.